TWI633592B - Split device - Google Patents

Abstract

An object of the present invention is to provide a dividing device capable of efficiently dividing a sheet-like workpiece including a ceramic capacitor substrate without degrading the quality of the wafer. A dividing device for dividing a plate-shaped workpiece into a plurality of wafers, comprising: a storage box mounting area on which the storage case is placed, a temporary device for temporarily storing the workpiece before processing, and The workpiece carrying-out device that has been processed before the processing of the storage box is carried out to the workpiece carrying-out device of the temporary equipment, the holding table for sucking and holding the workpiece before processing, and the holding table is moved to carry in and carry out the workpiece The moving equipment of the loading and unloading area and the processing area, and the workpiece before the processing that has been carried out to the temporary equipment are transported to the workpiece carrying equipment that has been positioned on the holding table of the loading/unloading area, and the laser beam is irradiated. A laser light irradiation device that can be divided into a dividing groove that should be divided into a breaking starting point of the wafer is formed on the workpiece before processing, which is sucked and held by the holding table, and becomes broken. An external force is applied to the workpiece in the dividing groove of the starting point, and the workpiece is divided into a plurality of wafers along the dividing groove, and a plurality of wafers divided by the dividing device are accommodated. Storage device, and a separating apparatus will be divided into a plurality of wafer dropping storage device wafer dropping device.

Description

Split device Field of invention

The present invention relates to a dividing device for dividing a plate-shaped workpiece into a plurality of wafers.

Background of the invention

A ceramic capacitor substrate in which a metal foil and an insulator are laminated to each other is widely used in an electric device such as a mobile phone or a computer by a dividing device to be divided into individual chip capacitors.

As a dividing device that can divide the ceramic capacitor substrate into individual chip capacitors, a cutting device including a cutting blade is generally used (see, for example, Patent Document 1).

Further, as a method of dividing a ceramic capacitor substrate into individual wafer capacitors, it has been attempted to irradiate laser light having an absorptive wavelength to a ceramic capacitor substrate along a predetermined dividing line. A method of cutting a ceramic capacitor substrate by dividing a predetermined line.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-142334

Summary of invention

However, when the ceramic capacitor substrate is sintered at a predetermined temperature, it becomes hard, and when the ceramic capacitor substrate is cut by the cutter, the cutter is violently depleted and damaged, and There is also the problem of so-called poor productivity.

Further, when the ceramic capacitor substrate is irradiated with laser light and divided into individual wafer capacitors, there is a problem that a so-called melt (dross) adheres to the side surface of the wafer capacitor to lower the quality.

In addition, in order to facilitate the processing such as transport after dividing the ceramic capacitor substrate into individual wafer capacitors, the ceramic capacitor substrate is supported by a support member such as a substrate or a tape, and therefore it is necessary to attach the support member. The step of peeling off, there is a problem of so-called deterioration in productivity.

The present invention has been made in view of the above-described circumstances, and a main technical object thereof is to provide a dividing device capable of efficiently dividing a plate-shaped workpiece including a ceramic capacitor substrate without deteriorating the quality of the wafer.

In order to solve the above-mentioned main technical problems, the dividing device according to the present invention is a dividing device that divides a plate-shaped workpiece into a plurality of wafers, and is characterized in that it includes a storage box mounting region for mounting a storage box that stores the processed object before processing; and a temporary device for temporarily processing the workpiece before processing; The workpiece is carried out of the apparatus, and the workpiece before being processed stored in the storage box placed in the storage box mounting area is carried out to the temporary equipment; and the holding table is used to suck and hold the workpiece before processing. The mobile device moves the holding table to the loading/unloading area and the processing area for loading and unloading the workpiece, and the workpiece is carried into the apparatus, and the workpiece before being processed to be transported to the temporary equipment is transported to the processed object. Positioned on the holding stage of the loading/unloading area; the laser beam irradiation device irradiates the laser beam onto the workpiece before being processed and held by the holding table, and is formed on the workpiece. a dividing groove for dividing into a breaking starting point of the wafer; the dividing device applies an external force to the workpiece formed with the dividing groove that can become the breaking starting point, and divides the workpiece into a plurality of wafers along the dividing groove; a storage device that accommodates a plurality of wafers divided by the dividing device; and a wafer falling into the device, into which the plurality of wafers divided by the dividing device are dropped

Since the dividing device according to the present invention is constructed as described above, the laser beam is irradiated to the workpiece by the laser light irradiation device to form a dividing groove which can be broken into a starting point of the wafer, so there is no In the same manner as the conventional cutting method in which the cutting is performed by the cutter, the productivity is deteriorated due to the wear and tear of the cutting blade.

Further, since the laser processing by the laser light irradiation device forms a dividing groove which can be divided into the breaking starting point of the wafer, there is no like that the molten material (melt) adheres to the wafer. This is the case on the side wall.

In addition, since the workpiece to be divided into the dividing grooves to be divided into the breaking starting points of the wafer is formed into a single wafer by the dividing device, it is stored in the storage device, so that it is not necessary to process the workpiece. In the case of being supported on a support member such as a substrate or a tape, the step of attaching and peeling off the support member is not required, and productivity can be improved.

10‧‧‧Ceramic capacitor substrate

10a‧‧‧ surface

101‧‧‧1st dividing line

102‧‧‧2nd dividing line

103‧‧‧Wafer capacitance

104‧‧‧dividing trench

11‧‧‧Segmentation equipment

111‧‧‧Worked objects mounting members

112‧‧‧Press roller

113‧‧‧Roller housing

12‧‧‧Processed material handling equipment

13‧‧‧Batch storage equipment

131‧‧‧ wafer drop member

131a‧‧‧ openings

132‧‧‧ wafer storage container

133‧‧‧Drawers

14‧‧‧ wafers fall into the device

141‧‧‧The wafer falls into the eraser

2‧‧‧ device housing

20‧‧‧Control equipment

201‧‧‧Central Processing Unit (CPU)

202‧‧‧Reading Memory (ROM)

203‧‧‧ Random Access Memory (RAM)

204‧‧‧Input interface

205‧‧‧Output interface

3‧‧‧Processed object retention mechanism

31‧‧‧ Keeping the table

311‧‧‧Adsorption chuck

32‧‧‧Maintenance support equipment

4‧‧‧Laser light irradiation equipment

41‧‧‧ concentrator

5‧‧‧ storage box

5a‧‧‧ Storage box mounting area

50‧‧‧ storage box

6‧‧‧Preliminary equipment

7‧‧‧Worked objects moved out of the equipment

8‧‧‧Processed loading equipment

81, 121‧‧‧ attraction holding mat

82, 122‧‧ ‧ cylinder mechanism

83, 123, 142‧‧‧

9‧‧‧Photography equipment

P‧‧‧ spotlight

X, Y, Z‧‧ Direction

X1‧‧‧ direction

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a dividing device constructed by the present invention.

Fig. 2 is a perspective view of a wafer dropping member and a wafer storage container constituting a bulk storage device mounted on the dividing device shown in Fig. 1;

Fig. 3 is a block diagram showing the configuration of a control device installed in the dividing device shown in Fig. 1.

4(a)-(c) are explanatory views of a laser processing step performed by the dividing device shown in Fig. 1.

Fig. 5 is a perspective view of a ceramic capacitor substrate as a plate-like workpiece.

Form for implementing the invention

Hereinafter, a suitable embodiment of the dividing device constructed in accordance with the present invention will be described in further detail with reference to the additional drawings.

Fig. 5 is a perspective view showing a ceramic capacitor substrate as a plate-like workpiece. The ceramic capacitor substrate 10 shown in FIG. 5 has a thickness of 500 A plurality of first divided planned lines 101 extending in a predetermined direction on the surface 10a, and a plurality of second divided planned lines 102 extending in a direction perpendicular to the first divided planned line 101 are formed on the surface 10a. Formed in a lattice shape. A wafer capacitor 103 is formed in a plurality of regions divided by the first division planned line 101 and the second division planned line 102. The ceramic capacitor substrate 10 thus formed is a wafer capacitor 103 that is divided into individual pieces along the first dividing line 101 and the second dividing line 102.

FIG. 1 is a perspective view showing a dividing device according to the present invention for dividing the ceramic capacitor substrate 10 along the first dividing line 101 and the second dividing line 102.

The dividing device shown in Fig. 1 is provided with a device casing 2. A workpiece holding mechanism 3 for holding a workpiece and a laser beam that irradiates the workpiece to be held on the workpiece holding mechanism 3 with laser light are disposed at a central portion of the apparatus casing 2. Irradiation device 4. The workpiece holding mechanism 3 includes a holding table 31 for sucking and holding the ceramic capacitor substrate 10 as a plate-shaped workpiece, and a holding table supporting device 32 that can support the holding table 31. The holding table 31 is provided with an adsorption chuck 311 formed of porous ceramics, which is formed in a rectangular shape as shown in FIG. 1 and which is used to attract and hold the ceramic capacitor substrate 10 on the central portion of the surface. Also, the adsorption chuck 311 is attached to a suction device not shown. Therefore, the ceramic capacitor substrate 10 can be attracted and held by the chuck 13 by placing the ceramic capacitor substrate 10 on the chuck 311 and moving the suction device (not shown).

The holding table support device 32 constituting the workpiece holding mechanism 3 is provided so that the holding table 31 is wound around a circumference perpendicular to the holding surface as the upper surface. The rotation of the figure is not shown in the rotary drive device. The holding table support device 32 configured as described above is configured to move the holding table 31 to the loading/unloading area in which the workpiece is carried in and out as shown in FIG. 1 and the processing area formed by the laser beam irradiation device 4, and It becomes possible to move the apparatus in the X-axis direction (not shown) to move it in the processing conveyance direction (X-axis direction) shown by the arrow X.

The laser light irradiation device 4 that irradiates the ceramic capacitor substrate 10 that is held on the holding table 31 of the workpiece holding mechanism 3 with the laser light, and a laser light emitting device (not shown) that can emit pulsed laser light, and The concentrator 41 that collects the laser light emitted from the laser light emitting device can be disposed, and the concentrator 41 is disposed in the processing region.

A storage box mounting area on which the storage case of the ceramic capacitor substrate 10 as a plate-shaped workpiece before storage is placed is provided on one side of the Y-axis direction of the workpiece holding mechanism 3 In the storage box mounting area 5a, a storage cassette 50 that can be moved in the vertical direction (Z-axis direction) indicated by the arrow Z by a lifting device (not shown) is disposed. The storage case 5 of the above-described ceramic capacitor substrate 10 in which a plurality of sheets are stored as workpieces is placed on the storage cassette stage 50. The ceramic capacitor substrate 10 accommodated in the storage case 5 is temporarily placed on the front side of the storage case mounting area 5a, and the positional device 6 for position alignment and the ceramic capacitor substrate to be housed in the storage case 5 are disposed. 10 The workpiece is carried out to the temporary equipment 6 and the equipment 7 is carried out.

The workpiece loading device 8 is disposed between the temporary storage device 6 and the loading/unloading area, and the workpiece loading device 8 can be processed as a plate before being processed out of the temporary device 6 and subjected to position calibration. Object The ceramic capacitor substrate 10 is transported to a holding surface on the upper surface of the holding table 31 which is positioned in the loading/unloading area and which constitutes the workpiece holding mechanism 3. This workpiece loading device 8 is a suction holding pad 81 that can hold and hold the upper surface of the ceramic capacitor substrate 10, can support the suction holding pad 81, and move the suction holding pad 81 in the vertical direction (Z-axis direction). The cylinder mechanism 82, the actuator arm 83 that can support the cylinder mechanism 82, and the moving device that can move the actuator arm 83 in the Y-axis direction are not shown. The suction holding pad 81 that carries the workpiece to be processed into the apparatus 8 is connected to a suction device (not shown).

The dividing device in the illustrated embodiment includes the imaging device 9 and is a cylinder mechanism 82 that is attached to the workpiece loading device 8 and can detect a processing region of the ceramic capacitor substrate 10 as a plate-shaped workpiece. Further, the ceramic capacitor substrate 10 is held by the holding table 31 positioned in the loading/unloading area. The imaging device 9 is formed by an optical device such as a microscope or a CCD camera, and can transmit the captured image signal to a control device to be described later.

The other side of the workpiece holding mechanism 3 in the Y-axis direction is disposed so that the ceramic capacitor substrate 10 as a plate-shaped workpiece processed by laser processing in the processing region is divided into individual pieces. The wafer capacitor is divided by the device 11. The dividing device 11 includes a workpiece placing member 111 disposed on the other of the Y-axis directions of the workpiece holding mechanism 3, and a laser that can be placed on the workpiece loading member 111. A processed roller 112 that imparts an external force to the ceramic capacitor substrate 10 as a plate-shaped workpiece, and a roller that accommodates the pressing roller 112 as an input and exit roller The housing 113 is housed. The workpiece mounting member 111 is formed in a rectangular shape by a flexible member such as rubber. The pressing roller 112 is configured to be rotatable in the X-axis direction while pressing the upper surface of the ceramic capacitor substrate 10 placed on the workpiece mounting member 111.

The dividing device according to the embodiment of the present invention includes the workpiece transporting device 12, and the ceramic capacitor substrate 10 as a plate-shaped workpiece that has been subjected to laser processing can be transported to the workpiece mounting member 111 that constitutes the dividing device 11 In addition, the ceramic capacitor substrate 10 is placed on the holding table 31 of the workpiece holding mechanism 3 that is positioned in the loading/unloading area. The workpiece transporting apparatus 12 is composed of a member that can attract and hold the upper surface of the ceramic capacitor substrate 10 which is a laser-processed sheet-like workpiece placed on the holding table 31. a pad 121, a cylinder mechanism 122 that can support the suction holding pad 121 and move the suction holding pad 121 in the up and down direction (Z-axis direction), an actuator arm 123 that can support the cylinder mechanism 122, and the actuator arm 123 on the Y-axis A mobile device that is not shown in the figure moving in the direction. The suction holding pad 121 of the workpiece conveying device 12 thus constructed is connected to a suction device (not shown).

The dividing device according to the embodiment of the present invention includes a batch storage device 13 that is disposed adjacent to the workpiece mounting member 111 that constitutes the dividing device 11 and that can store a plurality of wafer capacitors that are divided into a plurality of wafer capacitors. The bulk storage device 13 includes a wafer dropping member 131 that is provided with an opening 131a that is formed to open adjacent to the workpiece to be processed 111. As shown in FIG. 2, this wafer dropping member 131 is formed in a funnel shape from the opening 131a toward the lower side. The wafer dropping member 131 thus constructed A wafer storage container 132 is disposed on the lower side. As shown in FIG. 1, on the front wall of the apparatus casing 2 in which the batch storage apparatus 13 formed of the wafer dropping member 131 and the wafer storage container 132 is disposed, a drawer for inserting and receiving the wafer storage container 132 is provided. 133.

Referring to Fig. 1, the dividing device in the illustrated embodiment is provided with a wafer dropping device 14 for ceramics to be placed on the workpiece mounting member 111 constituting the dividing device 11. The plurality of wafer capacitors divided by the capacitor substrate 10 fall into the opening portion 131a of the wafer drop member 131 constituting the batch storage device 13. The wafer is dropped into the apparatus 14 by the wafer falling into the wiper 141, the supporting wafer falling into the actuator 142 of the wiper 141, and the movement of the actuator arm 142 in the Y-axis direction. The mobile device is formed.

The dividing device in the illustrated embodiment is provided with the control device 20 shown in FIG. The control device 20 is constituted by a computer, and includes a central processing unit (CPU) 201 that can perform calculation processing in accordance with a control program, a read-only memory (ROM) 202 that can store a control program, and the like, and a storage calculus The result is a readable and writable random access memory (RAM) 203, an input interface 204, and an output interface 205. The detection signal from the above-described imaging device 9 or the like can be input to the input interface 204 of the control device 20 thus constructed. Further, the control signal from the output interface 205 of the control device 20 is output to the workpiece holding mechanism 3, the laser beam irradiation device 4, the workpiece carrying device 7, the workpiece loading device 8, the dividing device 11, and the The workpiece transporting device 12 and the like.

The dividing device in the illustrated embodiment is in the above manner The configuration will be described below with respect to its action.

The ceramic capacitor substrate 10 before processing stored in the storage case 5 placed on the storage cassette 50 placed in the storage cassette mounting area 5a is formed in the Z-axis direction by a lifting device not shown. Move up and down to be positioned to the carry-out position. Next, the control device 20 moves the workpiece carry-out device 7 forward and backward to carry out the ceramic capacitor substrate 10 positioned at the carry-out position to the temporary device 6. The ceramic capacitor substrate 10 that has been carried out to the temporary device 6 is positionally calibrated here. Next, the control device 20 activates the workpiece loading device 8 to suck and hold the upper surface of the ceramic capacitor substrate 10 that has been positionally aligned on the temporary device 6 by the suction holding pad 81, and transports it to the object. The holding surface of the upper surface of the chuck 311 of the holding table 31 of the workpiece holding mechanism 3 is placed in the loading/unloading area. In this manner, after the ceramic capacitor substrate 10 is placed on the chuck 311 of the holding table 31, the suction device (not shown) can be actuated by the control device 20 to attract and hold the ceramic capacitor substrate 10 at the holding stage 31. The holding surface of the upper surface of the adsorption chuck 311 (the workpiece holding step).

After the ceramic capacitor substrate 10 is attracted and held on the holding surface of the upper surface of the chuck 311 of the holding table 31 as described above, the control device 20 moves the workpiece into the apparatus 8 to be mounted on the cylinder mechanism 82. The image pickup apparatus 9 is positioned to the upper side of the ceramic capacitor substrate 10 held by the holding stage 31. Next, the control device 20 activates the imaging device 9 to image the first divided planned line 101 and the second divided planned line 102 formed on the ceramic capacitor substrate 10 held by the holding table 31, and performs the first confirmation. Whether the division planned line 101 and the second division planned line 102 are flat with the X-axis direction and the Y-axis direction Line alignment work. When the first division planned line 101 and the second division planned line 102 are not parallel to the X-axis direction and the Y-axis direction, the control device 20 controls the holding table supporting device 32 that constitutes the workpiece holding mechanism 3. The rotary drive device (not shown) is rotated so that the first division planned line 101 and the second division planned line 102 formed on the ceramic capacitor substrate 10 held by the holding stage 31 are adjusted to be in the X-axis direction and the Y-axis direction. Parallel (calibration step).

When the calibration step is carried out as described above, the control device 20 moves the holding unit 31 to the processing area by moving the X-axis direction moving device not shown, and sets the predetermined first one as shown in Fig. 4(a). One end of the division planned line 101 (the left end in FIG. 4(a)) is positioned directly below the concentrator 41 of the laser light irradiation apparatus 4. Then, the condensed spot P of the pulsed laser light irradiated from the concentrator 41 is aligned to the vicinity of the surface 10a (upper surface) of the ceramic capacitor substrate 10. Next, the control device 20 activates the laser light irradiation device 4 to illuminate the pulsed laser light having a wavelength that is absorptive to the ceramic capacitor substrate 10 from the concentrator 41 while moving the device in the X-axis direction not shown. The holding table 31 is moved in a direction indicated by an arrow X1 in Fig. 4(a) at a predetermined processing conveyance speed. Further, when the other end of the first division planned line 101 (the right end in FIG. 4(b)) reaches directly below the concentrator 41, the irradiation of the pulsed laser light is stopped, and the movement of the holding stage 31 is stopped. As a result, as shown in FIG. 4(b) and FIG. 4(c), the ceramic capacitor substrate 10 is formed with a dividing groove 104 that can be broken along the first dividing line 101 (the laser processing step). ). Further, the dividing groove 104 is formed to have a depth of about 50 μm under the following processing conditions.

Furthermore, the above laser processing step is, for example, the following processing strip Pieces are carried out.

Wavelength: 355nm

Repeat frequency: 10kHz

Average output: 5W

Converging point: φ 10μm

Processing transfer speed: 50mm / sec

When the above-described laser processing steps are performed along all of the first division planned lines 101 formed on the ceramic capacitor substrate 10 in a predetermined direction, the control device 20 activates a rotary driving device not shown to hold the holding table. 31 turns 90 degrees. Further, the above-described laser processing step is performed on the holding stage 31 along all of the second division planned lines 102 formed in the direction perpendicular to the first division planned line 101. As a result, the ceramic capacitor substrate 10 held on the holding stage 31 is formed so as to be a dividing groove 104 which is a breaking starting point along all of the first dividing line 101 and the second dividing line 102.

As described above, the holding table 31 holding the ceramic capacitor substrate 10 on which the laser processing step has been performed is moved from the processing region to the loading/unloading region. Then, when the holding table 31 reaches the loading/unloading area shown in FIG. 1, the movement of the holding table 31 is stopped. Next, the suction holding of the ceramic capacitor substrate 10 held on the holding table 31 is released.

Next, the control device 20 activates the mobile device (not shown) of the workpiece transporting device 12 to position the suction holding pad 121 to the ceramic capacitor substrate 10 placed on the holding table 31 that has been positioned in the loading/unloading region. Directly above, the cylinder mechanism 122 is actuated simultaneously so that the suction holding surface of the lower surface of the suction holding pad 121 contacts the upper surface of the ceramic capacitor substrate 10. And borrow A suction device (not shown) is used to attract and hold the ceramic capacitor substrate 10 on the suction holding surface of the lower surface of the suction holding pad 121.

After the ceramic capacitor substrate 10 is attracted and held on the suction holding pad 121 as described above, the control device 20 activates the mobile device not shown in the workpiece transporting device 12 to attract and hold the suction holding pad 121. The ceramic capacitor substrate 10 is positioned directly above the workpiece mounting member 111 constituting the dividing device 11, while the cylinder mechanism 122 is actuated to lower the suction holding pad 121, and the ceramic capacitor substrate 10 sucked and held by the suction holding pad 121 is attracted. The upper surface of the workpiece mounting member 111 constituting the dividing device 11 is positioned. Further, the suction formed by the suction holding pad 121 on the ceramic capacitor substrate 10 is released. As a result, the ceramic capacitor substrate 10 is placed on the workpiece mounting member 111 constituting the dividing device 11.

Then, the control device 20 activates the pressing roller 112 constituting the dividing device 11 to press the upper surface of the ceramic capacitor substrate 10 placed on the workpiece mounting member 111 while rotating in the X-axis direction. As a result, the ceramic capacitor substrate 10 is formed with the division grooves 104 which can be broken along the first division planned line 101 and the second division planned line 102. Therefore, the ceramic capacitor substrate 10 can be divided along the formed. The first dividing line 101 and the second dividing line 102 of the groove 104 are broken to be divided into individual wafer capacitors 103 (dividing step).

After the above-described dividing step is performed, the control device 20 moves the wafer into the mobile device (not shown) of the device 14, so that the wafer mounted on the actuator arm 142 falls into the wiper 141 toward the bulk storage device 13. The opening portion 131a of the wafer dropping member 131 moves. The result is that the workpiece is loaded The plurality of wafer capacitors 103 that are divided into individual pieces in the placing member 111 are housed in the wafer storage container 132 through the opening 121a.

As described above, the dividing device in the illustrated embodiment transmits the laser beam irradiation device 4 along the first dividing line 101 and the second dividing line 102 on the ceramic capacitor substrate 10. Since the light is formed to form the dividing groove 104 which can be the starting point of the breaking, there is no possibility that the productivity is lowered due to the wear and breakage of the cutting blade like the conventional dividing method which is cut by the cutting blade.

In the laser processing by the laser beam irradiation device 4, the first dividing line 101 and the second dividing line 102 on the ceramic capacitor substrate 10 form the dividing groove 104 which can be the starting point of the breaking. There is no such thing as a melt (slag) adhering to the sidewall of the wafer capacitor.

In addition, the ceramic capacitor substrate 10 in which the dividing groove 104 which can be broken as the starting point is formed along the first dividing line 101 and the second dividing line 102 is divided into individual wafer capacitors 103 by the dividing device 11. After that, it is stored in the wafer storage container 132. Therefore, when the ceramic capacitor substrate 10 does not have to be supported on a holding member such as a holding substrate or a tape, the bonding and peeling steps of the supporting member do not need to be performed, and the lifting can be performed. Productive.

In the above-described embodiment, the ceramic capacitor substrate 10 as a plate-shaped workpiece is divided into the wafer capacitors 103 along the first dividing line 101 and the second dividing line 102. According to the dividing device of the present invention, even if a glass substrate which is a plate-shaped workpiece and is not formed with a predetermined dividing line is divided into a plurality of wafers, Get the same effect.

Claims (1)

A dividing device is a dividing device capable of dividing a plate-shaped workpiece into a plurality of wafers, and is characterized in that: a storage box mounting area for placing a storage box in which a workpiece before processing is stored; The temporary equipment is used for the workpiece to be processed before the temporary processing; the workpiece is carried out of the equipment, and the processed workpiece stored in the storage box placed in the storage box mounting area is carried out to the temporary position. a holding device for sucking and holding a workpiece before processing; and a moving device for moving the holding table to a loading/unloading area and a processing area for loading and unloading the workpiece; and the workpiece is carried into the device and moved out to the device The workpiece before processing of the temporary equipment is transported to the holding table that has been positioned in the loading/unloading area; the laser light irradiation device irradiates the laser light to the processing area and is sucked and held by the holding stage. On the workpiece before processing, a dividing groove for dividing into a breaking starting point of the wafer is formed on the workpiece, and the dividing device forms a dividing groove which can be a starting point of breaking Workpiece given force, and will be split along the split grooves into a plurality of wafer workpiece; storage device, the device housing to the divided plurality of segmented wafer; And the wafer is dropped into the apparatus, and a plurality of wafers dispersed in a state of being not supported by the supporting member by the dividing device are dropped into the storage device, and the dividing device includes: a workpiece mounting member to be soft The member is formed to mount the workpiece; and the pressing roller presses the workpiece placed on the workpiece mounting member.