JP2003142334A - Method of dividing ceramic chip capacitor sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of dividing a ceramic chip capacitor sheet, which is capable of easily detecting and recognizing alignment marks. SOLUTION: Ceramic layers and electrode layers, each of which is equipped with electrode regions that are demarcated in grids on the surface of the ceramic layer and provided with a plurality of electrodes and alignment mark regions which surround the electrode regions and are provided with alignment marks, that indicate the positions of the electrodes are alternately laminated into a ceramic chip capacitor sheet. The demarcated ceramic chip capacitor sheet is divided into separated chip capacitors through a certain method. The method comprises an alignment mark detection hole forming process of forming a detection hole, whose bottom is conical at a prescribed position in the alignment mark region, an alignment process of detecting a cutting area, on the basis of the alignment mark displayed on the conical bottom of the alignment mark detection hole, and a dividing process of dividing the ceramic chip capacitor sheet into separate chip capacitors, on the basis of the detected cutting area.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dividing method for dividing a ceramic chip capacitor sheet into individual chip capacitors.

[0002]

2. Description of the Related Art In a ceramic chip capacitor sheet, a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a grid pattern are alternately laminated, and the ceramic layer is the uppermost layer. Are laminated. As a method of manufacturing such a ceramic chip capacitor sheet, the following method is generally performed. That is, a tape serving as a separation layer is applied to the surface of a plate-shaped carrier substrate, and raw ceramics is applied on the tape to form a raw ceramics layer having a thickness of about 5 μm.
An electrode metal having a thickness of about 1 μm is formed on the surface of the raw ceramics layer by screen-printing an electrode metal such as baladium. About 200 layers of the raw ceramic layers and the electrode layers are alternately laminated, and a ceramic layer is laminated on the uppermost layer to form a ceramic chip capacitor sheet.

In the ceramic chip capacitor sheet constructed as described above, the ceramic layer is formed on the uppermost layer, and the position of the electrode cannot be confirmed from the surface, so when dividing into individual chip capacitors. The following measures are taken to confirm the position of the electrodes. That is, when the electrode layer is formed, an alignment mark region having an alignment mark indicating the position of the electrode is formed by surrounding the electrode region, and a cutting blade having a V-shaped cross section on the outer periphery is formed in the alignment mark region. By forming the V groove by using the V groove, the alignment mark exposed on the wall surface of the V groove is recognized.

[0004]

The method for recognizing the alignment mark by forming the V groove in the alignment mark area with the cutting blade as described above has the following problems. (1) The tape used as the separation layer to be mounted on the surface of the carrier substrate is a water-soluble tape because it is divided into individual chip capacitors and then removed. Therefore, when forming the V groove in the alignment mark area, Must be dry cut. When cutting with a dry type, dust of ceramics is scattered, so it is necessary to perform dust treatment,
This causes a decrease in productivity. (2) In order to solve the above-mentioned problem (1), there is also a method of forming V-grooves in the alignment mark region by a wet process and then immediately wiping off cutting water adhering to the ceramic chip capacitor sheet. There is a problem that the ceramic chip capacitor sheet floats up from the carrier because the tape serving as the separation layer absorbs cutting water. In addition, cutting water may infiltrate into the V-groove, making it impossible to detect the alignment mark.

The present invention has been made in view of the above facts, and its main technical problem is to easily and surely recognize an alignment mark formed by surrounding and bending an electrode region. Another object of the present invention is to provide a method of dividing a ceramic chip capacitor sheet that can achieve the above.

[0006]

In order to solve the above-mentioned main technical problems, according to the present invention, an electrode region having a ceramics layer and a plurality of electrodes formed on the surface of the ceramics layer and partitioned in a grid pattern. And a ceramic chip capacitor sheet formed by alternately laminating an electrode layer surrounding the electrode region and having an alignment mark region having an alignment mark indicating the position of the electrode, and laminating a ceramic layer on the uppermost layer. Is a division method for dividing the chip into individual chip capacitors divided into a grid pattern, and a detection hole forming step of forming an alignment mark detection hole having a conical bottom surface at a predetermined portion of the alignment mark area, and the detection hole forming step. Cutting based on the alignment mark exposed on the conical bottom surface of the alignment mark detection hole formed by the process And the alignment step of detecting a Tokoro,
And a dividing step of cutting the ceramic chip capacitor sheet based on the cutting points detected by the alignment step to divide the ceramic chip capacitor sheet into individual chip capacitors, the ceramic chip capacitor sheet dividing method is provided. .

The alignment mark detecting hole is formed by an end mill or a drill. The position where the alignment mark detection hole is formed is determined based on the design drawing of the ceramic chip capacitor sheet. The alignment information detected by the alignment process is stored in the storage means, and it is desirable to perform the dividing process on the ceramic chip capacitor sheet manufactured by the same rod based on the alignment information. In addition, it is desirable that the dividing step is performed by a multi-cutting blade in which a plurality of cutting blades are installed so as to match the intervals of the chip capacitors, and further, the area to be cut on the ceramic chip capacitor sheet is cut by the multi-cutting blades. After cutting
When cutting the next area to be cut with the multi-cutting blade, it is desirable to perform cutting by offsetting the cutting base point.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a method for dividing a ceramic chip capacitor sheet according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a perspective view of a ceramic chip capacitor sheet which is divided into individual chip capacitors according to the present invention, and FIG. 2 is an enlarged sectional view taken along line AA in FIG. In the ceramic chip capacitor sheet shown in FIG. 1, the uppermost ceramic layer is partially cut away. The ceramic chip capacitor sheet 2 shown in FIGS. 1 and 2 is formed on the surface of a rectangular carrier substrate 3 made of a glass plate with a tape 4 serving as a separation layer interposed therebetween. That is, the raw ceramics are applied on the tape 4 attached to the surface of the carrier substrate 3 to a thickness of 5 μm.
A raw ceramic layer 21 having a thickness of about m is formed, and an electrode metal such as barium is screen-printed on the surface of the raw ceramic layer 21 to form an electrode layer 22 having a thickness of about 1 μm. The electrode layer 22 includes an electrode region 221 having a plurality of electrodes 221a divided into a grid pattern and the electrode region 2
21 and an alignment mark region 222 having an alignment mark 222a that surrounds 21 and indicates the position of the electrode 221a. The raw ceramic layers 21 and the electrode layers 22 thus formed are alternately laminated for several tens to 100 weeks, and the raw ceramic layer 21 is formed as the uppermost layer.

In order to divide the ceramic chip capacitor sheet 2 formed as described above into individual chip capacitors, first, as shown in FIG. 3, the alignment mark detection hole 5 is formed at a predetermined position in the alignment mark area 222. (Detection hole forming step). The predetermined position where the alignment mark detection hole 5 is formed is determined based on a design drawing used when manufacturing the ceramic chip capacitor sheet 2. As shown in FIG. 4, the alignment mark detection hole 5 has a convex surface 5 having a conical bottom surface.
1 or as shown in FIG. 5, the bottom surface is formed to be a conical concave surface 52. In addition, as shown in FIG. 4, in order to form the alignment mark detection hole 5 so that the bottom surface becomes the conical convex surface 51, it is possible to excavate by the end mill 6. Further, as shown in FIG. 5, in order to form the alignment mark detection hole 5 so that the bottom surface becomes the conical concave surface 52, it is possible to excavate with the drill 7. Alignment mark detection hole 5 formed in this way
When viewed from above, the electrode 221a can be confirmed by being exposed on the conical convex surface 51 or the conical concave surface 52 as shown in FIG. As described above, in the detection hole forming step, the alignment mark area 222 of the ceramic chip capacitor sheet 2 is moved to the end mill 6 or the drill 7.
Since the alignment mark detection hole 5 is formed by
Since the specified narrow area can be excavated by dry method, the dust hardly scatters, the dust treatment is facilitated, and the productivity is improved. Further, since the detection hole forming step can be performed by dry digging, the tape 4 serving as the separation layer does not absorb moisture, and the problem that the ceramic chip capacitor sheet 2 is lifted from the carrier substrate 3 is solved.

As described above, the alignment mark area 2
After the alignment mark detection holes 5 are formed at predetermined positions 22, the ceramic chip capacitor sheet 2 is divided into individual chip capacitors by a dicing device. Here, the dicing device will be described with reference to FIG. Dicing 100 in the illustrated embodiment
Includes a device housing 120 having a substantially rectangular parallelepiped shape. In the device housing 120, a chuck table 130 for holding a workpiece is arranged so as to be movable in the direction indicated by arrow X, which is the cutting feed direction. The chuck table 130 includes a suction chuck support base 131, a rectangular suction chuck 132 mounted on the suction chuck support base 131, and three positioning pins arranged along two sides of the suction chuck 132. And 133,
On the mounting surface, which is the surface of the suction chuck 132, as shown in FIG.
The ceramic chip capacitor sheet 2 having the alignment mark detection holes 5 formed at predetermined positions 22 is placed. At this time, the two sides of the carrier substrate 3 are brought into contact with the above-mentioned three positioning pins 133 for positioning. The ceramic chip capacitor sheet 2 is placed at a predetermined position on the chuck 132 of the chuck table 130.
When is positioned, it is held by suction means (not shown). The chuck table 1
30 is configured to be rotatable by a rotation mechanism (not shown).

Dicing apparatus 1 in the illustrated embodiment
00 is two spindle units 1 as cutting means
40 and 150 are provided. Spindle unit 14
Reference numerals 0 and 150 denote spindle housings 141 and 151 that are mounted on a moving base (not shown) and are moved and adjusted in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housings 141 and 151.
Rotating spindles 142 and 152 that are rotatably supported by 151 and are rotationally driven by a rotational driving mechanism (not shown).
And cutting blades 143 and 153 mounted on the rotary spindles 142 and 152. It should be noted that one of the cutting blades 143 is a multi-cutting blade in which a plurality of cutting blades are incorporated so as to match the intervals of the chip capacitors as shown in FIG. Cut along. The other cutting blade 153 is also a multi-cutting blade in which a plurality of cutting blades are incorporated so as to match the intervals of the chip capacitors as shown in FIG. 9, and along the Y-axis street of the ceramic chip capacitor sheet 2. To cut.

The dicing apparatus 1 in the illustrated embodiment
Reference numeral 00 denotes an image of the alignment mark detection hole 5 formed in the alignment mark area 222 of the ceramic chip capacitor sheet 2 which is the workpiece held on the surface of the suction chuck 132 which constitutes the chuck table 130, and The imaging mechanism 160 for detecting the region to be cut by the cutting blades 143 and 153 is provided. The image pickup mechanism 160 is composed of optical means such as a microscope and a CCD camera. The dicing apparatus 100 also includes a display unit 170 that displays an image captured by the image capturing mechanism 160.

Dicing apparatus 1 in the illustrated embodiment
Reference numeral 00 denotes a cassette 181 that stocks the ceramic chip capacitor sheet 2 that is a workpiece, a workpiece unloading unit 183 that unloads the workpiece housed in the cassette 181 to a workpiece mounting area 182, Workpiece transfer means 1 for transferring the workout carried out by the workout carry-out means 183 onto the chuck table 130.
84, a cleaning unit 185 that cleans and spin-drys the workpiece machined by the chuck table 130, and a cleaning transport unit 186 that transports the workpiece machined by the chuck table 130 to the cleaning unit 185. is doing. Further, the dicing apparatus 100 includes the chuck table 130, the spindle units 140 and 150, the elevating means for the cassette 181, the workpiece unloading means 183, the workpiece conveying means 184, the cleaning means 185, and the cleaning conveying means 1.
The control means 188 for controlling 86 and the like is provided. This control means 188 is a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores control programs and the like, and a readable and writable random access memory (RAM) that stores arithmetic results and the like.
And so on. Then, the control means 188 temporarily stores the alignment information (areas to be cut by the cutting blades 143, 153) imaged by the imaging mechanism 160 in a random access memory (RAM), and based on this alignment information, the spindle unit. 14
The control signal is output to 0 and 150.

Next, a cutting process of the ceramic chip capacitor sheet 2 in which the alignment mark detection holes 5 are formed in the alignment mark region 222 by the above-described detection hole forming step using the above-mentioned dicing apparatus 10 will be described. First, the alignment mark area 222
The ceramic chip capacitor sheet 2 having the alignment mark detection holes 5 formed therein (state provided on the carrier substrate 3) is housed in the cassette 181. The ceramic chip capacitor sheet 2 accommodated in the predetermined position of the cassette 7 is moved to the up and down position by an elevating means (not shown) to be positioned at the carry-out position. Next, the work piece carrying-out means 183 moves forward and backward to carry out the ceramic chip capacitor sheet 2 positioned at the carry-out position to the work piece placing area 182. The ceramic chip capacitor sheet 2 carried out to the workpiece mounting area 182 is transported to the mounting surface of the suction chuck 132 constituting the chuck table 130 by the rotating operation of the workpiece transporting means 184, and as described above. After the two sides of the carrier substrate 3 are brought into contact with the three positioning pins 133 to be positioned, the carrier substrate 3 is sucked and held by the suction chuck 132. The chuck table 130 holding the ceramic chip capacitor sheet 2 by suction in this manner is moved to a position right below the imaging mechanism 160.

The chuck table 130 is an image pickup mechanism 160.
If it is positioned immediately below, the imaging mechanism 160 images the alignment mark detection hole 5 formed in the alignment mark area 222 of the ceramic chip capacitor sheet 2 to detect the cutting point (X-axis street), and further the chuck. The table 130 is rotated 90 degrees, and the imaging mechanism 160 images the alignment mark detection hole 5 to detect the cutting point (Y-axis street) (alignment step). The alignment information thus detected is used as the random access memory (RA of the control means 188).
It is temporarily stored in M). Next, the chuck table 130
Back by 90 degrees and rotate to rotate one spindle unit 14
8 is moved and adjusted in the direction of the arrow Y, which is the indexing direction, and FIG.
As shown in, the precision alignment work between the cutting blade 143 and the cutting point (X-axis street) is performed. afterwards,
While the cutting blade 143 is rotated in a predetermined direction, the chuck table 130 holding the ceramic chip capacitor sheet 2 by suction is in the cutting feed direction indicated by arrow X (direction orthogonal to the rotation axis of the cutting blade 143).
By moving to, the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut along the X-axis street (division step). That is, since the cutting blade 143 is mounted on the spindle unit 140 that is moved and adjusted in the direction indicated by the arrow Y which is the indexing direction and the direction indicated by the arrow Z which is the cutting direction, and is rotationally driven, the chuck table 1
By moving 30 along the lower side of the cutting blade 143 in the cutting feed direction, the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut by the cutting blade 143 along a predetermined X-axis street.

When all the X-axis streets have been cut as described above, the chuck table 130 is rotated 90 degrees. Then, as described above, the alignment step is performed in advance to detect the cut portion (Y-axis street) of the ceramic chip capacitor sheet 2, and based on the stored alignment information, the other spindle unit 150 is in the indexing direction. By adjusting the movement in the Y direction, as shown in FIG. 9, the precision alignment work of the cutting blade 153 and the cutting place (Y axis street) is performed. Then, while rotating the cutting blade 153 in a predetermined direction,
The chuck table 130 holding the ceramic chip capacitor sheet 2 by suction is indicated by an arrow X, which is the cutting feed direction.
By moving in the direction indicated by, the chuck table 1
The ceramic chip capacitor sheet 2 held by 30 is cut along the Y-axis street (dividing step).

As described above, the ceramic chip capacitor sheet 2 is cut along the X-axis streets and the Y-axis streets to be divided into individual chip capacitors. The individual chip capacitors thus divided are not separated by the action of the tape 4, and the state of the ceramic chip capacitor sheet 2 supported by the carrier substrate 3 is maintained. After the cutting of the ceramic chip capacitor sheet 2 is completed in this way, the chuck table 130 holding the ceramic chip capacitor sheet 2 is returned to the position where the ceramic chip capacitor sheet 2 is first sucked and held, and the ceramic chip capacitor sheet 2 is held there. Sheet 2
Release the suction hold. Next, the ceramic chip capacitor sheet 2 is conveyed to the cleaning means 185 by the cleaning / conveying means 186, where it is cleaned and dried. The thus-cleaned ceramics chip capacitor sheet 2 is carried out to the work piece mounting area 182 by the work piece conveying means 184. Then, the ceramic chip capacitor sheet 2 is used as the workpiece carrying-out means 18
It is accommodated in a predetermined position of the cassette 181 by 3.

In the ceramic chip capacitor sheet dividing method described above, since the ceramic chip capacitor sheets 2 manufactured in the same lot have substantially the same strain in the chip arrangement, the first detected alignment information is controlled by the control means 188. Random access memory (RAM) is temporarily stored, and by performing the above-mentioned division process of other ceramic chip capacitor sheets 2 manufactured in the same lot based on this alignment information, the alignment work is significantly shortened. can do. In addition, as a cutting blade, FIG. 8 and FIG.
By performing the dividing step using a multi-cutting blade as shown in, the cutting time is shortened and
Even if the cutting is performed by a wet method, the dividing step can be completed before the tape 4 serving as the separation layer absorbs moisture. In addition,
When performing the dividing step using the multi-cutting blade, the cutting groups can be distinguished by offsetting the cutting base point as shown in FIG. 10, and the position of the area where the defective product has occurred, that is, the number of cutting It becomes easy to grasp, for each lot, that defective products have occurred between the number of cutting grooves from the groove, and quality control becomes easy.

[0020]

According to the method of dividing a ceramic chip capacitor sheet according to the present invention, an alignment mark detection hole having a conical bottom surface is formed at a predetermined portion of the alignment mark area of the ceramic chip capacitor sheet, and the cone of the alignment mark detection hole is formed. Since the cutting point is detected based on the alignment mark displayed on the bottom of the shape, the specified narrow area can be excavated by dry method, so that the dust hardly scatters and the dust treatment becomes easy and the production is completed. The property is improved. Further, since the detection hole forming step can be performed by dry digging, when the ceramic chip capacitor sheet is arranged on the carrier substrate via the tape serving as the separation layer, the tape does not absorb moisture, and the ceramic It also solves the problem that the chip capacitor sheet floats up from the carrier substrate.

[Brief description of drawings]

FIG. 1 is a perspective view showing a ceramic chip capacitor sheet divided by a dividing method according to the present invention, with a part thereof cut away.

2 is an enlarged cross-sectional view taken along the line AA in FIG.

FIG. 3 is a perspective view showing a state in which a detection hole forming step has been performed on the ceramic chip capacitor sheet shown in FIG.

FIG. 4 is an enlarged cross-sectional view showing an embodiment of an alignment mark detection hole formed on a ceramic chip capacitor sheet by a detection hole forming step.

FIG. 5 is an enlarged cross-sectional view showing another embodiment of the alignment mark detection hole formed in the ceramic chip capacitor sheet by the detection hole forming step.

FIG. 6 is an enlarged view of an alignment mark detection hole seen from above.

FIG. 7 is a perspective view of a dicing apparatus for carrying out the method for dividing a ceramic chip capacitor sheet according to the present invention.

8 is an enlarged perspective view of a main part of a spindle unit for X-axis street cutting equipped in the dicing device shown in FIG.

9 is an enlarged perspective view of a main part of a spindle unit for Y-axis street cutting equipped in the dicing device shown in FIG.

10 is an explanatory view showing a cutting base point in a step of dividing the ceramic chip capacitor sheet by the dicing device shown in FIG.

[Explanation of symbols]

2: Ceramic chip capacitor sheet 3: Carrier substrate 4: Tape 21: Raw ceramic layer 22: Electrode layer 221: Electrode area 221a: electrode 222: Alignment mark area 222a: alignment mark 5: Alignment mark detection hole 51: Conical convex surface 52: Conical concave surface 6: End mill 7: Drill 100: Dicing 120: Device housing 130: Chuck table 131: Support for suction chuck 132: suction chuck 133: Positioning pin 140: Spindle unit (for X-axis street cutting) 150: Spindle unit (for Y-axis street cutting) 160: Imaging mechanism 170: Display means 181: cassette 182: Workpiece mounting area 183: Workpiece unloading means 184: Workpiece conveying means 185: Cleaning means 186: Cleaning / conveying means 188: Control means

Claims (7)

[Claims] 1. An alignment having a ceramics layer, an electrode region having a plurality of electrodes formed on the surface of the ceramics layer and defined in a grid pattern, and an alignment mark surrounding the electrode region and indicating the position of the electrode. A method for dividing a ceramic chip capacitor sheet, which is configured by alternately stacking electrode layers having mark areas and a ceramic layer on the uppermost layer, into individual chip capacitors divided into a grid pattern. A detection hole forming step of forming an alignment mark detecting hole having a conical bottom surface at a predetermined portion of the alignment mark area, and a conical bottom surface of the alignment mark detecting hole formed by the detecting hole forming step. Alignment step of detecting a cutting point based on the alignment mark, and the alignment step And a step of dividing the ceramic chip capacitor sheet into individual chip capacitors based on the cut points, and dividing the ceramic chip capacitor sheet into individual chip capacitors. 2. The method of dividing a ceramic chip capacitor sheet according to claim 1, wherein the alignment mark detection hole is formed by an end mill. 3. The method of dividing a ceramic chip capacitor sheet according to claim 1, wherein the alignment mark detection hole is formed by a drill. 4. The method for dividing a ceramic chip capacitor sheet according to claim 1, wherein the position where the alignment mark detection hole is formed is determined based on a design drawing of the ceramic chip capacitor sheet. 5. The alignment information detected by the alignment step is stored in a storage means, and for the ceramic chip capacitor sheet manufactured by the same rod, the dividing step is performed based on the alignment information. Method of dividing ceramic chip capacitor sheet of. 6. The method of dividing a ceramic chip capacitor sheet according to claim 1, wherein the dividing step is performed by a multi-cutting blade in which a plurality of cutting blades are installed so as to match the intervals of the chip capacitors. 7. In the dividing step, after cutting a region to be cut of a ceramic chip capacitor sheet with a multi-cutting blade, when cutting the next region to be cut with a multi-cutting blade, the cutting base point is offset and cut. 7. The method for dividing a ceramic chip capacitor sheet according to claim 6, wherein