JPH03173108A - Manufacture of laminated ceramic capacitor - Google Patents
Manufacture of laminated ceramic capacitorInfo
- Publication number
- JPH03173108A JPH03173108A JP31198289A JP31198289A JPH03173108A JP H03173108 A JPH03173108 A JP H03173108A JP 31198289 A JP31198289 A JP 31198289A JP 31198289 A JP31198289 A JP 31198289A JP H03173108 A JPH03173108 A JP H03173108A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- interval
- lines
- cutter
- cutting lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims description 18
- 239000000919 ceramic Substances 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、セラミックグリンシート上に内部電極用パタ
ーンが複数配列されたシートを複数枚重ねて圧着した積
層板を、個々の積層セラミックコンデンサの生チップの
寸法に切断して積層セラミックコンデンサを製造する方
法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention uses a laminate in which a plurality of sheets in which a plurality of internal electrode patterns are arranged on a ceramic green sheet are piled up and pressed together to form individual multilayer ceramic capacitors. The present invention relates to a method of manufacturing a multilayer ceramic capacitor by cutting it into the dimensions of a raw chip.
［従来の技術］
一般に、積層セラミックコンデンサは、誘電体セラミッ
ク原料粉末を有機バインダ等と共に混合し、原料スラリ
ーを構成する。このスラリーをドクターブレード法等に
よって長尺なベースフィルム上に薄く塗布し、乾燥し、
前記ベースフィルム上にセラミックグリンシート（以下
「グリンシート」と称する）を製作する。次に、このグ
リツジ−１・を適当な大きさ、例えば１００ｍｍ角に切
断すると共に、前記ペースフィルムから剥離する。そし
て、第５図で示すように、このグリーンシートｌａ１
１ｂの表面に導電ペーストを用いてスクリーン印刷等の
公知の手段により、例えば５．２ｍｍＸ１．０ｍｍの内
部電極パターン２ａｓ２ｂを０．７ｍｍ間隔で縦横に複
数配列して印刷し、これを乾燥する。なお、グリーンシ
ート１ａｘｌａ・・・の内部電極パターン２ａｓ２ａ・
・・と、グリーンシー） １ ｂｌ１ｂ・・・の内部電
極パターン２ｂ、２ｂ・・・とは、一方が他方に対して
第５図において示したＹ方向に１／２間隔分ずれるよう
印刷される。[Prior Art] Generally, a multilayer ceramic capacitor is manufactured by mixing dielectric ceramic raw material powder with an organic binder and the like to form a raw material slurry. This slurry is applied thinly onto a long base film using a doctor blade method, etc., dried,
A ceramic green sheet (hereinafter referred to as "green sheet") is manufactured on the base film. Next, this Grizzie-1 is cut into an appropriate size, for example, 100 mm square, and peeled off from the pace film. Then, as shown in Fig. 5, this green sheet la1
A plurality of internal electrode patterns 2as2b of, for example, 5.2 mm x 1.0 mm are printed on the surface of 1b by a known means such as screen printing using a conductive paste, arranged vertically and horizontally at intervals of 0.7 mm, and then dried. In addition, the internal electrode pattern 2as2a of the green sheet 1axla...
The internal electrode patterns 2b, 2b... of 1 bl1b... are printed so that one is shifted from the other by 1/2 interval in the Y direction shown in FIG. .
次に内部電極パターン２ａｚ２ａ・・・と２ｂ。Next, internal electrode patterns 2az2a... and 2b.
２ｂ・・・を各々片面に印刷したグリンシート１ａｘ１
ｂを、交互に複数枚積み重ねる。さらに、この積層体の
上下に内部電極パターン２ａｓ２ｂが印刷されてないグ
リンシート、つまり保護シート（図示せず）を積み重ね
た後、熱圧着して積層板、いわゆるバーを形成する。そ
して、この積層板を所定の切断線４．４・・・、５．５
・・・に沿って縦横に切断し、個々の生チップに分離す
る。この生チップを焼成し、両端に端子電極１１．１１
を焼き付けることにより、第４図で示すような積層コン
デンサが出来上がる。なお、第４図において、９の符合
は、前記グリーンシートが焼成されて出来上がった誘電
体を示す。Green sheet 1ax1 with 2b... printed on each side
Stack multiple sheets of b alternately. Further, green sheets on which internal electrode patterns 2as2b are not printed, that is, protective sheets (not shown) are stacked on top and bottom of this laminate, and then thermocompression bonded to form a laminate, a so-called bar. Then, cut this laminate along predetermined cutting lines 4.4..., 5.5.
Cut it vertically and horizontally along ... and separate it into individual raw chips. This raw chip is fired, and terminal electrodes 11 and 11 are attached to both ends.
By baking, a multilayer capacitor as shown in FIG. 4 is completed. In addition, in FIG. 4, the reference numeral 9 indicates a dielectric material obtained by firing the green sheet.
この製造工程において、前記積層板１を個々の積層セラ
ミックコンデンサの寸法に切断する方法の一つは、第６
図で示すようなマルチホイールカッタ３ａを用いる方法
である。このマルチホイールカッタ３ａは、周縁にダイ
ヤモンド粉を固着させたディスク状の回転する刃７．７
・・・と、これらの刃７．７・・・を積層セラミックコ
ンデンサの生チップの一辺の長さに相当する間隔に保持
するスペーサ８．８・・・とを、交互に軸６に挿入し、
固定したもので、軸６は回転自在に水平に軸支される。In this manufacturing process, one of the methods for cutting the laminated plate 1 into the dimensions of individual laminated ceramic capacitors is the sixth method.
This is a method using a multi-wheel cutter 3a as shown in the figure. This multi-wheel cutter 3a has a disk-shaped rotating blade 7.7 with diamond powder adhered to its periphery.
. . . and spacers 8 . 8 . . . that hold these blades 7 . 7 . ,
It is fixed, and the shaft 6 is rotatably supported horizontally.
このマルチホイルカッタ３ａの下には、一方向に直線的
に移動可能な保持板ａが設けられている。この保持板ａ
上に前記積層板ｌを置いて固定し、前記マルチホイール
カッタ３ａの刃７．７・・・を回転させながら保持板ａ
を矢印方向に移動させずことにより、前記積層板１を前
記刃７．７・・・の間隔の切断線４．４・・・に沿って
切断する。さらに、生チップの他方の辺の長さに相当す
る間隔で刃が固定された別のマルチホイールカッタを用
い、前記切断線４．４・・・と直交する切断線５．５・
・・に沿って、積層板ｌの切断が同様にして行なわれる
。A holding plate a that is linearly movable in one direction is provided below the multi-foil cutter 3a. This holding plate a
Place and fix the laminated plate l on top, and while rotating the blades 7, 7... of the multi-wheel cutter 3a, remove the holding plate a.
By not moving the blades in the direction of the arrow, the laminated plate 1 is cut along the cutting lines 4.4 at intervals between the blades 7.7. Furthermore, using another multi-wheel cutter whose blades are fixed at intervals corresponding to the length of the other side of the green chip, cutting lines 5.5 and 5.5, which are orthogonal to the cutting lines 4.4,
Cutting of the laminate l is carried out in the same way along...
積層板ｌを切断する他の方法は、前記のようなマルチホ
イールカッタによらず、第７図で示すような一枚のディ
スク状の回転する刃７を装むしたシングルホイルカッタ
３ｂを用いる方法である。すなわち、積層板ｌを平行移
動しながら、切断線５．５・・・に沿って同積層板１を
切断する事を、切断線５．５・・・の間隔毎にカッタ３
ｂをずらしながらその数だけ繰り返す。続いて、一方向
の切断が済んだら積層板を９０″回転し、前記切断線５
．５・・・と直交する方向の切断線４．４・・・に沿っ
て同じ様に切断する方法である。Another method for cutting the laminate l is to use a single-wheel cutter 3b equipped with a disc-shaped rotating blade 7 as shown in FIG. 7, instead of using the multi-wheel cutter as described above. It is. That is, while moving the laminate l in parallel, the cutter 3 cuts the laminate 1 along the cutting lines 5.5... at intervals of the cutting lines 5.5...
Repeat the same number of times while shifting b. Subsequently, after cutting in one direction, the laminate is rotated 90'' and the cutting line 5 is
．． This is a method of cutting in the same way along cutting lines 4.4... in the direction orthogonal to 5....
［発明が解決しようとする課題］
前者のマルチホイールカッタ３ａを用いる積層板ｌの切
断法は、積層セラミックコンデンサの一方の切断線４．
４・・・の間隔で刃７．７・・・が保持されたマルチホ
イルカッタ３ａと、他方の切断線５．５・・・の間隔で
刃が保持されたマルチホイルカッタとの２種類のマルチ
ホイルカッタを用意しなければならない。このため、設
備費用が掛かる事と、複数の刃７．７・・・と複数のス
ペーサ８．８・・・とを交互に組み込んで、生チップの
長辺及び短辺寸法に合う刃７．７・・・の間隔を各々得
るので、正確な刃７．７・・・のピッチ精度が得難いと
言う課題があった。[Problems to be Solved by the Invention] The former method of cutting the laminated plate l using the multi-wheel cutter 3a is based on one cutting line 4 of the laminated ceramic capacitor.
There are two types of multi-foil cutters: a multi-foil cutter 3a in which blades 7.7... are held at intervals of 4..., and a multi-foil cutter 3a in which blades are held at intervals of the other cutting line 5.5... You will need to prepare a multi-foil cutter. For this reason, equipment costs are high, and a plurality of blades 7.7... and a plurality of spacers 8.8... are installed alternately to match the long and short side dimensions of the raw chips. Since the spacing of 7... is obtained, there is a problem in that it is difficult to obtain accurate pitch accuracy of the blades 7.7....
一方、シングルホイールカッタ３ｂによる方法は、同カ
ッタ３ｂの切断線４．４・・・の間の移動回数が多いこ
とから、１枚の積層板１を切断するのに時間がかかり、
生産性が低いという課題があった。On the other hand, in the method using the single wheel cutter 3b, the cutter 3b has to move many times between the cutting lines 4, 4, etc., so it takes time to cut one laminate 1.
There was an issue of low productivity.
本発明は、前記従来の課題に鑑み、その課題を解消する
事の出来る積層セラミックコンデンサの製造方法を提供
することを目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned conventional problems, an object of the present invention is to provide a method for manufacturing a multilayer ceramic capacitor that can solve the problems.
［課題を解消する為の手段］
すなわち、前記目的を達成するため、本発明において採
用された手段の要旨は、セラミックグリンシートｌａ、
１ｂ上に内部電極パターン２ａ、２ｂを縦横に所定の間
隔で印刷する工程と、該セラミックグリーンシートｌａ
１ １ｂを積層して積層板ｌを得る工程と、所定の間隔
で切断用の刃７．７・・・が装着されたカッタ３によっ
て前記積層板ｌを直交する方向に各々所定の間隔で切断
して生チップを得る工程と、該生チップを焼成すると共
に、両端面部に外部電極ＩＬｌｌを形成する工程とを含
む積層セラミックコンデンサの製造方法に於て、前記積
層体ｌの一方向の切断線４．４・・・のピッチが他方向
の切断線５．５・・・のピッチの整数倍であり、かつこ
れら切断線４．４・・・及び５．５・・・に沿う積層板
ｌの切断が、何れも前者の切断線４．４・・・のピッチ
の整数倍に相当する間隔で前記切断用の刃７．７・・・
が複数枚装着されたカッタ３を用いて行なわれることを
特徴とする積層セラミックコンデンサの製造方法である
。[Means for solving the problem] That is, the gist of the means adopted in the present invention to achieve the above object is as follows:
A process of printing internal electrode patterns 2a and 2b at predetermined intervals vertically and horizontally on the ceramic green sheet la
1 Step of laminating 1b to obtain a laminate l, and cutting the laminate l at predetermined intervals in a direction perpendicular to each other by a cutter 3 equipped with cutting blades 7, 7... at predetermined intervals. In the method for manufacturing a multilayer ceramic capacitor, the method includes the steps of: obtaining a raw chip by heating the raw chip; and firing the raw chip and forming external electrodes ILll on both end surfaces. The pitch of 4.4... is an integral multiple of the pitch of cutting lines 5.5... in the other direction, and the laminated plate l along these cutting lines 4.4... and 5.5... The cutting blades 7.7... cut at intervals corresponding to an integral multiple of the pitch of the cutting lines 4.4... of the former.
This is a method for manufacturing a multilayer ceramic capacitor, characterized in that a plurality of cutters 3 are used.
［作 用］
積層セラミックコンデンサの寸法は、いわゆる寸法呼称
が３２１６．１６０８．１００５．２０１０といったよ
うに、長短辺寸法比が２：ｌのものが殆どで、まれに長
短辺寸法比が３＝１のものがある。従って、積層板ｌの
縦横の切断線４．４・・・と５．５・・・の比は、生チ
ップの長短辺寸法比と同じであるから、多くの場合２：
１、まれに３： ｌである。[Function] Most of the dimensions of multilayer ceramic capacitors have a ratio of long and short sides of 2:1, such as the so-called dimension designation 3216.1608.1005.2010, and in rare cases, the ratio of long and short sides is 3=1. There is something. Therefore, the ratio of the vertical and horizontal cutting lines 4.4... and 5.5... of the laminate l is the same as the length ratio of the long and short sides of the raw chip, so in most cases it is 2:
1, rarely 3: l.
本件発明者は、この点に着目し、間隔の広い切断線４．
４・・・のピッチ、つまり生チップの長辺寸法の整数倍
の間隔で複数の切断用の刃７．７・・・を保持したカッ
タ３を用い、まず第１図（ａ）及び第２図（ａ）で示す
ように、積層板１を一方向（図では横方向に）移動させ
ることにより、切断線４．４・・・に沿って積層板１を
切断する。さらにカッタ３を切断線４．４・・・の間隔
の整数倍だけ上下方向に移動し、同様にして切断線４．
４・・・に沿って切断する。これを何回か繰り返すこと
で、前記切断用の刃７．７の間隔の整数分の１の間隔で
積層板ｌが切断できる。The inventor of the present invention paid attention to this point, and the inventors of the present invention focused on this point, and created 4 cutting lines with wide intervals.
Using a cutter 3 holding a plurality of cutting blades 7.7 at a pitch of 4..., that is, an interval that is an integral multiple of the long side dimension of the green chip, As shown in Figure (a), the laminate 1 is cut along the cutting lines 4, 4, . . . by moving the laminate 1 in one direction (in the lateral direction in the figure). Furthermore, the cutter 3 is moved up and down by an integral multiple of the interval between the cutting lines 4.4, . . . , and in the same manner.
4 Cut along... By repeating this several times, the laminated plate 1 can be cut at intervals that are one integer fraction of the interval between the cutting blades 7.7.
次いで、積層板ｌの向きを９０″回転し、前記と同様に
して同積層板ｌを切断線５．５・・・に沿って切断する
。この場合、カッタ３の切断線５．５・・・と直交する
方向の移動間隔を、前記切断線４．４・・・の切断の場
合の１／２或は１／３とすることにより、第１図（ａ）
及び第２図（ｂ）で示すように、前記切断線４．４・・
・の間隔の１／２或は１／３の間隔で積層板ｌが切断で
きる。Next, the direction of the laminated plate l is rotated by 90'', and the same laminated plate l is cut along the cutting line 5.5... in the same manner as above. In this case, the cutting line 5.5... of the cutter 3 is cut. By setting the movement interval in the direction perpendicular to . . . to 1/2 or 1/3 of that in the case of cutting along the cutting line 4.4..., as shown in FIG.
And as shown in FIG. 2(b), the cutting line 4.4...
The laminate l can be cut at intervals of 1/2 or 1/3 of the interval .
そして、前記カッタ３は、複数の刃７．７・・・を有す
るため、繰り返し切断する回数は、シングルホイルカッ
タを用いる場合に比べて少なくて済み、しかも何れも同
じカッタ３で縦横が切断できる。また、カッタ３の間隔
は、生チップの長辺寸法の整数倍に設定すればよいので
、極１１．１に刃７．７・・・の間隔を狭くする必要が
な（、カッタ３の組み立てが容易で、高い精度が得られ
る。Since the cutter 3 has a plurality of blades 7, 7..., the number of repeated cuts is less than when using a single foil cutter, and the same cutter 3 can cut both vertically and horizontally. . In addition, since the spacing between the cutters 3 can be set to an integral multiple of the long side dimension of the raw chip, there is no need to narrow the spacing between the poles 11.1 and the blades 7.7. is easy and provides high accuracy.
［実 施 例コ
次に、図面を参照しながら、本発明の実施例について具
体的に説明する。[Embodiments] Next, embodiments of the present invention will be specifically described with reference to the drawings.
本発明による積層セラミックコンデンサの製造方法にお
いて用いられるカッタ３の例が第３図に示されている。An example of the cutter 3 used in the method of manufacturing a multilayer ceramic capacitor according to the present invention is shown in FIG.
同図では、２枚のディスク状の刃７．７と、この間に挟
まれたスペーサ８とが、軸６に固定され、これにより２
枚の刃７．７が切断線４．４・・・の大きな方の間隔、
つまり生チップの長辺寸法に対応する間隔に保持されて
いる。In the same figure, two disc-shaped blades 7.7 and a spacer 8 sandwiched between them are fixed to the shaft 6, and thereby the two
The gap between the blades 7.7 and the larger cutting line 4.4...
In other words, they are maintained at intervals corresponding to the long side dimensions of the raw chips.
第１図及び第２図において、符合ｌは、既に述べたよう
な方法で製作された積層板を示すが、前記カッタ３を用
いてこれを切断し、個々の生チップに分割する工程が第
１図と第２図に示されており、第１図は、生チップの長
短辺寸法比が２＝ １の場合、第２図は、生チップの長
短辺寸法比が３； １の場合である。In FIGS. 1 and 2, the reference numeral 1 indicates a laminate manufactured by the method described above, and the step of cutting it using the cutter 3 and dividing it into individual green chips is the first step. 1 and 2. Figure 1 shows the case where the ratio of long and short sides of the raw chip is 2=1, and Figure 2 shows the case where the ratio of the long and short sides of the raw chip is 3:1. be.
まず、第１図について説明すると、保持板ａの上に前記
カッタ３の軸６を水平に支持し、刃７．７を回転させる
。また、保持板ａ上に前記積層板１を載せるが、この−
辺（図において左辺）が前記カッタ３の軸６と平行にな
るよう配置し、かつ保持板ａの板面とカッタ３の刃先と
の間隔を積層板ｌの厚さより狭く設定する。この状態で
、先ず第１図（ａ）で示すように、保持板ａを矢印で示
す方向に移動させて、カッタ３で積層板ｌを切断する。First, referring to FIG. 1, the shaft 6 of the cutter 3 is supported horizontally on a holding plate a, and the blade 7.7 is rotated. Also, the laminated plate 1 is placed on the holding plate a, but this -
The cutter 3 is arranged so that its side (the left side in the figure) is parallel to the axis 6 of the cutter 3, and the distance between the plate surface of the holding plate a and the cutting edge of the cutter 3 is set to be narrower than the thickness of the laminate l. In this state, first, as shown in FIG. 1(a), the holding plate a is moved in the direction shown by the arrow, and the laminated plate l is cut with the cutter 3.
これにより、積層板１は、平行でかつ生チップの長辺寸
法の１■隔を有する２本の切断線４．４に沿って切断さ
れる。As a result, the laminate 1 is cut along two cutting lines 4.4 that are parallel and spaced apart by 1 inch, the length of the long side of the green chip.
次に、保持板ａを下降させ、矢印と反対側に移動させて
積層板ｌを戻し、再び上昇させると共に、同保持板ａを
第１図（ａ）において下方へ生チップの長辺寸法の２倍
の距離だけ移動させる。そして、この状態で前記と同様
にして保持板ａを移動させて積層板ｌを切断する。これ
により、積層板ｌは、前記切断線２と平行でかつ生チッ
プの長辺寸法の間隔だけ離れた別の２本の切断線４．４
に沿って切断され、この切断線４．４の間隔は、先に形
成された切断線４．４と同じ間隔である。これを何度か
繰り返すことにより、所定の切断線４．４・・・の全て
に沿って積層板ｌが切断される。Next, the holding plate a is lowered, moved to the opposite side of the arrow, the laminated plate l is returned, and raised again, and the same holding plate a is moved downward in FIG. Move it twice as far. Then, in this state, the holding plate a is moved and the laminated plate l is cut in the same manner as described above. As a result, the laminate l is cut along two other cutting lines 4.4 parallel to the cutting line 2 and spaced apart by the length of the long side of the green chip.
The distance between the cutting lines 4.4 is the same as the previously formed cutting lines 4.4. By repeating this several times, the laminate l is cut along all of the predetermined cutting lines 4, 4, . . . .
なお、刃７．７の間隔を生チップの長辺寸法の２倍に設
定したときは、まず保持板ａを図において下方に移動さ
せながら、前記刃７．７と同じ間隔で同切断線４．４・
・・を形成し、その後この切断線４．４・・・の中間位
置に全く同じようにして切断線４．４・・・を形成する
ことにより、生チップの長辺寸法に対応する間隔で切断
線４．４・・・が形成Ｃきる。さらに、刃７．７の間隔
を生チップの長辺寸法の３倍に設定したときは、まず保
持板ａを図において下方に移動させながら、刃７．７と
同じ間隔で同切断線４．４・・・を形成した後、との切
断線４．４・・・の間の１／３及び２／３の位置で各々
全く同じようにして切断線４．４・・・を形成すればよ
い。以下、刃７．７の間隔を生チップの長辺寸法の４倍
以上に設定したときも同様である。Note that when the spacing between the blades 7.7 is set to twice the long side dimension of the raw chips, first move the holding plate a downward in the figure and cut the same cutting line 4 at the same spacing as the blades 7.7. .4・
..., and then form cutting lines 4.4... in exactly the same way at the intermediate positions of the cutting lines 4.4..., with intervals corresponding to the long side dimensions of the raw chips. Cutting lines 4.4... are formed. Furthermore, when the spacing between the blades 7.7 is set to three times the long side dimension of the green chip, first move the holding plate a downward in the figure and then cut along the same cutting line 4.7 at the same spacing as the blades 7.7. After forming 4..., cut lines 4.4... are formed in exactly the same way at 1/3 and 2/3 positions between the cut lines 4.4... good. The same holds true when the spacing between the blades 7.7 is set to four times or more the long side dimension of the raw chip.
次に、第１図（ａ）の状態から同図（ｂ）で示すように
、保持板ａを９０°回転させる。そして、前記と同様に
して切断線４．４・・・と直交する切断線５．５・・・
に沿って積層板ｌを切断する。この場合例えば、まず保
持板ａを図において下方へ移動させながら、前記切断線
４．４・・・と同じ間隔で切断線５．５・・・を形成し
、その後この切断線５．５・・・の中間位置に全く同じ
ようにして切断線５．５・・・を形成することにより、
結局切断線５．５・・・の間隔は切断線４．４・・・の
間隔の１／２となる。つまり、積層板ｌから長短辺寸法
比が２： １の生チップが切断される。Next, the holding plate a is rotated 90 degrees from the state shown in FIG. 1(a) as shown in FIG. 1(b). Then, in the same manner as above, cutting lines 5.5... perpendicular to cutting lines 4.4...
Cut the laminate l along. In this case, for example, first, while moving the holding plate a downward in the figure, cutting lines 5.5 are formed at the same intervals as the cutting lines 4.4, and then the cutting lines 5.5 and 5.5 are formed at the same intervals as the cutting lines 4.4. By forming a cutting line 5.5... in exactly the same way at the intermediate position of...
As a result, the interval between the cutting lines 5.5, . . . becomes 1/2 of the interval between the cutting lines 4, 4, . In other words, raw chips having a long-to-short side dimension ratio of 2:1 are cut from the laminate l.
既に述べた通り、この様にして切断された個々の生チッ
プを焼成すると共に、その両端に外部電極１１．１１を
形成することにより、第４図で示すような積層セラミッ
クコンデンサが完成する。As already mentioned, by firing the individual raw chips cut in this way and forming external electrodes 11.11 on both ends, a multilayer ceramic capacitor as shown in FIG. 4 is completed.
第２図は、生チップの長短辺寸法比がに３の場合の例で
あるが、この場合は、積層板ｌを切断線５．５・・・に
沿って切断する間隔が前記第１図の場合と異なるだけで
ある。つまりここでは、例えばまず保持板ａを図におい
て下方に移動させながら、前記切断線４．４・・・と同
じ間隔で切断線５．５・・・を形成した後、この切断線
５．５・・・の間の１／３及び２／３の位置で各々全く
同じようにして切断線５．５・・・を形成する。これに
より、結局切断線５．５・・・の間隔は切断線４．４・
・・の間隔の１／３となる。つまり、積層板ｌから長短
辺寸法比が３＝ １の生チップが切断される。FIG. 2 shows an example in which the ratio of long and short sides of the green chip is 3. In this case, the interval at which the laminated plate l is cut along the cutting line 5.5 is as shown in FIG. 1. It is only different from the case of . That is, here, for example, first, while moving the holding plate a downward in the figure, cutting lines 5.5... are formed at the same intervals as the cutting lines 4.4..., and then the cutting lines 5.5... Cut lines 5.5... are formed in exactly the same way at 1/3 and 2/3 positions between... As a result, the interval between the cutting lines 5.5 and 4.4.
This is 1/3 of the interval between... In other words, raw chips having a length ratio of 3=1 are cut from the laminate l.
［発明の効果コ
以上説明した通り、本発明によれば、刃とスペーサの数
が少ないカッタを１組だけ用意すればよいので、設備費
用が少なく、また、刃の間隔は生チップの長辺寸法の整
数倍に合わせて間隔を設定すればよいので、その間隔精
度が高くなり、切断精度が高くなるという効果が得られ
る。[Effects of the Invention] As explained above, according to the present invention, it is only necessary to prepare one set of cutters with a small number of blades and spacers. Since it is only necessary to set the interval according to an integral multiple of the dimension, the accuracy of the interval is increased, and the effect of increasing the cutting accuracy can be obtained.
第１図（ａ）、（ｂ）及び第２図（ａ）、（ｂ）は、本
発明の各実施例を示す積層板の切断工程の平面図、第３
図は、本発明の方法に用いるカッタの例を示す斜視図、
第４図は、積層セラミックコンデンサの構造の例を示す
一部切欠の断面図、第５図は、内部電極パターンが印刷
済みのグリーンシートを示す斜視図、第６図と第７図は
、従来の積面セラミックコンデンサの製造方法における
積層板の切断工程の各側を示す斜視図である。
■・・・積層板 １ａ、１ｂ・・・セラミックグリンシ
ート ２ａ、２ｂ・・・内部電極パターン ３・・・カ
ッタ ４．５・・・切断線 ７・・・切断用の刃 １１
・・・外部電極FIGS. 1(a), (b) and 2(a), (b) are plan views of the cutting process of a laminate showing each embodiment of the present invention, and FIGS.
The figure is a perspective view showing an example of a cutter used in the method of the present invention;
Fig. 4 is a partially cutaway cross-sectional view showing an example of the structure of a multilayer ceramic capacitor, Fig. 5 is a perspective view showing a green sheet with internal electrode patterns printed on it, and Figs. 6 and 7 are conventional FIG. 3 is a perspective view showing each side of the laminated plate cutting process in the method for manufacturing a multilayer ceramic capacitor. ■... Laminate plate 1a, 1b... Ceramic green sheet 2a, 2b... Internal electrode pattern 3... Cutter 4.5... Cutting line 7... Cutting blade 11
・・・External electrode
Claims (1)
ン２ａ、２ｂを縦横に所定の間隔で印刷する工程と、該
セラミックグリーンシート１ａ、１ｂを積層して積層板
１を得る工程と、所定の間隔で切断用の刃７、７・・・
が装着されたカッタ３によって前記積層板１を直交する
方向に各々所定の間隔で切断して生チップを得る工程と
、該生チップを焼成すると共に、両端面部に外部電極１
１、１１を形成する工程とを含む積層セラミックコンデ
ンサの製造方法に於て、前記積層体１の一方向の切断線
４、４・・・のピッチが他方向の切断線５、５・・・の
ピッチの整数倍であり、かつこれら切断線４、４・・・
及び５、５・・・に沿う積層板１の切断が、何れも前者
の切断線４、４・・・のピッチの整数倍に相当する間隔
で前記切断用の刃７、７・・・が複数枚装着されたカッ
タ３を用いて行なわれることを特徴とする積層セラミッ
クコンデンサの製造方法。A process of printing internal electrode patterns 2a, 2b on the ceramic green sheets 1a, 1b at predetermined intervals vertically and horizontally, a process of laminating the ceramic green sheets 1a, 1b to obtain a laminate 1, and cutting at predetermined intervals. Blade 7, 7...
A step of cutting the laminated plate 1 at predetermined intervals in the orthogonal direction using a cutter 3 equipped with a cutter 3 to obtain raw chips, and firing the raw chips and attaching external electrodes 1 to both end surfaces.
1, 11, the pitch of the cutting lines 4, 4... in one direction of the multilayer body 1 is the pitch of the cutting lines 5, 5... in the other direction. is an integral multiple of the pitch of, and these cutting lines 4, 4...
and 5, 5..., the cutting blades 7, 7... are cut at intervals corresponding to an integral multiple of the pitch of the former cutting lines 4, 4... A method for manufacturing a multilayer ceramic capacitor, characterized in that the manufacturing method is carried out using a plurality of cutters 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1311982A JP2974153B2 (en) | 1989-11-30 | 1989-11-30 | Manufacturing method of multilayer ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1311982A JP2974153B2 (en) | 1989-11-30 | 1989-11-30 | Manufacturing method of multilayer ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03173108A true JPH03173108A (en) | 1991-07-26 |
| JP2974153B2 JP2974153B2 (en) | 1999-11-08 |
Family
ID=18023776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1311982A Expired - Fee Related JP2974153B2 (en) | 1989-11-30 | 1989-11-30 | Manufacturing method of multilayer ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2974153B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129502A (en) * | 1995-11-01 | 1997-05-16 | Taiyo Yuden Co Ltd | Method and device of manufacturing laminated electronic component |
| JP2003142334A (en) * | 2001-10-31 | 2003-05-16 | Disco Abrasive Syst Ltd | Method of dividing ceramic chip capacitor sheet |
| JP2011135032A (en) * | 2009-12-24 | 2011-07-07 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and method of manufacturing the same |
| US20130199717A1 (en) * | 2012-02-07 | 2013-08-08 | Murata Manufacturing Co., Ltd. | Method for manufacturing monolithic ceramic electronic components |
-
1989
- 1989-11-30 JP JP1311982A patent/JP2974153B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129502A (en) * | 1995-11-01 | 1997-05-16 | Taiyo Yuden Co Ltd | Method and device of manufacturing laminated electronic component |
| JP2003142334A (en) * | 2001-10-31 | 2003-05-16 | Disco Abrasive Syst Ltd | Method of dividing ceramic chip capacitor sheet |
| JP2011135032A (en) * | 2009-12-24 | 2011-07-07 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic capacitor and method of manufacturing the same |
| US8194390B2 (en) | 2009-12-24 | 2012-06-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and fabricating method thereof |
| US20130199717A1 (en) * | 2012-02-07 | 2013-08-08 | Murata Manufacturing Co., Ltd. | Method for manufacturing monolithic ceramic electronic components |
| CN103247442A (en) * | 2012-02-07 | 2013-08-14 | 株式会社村田制作所 | Method for manufacturing laminated ceramic electronic components |
| US9039859B2 (en) * | 2012-02-07 | 2015-05-26 | Murata Manufacturing Co., Ltd. | Method for manufacturing monolithic ceramic electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2974153B2 (en) | 1999-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61248413A (en) | Manufacture of laminate ceramic capacitor | |
| JPH03108306A (en) | Manufacture of multilayer capacitor | |
| JP2974153B2 (en) | Manufacturing method of multilayer ceramic capacitor | |
| JPH09260187A (en) | Manufacture of ceramic electronic part | |
| JP2000269074A (en) | Multilayer ceramic capacitor and manufacture thereof | |
| JP2539106B2 (en) | Piezoelectric actuator and manufacturing method thereof | |
| JPH0228977A (en) | Laminated piezoelectric element | |
| JPH08191034A (en) | Laminated capacitor | |
| JPH0722222B2 (en) | Method for dividing ceramic laminate | |
| JPS59100510A (en) | Method of producing laminated ceramic condenser | |
| JPS5941282B2 (en) | Resistance element, resistance element assembly and manufacturing method thereof | |
| JP3381860B2 (en) | Ceramic green sheet reversing jig and reversing method using the same | |
| JPH01264805A (en) | Manufacture of ceramic substrate | |
| JPH08244019A (en) | Lamination of ceramic green sheet | |
| JPH06275438A (en) | Chip coil with mark and manufacture thereof | |
| JPS60124813A (en) | Method of producing laminated ceramic capacitor | |
| JPH06226689A (en) | Electronic part element collective sheet cutter and electronic part element collective sheet cutting method using the cutter | |
| JPH047579B2 (en) | ||
| JP3155851B2 (en) | Manufacturing method of chip type resistor | |
| JPH11340088A (en) | Manufacture of capacitor array | |
| JPH05182858A (en) | Manufacture of laminated ceramic capacitor | |
| JPH0555045A (en) | Chip inductor and its manufacture | |
| JPH0412018B2 (en) | ||
| JPH05175064A (en) | Manufacture of laminated electronic component | |
| JPH01289234A (en) | Manufacture of laminated ceramic chip capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |