JPH09129502A - Method and device of manufacturing laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the method of manufacturing laminated electronic compo nent capable of settling the nonconformity in the case of cutting off a ceramic green sheet for manufacturing excellent components. SOLUTION: A ceramic green sheet 2 on a carrier film 1 is linearly cut off by draw cutting mode using respective cut off blades 13 by shifting respective circular cut off blades 13 in parallel with the surface of a table 3 so that the burring or cracking around an unit sheet in case of cut off step by conventional cutting mode may be avoided thereby enabling a clean cut off surface to be produced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a laminated electronic component manufactured by stacking ceramic green sheets cut into a predetermined size.

[0002]

2. Description of the Related Art A typical multilayer capacitor as a multilayer electronic component has been conventionally manufactured as follows.

First, a ceramic slurry is applied to the upper surface of a carrier film made of PET or the like by a doctor blade method or the like with a uniform thickness, and this is dried to form a ceramic green sheet on the carrier film.

Next, a pattern of a conductor paste to be internal electrodes is formed on the upper surface of this ceramic green sheet by screen printing or the like, and this is dried.

Next, as shown in FIG. 8 (a), the carrier film 101 and the ceramic green sheet 102 are conveyed onto the table 103 and stopped while maintaining the adhered state of both. A large number of suction holes 103 a are formed on the upper surface of the table 103, and the stopped carrier film 1 is suction-held on the table 103.

Next, as shown in FIG. 8A, the punching blade 1
A cutting head 105 equipped with 04 on the periphery is vertically lowered from above the table 103 to bring the lower surface into close contact with the ceramic green sheet 102, and the cutting edge of the punching blade 104 is cut into the upper surface layer of the carrier film 101. The ceramic green sheet 102 is cut into a predetermined size. A large number of suction holes 105a are formed on the lower surface of the cutting head 105, and the ceramic green sheet 102 after the close contact is sucked and held by the cutting head 105 with a force larger than that of the table 103 side.

Next, as shown in FIG. 8 (b), the cutting head 105 is raised to separate the ceramic green sheet (hereinafter referred to as a unit sheet) 102a cut into a predetermined size from the carrier film 101. To do.

Next, the cutting head 105 for sucking and holding the unit sheets 102a is moved to the stacking position, where the suction force is released to stack the unit sheets 102a. The above procedure is repeated until a predetermined number of unit sheets 102a are stacked, and after stacking, this is pressed to obtain a laminate.

Next, the laminated product is cut into a size corresponding to each component and baked, and a conductor paste is applied to both ends of the chip and baked to form an external electrode. If necessary, the external electrode is formed on the surface of the external electrode. Form a solder plating layer.

[0010]

In the above-mentioned conventional manufacturing method, the punching blade 104 provided around the cutting head 105 is lowered in the direction perpendicular to the upper surface of the carrier film 101, whereby the carrier film 10 is cut.
Since the ceramic green sheet 102 on 1 is cut by push cutting, burrs and cracks are easily generated around the unit sheet 102a due to the pressing force from the punching blade 104, and when stacking the unit sheets due to this influence. There is a problem that displacement occurs and stress concentration is locally generated during pressurization, resulting in deterioration of quality and performance. Further, since the sheet material easily adheres to the punching blade 104 at the time of cutting, there is a problem that the degree of burrs and cracks gradually deteriorates unless the sheet material is regularly removed.

The above problem may occur not only in the case of the multilayer capacitor but also in the case of the multilayer inductor, the thick film multilayer substrate, etc., when the ceramic green sheet is cut by the same pressing.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a laminated electronic component capable of obtaining a high-quality component by eliminating the problem of cutting a ceramic green sheet. An object of the present invention is to provide a manufacturing method and an apparatus suitable for carrying out this method.

[0013]

In order to achieve the above object, the invention of claim 1 is a laminated type in which a ceramic green sheet on a carrier film is cut into a predetermined size and is peeled from the carrier film and stacked. The method of manufacturing an electronic component is characterized in that the ceramic green sheet on the carrier film is cut into a predetermined size by cutting with a cutting blade.

According to a second aspect of the invention, there is provided a table for adsorbing and holding a carrier film having a ceramic green sheet formed on the upper surface thereof, and a blade for cutting the ceramic green sheet on the carrier film into a predetermined size. And a suction head for sucking and holding a ceramic green sheet cut into a predetermined size and peeling it from the carrier film, in a manufacturing apparatus for a laminated electronic component, the suction head is provided with a carrier film on the carrier film. The feature is that a blade for cutting the ceramic green sheet by cutting is provided.

According to the first and second aspects of the present invention, since the ceramic green sheet on the carrier film is cut by pull cutting, burrs and burrs are formed around the unit sheet at the time of cutting like the conventional push cutting. It is possible to prevent the occurrence of cracks and obtain a clean cut surface, which occurs when the unit sheets are stacked due to burrs and cracks and when pressure is applied. By avoiding localized stress concentration, it is possible to prevent deterioration of quality and performance of manufactured parts.

[0016]

1 to 4 show an embodiment of the present invention. FIG. 1 is a side view of the apparatus, and FIG. 2 is A- of FIG.
FIG. 4 is a sectional view taken along line A, FIG. 3 is a sectional view taken along line BB in FIG. 1, and FIG. The present invention can be applied to various laminated electronic components such as a laminated capacitor, a laminated inductor, and a thick film multilayer substrate. Here, an example applied to a laminated capacitor will be described.

In the figure, 1 is a carrier film, 2 is a ceramic green sheet, 3 is a table, and 11 is a cutting / suction unit.

The carrier film 1 is formed of a flexible resin film such as PET in a band shape with a predetermined width, and a ceramic green sheet 2 is provided on the upper surface thereof with a predetermined thickness and width. The ceramic green sheet 2 is formed by applying a dielectric ceramic slurry on the carrier film 1 by a doctor blade method or the like with a uniform thickness and drying it. Further, on the upper surface of the ceramic green sheet 2, a pattern (not shown) of a conductor paste to be an internal electrode is formed by screen printing or the like. By the way, ceramic green sheet 2
Is adhered to the carrier film 1 in a releasable state, and the adhesive force is adjusted by applying a known release material on the carrier film 1 in advance.

The table 3 is for adsorbing and holding the carrier film 1 having the ceramic green sheet 2 formed on the upper surface thereof. The table 3 is wider than the carrier film 1 and has a large number of suction holes 3a on the flat upper surface. Are formed. These suction holes 3a are connected to a negative pressure source such as a compressor so that the lower surface of the carrier film 1 can be adsorbed and held if necessary.

The cutting / suction unit 11 is the suction head 1
2, four cutting blades 13 having a circular cutting edge, four arms 14 for supporting the cutting blades, an elevating plate 15, a belt 16 for arm movement, and a belt driving motor 17,
It is mainly composed of two cylinders 18 for driving the lifting plate, a cylinder 19 for driving the suction head, and a base plate 20.

The suction head 12 is for sucking and holding a green sheet (hereinafter referred to as a unit sheet) 2a cut into a predetermined size, has the same shape as the unit sheet 2a, and has an upper surface of the table 3. A large number of suction holes 12a are formed on a flat lower surface facing in parallel with. These suction holes 12a are connected to a negative pressure source such as a compressor, and if necessary, attract and hold the unit sheet 2a with a force larger than that on the table side. The suction head 12 is connected to a rod 19a of a cylinder 19 provided on the base plate 20, and the cylinder 19 is actuated to move up and down in a direction perpendicular to the upper surface of the table 3 while maintaining a parallel state with the upper surface of the table 3. To do.

Each arm 14 is substantially L-shaped when viewed from the side, and a slide guide 21 fixed to the upper part of the arm 14 is slidably engaged with the outer edge (guide rail portion) of the elevating plate 15, It can be moved along each outer edge of the lift plate 15. In addition, in the lower part of each arm 14, a cylindrical member 22 having an opening on the suction head 12 side, a bush 22 that rotatably supports the shaft 13a of the cutting blade 13, and the shaft 13a of the cutting blade 13 are attached to the suction head 12. Spring 23 that biases to the side
Is provided. That is, each cutting blade 13 has its shaft 13
a is supported in a direction parallel to the upper surface of the table, and further, in FIG.
As shown in FIG. 5, the axes are arranged so that the axes are different from each other by 90 degrees when viewed from the upper surface, and the tip end surface of the axis is in contact with each side surface of the suction head 12 by the spring biasing force. Also, the lifting plate 15
Is connected to the rods 18a of two cylinders 18 provided on the base plate 20, and the cylinders 18 are operated to move up and down in a direction perpendicular to the upper surface of the table 3 while maintaining the parallel state with the upper surface of the table 3.

The belt 16 attaches each arm 14 to the lifting plate 15
For moving along each side of the outer edge of the
It is wound around four pulleys 24 arranged at the four corners of No. 5, and the upper end extending portions 14a of each arm 14 are connected to this. A pulley 25 for driving force transmission is connected to one of the four pulley shafts, and the pulley 25 is connected to the pulley 25 and the shaft of a belt driving motor 17.
Another belt 26 is wound around. That is, the belt 16 moves in a predetermined direction by the operation of the motor 17, the arms 14 move along the outer edges of the lift plate 15 along with the movement, and the cutting blades 13 move to the side surfaces of the suction head 12. Move along.

Here, the procedure for cutting and peeling the ceramic green sheet will be described with reference to FIGS.

First, the carrier film 1 having the ceramic green sheet 2 formed on its upper surface is conveyed onto the table 1 and stopped at a predetermined position. And table 3
A suction force is applied to the suction holes 3a of the carrier film 1
Is adsorbed and held on the table top surface.

Next, as shown in FIG. 4A, the suction head 12 is lowered by a predetermined distance by the operation of the cylinder 19, and the lower surface thereof is brought into close contact with the upper surface of the ceramic green sheet 2. At the same time, the operation of the cylinder 18 also lowers the lifting plate 15 and each arm 14 by the same distance, and maintains the positional relationship between the suction head 12 and each cutting blade 13.

Next, as shown in FIG. 4 (b), the operation of the cylinder 18 lowers the elevating plate 15 and each arm 14 by a distance slightly larger than the thickness of the ceramic green sheet 2 to remove each cutting blade 13. The cutting edge is cut into the upper surface layer of the carrier film 1.

Next, as shown in FIG. 4 (c), the motor 1
The belt 16 and each arm 14 are moved in a predetermined direction by the operation of 7, and each cutting blade 13 is moved in parallel with the upper surface of the table 3. As a result, each cutting blade 13 moves along the side surface of the cutting head 12 while rotating while being in contact with the carrier film 1, and the ceramic green sheet 2 on the carrier film 1 is linearly cut by the cutting blades 13. Be disconnected.

As described above, since the cutting blades 13 have their moving directions different from each other by 90 degrees and the moving distance thereof is set to be larger than the side face width of the suction head 12, FIG. As shown in d), the cutting lines L by the respective cutting blades 13 are orthogonal to each other at a 90 degree angle, whereby the ceramic green sheet 2 is cut into a predetermined size.

Next, as shown in FIG. 4 (e), the lift plate 15 and each arm 14 are moved to the position shown in FIG.
It is raised by the amount of fall in (b), and the positional relationship between the suction head 12 and each cutting blade 13 is returned to the original state. Around this, a suction force is applied to the suction holes 12a of the suction head 12 to suck and hold the cut unit sheet 2a.

Next, as shown in FIG. 4 (f), the suction head 12 is raised and returned by the operation of the cylinder 19, and the cut unit sheet 2a is peeled from the carrier film 1. At the same time, the lift plate 15 and the arms 14 are also lifted and returned by the operation of the cylinder 18, and the suction head 12
While maintaining the positional relationship between the cutting blade 13 and each cutting blade 13,
By the operation of 7, the belt 16 and each arm 14 are moved in the opposite direction, and each cutting blade 13 is returned to the original position.

Next, the suction head 12 for sucking and holding the unit sheets 2a is moved to the stacking position, where the suction force is released to stack the unit sheets 2a. The above procedure is repeated until a predetermined number of unit sheets 2a are stacked,
After stacking, this is pressed to obtain a laminate.

Next, the laminate is cut into a size corresponding to each component and baked, and a conductor paste is applied to both ends of the chip and baked to form an external electrode. If necessary, a surface of the external electrode is formed. A solder plating layer or the like is formed. The multilayer capacitor is manufactured as described above.

As described above, according to the above-mentioned manufacturing method, since the ceramic green sheet 2 on the carrier film 1 is cut by pull-cutting, burrs are formed around the unit sheet at the time of cutting like the conventional push-cutting. It is possible to prevent the occurrence of cracks and cracks and obtain a clean cut surface, which occurs when the unit sheets are stacked due to burrs and cracks and when pressure is applied. Precisely avoiding localized stress concentration, it is possible to prevent deterioration in quality and performance of manufactured parts. Further, since the sheet material does not adhere to the blade itself at the time of cutting, there is no need for cleaning, and a clean cut surface free of burrs and cracks can be obtained at all times.

Moreover, since the ceramic green sheet 2 is cut by pulling with the cutting edge of the cutting blade 13 biting into the upper surface layer of the carrier film 1, the parallelism between the moving direction of the cutting blade 13 and the upper surface of the table. Even if the sheet is not accurately maintained, it is possible to completely cut the sheet and avoid a cutting failure.

In the above embodiment, the unit sheet 2a is peeled off by raising the suction head 12, but as shown in FIG. 5, the table 3'is configured to be movable in the horizontal direction. , The table 3'is moved to the left in the figure at the timing corresponding to FIG. 4 (e), and at the same time, the carrier film 1 and the ceramic green sheet 2 after cutting are pulled downward. The unit sheet 2a can be peeled off without raising. In this case, since peeling is performed from one end of the unit sheet 2a toward the other end, sheet deformation or breakage is less likely to occur during peeling as compared with the case where the suction head 12 is lifted and peeled, and higher quality is achieved. A unit sheet of is obtained.

Further, in the above embodiment, the suction head 12
Although the cutting blades 13 and the cutting blades 13 can be independently moved up and down by the dedicated cylinders 18 and 19, respectively, the cylinders 18 are eliminated and the lifting plate 15 is fixed to the suction heads 12. Even if the downward protrusion amount of each cutting blade 13 from the above is defined in advance according to the thickness of the ceramic green sheet 2, the same sheet cutting and peeling as described above can be performed.

Further, in the above-described embodiment, the cutting blade 13 which has a circular cutting edge and moves in the direction parallel to the upper surface of the table is exemplified as the cutting blade capable of pulling and cutting.
Various cutting blade structures, as long as they allow pull cutting,
For example, the structure shown in FIG. 6 or 7 can be adopted.

The cutting blade 31 shown in FIG. 6 has a curved cutting edge and swings without changing the distance between the cutting edge and the table top surface.
And a ball screw 33 that rotates by this is arranged parallel to the table upper surface, and a nut 34 rotatably attached to the apex of the cutting blade 31 is screwed into the ball screw 32,
The pin 31a provided at the center of the cutting blade 31 is guided by the V groove 15a on the side surface of the lift plate.

According to this cutting blade structure, the nut 34 is moved in parallel with the table upper surface by the operation of the motor 32, so that the cutting blade 31 is swung without changing the blade tip distance from the table upper surface, so that the carrier film is not moved. The ceramic green sheet of can be cut by drawing.

The cutting blade 41 shown in FIG. 7 has a linear cutting edge and is parallel to the table upper surface in a direction intersecting the direction orthogonal to the table upper surface. Arranged in a direction orthogonal to the upper surface, the pressing plate 43 is connected to the rod, two slender elongated holes 41a are formed in the cutting blade 41, and a pin 15b protruding from the side surface of the elevating plate is fitted into this. The cutting blade 41 is urged upward by a spring 44 so that its upper edge is in contact with the flat lower surface of the pressing plate 43.

According to this cutting blade structure, the operation of the cylinder 42 presses the cutting blade 41 downward against the spring biasing force via the pressing plate 43, so that the cutting blade 41 is formed into the slender long hole 41a. The ceramic green sheet on the carrier film can be cut by pulling it by moving it diagonally to the lower left in the figure.

[0043]

As described in detail above, according to the present invention,
Since the ceramic green sheet on the carrier film is cut by pull cutting, burrs and cracks are not generated around the unit sheet at the time of cutting as in the case of conventional push cutting to obtain a clean cut surface. It is possible to accurately avoid positional deviations that occur when stacking unit sheets due to burrs and cracks, and local stress concentration that occurs when applying pressure, and to improve the quality of manufactured parts. It is possible to prevent performance deterioration. Further, since the sheet material does not adhere to the blade itself at the time of cutting, there is no need for cleaning, and a clean cut surface free of burrs and cracks can be obtained at all times.

[Brief description of the drawings]

FIG. 1 is a side view of an apparatus according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a sectional view taken along line BB of FIG. 1;

FIG. 4 is a diagram showing a state of cutting and peeling a sheet.

FIG. 5 is a diagram showing another structural example of a table.

FIG. 6 is a view showing another structural example of the cutting blade.

FIG. 7 is a view showing another structural example of the cutting blade.

FIG. 8 is a diagram showing a conventional apparatus and method.

[Explanation of symbols]

1 ... Carrier film, 2 ... Ceramic green sheet, 2a ... Unit sheet, 3, 3 '... Table, 12 ... Suction head, 13, 31, 41 ... Cutting blade.

Claims (5)

[Claims] 1. A method for manufacturing a laminated electronic component, wherein a ceramic green sheet on a carrier film is cut into a predetermined size, and the ceramic green sheet is peeled from the carrier film and stacked. A method of manufacturing a multilayer electronic component, comprising cutting the material into a predetermined size by drawing. 2. A table for adsorbing and holding a carrier film having a ceramic green sheet formed on an upper surface thereof, a blade for cutting the ceramic green sheet on the carrier film into a predetermined size, and a predetermined size. In a laminated electronic component manufacturing device equipped with an adsorption head for adsorbing and holding the cut ceramic green sheet and peeling it from the carrier film, the ceramic green sheet on the carrier film is cut off around the adsorption head. An apparatus for manufacturing a laminated electronic component, which is provided with a cutting blade. 3. The laminated electronic component according to claim 2, wherein the pulling-off blade has a circular blade edge and is movable in a direction parallel to the upper surface of the table. apparatus. 4. The laminated die according to claim 2, wherein the pull-cutting blade is a blade having a curved blade edge and swinging without changing a blade edge distance from a table upper surface. Manufacturing equipment for electronic components. 5. The laminate according to claim 2, wherein the pull-cutting blade is a blade that has a linear blade edge and that translates in a direction intersecting the orthogonal direction with respect to the upper surface of the table. Type electronic parts manufacturing equipment.