JPH09134849A - Manufacture of laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of laminated electronic component by recycling a carrier film by extracting a sheet without giving any damage to the carrier film. SOLUTION: After a carrier film F is removed from the rear surface of a ceramic green sheet S while the sheet S is held by means of a suction head 2 by suction, the sheet S is carried onto a punching state 4 and held between the head 2 and state 4. Then a piece of a prescribed size is punched from the sheet matrix S with a punching blade 3 and the punched piece Sa is extracted with the suction head 2. Since the film F is removed from the sheet matrix S before the sheet S is punched, the carrier film F is not damaged as in the case of the conventional example. Therefore, the manufacturing cost of laminated electronic components can be reduced by recycling the carrier film F.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated electronic component manufactured by stacking ceramic green sheets having a predetermined size.

[0002]

2. Description of the Related Art A typical multilayer capacitor as a multilayer electronic component has been conventionally manufactured as follows.

First, the surface of a carrier film made of PET or the like is coated with a ceramic slurry in a uniform thickness by a coating method using a doctor blade, a reverse roll coater or the like, and this is dried to form a ceramic on the carrier film. Form a green sheet.

Next, a conductor paste is printed in a predetermined pattern on the surface of the ceramic green sheet by screen printing or the like, and the conductor paste is dried to form a conductor layer to be an internal electrode.

Next, the carrier film on which the ceramic green sheets are formed is conveyed onto a base, and a punching blade is cut into the ceramic green sheets to punch only the ceramic green sheets to a predetermined size.

Next, the punched ceramic green sheets of a predetermined size are peeled off from the carrier film, extracted, and stacked. The above procedure is repeated until a predetermined number of ceramic green sheets having a predetermined size are stacked, and after stacking, this is pressed to obtain a laminate.

Next, the laminate is cut into a size corresponding to each component and fired, and a conductor paste is applied to both ends of the fired chip and baked to form an external electrode. A solder plating layer or the like is formed on the surface.

FIG. 11 shows an apparatus generally used in the above-mentioned sheet extracting process. In the figure, 101 is a base, 102 is a suction head, 103 is a punching blade, F is a carrier film, and S is a film. Is a ceramic green sheet.

The base 101 has a flat upper surface larger than the width of the carrier film F, and a large number of suction holes 101 are formed on the upper surface.
a. These suction holes 101a are connected to a negative pressure source (not shown), and suction-hold the carrier film F by causing a suction action as necessary.

The suction head 102 has a flat lower surface facing parallel to the upper surface of the base 101, and a large number of suction holes 1 are formed on the lower surface.
02a. These suction holes 102a are connected to a negative pressure source (not shown), and attract and hold the punched ceramic green sheet Sa by generating a suction action as necessary. The suction head 102 is a base 10.
It is possible to move up and down in a direction perpendicular to the upper surface of No. 1 and move horizontally to the sheet stacking position.

The punching blade 103 is configured by arranging a flat blade having a sharp cutting edge on the four side surfaces of the suction head 102 without a gap, or a square tubular blade having the same cutting edge around the suction head 102. The blade edge projects downward from the lower surface of the suction head 102. Incidentally, the protruding amount of the blade edge is set to be slightly larger than the thickness of the dried ceramic green sheet S.

[0012]

In the above conventional method,
When obtaining a ceramic green sheet of a predetermined size,
As shown in FIG. 1, since the punching blade 103 bites into the ceramic green sheet S to such a depth that the cutting edge thereof slightly enters the surface of the carrier film F, FIG.
As shown in FIG. 3, a scar Fa due to the cutting edge is formed on the surface of the carrier film F. Such a carrier film F cannot be reused even if the sheet debris is removed, and since it is normally disposed of only once, the cost is heavy. This problem may occur not only in the case of the multilayer capacitor, but also in the case of performing similar sheet extraction in other multilayer electronic components such as a multilayer inductor and a thick film multilayer substrate.

The present invention has been made in view of the above problems. An object of the present invention is to make it possible to remove a sheet without damaging the carrier film, thereby making it possible to reuse the carrier film and to reduce the manufacturing cost. It is an object of the present invention to provide a method for manufacturing a multilayer electronic component that can contribute to reduction of power consumption.

[0014]

To achieve the above object, the present invention provides a ceramic green sheet formed on the surface of a carrier film in a method for producing a laminated electronic component in which ceramic green sheets having predetermined dimensions are stacked. The step of peeling the carrier film on the back surface side of the ceramic green sheet from the ceramic green sheet while the surface of the ceramic green sheet is suction-held by the suction head, and the suction head holding the ceramic green sheet by suction is moved to the punching stage, And the punching stage are brought relatively close to each other to sandwich the ceramic green sheet therebetween, and the punching blade is bited into the ceramic green sheet sandwiched between the suction head and the punching stage. A punch for punching a ceramic green sheet to a specified size. And-up, the punched ceramic green sheets provided with the steps of withdrawing adsorbed and held by one of the suction head and the punching stage, and its main feature that.

According to the method of manufacturing a laminated electronic component of the present invention, the carrier film on the back surface side of the ceramic green sheet is peeled off while the ceramic green sheet is suction-held by the suction head, and the ceramic green sheet is then punched. And then sandwiched between the suction head and the punching stage, and the ceramic green sheet is punched to a predetermined size by a punching blade, and the punched ceramic green sheet of a predetermined size is sheeted by the suction head or the punching stage. Since it is pulled out from the mother body, the surface of the carrier film is not scratched as in the conventional case during the sheet punching process, and the carrier film peeled off before the sheet punching can be reused.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. The present invention can be applied to various laminated electronic components such as a laminated capacitor, a laminated inductor, and a thick film multilayer substrate. Here, an example in which the present invention is applied to a laminated capacitor as in the conventional case will be described.

1 to 5 show a first embodiment of the present invention, in which 1 is a suction stage, 2 is a suction head, 3 is a punching blade, 4 is a punching stage, and 5 is a stage. A connecting plate, 6 is a film drawing roll, F is a carrier film, and S is a ceramic green sheet.

The suction stage 1 has a rectangular flat upper surface (film suction surface) 1 larger than the width of the carrier film F.
The film suction surface 1a has a large number of suction holes 1b. These suction holes 1b are connected to a negative pressure source (not shown), and the carrier film F conveyed onto the suction stage 1 is suction-held on the film suction surface 1a by the suction action generated in the suction holes 1b.

The suction head 2 has a rectangular flat lower surface (sheet suction surface) 2a facing in parallel with the film suction surface 1a of the suction stage 1, and has a large number of suction holes 2b in the sheet suction surface 2a. There is. These suction holes 2b are connected to a negative pressure source (not shown), and the ceramic green sheet S and the punched-out ceramic green sheet Sa are sucked by the suction action generated in the suction holes 2b.
It is adsorbed and held by a.

The punching blade 3 is constructed by arranging a flat blade having a sharp blade edge on the four side surfaces of the suction head 2 without any gap, or a square cylindrical blade having the same blade edge around the suction head 2. The punching blade 3 is supported by the blade supporting plate 3a and can move up and down integrally with the blade supporting plate 3a. The blade support plate 3a is biased upward by a spring 3b, and the amount of lowering of the punching blade 3 is defined by the gap between the blade support plate 3a and the suction head 2 here.

The punching stage 4 has a rectangular flat upper surface (sheet suction surface) 4a larger than the width of the ceramic green sheet S, and has a large number of suction holes 4b around the sheet suction surface 4a. . These suction holes 4b are connected to a negative pressure source (not shown), and the sheet debris after punching is sucked and held on the sheet suction surface 4a by the suction action generated in the suction holes 4b.

The stage connecting plate 5 connects the suction stage 1 and the punching stage 4 with a predetermined distance therebetween, and the stage connecting plate 5 is provided with a roll 6 for pulling the carrier film F downward. Are spaced apart. Both rolls 6 have an axial length larger than the width of the carrier film F, and guide the carrier film F downward according to the operation of a film winder (not shown). In the example shown in the drawing, when the suction head 2 that suction-holds the ceramic green sheet S is moved onto the punching stage 4, the back surface of the ceramic green sheet S is prevented from coming into contact with the punching stage 4 and being damaged. A proper gap is formed.

When manufacturing a multilayer capacitor, first,
A ceramic slurry is applied to the surface of a carrier film F made of PET or the like by a coating method using a doctor blade, a reverse roll coater or the like with a uniform thickness, and this is dried to form a ceramic green sheet S (Fig. 1). The ceramic green sheet S adheres to the surface of the carrier film F with a peelable adhesive force, and is capable of moving integrally with the carrier film F in the same attached state.

Next, a conductor paste is printed in a predetermined pattern on the surface of the ceramic green sheet S by screen printing or the like, and this is dried to form a conductor layer (not shown) to be an internal electrode.

Next, as shown in FIG. 1, the carrier film F having the ceramic green sheet S formed thereon is conveyed onto the suction stage 1 and stopped at a predetermined position.
At the beginning of conveyance, the end portion of the carrier film F is peeled off from the ceramic green sheet S and set on a film winder (not shown) via the roll 6, and
The end portion of the ceramic green sheet S is pulled out toward the punching stage 4 and set on a sheet winder (not shown), and the carrier film F and the ceramic green sheet S are wound in accordance with the conveyance of the carrier film F. Then, a suction action is generated in the suction hole 1b to suck and hold the carrier film F after stopping on the film suction surface 1a.

Next, as shown in FIG. 2, the suction head 2 is lowered toward the suction stage 1 by a predetermined stroke,
The sheet suction surface 2a is brought into close contact with a predetermined position on the surface of the ceramic green sheet S. Then, the ceramic green sheet S after being brought into close contact by causing a suction action in the suction hole 2b
Are held by suction on the sheet suction surface 2b.

Next, as shown in FIG. 3, while moving the suction head 2 for sucking and holding the ceramic green sheet S to the right in the figure and moving it to the punching stage 4, the movement of the ceramic green sheet S at this time is performed. The carrier film F corresponding to the amount is wound around the roll 6 and peeled from the back surface of the ceramic green sheet S. Of course, the same operation can be performed by winding the carrier film F while moving the suction stage 1 and the punching stage 4 to the left in the drawing.

Next, as shown in FIG. 4, the suction head 2 for sucking and holding the ceramic green sheet S is vertically lowered toward the punching stage 4 by a predetermined stroke, and is brought to the sheet suction surface 4a of the punching stage 4. The back surface of the ceramic green sheet S is brought into close contact, and the ceramic green sheet S is sandwiched between the suction head 2 and the punching stage 4. Then, a suction action is generated in the suction holes 4b to suck and hold the ceramic green sheet S after the close contact with the sheet suction surface 4a.

Next, as shown in FIG. 4, the punching blade 3 is vertically lowered toward the sheet suction surface 4a by a predetermined stroke by using the blade support plate 3a, so that the suction head 2 and the punching stage 4 are separated from each other. The cutting edge of the punching blade 3 is made to bite into the ceramic green sheet S sandwiched between. Since the amount of biting of the cutting edge of the punching blade 3 is set according to the thickness of the ceramic green sheet S, the biting of the punching blade 3 punches the ceramic green sheet S in a predetermined rectangular dimension.

Next, as shown in FIG. 5, the punching blade 3 is returned to the original position by the spring, and the suction head 2 for sucking and holding the punched ceramic green sheet Sa is lifted by a predetermined stroke to punch it. The ceramic green sheets Sa are taken out from the sheet matrix S, conveyed by the suction head 2 to the stacking position, and stacked while releasing suction holding.

The above procedure is repeated until a predetermined number of ceramic green sheets Sa having a predetermined size are stacked, and after stacking, this is pressed to obtain a laminate.

Next, the laminated product is cut into a size corresponding to each individual component and fired, and a conductor paste is applied to both ends of the fired chip and baked to form an external electrode. A solder plating layer or the like is formed on the surface.

If the sheet remains adhered to the sheet suction surface 4a even after releasing the sheet suction and hold in the punching stage 4 after punching the sheet, air or the like may be blown out from the suction hole 4b. Then, this can be easily eliminated, and the subsequent winding of the sheet debris can be performed smoothly.

As described above, according to the above-mentioned manufacturing method, the carrier film F on the back surface side of the ceramic green sheet S is peeled off while the ceramic green sheet S is suction-held by the suction head 2, and then the ceramic green sheet S is punched out. 4 and conveys the ceramic green sheet S between the suction head 2 and the punching stage 4 and punches the ceramic green sheet S to a predetermined size by a punching blade 3 to suck the punched ceramic green sheet Sa of a predetermined size. Since the head 2 pulls out from the sheet matrix S,
In the sheet punching process, the surface of the carrier film F is not scratched as in the conventional case, and the carrier film F peeled off before the sheet punching can be reused to reduce the manufacturing cost.

6 to 10 show a second embodiment of the present invention. In the drawings, 11 is a suction stage, 12 is a suction head, 13 is a roll support plate, 14 is a film drawing roll, and 15 is a punching roll. Punching stage, 16 is punching blade, F
Is a carrier film and S is a ceramic green sheet.

The suction stage 11 has a carrier film F.
Rectangular flat upper surface (film suction surface) larger than the width of
11a, and the film suction surface 11a has a large number of suction holes 11b. These suction holes 11b are connected to a negative pressure source (not shown), and the carrier film F conveyed onto the suction stage 11 is sucked and held on the film suction surface 11a by the suction action generated in the suction holes 11b.

The suction head 12 is the suction stage 11 described above.
Is provided with a rectangular flat lower surface (sheet suction surface) 12a facing in parallel with the film suction surface 11a and having a width larger than the width of the ceramic green sheet S.
A has a large number of suction holes 12b. These suction holes 1
Reference numeral 2b is connected to a negative pressure source (not shown), and the ceramic green sheet S or the sheet debris after punching is adsorbed and held on the sheet adsorbing surface 12a by the suction action generated in the suction holes 12b.

The roll supporting plate 13 is provided so as to project on the punching stage side of the suction stage 11. On the roll supporting plate 13, rolls 14 for pulling out the carrier film F downward are vertically spaced. It is arranged. Both rolls 14 have an axial length larger than the width of the carrier film F, and guide the carrier film F downward according to the operation of a film winder (not shown).

The punching stage 15 has a rectangular flat upper surface (sheet suction surface) 15a, and the sheet suction surface 15a.
Has a large number of suction holes 15b. These suction holes 15
b is connected to a negative pressure source (not shown), and the punched ceramic green sheet Sa is adsorbed and held on the sheet adsorbing surface 15a by the adsorbing action generated in the adsorbing holes 15b. By the way, the sheet suction holding force on the punching stage 15 side is set to be stronger than that on the suction head 12 side in order to accurately perform sheet removal by the punching stage 15.

As the punching blade 16, a flat blade having a sharp cutting edge is arranged on the four side surfaces of the punching stage 15 without any gap, or a square tubular blade having the same cutting edge is arranged around the punching stage 15. It is configured. The punching blade 16 has its blade edge protruding upward from the sheet suction surface 15a, and the blade edge protrusion amount corresponds to the thickness of the ceramic green sheet S.

When manufacturing a multilayer capacitor, first,
A ceramic slurry is applied to the surface of a carrier film F made of PET or the like by a coating method using a doctor blade, a reverse roll coater or the like with a uniform thickness, and this is dried to form a ceramic green sheet S (Fig. 6). The ceramic green sheet S adheres to the surface of the carrier film F with a peelable adhesive force, and is capable of moving integrally with the carrier film F in the same attached state.

Next, a conductor paste is printed in a predetermined pattern on the surface of the ceramic green sheet S by screen printing or the like, and the conductor paste is dried to form a conductor layer (not shown) to be an internal electrode.

Next, as shown in FIG. 6, the carrier film F on which the ceramic green sheet S is formed is conveyed onto the suction stage 11 and stopped at a predetermined position.
At the beginning of conveyance, the end of the carrier film F is peeled from the ceramic green sheet S and set on a film winder (not shown) via the roll 14, and the end of the ceramic green sheet S is punched out. The carrier film F is pulled out in the direction of the stage 15 and set in a sheet winder (not shown), and the carrier film F and the ceramic green sheet S are wound in accordance with the conveyance of the carrier film F. Then, the suction action is generated in the suction holes 11b, and the stopped carrier film F is suction-held on the film suction surface 11a.

Next, as shown in FIG. 7, the suction head 12
Is lowered toward the suction stage 11 by a predetermined stroke to bring the sheet suction surface 12a into close contact with a predetermined position on the surface of the ceramic green sheet S. And the suction hole 12
The ceramic green sheet S after the close contact is sucked and held by the sheet suction surface 12b.

Next, as shown in FIG. 8, while moving the suction head 12 for sucking and holding the ceramic green sheet S to the right in the figure and moving it to the punching stage 15, the movement of the ceramic green sheet S at this time is performed. The carrier film F corresponding to the amount is wound around the roll 14 and peeled from the back surface of the ceramic green sheet S. Of course, the same operation can be performed by winding the carrier film F while moving the suction stage 11 and the punching stage 15 to the left in the figure.

Next, as shown in FIG. 9, the punching stage 15 is vertically raised by a predetermined stroke toward the suction head 12 which holds the ceramic green sheet S by suction.
The sheet suction surface 15a of the punching stage 15 is brought into close contact with the back surface of the ceramic green sheet S, and the ceramic green sheet S is sandwiched between the suction head 2 and the punching stage 15. Then, a suction action is generated in the suction holes 15b to suck and hold the ceramic green sheet S after the adhesion on the sheet suction surface 15a.

In the above process of raising the punching stage 15 toward the suction head 12 by a predetermined stroke, as shown in FIG. 9, with respect to the ceramic green sheet S sandwiched between the suction head 12 and the punching stage 15. The punching blade 16 bites in, and thereby the ceramic green sheet S is punched into a rectangular shape with a predetermined size.

Next, as shown in FIG. 10, the punching stage 15 for sucking and holding the punched ceramic green sheet Sa is returned to the lowered position, and the punched ceramic green sheet Sa is pulled out from the sheet matrix S, and this is removed. The sheet is conveyed to the stacking position by the punching stage 15 and stacked while releasing the suction and holding.

The above procedure is repeated until a predetermined number of ceramic green sheets Sa having a predetermined size are stacked, and after stacking, this is pressed to obtain a laminate.

Next, the laminated product is cut into a size corresponding to each component, and the product is fired. A conductor paste is applied to both ends of the fired chip and baked to form an external electrode. A solder plating layer or the like is formed on the surface.

After punching the sheet, the suction head 1
In the case where the sheet debris is stuck to the sheet suction surface 12a even after the sheet suction holding in 2 is released, it is possible to easily eliminate this by blowing air or the like from the suction hole 12b in reverse. You can smoothly wind up the sheet debris.

As described above, according to the manufacturing method described above, the carrier film F on the back surface side of the ceramic green sheet S is peeled off while the ceramic green sheet S is suction-held by the suction head 12, and then the ceramic green sheet S is punched out. 15 and the suction head 12 and the punching stage 15
And the ceramic green sheet S is punched to a predetermined size by the punching blade 16, and the punched ceramic green sheet Sa having a predetermined size is pulled out from the sheet matrix S by the punching stage 15. The carrier film F peeled off before the sheet punching without causing scratches on the surface of the carrier film F during the sheet punching as in the prior art.
Can be reused to reduce the manufacturing cost.

[0053]

As described above in detail, according to the present invention, the carrier film on the back side of the ceramic green sheet is peeled off while the ceramic green sheet is sucked and held by the suction head, and the ceramic green sheet is punched out. It is conveyed to the upper side and sandwiched between the suction head and the punching stage, and the ceramic green sheet is punched to a predetermined size by a punching blade, and the punched ceramic green sheet of a predetermined size is sucked by the suction head or the punching stage. Since it is designed to be pulled out from the base sheet,
In the sheet punching process, the surface of the carrier film is not scratched as in the conventional case, and the carrier film peeled off before the sheet punching can be reused to reduce the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a first embodiment of the present invention.

FIG. 2 is a process chart showing the first embodiment of the present invention.

FIG. 3 is a process chart showing the first embodiment of the present invention.

FIG. 4 is a process chart showing the first embodiment of the present invention.

FIG. 5 is a process chart showing the first embodiment of the present invention.

FIG. 6 is a process chart showing a second embodiment of the present invention.

FIG. 7 is a process chart showing a second embodiment of the present invention.

FIG. 8 is a process chart showing a second embodiment of the present invention.

FIG. 9 is a process chart showing a second embodiment of the present invention.

FIG. 10 is a process drawing showing the second embodiment of the present invention.

FIG. 11 is a diagram showing a conventional sheet extracting procedure.

FIG. 12 is an explanatory diagram of conventional problems.

[Explanation of symbols]

F ... Carrier film, S ... Ceramic green sheet, Sa ... Punched ceramic green sheet, 1
... Suction stage, 2 ... Suction head, 3 ... Punching blade, 4 ... Punching stage, 11 ... Suction stage, 12 ... Suction head,
15 ... Punching stage, 16 ... Punching blade.

Claims (3)

[Claims] 1. A method for manufacturing a laminated electronic component, wherein ceramic green sheets of a predetermined size are stacked, wherein the back surface of the ceramic green sheet is held while the surface of the ceramic green sheet formed on the surface of the carrier film is suction-held by a suction head. The step of peeling the carrier film on the side of the ceramic green sheet from the ceramic green sheet, and moving the suction head that holds the ceramic green sheet to the punching stage so that the suction head and the punching stage are relatively close to each other. The step of sandwiching the ceramic green sheet, the step of punching the ceramic green sheet into a predetermined size by cutting the ceramic green sheet sandwiched between the suction head and the punching stage with the punching blade, and the punched ceramic Green sheet Method of manufacturing a multilayer electronic component, characterized equipped with a step of withdrawing by suction held by one of the suction head and the punching stage, the. 2. The punching blade is provided on the suction head side, and the ceramic green sheet is punched by a relative approach between the suction head and the punching stage. Manufacturing method of multilayer electronic component of. 3. The punching blade is provided on the punching stage side, and the ceramic green sheet is punched by the relative approach between the suction head and the punching stage. A method for manufacturing the described laminated electronic component.