TW200939364A - Method and apparatus for cutting substrate - Google Patents

Abstract

Provided is an apparatus for cutting a substrate capable of improving the productivity of a product (a package (5)) formed by cutting a shaped substrate (1) along a cutting line (4). An apparatus for cutting a substrate (9) comprises two cutting tables (17 (17a and 17b)). At a substrate placing position (24), the shaped substrate (1) placed on one cutting table (17a) is aligned by an alignment mechanism (27) thereby setting the cutting line (4). (Substantially) simultaneously with this, moreover, the shaped substrate (1) placed on the other cutting table (17b) is cut along the cutting line (4) by a first cutting mechanism (28) (an integral cut inspecting means (62)) and a second cutting mechanism (29) thereby forming a cutting groove (kerf) (58). At the same time, the cutting groove (58) is inspected (kerf-checked) by a kerf check mechanism (59) (the integral cut inspecting means (62)).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate in which a plurality of electronic components such as ic and a plurality of electronic components are packaged together by a resin material, and the formed substrate is cut into individual components (slices). Improvement of the breaking method and its device. [Prior Art] In the past, by using a cutting device using a single-substrate substrate, a cutting mechanism (cutting mechanism) such as a blade (a circular cutting blade) cuts a desired portion of the formed substrate. 'To form each component, the cutting is carried out in the following procedure. In other words, the substrate 1 is first fixed to the mounting surface of the cutting table (the rotating table for cutting) in a state where the spherical surface 1a is on the substrate mounting position of the device, and is fixed and fixed. The cutting line is set on the spherical surface (substrate surface) la of the formed substrate 1 (see Figure 6 (1) for the formed substrate 1 and Figure 6 (2) for the module 5). At this time, the desired cutting line 4 is set by detecting the alignment mark (check mark) provided on the spherical surface u of the formed substrate i by the detecting means. Hereinafter, the debt measurement is set and set to the alignment setting. Next, the cutting table on which the molded substrate 1 is placed is moved to the substrate cutting position, and the cooling water is sprayed on the cutting portion at the substrate cutting position, and the cutting mechanism is set along the cutting substrate 1 to be cut. The formed substrate 1 is cut by a wire to form a cut-off substrate (assembly assembly), that is, each component 5 (1 c). At this time, a cutting groove (a cutting groove 58 having a desired width) having a groove width of 200939364 is formed by a cutting mechanism at a position of the cutting line 4 of the substrate. Next, 'the cutting table on which the cut substrate 5 (lc) is placed is moved back to the substrate mounting position ', and the cut-off substrate 5 (lc) is cut by the _ mechanism check (cutting groove inspection) The groove width of the groove (the width of the cutting groove 58) is conventionally applied to the substrate mounting position of the cutting device of the substrate, and the alignment setting of the front 逑 alignment mark and the cutting of the cutting groove μ are performed by one detecting mechanism. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-168697. SUMMARY OF THE INVENTION In recent years, the problem of the substrate cutting device is to improve the yield of products (components) and to improve the products per unit time (components). The production quantity is used to cut the formed substrate with good efficiency. That is, it is required to improve the productivity of the product (assembly) cut from the formed substrate. φ However, as described above, the conventional cutting device is Since the positioning position is used for both the alignment setting and the cutting groove collation, the formed substrate cannot be cut with good efficiency to form each component, and there is a problem that the productivity of the product (assembly) cannot be improved. A method for cutting a substrate and an apparatus for improving the productivity of a product (component) are provided. In order to solve the above-described technical problems, a method for cutting a substrate according to the present invention is to use a cutting device for a substrate, first on a substrate of the device. The mounting position places the formed substrate on the cutting table and moves to the substrate cutting position of the device 5 200939364, and secondly, the formed substrate is placed in the cutting table under the substrate cutting position to cut The cutting mechanism is cut to form an assembly, wherein: first, at the substrate mounting position, the formed substrate is set by alignment with an alignment mechanism, and a cutting line is set on the formed substrate; In the cutting position, the cutting groove collating mechanism checks the cutting groove formed by cutting the formed substrate along the cutting line by the cutting mechanism. Further, in order to solve the technical problem, the cutting method of the substrate of the present invention is used. The substrate cutting device 'firstly places the formed substrate on the cutting table at the substrate mounting position of the device and moves to the substrate cutting position of the device' followed by the substrate cutting The breaking position is placed in the cutting table and cut by a cutting mechanism to form an assembly, characterized in that the following steps are performed: at the substrate mounting position, by the alignment mechanism Aligning the set substrate to set a cutting line on the formed substrate; and cutting the formed substrate by the cutting mechanism along the cutting line of the formed substrate at the substrate cutting position a step of forming a cutting groove corresponding to the cutting line in the formed substrate; and a step of inspecting the cutting groove formed in the formed substrate by the cutting groove collating mechanism at the cutting position of the substrate; cutting the cutting line In the step of 'cutting the cutting mechanism along the cutting line with respect to the cutting mechanism, the cutting substrate is cut along the cutting line; during the inspection step of the cutting groove, 'by cutting the cutting groove The mechanism is moved relative to the cutting table in a direction opposite to the cutting direction to inspect the cutting groove by the cutting 200939364 groove collating mechanism. In order to solve the technical problem, the method for cutting a substrate according to the present invention is to use a cutting device including a substrate of two cutting tables, and to separate the two cutting tables from the substrate mounting position of the device. Moving to the substrate cutting position, firstly, the formed substrate is placed on the cutting table at the substrate mounting position, and the formed substrate is placed on the cutting table next to the substrate cutting position. In the state of the stage, the module is cut by the cutting mechanism, and the assembly is formed by first arranging the formed substrate with the alignment mechanism at the substrate placement position. The formed substrate is provided with a cutting line. Next, at the substrate cutting position, a step of inspecting the cutting groove formed by the cutting mechanism by the cutting groove collating mechanism is performed. Further, in order to solve the above-described problems, the method for cutting a substrate according to the present invention is characterized in that, when the cutting mechanism is used to cut the formed tantalum substrates placed on the two cutting tables, the cutting is performed. The table rotates the desired angle by the eccentric position of the cutting table as the center position of the rotation. In order to solve the above problems, the substrate cutting apparatus of the present invention includes: a cutting mechanism for cutting a desired portion of the formed substrate; a cutting table for placing the formed substrate; and The cutting table reciprocates between the substrate mounting position and the substrate cutting position; and is characterized in that: the substrate mounting position alignment setting is placed on the cutting table 7 200939364 An alignment mechanism for forming the substrate; and a cutting groove collation mechanism for inspecting the cutting groove formed by cutting the formed substrate by the cutting mechanism at the substrate cutting position. Further, in order to solve the technical problem, the substrate cutting device according to the present invention is characterized in that a cutting and inspection means for integrating the cutting mechanism and the cutting groove collation mechanism is provided.

Further, in order to solve the technical problem, the substrate cutting apparatus of the present invention is characterized in that: an integrated cutting inspection means for integrating the cutting mechanism and the cutting groove collation mechanism is provided; The cutting means of the inspection means is disposed along the cutting line collating mechanism and the cutting line of the formed substrate cut along the cutting means. Moreover, in order to solve the technical problem, the substrate cutting apparatus of the present invention is characterized in that:

Two cutting tables were set. Further, in order to solve the above-described problems, a substrate cutting apparatus according to the present invention is characterized in that a rotating mechanism is provided for rotating the cutting table at a desired position with its eccentric position as a center position of rotation. Further, in order to solve the above-described problems, the substrate cutting apparatus according to the present invention is characterized in that: a scrap material removing mechanism is provided, which is formed by cutting the two fluid mixture of gas and water formed by the cutting mechanism. Remove the surface of the attached component and spray the shredded material that is empty on the surface of the component. The present invention is a method of providing a cutting table. In addition to the productivity of the product (component), the two-stage (2 ❹ 纟 invention 'cutting device for the substrate using the two-stage method; the substrate mounting position' is placed on one of the two cutting tables The alignment marks of the formed substrate are aligned, and the width of the cutting groove formed on the formed substrate placed on the other cutting table is checked (substantially) at the substrate cutting position, and (substantially) At the same time, the alignment setting and the cutting groove collation are performed to increase the number of products (components) produced per unit time. The 'present invention' can further be provided with a cleaning portion disposed between the substrate cutting position and the substrate mounting position. The substrate (each component) that has been cut to the cutting groove is cleaned. That is, when the formed substrate is cut by one cutting table, the formed substrate can be aligned at the same time, or the cut substrate can be cleaned. In addition, when the formed substrate is aligned by one cutting table, the formed substrate can be cut at the same time, or the cut components can be cleaned. a cutting table for good results The molded substrate 0 is cut. Therefore, the present invention can efficiently cut the formed substrate and improve the productivity of the product (assembly). Further, the present invention uses the cutting mechanism and the cutting groove collation mechanism (cutting groove collation mechanism). The configuration of the integrated cutting inspection means formed by the integration 0 9 200939364, that is, the "invention" in the substrate cutting position, first, the integrated cutting inspection means (cutting mechanism) is relatively moved in the cutting direction to cut The cutting mechanism cuts the formed substrate along one of the cutting lines of the formed substrate, and forms a cutting groove corresponding to the cutting line, and immediately performs an integrated cutting inspection means (cutting groove collation mechanism) along the cutting line The direction opposite to the direction (checking direction) is relatively moved to check the width of the cutting groove. (It is also known that the cutting position is at the substrate cutting position, and only one cutting groove corresponding to the cutting line is formed by the cutting mechanism). According to the present invention, since the configuration of the width of the cutting groove is immediately determined after forming one cutting groove, the time for the relative movement of the cutting mechanism can be reduced. Therefore, the present invention, as shown in the conventional example, can improve the product by shortening the time for cutting the formed substrate as described above, as compared with the configuration of inspecting the width of all the cutting grooves after forming all the cutting grooves. Productivity of (Component) As described above, according to the present invention, it is possible to provide an excellent effect of providing a method of cutting a substrate and an apparatus thereof which can improve the productivity of a product (assembly). [Embodiment] This embodiment will be described in detail using an embodiment. Fig. 1 and Fig. 2 show a cutting device for a substrate according to the present invention. Fig. 3 (1) and Fig. 3 (2) are integrated with a cutting device of the present invention and a cutting groove collating mechanism (cutting groove inspection mechanism). Fig. 4 is an integrated cutting inspection means (cutting groove collation mechanism) of the present invention. Fig. 5 (1), Fig. 5 (2), and Fig. 5 (3) show the __ of the present invention. Body cutting test 200939364 The cutting state and the cutting groove check state. Fig. 6 (1) shows a molded substrate (cut substrate) used in the present invention, and Fig. 6 (2) shows a module cut by the cutting device of the substrate of the present invention. (Formed substrate and module used in the present invention) Further, as shown in Fig. 6 (1), a spherical surface (substrate surface) la is provided as a surface on the formed substrate 1, and a surface as the opposite side is provided. Die face ib. Further, in the molded substrate 1, the substrate 2 and the resin molded body 3 provided on the mold surface (resin surface) 11 side of the formed substrate 1 (substrate 2) are provided, and the formed substrate 1 (substrate 2) is formed. The cutting line 4 is set on the spherical surface (substrate surface) ia side. Further, by cutting the formed substrate 1 along the cutting line 4, a cutting groove (a cutting groove having a desired groove width) having a desired width corresponding to the cutting line 4 is formed on the spherical surface la of the formed substrate 1. Further, as shown in Fig. 6 (2), the module 5 which is formed by cutting the cutting line 4 of the formed substrate 1 is separated, and the spherical surface 5a and the surface opposite thereto are provided in the same manner as the formed substrate 1. Face 5b. Further, the module 5 is provided with a substrate portion 6 and a resin portion 7 provided on the mold surface 5b side of the module 5 (substrate portion 6). Further, the ball electrode 8 is formed on the spherical surface 5a (la) side of the substrate portion 6 (substrate 2). Further, in Fig. 6 (1), the assembly of the respective components 5 of the cut substrate lc which is cut and separated from the formed substrate 1 (the appearance is the same size as the formed substrate )) is denoted by the symbol 5 (1 c). ) said. Therefore, as will be described later, each of the modules 5 (ic) can be formed by cutting the formed substrate 1 by using the substrate cutting device (9) of the present invention. Further, in Fig. 6 (1), 4a corresponds to a rectangular shape in a parallel state. 11 200939364 A cutting line in the longitudinal direction of the long side of the substrate 1 (the cutting portion in the i-th direction is short in parallel) The cutting line in the short-side direction of the side (the cutting portion in the second direction). The cutting line (4) for cutting the formed substrate 1 can be set in the direction of the cutting line (cutting portion). In any direction, it can be set in various directions (for example, the first direction or the second direction). (Configuration of the cutting device of the substrate of the present invention) That is, as shown in Fig. 1, the cutting device 9 of the substrate of the present invention a substrate loading unit A for loading the formed substrate 1 and a substrate cutting unit B for cutting (separating) the formed substrate 移 transferred from the substrate loading unit A into components 5 (cut off) The substrate 1 c); the component inspection unit ^ performs visual inspection on each component 5 cut by the substrate cutting unit B to select a good product and a defective product; and the component housing unit D, which will check the component selected in the component inspection unit c Depending on the good product and the defective product, it is stored in the tray. Therefore, it will be loaded first. The formed substrate 1 of the substrate loading unit A is transferred to the substrate cutting unit B to be cut into the respective components 5, and secondly, the cut components 5 are inspected and selected by the component inspection unit c, and the assembly 5 is assembled into components. The storage unit D is housed separately from the defective product. Further, in the substrate cutting device 9 of the present invention, the units A, B, C, and D can be detachably connected to each other in this order. In the substrate cutting device 9 of the present invention, for example, each of the units A, B, C, and D can be detachably connected by the connecting member 1. The substrate cutting device 9' 9a shown in Fig. 1 is the front side of the device. 9b is behind the device. 12 200939364 (The present invention <Configuration of the cutting unit of the module) P As shown in Fig. 2, the cutting unit AB is provided on the substrate, and the arrangement mechanism 4 11 ' is used to form the substrate i The substrate is cut in the desired direction; and the cutting mechanism portion 12 of the substrate cuts the formed substrate 1. Therefore, the formed substrate 1 supplied from the loading unit A side of the substrate is first arranged in the arrangement mechanism of the substrate. Providing a cutting mechanism 12 fixed to the substrate in a desired direction, The substrate cutting unit 1 is cut by the cutting mechanism unit 12 of the substrate. The cutting device 9 (the cutting unit of the substrate) of the substrate of the present invention is a double (two cutting table 17) system. (Configuration of the arranging mechanism portion of the substrate) That is, as shown in FIG. 2, the substrate supply table 13 is disposed on the arranging mechanism portion of the substrate, and the formed substrate 供应 is supplied from the loading unit of the substrate 及: and the rotation of the substrate The arranging means 14 supplies the cardged substrate 1 to the formed substrate 1 of the substrate supply table 13 and rotates at a desired angle (for example, 9 degrees) to form a formed substrate 所 in the desired φ direction, and supplies the substrate to the substrate. Therefore, the formed substrate 丨 is first fixed and fixed to the substrate supply stage 13 from the loading unit A of the substrate, and secondly, the formed substrate is slid from the substrate supply table 13 by the substrate rotation means 14 Further, the desired angle is rotated, and the formed substrate 1 is aligned in a desired direction and supplied to the cutting mechanism portion 12 side of the substrate. (Configuration of the cutting mechanism portion of the substrate) As shown in Fig. 2, in the cutting mechanism portion 12 of the substrate, two groups (two lines) are arranged as the cutting of the substrate (the cutting of the substrate). Disconnect 13 200939364 Set the production line of the production line in 9 (the cutting unit b of the substrate). Further, the two sets of slicing lines are arranged in the γ direction in a parallel state, and their arrangement positions are substantially identical to the moving areas 26 of the cutting table 17 which will be described later. In the example shown in Fig. 2, the sliced production line (the moving area 26 of the cutting table 17) of the two groups is disposed on the left side of the i-th slice production line (the moving area 26a of the i-th cutting table 17a) In the group, the group of the second slicing line (the moving area 26b of the second cutting table i7b) is placed on the right side.

Further, in the cutting mechanism unit 12 of the substrate, the mounting means 15 for the substrate and the substrate mounting means 15 are provided in each of the groups of the second and second slicing lines (moving regions 26 of the cutting table 17). The reciprocating means 16 is guided by reciprocating movement in the gamma direction. Further, in the cutting mechanism portion 12 of the substrate, the substrate mounting position 24 is provided at the substrate cutting position 25, and the substrate can be placed in the cutting section 15 by the re-moving means. 17) Reciprocating in the gamma direction. In the first slicing line 26a, the first substrate can be placed by the i-th reciprocating section 16a.

It is reciprocated between the substrate placement position 24 and the substrate cutting position in the Kushiro No. 15a (the first cutting table 17a). Further, in the second slicing line 2, the second substrate can be placed on the second substrate to move the hand A on the board setting table 17b) to reciprocate the substrate mounting position 24 and the substrate cutting position 25 between. Further, regarding the constituent members of the substrate cutting mechanism unit 12 (26), the first production line (moving area: word. The first system is a), and the second system is Π (cutting table) 14 200939364, that is, As shown in FIG. 2, the substrate mounting means 15 (the second substrate mounting means 15a and the second substrate mounting means 15b) are provided with a cutting table (mounting rotary table for cutting) 17 (17a, 17b). This is to place the formed substrate 1 in a state in which the die surface ib is below or in a state in which the substrate surface 1 a is on the upper surface. Further, as shown in Fig. 4, the cutting table 17 (the first cutting table 17a) The second cutting table 17b) is provided with a suction hole 51 (the first suction hole 51a and the second suction hole 51b) for adsorbing and fixing the formed substrate 1 placed on the cutting table i7 (i7a, 17b); The vacuum pumping mechanism 52 (the first vacuum pumping machine structure 52a and the second vacuum pumping mechanism 52b), such as a vacuum pump, is shown in Fig. 4, and is placed on the mounting surface 20 of the cutting table 17 (first The cutting table mounting surface 20a and the second cutting table mounting surface 20b) are provided with a cutting mechanism (the first cutting mechanism 28 and the second cutting mechanism 29) corresponding to a blade (rotation cutting blade) to be described later. Cutting table groove 53 (first cut) In addition, as shown in FIG. 4, the mounting surface 20 of the cutting table (the first cutting table mounting surface 20a and the second cutting table mounting surface) are provided as shown in FIG. The position of the cutting groove 53 (5 3a, 53b) ® of 20b) coincides with the cutting line 4 (4a) set on the formed substrate 1 (supplied and fixed to the cutting table mounting surface 20 (20a, 20b)) 4b) Therefore, first, the formed substrate 1 which has been aligned by the rotary alignment means 14 is cut off at the cutting line 4 (4a, 4b) of the formed substrate 1 ( The cutting table mounting surface 209 (20a, 20b) fixed to the cutting table 17 (17a, 17b) is supplied in the state of the position 53a, 53b), and secondly by the vacuum drawing mechanism 52 (5 2 & 5215) The forced suction air 51 is forcedly sucked from the suction holes 51 (51 & 51, 51) to be vacuum-drawn, so that the formed substrate 1 can be adsorbed and fixed to the cutting table 17 (17a, 17b) by the die surface 1 side 15 200939364 thereof. Cutting table mounting surface 2〇 (2〇a 20b). (Eccentric rotation of the cutting table) Further, a rotating mechanism (not shown) is provided on the lower end side of the cutting table 17 (17a' 17b). Make the cutting table 17 (17a, 17b) to set the shi The eccentric position 21 (2la, 2lb) of the mounting surface 20 (20a, 20b) of the table 17 (17a, 17b) is a center of rotation, and is rotated at an intended angle (for example, 9 degrees) (eccentric rotation). When the cutting table 17 (17a, 17b) is suction-fixed to the cutting table mounting surface 20 (20a, 20b), the eccentric position 21 (21a, 21b) is rotated by the rotating mechanism. The position (as the axis position of the rotary axis) is rotated in the desired direction (eccentrically rotated) by the desired angle. (Eccentric position of the cutting table) As described above, in the present invention, the eccentric position 21 (21 a, 21 b) of the mounting surface 20 (20a, 20b) of the cutting table 17 is set as the center position of the rotation. . The eccentric position 21 (21a, 21b) of the cutting table 17 (17a, 17b) is a position at which the center position of the placing surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) is removed. Further, for example, the eccentric position 21 (21 a ' 21b) of the rectangular cutting table 17 (17a, 17b) is placed in a rectangular shape formed by the long side and the short side of the cutting table ι7 (formed substrate 丨) The surface 20 (20a, 20b) can be set on a straight line which is formed by joining the center of the short side and parallel to the long side (except the center position of the cutting stage mounting surface). 200939364 (Proximity of the first and second cutting tables) Further, for example, the first cutting table 17a and the second cutting table 17b are in a state in which their longitudinal directions are parallel to each other in the Y direction. Further, for example, the formed substrate 1 placed on the first cutting table 17a and the formed substrate 1 placed on the second cutting table 17b are in a state in which the longitudinal direction thereof is parallel to the Y direction. Therefore, the first cutting table 17a and the second cutting table 17b are placed adjacent to each other and spaced apart from each other by an interval 33 at which the position is the smallest. In this state, the first cutting table 17a and the second cutting table 17b are reciprocally moved between the substrate mounting position 24 and the substrate cutting position 25 so as not to collide (interfere with each other). Therefore, the first cutting table 17a and the second cutting table 17b are disposed at positions that can no longer be placed closer together. Further, the first cutting table 17a and the second cutting table 17b are configured to be adjacent to each other and are not rotated at the center position where the eccentric position is rotated, so that the cutting tables 17 (17a, 17b) can be mutually moved. Rotate without conflict (interference). In addition, the first cutting table 17a (second cutting table 17b) can be in a single state and the second cutting table nb is not adjacent to each other in the substrate cutting position 25 (for example, the second cutting table) 17b is present in the substrate mounting position 24), and the desired angle is rotated with the eccentric position 21a as the center of rotation. Therefore, as described above, since the first cutting table 17a and the second cutting table 17b are disposed in a close position and at a minimum interval 33 in which the approaching position is 1 standing, (for example, the center position of the rotation) In comparison with the device which is present at the center of the cutting table, the size of the cutting device of the substrate can be reduced to a small size. 17 200939364 (the bellows member and the cleaning portion) Further, on both sides of the reciprocating direction of the substrate mounting means 15 (15a, 15b) of the substrate, the bellows member 31 (31a, which is formed in a vertical wall shape) is provided in a telescopic manner. 31b) for protecting the reciprocating means 16 (16a, 16b) from the cutting shoulder damage generated when the formed substrate 1 placed on the cutting table 17 (17a, 17b) is cut. Further, between the substrate placement position 24 (26a, 26b) of the cutting table 17 (17a, 17b) and the substrate cutting position 25, a cleaning portion 30' is provided for cleaning the substrate. Each component 5 (lc) cut at position 25 is applied and dried. In other words, in the moving region 26 (26a, 26b) of the cutting table, the formed substrate 1 can be placed in a state in which the vertical wall-shaped bellows members 31 (3 la, 3 lb) are extended or contracted ( The cutting table 17 (17a, 17b) of each of the modules 5) is reciprocated, and the cleaning unit 30 is washed by the respective components c) cut at the substrate cutting position 25 and dried. Therefore, the reciprocating means i6 (i6a, 16b) can be protected by the bellows members 3丨 (3丨a, 31b) which are elongated or narrowed. (Alignment Mechanism) Further, an alignment mechanism 27 (one) is provided at the substrate mounting position 24 of the cutting mechanism portion 12 of the substrate for detecting that it is placed on the cutting table 17 (17a, 17b). The alignment mark (check mark) of the formed substrate ι (spherical la) is (imaginary) the cutting line 4 (4a, 4b) is set. Further, in the cutting mechanism portion 12 of the substrate, the alignment reciprocating mechanism 54 is provided, and the alignment mechanism 27 is reciprocated along the direction of the device 9 (the cutting unit B of the substrate), the 200939364 y direction, and the z direction (up and down direction). mobile. In other words, since the alignment mechanism 27 is moved and scanned by the alignment reciprocating mechanism 54, the formed substrates 1 respectively placed on the two cutting tables 17 (17a, 17b) can be aligned and aligned. The cutting line 4 (cutting portion) can be set for each of the formed substrates 1 . Therefore, the formed substrate 1 placed on the first cutting table 17a and the formed substrate 1 placed on the second cutting table 17b can be aligned and set, and the cutting line 4 can be set (4a, 4b). (Cutting mechanism) Further, as shown in FIG. 2 and FIG. 3, two cutting mechanisms having a blade (a circular cutting blade) are provided at the substrate cutting position 25' of the cutting mechanism portion 12 of the substrate. (Cutting mechanism) 'The formed substrate 1 placed on the cutting table 7 (丨7a, 丨7b) is cut along the cutting line 4, that is, the i-th cutting mechanism 28 and the second cutting mechanism 29 are The cutting means of the formed substrate i is provided. That is, the first blade 63 is provided in the first cutting mechanism 28, and the second blade 64 is provided in the second cutting mechanism 29. Further, in the first cutting mechanism 28 and the second cutting mechanism 29, the i-th blade 63 and the second blade 64 are placed in a state of being held at a desired interval (a state in which the blade faces are parallel to each other). Further, the axial direction of the mandrels in which the blades 63 and 64 are respectively rotated is configured to be parallel in the X direction. Further, the first cutting mechanism 28 and the second cutting mechanism 29 are provided with a reciprocating mechanism 55 for the cutting mechanism for causing the two to be in the χ direction, the (relatively) Υ direction, and the Ζ direction (up and down direction). ) Reciprocating movement. 200939364 Further, the first slide connecting member 60 is attached to the first cutting mechanism 28, and the second slide connecting member is attached to the second cutting mechanism 29, so that the reciprocating mechanism 55 of the cutting mechanism can be attached thereto. The first! The slide connecting member 6A of the W-breaking mechanism 28 of the blade 63 also reciprocates in the X direction, (relatively) the γ direction, and the ζ direction (up and down direction). Moreover, the slide connecting member 61 attached to the second cutting mechanism 29 having the second blade 64 can be attached to the second cutting mechanism 29 of the second blade 64, and the second cutting mechanism 29 can be in the X direction (relatively). The ground is reciprocated in the γ direction and the ζ direction (up and down direction). Further, the reciprocating mechanism 55 of the cutting mechanism can move the first blade 63 and the second blade 64 at desired intervals by moving the second cutting mechanism 28 and the second cutting mechanism 29 in the X direction, respectively. Set it appropriately. Therefore, for example, when the two cutting lines 4 that are parallel to the molded substrate 1 placed on the first cutting table 17a are cut by the first cutting mechanism 28 and the second cutting mechanism 29, it is possible to The cutting directions of the blades 63 and 64 are parallel directions and the formed substrate 1 is cut in the Y direction. Further, similarly, in the molded substrate 1 placed on the second cutting table 17b, the cutting direction of the two blades 63 and 64 can be parallel and the formed substrate 1 can be cut in the Y direction. Further, the first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cooling water spray mechanism 67 for injecting cooling water to the blades 63 (64). In the example shown in Fig. 3 (2), the cooling water ejecting mechanism 67 is formed at a side of the blade 63 at the side of the cooling pipe 68 of the circular tubular shape 20 200939364. A desired number of injection holes (not shown). Therefore, when the formed substrate i is cut along the cutting line 4, cooling water can be sprayed from the injection holes of the cooling pipe 68 of the cooling water spraying mechanism 67 to the blade 63 (the circular side surface) to cool the blade 63. Further, the first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cutting water jet mechanism for jetting cutting water to the blade 63 (64), as shown in Fig. 3 (2), (along the blade 63) The cutting water jetting mechanism 69 is provided on the side of the front surface 9a of the blade 63. Therefore, the formed substrate is cut along the cutting line 4! When the cutting water spray mechanism 69 is used to spray the cutting water on the blade 63 (the blade is cut by the cutting mechanism 28 and the cutting mechanism 29 (blades 63, 64), the formed substrate is formed on the formed substrate. i (component 5) produces a scrap material (a foreign matter such as a magical object is cut. A hai shredded material (foreign matter) easily adheres to the surface of the component 5 (for example, the spherical surface 5a) 'even if washed with washing water, sometimes the scraped material is still The adhesion remains on the surface of the assembly 5. Therefore, it is required to effectively remove the debris from the surface of the assembly 5 after the cleaning of the assembly 5. That is, the first cutting mechanism 28 (or the second cutting mechanism) 29) A scrap removing mechanism (fragment discharging mechanism) 7 is provided for causing the blade 63 (64) to be cut along the cutting line 4 to be formed and attached to the surface of the assembly 5 (5a) The shredded material is removed by spraying the mixed liquid and liquid gas-liquid two-fluid mixture (including the water of most air bubbles). In the legend shown in Fig. 3 (2), the crushed material removing mechanism 7 is set in Blade 21 200939364 63 on the front side 9a of the device, and the scrap removal mechanism 7 is clamped to the blade 63 and the cutting water jet mechanism In other words, the cutting water jetting mechanism 69 and the scraping material removing mechanism 7 are disposed in this order from the blade 63 side in the cutting direction (γ direction) of the blade 63. The shredded material (foreign matter) generated when the wire 4 cuts the formed substrate i by the blade 63 is removed by the crushing material removing mechanism. (Cutting groove), that is, as shown in Fig. 4, when the edge is set to be placed In the cutting line 4 of the formed substrate 1 of the cutting table 17 (17a, 17b), the formed substrate i is cut by the i-th cutting mechanism 28 (first blade 63) or the second cutting mechanism 29 (the When the two blades are cut, a cutting groove (58) having a desired groove width 57 can be formed on the formed substrate 1. The longitudinal direction of the groove is the γ direction corresponding to the cutting line 4. Then, since the cutting line 4 is cut by the full cutting method, the cutting edge of the cutting blades 17 (17a, 17b) of the cutting table 17 (17a, 17b) at the position corresponding to the cutting line 4 can be made to enter the cutting edge of the blades 63 and 64. (53a, 53b). Therefore, by cutting the formed substrate i along the cutting line 4 by using the first cutting mechanism 28 and the second cutting mechanism 29, it is possible to form a corresponding cutting line 4 The cutting groove 58 (cutting groove) of the groove width 57. When the cutting groove 58 having the desired groove width 57 formed on the formed substrate 1 (cut substrate lc) is viewed from above, it is γ In the direction of the first line 0 (cutting groove collation mechanism), as shown in Figs. 3 (1) and 3 (2), a cutting groove collating mechanism (cutting groove inspection mechanism) 59 is provided in the cutting mechanism portion 12 of the substrate. The groove width 57 for inspecting the cutting groove 58 formed by cutting the formed substrate 1 along the line 22 200939364, 4 can be used to scan one groove line formed in the Y direction of the formed substrate inspection using the cutting (four) collating mechanism 59. The groove width 57 of the cutting groove 58 is such that the formed substrate can be cut! The size of each of the formed components 5, (the length of the vertical and horizontal directions) is correctly set to a desired length to form each component. Further, the 'cutting groove check_59 can check the groove width 57 of the cutting groove 58, and can check the shape of the cutting groove 58, for example, the peeling state of the cutting groove 58. Therefore, it is possible to detect the shape of the cutting groove (that is, the shape of the component 5) by the cutting groove collating mechanism 59, and to remove the component such as peeling, and efficiently remove it to obtain a high-quality, high-reliability product ( Various plant parts). Further, an air blowing mechanism 71 is provided in the cutting groove collating mechanism 59, and the compressed air rolling is pressure-fed to the surface of the cut substrate lc (each component 5) inspected by the cutting groove collating mechanism 59, and is sprayed and attached to each component. $ Surface foreign matter. That is, in the example shown in Fig. 3 (7), the air blowing mechanism 71 is provided on the front side 9a of the device of the cutting groove collating mechanism 59. Therefore, by blowing the compressed air onto the surface of the (four) substrate by the air blowing means 71, foreign matter such as dust adhering to the surface of each of the components 5 can be ejected and removed. (Integrated cutting inspection means) In addition, as shown in Fig. 3 (1) and Fig. 3 (2), the cutting groove collating mechanism 59 is provided through the sliding coupling member (6) in the second cutting mechanism. The position of the portion 3 (M on the side of the reciprocating mechanism 55 of the cutting mechanism, or the side of the device 23 200939364 on the side of the face 9 a). Further, the cutting groove collating mechanism 59 is used to cut the formed substrate 1 with the first blade 63' The cutting groove 58 (cutting line 4) formed by cutting the slit line 4 is disposed (straight line extending in the z-direction). Therefore, the first cutting mechanism 28 and the cutting groove collating mechanism 59 are along the formed substrate 1 In the state in which the cutting line 4 (cutting groove 58) is disposed, the sliding connection member (9) is used to form the body-cut cutting inspection means 62. As shown in Fig. 3 (2), the first cutting is performed. The rotation direction of the first blade 63 of the mechanism 28 is the right rotation direction in the drawing. ❹ Further, the integrated cutting inspection means 62, similarly to the i-th cutting mechanism 28, can be a reciprocating mechanism 55 of the cutting mechanism. Reciprocating in the χ direction, (relatively) Υ direction (reciprocating movement on the cutting table 17 side), and ζ direction (up and down direction) Therefore, the cutting line 4 formed on the formed substrate i can be cut by the third cutting mechanism 28 of the integrated cutting and cutting device 62, and the desired groove width 57 corresponding to the cutting line 4 can be formed. The cutting groove 58. (The cutting mechanism of the integrated cutting inspection means and the arrangement of the cutting groove collation mechanism) As described above, the i-th cutting mechanism 28 and the cutting groove collating mechanism 59 of the integrated cutting inspection means 62 The position of the cutting line 4 (cutting groove 58) of the formed substrate 1 cut by the first cutting mechanism 28 (blade 63) can be arranged on the plane as shown in Fig. 3 (1) (Y direction). Therefore, when the cutting table 17 on which the formed substrate 1 is placed is reciprocated in the γ direction (the direction in which the cutting line 4 extends), the third cutting mechanism 28 and the cutting groove 24 200939364 are collided with the mechanism 59. One straight line (cut line 4 or cutting groove 58) reciprocates relative to the cutting table 17. Further, the relative shape of the formed substrate 1 (cutting table 17) and the cutting devices 28, 29 (cutting groove collating mechanism 59) The movement will be described in detail later. That is, first, the integrated cutting inspection means 62 is used to cut the platform from the apparatus. The back surface 9b side is moved to the apparatus front side 9a side (relatively moved in the forward direction), and the y-direction of the second cutter mechanism 28 (blade 63) in the cutting direction by the integrated cutting inspection means 62 The cutting line 4 is cut. Further, the integrated cutting inspection means 62 can be moved from the apparatus front side 9a side to the apparatus back surface 9b side with respect to the cutting table 17 (by returning in the opposite direction to the forward direction) The cutting direction check mechanism 58 of the integrated cutting and cutting means 62 checks the cutting groove 58 corresponding to the cutting line 4. Therefore, the cutting groove collating mechanism 59 of the inspection means 62 can be integrally cut. The inspection (cutting groove collation) corresponds to the groove φ width 57 of the cutting groove 58 formed by the cutting line 4. In addition, in the present invention, since the cutting of one cutting line 4 and the cutting groove can be performed efficiently, the integrated cutting inspection means 62 can be reduced (the first cutting mechanism 28 and the cutting groove collation mechanism). 59) The time during which the cutting table 17 is moved to shorten the time for cutting the formed substrate. Therefore, the number of articles produced per unit time can be increased because the formed substrate 1 can be efficiently cut into the respective components 5'. (relative movement of the cutting mechanism, etc.) Here, the cutting of the cutting line 4 and the groove width 57 of the cutting groove 58 are in accordance with the inspection. 200939364 Inspection, the integrated cutting inspection means 62, the cutting mechanisms 28, 29, and the cutting groove are described. The collating mechanism 59 and the relative movement with respect to the cutting tables 17 (17a, 17b) (see Figs. 5(1), 5(2), and 5(3)). That is, as described above, the cutting table 17 (17a, 17b) can reciprocate in the Y direction by the reciprocating means 16 (16a, 16b). For example, the first cutting mechanism 28 (including the cutting groove collating mechanism 59) and the second cutting mechanism 29 are not moved in the γ direction, and the cutting table 17 (17a, 17b) is moved from the Y direction. The front side 9a side of the apparatus is moved to the apparatus back surface 9b side, and the first cutting mechanism 28 and the second cutting mechanism 29 can be set to be respectively in the cutting direction 65, that is, set to be opposite to the front side of the apparatus from the apparatus back surface 9b side. The state of the ground movement. Further, for example, the first cutting mechanism 28 (including the cutting groove collating mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is removed from the γ. The device back surface 9b side of the direction moves to the device front surface 9a side, and the first cutting mechanism 28 (cutting groove collating mechanism 59) and the second cutting mechanism 29 can be set to be opposite to the cutting direction 65, that is, 66. It is set to a state in which it is relatively moved from the front surface 9a side of the apparatus toward the side of the apparatus rear surface 9b. Further, substantially, the cutting table 17 (17a, 17b) reciprocates in the γ direction, and the cutting and inspection means 62 perform cutting and inspection. (The cutting and inspection using the integrated cutting inspection means) That is, the first cutting mechanism 28 can be moved by moving the integrated cutting inspection means 62 to the cutting table 17 in the cutting direction 65' in the Y direction. The (i-th blade 63) cuts the formed substrate 1 along the cutting line 4. 26 200939364 Further, the integrated cutting inspection means 62 can be moved by the cutting groove collating mechanism 59 by moving the cutting table 7 relative to the cutting table 7 in a direction 66 (checking direction) opposite to the cutting direction in the Y direction. The groove width 57 of the cutting groove 58 formed by the cutting line 4 is formed. Therefore, first, as the forward path (advancing state) of the integrated cutting inspection means 62, by moving the integrated cutting inspection means 62 in the cutting direction 65 with respect to the cutting table 17, the inspection means 62 can be integrally cut. The formed substrate 1 is cut along one of the cutting lines 4, and the return path (backward state) of the integrated cutting and inspection means® 62 is followed by the integrated cutting and inspection means 62 with respect to the cutting table 17 When the cutting direction 66 is reversed, the groove width 57 of one cutting groove 58 can be inspected by the integrated cutting inspection means 62. Next, the cutting and inspection using the integrated cutting inspection means 62 of the present invention will be described in detail with reference to Figs. 5(1), 5(2) and 5(3). Further, Fig. 5 (1) shows a state before the substrate is cut by the integrated cutting inspection means 62, and Fig. 5 (2) shows a state when the substrate is cut and cut by the integrated cutting inspection means 62. 3) shows the state when the substrate is inspected by the integrated cutting inspection means 62. Further, in this case, although the cutting table 17 (l7a, 17b) moves in the Y direction, the integrated cutting inspection means 62 does not move in the Y direction. In other words, first, as shown in Fig. 5 (1), before the cutting of the substrate, the formed substrate 1 placed on the cutting table 17 (17a, 17b) is directed from the device front surface 9a side (the cleaning portion 30 side) toward The back side 9b of the device moves in the γ direction. Further, as shown in Fig. 5 (2), when the substrate is cut, first, the integrated cutting inspection means 62 is moved downward, and the integrated cutting means 27 200939364 is moved to the inspection means 62. The direction is such that the cutting direction 65 of the 刀片-direction of the i-th blade 63 is set to the (one) cutting line 4' in the direction of the spherical surface of the formed substrate 其, and the formed substrate 1 is cut. The shutoff table 17) moves in the γ direction from the device surface 9a side toward the device back surface 9b side, and moves the integrated cutting inspection means 62 (in the γ direction in a stationary state) with respect to the cutting table 17 in the cutting direction 65. It is possible to form a groove width of (1) corresponding to the cutting line 6 by cutting the formed substrate i along the cutting line 4 by the first blade 63 (first cutting mechanism 28) in the cutting direction 65. Cutting groove 58 of 57. Further, at this time, after the cutting line 4 is cut by the first blade 63, the integrated cutting and cutting inspection means 62 is moved upward. Further, as shown in Fig. 5 (3), when the substrate is inspected, the formed substrate 1 (cutting table 17) is moved in the Y direction from the outside of the device back surface toward the device front surface 9a side (in the γ direction). The integrated cutting inspection means 62 is moved relative to the cutting table 17 in the direction 66 (checking direction) opposite to the cutting direction, and can be inspected by the integrated cutting inspection means 62 (cutting groove collating mechanism 59). Corresponding to the groove width 57 of the (1) cutting groove 58 of the cutting line 4. Further, the inspection of the groove width 57 of the cutting groove 58 formed by cutting the formed substrate 1 along the cutting line 4 by the second cutting mechanism 29 (the second cutting blade 64) can be performed by the integrated cutting inspection means 62. The cutting groove collating mechanism 59 scans in the γ direction and inspects the groove width 57 of the cutting groove 58 of the second cutting mechanism 29 (second blade 64). (Cutting Method of Substrate) First, the substrate 丨 is supplied and fixed from the mounting unit of the substrate to the alignment mechanism portion n of the substrate of the cutting unit B of the substrate (substrate supply station 28 200939364 13), and is rotated by means of rotation 14 The formed substrate 1 is arranged in the desired direction 'and supplied to the mounting surface 20a (20b) of the first cutting table 17a (or the second cutting table 17b) existing at the substrate mounting position 24. At this time, the formed substrate 1 can be adsorbed and fixed to the cutting table mounting surface 20a (20b) and placed thereon. Next, the i-th cutting table 17a is moved to the substrate cutting position 25 while the formed substrate 1 is placed. At this time, the bellows members 31 of the vertical wall ® which are provided on both sides in the moving direction of the first cutting table i 7a are stretched one by one and the other is contracted as the first cutting table 17a moves. Then, the eccentric position 21a of the mounting surface 20a of the first cutting table 17a is rotated at the center position, and the first cutting table 17a is rotated by a desired angle (for example, an angle of 90 degrees). At this time, the cutting line 4 (4b) along the short side direction of the formed substrate 1 can be cut by the first cutting mechanism 28 (the body-cut cutting inspection means 62) and the second cutting mechanism 29. Further, at this time, the groove width 57 of the cutting groove 58 corresponding to the cutting line 4 (4b) can be inspected by the cutting groove collating mechanism 59 of the integrated cutting inspection means 62. Further, the first cutting table i7a on which the formed substrate 1 having the cutting line 4b in the short-side direction is cut is placed, and the eccentric position 21a is rotated. "The position is rotated in the opposite direction by the desired angle. In this case, the first cutting mechanism 28 (the body-cut cutting inspection means 02) and the second cutting mechanism can be used for the cutting line 4 (4a) of the formed substrate 1 along the longitudinal direction thereof. 29 200939364 Further, at this time, the groove width 57 of the cutting groove 58 corresponding to the cutting line 4 (4a) can be inspected by the cutting groove collating mechanism 59 of the integrated cutting inspection means 62. 1 The mounting surface 20a of the cutting table 17a forms each of the modules 5 (the substrate lc has been cut). The formed substrate 1 placed on the mounting surface 20b of the second cutting table 17b is also cut off. The same applies to the stage 17a. (Inspection of the groove width of the cutting groove of the cutting method of the substrate)

That is, as shown in Fig. 5 (1), the formed substrate 1 placed on the cutting table 17 (17a, 17b) is on the device back surface 9b side from the device front surface 9a side ( Go forward) Move 'Make the first! The physical cut-off inspection means 62 (or the second cutting mechanism 29) of the cutting mechanism 28 is moved in the cutting direction 65 with respect to the cutting table 17.

Next, as shown in Fig. 5 (2), the integrated cutting inspection means 62 (or the second cutting mechanism 29) provided with the first cutting mechanism 28 is moved downward, and The integrated cutting inspection means 62 (or the second cutting mechanism 29) of the cutting mechanism 28 moves in the cutting direction 65 with respect to the cutting table 17, that is, the first knife #63 (or the second blade 64) can be used. The formed substrate i is cut along the cutting line 4 (4a, 4b) and can be formed with a cutting groove 58 having a corresponding cutting line 4 (4a, 4 groove width 57. 'With the load placed on the cutting table 4b) The cutting groove 58 that has been cut has moved to the front side 9a (backward) of the apparatus, that is, the direction 66 (checking direction) of the integrated cutting inspection means 62. Therefore, next, as shown in Fig. 5 (3), 17 (17a, 17b) and along the cutting line 4 (4a, the substrate 1 is moved from the device back surface 9b side, the pair of cutting tables 17 provided with the cutting groove collating mechanism 59 can be provided. The direction is opposite to the cutting direction 30 200939364 At this time, it can be inspected by the cutting groove collating mechanism 59 provided in the integrated cutting inspection means 62 (cutting groove collation). The groove width of the cutting groove 5 § is $7. In the embodiment, the formed substrate 1 placed on the first cutting table na is aligned with the alignment mechanism 27 at the substrate mounting position 24 to set the cutting line 4 (4a, 4b), and At about the same time, at the substrate cutting position 25', the formed substrate 1 placed on the second cutting table 17b is cut along the cutting line 4 (4a, 4b) by the first cutting mechanism 28 (integrated cutting inspection) The means 62) is cut off from the second cutting mechanism 29 to form the cutting groove 58, and the groove width 57 of the cutting groove 58 formed in the formed substrate i is inspected by the cutting groove collation® mechanism 59 (integrated cutting inspection means 62). Therefore, compared with the conventional example, the alignment setting of the single detection mode by one detection mechanism is compared with the configuration of the cutting groove check after the cutting, by using this In the double-stage mode of the Ming, the alignment setting and the cutting groove check after cutting are configured to increase the number of products (components) per unit time. (Effect) The 'invention' is a two-stage method (2) The substrate of the cutting table 17), the cutting device 9', can be aligned with the substrate mounting position 24 to set the formed substrate 1 on the first cutting table na, and (about) simultaneously at the substrate cutting position 25 The formed substrate 1 on the second cutting table 17b is cut along the cutting line 4 (4a, 4b) to form the cutting groove 5, and the groove width 57 of the cutting groove 58 formed in the formed substrate 1 can be inspected. Therefore, by using the two-stage method (two cutting stages 17), the formed substrate 1 on the cutting table 17 of one of the two cutting stages 17 can be aligned with the substrate mounting position 24 to set the cutting. The wire 4 is broken, and the formed substrate 上 on the cutting table 17 of the other side can be cut and checked (about) at the same time on the substrate cutting 31 200939364. That is, by using the two-stage method (2 The configuration of the cutting table 17) and the "alignment setting" and "including the cutting inspection" (about) simultaneously The configuration of the line is compared with the configuration in which the "alignment setting" and the "inspection" are performed by one detection unit in a single mode as shown in the conventional example, and the present invention performs "alignment λ" and inspection respectively. Therefore, the number of products (components) per unit time can be increased. The formed substrate 1 is cut at a good efficiency. Therefore, the productivity of the product (component) can be improved. In the substrate cutting device 9 of the method (two cutting tables 17), the formed substrate 1 on the i-th cutting table 17a can be aligned at the substrate mounting position 24, and (about) simultaneously cut off at the substrate. Position 25, the formed substrate on the second cutting table 17b! The cutting line 58 is cut along the cutting line 4 (4a, 4b), and the groove width 57 formed in the cutting groove 58 of the formed substrate 1 can be inspected. For example, at the substrate cutting position 25, when the formed substrate 1 placed on one of the cutting tables 17a is cut (including the cutting groove collation), the formed substrate 1 is supplied and fixed by the rotation arrangement means 14 The other cutting table is placed and placed for alignment setting. Further, for example, when the molded substrate 1 placed on one of the cutting tables 17a is cut at the substrate cutting position 25 (including the cutting groove collation), first, the cleaning portion 30 is washed and placed. The other substrate cutting table 17b has the substrate lc (package 5) cut, and next to the substrate mounting position 24, the components placed on the cutting table 17b are transferred to the inspection unit c side. 32 200939364 Further, for example, when the substrate 1 placed on one of the cutting tables 17a is placed in alignment with the substrate mounting position 24, the cleaning unit 3 can be washed and placed on the other cutting table. The substrate lc (component 5) has been cut by 17b. Therefore, according to the present invention, the product (assembly) per unit time can be improved by the cutting device 9 provided with the two cutting tables i7 (17a, 17b) and the alignment mechanism 27 and the cutting groove collating mechanism 59. The production quantity, while efficiently cutting the formed substrate 1', can improve the productivity of the product (assembly). Further, according to the present invention, the first cutting mechanism 28 and the cutting groove collating mechanism 59 can be integrated to form the integrated cutting inspection means 62. In the substrate cutting position 25', the cutting table 17 is moved forward from the device front surface 9a side along the device back surface 9b side, whereby the integrated cutting inspection means 62 (first cutting mechanism 28) is cut in the cutting direction 65. When the first cutting mechanism 28 cuts the formed substrate 1 along the cutting line 4 to form the cutting groove 58 with the first cutting mechanism 28, the cutting table π is immediately advanced from the device back surface 9b side along the device front surface 9a side. By moving, the integrated cutting inspection means 62 (the cutting groove core pair mechanism 59) is moved relative to the cutting table 17 in the direction 66 opposite to the cutting direction to check the groove width 57 of the cutting groove 58. That is, as shown in the conventional example, the alignment setting is performed at the substrate placement position, and the configuration of cutting the width of the cutting groove after cutting all the cutting lines is compared with the present invention, since the substrate cutting position 25 can be Immediately after the cutting of the stringer cutting line 4, the groove width 57 of the cutting groove 58 corresponding to one cutting line 4 is checked, so that the time for cutting the formed substrate 缩短 can be shortened, and the productivity of the product (assembly) can be improved. Further, in the above-described embodiment, the center position of the rotation of the cutting table 33 200939364 17 on which the formed substrate is placed is set to the eccentric position 21 of the mounting surface 2 of the cutting table I, and two cuts are made. The shutoff table 17 (17a, 17b) is disposed at the approaching position (interval 33) so as to be movable in parallel in a parallel state, so that the overall size of the cutting device of the substrate can be made small. The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed and selected as needed within the scope of the gist of the invention. (Second-integrated cutting inspection means) The above-described embodiment is exemplified by attaching the cutting groove collation mechanism 59 to the first cutting mechanism 28 to form the (first) integrated cutting inspection means 02. In the configuration, the cutting groove collation mechanism 59 may be attached to the second cutting mechanism 29 to form a second-body cut-off inspection means. In this case, the cutting of the cutting line of the substrate and the inspection of the width of the cutting groove are performed using two integrated cutting inspection means (62). Therefore, the present invention can be constructed by using a plurality of integrated cutting inspection means (62). (Independent cutting mechanism and independent cutting groove collation mechanism) The embodiment described in the month illustrates the use of an integrated cutting and inspection method that integrates the cutting mechanism (28, 29) and the cutting groove collation mechanism (59). The composition of 62 can also be configured by separately setting the desired number of cutting mechanisms, 29) and the desired number of cutting groove collating mechanisms (59). For example, it is possible to adopt a configuration in which two cutting mechanisms and two cutting groove collating mechanisms are separately provided. 34 200939364 In this case, 'for the cutting table 17a (formed substrate 丨), the i cutting mechanism and the one cutting groove collating mechanism can be independently and exclusively provided, and for the cutting table 17b (formed substrate 丨), can cut a mechanism and! The cutting groove collating mechanisms are independently and exclusively arranged. (Multiple alignment mechanisms) Further, in the above-described embodiment, the configuration of one alignment mechanism 27 is exemplified, but a configuration in which a plurality of alignment mechanisms are used can be employed. ❾ In this case, for example, two alignment mechanisms can be used, and they can be separately and exclusively provided on the two cutting tables 17 (17a, 17b). (Semi-cut) In the above-described embodiment, the cutting line 4 of the formed substrate 1 is completely cut to form the cutting groove 58, but the groove depth (distance) of the cutting groove 58 can be set to be desired. The groove depth. For example, 'the cutting line 4 of the formed substrate 1 is half cut to form a cutting groove 0 having a desired groove depth (for example, a groove depth of one half of the full cutting) (the mounting of the formed substrate) In the embodiment, the molded substrate 1 is configured to be fixed to the cutting table 17 with the spherical surface 1 a as the upper surface. However, the formed substrate 1 can be supplied and fixed to the cutting table with the resin surface 1b as the upper surface. 17, and the alignment of the resin surface lb is set to set the cutting line. (Configuration of other units) That is, the substrate loading unit A' is provided with a substrate loading unit 41 for loading the formed substrate 1 and the ejection member 42 for ejecting the formed substrate 1 from the substrate loading unit 41 35 200939364. Therefore, by ejecting the formed substrate 1 from the substrate loading portion 41 by the ejecting member 42, the wired substrate i can be supplied to the substrate arranging mechanism portion 11 (substrate supply table 13) of the cutting sheet SB of the substrate. In addition, the component inspection unit c is provided with a component supply unit 43 that supplies each component 5 that has been cut by the unit (4) of the substrate (the cut substrate (4) is supplied to the component inspection unit 44; the component inspection unit 44 The components 5 (lc) from the component supply unit 43 are inspected; the inspection camera 45 is inspected by the component inspection unit 44; and the component selection means 46 is used to inspect the components 5 inspected by the component inspection unit. It is selected as a good product and a defective product and transferred to the storage unit D of the module. Therefore, in the inspection unit c of the component, each of the supply unit 43 supplies the cutting unit B from the substrate to the component supply unit 43 by the camera 45. The component 5 (1C) can be selected as a good product and a defective product by the component sorting means 46 and transferred to the storage unit D of the component. Further, the storage unit D of the component is provided with a good quality tray 47 for accommodating good products and a defective product. The defective product tray 48. Therefore, in the storage unit D of the module, the component 5 inspected by the inspection unit C of the module can be accommodated in the good tray 47' through the component sorting means 46 and the component which is inspected as a defective product 5 Through group The selection means 46 is housed in the defective product tray 48. As described above, the inspection unit c of the module is a unit that inspects the component 5 cut from the molded substrate 1 by an inspection camera (inspection means). Unit c, first check the spherical surface 5a of the assembly 5 (including 36 200939364 component size), and secondly check the resin surface 5b of the assembly 5. Further, in the inspection unit C, the spherical surface 5a of each component 5 (1 c) can be used as the upper surface It is placed on the first board and inverted in this state. The spherical surface 5a of each component 5 (lc) is inspected by the inspection camera from the lower position, and the resin surface 5b of each component 5 (lc) is placed on the second surface. On the board, the resin surface 5b of the module 5 (lc) is inspected by the inspection camera. [Brief Description of the Drawings] Fig. 1 is a schematic plan view schematically showing the cutting device of the substrate of the present invention. The main part of the cutting device of the substrate (the cutting unit of the module) is enlarged and enlarged as a schematic plan view. Fig. 3 (1) shows the cutting device of the substrate shown in Fig. 2 The outline of the main part is enlarged to show roughly Front view, FIG lines

The cutting mechanism (blade) of the main part of the apparatus shown in Fig. 3 (1) and the cutting groove collation mechanism are enlarged to show an enlarged schematic front view. 4 is an enlarged schematic longitudinal cross-sectional view schematically showing an essential part of a cutting device (cutting unit of the module) shown in FIG. 2 . 5(1), 5(2), and 5(3) are enlarged schematic front views showing a method of using the cutting mechanism (blade) and the cutting groove collation mechanism shown in Fig. 3 (2), and Fig. 5 (1) Table *Knife>|The base (4) before the break (4), Figure 5 (2) records the state of the 2 blade when the blade is broken, and Fig. 5 (3) shows the state when the cutting groove of the cutting groove collation mechanism is checked. Fig. 6 (1) is a schematic perspective view of 37 200939364 schematically showing a molded substrate used in the present invention, and Fig. 6 (2) is a view showing a schematic view of cutting a formed substrate shown in Fig. 6 (1) to form a module. Stereo picture. Explanation of main components and symbols 1 Formed substrate la Spherical surface (substrate surface) lb Mold surface (resin surface) 1 c Substrate (component assembly) 2 Substrate 3 Resin molded body 4 Cutting line 4a Cutting line in the longitudinal direction ( Cutting part in the first direction) 4b Cutting line in the horizontal direction (cutting part in the second direction) 5 Module 5a Spherical surface 5b Modular surface 5 (lc) Assembly of components (cutting of the substrate) 6 Substrate part 7 Resin part 8 ball electrode 9 substrate cutting device 9a device front 9b device back 10 connecting device 38 200939364

11 substrate alignment mechanism portion 12 substrate cutting mechanism portion 13 substrate supply table 14 substrate rotation alignment means 15 substrate placement means 15a first substrate placement means 15b second substrate placement means 16 reciprocating means 16a First reciprocating means 16b First reciprocating means 17 Cutting table 17a First cutting table 17b Second cutting table 20 Mounting surface (cutting table) 20a First mounting surface (the first cutting table) 20b second mounting surface (mounting surface of the second cutting table) 21 eccentric position (center position of rotation) 21a first eccentric position (eccentric position of the first cutting table) 21b second eccentric position ( Eccentric position of the second cutting table) 24 Substrate placement position 25 Substrate cutting position 26 Moving area (sliced line) 26a First moving area (moving area of the first cutting table) 26b Second moving area (No. 2 cut off the moving area of the table) 39 200939364 2 7 Alignment mechanism 28 First cutting mechanism 29 Second cutting mechanism 30 Cleaning portion 31 Bellows member 31a First bellows member 31b Second bellows member 33 Minimum interval 41 Substrate filling portion 42 Push-out member 43 Component supply portion 44 Component inspection Part 45 Inspection camera 46 Component selection means 47 Good product tray 48 Defective product tray 51 Suction hole 51a First suction hole 51b Second suction hole 52 Vacuum extraction mechanism 52a First vacuum extraction mechanism 52b Second vacuum extraction mechanism 53 Broken table groove 53a first cutting table slot

40 200939364 Ο ❹ 53b 2nd cutting table groove 54 Aligning reciprocating mechanism 55 Reciprocating mechanism 57 of cutting mechanism Slot width (groove width of cutting groove) 58 Cutting groove 59 Cutting groove collation mechanism (cutting groove inspection mechanism) 60 First sliding connection member 61 Second sliding connection member 62 Integrated cutting inspection means 63 First blade (rotation cutting blade) 64 Second blade (rotation cutting blade) 65 Cutting direction 66 opposite to the cutting direction (checking direction) 67 Cooling water jet mechanism 68 Cooling pipe (spray hole) 69 Cutting water jetting mechanism 70 Broken material removing mechanism (shredded material spraying mechanism) 71 Blowing mechanism A Substrate filling unit B Substrate cutting unit C Storage unit of the inspection unit D component

Claims (1)

200939364 VII. Patent application scope: 1. A method for cutting a substrate by using a cutting device for a substrate, first placing a formed substrate on a cutting table at a substrate mounting position of the device and moving to a substrate of the device The cutting position is followed by the substrate cutting position, and the formed substrate is placed in the cutting table, and is cut by a cutting mechanism to form an assembly. First, at the substrate mounting position, The formed substrate is set by alignment with an alignment mechanism, and a cutting line is set on the formed substrate; secondly, 'cutting position of the substrate is checked by the cutting groove collation mechanism © the cutting mechanism is cut along the cutting line The cutting groove formed by the formed substrate. 2. A method of cutting a substrate by using a substrate cutting device, first placing a formed substrate on a cutting table at a substrate mounting position of the device and moving to a substrate cutting position of the device' followed by The substrate cutting position is performed by the cutting mechanism in the state in which the formed substrate is placed on the cutting table to form the module. The method is characterized in that: the substrate is placed at the substrate mounting position by Aligning the alignment mechanism to set the formed substrate, and setting a cutting line on the formed substrate; cutting the substrate at the cutting position of the substrate by cutting the cutting line along the cutting line of the formed substrate a step of forming a cutting groove corresponding to the cutting line on the formed substrate; and a step of inspecting the cutting groove formed in the formed substrate by the cutting groove collating mechanism at the cutting position of the substrate; In the cutting step of the disconnection, the cutting mechanism is moved in the cutting direction with respect to the cutting plane of the 42 200939364 to cut the formed substrate along the cutting line; during the inspection step of the cutting groove, By The cutting means relative to the cutting grooves matching stage is moved in the opposite direction to the cutting direction, the cutting grooves to check the cutting groove collating means. 3. A method of cutting a substrate by using a cutting device including a substrate of two cutting tables, and moving the two cutting tables from a substrate mounting position provided in the device to a substrate cutting position, and In each of the cutting stages, the formed substrate is first placed on the cutting table at the substrate mounting position, and the formed substrate is placed on the cutting table in the substrate cutting position to cut off. The mechanism is formed by cutting off the mechanism, wherein the cutting table is first set at the substrate mounting position, and the formed substrate is aligned by an alignment mechanism to set a cutting line on the formed substrate; At the substrate cutting position, a step of inspecting the cutting groove formed by the cutting mechanism by the cutting groove collating mechanism is performed. 4. The method of cutting a substrate according to the third aspect of the invention, wherein, when the cutting mechanism cuts the formed substrates placed on the two cutting tables, respectively, The eccentric position of the cutting table is rotated at a desired position by the center position of the rotation. A cutting device for a substrate, comprising: a cutting mechanism for cutting a desired portion of the formed substrate; a cutting table for placing the formed substrate; and a reciprocating movement of the cutting table a reciprocating means between the substrate mounting position and the substrate cutting position; characterized in that: an alignment mechanism for setting the substrate to be placed on the cutting table 43 200939364 is set in the substrate mounting position alignment And a cutting groove collating mechanism for cutting the cutting groove formed by cutting the formed substrate by the cutting mechanism is not disposed at the substrate cutting position. 6. The apparatus for cutting a substrate according to the fifth aspect of the invention, wherein the cutting means for integrating the cutting mechanism with the cutting groove collating mechanism is provided. 7. The cutting device for a substrate according to claim 5, wherein an integrated cutting inspection means for integrating the cutting mechanism with the cutting groove collating mechanism is provided; and the integrated cutting inspection means The cutting mechanism and the cutting groove collating mechanism are disposed along a cutting line of the formed substrate cut by the cutting mechanism. 8. The cutting device for a substrate according to claim 5, wherein the cutting table is provided in two. 9_ The cutting device for a substrate according to claim 5, wherein the rotating mechanism is provided for rotating the cutting table by a desired angle with its eccentric position as a center position of rotation. 〇10. The cutting device for a substrate according to claim 5, wherein the material removing mechanism is disposed on a surface of the component formed by the cutting mechanism and sprayed with a fluid mixture of mixed air and water. To remove the debris attached to the surface of the component. Eight, schema · (such as the next page) 44