JPS5487168A - Manufacture for semiconductor device and its unit - Google Patents

Manufacture for semiconductor device and its unit

Info

Publication number
JPS5487168A
JPS5487168A JP15444177A JP15444177A JPS5487168A JP S5487168 A JPS5487168 A JP S5487168A JP 15444177 A JP15444177 A JP 15444177A JP 15444177 A JP15444177 A JP 15444177A JP S5487168 A JPS5487168 A JP S5487168A
Authority
JP
Japan
Prior art keywords
substrate
roller
motor
cutting
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15444177A
Other languages
Japanese (ja)
Inventor
Hiroichi Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15444177A priority Critical patent/JPS5487168A/en
Publication of JPS5487168A publication Critical patent/JPS5487168A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To increase the washing effect and to reduce the working process, by friction and rubbing cleaning.
CONSTITUTION: When the motor 26 is driven, the substrate 17 is upward and it is in contact with the blade 6. The cutting grooves are formed on the substrate 17 by feeding it toward X. At the end of cutting, the tip of substrate is touched on the roller 7, washing water is fed in the roller 7 and it is jetted from the roller grooves. The roller turns and it rubs while blowing out water on the substrate and the cutting trash can completely be removed. The washing effect is very high and unifrom. Since the roller is made of rubber, it does not damage the substrate surface. After washing, the motor 26 is reversed and the substrate is moved downward, and the substrate is moved back by reversing the motor 31. After that, the substrate is dried. With this constitution, the working time can remarkably be reduced.
COPYRIGHT: (C)1979,JPO&Japio
JP15444177A 1977-12-23 1977-12-23 Manufacture for semiconductor device and its unit Pending JPS5487168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15444177A JPS5487168A (en) 1977-12-23 1977-12-23 Manufacture for semiconductor device and its unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15444177A JPS5487168A (en) 1977-12-23 1977-12-23 Manufacture for semiconductor device and its unit

Publications (1)

Publication Number Publication Date
JPS5487168A true JPS5487168A (en) 1979-07-11

Family

ID=15584257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15444177A Pending JPS5487168A (en) 1977-12-23 1977-12-23 Manufacture for semiconductor device and its unit

Country Status (1)

Country Link
JP (1) JPS5487168A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS5790941A (en) * 1980-11-27 1982-06-05 Toshiba Corp Swing type vertical washer
JPS6096825U (en) * 1983-12-07 1985-07-02 株式会社東芝 cleaning brush
JPS62239544A (en) * 1986-04-10 1987-10-20 Mitsubishi Electric Corp Semiconductor manufacturing device
CN105551996A (en) * 2014-10-22 2016-05-04 东和株式会社 Cutting device and cutting method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627931A (en) * 1979-08-16 1981-03-18 Toshiba Corp Surface treatment of semiconductor wafer
JPS5790941A (en) * 1980-11-27 1982-06-05 Toshiba Corp Swing type vertical washer
JPS6096825U (en) * 1983-12-07 1985-07-02 株式会社東芝 cleaning brush
JPS62239544A (en) * 1986-04-10 1987-10-20 Mitsubishi Electric Corp Semiconductor manufacturing device
CN105551996A (en) * 2014-10-22 2016-05-04 东和株式会社 Cutting device and cutting method
JP2016082195A (en) * 2014-10-22 2016-05-16 Ｔｏｗａ株式会社 Cutting device and cutting method

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