JPS5542738A - Abrasive grain processing device - Google Patents

Abrasive grain processing device

Info

Publication number
JPS5542738A
JPS5542738A JP11458578A JP11458578A JPS5542738A JP S5542738 A JPS5542738 A JP S5542738A JP 11458578 A JP11458578 A JP 11458578A JP 11458578 A JP11458578 A JP 11458578A JP S5542738 A JPS5542738 A JP S5542738A
Authority
JP
Japan
Prior art keywords
abrasive grain
processed object
grain processing
head
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11458578A
Other languages
Japanese (ja)
Inventor
Narikazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11458578A priority Critical patent/JPS5542738A/en
Publication of JPS5542738A publication Critical patent/JPS5542738A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To constitute the device that the processed object is moved to the abrasive grain processing part, the cleaning part provided between the abrasive grain processing part and the receiving part which tempolarily supports the processed object, and the receiving part according to the constant sequence to achieve highly precise processing.
CONSTITUTION: The device to polish the processed object W is constituted by the head part 1, the abrasive grain processing part 2, the cleaning part 3, the receiving part 4, and the head driving mechanism 5, etc. Then, the head part 1 is shifted from the processing part 2 to be cleaned at the cleaning part 3 which is provided apart from the processing part 2 so that the head part 1 is cleaned easily and completely. Therefore, the processed object W is accurately mounted on the head part 1, and the abrasive grain processing accuracy can be remarkably improved. As the processed object W is mounted or removed on the head part 1 by pressure reducing or pressurizing, the accuracy can also by improved compared to that with the adhesives.
COPYRIGHT: (C)1980,JPO&Japio
JP11458578A 1978-09-20 1978-09-20 Abrasive grain processing device Pending JPS5542738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11458578A JPS5542738A (en) 1978-09-20 1978-09-20 Abrasive grain processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11458578A JPS5542738A (en) 1978-09-20 1978-09-20 Abrasive grain processing device

Publications (1)

Publication Number Publication Date
JPS5542738A true JPS5542738A (en) 1980-03-26

Family

ID=14641523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11458578A Pending JPS5542738A (en) 1978-09-20 1978-09-20 Abrasive grain processing device

Country Status (1)

Country Link
JP (1) JPS5542738A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748462A (en) * 1980-09-01 1982-03-19 Nippon Telegr & Teleph Corp <Ntt> Grinding attachment for modifying automatically form
JPS57132965A (en) * 1981-02-03 1982-08-17 Shibayama Kikai Kk One pass type multi-head plane grinding, polishing, washing automatic machine
JPS6087643U (en) * 1983-11-25 1985-06-15 東芝機械株式会社 Surface plate spacing structure of polishing equipment
JPH02308241A (en) * 1989-05-24 1990-12-21 Fuji Photo Film Co Ltd Prefogged direct positive silver halide emulsion
WO1993025347A1 (en) * 1992-06-15 1993-12-23 Speedfam Corporation Wafer polishing method and apparatus
DE4392793T1 (en) * 1992-06-15 1997-07-31 Speedfam Corp Method and device for polishing wafers

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5748462A (en) * 1980-09-01 1982-03-19 Nippon Telegr & Teleph Corp <Ntt> Grinding attachment for modifying automatically form
JPS5815265B2 (en) * 1980-09-01 1983-03-24 日本電信電話株式会社 Automatic shape correction polishing equipment
JPS57132965A (en) * 1981-02-03 1982-08-17 Shibayama Kikai Kk One pass type multi-head plane grinding, polishing, washing automatic machine
JPS6243832B2 (en) * 1981-02-03 1987-09-17 Shibayama Kikai Kk
JPS6087643U (en) * 1983-11-25 1985-06-15 東芝機械株式会社 Surface plate spacing structure of polishing equipment
JPH02308241A (en) * 1989-05-24 1990-12-21 Fuji Photo Film Co Ltd Prefogged direct positive silver halide emulsion
WO1993025347A1 (en) * 1992-06-15 1993-12-23 Speedfam Corporation Wafer polishing method and apparatus
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498196A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
DE4392793T1 (en) * 1992-06-15 1997-07-31 Speedfam Corp Method and device for polishing wafers
USRE37622E1 (en) 1992-06-15 2002-04-02 Speedfam-Ipec Corporation Wafer polishing method and apparatus

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