DE4392793T1 - Method and device for polishing wafers - Google Patents
Method and device for polishing wafersInfo
- Publication number
- DE4392793T1 DE4392793T1 DE4392793T DE4392793T DE4392793T1 DE 4392793 T1 DE4392793 T1 DE 4392793T1 DE 4392793 T DE4392793 T DE 4392793T DE 4392793 T DE4392793 T DE 4392793T DE 4392793 T1 DE4392793 T1 DE 4392793T1
- Authority
- DE
- Germany
- Prior art keywords
- polishing wafers
- wafers
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/898,876 US5329732A (en) | 1992-06-15 | 1992-06-15 | Wafer polishing method and apparatus |
DE4345407A DE4345407C2 (en) | 1992-06-15 | 1993-06-10 | Computer controlled device for polishing a surface of a thin material wafer |
PCT/US1993/005541 WO1993025347A1 (en) | 1992-06-15 | 1993-06-10 | Wafer polishing method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
DE4392793T1 true DE4392793T1 (en) | 1997-07-31 |
Family
ID=25932691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4392793T Ceased DE4392793T1 (en) | 1992-06-15 | 1993-06-10 | Method and device for polishing wafers |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE4392793T1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19648066A1 (en) * | 1996-07-09 | 1998-01-22 | Lg Semicon Co Ltd | Chemical mechanical polishing device for semiconductor wafers |
US8002610B2 (en) | 1999-05-17 | 2011-08-23 | Sumitomo Mitsubishi Silicon Corporation | Double side polishing method and apparatus |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857123A (en) * | 1970-10-21 | 1974-12-31 | Monsanto Co | Apparatus for waxless polishing of thin wafers |
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
US4194324A (en) * | 1978-01-16 | 1980-03-25 | Siltec Corporation | Semiconductor wafer polishing machine and wafer carrier therefor |
JPS5542738A (en) * | 1978-09-20 | 1980-03-26 | Toshiba Corp | Abrasive grain processing device |
JPS58223561A (en) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | Polishing machine |
JPS59227361A (en) * | 1983-06-07 | 1984-12-20 | Supiide Fuamu Kk | Surface grinder |
US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
US4918870A (en) * | 1986-05-16 | 1990-04-24 | Siltec Corporation | Floating subcarriers for wafer polishing apparatus |
US5035087A (en) * | 1986-12-08 | 1991-07-30 | Sumitomo Electric Industries, Ltd. | Surface grinding machine |
-
1993
- 1993-06-10 DE DE4392793T patent/DE4392793T1/en not_active Ceased
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857123A (en) * | 1970-10-21 | 1974-12-31 | Monsanto Co | Apparatus for waxless polishing of thin wafers |
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
US4194324A (en) * | 1978-01-16 | 1980-03-25 | Siltec Corporation | Semiconductor wafer polishing machine and wafer carrier therefor |
JPS5542738A (en) * | 1978-09-20 | 1980-03-26 | Toshiba Corp | Abrasive grain processing device |
JPS58223561A (en) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | Polishing machine |
JPS59227361A (en) * | 1983-06-07 | 1984-12-20 | Supiide Fuamu Kk | Surface grinder |
US4918870A (en) * | 1986-05-16 | 1990-04-24 | Siltec Corporation | Floating subcarriers for wafer polishing apparatus |
US5035087A (en) * | 1986-12-08 | 1991-07-30 | Sumitomo Electric Industries, Ltd. | Surface grinding machine |
US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19648066A1 (en) * | 1996-07-09 | 1998-01-22 | Lg Semicon Co Ltd | Chemical mechanical polishing device for semiconductor wafers |
DE19648066C2 (en) * | 1996-07-09 | 2002-01-31 | Lg Semicon Co Ltd | Chemical mechanical polishing device for semiconductor wafers |
US8002610B2 (en) | 1999-05-17 | 2011-08-23 | Sumitomo Mitsubishi Silicon Corporation | Double side polishing method and apparatus |
DE10081456B3 (en) * | 1999-05-17 | 2016-09-15 | Kashiwara Machine Mfg. Co., Ltd. | Apparatus for double-sided polishing |
DE10081456B9 (en) * | 1999-05-17 | 2016-11-03 | Kashiwara Machine Mfg. Co., Ltd. | Apparatus for double-sided polishing |
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Legal Events
Date | Code | Title | Description |
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AC | Divided out of |
Ref country code: DE Ref document number: 4345408 Format of ref document f/p: P Ref country code: DE Ref document number: 4345407 Format of ref document f/p: P |
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AC | Divided out of |
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OP8 | Request for examination as to paragraph 44 patent law | ||
AC | Divided out of |
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8127 | New person/name/address of the applicant |
Owner name: SPEEDFAM-IPEC CORP.(N.D.GES.D.STAATES DELAWARE), C |
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AC | Divided out of |
Ref country code: DE Ref document number: 4345407 Format of ref document f/p: P |
|
8131 | Rejection |