DE4392793T1 - Method and device for polishing wafers - Google Patents

Method and device for polishing wafers

Info

Publication number
DE4392793T1
DE4392793T1 DE4392793T DE4392793T DE4392793T1 DE 4392793 T1 DE4392793 T1 DE 4392793T1 DE 4392793 T DE4392793 T DE 4392793T DE 4392793 T DE4392793 T DE 4392793T DE 4392793 T1 DE4392793 T1 DE 4392793T1
Authority
DE
Germany
Prior art keywords
polishing wafers
wafers
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4392793T
Other languages
German (de)
Inventor
Chris E Karlsrud
Woerkom Anthony G Van
Shigeru Odagiri
Isao Nagahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/898,876 external-priority patent/US5329732A/en
Application filed by Speedfam Corp filed Critical Speedfam Corp
Publication of DE4392793T1 publication Critical patent/DE4392793T1/en
Ceased legal-status Critical Current

Links

DE4392793T 1992-06-15 1993-06-10 Method and device for polishing wafers Ceased DE4392793T1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/898,876 US5329732A (en) 1992-06-15 1992-06-15 Wafer polishing method and apparatus
DE4345407A DE4345407C2 (en) 1992-06-15 1993-06-10 Computer controlled device for polishing a surface of a thin material wafer
PCT/US1993/005541 WO1993025347A1 (en) 1992-06-15 1993-06-10 Wafer polishing method and apparatus

Publications (1)

Publication Number Publication Date
DE4392793T1 true DE4392793T1 (en) 1997-07-31

Family

ID=25932691

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4392793T Ceased DE4392793T1 (en) 1992-06-15 1993-06-10 Method and device for polishing wafers

Country Status (1)

Country Link
DE (1) DE4392793T1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648066A1 (en) * 1996-07-09 1998-01-22 Lg Semicon Co Ltd Chemical mechanical polishing device for semiconductor wafers
US8002610B2 (en) 1999-05-17 2011-08-23 Sumitomo Mitsubishi Silicon Corporation Double side polishing method and apparatus

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857123A (en) * 1970-10-21 1974-12-31 Monsanto Co Apparatus for waxless polishing of thin wafers
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4194324A (en) * 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device
JPS58223561A (en) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd Polishing machine
JPS59227361A (en) * 1983-06-07 1984-12-20 Supiide Fuamu Kk Surface grinder
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
US5035087A (en) * 1986-12-08 1991-07-30 Sumitomo Electric Industries, Ltd. Surface grinding machine

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857123A (en) * 1970-10-21 1974-12-31 Monsanto Co Apparatus for waxless polishing of thin wafers
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4194324A (en) * 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device
JPS58223561A (en) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd Polishing machine
JPS59227361A (en) * 1983-06-07 1984-12-20 Supiide Fuamu Kk Surface grinder
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
US5035087A (en) * 1986-12-08 1991-07-30 Sumitomo Electric Industries, Ltd. Surface grinding machine
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648066A1 (en) * 1996-07-09 1998-01-22 Lg Semicon Co Ltd Chemical mechanical polishing device for semiconductor wafers
DE19648066C2 (en) * 1996-07-09 2002-01-31 Lg Semicon Co Ltd Chemical mechanical polishing device for semiconductor wafers
US8002610B2 (en) 1999-05-17 2011-08-23 Sumitomo Mitsubishi Silicon Corporation Double side polishing method and apparatus
DE10081456B3 (en) * 1999-05-17 2016-09-15 Kashiwara Machine Mfg. Co., Ltd. Apparatus for double-sided polishing
DE10081456B9 (en) * 1999-05-17 2016-11-03 Kashiwara Machine Mfg. Co., Ltd. Apparatus for double-sided polishing

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