DE69618882D1 - Method and device for polishing semiconductor substrates - Google Patents

Method and device for polishing semiconductor substrates

Info

Publication number
DE69618882D1
DE69618882D1 DE69618882T DE69618882T DE69618882D1 DE 69618882 D1 DE69618882 D1 DE 69618882D1 DE 69618882 T DE69618882 T DE 69618882T DE 69618882 T DE69618882 T DE 69618882T DE 69618882 D1 DE69618882 D1 DE 69618882D1
Authority
DE
Germany
Prior art keywords
semiconductor substrates
polishing semiconductor
polishing
substrates
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69618882T
Other languages
German (de)
Other versions
DE69618882T2 (en
Inventor
Tomoyasu Murakami
Mikio Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69618882D1 publication Critical patent/DE69618882D1/en
Publication of DE69618882T2 publication Critical patent/DE69618882T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69618882T 1995-09-08 1996-08-29 Method and device for polishing semiconductor substrates Expired - Lifetime DE69618882T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23135595 1995-09-08

Publications (2)

Publication Number Publication Date
DE69618882D1 true DE69618882D1 (en) 2002-03-14
DE69618882T2 DE69618882T2 (en) 2002-07-11

Family

ID=16922329

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69618882T Expired - Lifetime DE69618882T2 (en) 1995-09-08 1996-08-29 Method and device for polishing semiconductor substrates

Country Status (4)

Country Link
US (1) US5866480A (en)
EP (1) EP0763402B1 (en)
KR (1) KR970018240A (en)
DE (1) DE69618882T2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833552B2 (en) * 1995-10-19 1998-12-09 日本電気株式会社 Wafer polishing method and polishing apparatus
JPH10329011A (en) 1997-03-21 1998-12-15 Canon Inc Precise polishing device and method
US5921849A (en) * 1997-06-04 1999-07-13 Speedfam Corporation Method and apparatus for distributing a polishing agent onto a polishing element
JP2000216120A (en) * 1999-01-27 2000-08-04 Mitsubishi Electric Corp Polisher and manufacturing semiconductor device using the same
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
JP2001138233A (en) * 1999-11-19 2001-05-22 Sony Corp Grinding apparatus, grinding method and cleaning method of grinding tool
US6887132B2 (en) * 2001-09-10 2005-05-03 Multi Planar Technologies Incorporated Slurry distributor for chemical mechanical polishing apparatus and method of using the same
JP4101609B2 (en) * 2001-12-07 2008-06-18 大日本スクリーン製造株式会社 Substrate processing method
JP2003324085A (en) * 2002-05-01 2003-11-14 Mitsubishi Electric Corp Device and method for polishing semiconductor wafer
US7128803B2 (en) * 2002-06-28 2006-10-31 Lam Research Corporation Integration of sensor based metrology into semiconductor processing tools
US7309618B2 (en) 2002-06-28 2007-12-18 Lam Research Corporation Method and apparatus for real time metal film thickness measurement
JP2005271151A (en) * 2004-03-25 2005-10-06 Toshiba Corp Polishing apparatus and polishing method
JP5298383B2 (en) * 2007-04-25 2013-09-25 Ｅｓファイバービジョンズ株式会社 Heat-adhesive conjugate fiber excellent in bulkiness and flexibility and fiber molded article using the same
KR101110268B1 (en) * 2010-04-30 2012-02-16 삼성전자주식회사 Chemical mechanical polishing system which prevents air pressure tube electric wires from being twisted
TWI517935B (en) * 2013-04-16 2016-01-21 國立台灣科技大學 Supplying system of adding gas into slurry and method thereof
JP6975078B2 (en) 2018-03-15 2021-12-01 キオクシア株式会社 Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment
JP7162465B2 (en) 2018-08-06 2022-10-28 株式会社荏原製作所 Polishing device and polishing method
JP7083722B2 (en) 2018-08-06 2022-06-13 株式会社荏原製作所 Polishing equipment and polishing method
CN111113224B (en) * 2019-12-27 2020-11-27 绍兴圣万特热流道有限公司 Automatic machining equipment for hot runner mold

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4910155A (en) * 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5341602A (en) * 1993-04-14 1994-08-30 Williams International Corporation Apparatus for improved slurry polishing
JP2903980B2 (en) * 1993-11-30 1999-06-14 信越半導体株式会社 Wafer polishing method and apparatus
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate

Also Published As

Publication number Publication date
KR970018240A (en) 1997-04-30
EP0763402B1 (en) 2002-01-30
EP0763402A1 (en) 1997-03-19
DE69618882T2 (en) 2002-07-11
US5866480A (en) 1999-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP