DE69703312D1 - Device and method for polishing semiconductor wafers - Google Patents

Device and method for polishing semiconductor wafers

Info

Publication number
DE69703312D1
DE69703312D1 DE69703312T DE69703312T DE69703312D1 DE 69703312 D1 DE69703312 D1 DE 69703312D1 DE 69703312 T DE69703312 T DE 69703312T DE 69703312 T DE69703312 T DE 69703312T DE 69703312 D1 DE69703312 D1 DE 69703312D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
polishing semiconductor
polishing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69703312T
Other languages
German (de)
Other versions
DE69703312T2 (en
Inventor
Teruaki Fukami
Kiyoshi Suzuki
Toshio Azito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69703312D1 publication Critical patent/DE69703312D1/en
Publication of DE69703312T2 publication Critical patent/DE69703312T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
DE69703312T 1996-03-25 1997-03-19 Device and method for polishing semiconductor wafers Expired - Fee Related DE69703312T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6799796 1996-03-25
JP05450497A JP3384530B2 (en) 1996-03-25 1997-03-10 Apparatus and method for polishing semiconductor wafer

Publications (2)

Publication Number Publication Date
DE69703312D1 true DE69703312D1 (en) 2000-11-23
DE69703312T2 DE69703312T2 (en) 2001-02-22

Family

ID=26395260

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703312T Expired - Fee Related DE69703312T2 (en) 1996-03-25 1997-03-19 Device and method for polishing semiconductor wafers

Country Status (4)

Country Link
EP (1) EP0798079B1 (en)
JP (1) JP3384530B2 (en)
DE (1) DE69703312T2 (en)
MY (1) MY132494A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121407A (en) 1999-10-21 2001-05-08 Nec Corp Polisher
JP4657412B2 (en) * 1999-12-10 2011-03-23 エルエスアイ コーポレーション Apparatus and method for polishing a semiconductor wafer
JP4510362B2 (en) * 2001-11-30 2010-07-21 俊郎 土肥 CMP apparatus and CMP method
JP2004075859A (en) * 2002-08-19 2004-03-11 Chubu Kiresuto Kk Method for cleaning polishing slurry
KR101088594B1 (en) * 2003-03-18 2011-12-06 노무라마이크로사이엔스가부시키가이샤 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
JP4551167B2 (en) * 2004-09-14 2010-09-22 日本化学工業株式会社 Semiconductor wafer polishing apparatus and polishing method using the same
JP2006346753A (en) * 2005-06-13 2006-12-28 Nomura Micro Sci Co Ltd Method of decontaminating polishing slurry contaminated with metal
TWI417430B (en) * 2006-08-25 2013-12-01 Applied Materials Inc Method and system for point of use treatment of substrate polishing fluids
JP2010167551A (en) 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd Method for regenerating used slurry
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
CN104552002A (en) * 2014-12-29 2015-04-29 苏州用朴合金工具有限公司 Cooling liquid recycling system for CBN (cubic boron nitride) grinding wheel processing based on hard alloy rod
JP6454599B2 (en) 2015-05-14 2019-01-16 株式会社ディスコ Polishing equipment
JP6844970B2 (en) * 2016-08-18 2021-03-17 株式会社ディスコ Polishing equipment
JP7000102B2 (en) * 2017-09-29 2022-01-19 株式会社フジミインコーポレーテッド Polishing method and polishing composition
JP6946166B2 (en) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 Polishing equipment and polishing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JP3150990B2 (en) * 1991-03-25 2001-03-26 旭化成株式会社 Treatment method for Ga-As polishing wastewater
EP0639534B1 (en) * 1993-08-16 1999-11-10 Ebara Corporation Waste treatment system in a polishing apparatus

Also Published As

Publication number Publication date
MY132494A (en) 2007-10-31
DE69703312T2 (en) 2001-02-22
JPH09314466A (en) 1997-12-09
EP0798079A2 (en) 1997-10-01
EP0798079A3 (en) 1998-03-25
EP0798079B1 (en) 2000-10-18
JP3384530B2 (en) 2003-03-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee