MY132494A - Polishing apparatus and polishing method for silicon wafers - Google Patents

Polishing apparatus and polishing method for silicon wafers

Info

Publication number
MY132494A
MY132494A MYPI97001183A MYPI19971183A MY132494A MY 132494 A MY132494 A MY 132494A MY PI97001183 A MYPI97001183 A MY PI97001183A MY PI19971183 A MYPI19971183 A MY PI19971183A MY 132494 A MY132494 A MY 132494A
Authority
MY
Malaysia
Prior art keywords
polishing
polishing slurry
semiconductor wafers
turn table
silicon wafers
Prior art date
Application number
MYPI97001183A
Inventor
Fukami Teruaki
Azito Toshio
Suzuki Kiyoshi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY132494A publication Critical patent/MY132494A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A POLISHING APPARATUS AND A POLISHING METHOD FOR SEMICONDUCTOR WAFERS ARE PROVIDED, WHEREBY HEAVY METAL CONTAMINATION OF SEMICONDUCTOR WAFERS CAN BE PREVENTED EFFECTIVELY IN A POLISHING PROCESS.A POLISHING APPARATUS OF SEMICONDUCTOR WAFERS INCLUDING A TURN TABLE ASSEMBLY HAVING A ROTATABLY FIXED TURN TABLE AND A POLISHING SLURRY TANK FOR STORING POLISHING SLURRY TO BE SUPLIED ONTO THE TURN TABLE WITH A POLISHING SLURRY SUPPLYING MEMBER, WHEREIN THE POLISHING SLURRY SUPPLYING MEMBER IS PROVIDED WITH MEANS FOR ELIMINATING HEAVY METAL IONS FROM THE POLISHING SLURRY.(FIG. 1)
MYPI97001183A 1996-03-25 1997-03-20 Polishing apparatus and polishing method for silicon wafers MY132494A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6799796 1996-03-25
JP05450497A JP3384530B2 (en) 1996-03-25 1997-03-10 Apparatus and method for polishing semiconductor wafer

Publications (1)

Publication Number Publication Date
MY132494A true MY132494A (en) 2007-10-31

Family

ID=26395260

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI97001183A MY132494A (en) 1996-03-25 1997-03-20 Polishing apparatus and polishing method for silicon wafers

Country Status (4)

Country Link
EP (1) EP0798079B1 (en)
JP (1) JP3384530B2 (en)
DE (1) DE69703312T2 (en)
MY (1) MY132494A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121407A (en) 1999-10-21 2001-05-08 Nec Corp Polisher
JP4657412B2 (en) * 1999-12-10 2011-03-23 エルエスアイ コーポレーション Apparatus and method for polishing a semiconductor wafer
JP4510362B2 (en) * 2001-11-30 2010-07-21 俊郎 土肥 CMP apparatus and CMP method
JP2004075859A (en) * 2002-08-19 2004-03-11 Chubu Kiresuto Kk Method for cleaning polishing slurry
KR101088594B1 (en) 2003-03-18 2011-12-06 노무라마이크로사이엔스가부시키가이샤 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
JP4551167B2 (en) * 2004-09-14 2010-09-22 日本化学工業株式会社 Semiconductor wafer polishing apparatus and polishing method using the same
JP2006346753A (en) * 2005-06-13 2006-12-28 Nomura Micro Sci Co Ltd Method of decontaminating polishing slurry contaminated with metal
TWI417430B (en) * 2006-08-25 2013-12-01 Applied Materials Inc Method and system for point of use treatment of substrate polishing fluids
JP2010167551A (en) 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd Method for regenerating used slurry
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
CN104552002A (en) * 2014-12-29 2015-04-29 苏州用朴合金工具有限公司 Cooling liquid recycling system for CBN (cubic boron nitride) grinding wheel processing based on hard alloy rod
JP6454599B2 (en) 2015-05-14 2019-01-16 株式会社ディスコ Polishing equipment
JP6844970B2 (en) 2016-08-18 2021-03-17 株式会社ディスコ Polishing equipment
JP7000102B2 (en) * 2017-09-29 2022-01-19 株式会社フジミインコーポレーテッド Polishing method and polishing composition
JP6946166B2 (en) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 Polishing equipment and polishing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (en) * 1983-04-11 1984-10-27 Nec Corp Circulative use of waste water used for grinding silicon wafer
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JP3150990B2 (en) * 1991-03-25 2001-03-26 旭化成株式会社 Treatment method for Ga-As polishing wastewater
KR100386965B1 (en) * 1993-08-16 2003-10-10 가부시키 가이샤 에바라 세이사꾸쇼 Waste treatment system in a polishing apparatus

Also Published As

Publication number Publication date
JPH09314466A (en) 1997-12-09
EP0798079A3 (en) 1998-03-25
EP0798079A2 (en) 1997-10-01
DE69703312D1 (en) 2000-11-23
DE69703312T2 (en) 2001-02-22
JP3384530B2 (en) 2003-03-10
EP0798079B1 (en) 2000-10-18

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