JPS5815265B2 - Automatic shape correction polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION In order to make a pattern formed in advance on a semiconductor substrate appear uniformly over the entire surface of the substrate, the present invention controls the processing system based on the measurement data of the mark detection system. The present invention relates to an automatic shape correction polishing device.

In a semiconductor substrate, as shown in FIG.
■ After forming a pattern such as grooves 3 on the substrate and depositing a different material on it to form a growth layer 2, the growth surface C is formed.
There is a method in which the growth layer 2 is used as a supporting substrate by polishing from the back side B of the substrate, and the original substrate 1 is left in a pattern.

In this case, when polishing from the B side, as shown in Figure 2a, the concave polishing state has progressed so that the pattern appears only near the center, and as shown in Figure 2 The pattern may not be evenly formed on the left and right sides because it has been polished by hand.

For practical substrates, correction processing is performed during the polishing process, but in the conventional method, polishing is temporarily stopped and the processed surface is observed with a microscope, and depending on the appearance of the pattern, for example, as shown in Figure 2 a, In the case shown in Figure 2, it was corrected to make it convex, and in the case shown in Figure 2, one side was polished more.

Therefore, this method has the drawback that it takes time and effort, and the production rate is extremely low, as the polishing has to be stopped many times during the polishing process, and a person makes judgments under a microscope, and each time calculates the amount of correction and performs the correction process. there were.

In order to solve these drawbacks, the present invention optically automatically detects detection mark patterns placed at multiple locations on the substrate, uses calculations to determine the depth deviation from the required polishing surface, and performs polishing based on this. The feature is that this cycle is performed unattended from the substrate cassette before polishing to the storage cassette after polishing, so that the movement of the jig tool is reflected and the process is automatically corrected to the desired shape and finished. This will be explained in detail below with reference to the drawings.

FIG. 3 shows an embodiment of the present invention.

1 is a substrate to be processed, and a processing station (2), a cleaning station (2), a measurement station (2), and a substrate attachment/detachment station (3) are arranged on the circumference of a circular table 40.

In the machining station ■, 5 is a rotary tool for polishing, 6 is a column for the tool axis, in the cleaning station ■, 7 is a scrubber brush for cleaning, 8 is a water injection nozzle, 9 is a N2 gas injection nozzle, = measuring stainless steel [n is 10 1 is an imaging lens, 11 is a light source, 12 is an eyepiece lens, 13 is a vacuum suction arm in the substrate attachment/detachment station (1), 14 is a substrate supply cassette before processing, 15 is a substrate storage cassette after processing, 1
6 is a processed substrate holding stage fixed on the circular table 4.

Further, each station is connected by a control line 17.

To operate this, the unprocessed substrate 1 carried out from the substrate supply cassette 14 by the arm 13 is held on the substrate holding stage 16 by vacuum suction, the circular table 4 is rotated, and the rotary polishing tool is moved to the processing station (2). 5, the surface is polished to a certain thickness to reveal a detection pattern made in advance.

Next, the circular table 4 is rotated and the cleaning scrubber brush 1 is rotated and pressed against the processing surface in the cleaning station IC, water is poured from the water injection nozzle 8 for cleaning, and after completion, it is dried by N2 gas from the gas injection nozzle 9. let

Furthermore, the circular table 4 is rotated and a plurality of patterns near the outer periphery and center of one substrate are measured using the imaging lens 10, the light source 11, and the eyepiece lens 12 at the measurement station ■, and the results are calculated to form a uniform pattern. The deviation of each part of the substrate 1 is determined from the above, the part of the substrate 1 to be polished thicker is determined, the direction is determined by operating the substrate holding stage 16, and the direction is determined by operating the substrate holding stage 16.
is operated to give an inclination in a specific direction to match the direction in which the substrate 1 is to be polished more thickly.Then, the circular table 4 is rotated to approach the processing station (2), and a predetermined polishing is performed.

These operations are performed by a control unit provided in the main body of the device, and this cycle is repeated. When it is determined that the pattern has been uniformly exposed on the entire substrate 1 at the measuring station (2), the arm 13C is moved at the board loading/unloading station (2). The next unprocessed substrate 1 is then transferred to the substrate storage cassette 15 and mounted on the substrate holding stage 16 again.

During the process, commands for the movement of each station are transmitted through the control line 17 based on measurement data.

Although various methods of polishing a specific shape can be considered, FIG. 4 is a conceptual diagram of one embodiment in which the substrate holding stage 16 has this function.

1 is a substrate to be processed, 5 is a rotating tool for polishing, 161 is a plate for holding the substrate, 162 is a wedge for forming an inclination angle, 163 is a rotating shaft,
164 is a fixed surface plate.

When the amount and direction of the inclined polishing is determined at the measurement station ■, the part of the substrate 1 to be polished more thickly is moved to the position 162 by relative rotation of the substrate holding disk 161 to the substrate 1, and the required inclination is set. The purpose can be achieved by setting by pressing the blade 162, rotating the circular table 4, and polishing with the rotary polishing tool 5.

Note that the arrangement of the stations 1 to 2 does not have to be circular as shown in the embodiment of FIG. 3, but can be arranged in a straight line to polish the substrate 1 placed on the reciprocating table.

As explained above with reference to the embodiment shown in the drawings,
By arranging a force meter station, a cleaning station, a measurement station, and a substrate attachment/detachment station in one polishing device, the pattern exposed on the processing surface is automatically detected, the shape to be processed is determined, and the substrate is polished into the desired shape. Because it is a device that can perform processing, if you set a cassette loaded with unprocessed substrates, it will automatically polish the shape and produce a substrate with a uniform pattern over the entire surface of the substrate, improving efficiency and yield. However, it has the advantage of reducing substrate cost.

[Brief explanation of drawings]

Figure 1 is a sectional view showing an example of a force meter semiconductor substrate, Figure 2
Figure ayb is a conceptual diagram showing an example of failure in uniform processing of a substrate, Figure 3 is a plan view showing an embodiment of the apparatus of the present invention, and Figure 4
The figure is a sectional view showing an example of shape polishing. In the drawing, 1 is a substrate to be processed, 2 is a growth layer, 3 is a groove, 4 is a circular table, 5 is a rotary tool for polishing, 6 is a column for a tool shaft, 7 is a scrubber brush for cleaning, 8 is a water injection nozzle, 9 is a gas injection nozzle, 10 is an imaging lens, 11 is a light source, 12 is an eyepiece, 13 is an arm, 14 is a substrate supply cassette, 15 is a substrate storage cassette, 16 is a substrate holding stage, 161 is a substrate holding disk, Reference numeral 162 indicates a tilt angle forming member, 163 indicates a rotating shaft, 164 indicates a fixed surface plate, and 17 indicates a control line.

Claims (1)

[Claims] 1 A processing station where a polishing device is installed, a cleaning station where a cleaning device is installed, a measurement station where a measurement optical system is installed, and an attachment/detachment device are installed on the circumference of a rotary table or a reciprocating table or in the middle of table movement. In an automatic polishing apparatus, a substrate holding stage is fixed on the table, and the stations are connected by a control line. An optical system is provided for optically detecting a plurality of mark patterns on each semiconductor substrate, which is polished from the back side using the growth surface as a reference after a growth layer is formed by depositing a material. The attachment/detachment station incorporates each inclination forming device, and is provided with a control section that calculates the measurement data of the measurement station, determines a depth deviation from the polishing surface, and instructs this to the formation of the inclination angle of the substrate holding stage, An automatic shape correction polishing apparatus characterized in that it is configured to repeat a measurement-polishing-measurement cycle until the pattern becomes uniform over the entire surface of the substrate.