KR102524072B1 - Circuit board grinding system and grinding method - Google Patents

Abstract

The present invention provides a loading unit for transferring a substrate to be processed having molds formed on the upper and lower sides to a corresponding designated position, and a grinding means disposed near the loading unit and grinding the mold of the substrate to be processed transferred from the loading unit. The difference between the mold thickness (a) of the processing surface side of the substrate to be processed and the total thickness (b) of the substrate to be processed measured by the work table provided and the control unit electrically connected to the loading unit, the work table and the grinding means, Calculate the total thickness (c) of the non-processing surface side of the substrate to be processed, and the sum of the calculated total thickness (c) of the non-processing surface side and the predetermined processing target thickness (d) of the mold on the processing surface side, The target thickness (e) is calculated, and the grinding means is located based on the total thickness (b) of the substrate to be processed, which determines the grinding process start position, the measured mold thickness (a) on the processing surface side, and the preset processing The driving of the grinding means is controlled based on the difference between the processing target thickness (d) of the surface-side mold, the processing thickness of the processing surface side of the processing substrate and the target thickness (e) of the processing substrate, and Provided is a circuit board grinding system and a grinding processing method capable of preventing the remaining mold from being too thin.

Description

Circuit board grinding system and its grinding processing method {Circuit board grinding system and grinding method}

The present invention relates to a circuit board grinding system and a method for grinding the same, and more particularly, based on the thickness of a mold on the surface to be machined and the total thickness of the circuit board in which molds are formed on the upper and lower surfaces of the circuit board, respectively. A circuit board that calculates the total thickness of the non-machined surface side, calculates the target thickness of the mold on the machined surface side based on the calculated total thickness of the non-machined surface side, and grinds and processes the mold on the machined surface side based on the calculated target thickness of the mold on the machined surface side. It relates to a grinding system and its grinding processing method.

BACKGROUND OF THE INVENTION Generally during the fabrication of a semiconductor device, multiple layers of material are deposited, patterned, and etched to form electronic circuitry or electrical connections on a substrate, the top surface of which may be planarized between processing steps.

Such planarization is typically performed using an etch-back step or chemical mechanical polishing (CMP).

During the chemical mechanical polishing process described above, a substrate is placed face down on a polishing pad, pressed toward the polishing pad through a polishing head in the presence of a slurry, and rotated by the polishing pad.

The slurry may contain abrasive particles, or chemicals that aid in the removal of material from the substrate, and polishing is continued until sufficient material is removed to form a smooth surface on the substrate.

It is important to maintain uniformity across the substrate during CMP to ensure uniform layer thickness for devices formed on the substrate.

However, maintaining thickness uniformity across the entire surface of a substrate is difficult, especially for larger diameter substrates. Therefore, for large substrate sizes, methods and apparatus are needed to improve uniformity during chemical mechanical polishing.

As a prior art to solve this problem, Patent Publication No. 10-2015-0005672 (2015.01.14) was provided.

However, in the case of a circuit board whose surface is finished with a mold, conventionally, after measuring the entire thickness of the workpiece (circuit board), grinding was performed to achieve a target thickness from the measured overall thickness, but in this case, the thickness and processing of the workpiece Since the thickness of the face-side mold was not reflected, there was a problem in that the thickness of the remaining mold remaining after processing was too thin.

The present invention sets a target thickness based on the thickness of the mold on the processing surface side and the total thickness of the workpiece, thereby preventing the thickness of the remaining mold remaining after processing from becoming too thin. Provide a grinding system for a circuit board and a method for grinding the same to do for that purpose.

A circuit board grinding system according to the present invention includes a loading unit for transferring a substrate to be processed having molds formed on the upper and lower sides to a corresponding designated position, and a substrate to be processed disposed near the loading unit and taken over from the loading unit. A work table having a grinding means for grinding a mold, and electrically connected to the loading part, the work table and the grinding means, the measured mold thickness (a) on the processing surface side of the substrate to be processed, and the total thickness of the substrate to be processed ( With the difference of b), the total thickness (c) of the non-processing surface side of the substrate is calculated, and the total thickness (c) of the non-processing surface side is calculated as the sum of the predetermined processing target thickness (d) of the machined surface side mold. , Calculate the target thickness (e) of the substrate to be processed, position the grinding means based on the total thickness (b) of the substrate to be processed, which determines the grinding process start position, and measure the mold thickness (a) on the processing surface side ) and the predetermined processing target thickness (d) of the mold on the processing surface side, driving the grinding means based on the calculated processing thickness on the processing surface side of the substrate to be processed and the target thickness (e) of the substrate to be processed. It includes a control unit for controlling.

At this time, the work table according to the present invention includes a turntable rotating with respect to a central axis provided at the center, and radially divides the first, second, third, and fourth work areas with respect to the central axis, and the partitioned second Each of the first, second, third, and fourth work areas is equipped with a grinding means, and is disposed on each of the first, second, third, and fourth work areas of the work table divided radially, and is transferred from the loading unit. A plurality of processing tables for seating and supporting received substrates, a robot arm provided at one side of the first work area among the work areas, and picking up the substrates to be processed transported by the loading unit with a picker and placing them on the processing table; , a first grinding unit provided in a second work area of the work area and performing primary grinding processing on a substrate to be processed placed on a processing table located in the second work area; a second grinding means for performing secondary grinding on a substrate placed on a processing table located in the third work area; and provided in a fourth work area among the work areas and located in the fourth work area. and a third grinding means for polishing the substrate to be processed placed on the processing table to be processed.

Here, the loading unit according to the present invention receives a substrate to be processed for forming a mold on the upper and lower sides, respectively, and a strip loader that transfers the substrate to be processed to a corresponding designated position, and is disposed near the strip loader, and the strip loader and a loading shuttle for placing the workpiece substrate handed over through the upper surface and transporting it to a designated place where the picker of the robot arm is located.

In addition, a first thickness measurement sensor provided in the loading shuttle according to the present invention to measure the thickness of the mold on the processing surface side of the substrate to be processed and output the measured value to the control unit, and a work area of the worktable divided radially a second thickness measuring sensor provided in the second work area of the work table, measuring the total thickness of the substrate to be processed and outputting the measured value to the control unit; and a third work area of the radially divided work table area. a third thickness measuring sensor provided in a third thickness measuring sensor for measuring the total thickness of the substrate to be processed and outputting the measured value to the control unit; , a fourth thickness measuring sensor for measuring the total thickness of the substrate to be processed and outputting the measured value to the control unit.

At this time, it is preferable that each of the processing tables according to the present invention selectively rotates about its center as an axis.

In addition, an unloading unit for transferring a substrate to be processed that has been subjected to grinding processing on the work table according to the present invention to a magazine is included, and the robot arm picks up the substrate to be processed located in a first work area among the work areas with a picker, and Transfer to the unloading section.

In addition, the unloading unit according to the present invention is provided near the worktable, and an unloading shuttle for transporting the substrate transported by the robot arm to a designated place by placing the upper surface thereof, and the vicinity of the unloading shuttle a strip unloader that is disposed on the unloading shuttle and takes over the substrates to be processed transported by the unloading shuttle and transports them to a designated location; It includes a magazine conveyor that transfers to the magazine.

In addition, the first work area among the work areas of the work table according to the present invention includes a brush module for cleaning the plane of the processing table located in the first work area.

A method for grinding and processing a circuit board according to the present invention comprises the steps of: i) measuring the thickness (a) of a mold on the processing side of a substrate to be processed; ii) measuring the total thickness (b) of the substrate to be processed; iii) calculating the total thickness (c) of the non-processing surface side of the substrate to be processed by the difference between the total thickness (b) of the substrate to be processed and the thickness (a) of the mold on the processing surface side; iv) the calculated ratio Calculating the target thickness (e) of the substrate to be processed from the sum of the total thickness (c) of the processing surface side and the predetermined target processing thickness (d) of the processing surface side mold, and v) the measured thickness of the processing surface side mold (a) and the difference between the predetermined processing target thickness (d) of the mold on the processing surface side, determining the grinding processing thickness of the processing surface side of the substrate to be processed, and vi) the total thickness (b) of the substrate to be processed Grinding the substrate to be processed by determining the grinding process start position based on and controlling the grinding means based on the thickness of the grinding process on the processing surface side of the substrate to be processed and the target thickness (e) of the substrate to be processed. includes

Effects of the circuit board grinding system and the grinding processing method according to the present invention are as follows.

By setting the target thickness based on the thickness of the mold on the processing surface side and the total thickness of the workpiece, it is possible to prevent the thickness of the remaining mold remaining after processing from being too thin.

1 is an exemplary view showing a grinding system for a circuit board according to an embodiment of the present invention.
2 is an exemplary view schematically illustrating a process of calculating a mold grinding thickness of a processing surface side of a circuit board in a circuit board grinding system according to an embodiment of the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to the usual or dictionary meaning, and the inventor appropriately uses the concept of the term in order to explain his/her invention in the best way. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical spirit of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all of the technical ideas of the present invention, so at the time of the present application, they are equivalent alternatives that can be replaced. It should be understood that variations may exist.

The present invention calculates the total thickness of the non-machined surface side based on the mold thickness of the machined surface side of the circuit board in which molds are formed on the upper and lower surfaces, respectively, and the total thickness of the circuit board, and based on the calculated total thickness of the non-machined surface side. Calculate the target thickness of the mold on the machined surface side with the calculated target thickness of the mold on the machined surface side, and it relates to a circuit board grinding system and its grinding processing method for grinding the machined surface side mold based on the calculated target thickness of the mold on the machined surface side. Same as

A circuit board grinding system according to an embodiment of the present invention includes a loading unit 100, a work table 200, a plurality of processing tables 300, a robot arm 400, a first grinding unit 500, and a second grinding unit. It includes a means 600, a third grinding means 700, an unloading unit 800 and a control unit 900, wherein the loading unit 100 has molds 12 and 13 on the upper and lower sides of the circuit board 11. ) is transferred to the designated position.

At this time, the loading unit 100 according to an embodiment of the present invention includes a strip loader 110 and a loading shuttle 120, and the strip loader 110 has molds 12 and 13 on the upper and lower sides, respectively. After the forming process is completed, the substrate 10 to be processed is turned upside down so that the bottom surface (lower mold) of the substrate 10 faces upward to the designated position.

In addition, the loading shuttle 120 is disposed on one side of the strip loader 110, and the workpiece substrate 10 received through the strip loader 110 is placed on the upper surface, so that the picker of the robot arm 400 is positioned. transported to the designated location.

Here, a strip input 111 is provided between the strip loader 110 and the loading shuttle 120, and each of the loading shuttle 120 and the strip input 111 moves the shuttle along a linear guide bar placed to a corresponding point. In this type, the shuttle fixes the substrate to be processed 10 by vacuum adsorption, so that the substrate to be processed 10 is not damaged or jammed while the substrate to be processed 10 is transferred.

In addition, the loading shuttle 120 includes a laser scan sensor, and the laser scan sensor includes a barcode formed on the substrate 10 transported by the loading shuttle 120 and a state of the substrate 10. (Check whether the designated side of the upper or lower side is facing upward), etc. are scanned.

In addition, the loading shuttle 120 is further provided with a first thickness measurement sensor 121, the first thickness measurement sensor 121 is a laser sensor, is placed in the loading shuttle 120, the loading shuttle 120 ) to measure the thickness (a) of the lower mold 13, which is a mold on the processing surface side of the substrate 10 to be processed transported to the designated position, and outputs the measured value to the control unit 900.

Here, when the substrate 10 to be processed is placed in the loading shuttle 120, since the lower mold 13, which is a mold on the processing surface side, is turned upside down and placed therein, the lower mold 13 of the substrate 10 to be processed is placed. It is exposed to the outside (top), and the thickness (a) of the mold on the processing surface side of the processing substrate 10 is measured through the first thickness measurement sensor 121 .

A work table 200 is disposed near the loading unit 100 having the above configuration, and the work table 200 includes grinding means 500, 600, 700), which is a work area in which grinding processing of the substrate 10 is performed, and a disk-shaped turntable 210 is provided therein.

At this time, the center of the turntable 210 is the center of the work area and has a central shaft 211, and the turntable 210 preferably rotates counterclockwise by 90° with respect to the central shaft 211. do.

In addition, the work table 200 having the turntable 210 inside divides the work area along with the turntable 210 in a radial form based on the central axis 211, and the central axis ( 211), each processing table 300 is provided on each of the turntables 210 partitioned in a radial form.

The processing table 300 is provided on a turntable 210 located in each work area partitioned in a radial shape, and the substrate 10 to be processed is placed on the upper surface thereof, so that grinding processing is performed, When the turntable 210 rotates counterclockwise by 90° with respect to the central axis 211, it rotates by 90° in conjunction with this.

Accordingly, as the turntable 210 selectively rotates by 90° in a counterclockwise direction, the substrates 10 to be processed placed on the processing tables 300 are initially located in the first work area. When the turntable 210 rotates counterclockwise by 90°, it moves from the first work area to the second work area, and when the turntable 210 rotates counterclockwise by 90°, the second work area When the turntable 210 is moved to the third work area and rotated 90° counterclockwise again, it moves from the third work area to the fourth work area, and the turntable 210 moves counterclockwise again. When rotated 90° in the direction, it moves from the fourth work area to the first work area and is positioned.

Therefore, the substrate 10 to be processed forms a circulation path that circulates from the first to the fourth work area by the rotation of the turntable 210 .

In addition, each of the processing tables 300 can be selectively rotated around the center of the processing table 300 to selectively correct the placement direction of the substrate 10 placed on the processing tables 300. there is.

A robot arm 400 is provided on one side of the first work area of the work area, and the robot arm 400 picks up the substrate 10 transported by the loading unit 100 with a picker and moves the processing table 300 ) is placed in

At this time, the robot arm 400 is preferably provided as a 6-axis robot arm like a normal robot arm, and the picker of the robot arm 400 is a workpiece transported by the loading unit 100 in a vacuum suction method. The substrate 10 is picked up and placed on the processing table 300 located in the first work area.

In addition, the robot arm 400 picks up the processed substrate 10 located in the first work area among the work areas with a picker and transfers it to the unloading unit 800 .

Therefore, when the substrate 10 to be processed is brought into a corresponding designated position through the loading unit 100, it is positioned in the first working area among the working areas of the worktable 200 by the robot arm 400 at the designated position. The substrate 10 transferred to the processing table 300 and transferred to the first work area among the work areas of the work table 200 is rotated by the turntable 210 provided inside the work table 200. Moves from the first work area to the second work area, moves from the second work area to the third work area after the lapse of the corresponding time, moves from the third work area to the fourth work area after the lapse of the corresponding time, , After the lapse of the corresponding time, it moves from the 4th work area to the 1st work area again.

Here, in the second work area of the work area, a first grinding means 500 is provided, and the first grinding means 500 is placed on the processing table 300 located in the second work area. 10) is subjected to primary grinding.

At this time, the first grinding means 500 has a disc-shaped grinding member at the bottom of a spindle that can rotate at 300 [rpm] like a normal grinding means, and a processing table 300 located in the second work area. The processing surface side of the processing substrate 10 placed in the primary grinding process (Rough grinding) is performed.

In addition, a second thickness measurement sensor 510 is provided in a second work area among the work areas of the work table 200 partitioned in a radial shape. The second thickness measurement sensor 510 is a probe type, and the second work area The entire total thickness (b) of the substrate 10 placed on the processing table 300 and/or the target thickness (e) of the substrate are measured, and the measured values are transmitted to the control unit 900. outputs

The controller 900 determines the total thickness (b) of the substrate 10 measured by the second thickness sensor 510 and/or the target thickness (e) of the substrate 10. The driving of the first grinding unit 500 and the rotation of the turntable 210 in the second working area are controlled.

In addition, a second grinding means 600 is provided in a third work area among the work areas, and the second grinding means 600 is a substrate to be processed placed on the processing table 300 located in the third work area. (10) is subjected to secondary grinding.

At this time, the second grinding means 600 also has a disc-shaped grinding member at the bottom of the spindle that can rotate at 300 [rpm] like a normal grinding means, and the processing table 300 located in the third work area. ) The processing surface side of the processing substrate 10 placed in the secondary grinding process (Fine grinding) is performed.

In addition, a third thickness measurement sensor 610 is provided in a third work area among the work areas of the work table 200 partitioned in a radial shape. The third thickness measurement sensor 610 is a probe type, and the substrate to be processed The total thickness (b) of (10) and/or the target thickness (e) of the substrate to be processed are measured, and the measured values are output to the controller 900.

The controller 900 determines the total thickness (b) of the substrate 10 measured by the third thickness sensor 610 and/or the target thickness (e) of the substrate 10. The driving of the second grinding unit 600 and the rotation of the turntable 210 in the third working area are controlled.

In addition, a third grinding means 700 is provided in the fourth work area among the work areas, and the third grinding means 700 is placed on the processing table 300 located in the fourth work area. 10) is subjected to polish grinding.

At this time, the third grinding means 700 has a disk-shaped grinding member provided at the bottom of the spindle that can rotate at 300 [rpm] like a normal grinding means, and the processing table 300 located in the fourth work area. Dry polishing is performed on the upper surface of the substrate 10 placed thereon.

In addition, a fourth thickness measuring sensor 710 is provided in a fourth working area among the working areas of the work table 200 partitioned in a radial shape. The fourth thickness measuring sensor 710 is a probe type, and the substrate to be processed The total thickness (b) of (10) and/or the target thickness (e) of the substrate to be processed are measured, and the measured values are output to the controller 900.

The controller 900 determines the total thickness (b) of the substrate 10 measured by the fourth thickness sensor 710 and/or the target thickness (e) of the substrate 10. The driving of the third grinding means 700 and the rotation of the turntable 210 in the third working area are controlled.

In addition, a brush module 220 for cleaning the surface of the processing table 300 located in the first work area is provided in a first work area among the work areas of the work table 200 .

In addition, it is preferable to provide a surface cleaner for arranging the surface of the upper mold 12 of the substrate 10 to be processed, which is handed over to the unloading unit 800 in the first work area among the work areas of the work table 200.

In addition, the substrate 10 to be processed after grinding at the work table 200 is transferred to the magazine by the unloading unit 800, which includes an unloading shuttle 810 and a strip unloading unit 800. It includes a loader 820 and a magazine conveyor 830.

First, the unloading shuttle 810 is provided on one side of the work table 200, places the substrate 10 transported by the robot arm 400 on the upper surface, and transports it to a designated place.

At this time, the unloading shuttle 810 is a type in which the shuttle moves along a linear guide bar placed to the designated place, and the shuttle fixes the substrate 10 by vacuum suction, During transfer, the substrate 10 to be processed is not damaged or jammed.

In addition, a strip unloader 820 is disposed on one side of the unloading shuttle 810, and the strip unloader 820 takes over the substrate 10 transported by the unloading shuttle 810 and receives the corresponding transported to the designated location.

Here, a magazine conveyor 830 is disposed on one side of the scrip unloader 820, and the magazine conveyor 830 transfers the substrate 10 to be processed, which is handed over by the scrip unloader 820, to the magazine.

In addition, the control unit 900 according to an embodiment of the present invention includes the loading unit 100, four processing tables 300, a robot arm 400, a first grinding unit 500, and a second grinding unit 600. , Electrically connected to the third grinding means 700, the loading unit 100, four processing tables 300, and the robot arm 400 selectively according to the degree of transfer and grinding of the substrate 10 to be processed , The first grinding means 500, the second grinding means 600, and the third grinding means 700 are controlled.

At this time, the control unit 900 determines the thickness (a) of the lower mold 13, which is a mold on the processing surface side of the substrate 10 to be processed, based on the measurement value measured by the first thickness measurement sensor 121, Based on the measured value measured by the second thickness measuring sensor 510, the total thickness b of the substrate 10 is determined, and the measured thickness of the mold on the processing side of the substrate 10 ( The total thickness c of the non-processing side of the substrate 10 is calculated from the difference between a) and the total thickness b of the substrate 10 to be processed.

Then, the target thickness (e) of the substrate to be processed is calculated as the sum of the calculated total thickness (c) on the non-machined surface side and the target processing thickness (d) of the predetermined mold on the machined surface side, and the grinding process start position is determined. The first grinding means 500, the second grinding means 600, and the third grinding means 700 are positioned based on the total thickness b of the substrate 10 to be processed.

In addition, the processing thickness of the processing surface side of the substrate to be processed calculated by the difference between the measured processing surface-side mold thickness (a) and the preset processing surface-side mold processing target thickness (d), and the target thickness of the processing substrate ( Based on e), the driving of the first grinding unit 500, the second grinding unit 600, and the third grinding unit 700 is controlled.

Therefore, the difference between the measured processing surface-side mold thickness (a) and the preset processing surface-side mold processing target thickness (d), the processing thickness of the processing surface side of the substrate to be processed calculated by the difference, and the target thickness (e) of the processing substrate Based on ), the control unit 900 includes the loading unit 100, four processing tables 300, a robot arm 400, a first grinding unit 500, a second grinding unit 600, a third The grinding means 700 is controlled.

And, based on the measurement value measured by the fourth thickness measurement sensor 610, the control unit 900 determines whether or not normal processing is performed based on the total thickness (e) of the ground substrate 10, and grinding processing It is preferable to control the processed substrate 10 to be unloaded from the work table 200 .

The grinding processing method of a circuit board according to an embodiment of the present invention is performed in the above-described circuit board grinding system. Looking again with reference to FIG. 2, first, in step i), the thickness of the mold on the processing surface side of the processing substrate a) is measured.

At this time, the processing surface-side mold is the lower mold 13 of the substrate 10 to be processed, and the thickness (a) of the lower mold 13 is measured by the first thickness measurement sensor 121 of the loading shuttle 120. and the measured value of the thickness (a) of the lower mold 13 is transmitted to the controller 900.

Then, in step ii), the total thickness b of the substrate 10 is measured.

At this time, the total thickness b of the substrate 10 is measured by the second thickness measuring sensor 510 provided in the second work area of the work table 200, and the measured substrate 10 The total thickness b of ) is transmitted to the controller 900.

Then, in step iii), the difference between the total thickness (b) of the substrate 10 to be processed and the thickness (a) of the lower mold 13, which is a mold on the processing surface, is the difference between the non-processed substrate 10 Calculate the total thickness (c) of the face side.

At this time, the thickness a of the lower mold 13, which is a mold on the processing surface, measured by the first thickness measurement sensor 121 and the second thickness measurement sensor 510, and the total thickness of the substrate 10 to be processed When (b) is transmitted to the controller 900, the controller 900 determines the difference between the total thickness (b) of the substrate 10 and the thickness (a) of the lower mold 13, which is a mold on the processing surface side. , the total thickness (c) of the non-processed side of the processing substrate 10 is calculated.

Then, in step iv), the target thickness (e) of the substrate 10 is calculated as the sum of the calculated total thickness (c) of the non-machined surface side and the preset processing target thickness (d) of the mold on the machined surface side. yields

At this time, when the control unit 900 calculates the total thickness (c) of the unprocessed side of the substrate 10 to be processed, the total thickness ( By summing c), the target thickness e of the substrate 10 is calculated.

Next, in step v), the grinding processing thickness of the processing surface side of the substrate to be processed is determined by the difference between the measured processing surface side mold thickness (a) and the preset processing surface side mold thickness (d).

Next, in step vi), the grinding process start position is determined based on the total thickness (b) of the substrate 10 to be processed, and the thickness of the grinding process on the side of the processing surface of the substrate 10 is determined. Based on the target thickness e of the substrate 10 to be processed, the substrate 10 is ground.

At this time, the control unit 200 controls the driving of the turntable 210 and the processing table 300 together with the driving of the grinding means 500, 600, 700 provided in each work area of the work table 200, Grinding is controlled until the total thickness (b) of the substrate 10 meets the target thickness (e) of the substrate 10 to be processed.

And when the total thickness (b) of the substrate to be processed 10 that has been ground meets the target thickness (e) of the substrate to be processed 10, the substrate to be processed that has been ground on the worktable 200 ( 10) is transferred to the unloading unit 800.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is only exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims.

10: substrate to be processed 11: circuit board
12: upper mold 13: lower mold
100: loading unit 110: strip loader
111: strip input 120: loading shuttle
121: first thickness measurement sensor 200: work table
210: turntable 211: central axis
220: brush module 300: processing table
400: robot arm 500: first grinding means
510: second thickness measurement sensor 600: second grinding means
610: third thickness measurement sensor 700: third grinding means
710: fourth thickness measurement sensor 800: unloading unit
810: unloading shuttle 820: strip unloader
830: magazine conveyor 900: control unit

Claims (9)

a loading unit that transfers the substrate to be processed on which molds are formed on the upper and lower sides to a corresponding designated position;
a work table equipped with grinding means for grinding the mold of the processing substrate taken over from the loading unit; and
Electrically connected to the loading unit, the work table and the grinding means,
Calculate the total thickness (c) of the non-processing surface side of the substrate to be processed by the difference between the measured mold thickness (a) on the processing surface side of the substrate to be processed and the total total thickness (b) of the substrate to be processed,
A target thickness (e) of the substrate is calculated as the sum of the calculated total thickness (c) on the non-machined surface side and the predetermined target thickness (d) of the mold on the machined surface side,
Positioning the grinding means based on the total thickness (b) of the substrate to be processed, which determines the grinding process start position;
The processing thickness of the processing surface side of the substrate to be processed calculated by the difference between the measured processing surface side mold thickness (a) and the preset processing surface side mold processing target thickness (d), and the target thickness (e) of the processing substrate And a control unit for controlling the driving of the grinding means based on,
The loading part,
a strip loader which receives the substrate to be processed for forming molds on the upper and lower sides and transfers the substrate to a corresponding designated position;
a loading shuttle disposed on one side of the strip loader, placing the substrate to be processed received through the strip loader on an upper surface, and transporting it to a designated place where the picker of the robot arm is located;
a laser scan sensor provided in the loading shuttle to check whether a corresponding designated surface of the upper and lower surfaces of the substrate is placed facing upward; Grinding system of the circuit board comprising a.
The method of claim 1,
the workbench
While having a turntable that rotates on the basis of a central axis provided at the center, the first, second, third, and fourth work areas are radially partitioned on the basis of the central axis, and the partitioned first, second, third, A grinding means is provided in each of the fourth work areas,
a plurality of processing tables disposed in each of the first, second, third, and fourth work areas of the work table that are radially partitioned, and seating and supporting the workpiece substrate received from the loading unit;
a robot arm provided on one side of the first work area among the work areas, and picking up the substrate transported by the loading unit with a picker and placing it on a processing table;
first grinding means provided in a second work area among the work areas and performing primary grinding on a substrate to be processed placed on a processing table located in the second work area;
a second grinding means provided in a third work area among the work areas and performing secondary grinding on a substrate to be processed placed on a processing table located in the third work area;
A circuit board grinding system comprising: a third grinding means provided in a fourth work area among the work areas and polishing a substrate to be processed placed on a processing table located in the fourth work area.
delete The method of claim 1,
a first thickness measuring sensor provided in the loading shuttle to measure the thickness of the mold on the processing surface side of the substrate to be processed and to output the measured value to the control unit;
a second thickness measurement sensor provided in a second work area among the work areas of the work table partitioned radially, measuring a total thickness of the substrate to be processed and outputting the measured value to the control unit;
a third thickness measuring sensor provided in a third work area among the radially partitioned work table areas, measuring a total thickness of the substrate to be processed and outputting the measured value to the control unit;
A circuit comprising a fourth thickness measurement sensor provided in a fourth work area among the work areas of the work table partitioned in a radial shape, each measuring the total thickness of the substrate to be processed, and outputting the measured value to the control unit. Substrate grinding system.
The method of claim 2,
The processing tables are
A circuit board grinding system that selectively rotates around its center as an axis.
The method of claim 5,
Including; an unloading unit for transferring the substrate to be processed after grinding in the work table to a magazine,
The robot arm picks up a substrate to be processed located in a first work area among the work areas with a picker and transfers it to the unloading unit.
The method of claim 6,
The unloading unit
an unloading shuttle provided on one side of the work table, placing the substrate transported by the robot arm on an upper surface and transporting it to a designated place;
a strip unloader disposed on one side of the unloading shuttle, receiving the substrate transported by the unloading shuttle and transporting it to a designated location;
A circuit board grinding system comprising a magazine conveyor disposed on one side of the strip unloader and transferring the substrate to be processed, which is handed over by the strip unloader, to the magazine.
The method of claim 2,
In the first work area of the work table,
A circuit board grinding system having a brush module for cleaning a plane of a processing table located in the first work area.
i) measuring the thickness (a) of a mold on the side of the processing surface of the processing substrate after confirming whether the designated surface of the upper and lower surfaces of the processing substrate is placed facing upward;
ii) measuring the total thickness (b) of the substrate to be processed;
iii) calculating the total thickness (c) of the non-machined surface side of the substrate to be processed by the difference between the total thickness (b) of the substrate to be processed and the thickness (a) of the mold on the machined surface side;
iv) calculating a target thickness (e) of the substrate to be processed from the sum of the calculated total thickness (c) of the non-machined surface side and a predetermined target thickness (d) of the mold on the machined surface side;
v) determining the grinding thickness of the processing surface side of the substrate to be processed from the difference between the measured processing surface side mold thickness (a) and the preset processing surface side mold thickness (d); and
vi) The grinding process start position is determined based on the total thickness (b) of the substrate to be processed, and grinding is performed based on the thickness of the grinding process on the processing surface side of the substrate to be processed and the target thickness (e) of the substrate to be processed A method for grinding and processing a circuit board, comprising: controlling a means to grind and process the substrate to be processed.

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