KR20220126032A - Circuit board grinding system and grinding method - Google Patents

Abstract

The present invention provides a circuit board grinding system and a grinding processing method thereof. The system comprises: a loading unit which transfers a substrate to be processed with molds formed on upper and lower sides to a designated location; a work table disposed near the loading unit and having grinding means for grinding the mold of the substrate to be processed, which is transferred from the loading unit; and a control unit electrically connected to the loading unit, the work table, and the grinding means. The control unit is configured to calculate the total thickness (c) of a non-processing side of the substrate to be processed, using a difference between the measured mold thickness (a) on a processing side of the substrate to be processed and the total thickness (b) of the substrate to be processed, calculate a target thickness (e) of the substrate to be processed, using the sum of the calculated total thickness (c) on the non-processing side and a preset processing target thickness (d) of the mold on the processing side, position the grinding means based on the total thickness (b) of the substrate to be processed, which is used to determine a grinding processing start position, and control the driving of the grinding means based on the target thickness (e) of the substrate to be processed and the calculated processing thickness on the processing side of the substrate to be processed, using the difference between the preset mold processing target thickness (d) on the processing side and the measured mold thickness (a) on the processing side. The present invention prevents the thickness of the remaining mold remaining after processing from becoming too thin.

Description

Circuit board grinding system and its grinding processing method {Circuit board grinding system and grinding method}

The present invention relates to a grinding system for a circuit board and a grinding processing method thereof, and more particularly, based on the mold thickness on the side to be processed among circuit boards in which molds are formed on the upper and lower surfaces, respectively, and the total thickness of the circuit board. A circuit board that calculates the total thickness on the raw surface side, calculates the target thickness of the mold on the processed surface based on the calculated total thickness on the raw surface, and grinds the mold on the processed surface side based on the calculated target thickness of the mold on the processed surface It relates to a grinding system and a grinding processing method thereof.

Typically during fabrication of a semiconductor device, multiple layers of material are deposited, patterned, and etched to form electronic circuitry or electrical connections on a substrate, the top surface of which may be planarized between processing steps.

Such planarization is typically performed using an etch-back step or chemical mechanical polishing (CMP).

During the chemical mechanical polishing process described above, a substrate is placed face down on a polishing pad, pressed through a polishing head toward the polishing pad in the presence of a slurry and rotated by the polishing pad.

The slurry may contain abrasive particles, or chemicals that aid in material removal from the substrate, and polishing continues until sufficient material is removed to form a planar surface on the substrate.

It is important to maintain uniformity across the substrate during CMP to ensure uniform layer thickness for devices formed on the substrate.

However, maintaining thickness uniformity over the entire surface of the substrate is difficult, especially with larger diameter substrates. Therefore, for large substrate sizes, there is a need for a method and apparatus for improving uniformity during chemical mechanical polishing.

As a prior art for solving this problem, Patent Publication No. 10-2015-0005672 (2015.01.14) was provided.

However, in the case of a circuit board finished with a mold on the surface, conventionally, after measuring the total thickness of the workpiece (circuit board), grinding was performed to achieve a target thickness from the measured total thickness, but in this case, the thickness and processing of the workpiece Since the thickness of the face-side mold is not reflected, there is a problem in that the thickness of the remaining mold remaining after processing becomes too thin.

The present invention provides a circuit board grinding system and a method for grinding the circuit board that prevent the thickness of the remaining mold remaining after processing from becoming too thin by setting a target thickness based on the thickness of the mold on the processing surface side and the total thickness of the workpiece to do that for that purpose.

The circuit board grinding system according to the present invention includes a loading unit for transferring a processing substrate having molds formed on the upper and lower sides to a corresponding designated position, and is disposed near the loading unit, A workbench having a grinding means for grinding the mold, and the loading unit, the workbench and the grinding means are electrically connected to the measured mold thickness (a) on the processing surface side of the processing target substrate, and the total total thickness of the processing target substrate ( By the difference of b), the total thickness (c) of the non-machined surface side of the substrate to be processed is calculated, and the calculated total thickness (c) of the non-machined surface side is the sum of the preset processing target thickness (d) of the machined surface side mold. , calculates the target thickness (e) of the substrate to be processed, locates the grinding means based on the total total thickness (b) of the substrate to be processed, which determines the grinding processing start position, and the measured mold thickness (a) on the processing surface side ) and the difference between the preset processing target thickness (d) of the processing surface side mold, the calculated processing surface side processing thickness among the processing target substrates, and driving the grinding means based on the target thickness (e) of the processing target substrate It includes a control unit for controlling the.

At this time, the workbench according to the present invention includes a turntable that rotates about a central axis provided in the center, and radially divides first, second, third, and fourth working areas with respect to the central axis, and A grinding means is provided in each of the first, second, third, and fourth work areas, and is disposed in each of the first, second, third, and fourth work areas of the radially partitioned work table, and takes over from the loading unit A plurality of processing tables for seating and supporting the received substrate to be processed, and a robot arm provided on one side of the first working region of the working region, for picking up the processed substrate transferred by the loading unit with a picker and placing it on the processing table; , a first grinding means provided in a second work area of the work area and for primary grinding a substrate to be processed placed on a processing table located in the second work area, and in a third work area of the work area a second grinding means for secondary grinding of the substrate to be processed, which is provided and placed on a processing table located in the third working area; and a third grinding means for gloss-grinding the substrate to be processed placed on the processing table.

Here, the loading unit according to the present invention is disposed near the strip loader and the strip loader that takes over the substrate to be processed for forming the mold on the upper side and the lower side, respectively, and takes over the substrate to be processed to the designated position, and the strip loader and a loading shuttle for placing the substrate to be processed through the upper surface and transporting it to the designated place where the picker of the robot arm is located.

In addition, a first thickness measuring sensor provided in the loading shuttle according to the present invention to measure the mold thickness of the processing surface side of the substrate to be processed, and output the measured value to the control unit, and a radially partitioned working area of the workbench a second thickness measuring sensor provided in the second working area of the middle, measuring the total thickness of the substrate to be processed, and outputting the measured value to the control unit; is provided in the third thickness measuring sensor that measures the total thickness of the substrate to be processed and outputs the measured value to the control unit, and is provided in the fourth working area of the work area of the work table partitioned in a radial shape, and a fourth thickness measuring sensor for measuring the total thickness of the substrate to be processed, respectively, and outputting the measured value to the control unit.

At this time, it is preferable that the processing tables according to the present invention are selectively rotated about each of the centers as an axis.

In addition, it includes an unloading unit for transferring the processed substrate to the magazine after grinding on the work bench according to the present invention, wherein the robot arm picks up the processed substrate located in the first working area of the working area with a picker. transferred to the unloading unit.

And the unloading unit according to the present invention is provided in the vicinity of the workbench, the upper surface of the substrate transferred by the robot arm is placed on the upper surface of the unloading shuttle for transporting it to the designated place, and the vicinity of the unloading shuttle and a strip unloader disposed in the to-be-processed substrate transported by the unloading shuttle and transported to a corresponding designated place, and a processing target substrate disposed in the vicinity of the script unloader and transferred by the script unloader It includes a magazine conveyor that transports it to the magazine.

In addition, a brush module for cleaning the plane of the processing table located in the first working area is provided in the first work area of the work area of the work bench according to the present invention.

The grinding processing method of a circuit board according to the present invention comprises the steps of: i) measuring the thickness (a) of a mold on the processing surface side of the processing substrate; ii) measuring the total total thickness (b) of the processing substrate; iii) calculating the total thickness (c) of the non-processed side of the substrate by the difference of the thickness (a) of the mold on the processing surface side from the total thickness (b) of the processing substrate; iv) the calculated ratio Calculating the target thickness (e) of the substrate to be processed by the sum of the total thickness (c) on the processing surface side and the predetermined processing target thickness (d) of the mold on the processing surface side; v) Measured mold thickness on the processing surface side (a) and the difference between the preset processing target thickness (d) of the mold on the processing surface side, determining the grinding processing thickness on the processing surface side of the substrate to be processed, and vi) the total total thickness of the substrate to be processed (b) determining a grinding processing start position based on , and controlling the grinding means based on the grinding processing thickness on the processing surface side of the processing target substrate and the target thickness (e) of the processing target substrate to grind the processing substrate includes

Effects of the circuit board grinding system and the grinding processing method thereof according to the present invention are as follows.

By setting the target thickness based on the thickness of the mold on the processing surface side and the total thickness of the workpiece, the thickness of the remaining mold remaining after processing can be prevented from becoming too thin.

1 is an exemplary view showing a circuit board grinding system according to an embodiment of the present invention.
FIG. 2 is an exemplary diagram schematically illustrating a process of calculating a grinding thickness of a mold on a processing surface side of a circuit board in a circuit board grinding system according to an embodiment of the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims should not be construed as being limited to conventional or dictionary meanings, and the inventor should properly understand the concept of the term in order to best describe his invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all the technical ideas of the present invention, so at the time of the present application, they are equivalent It should be understood that there may be variations.

The present invention calculates the total thickness of the raw surface side based on the mold thickness on the processing surface side of the circuit board on which the mold is formed on the upper surface and the lower surface, and the total thickness of the circuit board, and the calculated total thickness on the raw surface side. It is related to a grinding system for a circuit board that calculates the target thickness of the mold on the processing surface side with a same as

The circuit board grinding system according to an embodiment of the present invention includes a loading unit 100 , a work table 200 , a plurality of processing tables 300 , a robot arm 400 , a first grinding means 500 , and a second grinding unit. It includes a means 600 , a third grinding means 700 , an unloading unit 800 , and a control unit 900 , wherein the loading unit 100 is formed on the upper and lower sides of the circuit board 11 , the molds 12 and 13 . ), which has completed the process of forming each substrate 10, is transferred to the designated position.

At this time, the loading unit 100 according to an embodiment of the present invention includes a strip loader 110 and a loading shuttle 120, wherein the strip loader 110 has molds 12 and 13 on the upper side and the lower side, respectively. The processing target substrate 10, which has completed the forming process, is taken over, and the processing target substrate 10 is turned over so that the bottom surface (lower mold) of the processing target substrate 10 faces upward to the designated position.

In addition, the loading shuttle 120 is disposed near the strip loader 110 , and the substrate 10 , which has been taken over through the strip loader 110 , is placed on the upper surface, and the picker of the robot arm 400 is positioned. transported to the designated place.

Here, a strip input 111 is provided between the strip loader 110 and the loading shuttle 120, and each of the loading shuttle 120 and the strip input 111 moves the shuttle along a linear guide bar placed up to the corresponding point. In this type, the shuttle fixes the processing target substrate 10 by vacuum suction, so that the processing target substrate 10 is not damaged or jamming occurs during the transfer of the processing target substrate 10 .

And the loading shuttle 120 is provided with a laser scan sensor, the laser scan sensor is a barcode formed on the processing target substrate 10 transported by the loading shuttle 120 and the state of the processing target substrate (10) (Make sure that the designated side faces upward among the top and bottom sides), etc. are scanned.

In addition, the loading shuttle 120 further includes a first thickness measuring sensor 121 . The first thickness measuring sensor 121 is a laser sensor, and is placed in the loading shuttle 120 to accommodate the loading shuttle 120 . ) to measure the thickness (a) of the lower mold 13 , which is a mold on the processing surface side of the substrate 10 to be processed, which is transported to the designated position by the ), and outputs the measured value to the control unit 900 .

Here, when the substrate 10 to be processed is placed in the loading shuttle 120, the lower mold 13, which is a mold on the processing surface side, is turned upside down and placed, so the lower mold 13 of the substrate 10 is Exposed to the outside (upper side), the thickness (a) of the mold on the processing surface side of the substrate 10 to be processed is measured through the first thickness measuring sensor 121 .

A workbench 200 is disposed near the loading unit 100 having the above configuration, wherein the workbench 200 includes grinding means 500, 600, 700), which is a working area in which the grinding process of the substrate 10 to be processed is performed, and a disk-shaped turntable 210 is provided therein.

In this case, the center of the turntable 210 is the center of the work area, and it has a central shaft 211 , and it is preferable that the turntable 210 rotates counterclockwise by 90° with respect to the central shaft 211 . do.

And the work table 200 provided with the turntable 210 therein divides the work area together with the turntable 210 in a radial form based on the central axis 211, and the work area together with the central axis ( A processing table 300 is provided on each turntable 210 divided in a radial form based on 211 .

The processing table 300 is provided on the turntable 210 positioned in each work area partitioned in a radial shape, and the substrate 10 to be processed is placed on the upper surface of each, so that grinding processing is performed, When the turntable 210 rotates by 90° in the counterclockwise direction with respect to the central axis 211, the turntable 210 rotates by 90° in association therewith.

Accordingly, as the turntable 210 selectively rotates counterclockwise by 90°, the substrate 10 placed on the processing tables 300 is initially located in the first working area, the turntable ( When 210 is rotated 90° counterclockwise, it moves from the first work area to the second work area, and when the turntable 210 rotates 90° counterclockwise again, the third work area in the second work area When the turntable 210 rotates 90° counterclockwise, the turntable 210 moves from the third work area to the fourth work area, and again the turntable 210 rotates 90° in the counterclockwise direction. When it is rotated, it moves from the fourth work area to the first work area and is positioned.

Therefore, the substrate 10 to be processed forms a circulation path that circulates through the first to fourth working areas by the rotation of the turntable 210 .

In addition, each of the processing tables 300 can be selectively rotated about its center as an axis, so that the seating direction of the processing target substrate 10 placed on the processing tables 300 can be selectively corrected. have.

A robot arm 400 is provided on one side of the first work area of the work area, and the robot arm 400 picks up the substrate 10 transferred by the loading unit 100 with a picker and selects a machining table 300 . ) is placed in

At this time, the robot arm 400 is preferably provided as a 6-axis robot arm like a normal robot arm, and the picker of the robot arm 400 is a to-be-processed transported by the loading unit 100 in a vacuum adsorption method. The substrate 10 is picked up and placed on the processing table 300 located in the first working area.

In addition, the robot arm 400 picks up the grinding-processed substrate 10 located in the first work area of the work area with a picker and transfers it to the unloading unit 800 .

Therefore, when the substrate 10 to be processed is drawn into the designated position through the loading unit 100 , it is located in the first working area of the work area of the work bench 200 by the robot arm 400 at the designated position. The substrate 10 to be processed is transferred to the processing table 300 and transferred to the first working area among the working areas of the work bench 200 by rotating the turntable 210 provided in the work bench 200 . moves from the first work area to the second work area by the , after the lapse of the corresponding time, it moves from the fourth work area back to the first work area.

Here, a first grinding means 500 is provided in a second working area among the working areas, and the first grinding means 500 is a substrate to be processed ( 10) is subjected to primary grinding.

At this time, the first grinding means 500 is provided with a disk-shaped grinding member at the lower end of the spindle that can rotate at 300 [rpm] like a normal grinding means, and the processing table 300 is located in the second working area. Primary grinding processing (Rough grinding) is performed on the processing surface side of the substrate to be processed 10 placed in the .

And a second work area of the work area of the work bench 200 partitioned in a radial form is provided with a second thickness measuring sensor 510, the second thickness measuring sensor 510 is a probe type, the second work area Measure the total total thickness (b) of the substrate to be processed 10 and/or the target thickness (e) of the substrate to be processed placed on the processing table 300 of the region, and use the control unit 900 to measure the measured value to output

The control unit 900 is based on the total total thickness (b) of the processing target substrate 10 and/or the target thickness (e) of the processing target substrate measured by the second thickness measuring sensor 510, the The driving of the first grinding means 500 and the rotation of the turntable 210 in the second working area are controlled.

In addition, a second grinding means 600 is provided in a third working area among the working areas, and the second grinding means 600 is a substrate to be processed placed on the processing table 300 located in the third working area. (10) is subjected to secondary grinding.

At this time, the second grinding means 600 is also provided with a disk-shaped grinding member at the lower end of the spindle that can rotate at 300 [rpm] like a normal grinding means, and the processing table 300 is located in the third working area. ), the processing surface side of the substrate 10 placed in the secondary grinding processing (fine grinding).

And a third thickness measuring sensor 610 is provided in a third working area of the working area of the work bench 200 partitioned in a radial shape. The third thickness measuring sensor 610 is a probe type, and the substrate to be processed The total total thickness (b) of (10) and/or the target thickness (e) of the substrate to be processed are measured, and the measured value is output to the control unit 900 .

The control unit 900 is based on the total total thickness (b) of the processing target substrate 10 and/or the target thickness (e) of the processing target substrate measured by the third thickness measuring sensor 610, the In the third working area, the driving of the second grinding means 600 and the rotation of the turntable 210 are controlled.

In addition, a third grinding means 700 is provided in a fourth working area among the working areas, and the third grinding means 700 is a substrate to be processed ( 10) is polished by grinding.

At this time, the third grinding means 700 is provided with a disk-shaped grinding member at the lower end of the spindle that can rotate at 300 [rpm] like a normal grinding means, and the processing table 300 is located in the fourth working area. Dry polishing is performed on the upper surface of the substrate 10 to be processed placed in the .

And a fourth thickness measuring sensor 710 is provided in a fourth working area of the working area of the work bench 200 partitioned in a radial form, and the fourth thickness measuring sensor 710 is a probe type, and the substrate to be processed The total total thickness (b) of (10) and/or the target thickness (e) of the substrate to be processed are measured, and the measured value is output to the control unit 900 .

The control unit 900 is based on the total total thickness (b) of the processing target substrate 10 and/or the target thickness (e) of the processing target substrate measured by the fourth thickness measuring sensor 710, the In the third working area, the driving of the third grinding means 700 and the rotation of the turntable 210 are controlled.

In addition, a brush module 220 for cleaning the surface of the processing table 300 located in the first working area is provided in a first working area of the work area of the work table 200 .

In addition, it is preferable to include a surface cleaner for cleaning the surface of the upper mold 12 of the substrate 10 to be processed, which is handed over to the unloading unit 800 in the first work area among the work areas of the work table 200 .

In addition, the substrate 10 to be processed after grinding on the worktable 200 is transferred to the magazine by the unloading unit 800, and the unloading unit 800 includes an unloading shuttle 810 and a strip-un It includes a loader 820 and a magazine conveyor 830 .

First, the unloading shuttle 810 is provided in the vicinity of the worktable 200, and the upper surface of the substrate 10 to be processed transferred by the robot arm 400 is placed on the upper surface and transported to the designated place.

At this time, the unloading shuttle 810 is a type in which the shuttle moves along a linear guide bar placed up to the designated place, and the shuttle fixes the substrate 10 by vacuum adsorption, During transfer, the substrate 10 to be processed is not damaged or jamming occurs.

And a strip unloader 820 is disposed in the vicinity of the unloading shuttle 810 , wherein the strip unloader 820 takes over the substrate 10 transported by the unloading shuttle 810 and receives the corresponding transported to a designated place.

Here, a magazine conveyor 830 is disposed in the vicinity of the script unloader 820, and the magazine conveyor 830 transfers the substrate 10 to be processed, which is taken over by the script unloader 820, to the magazine.

In addition, the control unit 900 according to an embodiment of the present invention includes the loading unit 100 , four processing tables 300 , a robot arm 400 , a first grinding unit 500 , and a second grinding unit 600 . , electrically connected to the third grinding means 700 , selectively according to the transfer and grinding degree of the substrate 10 to be processed, the loading unit 100 , the four processing tables 300 , and the robot arm 400 . , the first grinding means 500 , the second grinding means 600 , and the third grinding means 700 are controlled.

At this time, the control unit 900 determines the thickness (a) of the lower mold 13, which is a mold on the processing surface side of the substrate 10, based on the measured value measured by the first thickness measurement sensor 121, Based on the measured value measured by the second thickness measuring sensor 510, the total total thickness (b) of the processing target substrate 10 is determined, and the measured mold thickness on the processing surface side of the processing target substrate 10 ( A difference between a) and the total thickness b of the substrate 10 to be processed calculates the total thickness c on the non-machined surface side of the substrate 10 to be processed.

Then, the target thickness (e) of the substrate to be processed is calculated by the sum of the calculated total thickness (c) on the non-machined surface side and the predetermined processing target thickness (d) of the mold on the processing surface side, and the grinding processing start position is determined. The first grinding means 500 , the second grinding means 600 , and the third grinding means 700 are positioned based on the total thickness b of the substrate 10 to be processed.

In addition, the difference between the measured mold thickness (a) on the processing surface side and the predetermined processing surface side mold processing target thickness (d), the calculated processing thickness on the processing surface side among the processing target substrates, and the target thickness of the processing target substrate ( Based on e), the driving of the first grinding means 500 , the second grinding means 600 , and the third grinding means 700 is controlled.

Therefore, the difference between the measured mold thickness (a) on the processing surface side and the predetermined processing surface-side mold thickness (d), the calculated processing thickness on the processing surface side among the processing target substrates, and the target thickness (e) of the processing target substrate ) based on the control unit 900, the loading unit 100, the four processing tables 300, the robot arm 400, the first grinding means 500, the second grinding means 600, the third The grinding means 700 is controlled.

And the control unit 900, based on the measured value measured by the fourth thickness measuring sensor 610, determines whether the normal processing with the total total thickness (e) of the ground to-be-processed substrate 10, grinding processing It is preferable to control so that the processed substrate 10 is unloaded from the work bench 200 .

The grinding processing method of the circuit board according to an embodiment of the present invention is performed in the above-described grinding system of the circuit board. Referring back to FIG. 2, first, in step i), the thickness of the mold on the processing surface side of the substrate to be processed ( a) is measured.

At this time, the processing surface side mold is the lower mold 13 of the substrate 10 to be processed, and the thickness a of the lower mold 13 is measured by the first thickness measuring sensor 121 of the loading shuttle 120 . and the measured thickness a of the lower mold 13 is transmitted to the controller 900 .

Then, in step ii), the total total thickness (b) of the substrate 10 to be processed is measured.

At this time, the total total thickness (b) of the processing target substrate 10 is measured by the second thickness measuring sensor 510 provided in the second working area of the working table 200, and the measured processing target substrate 10 is ) of the total total thickness b is transmitted to the control unit 900 .

And the next step is iii), the difference between the thickness (a) of the lower mold 13, which is the mold on the processing surface side, from the total thickness (b) of the substrate 10 to be processed, among the unprocessed substrates 10 Calculate the total thickness (c) of the face side.

At this time, the thickness (a) of the lower mold 13, which is the mold on the processing surface side, measured by the first thickness measurement sensor 121 and the second thickness measurement sensor 510, and the total thickness of the substrate 10 to be processed When (b) is transmitted to the control unit 900 , the difference between the thickness (a) of the lower mold 13 , which is the processing surface side mold, from the total thickness (b) of the substrate 10 in the control unit 900 . , the total thickness c of the unprocessed surface side of the substrate 10 to be processed is calculated.

The next step is step iv), which is the sum of the calculated total thickness (c) on the non-machined surface side and the preset processing target thickness (d) of the mold on the machined surface side, and the target thickness (e) of the substrate 10 to be processed to calculate

At this time, when the control unit 900 calculates the total thickness (c) of the non-processed side of the substrate 10 to be processed, the predetermined processing target thickness (d) of the mold on the processing side is calculated as the total thickness of the non-processed side ( c) is added to calculate the target thickness e of the substrate 10 to be processed.

Then, in step v), the difference between the measured mold thickness (a) on the processing surface side and the preset processing target thickness (d) of the processing surface side mold determines the grinding thickness on the processing surface side of the substrate to be processed.

Then, in step vi), the grinding processing start position is determined based on the total total thickness (b) of the processing target substrate 10, and the grinding processing thickness of the processing surface side of the processing target substrate 10 and the The processing target substrate 10 is ground based on the target thickness e of the processing target substrate 10 .

At this time, the control unit 200 controls the operation of the turntable 210 and the processing table 300 along with the driving of the grinding means 500 , 600 , and 700 provided in each working area of the work table 200 , Control is performed so that the grinding process is performed until the total total thickness (b) of the processed substrate 10 matches the target thickness (e) of the substrate 10 to be processed.

And when the total total thickness (b) of the ground processing target substrate 10 meets the target thickness (e) of the processing target substrate 10, the processing target substrate grinded in the work table 200 ( 10) is transferred to the unloading unit 800 .

Although the present invention has been described with reference to the embodiment shown in the drawings, which is only exemplary, those of ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: substrate to be processed 11: circuit board
12: upper mold 13: lower mold
100: loading unit 110: strip loader
111: strip input 120: loading shuttle
121: first thickness measuring sensor 200: workbench
210: turntable 211: central axis
220: brush module 300: processing table
400: robot arm 500: first grinding means
510: second thickness measuring sensor 600: second grinding means
610: third thickness measuring sensor 700: third grinding means
710: fourth thickness measuring sensor 800: unloading unit
810: unloading shuttle 820: strip unloader
830: magazine conveyor 900: control unit

Claims (9)

a loading unit for transferring the substrate to which the mold is formed on the upper and lower sides, respectively, to the designated position;
a workbench disposed in the vicinity of the loading unit and having grinding means for grinding the mold of the substrate to be processed taken over from the loading unit; and
It is electrically connected to the loading unit, the workbench and the grinding means,
Calculate the unprocessed surface side total thickness (c) of the processed substrate by the difference between the measured mold thickness (a) on the processing surface side of the processing target substrate and the total total thickness (b) of the processing target substrate,
Calculate the target thickness (e) of the substrate to be processed by the sum of the calculated total thickness (c) on the non-machined surface side and the predetermined processing target thickness (d) of the mold on the processing surface side,
Positioning the grinding means based on the total total thickness (b) of the substrate to be processed, which determines the grinding processing start position,
The difference between the measured mold thickness (a) on the processing surface side and the predetermined processing surface side mold thickness (d) Grinding system of a circuit board comprising a control unit for controlling the driving of the grinding means based on.
The method according to claim 1,
the workbench
While having a turntable rotating about a central axis provided in the center, the first, second, third, and fourth work areas are radially divided based on the central axis, and the divided first, second, third, A grinding means is provided in each of the fourth working areas,
a plurality of processing tables disposed in each of the first, second, third, and fourth working areas of the radially partitioned work table, and for seating and supporting the substrate to be processed received from the loading unit;
a robot arm provided on one side of the first work area of the work area, the robot arm picking up the substrate transferred by the loading unit with a picker and placing it on a machining table;
a first grinding means provided in a second working area of the working area and performing primary grinding processing of a substrate to be processed placed on a processing table positioned in the second working area;
a second grinding means provided in a third working area of the working area and performing secondary grinding processing of a substrate to be processed placed on a processing table positioned in the third working area;
and a third grinding means provided in a fourth work area of the work area and performing a glossy grinding process on a substrate to be processed placed on a machining table positioned in the fourth work area.
3. The method according to claim 2,
the loading part
a strip loader that takes over a substrate to be processed for forming a mold on the upper side and the lower side, respectively, and delivers the substrate to a corresponding designated position;
A circuit board grinding system comprising a; a loading shuttle disposed near the strip loader, placing the substrate to be processed through the strip loader on the upper surface, and transporting it to the designated place where the picker of the robot arm is located.
4. The method of claim 3,
a first thickness measuring sensor provided in the loading shuttle to measure the mold thickness of the processing surface side of the substrate to be processed, and output the measured value to the control unit;
a second thickness measuring sensor provided in a second working area of the radially partitioned work area of the work table, measuring the total thickness of the substrate to be processed, and outputting the measured value to the control unit;
a third thickness measuring sensor provided in a third working area of the radially partitioned work area of the work table, measuring the total thickness of the substrate to be processed, and outputting the measured value to the control unit;
A circuit having a fourth thickness measuring sensor provided in a fourth working area among the working areas of the work table partitioned in a radial shape, measuring the total thickness of the substrate to be processed, and outputting the measured value to the control unit substrate grinding system.
3. The method according to claim 2,
The processing tables are
A grinding system for circuit boards that selectively rotates around the center of each.
6. The method of claim 5,
and an unloading unit for transferring the substrate to be processed after grinding on the work table to the magazine;
The robot arm is a circuit board grinding system that picks up a substrate to be processed located in a first work area of the work area with a picker and transfers it to the unloading unit.
7. The method of claim 6,
The unloading unit
an unloading shuttle provided in the vicinity of the workbench, placing the substrate to be processed transferred by the robot arm on its upper surface and transporting it to a designated place;
a strip unloader disposed in the vicinity of the unloading shuttle, the strip unloader taking over the substrate transported by the unloading shuttle and transferring it to a corresponding designated place;
and a magazine conveyor disposed in the vicinity of the script unloader and configured to transport the substrate to be processed by the script unloader to the magazine.
3. The method according to claim 2,
In the first work area of the work area of the workbench,
A grinding system for a circuit board having a brush module for cleaning the plane of the processing table located in the first working area.
i) measuring the thickness (a) of the mold on the processing surface side of the substrate to be processed;
ii) measuring the total total thickness (b) of the substrate to be processed;
iii) calculating the total thickness (c) of the non-processed side of the substrate by the difference of the thickness (a) of the mold on the processing surface side from the total thickness (b) of the substrate to be processed;
iv) calculating a target thickness (e) of the substrate to be processed as the sum of the calculated total thickness (c) of the non-machined surface side and the preset processing target thickness (d) of the mold on the processing surface side;
ⅴ) determining the grinding thickness of the processing surface side of the substrate to be processed by the difference between the measured processing surface side mold thickness (a) and the preset processing surface side mold processing target thickness (d); and
ⅵ) The grinding processing start position is determined based on the total thickness (b) of the substrate to be processed, and the grinding processing thickness on the processing surface side of the substrate to be processed and the target thickness (e) of the substrate to be processed are ground. A grinding processing method of a circuit board comprising a; controlling the means to grind the substrate to be processed.

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