JP2008284407A - Working apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working apparatus having a washing device with a high washing function. <P>SOLUTION: The working apparatus 1 for cutting and washing a work W to make a container accommodate it, comprises a first washing device 400 which sprays air-mixed washing water onto the surface of the cut work W to wash the surface of the work W, a second washing device 500 which washes the back of the work W with a washing roller 511, and a third washing device 600 which sprays air-mixed washing water onto the back of the work W to wash the back of the work W. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention generally relates to a processing apparatus including a cleaning device, and more particularly to a processing apparatus that cleans a workpiece that has been cut or grooved into a large number of pieces by a blade that rotates at high speed. The present invention is suitable for a dicing apparatus that cuts a package substrate into a large number of semiconductor devices.

  In recent years, there has been a demand for a dicing apparatus that can cut, clean, and store various-size package substrates and other workpieces at high speed and with high accuracy. An example of such a dicing apparatus is disclosed in Patent Document 1 by the present applicant. Such a processing apparatus has a workpiece cleaning unit that cuts a substrate with a blade into individual pieces, and then cleans the separated workpieces.

More specifically, the workpiece cleaning unit includes a first cleaning device that sprays cleaning water, which is a mixture of water and air, from above with the workpiece after dicing being adsorbed to the table, and cleaning by the first cleaning device. And a second cleaning device for cleaning the ground contact surface (work back surface) of the workpiece after the cleaning by a cleaning roller. The cleaning roller rotates around an axis and is made of a material such as a sponge containing cleaning water on the surface thereof, and comes into contact with the workpiece to remove the deposits attached to the workpiece.
JP 2005-152817 A

  However, if there is unevenness on the back of the workpiece, the contact force by the cleaning roller can be distributed, and cleaning may not be possible even if the contact is made. In particular, recently, there is a work whose back surface is not flat, so that cleaning is insufficient with only the cleaning roller.

  Therefore, an object of the present invention is to provide a processing apparatus having a cleaning apparatus having a high cleaning function.

  A processing apparatus according to one aspect of the present invention is a processing apparatus that cuts, cleans, and stores a workpiece in a container, and sprays cleaning water mixed with air on the surface of the cut workpiece. A first cleaning device that cleans the surface of the work, a second cleaning device that cleans the back surface of the work by a cleaning roller, and sprays cleaning water mixed with air on the back surface of the work. And a third cleaning device for cleaning the back surface of the workpiece. According to such a processing device (for example, a dicing device), the third cleaning device cleans the back surface of the workpiece and removes contamination that cannot be removed by the cleaning roller. You may further have a drying unit which blows dry air on the back surface of the said workpiece | work, and dries the back surface of the said workpiece | work. Thereby, the contamination adsorb | sucking to the back surface of a workpiece | work with washing water can be removed. Further, since the back surface of the workpiece is not attracted to the transfer table or the like by the cleaning water by drying, there is an effect that the subsequent transfer becomes easy. Note that the processing apparatus does not have to operate all of the second cleaning apparatus, the third cleaning apparatus, and the drying unit, and these can be combined.

  Further objects or other features of the present invention will become apparent in the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, it is possible to provide a processing apparatus having a cleaning device having a high cleaning function.

  Hereinafter, a dicing apparatus 1 as an example of a processing apparatus according to one aspect of the present invention will be described with reference to the accompanying drawings. Here, FIG. 1 is a schematic plan view of the dicing apparatus 1. In the figure, arrows indicate the flow of the workpiece W.

  Referring to FIG. 1, a dicing apparatus 1 is an apparatus that cuts, partitions, or divides a workpiece W such as a wafer or a resin sealing substrate into a large number of semiconductor devices (hereinafter simply referred to as “cutting”). The workpiece supply unit 100, the cutting table 200, the cutting mechanism 300, the workpiece cleaning units 400 to 700, the workpiece inspection unit 800, and the workpiece storage unit 900 are provided.

  The workpiece supply unit 100 stores the workpiece W before cutting and supplies the workpiece W to a cutting table 200 described later. The workpiece supply unit 100 includes a supply magazine 110, an alignment elevator 120, and a supply conveyance pickup 130.

  The supply magazine 110 is equipped with a plurality of supply magazines for storing a large number of works W, and can supply the necessary number of works W to the alignment elevator 120. It is always possible to collect empty magazines.

  In the present embodiment, the size and shape of the workpiece W before cutting are not particularly limited, and can correspond to various sizes such as 150 mm square to 350 mm square, for example. The size and shape of the cut workpiece W are not particularly limited, and can correspond to various sizes such as 5 mm square to 60 mm square. The workpiece W supplied to the alignment elevator 120 is placed on the cutting table 200 by the supply conveyance pickup 130. Since any technique known in the art can be applied to the supply conveyance pickup 130, a detailed description thereof is omitted here.

  In this embodiment, the cutting table 200 has a rectangular shape, and positions and fixes the workpiece W by suction holes provided on the upper surface. The suction hole of the cutting table 200 is maintained in a predetermined reduced pressure environment by a suction mechanism (not shown) so that the workpiece W can be sucked. The cutting table 200 has a function of separating the workpiece W into pieces in cooperation with a blade 310 of a cutting mechanism 300 described later. The cutting table 200 is configured to be rotatable by a rotation mechanism (not shown), and is configured to be translated in the Y-axis direction by a translation mechanism (not shown).

  The rotation mechanism (not shown) has a function of rotating the cutting table 200 by a predetermined angle when cutting the workpiece W in the vertical and horizontal directions (X-axis direction and Y-axis direction) and when cutting different workpieces W. A translation mechanism (not shown) has a function of moving the cutting table 200 in the Y-axis direction shown in FIG. 1 during cutting. Note that any technique known in the art can be applied to the rotation mechanism and the translation mechanism, and a detailed description thereof will be omitted. In general, the cutting table 200 is rarely mounted directly on the workpiece W. The cutting table 200 can be used to fix the workpiece W via a dicing jig that can be replaced according to the shape and number of the workpiece W to be cut. Positioning is performed.

  The cutting mechanism 300 has a function of cutting or grooving the workpiece W positioned and fixed on the cutting table 200, and includes, for example, a blade 310 and a spindle 320.

  The blade 310 is replaceably attached to the tip of the spindle 320 and has a function of cutting the workpiece W fixed and positioned on the cutting table 200 by rotating at a high speed around the rotation axis. In this embodiment, the blade 310 can cut the workpiece W in the Y-axis direction. The blade 310 rotates the cutting table 200 on which the workpiece W cut in the Y-axis direction is placed by 90 degrees, and is stacked again. By cutting W in the Y-axis direction, the workpiece W can be cut into individual semiconductor devices.

  The spindle 320 houses a motor that generates a rotational motion, a spindle shaft that transmits the rotational motion of the motor to the rotational shaft of the blade 310, a thrust bearing that determines the blade tip position of the blade 310, and the motor, the spindle shaft, and the thrust bearing. A spindle housing, and has a function of a rotation mechanism that imparts a rotational motion to the blade 310.

  The workpiece cleaning unit has a function of cleaning the workpiece W after cutting. In the present embodiment, the first cleaning device 400, the second cleaning device 500, the third cleaning device 600, and the drying device 700 are provided. Have.

  The first cleaning device 400 cleans the surface of the workpiece W after cutting while the back surface of the workpiece W is adsorbed on the cutting table 200. In addition, the surface of the workpiece | work W does not limit the surface of the workpiece | work W except that both have the front and back relationship. The first cleaning device 400 sprays cleaning water mixed with air (air) toward the surface of the work W from above the work W adsorbed on the cutting table 200 in a spray or jet form. Clean the surface. The first cleaning device 400 is embodied as, for example, a shower type cleaning device that includes a nozzle that sprays cleaning water and is configured by a gate-shaped member through which the cutting table 200 can pass (moves). Thereby, the contamination adhering to the surface of the workpiece | work W and the cutting end material which is not utilized as a semiconductor device can be washed away. The cleaning water used in the first cleaning device 400, the contaminated contaminants and the cut end material are discarded in the dust box 410.

  The second cleaning device 500 has a function of cleaning the back surface (grounding surface) of the workpiece W that has been cleaned by the first cleaning device 400 with the cleaning roller 511. The surface of the cut workpiece W is cleaned by the first cleaning device 400, but the back surface is not cleaned, and the cleaning water contains the contamination generated at the time of cutting and the contamination used in the first cleaning. May wrap around the back and remain. The back surface of the workpiece W is cleaned by the second cleaning device 500 and the third cleaning device 600.

  As shown in FIG. 2, the second cleaning device 500 includes a cleaning unit 510, a drainage mechanism 530, and a moving mechanism 540. Here, FIG. 2 is an enlarged view showing a configuration of the second cleaning device 500, FIG. 2A is a top view, and FIG. 2B is a front view.

The cleaning unit 510 is configured to be movable in the Y-axis direction by a moving mechanism 540 described later, and the back surface of the workpiece W is cleaned from below with the collective suction head 250 being carried out of the cutting table 200 and holding the surface of the workpiece W. To do. The position 250 shown in FIG. 1 is a workpiece back surface cleaning position. The second cleaning device 500 to clean the rear surface of the workpiece W by moving the Y ₁ direction shown in FIG.

  As shown in FIG. 3, the cleaning unit 510 includes a cleaning roller 511, a cleaning water supply member 512a, a gear portion 514, and a draining unit 520 described later. The cleaning unit 510 integrally includes a cleaning roller 511, a cleaning water supply member 512a, and a gear portion 514. The cleaning unit 510 is provided so as to be downsized and suitable for movement. Here, FIG. 3 is a cross-sectional view taken along the line AA of the cleaning unit 510 shown in FIG.

  The cleaning roller 511 has a surface 511a that comes into contact with the workpiece W, and has a function of removing contamination (adhering matter) attached to the workpiece W using cleaning water absorbed by the surface 511a. As shown in FIG. 3, the cleaning roller 511 has an absorbing member that can absorb cleaning water such as sponge around a roller shaft RS that can be rotated by a rotation driving unit 513 to be described later, and a cleaning member from the roller shaft RS to the absorbing member. It is configured by forming a holder for transferring water on the roller. In this embodiment, the holder has a large number of radially extending holes arranged in the outer peripheral portion at 90 ° intervals in the X direction, and the cleaning water is transmitted from the roller shaft RS to the absorbing member through the holes. Contamination adhering to the workpiece W can be removed by bringing the surface 511 a that has absorbed the cleaning water into contact with the workpiece W and rotating the cleaning roller 511.

  The cleaning water supply member 512a is provided on the roller shaft RS of the cleaning roller 511, and has a packing that prevents the cleaning water from entering the bearing portion of the cleaning roller 511 (roller shaft RS). The cleaning water supply member 512a is provided at one end of the roller shaft RS, and is configured to pass cleaning water through a hollow portion RSa formed in the roller shaft RS to a hole in the central portion of the roller shaft RS. Yes. The washing water that has passed through the hole of the roller shaft RS passes through the hole of the holder and is transmitted to the absorbing member.

  The rotational drive unit 513 has a function of imparting rotational motion to the cleaning roller 511 (roller shaft RS). As shown in FIGS. 2 and 4, the rotation drive unit 513 includes a motor 513 a that generates a rotation motion and a rotation shaft 513 b, and is connected to the gear unit 514. 4 is an enlarged view showing the configuration of the cleaning unit 510 and the rotation drive unit 513, where FIG. 4A is a top view, FIG. 4B is a side view, and FIG. 4C is a front view. FIG.

  The motor 513a has a function of generating a rotational motion for rotating the cleaning roller 511. As the motor 513a, for example, a brush motor having a commutator and a brush, or a brushless motor having a magnetoelectric conversion element can be used.

  The rotating shaft 513b is formed of a cylindrical member, and a motor 513a is connected to one end and a gear portion 514 is connected to the other end. In other words, the rotating shaft 513b has a function of connecting the motor 513a and the cleaning roller 511 via the gear portion 514 and imparting the rotational motion of the motor 513a to the roller axis RS of the cleaning roller 511.

  The gear unit 514 has a function of transmitting the rotational motion of the rotary shaft 513b to the cleaning roller 511. In the present embodiment, the first gear 514a, the second gear 514b, the third gear 514c, 4 gears 514d. The first gear 514a is connected to the rotary shaft 513b via the joint JT, the second gear 514b meshes with the first gear 514a, and the third gear 514c is provided coaxially with the second gear 514b. The fourth gear 514d meshes with the third gear 514c, and the roller shaft RS of the cleaning roller 511 is provided coaxially with the fourth gear 514d. The first gear 514a to the fourth gear 514d can reduce the size of the cleaning unit 510 that can move in the Y-axis direction.

  The draining unit 520 has a function of removing excess cleaning water that the surface 511a of the cleaning roller 511 does not absorb (that is, flowing out to the surface 511a), and as shown in FIG. 524. Here, FIG. 5 is a front view showing the configuration of the draining unit 520. FIG. 5 (a) shows a state in which the draining roller 522 presses the cleaning roller 511, and FIG. 5 (b) shows the draining roller 522 in the cleaning roller. 511 shows a state where it is detached from 511.

  The draining roller 522 has a function of draining the surface 511a of the cleaning roller 511, and drops excess cleaning water to the drainage mechanism 530 described later.

  The press release mechanism 524 has a function of pressing the draining roller 522 against the cleaning roller 511 and causing the draining roller 522 to be released from the cleaning roller 511. More specifically, the pressure release mechanism 524 causes the draining roller 522 to be pressed against the cleaning roller 511 when the workpiece W is being cleaned (when the dicing apparatus 1 is in operation), and other than when the workpiece W is being cleaned (when the dicing apparatus 1 is at rest). ) Is removed from the cleaning roller 511. In this embodiment, the press release mechanism 524 includes a rotating part 524a and a push / pull part 524b.

The rotating part 524a can rotate around the fixed axis FS. As for the rotation part 524a, the pushing / pulling part 524b is connected to one end, and the draining roller 522 is attached to the other end. Push-pull unit 524b, as shown in FIG. 5 (a), presses the cleaning roller 511 by the draining roller 522 is moved in the arrow beta ₁ direction by pressing one end connected to the rotating part 524a in the arrow alpha ₁ direction To do. Further, push-pull unit 524b, as shown in FIG. 5 (b), washed with one end connected to the rotation part 524a and a draining roller 522 is moved in the arrow beta ₂ direction by pulling the arrow alpha ₂ direction roller 511 To leave. The removed draining roller 522 stops its movement by the stopper shown in FIG. When the dicing apparatus 1 is stopped, it is desirable to display at least that the draining roller 522 should be detached from the cleaning roller 511.

  The draining roller 522 can be pressed against and removed from the cleaning roller 511 by the pressing and releasing mechanism 524. When the cleaning roller 511 is dried (other than during the cleaning of the workpiece W), the draining roller 522 and the cleaning roller 511 are separated so that the cleaning roller 511 that has lost its elasticity (restoring force) due to drying is drained. This prevents the formation of dents caused by pressing. Thereby, it is possible to prevent the cleaning function of the cleaning roller 511 from being lowered and the use period from being shortened. Further, when the cleaning roller 511 is replaced, as shown in FIG. 5B, the draining roller 522 can be detached from the cleaning roller 511, so that the cleaning roller 511 can be easily removed.

  The drainage mechanism 530 is disposed below the cleaning roller 511 and includes a drainage tank 532, a drainage port 534, and a net tray 536. The drain tank 532 accumulates excess cleaning water, contamination, and the like on the surface 511a of the cleaning roller 511 drained (removed) by the draining roller 522. The drain port 534 is used when discarding cleaning water, contamination, and the like accumulated in the drain tank 532. The net tray 536 is a simple filtration tray having a bottom made of a steel net and has a function of picking up a semiconductor device when it falls during cleaning.

  The moving mechanism 540 has a function of moving the cleaning unit 510 in the Y-axis direction along the back surface of the workpiece W that is collectively sucked and suspended by the collective suction head 250. In this embodiment, the moving mechanism 540 includes a motor 542, a belt 544, and a slide mount 546.

  The moving mechanism 540 is configured to wind the belt 544 and move the cleaning unit 510 and the rotation driving unit 513 supported by the slide mount 546 connected to the belt 544 in the Y-axis direction when the motor 542 rotates. Yes.

Further, the moving mechanism 540 includes a support shaft 548 shown in FIG. 6 at a connecting portion between the slide mount 546 and the rotation driving unit 513. The support shaft 548 supports the slide mount 546 and the rotation drive unit 513 so that the slide mount 546 and the rotation drive unit 513 can be coaxially rotated with each other. And is configured to move.

  The third cleaning device 600 has a function of cleaning the back surface of the work W by spraying cleaning water mixed with air on the back surface of the work W in the form of spray or jet. As shown in FIGS. 2, 7, and 8, the third cleaning device 600 includes a block 610, a fixed plate 620, O-rings 630 and 632, a plurality of nozzles 640, an air introduction mechanism 650, a cleaning A water introduction mechanism 660 and a nozzle upper and lower cylinder 670 are provided. FIG. 7 is an arrow view seen from the direction C in FIG. FIG. 8 is a DD cross-sectional view of FIG.

  The block 610 has a rectangular parallelepiped shape, and a fixing plate 620 is attached to the upper surface 612. Block 610 has stepped hollows 614, 616 and 618. The hollow portion 614 is a portion recessed from the upper surface 612 and supports the O-ring 630 and accommodates the plate 625. The hollow portion 616 is formed below the hollow portion 614, has a narrower width than the hollow portion 614, and supports the main portion of the pipe 654 and the O-ring 632. The hollow portion 618 is formed below the hollow portion 616 and is narrower than the hollow portion 616 and accommodates the main part of the cleaning water introduction mechanism 660.

  The fixing plate 620 has a function of fixing the nozzle 640 and seals the inside of the hollow portion 614 together with the O-ring 630. A plate 625 on which the nozzle 640 is placed is provided under the fixed plate 620. The plate 625 is formed with an air flow path 626 introduced from the T direction and a cleaning water flow path 627 introduced from the Z direction. The flow path 626 and the flow path 627 are coupled within the plate 625. The fixing plate 620 and the plate 625 are sealed with an O-ring 630. As a result, cleaning water and air will not leak from between the fixed plate 620 and the nozzle 640 or between the fixed plate 620 and the upper surface 612. The number of the channels 626, the diameters of the channels 626 and 627, and the angle in the T direction are not limited.

Nozzles 640 are aligned at equal intervals in the X direction shown in FIG. 1, is a 2-fluid cleaning nozzle for washing with two fluid that cleaning water and air back surface of the workpiece W by moving the Y ₁ direction shown in FIG. 1 . The number and size of the nozzles 640 and the interval between the nozzles 640 are not limited. The nozzle 640 has an opening 642 for spraying cleaning water mixed with air in the Z direction in the form of a spray or jet, and a flow path 644 connected to the opening 642. The nozzle 640 has a shape combining a cylinder and a hemisphere. The flow path 644 is a flow path of washing water mixed with air and extends in the Z direction.

  The nozzle 640 is configured to be swingable in the P direction shown in FIG. The swing mechanism is a mechanism for rotating the block 610 within a certain angle range in the P direction shown in FIG. 2B, and a structure well known in the art can be used. The inclination angle of the nozzle 640 with respect to the back surface of the workpiece W by the swing mechanism can be controlled.

  The air introduction mechanism 650 is a mechanism that introduces air into the flow path 642 of the nozzle 640, and includes a plug 652 connected to an air supply source (not shown) via a hose (not shown), a pipe 654 connected to the plug 652, and a branch. Socket 656. The pipe 654 extends in the X direction and is coupled to the branch socket 656. The branch socket 656 opens in the X direction and the Z direction, and allows the piping 654 extending in the X direction to be coupled to the piping 666 and the nozzle 640 of the cleaning water introduction mechanism 660.

  The flow rate of the air introduced by the air introduction mechanism 650 or the mixing ratio of the air and the cleaning water of the third cleaning device 600 can be changed. This mixing ratio includes the case where the ratio of air is zero.

  The cleaning water introduction mechanism 660 is a mechanism for introducing cleaning water into the flow path 642 of the nozzle 640, and includes a plug 662 connected to a cleaning water supply source (not shown) via a hose (not shown), and a pipe 664 connected to the plug 662. And 666. The piping 664 extending in the X direction has a plurality of connecting portions 665, and the piping 666 extending in the Z direction is fixed to the connecting portions 665. The connection portion 665 is, for example, a female screw hole, and a male screw portion formed at the tip of the pipe 666 is fitted therein. As a result, the cleaning water is supplied from the cleaning water supply source to the nozzle 640 through the plug 662 and the pipes 664 and 666.

  As shown in FIG. 2B, the nozzle up / down cylinder 670 moves the block 610 up and down in the Z direction. The nozzle up / down cylinder 670 retracts the block 610 downward in the Z direction when moving by the moving mechanism 540 or when the third cleaning device 600 is not in operation, and moves the block 610 upward in the Z direction when cleaning by the third cleaning device 600. That is, the block 610 is moved in the direction approaching the workpiece W. As a result, it is possible to prevent the injection force from the nozzle 640 from weakening while reaching the back surface of the workpiece W.

  The drying unit 700 has a function of blowing dry air onto the back surface of the work to dry the back surface of the work, and includes a block 710 and a plug 720 connected to the block 710. The block 710 has a socket 712, an exhaust part 714, and a hollow part 718. The socket 712 is formed on the side surface of the block 710 and is coupled to the hollow portion 718. The exhaust unit 714 has an opening 715 having a predetermined width that continuously extends in the X direction, and a flow path 716 of dry air connected to the opening 715 is connected to the inside.

  The width of the opening 715 can be changed. In this embodiment, the block 710 is divided into three sub-blocks 711a to 711c, and a plurality of types of sub-blocks 711b having openings 715 having different widths are prepared in advance. When the width of the opening 715 is changed, the sub-block 711b having the wide opening 715 is replaced with the sub-block 711b shown in FIG. Similarly, the exhaust pressure of the dry air can be adjusted from a low pressure to a high pressure, and can be selectively used according to the object.

  The channel 716 is connected to the hollow portion 718. The plug 720 is connected to a dry air supply source (not shown) via a hose 730 and is inserted into the socket 712 of the block 710 to be coupled. A dry air supply source (not shown) supplies air dried at a high temperature.

  As a result, dry air is discharged from the exhaust unit 714 through the plug 720 and the hollow part 718 from the dry air supply source. Thereby, the contamination adsorb | sucked to the back surface of the workpiece | work W with the water and washing | cleaning water supplied at the time of a cutting | disconnection can be removed by drying the back surface of the workpiece | work W and removing a water | moisture content. Further, since the back surface of the work W is not attracted to the transfer table or the like by the cleaning water by drying, there is an effect that the subsequent transfer becomes easy.

  The processing apparatus 1 does not have to operate all of the second cleaning apparatus 500, the third cleaning apparatus 600, and the drying unit 700, and these can be combined. As a result, the processing apparatus 1 is cleaned only by the second cleaning apparatus 500, cleaning by the second cleaning apparatus 500 and drying by the drying unit 700, cleaning only by the third cleaning apparatus 600, and by the third cleaning apparatus 600. Various patterns of cleaning can be provided, such as cleaning and drying by the drying unit 700, cleaning by the second cleaning device 500 and the third cleaning device 600, and drying by the drying unit 700.

  In FIG. 1, when viewed from the workpiece W, the third cleaning device 600, the drying unit 700, and the second cleaning device 500 are arranged in this order, but this is merely an example. In the embodiment in FIG. 1, when all the cleaning units are used, the cleaning by the third cleaning device 600 and the second cleaning device 500 is sequentially performed in one movement by the moving mechanism 540, and the moving mechanism 540 is set again. Returning to the Y direction, drying by the drying unit 700 is performed.

  The workpiece inspection unit 800 has a function of performing quality inspection including image processing inspection and continuity inspection on each individual workpiece W, and includes a buffer tray 810, a pickup mechanism, and an index table 830. And have.

  The buffer tray 810 is disposed between the second and third cleaning apparatuses 500 and 600 and the index table 830 that inspects the separated workpieces W one by one, and has a function of absorbing a difference in processing speed. Have. The buffer tray 810 temporarily accommodates the workpieces W that have been collectively conveyed by the collective suction head 250, and delivers the workpieces W to the pickup mechanism 820 that handles the workpieces W one by one.

  The pickup mechanism includes a reverse pickup mechanism 820, an intermediate pickup mechanism 822, and a storage pickup mechanism 824.

  The reversing pickup mechanism 820 has a function of reversing the work W stored in the buffer tray 810 one by one upside down. In the manufacture of a semiconductor device, the semiconductor device may be manufactured in a state where the semiconductor device is turned upside down rather than in a state where the terminal surface, which is the original mounting posture of the semiconductor device, is turned down. This is because it is necessary to have the original mounting posture of the apparatus. The intermediate pickup mechanism 822 conveys the workpiece W inverted upside down by the reverse pickup mechanism 820 to the index table 830. The storage pickup mechanism 824 stores the non-defective semiconductor device in the non-defective product storage tray 910, and stores the defective semiconductor device in the defective product storage tray (not shown).

  The index table 830 is configured to be rotatable counterclockwise with an arrow about the rotation axis, and has holding portions 832a to 832d disposed at four positions on the outer peripheral portion at intervals of 90 degrees about the rotation axis. The workpiece W conveyed from the intermediate pickup mechanism 822 is placed on the holding portions 832a to 832d with the terminal surface facing down. The workpieces W held in the holding units 832a to 832d of the index table 830 are sequentially sent to the inspection unit and subjected to quality inspection when the index table 830 rotates 90 degrees. The workpieces W that have undergone the quality inspection are sequentially sent to the unloading position as the index table 830 further rotates 90 degrees, and unloaded to the workpiece storage unit 900 by the storage pickup mechanism 824. In FIG. 1, 832a is a placement position where the work W is placed from the reverse pickup mechanism 820, 832c is an inspection position where the work W is inspected, and 832d is a carry-out position where the work W is carried out to the work storage unit 900. .

  The workpiece storage unit 900 has a function of storing the workpiece W, which has undergone quality inspection in the workpiece inspection unit 800, into a non-defective product and a defective product, and stores a non-defective product storage tray 910 for storing the non-defective workpiece, A defective product storage tray (not shown) for storing the workpiece; The non-defective product storage tray 910 and the defective product storage tray are configured to be movable in the Y-axis direction (from the top to the bottom in the drawing) according to the storage speed of the workpiece W.

  Hereinafter, the operation of the dicing apparatus 1 will be described. First, in the workpiece supply unit 100, the workpiece W is supplied from the supply magazine 110 to the alignment elevator 120. The work W supplied to the alignment elevator 120 is placed on the cutting table 200 by the transport mechanism. The workpiece W placed on the cutting table 200 is attracted to the cutting table 200 via a suction mechanism or the like.

  The cutting table 200 on which the workpiece W is positioned and fixed is moved and rotated by a translation mechanism and a rotation mechanism, and separates the workpiece W in cooperation with the cutting mechanism 300. Specifically, the cutting table 200 is moved in the Y-axis direction by using a translation mechanism with respect to the blade 310 that is driven to rotate, and the workpiece W is cut by further reciprocating. After repeating the cutting in the Y-axis direction, the cutting table 200 is rotated 90 degrees by the rotation mechanism, and the same operation is repeated to cut the workpiece W into a large number of pieces.

  Next, the separated workpiece W is cleaned by the workpiece cleaning unit. Specifically, the translation table is used to move the cutting table 200 in the Y-axis direction, and the cleaning liquid is sprayed when the cutting table 200 passes through the first cleaning device 400. At this time, since the separated workpiece W remains adsorbed on the cutting table 200, the workpiece W is washed from above.

  When the cleaning in the first cleaning device 400 is completed, the separated workpieces W are collectively sucked by the suction transport means and transported to the second cleaning device 500. The workpiece W sucked and suspended by the collective suction head 250 is cleaned from below by the third cleaning device 600 and the second cleaning device 500.

  Specifically, the air introduction mechanism 650 and the washing water introduction mechanism 660 of the third washing apparatus 600 introduce air and washing water into the flow paths 626 and 627, respectively, and the washing water mixed with air from the nozzle 640 is fogged. Or jetted onto the back surface of the workpiece W. As a result, contamination can be effectively removed even if the back surface of the workpiece W is uneven.

  Next, when the cleaning roller 511 of the second cleaning device 500 absorbs the cleaning water on the surface 511a, the draining roller 522 provided with the press release mechanism 524 presses the surface 511a, and the cleaning roller 511 is wetted (desired). Control it well. Then, the surface 511a of the cleaning roller 511 controlled to a desired wetness (wetting) is brought into contact with the cleaning surface of the workpiece W, and the cleaning roller 511 (cleaning unit 510) is moved along the cleaning surface of the workpiece W by the moving mechanism 540. The contaminants adhering to the workpiece W are cleaned by abutting and moving with high accuracy. At this time, the surface 511a of the cleaning roller 511 and the workpiece W are configured to be in uniform contact, and cleaning can be performed without applying a load to the cleaning roller 511. Moreover, it is prevented that a water droplet trace remains in the workpiece | work W after washing | cleaning by the excessive supply of washing water. When the cleaning of the workpiece W is completed (when the dicing apparatus 1 is stopped), the draining roller 522 is separated from the surface 511a of the cleaning roller 511 by the press release mechanism 524. This prevents the surface 511a from being depressed when the cleaning roller 511 is dried. As described above, the second cleaning device 500 can maintain the cleaning function of the cleaning roller 511 high and prevent the cleaning roller 511 from being worn, so that the cleaning roller 511 can be used for a long time (that is, the cleaning roller 511). 511 can be reduced), downtime due to the replacement of the cleaning roller 511 can be suppressed, and a decrease in throughput can be prevented.

  Next, using the moving mechanism 540 and the drying unit 700, dry air is blown onto the back surface of the work W to dry the back surface of the work W.

  The workpiece W that has been cleaned is transported to the workpiece inspection unit 800, and quality inspection is performed on the separated workpiece W. Next, in the work storage unit 900, non-defective workpieces are stored in the non-defective product storage tray 910, and defective products are stored in the defective product storage tray.

  Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

It is a schematic plan view of the processing apparatus (dicing apparatus) of this invention. It is an enlarged view which shows the structure of the 2nd washing | cleaning apparatus shown in FIG. It is AA sectional drawing of the washing | cleaning unit shown in FIG.2 (b). It is an enlarged view which shows the structure of a washing | cleaning unit and a rotation drive part. It is a figure which shows the structure of the washing water injection mechanism of a washing | cleaning unit. It is a front view which shows the structure of a draining unit. It is an enlarged view which shows the structure of the moving mechanism shown in FIG.2 (b). It is the arrow line view seen from the C direction shown to Fig.2 (a).

Explanation of symbols

1 Dicing device 400 First cleaning device 500 Second cleaning device 511 Cleaning roller 600 Third cleaning device 700 Drying unit W Workpiece

Claims (2)

A processing device that cuts, cleans, and stores a workpiece in a container,
A first cleaning device that cleans the surface of the workpiece by spraying cleaning water mixed with air on the surface of the workpiece that has been cut;
A second cleaning device for cleaning the back surface of the workpiece with a cleaning roller;
A processing apparatus, comprising: a third cleaning device that sprays cleaning water mixed with air on the back surface of the workpiece in a sprayed manner to clean the back surface of the workpiece.   The processing apparatus according to claim 1, further comprising a drying unit that blows dry air onto the back surface of the workpiece to dry the back surface of the workpiece.