JP2007053154A - Cleaning device for mask substrate, and cleaning method for mask substrate using the device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning device for a mask substrate capable of easily and surely cleaning entire end surfaces of the rectangular mask substrate. <P>SOLUTION: The cleaning device includes a chamber 2, rotatable cleaning brushes 8a and 8b which are oppositely provided, a robot arm 6 for holding the mask substrate 5 on its end surfaces and capable of relatively moving between the opposite brushes, and cleaning liquid supply means 7, 9 and 20 for supplying a cleaning liquid to at least either the both ends of the mask substrate held by the robot arm or the cleaning brushes. The robot arm holds the mask substrate on a pair of its opposite end surfaces, the cleaning liquid supply means feed the cleaning liquid to the mask substrate and/or the cleaning brush 8, and in addition, the substrate held by the robot arm is relatively moved between the opposite cleaning brushes, thereby cleaning opposite end surfaces not held by the robot arm by the cleaning brushes. The cleaning device 1 for the mask substrate is thus configured. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cleaning apparatus for cleaning a mask substrate used in photolithography in a semiconductor device manufacturing process or the like.

In the manufacturing process of a semiconductor device, a liquid crystal display (LCD) or the like, photolithography is performed using a mask substrate on which a desired pattern is formed in order to form a fine pattern on a silicon wafer, a glass substrate, or the like.
If particles or the like adhere to the mask substrate in the photolithography process, pattern formation failure is caused. Therefore, it is necessary to keep the mask substrate clean, and it is necessary to clean not only both surfaces of the mask substrate but also the end surfaces.

  When cleaning the mask substrate, there is a method of performing megasonic cleaning by putting the substrate into a cleaning tank filled with pure water or a cleaning liquid. However, in this method, megasonic irradiation is not sufficiently applied partially, and cleaning unevenness may occur. In this case, it is necessary to polish and clean manually.

On the other hand, as a cleaning apparatus for a mask substrate, an apparatus including a cleaning tank, a water-washing tank, and a drying tank has been proposed (see Patent Document 1). For example, after holding the corners of the mask substrate with arms, spraying pure water with ultrasonic waves on the substrate in the cleaning tank and rubbing it with a brush, the cleaning liquid contained in another cleaning tank Immerse in. Next, the substrate is transported to a water rinsing tank to remove the surface cleaning liquid, and further transported to a drying tank for drying.
In such an apparatus, it is said that the side surface (end surface) of the substrate can also be cleaned. However, since the apparatus includes a large number of tanks, the apparatus becomes large, and the substrate is held between arms by holding the substrate with an arm. In order to convey, there exists a possibility that a particle etc. may adhere during conveyance.

Also proposed is a cleaning device that supports the periphery of the mask substrate with a rotary table, supplies cleaning liquid to both surfaces of the substrate from nozzles arranged above and below, and then performs drying (spin drying) by rotating the substrate. (See Patent Document 2).
As described above, in the apparatus that performs cleaning while supporting the mask substrate on the rotary table, the apparatus can be miniaturized and can be performed from cleaning to drying while being placed on the rotary table. However, in some cases, the supported portion of the substrate is not cleaned, and the dirt cannot be sufficiently removed even in the portion where the cleaning liquid hits.

  In order to remove the contamination of the end face of the substrate that cannot be removed only by chemical cleaning with the cleaning liquid, hold the back side of the substrate and rotate it to supply the cleaning liquid near the end face of the substrate and bring the brush into contact with the end face. A cleaning apparatus for cleaning the end face has been proposed (see Patent Document 3). By cleaning the end face of the substrate with the cleaning liquid and the brush in this way, contaminants that cannot be removed only with the cleaning liquid can be removed. However, in this cleaning apparatus, since the substrate is rotated and the end surface of the substrate is brought into contact with the brush for cleaning, the end surface of the square mask substrate is cleaned only when cleaning the end surface of the substantially circular substrate. It is not possible.

JP-A-5-259137 Japanese Patent Laid-Open No. 10-260522 JP 2003-197592 A

  In view of the above problems, the main object of the present invention is to provide a cleaning device for a mask substrate that can easily and reliably clean the entire end face of a rectangular mask substrate.

  In order to achieve the above object, according to the present invention, there is provided an apparatus for cleaning a square mask substrate, comprising at least a chamber, a rotatable cleaning brush disposed oppositely in the chamber, and the mask substrate. A robot arm which is held narrowly at the end face and is relatively movable between the opposing cleaning brushes, and at least the front and back surfaces of the mask substrate held by the robot arm and the cleaning brush And a cleaning liquid supply means for supplying the cleaning liquid to the mask substrate and / or a cleaning brush from the cleaning liquid supply means. The robot arm is moved by relatively moving the substrate held by the robot arm between the opposing cleaning brushes. Cleaning device for a mask substrate is provided, wherein the opposing end faces are not held by the arm in which washing with the cleaning brush (claim 1).

  In such a cleaning apparatus, the mask substrate is held by the opposite end surface by the robot arm, and is moved relatively between the opposite brushes without avoiding the robot arm. Two end surfaces can be brush cleaned simultaneously. Therefore, after cleaning two opposite end faces of the mask substrate at the same time, the substrate is cleaned again by the robot arm, and the opposite end faces originally held by the robot arm are cleaned simultaneously. The whole can be easily and reliably cleaned.

In the chamber, it is preferable to include substrate rotation means having at least a rotation table and support pins provided on the rotation table and supporting the outer periphery of the mask substrate.
If such a substrate rotating means is provided, the end surface of the mask substrate can be easily held again, and a cleaning apparatus that can more easily clean the entire end surface of the substrate is obtained.

It is preferable to provide a cleaning liquid supply nozzle that supplies a cleaning liquid to both the front and back surfaces of the mask substrate supported by the support pins of the substrate rotating means.
If such a cleaning liquid supply nozzle is provided, after cleaning the entire end surface of the mask substrate, both the front and back surfaces of the mask substrate delivered to the substrate rotating means can be cleaned, and the operation of holding the substrate is performed. It is possible to prevent the substrate from being stained in the meantime.

Further, the rotary table and / or the support pin can be moved up and down (Claim 4).
If the rotary table or the support pin can be moved up and down, the mask substrate can be transferred and held again between the robot arm and the substrate rotating means.

As the cleaning liquid supply means, it is preferable that the robot arm is provided with a cleaning liquid supply nozzle that supplies the cleaning liquid to the mask substrate held by the robot arm.
If cleaning liquid is supplied from the cleaning liquid supply nozzle attached to the robot arm to the mask substrate held by the robot arm, the front and back surfaces of the substrate can be prevented from being dried, and contamination and stain can be reliably prevented. It becomes a cleaning device.

It is preferable that an arm cleaning nozzle for supplying a cleaning liquid to the robot arm is provided.
If an arm cleaning nozzle for cleaning the robot arm is provided, after cleaning the end face of the substrate, the end face of the substrate cleaned by the robot arm is contaminated when the substrate is held again by the cleaned end face. Can be prevented.

The opposed cleaning brushes are preferably cylindrical or columnar, respectively (Claim 7).
If it is a cylindrical or columnar cleaning brush, the end face of the mask substrate can be efficiently cleaned by rotating these brushes.

It is preferable that the opposing cleaning brushes can swing with respect to the substrate moving between the brushes (Claim 8).
If the cleaning brush can swing, the end face can be brush cleaned corresponding to substrates of various sizes.

It is preferable to include a cover unit that surrounds the substrate rotating unit and suppresses the scattering of the cleaning liquid.
If such a cover means is provided, it is possible to prevent the cleaning liquid from splashing into the chamber when the mask substrate supported by the substrate rotating means is cleaned.

In this case, it is preferable that the cover means can be moved up and down.
If the cover means can move up and down, interference between the robot arm and the cover means can be prevented, and scattering of the cleaning liquid when cleaning the mask substrate supported by the substrate rotating means can be more reliably prevented.

A filter for purifying the atmosphere in the chamber may be provided (claim 11).
The inside of the chamber can be maintained in a clean atmosphere by the filter, and reattachment of particles and the like to the cleaned mask substrate can be reliably prevented.

  Furthermore, according to the present invention, there is provided a method for cleaning a square mask substrate, wherein the mask substrate is held narrowly by a pair of opposing end surfaces by at least the robot arm using the cleaning apparatus according to the present invention. The cleaning liquid is supplied from the cleaning liquid supply means to the mask substrate and / or the cleaning brush, and the substrate held by the robot arm is relatively moved between the opposing cleaning brushes to be held by the robot arm. Cleaning the opposite end faces that are not performed with the cleaning brush, passing the substrate to the substrate rotating means, rotating the rotary table 90 ° with the outer periphery of the substrate supported by the support pins, The substrate is held by the robot arm between the opposite end faces that have been cleaned, and is not held by the robot arm. Cleaning the pair of opposing end surfaces with the cleaning brush, passing the substrate again to the substrate rotating means, supplying a cleaning liquid to both the front and back surfaces of the substrate, and cleaning. A method for cleaning a mask substrate is provided.

  If the edge surface of the mask substrate is simultaneously cleaned with the cleaning brush two by two using the cleaning device according to the present invention, the entire edge surface of the substrate can be easily and reliably brush cleaned, and all the end surfaces (entire circumference) After cleaning, the entire surface of the substrate can be cleaned by supplying a cleaning solution to both the front and back surfaces of the substrate supported by the substrate rotating means and cleaning.

After cleaning both the front and back surfaces of the mask substrate, a step of rotating the rotary table to dry the substrate can be performed.
If the rotary table is rotated and the liquid adhering to both the front and back surfaces of the mask substrate is blown off by the centrifugal force and dried, cleaning to drying can be performed.

  The cleaning device for a mask substrate according to the present invention is held by holding the mask substrate at the opposite end face by the robot arm and relatively moving between the facing brushes without avoiding the robot arm. Two opposite end faces can be brush-cleaned simultaneously. Therefore, after cleaning two opposite end faces of the mask substrate at the same time, the substrate is held again by the end face cleaned by the robot arm, and subsequently, the two opposite end faces originally held by the robot arm are simultaneously cleaned. The entire end face can be easily and reliably cleaned.

Hereinafter, a mask substrate cleaning apparatus according to the present invention and a case of cleaning a square mask substrate using the same will be described in detail with reference to the accompanying drawings.
1 and 2 show an example of a cleaning apparatus for a mask substrate according to the present invention. The apparatus 1 includes a chamber 2, cleaning brushes 8 a and 8 b, a robot arm 6, cleaning liquid supply means 7, 9 and 20, a substrate rotating means 3, a cover means 11 and the like.

  The chamber 2 can carry the mask substrate 5 in and out through the insertion port 15. The input port 15 is partitioned by a gate valve 16, and the atmosphere in the chamber 2 can be isolated from the external atmosphere except during transport. In addition, a clean unit 13 having a filter such as a HEPA filter or a ULPA filter is provided in the upper part of the chamber 2, and the atmosphere in the chamber can be kept at a high degree of cleanliness. Further, a rectifying plate 12 is provided on the lower side surface of the chamber 2 in order to adjust the air flow in the chamber being cleaned. Furthermore, a slope descending toward the waste liquid port 10 is formed at the bottom of the chamber 2, and the waste liquid of the cleaning liquid used for cleaning the substrate can be collected without staying.

In the chamber, two cylindrical cleaning brushes 8a and 8b are arranged to face each other. Each of the cleaning brushes 8a and 8b is rotatable and can swing with respect to the substrate 5 moving between the brushes 8a and 8b. Moreover, it is good also as what can adjust the width | variety between brush 8a, 8b according to the width | variety of the mask board | substrate 5 by numerical control.
As the cleaning brushes 8a and 8b, those that do not damage the mask substrate 5 can be used. For example, a PVA sponge used for cleaning a semiconductor wafer or the like formed into a cylindrical shape or a columnar shape (PVA brush) is suitable. By arranging such cleaning brushes 8a and 8b so as to face each other, two end surfaces of the mask substrate 5 can be brush-cleaned simultaneously. The number of cleaning brushes 8a and 8b is not particularly limited, and two or more cleaning brushes 8a and 8b may be arranged on the left and right sides, respectively.

The robot arm 6 includes two arms 6a and 6b, and an arm moving mechanism (operation unit) 21 that freely moves the arms 6a and 6b up and down, left and right, and front and rear.
As shown in FIG. 3, each arm 6a, 6b extends in a horizontal direction from the arm moving mechanism 21, and has a shape refracted downward at an intermediate position between the two opposing cleaning brushes 8a, 8b. Hands 18a and 18b for holding the end surface of the mask substrate 5 are provided at the tips of the arms 6a and 6b.
The arm moving mechanism 21 can control the positions of the arms 6a and 6b according to the size of the mask substrate 5, and can also control the coordinates of the operations of the arms 6a and 6b during cleaning.

  According to the robot arm 6, the two arms 6a and 6b open and close to the left and right, so that the two opposing end surfaces of the mask substrate 5 can be held narrowly by the hand portions 18a and 18b. For example, as shown in FIG. 3, the mask substrate 5 is held by a pair of opposed end surfaces 5 a and 5 b by the arms 6 a and 6 b (hand portions 18 a and 18 b), and is opposed along the rail 23 of the arm moving mechanism 21. By moving (passing, reciprocating) between the cleaning brushes 8a and 8b, the other opposing end surfaces 5c and 5d not held by the arms 6a and 6b can be brush-cleaned simultaneously.

Various cleaning liquid supply nozzles are provided in the chamber 2. The robot arm 6 has cleaning liquid supply nozzles 20a and 20b that can supply cleaning liquid to the mask substrate 5 held by the arms 6a and 6b, and the arms 6a and 6b (hand portions 18a and 18b). Arm cleaning nozzles 22a and 22b for supplying a cleaning liquid are provided.
Cleaning liquid supply nozzles 7a, 7b, 7c, and 7d that can supply a cleaning liquid to the mask substrate 5 held by the robot arm 6 are also provided before and after each of the cleaning brushes 8a and 8b.
Further, near the cleaning brushes 8a and 8b, brush cleaning liquid supply nozzles 9a and 9b for supplying a cleaning liquid to the cleaning brushes 8a and 8b are provided in order to prevent the brushes 8a and 8b from being dried and to clean the substrate 5. Yes.

The substrate rotating means 3 has a rotary table 14 and eight support pins 4 for positioning the mask substrate 5 on the rotary table 14 and supporting the outer periphery of the substrate 5. The turntable 14 is connected to a servo motor shaft and can control the number of rotations and the like. The support pins 4 on the turntable 14 can move up and down to facilitate delivery of the substrate 5 to the robot arm 6. The rotary table 14 may be movable up and down. Such substrate rotation means 3 is used when the substrate is moved by the robot arm 6 and between the transfer robot (not shown) for transferring the mask substrate 5 into the chamber and the robot arm 6 in the chamber. Thus, it plays a role of mediating the conveyance (reception and delivery) of the substrate 5.
Near the substrate rotating means 3, cleaning liquid supply nozzles 19 a and 19 b for supplying a cleaning liquid to both the front and back surfaces of the mask substrate 5 supported by the support pins 4 are provided.

  The cover means 11 is provided so as to surround the substrate rotating means 3 and can move up and down. When cleaning the mask substrate 5 supported by the support pins 4 of the substrate rotating means 3, the cover means 11 is raised to prevent the cleaning liquid or mist from splashing over the entire interior of the chamber 2. Recontamination can be prevented. Further, when the mask substrate 5 is transferred from the robot arm 6 to the substrate rotating means 3 and is held again, the cover means 11 is lowered to prevent interference, and the mask substrate 5 can be easily transferred to the substrate rotating means 3. It can be carried out.

Next, a method for cleaning the square mask substrate 5 using the mask substrate cleaning apparatus 1 will be described in detail.
The mask substrate insertion port 15 is opened via the gate valve 16 of the chamber 2, the mask substrate transported by the transport robot is transferred to the substrate rotating means 3, and the outer periphery of the substrate 5 is supported by the support pins 4.
After the support pin 4 (or the rotary table 14) is lifted so that the substrate 5 is positioned at the same position as the hand portions 18a and 18b of the arms 6a and 6b, the mask substrate is formed by the hand portions 18a and 18b of the two arms 6a and 6b. 5 is held narrow by a pair of opposed end faces. Thereby, the board | substrate 5 is delivered from the board | substrate rotation means 3 to arm 6a, 6b. Note that the mask substrate 5 may be held by moving the arms 6a and 6b downward.

By moving the arms 6a and 6b holding the mask substrate 5 horizontally, the substrate 5 is moved between the opposing cleaning brushes 8a and 8b. On the other hand, the cleaning brushes 8a and 8b arranged opposite to each other are rotated, and the cleaning liquid is supplied to the brushes 8a and 8b from the brush cleaning liquid supply nozzles 9a and 9b. The cleaning brushes 8a and 8b are not necessarily rotated, but the cleaning effect can be enhanced by rotating the brushes 8a and 8b, particularly when the end face of the substrate 5 is dirty.
Further, the cleaning liquid supply nozzles 20a and 20b of the arms 6a and 6b or the cleaning liquid supply nozzles before and after the cleaning brushes 8a and 8b are provided for preventing and cleaning the front and rear surfaces of the mask substrate 5 held by the arms 6a and 6b. The cleaning liquid may be supplied to both the front and back surfaces of the substrate 5 from 7a, 7b, 7c, and 7d.

  As shown in FIG. 4, the mask substrate 5 held by the robot arm 6 is moved between the cleaning brushes 8a and 8b along the substrate guide 17, and the end surface of the substrate 5 not held by the arms 6a and 6b is moved. The cleaning brushes 8a and 8b are brought into contact with each other. Thereby, two end surfaces of the substrate 5 are brush-cleaned simultaneously. Further, as shown in FIG. 5, after the mask substrate 5 is passed between the brushes 8a and 8b, the arms 6a and 6b are moved toward the original positions (above the rotary table 14). Thereby, the same end surface of the substrate 5 is brush cleaned again. At this time, the arms 6a and 6b hold opposite end faces different from the pair of opposing end faces of the substrate 5 to be cleaned with the brushes 8a and 8b, and therefore do not interfere with the brushes 8a and 8b. Therefore, the arms 6a and 6b can be reciprocated without avoiding, and the end surface of the substrate 5 not held by the arms 6a and 6b can be easily and reliably brush-cleaned. The number of reciprocations of the arms 6a and 6b is not particularly limited, and the number of cleanings may be numerically controlled by setting the arm moving mechanism 21.

  When the arms 6 a and 6 b holding the mask substrate 5 reach again above the substrate rotating means 3, the substrate 5 is delivered to the substrate rotating means 3. After the turntable 14 is rotated 90 ° with the outer periphery of the substrate 5 supported by the support pins 4, the substrate 5 is sandwiched between the opposite end surfaces previously cleaned by the robot arm 6 and held again.

  While the substrate 5 is transferred from the arms 6a and 6b to the substrate rotating means 3 and is again held by the arms 6a and 6b, the cleaning liquid is supplied from the arm cleaning nozzles 22a and 22b, and the hand portions of the arms 6a and 6b. 18a and 18b may be washed. If cleaning is performed by supplying a cleaning liquid to the hand portions 18a and 18b, in particular, a portion in contact with the end surface of the substrate 5 during standby, the arms 6a and 6b are contaminated when the end surface of the substrate 5 cleaned first is held again. Can be prevented. Note that the cleaning liquid may be supplied from the arm cleaning nozzles 22a and 22b to prevent contamination of the hand portions 18a and 18b, for example, while the substrate 5 is being transported or the end face is being cleaned.

  After holding the substrate 5 again, the arms 6a and 6b pass between the cleaning brushes 8a and 8b while holding the substrate 5 and reciprocate so that the remaining two end faces of the substrate 5 are brush cleaned simultaneously. Is done. When the predetermined number of times of brush cleaning is completed, the mask substrate 5 is transferred to the substrate rotating means 3 again. The cleaning liquid is supplied from the cleaning liquid supply nozzles 19a and 19b to the front and back surfaces of the mask substrate 5 supported by the support pins 4 for cleaning. At this time, by raising the cover means 11, it is possible to prevent the cleaning liquid and mist from being scattered in other parts of the chamber. Further, the rotary table 14 can be cleaned while being rotated or stationary, but by rotating the rotary table 14, the entire front and back surfaces of the substrate 5 can be reliably cleaned. It is also possible to remove the ion-level cleaning liquid remaining on the front and back surfaces of the substrate 5 by discharging a liquid containing ozone.

After completion of the cleaning, the mask substrate 5 is carried out of the chamber through the inlet 15. The substrate 5 on the turntable 14 may be supplied with a cleaning liquid for a predetermined time from the cleaning liquid supply nozzles 19a and 19b in order to avoid drying while waiting for reception. Thus, the timing for supplying the cleaning liquid can also be set by numerical control.
On the other hand, when drying the mask substrate 5 after cleaning, the substrate 5 can be dried by rotating the rotary table 14 at a high speed and flying the liquid on the substrate surface by centrifugal force.

  As described above, the cleaning apparatus for a mask substrate according to the present invention holds the mask substrate on the opposite end face by the robot arm, and the other opposite end faces that are not held by the arm without avoiding the robot arm. The surface can be cleaned with a cleaning brush at the same time. Accordingly, after cleaning the two opposite end faces of the mask substrate simultaneously, it is again held by the end face cleaned by the robot arm, and the opposite end faces originally held by the robot arm are simultaneously cleaned to simultaneously clean the entire end face ( The entire circumference can be easily and reliably cleaned.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and has the same operational effects can be used. It is included in the technical scope of the present invention.

  For example, in the above embodiment, the case where the arm moves in the brush direction to clean the end surface of the substrate has been described. However, in the present invention, the mask substrate held by the arm may be relatively movable between the cleaning brushes. Alternatively, the cleaning brush may be moved to clean the end face of the substrate.

It is a top view which shows the outline of an example of the cleaning apparatus for mask substrates which concerns on this invention. It is sectional drawing which shows the outline of an example of the cleaning apparatus for mask substrates which concerns on this invention. It is the schematic which shows the state which hold | maintained the end surface of the mask board | substrate with the robot arm. It is a top view which shows the state by which the end surface of a mask board | substrate is wash | cleaned with the washing brush. It is a top view which shows the state which the mask board | substrate passed the cleaning brush.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mask substrate cleaning apparatus, 2 ... Chamber, 3 ... Substrate rotating means, 4 ... Support pin, 5 ... Mask substrate, 5a, 5b, 5c, 5d ... End face of mask substrate, 6 ... Robot arm, 6a, 6b ... Arm, 7a, 7b, 7c, 7d ... Cleaning liquid supply nozzle, 8a, 8b ... Cleaning brush, 9a, 9b ... Brush cleaning liquid supply nozzle, 10 ... Waste liquid port, 11 ... Cover means, 12 ... Rectifying plate, 13 ... Clean unit ( Filter), 14 ... Rotary table, 15 ... Loading port, 16 ... Gate valve, 17 ... Substrate guide, 18a, 18b ... Hand part, 19a, 19b ... Cleaning liquid supply nozzle, 20a, 20b ... Cleaning liquid supply nozzle, 21 ... Arm movement Mechanism (operation part), 22a, 22b ... arm washing nozzle.

Claims (13)

  An apparatus for cleaning a quadrilateral mask substrate, comprising at least a chamber, a rotatable cleaning brush disposed oppositely in the chamber, and holding the mask substrate narrowly at an end face, and facing the cleaning brush A robot arm that is relatively movable between and a cleaning liquid supply means for supplying a cleaning liquid to at least one of the front and back surfaces of the mask substrate held by the robot arm and the cleaning brush. The mask substrate is held narrowly by a pair of opposed end surfaces by an arm, and the cleaning liquid is supplied from the cleaning liquid supply means to the mask substrate and / or the cleaning brush, and the substrate held by the robot arm is cleaned by the opposing cleaning. By relatively moving between the brushes, the opposing end faces not held by the robot arm are Cleaning device for a mask substrate, characterized in that washing with purification brush.   2. The mask substrate according to claim 1, further comprising: a substrate rotation unit having at least a rotation table and a support pin provided on the rotation table and supporting an outer periphery of the mask substrate in the chamber. Cleaning equipment.   The cleaning apparatus for a mask substrate according to claim 2, further comprising a cleaning liquid supply nozzle that supplies a cleaning liquid to both the front and back surfaces of the mask substrate supported by the support pins of the substrate rotating means.   4. The cleaning apparatus for a mask substrate according to claim 2, wherein the rotary table and / or the support pins are movable up and down.   5. The cleaning liquid supply means according to claim 1, wherein the robot arm is provided with a cleaning liquid supply nozzle for supplying a cleaning liquid to a mask substrate held by the robot arm. The cleaning apparatus for a mask substrate according to one item.   The mask substrate cleaning apparatus according to any one of claims 1 to 5, further comprising an arm cleaning nozzle that supplies a cleaning liquid to the robot arm.   The mask substrate cleaning apparatus according to any one of claims 1 to 6, wherein the opposing cleaning brushes are each cylindrical or columnar.   The mask substrate cleaning apparatus according to any one of claims 1 to 7, wherein the opposing cleaning brush is swingable with respect to the substrate moving between the brushes.   The mask substrate cleaning apparatus according to claim 2, further comprising a cover unit that surrounds the substrate rotating unit and suppresses the scattering of the cleaning liquid.   10. The cleaning apparatus for a mask substrate according to claim 9, wherein the cover means is movable up and down.   The cleaning apparatus for a mask substrate according to claim 1, further comprising a filter for purifying an atmosphere in the chamber.   A method for cleaning a square mask substrate, wherein the cleaning substrate according to any one of claims 3 to 11 is used, and at least a pair of end surfaces of the mask substrate are opposed to each other by the robot arm. By holding narrowly and supplying the cleaning liquid from the cleaning liquid supply means to the mask substrate and / or the cleaning brush and relatively moving the substrate held by the robot arm between the opposing cleaning brushes, A step of cleaning the opposing end surfaces not held by the robot arm with the cleaning brush, the substrate is transferred to the substrate rotating means, and the rotating table is rotated by 90 ° while the outer periphery of the substrate is supported by the support pins. After that, the substrate is held by the robot arm so that the substrate is sandwiched between the cleaned opposite end surfaces and held by the robot arm. Performing a step of cleaning the pair of opposed end faces that are not formed with the cleaning brush, a step of transferring the substrate again to the substrate rotating means, and supplying a cleaning solution to both the front and back surfaces of the substrate for cleaning. A method for cleaning a mask substrate.   13. The method for cleaning a mask substrate according to claim 12, wherein after the front and back surfaces of the mask substrate are cleaned, a step of rotating the rotary table to dry the substrate is performed.

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