JP4471747B2 - Semiconductor device manufacturing equipment - Google Patents

Description

  The present invention generally relates to a semiconductor device manufacturing apparatus, and more particularly to a semiconductor device manufacturing apparatus that stretches a wafer tape held on a wafer frame. The present invention is suitable, for example, for a semiconductor device manufacturing apparatus that cuts or cuts a workpiece pasted on a wafer frame with a blade rotating at high speed into a large number of pieces.

  With the recent high performance and widespread use of electronic devices, it is desired to manufacture high-quality semiconductor devices used in such electronic devices more efficiently (low cost) and at high speed. A process for manufacturing a semiconductor device includes a pre-process for manufacturing a semiconductor chip and a post-process for manufacturing a semiconductor device from the semiconductor chip. Among these, in the post-process (assembly process), there is a cutting process in which the workpiece after the pre-process (wafer processing process) is molded and then divided into a number of regions (corresponding to elements such as semiconductor devices).

  In the singulation process, the work is vacuum-sucked on a table called a table, positioned and fixed, and then the work is cut with a blade that rotates at high speed while moving the table in the XY directions, and is partitioned into a large number of semiconductor devices. . The workpiece is generally attached to a wafer tape (also referred to as “wafer film”) held on a ring-shaped wafer frame (also referred to as “wafer ring”), and the workpiece is positioned and fixed to a table. For this purpose, the wafer tape is stretched (expanded). If the wafer tape has wrinkles or slack, the vacuum suction of the wafer tape will leak and the work position will shift (ie, the work cannot be fixed), so the wafer tape will be stretched to eliminate wrinkles or slack. It is because it is necessary to make it vacuum-suck to a table in the state which carried out.

  Therefore, as shown in FIG. 5, a stretching mechanism (or a pulling mechanism) 1000 that stretches the wafer tape 1100 by pulling down the wafer frame 1200 with respect to the wafer tape 1100 has been conventionally used (for example, Patent Document 1). And 2). The wafer frame 1200 is pulled down by, for example, driving the ball screw 1400 via the drive mechanism 1500. Further, as shown in FIG. 5B, the wafer frame 1200 is pulled down until the position of the wafer frame 1200 is lower than the surface of the wafer tape 1100 (that is, the surface to which the workpiece 1300 is attached) (that is, When the wafer frame 1200 is viewed from the side, the work 1300 is exposed from the wafer frame 1200), so that it is not necessary to move the blade or the work 1300 in a complicated manner so as not to cut the wafer frame 1200. The movement control of the blade or workpiece 1300 is also facilitated. Here, FIG. 5 is a schematic cross-sectional view shown in Patent Document 1, and FIG. 5A shows a state before the wafer tape 1100 is stretched (the wafer frame 1200 is pulled down). ) Shows a state in which the wafer tape 1100 is stretched (the wafer frame 1200 is pulled down).

Since the separated semiconductor device is attached with contamination (cutting waste) generated at the time of cutting, the semiconductor device is sent to the next process through a cleaning process. In the cleaning process, the contaminated material is washed away by spraying cleaning water onto the semiconductor device on the wafer tape vacuum-adsorbed on the table while the wafer frame is pulled down, as in the case of cutting the workpiece.
Japanese Patent No. 29175511 Japanese Patent No. 3180208

  However, the conventional stretching mechanism for stretching the wafer tape is mainly a mechanical mechanism that pulls down the wafer frame from below with a ball screw or presses the wafer frame from above with a pressing plate. It has become impossible to achieve a sufficient reduction. In addition to the expensive ball screw and the like, for example, the mechanical stretching mechanism has an anti-corrosion property against cleaning water (ie, does not rust) in order to pass through the cleaning process as described above. This is because it is necessary to use a material, which causes an increase in manufacturing cost. Further, in order to uniformly stretch the wafer tape, a plurality of stretching mechanisms are required over the circumference of the wafer frame, which further increases the manufacturing cost.

  In addition, the mechanical stretching mechanism has a very complicated structure (for example, it is necessary to provide a ball screw and a driving mechanism for driving the ball screw separately), so that it takes time for maintenance and assembly. As a result, the semiconductor This leads to a long time required for manufacturing the device.

  Therefore, the present invention solves such a conventional problem, stretches a wafer tape to which a workpiece or a semiconductor device separated into pieces is attached with a simple configuration, and relatively shortens the semiconductor device in a short time. It is an exemplary object to provide a semiconductor device manufacturing apparatus that can be manufactured at low cost and achieves manufacturing efficiency and speedup.

  In order to achieve the above object, a semiconductor device manufacturing apparatus according to one aspect of the present invention is a semiconductor device manufacturing apparatus that extends a pasting member including a wafer tape to which a work or individual semiconductor device is pasted. A table that can be switched between a first state in which the sticking member is placed and a second state in which the sticking member is adsorbed, and the sticking member when the table is in the first state. And a vacuum suction pad that vacuum-sucks the sticking member while the table is switched from the first state to the second state. Such a semiconductor device manufacturing apparatus can stretch a wafer tape while using a simple structure of a vacuum suction pad. The vacuum suction pad has a bellows mechanism for pulling down the sticking member by vacuum sucking the sticking member. Thereby, a sticking member can be pulled down because a vacuum suction pad itself expands and contracts.

  Further objects and other features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, it is possible to stretch a wafer tape on which a workpiece or a separated semiconductor device is attached with a simple configuration, and to manufacture the semiconductor device in a short time and at a relatively low cost, It is possible to provide a semiconductor device manufacturing apparatus that achieves manufacturing efficiency and speedup.

  Hereinafter, a semiconductor device manufacturing apparatus according to an aspect of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted. Here, FIG. 1 is a schematic plan view showing an entire cutting apparatus 1 as an example of a semiconductor device manufacturing apparatus of the present invention.

  The cutting device 1 is a device that cuts or partitions a workpiece W such as a wafer or a molded substrate into a number of semiconductor devices. In the present embodiment, the cutting apparatus 1 will be described by taking an example of an apparatus that cuts a batch-molded (MAP) type work W in which a plurality of semiconductor chips are collectively sealed.

  As shown in FIG. 1, the cutting apparatus 1 includes a workpiece supply unit 100, a workpiece pasting unit 200, a table 300, a cutting mechanism 400, a workpiece cleaning unit 500, a pickup unit 600, and an inspection unit 700. .

  The work supply unit 100 stores a work W before dicing (molded substrate before cutting or partitioning into a large number of semiconductor devices) and supplies the work W to a work pasting unit 200 described later. The workpiece supply unit 100 exemplarily includes a supply unit 110, a cutout unit 120, and a conveying unit (not shown).

  The supply unit 110 is equipped with a plurality of supply magazines for storing a large number of workpieces W, and can supply the necessary number of workpieces W to the cutting unit 120 by a pusher or the like. In the present embodiment, the supply unit 110 is illustrated so as to supply the rectangular workpieces W to the cutting unit 120 one by one. However, for example, even if three workpieces W are arranged and supplied in the X direction, Well, it can be handled in the same way.

  The workpiece W supplied to the cutting unit 120 is transported to the workpiece pasting unit 200 by a transport unit (not shown). Since any technique known in the art can be applied to the conveying means, a detailed description thereof will be omitted. For example, the workpiece W is fixedly conveyed by being sucked and conveyed.

  The workpiece affixing unit 200 stores the wafer tape WT held on the wafer frame WF, affixes one or more workpieces W supplied from the workpiece supply unit 100 to the wafer tape WT, and the workpiece W is affixed. Wafer tape WT (and wafer frame WF) is supplied to table 300 and cutting mechanism 400 described later. The workpiece pasting unit 200 exemplarily includes a storage unit 210 and a pasting unit 220.

  Wafer frame WF is a frame for holding wafer tape WT to which workpiece W is attached. Specifically, the wafer frame WF has a wafer tape WT attached to the lower surface of the frame. In this embodiment, the wafer frame WF has a ring shape, but the shape is exemplary, and may be, for example, a rectangular shape.

  Wafer tape WT is an adhesive tape made of an adhesive resin for attaching workpiece W or a cut workpiece (hereinafter referred to as “semiconductor device SC”). Wafer tape WT is made of a UV sheet or the like in which an adhesive is applied to the surface of vinyl chloride, polyethylene, or vinyl acetate. By attaching one or a plurality of workpieces W or semiconductor device SC, workpiece W or the semiconductor device. Hold SC. Here, the UV sheet is a tape that secures the ease of picking up by reducing the adhesive force of the work W or the semiconductor device SC by irradiating ultraviolet rays.

  The storage unit 210 stores the wafer tape WT held on the wafer frame WF, and puts the wafer tape WT on the pasting unit 220 in accordance with the work W transferred from the work supply unit 100 (that is, in accordance with the transfer timing of the work W). Wafer tape WT held on wafer frame WF is supplied. In this embodiment, the storage unit 210 stores the wafer tape WT held in advance on the wafer frame WF, but the wafer frame WF and the wafer tape WT may be stored separately. In such a case, in the storage unit 210, the wafer tape WT may be affixed to the wafer frame WF, or after the workpiece W is affixed to the wafer tape WT by the affixing means 220 described later, the workpiece W is affixed. Wafer tape WT may be attached to wafer frame WF.

  The affixing means 220 has a function of affixing one or a plurality of workpieces W conveyed from the workpiece supply unit 100 to the wafer tape WT held on the wafer frame WF supplied from the storage unit 210.

  The pasting means 220 has, for example, a pasting roller disposed so as to be rotatable and movable on the back surface (non-adhesive surface) side of the pasting (adhesive) surface to which the workpiece W is pasted. The attaching roller presses the wafer tape WT from the back surface and assists in attaching the work W to the wafer tape WT. Specifically, one or a plurality of workpieces W are transported from the workpiece supply unit 100 onto a bonding surface of the wafer tape WT by a transport unit (not shown), and are lowered while adsorbed by the transporting unit to the bonding surface of the wafer tape WT. Contact. When the work W and the wafer tape WT come into contact with each other, the attaching roller rotates and moves along the work W, and the work W is attached to the wafer tape WT.

  The table 300 has the same shape as the shape of the wafer tape WT held in the wafer frame WF (in this embodiment, a circular shape), and has a function of positioning and fixing the workpiece W attached to the wafer tape WT. Have. The table 300 can be switched between a state in which the wafer tape WT held on the wafer frame WF is merely placed (first state) and a state in which the wafer tape WT is adsorbed (second state). Configured. In the present embodiment, the table 300 includes a suction block 310, a tape suction plate 320, and a vacuum suction pad 330, as shown in FIG. Here, FIG. 2 is a schematic cross-sectional view showing the configuration of the table 300.

  The suction block 310 stores a tape suction plate 320 described later, and has a function of sucking the wafer tape WT held on the wafer frame WF via the tape suction plate 320. In this embodiment, the suction block 310 has a substantially cylindrical shape, and is made of a material having corrosion resistance to cleaning water sprayed by the workpiece cleaning unit 500 described later, for example, stainless steel. As illustrated in FIG. 2, the suction block 310 includes a suction hole 312, a storage part 314, an installation part 316, and a taper part 318.

  The suction hole 312 has a circular shape and is formed at the center of the suction block 310. The suction hole 312 connects the storage unit 314 and a suction mechanism (not shown) (in communication with the storage unit 314), and is maintained in a predetermined reduced pressure environment by the suction mechanism to enable the wafer tape WT to be suctioned. In the present embodiment, only one suction hole 312 is formed, but a plurality of suction holes 312 may be formed, and the shape is not limited to a circular shape.

  The storage unit 314 is formed as a concave groove in a portion that covers an area where the wafer tape WT is placed on the upper surface (wafer tape WT side) of the suction block 310. The storage unit 314 stores the tape suction plate 320 in an airtight manner via a seal packing or the like. The storage unit 314 has the same depth as the thickness of the tape suction plate 320, and has a shape corresponding to the shape of the tape suction plate 320 (the shape of the wafer tape WT), in this embodiment, a circular shape.

  The installation unit 316 corresponds to the shape of the wafer frame WF immediately below the wafer frame WF when the table 300 is mounted with the wafer tape WT held on the wafer frame WF. Formed. The mounting unit 316 enables the vacuum suction pad 330 to be described later to be installed, and when the table 300 is in the first state, the vacuum suction pad 330 is in contact with the wafer frame WF with respect to the upper surface of the suction block 310. Have a step.

  The installation unit 316 has suction holes 316a corresponding to the number and positions of the vacuum suction pads 330 to be installed. The suction hole 316a has, for example, a circular shape, connects the vacuum suction pad 330 and a suction mechanism (not shown), and is maintained in a predetermined reduced pressure environment by the suction mechanism. The wafer frame WF can be sucked. The suction hole 312 and the suction hole 316a are independently controlled for the suction of the wafer tape WT and the suction of the wafer frame WF.

  The taper portion 318 is formed at a step portion between the upper surface of the suction block 310 and the installation portion 316 and has a taper shape (that is, a conical taper toward the upper surface of the suction block 310). The taper portion 318 has a function of smoothly (easily) extending the wafer tape WT held by the wafer frame WF, and details thereof will be described later.

  The tape suction plate 320 is stored in the storage unit 314 and places the wafer tape WT held on the wafer frame WF. The tape suction plate 320 is composed of a porous member having a plurality of holding holes for sucking the wafer tape WT, and the holding holes communicate with the suction holes 312. Therefore, when the suction hole 312 is in a predetermined reduced pressure environment, the wafer tape WT is sucked for each holding hole, and the wafer tape WT can be sucked to the tape suction plate 320. In other words, the tape adsorbing plate 320 adsorbs the wafer tape WT and positions and fixes the work W attached to the wafer tape WT. The tape suction plate 320 has a size and a shape corresponding to the shape of the wafer tape WT, and in the present embodiment, is composed of a circular plate-shaped member.

  The vacuum suction pad 330 is installed in the installation unit 316 and, as shown in FIG. 2, the table 300 is in a state where the wafer tape WT held by the wafer frame WF is only placed (first state). The wafer frame WF is vacuum-sucked while the table 300 is switched from the first state to the state (second state) where the table 300 is sucking the wafer tape WT. 2, the left side of the drawing shows a state where the vacuum suction pad 330 is in contact with the wafer frame WF (the table 300 is in the first state), and the right side of the drawing shows that the vacuum suction pad 330 vacuum-sucks the wafer frame WF. (Table 300 is in the second state).

  Here, a specific configuration of the vacuum suction pad 330 will be described with reference to FIG. FIG. 3 is an enlarged view showing the configuration of the vacuum suction pad 330. FIG. 3A shows a state before the wafer tape WT is stretched (lowering the wafer frame WF), and FIG. 3B shows the wafer tape. A state in which the WT is stretched (the wafer frame WF is pulled down) is shown. As shown in FIG. 3, the vacuum suction pad 330 includes a mounting bracket 332 and a bellows mechanism 334.

  The mounting bracket 332 has a function of connecting the installation portion 316 (the suction hole 316a thereof) and the bellows mechanism 334. The mounting bracket 332 is made of a corrosion resistant member. As will be described later, the mounting bracket 332 is blocked from the washing water by the bellows mechanism 334 in order to connect the bellows mechanism 334 and the installation portion 316 in the gap 334a inside the bellows mechanism 334. In addition, the mounting bracket 332 has a through hole 332 a and communicates with the suction hole 316 a of the installation portion 316 and the gap 334 a of the bellows mechanism 334.

The bellows mechanism 334 is made of silicon or rubber, has a gap 334a inside, and has a shape that expands and contracts in accordance with a change in the pressure of the gap 334a (in this embodiment, a bellows shape). Bellows mechanism 334, as shown in FIG. 3 (a), when the air gap 334a is the same as the atmospheric pressure (i.e., a state where the bellows mechanism 334 is extended), the length _{L 1} to be in contact with the wafer frame WF Set. Thereby, when the bellows mechanism 334 contracts, the distance which pulls down the wafer ring WF can be taken large.

  When the suction hole 316a is depressurized while the bellows mechanism 334 is in contact with the wafer frame WF, the pressure of the gap 334a is reduced to vacuum-suck the wafer frame WF. Further, when the suction hole 316a is depressurized, the bellows mechanism 334 contracts while the wafer frame WF is vacuum-sucked as shown in FIG. 3B, and lowers the wafer frame WF. That is, the wafer frame WF can be pulled down by the amount that the bellows mechanism 334 is contracted. The bellows mechanism 334 lowers the wafer frame WF, while the wafer tape WT is placed on the table 300, so that the wafer tape WT held on the wafer frame WF is stretched. In other words, the bellows mechanism 334 extends the wafer tape WT by pulling down the wafer frame WF with respect to the wafer tape WT, and can forcibly remove wrinkles and slack. Further, when the wafer frame WF is pulled down, the wafer tape WT is stretched along the taper portion 318 provided in the suction block 310, so that the force for pulling down the wafer frame WF escapes compared to the case without the taper portion 318. Without being transmitted to the wafer tape WT, the wafer tape WT can be stretched smoothly (easy).

As shown in FIG. 4, a plurality of vacuum suction pads 330 are provided in order to uniformly lower the wafer frame WF and make the wafer tape WT stretch uniformly. In the present embodiment, eight vacuum suction pads 330 are provided at equal intervals, but the number and arrangement of the vacuum suction pads 330 are exemplary. Vacuum suction pad 330, the force to lower the wafer frame WF according to the number and pad diameter L ₂ (i.e., it is possible to adjust the force for stretching the wafer tape WT (tensile force), for example, increasing the pad size L ₂ However, in order to evenly lower the wafer frame WF and make the wafer tape WT evenly stretched, at least four vacuum suction pads 330 should be provided at regular intervals. 4 is a schematic top view showing a table 300 on which the wafer tape WT held on the wafer frame WF is placed and sucked.

  As described above, by using the vacuum suction pad 330, the wafer frame WF is pulled down and the wafer tape WT is stretched without using an expensive material (such as a ball screw) as compared with a mechanical stretching mechanism. Thus, an increase in manufacturing cost can be prevented. In addition, the vacuum suction pad 330 can be made of a relatively inexpensive material such as silicon or rubber, while having durability against the cleaning water, so that an increase in manufacturing cost can be prevented. Furthermore, the vacuum suction pad 330 has a very simple configuration as compared to a mechanical stretching mechanism, such as the vacuum suction pad 330 also serving as a drive mechanism that lowers the wafer frame WF (the vacuum suction pad 330 expands and contracts). Maintenance and assembly can be performed in a short time, leading to a reduction in manufacturing time of the semiconductor device. In the present embodiment, the vacuum suction pad 330 is configured integrally with the table 300 (suction block 310), but may be configured separately.

  Hereinafter, the operation of the table 300, that is, the operation until the work W is fixed by placing and sucking the wafer tape WT held on the wafer frame WF on the table 300 will be described.

  First, the wafer tape WT held by the wafer frame WF and attached with the workpiece W in the workpiece attaching unit 200 is placed on the tape suction plate 320 housed in the suction block 310 (first state). At this time, it is assumed that the position of the wafer frame WF is adjusted and disposed just above the suction pad 330.

When the wafer tape WT is placed on the tape suction plate 320, the gap 334a of the bellows mechanism 334 is decompressed through the suction hole 316a of the installation portion 316, and the vacuum suction pad 330 vacuum-sucks the wafer frame WF. Moreover, when decompressing the gap 334a of the bellows mechanism 334, a bellows mechanism 334 contracts (length _{L 1} of the bellows mechanism 334 is shortened), pulls the wafer frame WF was vacuum suction. As a result, the wafer tape WT held on the wafer frame WF is stretched, and wrinkles and slack of the wafer tape WT are forcibly removed.

  When the wafer frame WF is pulled down and the suction hole 312 is depressurized in a state where the wafer tape WT is stretched, the wafer tape WT is adsorbed to the tape adsorption plate 320 through the holding hole of the tape adsorption plate 320 (second second). Status). At this time, since the wafer tape WT is stretched, wrinkles and slack are removed, and the workpiece W can be positioned and fixed without causing leakage in the vacuum suction (preventing displacement of the workpiece W). ). After the table 300 is placed on the wafer tape WT and before the wafer tape WT is sucked (in other words, while the table 300 is switched from the first state to the second state), the vacuum is applied via the vacuum suction pad 330. By pulling down the wafer frame WF and extending the wafer tape, the wafer tape WT can be reliably vacuum-adsorbed to the table 300.

  Returning to FIG. 1 again, the table 300 also has a function of separating the workpieces W in cooperation with a cutting mechanism 400 described later. The table 300 is configured to be rotatable by a rotation mechanism (not shown), and is configured to be able to translate in the Y direction by a translation mechanism (not shown).

  A rotation mechanism (not shown) has a function of rotating the table 300 by a predetermined angle when cutting the vertical and horizontal directions (X direction and Y direction) of the workpiece W. The translation mechanism (not shown) has a function of moving the table 300 in the Y direction shown in FIG. Note that any technique known in the art can be applied to the rotation mechanism and the translation mechanism, and thus detailed description thereof is omitted here.

  The cutting mechanism 400 has a function of cutting or grooving the workpiece W positioned and fixed on the table 300, and includes a blade 410 and a spindle 420, for example.

  The blade 410 is replaceably attached to the tip of the spindle 420 and has a function of cutting the workpiece W fixed and positioned on the table 300 by rotating at a high speed around the rotation axis. In this embodiment, the blade 410 can cut the workpiece W in the Y direction, and rotates the table 300 on which the workpiece W cut in the Y direction is placed by 90 degrees, and then overlaps the workpiece W to the Y. By cutting in the direction, the workpiece W can be cut into individual semiconductor devices SC. When cutting the workpiece W, the wafer frame WF is held by the vacuum suction pad 330 until the position of the wafer frame WF is below the attachment surface of the wafer tape WT (that is, the workpiece W is exposed from the wafer frame WF). Is pulled down, and it is not necessary to move the blade 410 or the workpiece W in a complicated manner so as not to cut the wafer frame WF. The position of the blade 410 is controlled so as not to cut the wafer tape WT.

  The spindle 420 houses a motor that generates a rotational motion, a spindle shaft that transmits the rotational motion of the motor to the rotational shaft of the blade 410, a thrust bearing that determines the blade tip position of the blade 410, and the motor, the spindle shaft, and the thrust bearing. A spindle housing, and has a function of a rotation mechanism that imparts rotational motion to the blade 410.

  The workpiece cleaning unit 500 has a function of cleaning cutting waste (contamination) and cutting edge material and semiconductor device SC (work after cutting) generated when the workpiece W is cut. The workpiece cleaning unit 500 cleans the semiconductor device SC attached to the wafer tape WT while the vacuum suction pad 330 pulls down the wafer frame WF and the wafer tape WT is stretched. Thereby, it is possible to wash away wrinkles and slack of the wafer tape WT without leaving cutting waste, cutting edge material and cleaning water. Since the vacuum suction pad 330 is made of silicon or rubber, there is no problem of rusting even when the cleaning water is applied.

  The workpiece cleaning unit 500 is configured to be able to spray cleaning water obtained by mixing water and air from above the semiconductor device SC attached to the wafer tape WT. The workpiece cleaning unit 500 includes, for example, a nozzle that sprays cleaning water, and the wafer tape WT (and the wafer frame WF or the table 300 that holds the wafer tape WT) to which the semiconductor device SC is attached can pass (move). The present invention is embodied as a shower type cleaning device configured by a gate-shaped member. Thereby, the cutting waste adhering to the surface of the semiconductor device SC and the cut end material not used as the semiconductor device SC can be washed away. Further, the cleaning water used in the workpiece cleaning unit 500, the washed cutting waste and the cut end material are discarded in the dust box 510.

  The pickup unit 600 has a function of simultaneously picking up one or a plurality of semiconductor devices SC from the wafer tape WT held on the wafer frame WF, and is embodied as a handler, for example. The pickup unit 600 automatically supplies the semiconductor device SC to be measured to the inspection unit 700 described later. Further, the pickup unit 600 may simply store the semiconductor device SC in a tray.

  The pickup unit 600 illustratively includes a UV irradiation unit 610, a peeling mechanism 620, and a collection unit 630.

  As shown in FIG. 1, the UV irradiation unit 610 includes a plurality of UV lamps 612. The UV lamp 612 irradiates the back surface of the wafer tape WT with the semiconductor device SC attached thereto with ultraviolet rays. Since the wafer tape WT is a UV sheet in this embodiment, the adhesive strength of the semiconductor device SC is reduced by being irradiated with ultraviolet rays. Thereby, the semiconductor device SC can be easily picked up from the wafer tape WT. For example, the UV lamp 612 may be provided corresponding to the semiconductor device SC on the wafer tape WT, or may be provided at a position where the adhesive force of the wafer tape WT can be reduced most efficiently.

  Any technique known in the industry can be applied to the peeling mechanism 620. For example, the peeling mechanism 620 includes a peeling table (not shown), a suction groove, a push-up pin, and a suction head 622. The peeling mechanism 620 places the wafer tape WT on which the semiconductor device SC is attached on the peeling table, and adsorbs the space between the semiconductor devices SC to the suction groove in which the inside formed on the peeling table is decompressed. Immediately below each of the semiconductor devices SC, a push-up pin is provided so as to protrude and retract with respect to the peeling table. Therefore, by pushing up the push-up pins by a predetermined distance, the bonding portion between the semiconductor device SC and the wafer tape WT can be reduced (preferably at one point), and the bonding area and bonding force between the semiconductor device SC and the wafer tape WT can be reduced. Can be reduced. The suction head 622 has a reduced pressure inside and comes into contact with the upper surface of the semiconductor device SC pushed up by the push-up pin. The semiconductor device SC can be picked up (separated) from the wafer tape WT by raising the suction head 622 that is in contact with the semiconductor device SC. In this embodiment, the suction head 622 also has a function of inverting the picked-up semiconductor device SC and delivering it to the inspection unit 700. In this embodiment, the peeling mechanism 620 that picks up the semiconductor devices SC from the wafer tape WT one by one has been described. However, for example, a peeling mechanism that picks up the semiconductor devices SC attached to the wafer tape WT all together. Can also be applied.

  Further, by extending the wafer tape WT at the time of pickup, it is possible to sufficiently widen the interval between the semiconductor devices SC and reduce the adhesive force between the semiconductor device SC and the wafer tape WT. Therefore, the semiconductor device SC can be picked up with high throughput without increasing the manufacturing cost by pulling down the wafer frame WF using the vacuum suction pad 330 and extending the wafer tape WT at the time of picking up.

  The collection unit 630 collects the wafer tape WT after all the semiconductor devices SC are picked up by the peeling mechanism 620. In the present embodiment, the collection unit 630 collects the wafer tape WT while being held (that is, attached) to the wafer frame WF. However, the collection unit 630 peels the wafer tape WT from the wafer frame WF and separately It may be recovered.

  The inspection unit 700 has a function of performing inspection including image processing inspection and continuity inspection for each semiconductor device SC, and includes an inspection table 710 and a semiconductor device storage unit 720.

  The inspection table 710 is configured to be rotatable about the rotation axis in the direction of the arrow in FIG. 1, and has holding units 712 a to 712 h arranged at eight positions on the outer periphery at intervals of 45 degrees about the rotation axis. The semiconductor device SC delivered by the pickup unit 600 (the suction head 622) is placed on the holding units 712a to 712h with the terminal surface facing down. The semiconductor device SC held in the holding units 712a to 712h of the inspection table 710 is sequentially sent to the inspection position and undergoes quality inspection as the inspection table 710 rotates 45 degrees. The semiconductor device SC that has undergone the quality inspection is sequentially sent to an unloading position by further rotating the inspection table 710, and unloaded to the semiconductor device storage portion 720 by an unillustrated unloading mechanism. In FIG. 1, reference numeral 712a denotes a mounting position on which the semiconductor device SC is mounted, reference numerals 712b to 712e denote inspection positions at which quality inspection is performed, and reference numerals 712f to 712h denote unloading positions for unloading the semiconductor device SC to the semiconductor device storage unit 720. . At the inspection position, terminal drop monitoring inspection by image processing, terminal continuity inspection, and the like are performed, and the manufacturing quality of the semiconductor device SC is confirmed.

  The semiconductor device storage unit 720 has a function of storing the semiconductor device SC, which has been inspected by the inspection table 710, into a non-defective product and a non-defective product, a non-defective product storage tray 722 for storing the non-defective semiconductor device, and a defective product. And a defective product storage tray 724 for storing the semiconductor device. The quality-inspected semiconductor device SC is unloaded from the unloading position of the inspection table 710 to the semiconductor device storage unit 720 by an unillustrated unloading mechanism, and is stored in the non-defective product storage tray 722 or the defective product storage tray 724 according to the quality inspection result. .

  As described above, the cutting apparatus 1 uses the vacuum suction pad 330 having a low cost and a simple structure to pull down the wafer frame WF holding the wafer tape WT and attach the workpiece W or the semiconductor device SC to the wafer tape WT. Can be stretched. Therefore, the cutting apparatus 1 can manufacture the semiconductor device SC in a short time and at a relatively low cost, and can sufficiently achieve the manufacturing efficiency and speedup.

  Hereinafter, the operation of the cutting apparatus 1 will be described. First, in the workpiece supply unit 100, the workpiece W is supplied from the supply unit 110 to the cutting unit 120. The workpiece W supplied to the cutting unit 120 is transported to the workpiece pasting unit 200 by a transport unit (not shown).

  The workpiece W conveyed to the workpiece pasting unit 200 is pasted to the wafer tape WT held by the wafer frame WF supplied from the storage unit 210 by the pasting means 220.

  Wafer tape WT to which workpiece W is attached is placed on table 300 while being held on wafer frame WF. The wafer tape WF placed on the table 300 is stretched by pulling down the wafer frame WF by the vacuum suction pad 330, and wrinkles and slack are forcibly removed. The wafer tape WT stretched through the vacuum suction pad 330 is vacuum-sucked to the table 300, and the workpiece W attached to the wafer tape WT is positioned and fixed.

  The table 300 on which the workpiece W is positioned and fixed is moved and rotated by a translation mechanism and a rotation mechanism, and the workpiece W attached to the wafer tape WT is cut in cooperation with the cutting mechanism 400 to obtain a semiconductor device SC. Specifically, the table 300 is moved in the Y direction by using a translation mechanism with respect to the blade 410 that is driven to rotate, and the workpiece W is cut by further reciprocating. After repeating the cutting in the Y direction, the table 300 is rotated 90 degrees by the rotating mechanism, and the same operation is repeated to cut the workpiece W into a large number of pieces. At this time, since the wafer frame WF is pulled down below the wafer tape WT adsorbed on the table 300 (the workpiece W is exposed from the wafer frame WF), the blade 410 does not cut the wafer frame WF. Alternatively, it is not necessary to move the workpiece W in a complicated manner.

  Next, the separated semiconductor device SC is cleaned by the workpiece cleaning unit 500 while being attached to the wafer tape WT. Specifically, the table 300 is moved to move in the Y-axis direction using a translation mechanism, and cleaning water is sprayed onto the semiconductor device SC when the table 300 passes the workpiece cleaning unit 500. At this time, since the semiconductor device SC remains adhered to the wafer tape WT held on the wafer frame WF and vacuum-sucked on the table 300, the cutting waste and the cut end material adhering to the semiconductor device SC are washed away. Further, since the wafer frame WF is pulled down by the vacuum suction pad 330 and the wafer tape WT remains stretched, the wafer tape WT is washed away without remaining cutting debris, cutting edge material, and cleaning water in the wrinkles or slack of the wafer tape WT. be able to.

  When the cleaning is completed, the lowering of the wafer frame WF by the vacuum suction pad 330 and the vacuum suction of the wafer tape by the table 300 are released, and the wafer tape WT held by the wafer frame WF and attached with the semiconductor device SC is removed. It is transported to the pickup unit 600 by transport means (not shown). In pickup unit 600, semiconductor device SC attached to wafer tape WT is picked up. Specifically, the UV irradiation unit 610 irradiates the wafer tape WT to which the semiconductor device SC is attached with ultraviolet rays, thereby reducing the adhesive force of the semiconductor device SC on the wafer tape WT. Next, in the peeling mechanism 620, the semiconductor device SC is peeled off from the wafer tape WT having a reduced adhesive strength of the semiconductor device SC, and the semiconductor device SC is conveyed to the inspection unit 700. On the other hand, the wafer tape WT from which all of the attached semiconductor device SC has been peeled is collected by the collection unit 630.

  The semiconductor device SC transported to the inspection unit 700 undergoes a quality inspection at the inspection table 710. In the semiconductor device storage unit 720, a non-defective semiconductor device is stored in the non-defective storage tray 722, and a defective semiconductor device is stored in the defective storage tray 724. Store separately.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist. For example, in the present invention, the wafer tape is held on the wafer frame, and the vacuum suction pad extends the wafer tape by pulling down the wafer ring. However, the present invention can also be applied when the wafer frame is not used. In that case, needless to say, the vacuum suction pad may vacuum-suck the outer peripheral portion of the wafer tape and lower the outer peripheral portion.

1 is a schematic plan view showing an entire cutting apparatus as an example of a semiconductor device manufacturing apparatus of the present invention. It is a schematic sectional drawing which shows the structure of the table shown in FIG. It is an expanded sectional view which shows the structure of the vacuum suction pad shown in FIG. It is a schematic top view which shows the table which mounted and adsorb | sucked the wafer tape hold | maintained at the wafer frame. It is a schematic sectional drawing of the extending | stretching mechanism shown by patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cutting device 100 Work supply part 110 Supply part 120 Cutting part 200 Work sticking part 210 Storage part 220 Sticking means 300 Table 310 Suction block 312 Suction hole 314 Storage part 316 Installation part 316a Suction hole 318 Taper part 320 Tape suction plate 330 Vacuum Suction pad 332 Mounting bracket 332a Through hole 334 Bellows mechanism 334a Gap 400 Cutting mechanism 500 Work cleaning unit 600 Pickup unit 700 Inspection unit WF Wafer frame WT Wafer tape W Work SC Semiconductor device

Claims (3)

An apparatus for manufacturing a semiconductor device for extending a sticking member including a wafer tape to which a workpiece or a separated semiconductor device is attached,
A table that can be switched between a first state for placing the sticking member and a second state for sucking the sticking member;
A vacuum suction pad that contacts the sticking member when the table is in the first state, and vacuum sucks the sticking member while the table is switched from the first state to the second state; An apparatus for manufacturing a semiconductor device. The vacuum suction pad, the sticking member by vacuum suction, the apparatus for manufacturing a semiconductor device according to claim 1, wherein the wafer tape to the semiconductor device on the wafer tape and said and pulled Turkey. 3. The semiconductor device manufacturing apparatus according to claim 1, wherein the vacuum suction pad has a bellows mechanism for pulling down the sticking member by vacuum sucking the sticking member.