TW201440949A - Jig tray - Google Patents

Abstract

This invention is a jig tray designed to provide convenience in replacing a component holder that is set up on a surface panel support. A cutter cuts multiple chips out of a panel-shaped work-piece along the multiple preset cut lines. The jig tray is utilized to keep the panel-shaped target in place. The surface of the jig tray comprises: a holder clip which is formed by a flexible component of a holder face in which the surface has a corresponding dimension of the panel-shaped work-piece, and a support panel which is formed by a rigid component of a removable support holder clip. The holder clip is formed by a work-piece holder which has the holder face corresponding to the dimension of the work-piece, and a back-side exterior frame of the work-piece holder. The work-piece holder has multiple suction holes which have openings facing the holder face within a corresponding region of chips that are segregated by the multiple preset cutlines formed on the panel-shaped work-piece, and multiple retraction slots formed in the region which corresponds to the region segregated by the multiple preset cutlines formed on the panel-shaped work-piece for the tool retracting of a cutting tool. The support panel has the work-piece holder to support the work-piece, and multiple chip supports which have through holes that connect to the multiple suction holes. Furthermore, the support panel also has a base of a frame support, which is set up around the chip support in segments at the chip support, and which has a frame support plane for supporting the frame of the holder clip.

Description

Keep the fixture Field of invention

The present invention relates to a holding jig for holding a workpiece when a cutting tool having a cutting edge on the outer circumference cuts a plate-shaped workpiece along a predetermined dividing line.

Background of the invention

In the semiconductor device manufacturing step, devices such as ICs and LSIs are formed in a plurality of regions arranged in a lattice shape on the surface of the substantially disk-shaped semiconductor wafer, and the dividing lines are formed by dividing the regions forming the device. Cutting is performed to make individual devices. The device thus divided can be packaged for widespread application to electrical machines such as mobile phones and computers.

As electrical equipment such as mobile phones and personal computers are required to be lighter and smaller, the packaging of semiconductor devices has also developed a compact packaging technology called wafer level packaging (CSP). The packaging technology called Quad Flat Non-lead Package (QFN, quad flat no-lead package) has been put into practical use and has become one of the CSP technologies. This packaging technique, called QFN, forms a plurality of terminals for the terminals of the corresponding device, and at the same time, a plurality of devices are arranged in a matrix on a metal plate such as a copper plate which is divided into predetermined grids of a predetermined division line. Shape and by using the tree from the back side of the device The resin portion formed by the die molding integrates the metal plate and the device, thereby forming a CSP substrate (package substrate). By cutting the package substrate along a predetermined dividing line, it can be divided into devices that can be individually packaged (wafer level package).

The cutting of the package substrate is usually performed by a cutting device provided with a cutting tool having a cutting edge on the outer periphery. The cutting device is provided with a lattice shape for retracting a cutting edge of a cutting tool corresponding to a region corresponding to a predetermined dividing line, and a suction hole is provided in each of a plurality of regions defined by the undercut groove. Holding the jig, the holding jig positioned on the holding platform attracts and holds the package substrate, and moves the holding platform relative to the dividing line of the package substrate in the cutting conveying direction while rotating the cutting tool, and is divided along the dividing line The board cuts the package substrate and divides it into individual devices. In addition, the holding jig is made of a metal plate such as stainless steel, and a holding layer made of a urethane resin or the like is formed on the surface (see, for example, Patent Document 1).

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-142992

Summary of invention

However, the holding jig formed by coating a surface of a metal plate such as stainless steel described in Patent Document 1 with a retaining layer made of a urethane resin or the like has the following problems. That is, repeating on the jig When the workpiece is attached or detached, the holding layer formed by the urethane resin or the like which is coated on the surface of the metal plate is damaged, and the function of retaining the workpiece is lost. Therefore, if the retaining layer covered by the surface of the metal plate is damaged, the retaining layer must be peeled off and a new retaining layer must be applied, and at the same time, the undercut groove and the suction hole are formed on the retaining layer, thereby having a repairing operation. The problem of spending more time.

The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a holding jig that can easily replace a holding member disposed on a surface of a support plate.

In order to solve the above-mentioned main technical problems, the holding jig provided by the present invention is such that a cutting tool having a cutting edge on the outer circumference cuts a plate-shaped workpiece along a predetermined plurality of predetermined dividing lines to divide the same into a plurality of wafers. A holding jig for holding a plate-like workpiece, comprising: a holding piece formed of a flexible member and having a holding surface corresponding to a size of a plate-like workpiece; and detachably supporting the holding piece A support plate formed of a rigid member having a holding portion provided with a holding surface corresponding to the size of the plate-shaped workpiece and a frame provided on the outer peripheral portion of the back surface of the workpiece holding portion In the workpiece holding portion, a plurality of openings are formed in a region corresponding to a plurality of wafers divided by a plurality of predetermined dividing lines set on the sheet-like workpiece, and are opened toward the holding surface. The suction hole sum is formed in correspondence with a plurality of predetermined dividing lines set on the plate-shaped workpiece a plurality of undercuts for retracting the cutting edge of the cutting tool in the region, the support plate having the workpiece holding portion supporting the holding piece and provided with a plurality of communication holes communicating with the plurality of suction holes And a base portion of the frame supporting surface of the frame body for supporting the frame of the holding piece.

The holding jig according to claim 1, comprising: a fixing frame having a step portion, wherein the step portion is engaged with a holding piece frame portion having an opening corresponding to a workpiece holding portion of the holding piece, and the holding piece frame portion The fixing frame is fixed to the base of the support plate.

Further, the plate-like workpiece may be divided into a plurality of blocks, and the holding piece corresponds to a plurality of blocks and a plurality of holding pieces are provided, and the supporting plate is provided with a plurality of sheet supporting portions for supporting the plurality of holding pieces.

The plurality of holding pieces are provided with ID convex portions for restricting the respective holding pieces, and a concave portion for fitting the ID convex portions is formed at a position on the support plate corresponding to the ID convex portions provided on the plurality of holding pieces.

The holding jig of the present invention includes a holding piece formed of a flexible member and a holding plate having a holding surface corresponding to the size of the plate-like workpiece, and a support plate formed of a rigid member that detachably supports the holding piece The holding piece is composed of a workpiece holding portion provided with a holding surface corresponding to the size of the plate-shaped workpiece, and a frame portion provided on the outer peripheral portion of the back surface of the workpiece holding portion, and the workpiece holding portion is formed. Forming a plurality of suction holes formed in a region corresponding to a plurality of wafers divided by a plurality of predetermined dividing lines set on the sheet-like workpiece and forming an opening in the holding surface, forming a plurality of undercuts for retracting a cutting edge of the cutting tool in a region corresponding to a plurality of predetermined dividing lines set on the sheet-like workpiece, the support plate having a workpiece for supporting the holding piece The holding portion is provided with a sheet support portion that is connected to the plurality of communication holes, and a frame that is disposed around the sheet support portion and is provided with a frame for supporting the holding piece. Since the body supports the base of the surface, the holding piece can be easily attached to and detached from the support plate. Therefore, when the workpiece is repeatedly attached and detached to the holding jig, and the workpiece holding portion of the holding sheet is damaged by abrasion or the like, and the holding function of the workpiece is lost, the self-supporting structure can be easily used. The plate of the support plate of the jig is removed. Therefore, the holding piece in which the workpiece holding portion has been damaged can be easily replaced with a new holding piece. Thereby, the replacement of the holding piece can be performed by the user, and the manufacturer only needs to send the holding piece to the user side, without the need to perform the removal of the holding piece on the manufacturer side and then return the holding jig to the user side. The operation can reduce the cost.

1‧‧‧Package substrate

Blocks 10a, 10b, 10c‧‧

11‧‧‧Metal plates

111‧‧‧1st dividing line

112‧‧‧2nd dividing line

113‧‧‧ devices

2‧‧‧Keeping fixture

3, 30a, 30b, 30c‧‧‧ holding pieces

33a, 33b, 33c‧‧‧ID convex

31‧‧‧Processed Object Maintenance Department

311‧‧‧ Keep face

311a‧‧‧ recess

312‧‧‧ attracting holes

313‧‧‧Unslot

32‧‧‧ frame

321‧‧‧ fitting recess

4, 40‧‧‧ support plate

41‧‧‧Sheet support

411‧‧‧Connected holes

42‧‧‧ base

421‧‧‧ frame support surface

422‧‧‧Bolted holes

423‧‧‧Location decision hole

43a, 43b, 43c‧‧‧ recess

5, 50‧‧‧ fixed frame

51, 51a, 51b, 51c‧‧

52‧‧‧Departure

53‧‧‧ screw holes

6‧‧‧Constrained bolts

7‧‧‧Cutting device

71‧‧‧Device housing

72‧‧‧Attracting platform

721‧‧‧Attraction recess

722‧‧‧ attracting mouth

723‧‧‧ position decision latch

73‧‧‧ spindle unit

731‧‧‧ spindle housing

732‧‧‧Rotating spindle

733‧‧‧Cutting tools

733a‧‧ arrow symbol

74‧‧‧ camera organization

X, Y, Z, X1, Y1, Z1‧‧‧ arrow symbols

1(a) and 1(b) are a perspective view and a cross-sectional view of a package substrate as a plate-like workpiece; Fig. 2 is a perspective view of a holding jig for holding the package substrate shown in Fig. 1; Figure 2 is a perspective view of the structural member of the retaining fixture; Figure 4 is a cross-sectional view taken along line AA of Figure 3; Figure 5 is a cross-sectional view taken along line BB of Figure 3; Figure 6 is a cross-sectional view taken along line CC of Figure 3; Figure 7 is a cross-sectional view taken along line DD of Figure 2; Figure 8 is a perspective view showing another embodiment of the retaining jig of the present invention; 9 is a perspective view showing the constituent members of the holding jig shown in FIG. 8 in an exploded manner; FIG. 10 is a perspective view of another package substrate used for holding the plate-shaped workpiece held by the jig shown in FIG. 8; 2 and FIG. 8 are perspective views of the cutting device for holding the jig; and FIGS. 12(a) and (b) are diagrams showing the cutting device shown in FIG. 11 held on the holding jig shown in FIG. An illustration of a cutting step in which the package substrate is cut.

Form for implementing the invention

Hereinafter, preferred embodiments of the holding jig constructed by the present invention will be described in more detail with reference to the accompanying drawings.

Fig. 1 is a perspective view and a cross-sectional view showing a package substrate as a plate-like workpiece. The package substrate 1 shown in FIGS. 1(a) and 1(b) is provided with a metal plate 11, and a plurality of first division planned lines 111 extending in a predetermined direction on the metal plate 11 are perpendicular to the first division planned line 111. The plurality of second divided planned lines 112 extending in the intersecting direction are formed in a lattice shape. A device (wafer level package) 113 is disposed in each of a plurality of regions divided by the first division planned line 111 and the second division planned line 112, and is molded from the back surface side of the metal plate 11 by the synthetic resin portion 12. The device 113. The package substrate 1 thus formed will be along the first The division planned line 111 and the second division planned line 112 are cut and divided into devices 113 (wafers) that can be individually packaged.

When the package substrate 1 is cut along the plurality of first division planned lines 111 and the second division planned line 112 by using a cutting device provided with a cutting tool having a cutting edge on the outer periphery, a holding jig for holding the package substrate 1 is required. .

2 is a perspective view showing a holding jig for holding the package substrate 1 according to the present invention, and FIG. 3 is a perspective view showing the constituent members of the holding jig shown in FIG. 2 in an exploded view. The holding jig 2 shown in FIG. 2 and FIG. 3 is provided with a holding piece 3 formed of a flexible member such as rubber and a holding surface corresponding to the size of the package substrate 1, and detachably supporting the holding piece 3 A support plate 4 formed of a rigid member such as stainless steel and a fixing frame 5 for fixing the holding piece 3 to the support plate 4.

As shown in FIG. 3 and FIG. 4, the holding piece 3 constituting the holding jig 2 is a workpiece holding portion 31 provided with a holding surface 311 having a size corresponding to the package substrate 1, and is provided in the workpiece holding portion 31. The frame portion 32 on the outer circumference of the back surface is formed. The workpiece holding portion 31 constituting the holding sheet 3 is provided with a plurality of devices 113 (wafers) formed on the plurality of first division planned lines 111 and second divided planned lines 112 set on the package substrate 1. a plurality of suction holes 312 which are formed in the corresponding area and which are formed in the holding surface 311, and are formed in a plurality of first division planned lines 111 and second divided planned lines 112 which are formed on the package substrate 1. In the region, a plurality of undercut grooves 313 for retracting the cutting edges of the cutting tool to be described later are used. Further, a concave portion 311a is formed around the suction hole 312 on the holding surface of the workpiece holding portion 31. As shown As shown in FIG. 4, the frame portion 32 constituting the holding piece 3 is provided on the outer peripheral portion of the back surface of the workpiece holding portion 31, and the fitting concave portion 321 is formed integrally on the inner side and the back surface of the workpiece holding portion 31.

As shown in FIGS. 3 and 5, the support plate 4 constituting the holding jig 2 is provided with a sheet supporting portion 41 for supporting the workpiece holding portion 31 of the holding sheet 3, and is formed with the sheet supporting portion 41. A base portion 42 for arranging the frame supporting surface 421 on the bottom surface of the frame portion 32 of the holding piece 3 is provided around the sheet supporting portion 41, so that the sheet supporting portion 41 can be fitted to the holding piece 3 The frame portion 32 and the fitting recess portion 321 formed on the back surface of the workpiece holding portion 31 are formed. In addition, as shown in FIG. 7, the sheet supporting portion 41 is fitted to the fitting recessed portion 321 of the holding piece 3, and is provided in the sheet supporting portion 41 of the support plate 4 and provided in the holding piece 3. The communication hole 411 in which the plurality of suction holes 312 of the workpiece holding portion 31 communicate with each other. Further, in a state in which the sheet supporting portion 41 is fitted to the fitting recessed portion 321 of the holding piece 3, the bottom surface of the frame body 32 on which the holding piece 3 is formed as shown in Fig. 7 is placed on the frame supporting surface of the base portion 42. 421. The base portion 42 of the support plate 4 thus configured is provided with a plurality of bolt insertion holes 422 for inserting the fastening bolts 6 for fixing the fixing frame 5 to be described later to the periphery of the sheet support portion 41. Further, in the base portion 42 of the support plate 4, a position determining hole 423 is provided at four corners for determining a position to be mounted on a suction platform of a cutting device to be described later.

As shown in FIGS. 3 and 6, the fixing frame 5 constituting the holding jig 2 is provided with an opening 51 corresponding to the size of the workpiece holding portion 31 of the holding piece 3. A step portion 52 that engages with the frame portion 32 of the holding piece 3 is provided in the inner peripheral portion of the fixing frame 5. Moreover, as shown in FIG. 6, on the bottom surface of the fixed frame 5, and in the above A plurality of screw holes 53 for screwing the joint bolts 6 are formed at positions corresponding to the plurality of bolt insertion holes 422 of the base portion 42 of the support plate 4.

The holding piece 3, the support plate 4, and the fixing frame 5 constituting the holding jig 2 are constructed as described above, and are combined as shown in Figs. 2 and 7. That is, the fitting recessed portion 321 of the holding piece 3 is fitted to the sheet supporting portion 41 of the support plate 4. In this state, the bottom surface of the frame body 32 of the holding piece 3 is placed on the frame supporting surface 421 of the base portion 42. Next, the workpiece holding portion 31 of the holding piece 3 is nested in the opening 51 of the fixing frame 5 so that the step portion 52 is engaged with the top surface of the frame portion 32 of the holding piece 3. In this state, the plurality of screw holes 53 formed in the fixing frame 5 can be positioned to oppose the plurality of bolt insertion holes 422 provided in the base portion 42 of the support plate 4. Further, as shown in FIG. 7, the connection bolt 6 is inserted from the lower side of the plurality of bolt insertion holes 422 provided in the base portion 42 of the support plate 4 to be screwed into the plurality of screw holes 53 formed in the fixing frame 5, Thereby, the support plate 4, the holding piece 3, and the fixing frame 5 are fixed to each other to constitute the holding jig 2. The package substrate 1 can be placed on the holding piece 3 of the jig 2 that is configured as described above.

Next, another embodiment of the holding jig will be described with reference to Figs. 8 and 9 .

The holding jig 20 shown in Figs. 8 and 9 is a user corresponding to the package substrate 10 shown in Fig. 10. In the package substrate 10 shown in FIG. 10 and the holding jig 20 shown in FIG. 8 and FIG. 9, the same members as those of the package substrate 1 and the holding jig 2 will be denoted by the same reference numerals and will not be described. Description.

The package substrate 10 shown in FIG. 10 is formed by three blocks 10a, 10b, and 10c, and a plurality of first division planned lines 111 and extending in a predetermined direction respectively intersect perpendicularly to the first division planned line 111. 2nd point extending in the direction The cut line 112 is formed in a lattice shape. Further, a device (wafer level package) 113 is disposed in each of a plurality of regions divided by the first division planned line 111 and the second division planned line 112.

The holding jig 20 shown in FIG. 8 and FIG. 9 for holding the package substrate 10 is provided with a holding surface having a size corresponding to the three blocks 10a, 10b, and 10c of the package substrate 10, which is flexible by rubber or the like. The three holding pieces 30a, 30b, 30c formed by the structural members and the support plate 40 formed of a rigid member such as stainless steel detachably supporting the three holding pieces 30a, 30b, 30c, and for holding the three holding pieces 30a , 30b, 30c are fixed to the fixing frame 50 of the support plate 40.

As shown in FIGS. 8 and 9, the holding pieces 30a, 30b, and 30c constituting the holding jig 20 are respectively processed by a holding surface 311 having a size corresponding to the three blocks 10a, 10b, and 10c of the package substrate 10. The holding portion 31 and the frame portion 32 provided on the outer periphery of the back surface of the workpiece holding portion 31 are formed. The workpiece holding portion 31 constituting the holding sheets 30a, 30b, and 30c is provided with a plurality of plural first predetermined line 111 and second divided line 112 which are formed on the package substrate 10, respectively. In the region corresponding to the device 113 (wafer), a plurality of opening holes 312 are formed in the holding surface 311, and a plurality of first division planned lines 111 and second divisions formed on the package substrate 10 are provided. In the region corresponding to the predetermined line 112, a plurality of undercut grooves 313 for retracting the cutting edges of the cutting tool to be described later are used. In the three holding pieces 30a, 30b, and 30c thus configured, ID convex portions 33a, 33b, and 33c for restricting the holding pieces 30a, 30b, and 30c, respectively, are provided on the bottom surface of the frame portion 32, respectively. The ID convex portions 33a, 33b, 33c are three branches that selectively remove the same arrangement In the case of one of the latches, the ID convex portion 33a is a form in which one of the side pins is removed, the ID convex portion 33b is a form in which the central one is removed, and the ID convex portion 33c is a one in which the central side is removed. Shape. Further, other configurations of the holding pieces 30a, 30b, and 30c can be made the same as those of the above-described holding piece 3.

As shown in FIG. 9, the support plate 40 constituting the holding jig 20 has the sheet supporting portions 41a, 41b, 41c and the sheet body respectively supporting the workpiece holding portions 31 of the three holding pieces 30a, 30b, 30c. The support portions 41a, 41b, 41c form a base portion 42 which is disposed around the sheet body supporting portions 41a, 41b, 41c in a stepwise manner. Further, in the base portion 42, recesses 43a and 43b into which the ID convex portions 33a, 33b, and 33c are fitted are provided at positions corresponding to the ID convex portions 33a, 33b, and 33c provided in the holding pieces 30a, 30b, and 30c, respectively. 43c. Thereby, the holding pieces 30a, 30b, 30c can be surely supported by the sheet supporting portions 41a, 41b, 41c of the support plate 40, respectively. Furthermore, the other configuration of the support plate 40 can be made the same as that of the above-described support plate 4.

As shown in Fig. 9, the fixing frame 50 constituting the holding jig 20 is provided with openings 51a, 51b, and 51c corresponding to the size of the workpiece holding portion 31 of the three holding pieces 30a, 30b, and 30c. Furthermore, the other structure of the fixing frame 50 can be made the same as that of the above-described fixing frame 5.

The holding pieces 30a, 30b, 30c and the supporting plate 40 and the fixing frame 50 constructed as described above are combined in the same manner as the above-described holding jig 2 to constitute the holding jig 20 shown in Fig. 8.

Next, a cutting device for cutting the package substrate 1 or 20 placed on the holding jig 2 or 20 along the first dividing line 111 and the second dividing line 112 will be described with reference to FIG.

The cutting device 7 shown in Fig. 11 has a device housing 71 having a substantially rectangular parallelepiped shape. The inside of the apparatus casing 71 is disposed such that the suction stage 72 holding the workpiece moves in a direction indicated by an arrow symbol X as a cutting conveyance direction. The top surface of the suction platform 72 is provided with a suction concave portion 721, and the suction opening 722 that forms an opening in the suction concave portion 721 communicates with a suction mechanism (not shown). Further, in the four corners of the top surface of the suction platform 72, the position determining pin 723 to which the position determining holes 423 provided in the four corners of the holding jig 2 are fitted is erected. Further, the suction stage 72 is configured to be rotatable by a rotating mechanism not shown. The suction stage 72 thus constructed is movable in the cutting conveyance direction indicated by the arrow symbol X through a cutting conveyance mechanism (not shown).

The cutting device 7 is provided with a spindle unit 73 as a cutting mechanism. The spindle unit 73 is configured to be movable in an indexing direction indicated by an arrow Y in FIG. 11 by an indexing mechanism not shown, and can be arrowed in FIG. 11 by a cutting mechanism not shown. The symbol Z indicates the movement in the cut-in direction. The spindle unit 73 as the cutting mechanism is provided to be mounted on a moving base (not shown) and can be moved in a direction indicated by an arrow Y in the indexing direction and in a direction indicated by an arrow Z in the cutting direction. The spindle housing 731 and the rotary spindle 732 rotatably supported by the spindle housing 731 and the cutting tool 733 having a cutting edge disposed on the outer periphery of the front end portion of the rotary spindle 732.

Further, the cutting device 7 is provided with an imaging mechanism 74 for capturing the surface of the workpiece held on the suction stage 72 to detect the cutting area of the cutting tool 733. The imaging mechanism 74 has an optical system composed of a microscope and an imaging element (CCD), and can transmit the captured image signal Send it to the control unit not shown.

The cutting device 7 shown in FIG. 11 is configured as described above, and a cutting operation for cutting the package substrate 1 along the plurality of first dividing line 111 and the second dividing line 112 by the cutting device 7 will be described below.

First, the holding jig 2 is placed on the suction platform 72 of the cutting device 7. At this time, the plurality of position determining holes 423 provided in the four corners of the holding jig 2 are fitted to the positions of the four corners of the suction platform 72 to determine the latch 723, so that the holding jig 2 can be positioned. To the intended location. Further, screw holes are formed in the four corners of the suction platform 72 instead of the position determining pins 723, and the bolts are inserted into the plurality of position determining holes 423 provided in the four corners of the holding jig 2 to be screwed into the screw holes. However, it is also possible to keep the jig 2 converged to the attraction platform 72. When the jig 2 is attached to the suction platform 72, the package substrate 1 which is schematically aligned and positioned by the position determining mechanism not shown can be placed on the workpiece of the holding piece 3 by a transfer mechanism (not shown). Holding portion 31. Further, by activating the suction mechanism (not shown), the suction port 722 of the suction platform 72, the suction concave portion 721, and the plurality of communication holes 411 provided in the sheet supporting portion 41 constituting the support plate 4 of the jig 2 are removed. The plurality of suction holes 312 provided in the workpiece holding portion 31 of the holding sheet 3 are applied to the package substrate 1 placed on the workpiece holding portion 31 of the holding sheet 3 that holds the jig 2 by a negative pressure. In the device 113 (wafer), each device 113 (wafer) of the package substrate 1 is sucked and held by the workpiece holding portion 31 constituting the holding sheet 3 of the jig 2 (package substrate holding step).

When the above-described package substrate holding step has been carried out, the cutting transfer mechanism not shown can be actuated until the holding of the package substrate 1 is maintained. The device 2 moves directly below the camera mechanism 74. When the holding jig 2 is positioned directly below the imaging mechanism 74, a calibration operation for detecting the processing region of the package substrate 1 to be cut by the imaging mechanism 74 and the control mechanism not shown can be performed. In other words, the imaging unit 74 and the control unit (not shown) can execute the first dividing line 111 formed in the predetermined direction of the package substrate 1 and the cutting tool 733 which is cut along the first dividing line 111. Image processing such as pattern matching is performed to perform calibration of the processing area that should be machined. Moreover, the calibration of the processing region to be cut can be performed in the same manner with respect to the second division planned line 112 extending in the direction perpendicular to the predetermined direction formed in the package substrate 1.

As described above, when the calibration operation for detecting the processing area of the package substrate 1 which should be subjected to the cutting process has been performed, the holding jig 2 can be moved to the cutting area, and predetermined by as shown in FIG. 12(a) One end of the first division planned line 111 is just below the cutting tool 733 and is positioned just to the right of FIG. 12(a). Further, while the cutting tool 733 is rotated in the direction indicated by the arrow symbol 733a, the cutting mechanism (not shown) is actuated to cause the cutting tool 733 to cut into a predetermined amount in the direction indicated by the arrow symbol Z1 to be positioned. At a predetermined plunging depth. This cutting depth is set so that the outer periphery of the cutting edge of the cutting tool 733 can reach the position of the undercut groove 313 (see FIGS. 2 and 4) provided in the holding piece 3 constituting the jig 2 . Next, the cutting conveyance mechanism (not shown) is actuated to move the suction stage 72 at a predetermined cutting conveyance speed in the direction indicated by the arrow symbol X1 in Fig. 12(a). And, by predetermining the package substrate 1 that is held on the attraction platform 72 by the holding jig 2 When the other end of the first division planned line 111 reaches the right side of the cutting tool 733 as shown in FIG. 12(b) and is located just to the left side, the movement of the suction stage 72 is stopped, and the cutting tool 733 is indicated by the arrow symbol Z2. The direction is raised, and then the index is transferred to the first dividing line 111 to be cut to repeat the cutting operation. As a result, the package substrate 1 can be cut along the first division planned line 111 (first cutting step).

When the first cutting step is performed, the suction stage 72 is rotated by 90 degrees, and the second dividing line 112 formed on the package substrate 1 held by the holding fixture 2 on the suction stage 72 is positioned to the cutting conveyance. In the direction indicated by the arrow symbol X in the direction, the package substrate 1 is subjected to a cutting operation along all of the second division planned lines 112 (second cutting step) in the same manner as the above-described first cutting step.

As described above, the package substrate 1 subjected to the first cutting step and the second cutting step can be cut along the first dividing line 111 and the second dividing line 112, and divided into individual devices. (Wafer Level Package) 113. The device 113 thus divided can be placed in a transport tray (not shown) for transfer to the assembly step of the next step.

When the mounting jig 2 is attached and detached to the holding jig 2 by performing the cutting operation as described above, the workpiece holding portion 31 of the holding piece 3 which is formed of the flexible member such as rubber which holds the jig 2 is formed. The retention function of the package substrate 1 may be lost due to damage due to abrasion or the like. In the case where the workpiece holding portion 31 of the holding piece 3 is damaged in this manner, the joining bolt 6 for fixing the supporting plate 4 and the holding piece 3 constituting the holding jig 2 and the fixing frame 5 to each other can be loosened. Remove the fixing frame 5 so that it can be easily self-supporting The plate 4 takes off the holding piece 3. Therefore, the holding piece 3 damaged by the workpiece holding portion 31 can be easily replaced with the new holding piece 3. Thereby, the replacement of the holding piece can be performed by the user, and the manufacturer only needs to send the holding piece to the user side, without the need to perform the removal of the holding piece on the manufacturer side and then returning the holding jig to the use. The operation of the party can achieve the purpose of reducing costs.

2‧‧‧Keeping fixture

3‧‧‧ Keeping the film

311‧‧‧ Keep face

312‧‧‧ attracting holes

313‧‧‧Unslot

4‧‧‧Support board

5‧‧‧Fixed frame

Claims (4)

A holding jig for holding a plate-shaped workpiece when a cutting tool having a cutting edge on the periphery cuts a plate-shaped workpiece along a predetermined plurality of predetermined dividing lines to divide the sheet into a plurality of wafers The present invention includes: a holding piece formed of a flexible member having a holding surface corresponding to a size of a plate-like workpiece; and a support plate formed of a rigid member detachably supporting the holding piece, The holding piece is composed of a workpiece holding portion provided with a holding surface corresponding to the size of the plate-shaped workpiece, and a frame portion provided on the outer peripheral portion of the back surface of the workpiece holding portion, and the workpiece holding portion is provided a plurality of suction holes formed in a region corresponding to a plurality of wafers divided by a plurality of predetermined dividing lines set on the sheet-like workpiece, and openings formed in the holding surface, formed in the sheet-like workpiece a plurality of undercuts in a region corresponding to the predetermined plurality of predetermined lines to be used for retracting the cutting edge of the cutting tool, the support plate having the workpiece holding portion supporting the holding piece a sheet supporting portion of the plurality of communicating holes that communicate with the plurality of suction holes, and a frame that is disposed around the sheet supporting portion and provided with the frame for supporting the holding piece The base of the support surface. The holding jig according to claim 1, further comprising a fixing frame provided with a step portion having a portion opposite to the workpiece holding portion of the holding piece The opening of the size is engaged with the frame portion of the holding piece, and the fixing frame is fixed to the base of the support plate. The holding jig according to claim 1 or 2, wherein the plate-shaped workpiece is divided into a plurality of blocks, and the holding piece is provided with a plurality of holding pieces corresponding to the plurality of blocks, the support The plate is provided with a plurality of sheet support portions for supporting the plurality of holding pieces. The holding jig according to claim 3, wherein the plurality of holding pieces are provided with ID convex portions for restricting the respective holding pieces, and corresponding to the ID convex portions provided on the plurality of holding pieces on the supporting plate The position forms a recess for fitting the ID convex portion.