CN107068606B - Processing device - Google Patents
Processing device Download PDFInfo
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- CN107068606B CN107068606B CN201610987077.1A CN201610987077A CN107068606B CN 107068606 B CN107068606 B CN 107068606B CN 201610987077 A CN201610987077 A CN 201610987077A CN 107068606 B CN107068606 B CN 107068606B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Provided is a processing device which can hold and process a workpiece without using vacuum. A processing device (2) for processing a workpiece (11) formed by containing a ferromagnetic substance, the processing device (2) comprising: a chuck table (10) for holding a workpiece by a holding surface (10 a); a processing component (12) which processes the processed object held by the chuck worktable; and a conveying member (48) for conveying the workpiece to the chuck table or conveying the workpiece from the chuck table, wherein the chuck table has a 1 st magnetic force holding part (64) on the holding surface side, the 1 st magnetic force holding part (64) holds the workpiece by magnetic force, and the conveying member has a 2 nd magnetic force holding part (84), and the 2 nd magnetic force holding part (84) holds the workpiece or a supporting member (15) for supporting the workpiece by magnetic force.
Description
Technical Field
The present invention relates to a processing apparatus for processing a plate-shaped workpiece.
Background
When dividing a plate-shaped object to be processed, such as a semiconductor wafer or a package substrate, into a plurality of chips, a processing apparatus, such as a cutting apparatus or a laser processing apparatus, is used. These machining apparatuses are provided with a chuck table for sucking and holding a workpiece by vacuum generated by a pump such as an ejector (see, for example, patent document 1).
The work is sucked and held on the chuck table in a state where an adhesive tape called a dicing tape or the like is attached to a lower surface, for example. An annular frame is fixed to an outer peripheral portion of the adhesive tape so that the divided objects (a plurality of chips) can be collected and transported.
However, the above-mentioned adhesive tape used for dividing the workpiece is disposable, and there is room for improvement in terms of manufacturing cost. In recent years, in order to hold a divided workpiece (a plurality of chips) without using an adhesive tape, a jig table or the like having a suction portion corresponding to each chip has been proposed (for example, see patent documents 2 and 3).
Patent document 1: japanese patent laid-open publication No. 2004-200440
Patent document 2: japanese patent laid-open publication No. 2013-65603
Patent document 3: japanese patent laid-open publication No. 2014-116486
However, in the jig table as described above, when the chip is miniaturized to a certain degree, the suction force acting on each chip is insufficient and the chip cannot be held properly. The same problem occurs in a conveying unit that sucks, holds, and conveys the divided workpieces.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a processing apparatus capable of holding and processing a workpiece without using vacuum.
According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece including a material exhibiting ferromagnetic properties, the processing apparatus including: a chuck table for holding a workpiece by a holding surface; a processing member for processing the workpiece held by the chuck table; and a conveying member that carries the workpiece into and out of the chuck table, wherein the chuck table has a 1 st magnetic force holding portion on the holding surface side, the 1 st magnetic force holding portion holds the workpiece by magnetic force, the conveying member has a 2 nd magnetic force holding portion, and the 2 nd magnetic force holding portion holds the workpiece or a support member that supports the workpiece by magnetic force.
In one aspect of the present invention, it is preferable that the 1 st magnetic force retaining portion or the 2 nd magnetic force retaining portion has an electromagnet.
A processing apparatus according to an embodiment of the present invention includes: a chuck table for holding a workpiece formed by including a substance exhibiting ferromagnetic properties by magnetic force; and a conveying member for holding the workpiece or a support member for supporting the workpiece by magnetic force, so that the workpiece can be held without using vacuum.
Drawings
Fig. 1 is a perspective view schematically showing a configuration example of a processing apparatus.
Fig. 2 (a) is a partial cross-sectional side view schematically showing the structure of the chuck table of the present embodiment, fig. 2 (B) is a partial cross-sectional side view schematically showing the structure of the chuck table of modification 1, (C) is a partial cross-sectional side view schematically showing the structure of the chuck table of modification 2, and (D) is a partial cross-sectional side view schematically showing the structure of the chuck table of modification 3.
Fig. 3 (a) is a partially cross-sectional side view schematically showing the structure of the conveying unit of the present embodiment, fig. 3 (B) is a partially cross-sectional side view schematically showing the structure of the conveying unit of modification 1, (C) is a partially cross-sectional side view schematically showing the structure of the conveying unit of modification 2, and (D) is a partially cross-sectional side view schematically showing the structure of the conveying unit of modification 3.
Fig. 4 is a perspective view schematically showing a configuration example of a machining device according to a modification.
Description of the reference symbols
2. 112, 112: a machining device (cutting device); 4: a base station; 4a, 4b, 4c, 4 d: an opening; 6: an X-axis moving table; 8: a dustproof drip-proof cover; 10. 72, 74, 76: a chuck table; 10 a: a holding surface; 12: a cutting unit (machining unit, machining member); 14: a support structure; 16: a cutting unit moving mechanism; 18: a Y-axis guide rail; 20: moving the plate along the Y axis; 22: a Y-axis ball screw; 24: a Y-axis pulse motor; 26: a Z-axis guide rail; 28: moving the plate along the Z axis; 30: a Z-axis ball screw; 32: a Z-axis pulse motor; 34: a cutting tool; 36: a camera; 42: a carry-in side table; 42 a: a holding surface; 44: a positioning member; 46: a carry-out side table; 46 a: a holding surface; 48. 92, 94, 96: a conveying unit (conveying member); 48 a: a holding surface; 50: a nozzle; 62: a support plate; 62 a: an aspiration path; 62 b: a groove; 64: a magnet (1 st magnetic force holding part); 66: a cover plate; 68: a clamp; 82: a holding plate; 84: a magnet (2 nd magnetic force holding part); 86: a cover plate; 102: a holding frame; 104: a holding section; 106: a magnet (2 nd magnetic force holding part); 108: a suction holding part; 114: a cassette supporting table; 116: a cartridge; 118: a cleaning unit; 120: a grip portion; 122: a guide rail; 11: a workpiece; 13: an adhesive tape; 15: a frame.
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view schematically showing a configuration example of a machining device (cutting device) 2 according to the present embodiment. In the present embodiment, the description has been given of the processing apparatus (cutting apparatus) 2 for cutting a plate-shaped workpiece, but the processing apparatus of the present invention may be a laser processing apparatus or the like for processing a workpiece with a laser beam.
As shown in fig. 1, the processing apparatus 2 includes a base 4 that supports each structure. A rectangular opening 4a that is long in the X-axis direction (front-rear direction, machining feed direction) is formed in the center of the base 4. In the opening 4a, an X-axis moving table 6, an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dust-proof and drip-proof cover 8 for covering the X-axis moving mechanism are disposed.
A chuck table 10 for holding a plate-like workpiece 11 is provided above the X-axis moving table 6. As shown in fig. 1, the workpiece 11 is, for example, a rectangular package substrate, a ceramic substrate, a glass substrate, a semiconductor wafer, or the like, which is made of a ferromagnetic material such as iron, cobalt, or nickel, and a pressure-sensitive adhesive tape (adhesive film) 13 is attached to the lower surface thereof.
However, the shape of the workpiece 11 is not limited. Further, an annular frame (support member) 15 may be fixed to the outer edge portion of the pressure-sensitive adhesive tape 13 (see fig. 2 (D), etc.). In this case, the workpiece 11 is supported by the annular frame 15 through the adhesive tape 13.
The chuck table 10 is moved in the X-axis direction together with the X-axis moving table 6 by the X-axis moving mechanism described above. The chuck table 10 is connected to a rotation driving source (not shown) such as a motor and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction). The upper surface of the chuck table 10 serves as a holding surface 10a for holding the workpiece 11. Details of the chuck table 10 will be described below.
A gate-shaped support structure 14 for supporting the two sets of cutting means (machining means, machining members) 12 is disposed on the upper surface of the base 4 so as to extend across the opening 4 a. Two sets of cutting unit moving mechanisms 16 for moving the respective cutting units 12 in the Y-axis direction (the left-right direction, the indexing direction) and the Z-axis direction are provided on the upper front surface of the support structure 14.
The cutting unit moving mechanisms 16 each have a pair of Y-axis guide rails 18 arranged on the front surface of the support structure 14 and parallel to the Y-axis direction. A Y-axis moving plate 20 constituting each cutting unit moving mechanism 16 is slidably attached to the Y-axis guide rail 18. A nut portion (not shown) is provided on the back surface side (rear surface side) of each Y-axis moving plate 20, and a Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed to the nut portion.
One end of each Y-axis ball screw 22 is connected to a Y-axis pulse motor 24. If the Y-axis ball screw 22 is rotated by the Y-axis pulse motor 24, the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide 18.
A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the front surface (front surface) of each Y-axis moving plate 20. A Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26. Nut portions (not shown) are provided on the back surface side (rear surface side) of each Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed into each nut portion.
One end of each Z-axis ball screw 30 is connected to a Z-axis pulse motor 32. If the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.
A cutting unit 12 is provided below each Z-axis moving plate 28. The cutting unit 12 includes an annular cutting tool 34 attached to one end side of a spindle (not shown) serving as a rotating shaft. A nozzle (not shown) for supplying a cutting fluid (machining fluid) such as pure water is disposed in the vicinity of the cutting tool 34. A camera 36 for imaging the workpiece 11 held on the chuck table 10 is provided at a position adjacent to the cutting tool 34.
If the Y-axis moving plate 20 is moved in the Y-axis direction by each cutting unit moving mechanism 16, the cutting unit 12 and the camera 36 are moved in the Y-axis direction. Then, if the Z-axis moving plate 28 is moved in the Z-axis direction by each cutting-unit moving mechanism 16, the cutting unit 12 and the camera 36 are moved in the Z-axis direction.
A carry-in side table 42 for placing the workpiece 11 before machining is disposed in a region on the front side of the support structure 14 and on the side of the X-axis movement mechanism (opening 4 a). The upper surface of the carry-in-side table 42 serves as a holding surface 42a for holding the workpiece 11. An L-shaped positioning member 44 for defining the position of the workpiece 11 is disposed at a corner of the holding surface 42 a.
A carry-out-side table 46 for placing the processed object 11 is disposed in a region on the front side of the support structure 14 and on the other side of the X-axis movement mechanism (opening 4 a). That is, the X-axis movement mechanism (opening 4a) is sandwiched between the carry-in side table 42 and the carry-out side table 46. The upper surface of the carry-out-side table 46 serves as a holding surface 46a for holding the workpiece 11.
A conveying unit (conveying means) 48 is provided in the vicinity of the carry-in side table 42 and the carry-out side table 46, and the conveying unit (conveying means) 48 conveys (carries in) the workpiece 11 before processing from the carry-in side table 42 onto the chuck table 10 and conveys (carries out) the workpiece 11 after processing from the chuck table 10 onto the carry-out side table 46. The details of the carrying unit 48 will be described below.
A nozzle 50 for ejecting air is disposed in a region between the X-axis moving mechanism (opening 4a) and the carrying-out-side table 46. The nozzle 50 blows air to the workpiece 11 and the like while the conveyance unit 48 holding the workpiece 11 moves above the carry-out-side table 46. Thereby, the cutting fluid adhering to the workpiece 11 or the like is dried and removed.
When the workpiece 11 is cut by the machining apparatus 2 configured as described above, the workpiece 11 placed on the carry-in side table 42 is carried to the chuck table 10 by the carrying unit 48, for example. Next, the rotating cutting tool 34 is caused to cut into the workpiece 11 while the chuck table 10 is moved in the X-axis direction with the cutting tool 34 aligned with the line to be processed extending in the 1 st direction of the workpiece 11. Thereby, the workpiece 11 is cut along the intended processing line of the object.
After the workpiece 11 is cut along the intended processing line of the object, the cutting tool 34 is moved in the Y-axis direction so that the cutting tool 34 is aligned with the adjacent intended processing line. Then, the rotating cutting tool 34 is caused to cut into the workpiece 11 while the chuck table 10 is moved in the X-axis direction.
After repeating this operation, the workpiece 11 is cut along all the lines to be processed extending in the 1 st direction, and then the chuck table 10 is rotated to align the cutting tool 34 with the lines to be processed extending in the 2 nd direction. Then, the workpiece 11 is cut along the machining scheduled line. Similarly, the workpiece 11 is cut in order along the remaining lines extending in the 2 nd direction.
In this way, by cutting the workpiece 11 along all the planned processing lines extending in the 1 st direction and the 2 nd direction, the workpiece 11 can be divided into a plurality of chips. The divided workpiece 11 (a plurality of chips) is conveyed onto the carry-out side table 46 by the conveying unit 48.
Fig. 2 (a) is a side view, partially in section, schematically showing the configuration of the chuck table 10 of the present embodiment. As shown in fig. 2 (a), the chuck table 10 of the present embodiment includes a support plate 62 having a size corresponding to the workpiece 11. Although the shape of the support plate 62 is arbitrary, the support plate 62 which is viewed as a rectangle in plan is used here. A plurality of magnets (1 st magnetic force holding portion) 64 are arranged on the upper surface side of the support plate 62.
Each magnet 64 is a permanent magnet or an electromagnet. Each magnet 64 is provided at a position corresponding to a plurality of chips obtained by dividing the workpiece 11, for example. As described above, since the workpiece 11 is formed to include a substance exhibiting ferromagnetism, the workpiece 11 can be held by the magnetic force (attraction force) generated between each magnet 64 and the workpiece 11. The plurality of chips obtained by division are individually held by, for example, magnetic force generated by each magnet 64. However, the magnets 64 need not be provided at positions corresponding to a plurality of chips.
A cover plate 66 is disposed above the plurality of magnets 64. The upper surface of the cover plate 66 serves as a holding surface 10a of the chuck table 10. However, the cover plate 66 may be omitted.
Fig. 2 (B) is a side view, partially in section, schematically showing the structure of the chuck table 72 of modification 1. Here, many components of the chuck table 72 of modification 1 are the same as those of the chuck table 10 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
The chuck table 72 of modification 1 is configured to be capable of sucking and holding the outer edge portion of the adhesive tape 13. Specifically, the support plate 62 is provided with a suction passage 62a that is open at the outer edge portion of the upper surface. The suction passage 62a is connected to a suction source (not shown) such as an injector via a valve (not shown) or the like. This allows the outer edge portion of the pressure-sensitive adhesive tape 13 to be sucked and held by the negative pressure of the suction source.
Fig. 2 (C) is a side view, partially in section, schematically showing the structure of the chuck table 74 of modification 2. Here, many components of the chuck table 74 of modification 2 are the same as those of the chuck table 10 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
The chuck table 74 according to modification 2 is configured to be able to cut the workpiece 11 without using the adhesive tape 13. Specifically, a groove 62b corresponding to the line to be processed of the workpiece 11 is formed in the upper surface of the support plate 62. The width 62b of the groove is larger than the thickness (width) of the cutting insert 34, for example.
Thus, the cutting tool 34 can cut the workpiece 11 completely by cutting it into a sufficient depth without using the adhesive tape 13. In the chuck table 74, the cover plate 66 is omitted, and the upper surface of the support plate 62 (the upper surface of the magnet 64) serves as the holding surface 10 a.
Fig. 2 (D) is a side view, partially in section, schematically showing the structure of the chuck table 76 according to modification 3. Here, many components of the chuck table 76 of the modification 3 are the same as those of the chuck table 10 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
The chuck table 76 of modification 3 is configured to hold an annular frame (support member) 15 fixed to the outer edge portion of the adhesive tape 13. That is, a plurality of jigs 68 for fixing the frame 15 are provided on the outer side of the support plate 62. Each of the clamps 68 may be configured to be able to fix the frame 15 by magnetic force.
Fig. 3 (a) is a side view, partially in cross section, schematically showing the structure of the conveying unit 48 of the present embodiment. As shown in fig. 3 (a), the conveyance unit 48 of the present embodiment includes a holding plate 82 having a size capable of holding the entire workpiece 11. Although the shape of the holding plate 82 is arbitrary, the holding plate 82 which is viewed as a rectangle in plan is used here. A plurality of magnets (2 nd magnetic force holding portions) 84 are arranged on the lower surface side of the holding plate 82.
Each magnet 84 is a permanent magnet or an electromagnet. Each magnet 84 is provided at a position corresponding to a plurality of chips obtained by dividing the workpiece 11, for example. As described above, since the workpiece 11 is formed to include a substance exhibiting ferromagnetism, the workpiece 11 can be held by the magnetic force (attraction force) generated between each magnet 84 and the workpiece 11. The plurality of chips obtained by division are individually held by, for example, magnetic force generated by each magnet 84. However, each magnet 84 need not be provided at a position corresponding to a plurality of chips
In addition, an electromagnet is used for at least one of the magnet 64 of the chuck table 10 or the like and the magnet 84 of the transfer unit 48. If at least one of the magnet 64 and the magnet 84 is used as an electromagnet in this way, the magnetic force acting between the magnet 64 and the workpiece 11 or between the magnet 84 and the workpiece 11 can be adjusted, and the workpiece 11 can be transferred between the chuck table 10 and the like and the transfer unit 48.
For example, when the workpiece 11 is transferred from the chuck table 10 to the transfer unit 48, the magnetic force acting between the magnet 84 and the workpiece 11 may be made larger than the magnetic force acting between the magnet 64 and the workpiece 11. On the other hand, when the workpiece 11 is transferred from the transfer unit 48 to the chuck table 10, the magnetic force acting between the magnet 64 and the workpiece 11 may be made larger than the magnetic force acting between the magnet 84 and the workpiece 11.
A cover plate 86 is disposed below the plurality of magnets 84. The lower surface of the cover plate 86 serves as a holding surface 48a for holding the workpiece 11. However, the cover plate 86 may be omitted.
Fig. 3 (B) is a side view, partially in section, schematically showing the structure of a conveying unit (conveying member) 92 of modification 1. The conveyance unit 92 is configured to hold an annular frame (support member) 15 fixed to the outer edge of the adhesive tape 13. Here, the frame 15 containing a substance showing a ferromagnetic property is used.
The conveyance unit 92 has a holding frame 102 having a size corresponding to the frame 15. A plurality of holding portions 104 for holding the frame 15 are provided in a region outside the lower surface of the holding frame 102. A magnet (2 nd magnetic force holding portion) 106 is disposed on the lower surface side of each holding portion 104. Each magnet 106 is a permanent magnet or an electromagnet.
As described above, since the frame 15 is formed to include a substance showing a ferromagnetic property, the frame 15 can be held by a magnetic force (attraction force) generated between each magnet 104 and the frame 15. That is, the workpiece 11 can be held via the frame 15 (and the adhesive tape 13). In addition, an electromagnet is used for at least one of the magnet 64 and the magnet 106. This makes it possible to transfer the workpiece 11 (frame 15) between the chuck table 10 and the like and the conveyance unit 92.
Fig. 3 (C) is a side view, partially in section, schematically showing the structure of a conveying unit (conveying member) 94 of modification 2. Here, many components of the conveying unit 94 of the modification 2 are the same as those of the conveying units 48 and 92 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
The conveyance unit 94 of modification 2 is configured by combining the conveyance unit 48 and the conveyance unit 92. Specifically, the holding plate 82 is provided in the central region of the lower surface of the holding frame 102. This enables both the workpiece 11 and the frame 15 to be held by magnetic force.
Fig. 3D is a side view, partially in cross section, schematically illustrating the structure of the conveying unit (conveying member) 96 according to modification 3. Here, many components of the conveying unit 96 of modification 3 are the same as those of the conveying units 48 and 92 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
The conveyance unit 96 according to modification 3 is provided with a plurality of suction holding portions 108 for sucking and holding the frame 15 in a region outside the lower surface of the holding frame 102. The suction holding portion 108 is connected to a suction source (not shown) such as an ejector via a suction passage (not shown) or the like. The holding plate 82 is provided in a central region of the lower surface of the holding frame 102. This allows the frame 15 to be attracted and held while holding the workpiece 11 by magnetic force.
Further, when the holding by the magnetic force and the holding by the suction are used in combination as in the conveyance unit 96 of the modification 3, for example, it is preferable to provide a pressure sensor in the suction path to determine whether or not the object is appropriately held. For example, when the measurement value of the pressure sensor is lower than the threshold value (or lower than the threshold value), it is determined that the object is properly held, and when the measurement value of the pressure sensor is equal to or higher than the threshold value (or higher than the threshold value), it is determined that the object is not properly held. This can prevent the object from falling off.
Fig. 4 is a perspective view schematically showing a configuration example of a machining device (cutting device) 112 according to a modification. Here, many components of the machining apparatus 112 of the modification are the same as those of the machining apparatus 2 described above. Therefore, the same components are assigned the same reference numerals, and detailed description thereof is omitted.
As shown in fig. 4, the machining device 112 of the modification includes a base 4 that supports each structure. A rectangular opening 4b is formed in a front corner of the base 4, and a cartridge support base 114 is provided in the opening 4b so as to be able to move up and down. A rectangular parallelepiped cassette 116 for housing the plurality of workpieces 11 supported by the frame 15 is placed on the upper surface of the cassette support table 114. In fig. 4, for convenience of explanation, only the outline of the cartridge 116 is shown.
A rectangular opening 4c that is long in the X-axis direction is formed on a side of the cassette support table 114. An X-axis movement table 6, an X-axis movement mechanism (not shown), and a dust-proof and drip-proof cover 8 are disposed in the opening 4 c. A chuck table 76 according to the above-described modification 3 is provided above the X-axis moving table 6.
A gate-shaped support structure 14 for supporting the two sets of cutting units 12 is disposed on the upper surface of the base 4 so as to extend across the opening 4 c. Two sets of cutting unit moving mechanisms 16 for moving the cutting units 12 in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 14. A circular opening 4d is formed at a position opposite to the opening 4b with respect to the opening 4 c. A cleaning unit 118 for cleaning the workpiece 11 after cutting is disposed in the opening 4 d.
The conveyance unit 94 of the above-described modification 2 is provided in the vicinity of the cassette support base 114 and the cleaning unit 118. The conveying unit 94 has a grip 120 that grips the frame 15, and can pull out the frame 15 stored in the cassette 116 onto an adjacent guide rail 122, for example.
As described above, the machining devices (cutting devices) 2 and 112 according to the present embodiment and the modification include: chuck tables 10 and 76 for holding a workpiece 11 containing a ferromagnetic substance by magnetic force; and conveying means (conveying members) 48, 94 for holding the workpiece 11 or a frame (support member) 15 for supporting the workpiece 11 by magnetic force, and thus capable of holding and processing the workpiece 11 without using vacuum.
The present invention is not limited to the above embodiments, and various modifications can be made. For example, a conveying unit that conveys (carries in) the workpiece 11 to the chuck table and a conveying unit that conveys (carries out) the processed workpiece 11 from the chuck table may be provided separately.
Claims (2)
1. A processing device for processing a workpiece including a ferromagnetic substance, characterized in that,
the processing device is provided with:
a chuck table for holding a workpiece by a holding surface;
a processing member for processing the workpiece held by the chuck table; and
a conveying member for conveying the object to be processed into or out of the chuck table,
the chuck table has: a 1 st magnetic force holding unit which is provided on the holding surface side and holds the workpiece by a magnetic force; and a suction path having an opening for sucking and holding an outer edge portion of the adhesive tape adhered to the workpiece,
the conveying member includes: a 2 nd magnetic force holding unit for holding the workpiece by magnetic force; and a suction holding portion for sucking and holding the support member fixed to the outer edge portion of the adhesive tape,
a pressure sensor is provided in a suction path connecting the suction holding portion and a suction source.
2. The processing device according to claim 1,
one of the 1 st magnetic force holding part and the 2 nd magnetic force holding part uses an electromagnet, and the other of the 1 st magnetic force holding part and the 2 nd magnetic force holding part uses a permanent magnet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015231243A JP6579930B2 (en) | 2015-11-27 | 2015-11-27 | Processing equipment |
| JP2015-231243 | 2015-11-27 |
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| Publication Number | Publication Date |
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| CN107068606A CN107068606A (en) | 2017-08-18 |
| CN107068606B true CN107068606B (en) | 2022-02-18 |
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| CN201610987077.1A Active CN107068606B (en) | 2015-11-27 | 2016-11-09 | Processing device |
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| JP (1) | JP6579930B2 (en) |
| KR (1) | KR102486302B1 (en) |
| CN (1) | CN107068606B (en) |
| TW (1) | TWI708657B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6765751B2 (en) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | Work piece holding mechanism and processing equipment |
| JP6973931B2 (en) * | 2017-12-25 | 2021-12-01 | 株式会社ディスコ | Cutting equipment |
| JP6976660B2 (en) * | 2018-02-07 | 2021-12-08 | 株式会社ディスコ | Processing equipment |
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| JP2008103648A (en) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device |
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| CN105097613A (en) * | 2014-05-13 | 2015-11-25 | 株式会社迪思科 | Chuck table of cutting apparatus |
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| JP4590314B2 (en) | 2005-06-22 | 2010-12-01 | 三菱電機株式会社 | Wafer carrier |
| JP5466964B2 (en) * | 2010-02-08 | 2014-04-09 | 株式会社ディスコ | Work holding mechanism |
| JP5947010B2 (en) | 2011-09-15 | 2016-07-06 | 株式会社ディスコ | Splitting device |
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| JP2015012263A (en) * | 2013-07-02 | 2015-01-19 | 株式会社ディスコ | Processing device |
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2015
- 2015-11-27 JP JP2015231243A patent/JP6579930B2/en active Active
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2016
- 2016-10-12 TW TW105132909A patent/TWI708657B/en active
- 2016-11-04 KR KR1020160146508A patent/KR102486302B1/en active IP Right Grant
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Patent Citations (6)
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| JP2008103648A (en) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device |
| JP2009206166A (en) * | 2008-02-26 | 2009-09-10 | Renesas Technology Corp | Method of manufacturing semiconductor device |
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| CN105097613A (en) * | 2014-05-13 | 2015-11-25 | 株式会社迪思科 | Chuck table of cutting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170062377A (en) | 2017-06-07 |
| JP2017098471A (en) | 2017-06-01 |
| TWI708657B (en) | 2020-11-01 |
| TW201720573A (en) | 2017-06-16 |
| CN107068606A (en) | 2017-08-18 |
| JP6579930B2 (en) | 2019-09-25 |
| KR102486302B1 (en) | 2023-01-06 |
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