JP2009206166A - Method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automate a process of fixing a substrate structure to a holding frame with an adhesive tape. <P>SOLUTION: After the substrate structure 14 is disposed inside the holding frame 13 to have predetermined position relation, the holding frame 13 is held by a holding frame clamp (fixing means) 27g using magnetic force. After a dicing tape (adhesive tape) 12 is fitted to the holding frame 13 and substrate structure 14, the dicing tape is cut along the holding frame 13 to be parted into an in-use portion (first adhesive sheet) 12a and a surplus portion (second adhesive sheet) 12b. After the surplus portion 12b of the dicing tape 12 is peeled off the holding frame, the fixing force with which the holding frame clamp 27g fixes the holding frame 13 is weakened and the holding frame 13 is taken out together with the substrate structure 14 to be conveyed. The holding frame clamp 27g is a permanent magnet disposed on a surface of a sticking stage 27, where the holding fame 13 is placed, opposed to the holding frame 13 movably in a direction crossing the holding frame 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device manufacturing technique, and more particularly, to a semiconductor device manufacturing method in which a structure to be separated such as a multi-piece substrate and an adhesive sheet are bonded to each other in an individualization step. It is related to effective technology.

  There is a semiconductor device having a structure in which a semiconductor chip is mounted on one main surface of a substrate and the main surface side is sealed with a sealing resin.

  As an example of a method for manufacturing a semiconductor device having the above structure, for example, in Japanese Patent Laid-Open No. 2000-12745 (Patent Document 1), a large number of semiconductor elements are mounted in a matrix on the main surface of an insulating frame (substrate). A technique is disclosed in which a plate-shaped package panel (substrate structure) is formed by resin-sealing them all over the entire surface with a sealing resin, and the package panel is cut.

Further, in Patent Document 1, an adhesive sheet (adhesive sheet) is attached to the main surface side (surface sealed with a sealing resin) of the package panel before the package panel is separated into pieces. In this state, a technique is described in which the package panel is cut by abrasive cutting of a circular blade in this state.
JP 2000-12745 A

  When cutting with the adhesive sheet attached to the substrate structure to be separated, the adhesive sheet plays a role of fixing the position of the substrate structure so as not to shift during the cutting process. In the semiconductor device manufacturing process, the singulation means for cutting with the adhesive sheet attached is generally used when the wafer is singulated into individual semiconductor chips. Recently, however, MAP (Mold Array Process) and It is also used in a so-called semiconductor device manufacturing method.

  In the MAP, a multi-chip substrate having a plurality of package areas arranged in an array is prepared, and a semiconductor chip is mounted in each package area. Next, an external connection terminal of the semiconductor chip is electrically connected to a conductor pattern such as a pad included in the multi-chip substrate. Next, the main surface side of the substrate on which the semiconductor chip is mounted is sealed with a sealing resin. In this sealing process, for example, a multi-cavity substrate on which a semiconductor chip is mounted is sandwiched between an upper mold having a cavity large enough to accommodate a plurality of package regions on the lower surface side and a lower mold having a flat upper surface, and the cavity A sealing resin is injected into the interior and cured. After that, this multi-chip substrate structure (a structure in which a semiconductor chip is mounted on the main surface of the multi-chip substrate and the mounting surface is resin-sealed) is fixed in a holding frame with an adhesive sheet, and a dicing blade or the like Thus, individual semiconductor devices are separated. In the step of fixing the multi-piece substrate structure with the adhesive sheet, the multi-piece substrate structure and the holding frame are arranged in a predetermined positional relationship, and an adhesive sheet is attached so as to cover them, and then necessary. The adhesive sheet is cut to a size to obtain a multi-piece substrate structure supported by a holding frame.

  Here, the multi-chip substrate structure is generally harder than the wafer, and a stronger force is required for cutting. For this reason, the adhesive tape used for individualizing the multi-piece substrate structure is higher in adhesive strength than the adhesive tape used for wafer individualization.

  However, when an adhesive tape with high adhesive strength is used, the force that clamps the holding frame to the work stage when the excess adhesive tape is removed from the holding frame after the adhesive tape has been cut to the required size (clamping force) If it is small, the holding frame floats, which causes a problem that the excess adhesive tape cannot be completely peeled off. Further, if the adhesive tape cannot be completely peeled off, the holding frame and the multi-piece substrate structure may be wound around the adhesive tape winding device. Further, when the holding frame is lifted by being pulled by the adhesive tape, the holding frame or the multi-chip substrate structure itself may be twisted and damaged.

  On the other hand, if the clamping force for fixing the holding frame to the work stage is increased, the adhesive tape can be peeled off. However, if the clamping force is too large, the multi-piece substrate structure is held after the adhesive tape is peeled off. When transported together, it becomes difficult to lift the holding frame from the work stage.

  For this reason, the process of fixing the multi-piece substrate structure to the holding frame with the adhesive tape (particularly the process of peeling off the excess adhesive tape and the process of transporting the multi-piece board structure together with the holding frame) is difficult to automate, This is done manually or semi-automatically, in which only the adhesive tape is applied automatically.

  This invention is made | formed in view of the said subject, The objective is to provide the technique which can automate the process of fixing a board | substrate structure body to a holding frame with an adhesive tape.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, according to one embodiment of the present invention, a method of manufacturing a semiconductor device has a first structure in which a substrate structure is disposed inside a ring-shaped holding frame and then the holding frame is placed on a stage by a fixing means using magnetic force. A step of fixing with a fixing force. Also, a step of attaching the adhesive sheet, the holding frame and the substrate structure, and a first adhesive sheet for cutting the adhesive sheet along the holding frame and fixing the substrate structure and the holding frame And a step of separating into a second adhesive sheet separated from the first adhesive sheet. Furthermore, after the second adhesive sheet is peeled off from the holding frame, and after the second adhesive sheet is peeled off from the holding frame, the fixing means fixes the holding frame to the first holding frame. A second fixing force that is smaller than the fixing force of the substrate structure, and a step of taking out and transporting the holding frame together with the substrate structure, and a step of separating the substrate structure in a state of being fixed to the holding frame. is doing. Here, the fixing means is a plurality of permanent magnets arranged on a surface of the stage on which the holding frame is placed facing the holding frame so as to be movable in a direction intersecting the holding frame. .

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, according to one embodiment of the present invention, since the force for fixing (holding) the holding frame to the stage is changed according to the process, the process of fixing the substrate structure to the holding frame with the adhesive tape is automated. be able to.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like. Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges. Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted as much as possible. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Structure of semiconductor device>
FIG. 1 is a cross-sectional view of an essential part showing an example of the structure of a semiconductor device according to an embodiment of the present invention.

  The semiconductor device of this embodiment is a resin-sealed small semiconductor package in which a semiconductor chip 1 is mounted on a wiring board. In this embodiment, as an example, a CSP (Chip as shown in FIG. 1) is used. (Size Package) 7 will be described. Note that the CSP 7 shown in FIG. 1 has a plurality of solder balls 8 as external connection terminals arranged in a grid on the back surface 3b of the package substrate (wiring substrate) 3. Therefore, the CSP 7 is an area array type. This is a semiconductor device. As such a semiconductor device, in addition to the BGA (Ball Grid Array) shown in FIG. 1, for example, the solder ball 8 shown in FIG. 1 is not formed, but the land portion 3d of the package substrate 3 is used as an external connection terminal. There is also a semiconductor device such as a Land Grid Array.

  The structure of the CSP 7 shown in FIG. 1 will be described. The package substrate 3 as a wiring substrate, the semiconductor chip 1 mounted on the main surface 3 a of the package substrate 3, the pads 1 c as the electrodes of the semiconductor chip 1, and the package substrate 3. A conductive wire 4 that electrically connects the bonding terminal 3e, a plurality of land portions 3d formed on the back surface 3b of the package substrate 3, and a resin body 6 are provided. A plurality of solder balls 8 as external connection terminals are formed on the land portion 3d.

  The semiconductor chip 1 is made of, for example, silicon, and an integrated circuit is formed on the main surface 1a. The planar shape of the main surface 1a of the semiconductor chip 1 is a square, and the semiconductor chip 1 shown in FIG. 1 is, for example, a square. In addition, a plurality of pads 1c that are electrically connected to the integrated circuit are formed on the peripheral portion of the main surface 1a. The pads 1c and the bonding terminals 3e disposed on the peripheral edge of the main surface 3a of the package substrate 3 are electrically connected by conductive wires 4, respectively. The wire 4 is, for example, a gold wire.

  As shown in FIG. 1, the back surface 1b of the semiconductor chip 1 is fixed to the package substrate 3 via an adhesive 2 such as a paste agent or a die attach film, and the main surface 1a faces upward. 3 is installed.

  The package substrate 3 has a main surface 3a, a back surface 3b located on the opposite side of the main surface 3a, and a core material 3c. A plurality of bonding terminals (wire bonding portions) 3e are formed on the peripheral edge of the main surface 3a. The main surface 3a is covered with a solder resist film 3f which is an insulating film. An opening window is formed corresponding to the arrangement of the bonding terminals 3e, and at least a part of the bonding terminals 3e is on the main surface 3a side. Is exposed. The wire 4 is bonded to a region where the bonding terminal 3e is exposed.

  On the other hand, a plurality of land portions 3d are formed on the back surface 3b of the package substrate 3, and are arranged, for example, in a lattice pattern. The land portion 3d and the bonding terminal 3e are electrically connected via a conductor pattern such as a wiring (not shown) or a through hole (not shown) formed on the package substrate 3 (core material 3c). ing. The back surface 3b of the package substrate 3 is covered with a solder resist film 3f which is an insulating film. An opening window is formed corresponding to the arrangement of the land portion 3d, and at least a part of the land portion 3d is on the back surface 3b side. It is structured to be exposed to. Solder balls 8 are provided on the back surface 3b of the package substrate 3 so as to correspond to the exposed portions of the land portions 3d. The solder balls 8 are made of, for example, solder such as Pb—Sn, and are arranged in a lattice pattern on the back surface 3 b of the package substrate 3.

  The resin body 6 is made of, for example, an epoxy resin and is formed on the main surface 3a side of the package substrate 3 and seals the semiconductor chip 1 and the plurality of conductive wires 4 with resin.

  The CSP 7 of the present embodiment is a small semiconductor package, but as shown in FIG. 1, the plane areas of the semiconductor chip 1 and the package substrate 3 are approximately the same. That is, the package substrate 3 has an area slightly larger than that of the semiconductor chip 1.

  The CSP 7 shown in FIG. 1 is shown as an example of the present embodiment, and the number and size of each component are not limited to this. For example, FIG. 1 shows an example in which one semiconductor chip 1 is mounted, but a plurality of semiconductor chips 1 may be stacked or arranged side by side.

<Method for Manufacturing Semiconductor Device>
Next, a manufacturing method of CSP 7 shown in FIG. 1 will be described. In the present embodiment, a manufacturing method called MAP will be described as an example of a manufacturing method of CSP7. 2 is a manufacturing process flow diagram showing an example of assembly up to the resin mold in the assembly of the semiconductor device shown in FIG. 1, and FIG. 3 is a manufacturing process flow diagram showing an example of assembly after the resin mold in the assembly of the semiconductor device shown in FIG. 4 is a plan view of the multi-cavity substrate prepared in the substrate preparation step shown in FIG. 2, and FIG. 5 is a substrate in which the main surface of the multi-cavity substrate is resin-sealed in the resin molding step shown in FIG. It is a perspective view which shows the whole structure of a structure.

  First, substrate preparation shown in step S1 of FIG. 2 is performed. Here, a multi-chip substrate 9 is prepared in which a plurality of package regions 9a (40 in FIG. 4) are arranged as shown in FIG. The package region 9a is partitioned and arranged in a matrix.

  Next, the die bonding shown in step S <b> 2 is performed, and the semiconductor chip 1 is mounted (fixed) on the multi-piece substrate 9 via the adhesive 2. Here, the semiconductor chip 1 is mounted on each of the plurality of package regions 9a shown in FIG.

  Next, wire bonding shown in step S3 is performed. Here, the semiconductor chip 1 and the multi-chip substrate 9 are electrically connected. Specifically, the pads 1c on the main surface 1a of the semiconductor chip 1 shown in FIG. 1 and the bonding terminals 3e, which are wire bonding portions of the package substrate 3 of the multi-chip substrate 9 corresponding thereto, are electrically conductive such as gold wires. The wire 4 is electrically connected.

  Next, the resin mold shown in step S4 is performed. Here, a plurality of semiconductor chips 1 and a plurality of wires 4 (that is, a plurality of package regions 9 a shown in FIG. 4) are collectively covered with a single cavity 15 a of a resin molding die 15 on a multi-chip substrate 9. Resin sealing is performed, thereby forming the collective sealing body 5. The sealing resin forming the collective sealing body 5 is, for example, a thermosetting epoxy resin.

  When the encapsulating resin 5 is formed by curing the encapsulating resin, the encapsulating body 5 is formed on the main surface (semiconductor chip mounting surface) 3a side of the multi-chip substrate 9 shown in FIGS. The formed substrate structure 14 is obtained.

  Next, ball mounting shown in step S5 of FIG. 3 is performed, and solder balls are applied to the land portions 3d (see FIG. 1) of the back surface 3b (see FIG. 1) of the multi-piece substrate 9 (package substrate 3 shown in FIG. 3). 8 is connected. Here, after applying solder to the land portions 3d of the multi-chip substrate 9, the solder balls 8 are formed by reflow processing.

  Then, the mark shown in step S6 is performed. Here, marking 10 is performed to mark the collective sealing body 5. The marking 10 can be performed by, for example, an ink marking method or a laser marking method. In addition, the timing which performs the process of the mark shown to this step S6 should just be after forming the collective sealing body 5, and is not limited to the timing shown in FIG. For example, it may be performed before the ball mounting step shown in step S5 or after the singulation step shown in step S7.

  Next, individualization shown in step S7 is performed. When the singulation is completed, the assembly of the CSP 7 is completed as shown in step S8, and the product is completed.

  By the way, in order to divide into pieces, it is necessary to fix the substrate structure 14 at a predetermined position of the dicing apparatus. In the present embodiment, as the fixing means, the substrate structure 14 and the holding frame that holds the substrate structure 14 are fixed to each other by affixing a dicing tape to the substrate structure 14 in a predetermined positional relationship. A method of fixing to a stage of a dicing apparatus (hereinafter referred to as a tape dicing method) is used.

  In the tape dicing method, since the dicing tape is applied so as to cover one surface of the substrate structure 14, the substrate structure 14 that is being cut is more than the method in which the substrate structure 14 is directly adsorbed to the dicing stage (adsorption dicing method). Easy to fix the whole in place. Therefore, the tape dicing method is an individualization method suitable for manufacturing a relatively small semiconductor device. The outline of the individualization process shown in step S7 will be described below.

  First, in step S4, a dicing tape (adhesive sheet) 12 is attached to a multi-chip substrate 9 (that is, the substrate structure 14) whose main surface 3a side is sealed and a holding frame that holds the substrate, and these are predetermined. Fix in positional relationship.

  Next, the substrate structure 14 fixed to the holding frame 13 is taken out together with the holding frame 13 and conveyed to a dicing apparatus, and is cut using a cutting jig such as the dicing blade 11 while being fixed to the holding frame 13. Turn into. When the substrate structure 14 is separated, the CSP 7 shown in FIG. 1 is obtained.

  Next, each CSP 7 is transported to the pickup device while being fixed to the holding frame 13, and the adhesive strength of the dicing tape 12 is weakened (for example, a method of weakening the adhesive strength by irradiating light can be used. ) Later, the individual CSPs 7 are picked up from the dicing tape 12 and sent to the next process (selection process, packaging process, etc.).

  Of the series of singulation steps, the step of fixing the substrate structure 14 to the holding frame will be described in detail below. 6 is a plan view showing a state in which the substrate structure sealed on the main surface side is arranged inside the holding frame, and FIG. 7 is a main part showing a stage on which the holding frame and the substrate structure shown in FIG. 6 are placed. It is an enlarged plan view. FIG. 8 is a cross-sectional view of the main part showing an outline of the attaching device of the present embodiment, and FIG. 9 is a plan view showing the positional relationship between the dicing tape after being cut and the holding frame. FIG. 10 is a cross-sectional view of the main part showing the process of peeling off the surplus part of the dicing tape shown in FIG. 11 is an enlarged perspective view of the main part showing the periphery of the holding frame clamp shown in FIG. 7, and FIG. 12 shows the holding frame placed on the holding frame clamp shown in FIG. It is a principal part expanded sectional view which shows a cross section. FIG. 13 is an enlarged cross-sectional view of a main part showing a modified example of the holding frame clamp shown in FIG. FIG. 14 is a cross-sectional view of an essential part showing a step of taking out the holding frame shown in FIG. 10 and transporting it to a dicing apparatus.

  (A) First, the holding frame 13 shown in FIG. 6 is prepared, the substrate structure 14 is disposed inside the holding frame 13, and then the holding frame 13 is attached to the stage 27 by a fixing means using magnetic force. Fix with the first fixing force.

  The holding frame 13 is a frame made of a metal having magnetism (for example, a stainless steel) used for arranging the substrate structure 14 at a predetermined position of each apparatus in the above-described series of individualization steps. The holding frame 13 has a ring shape, and a tapered portion 13a for positioning at a predetermined position of each device is formed on the outer edge thereof.

  In this arrangement step, the holding frame 13 and the substrate structure 14 are arranged in a predetermined positional relationship. The position of the substrate structure 14 is defined by a plurality of positioning pins 27 d that extend from the substrate placement portion 27 a of the attaching stage 27. The positioning pin 27d is preferably movable up and down using a lifting jig such as a cylinder. This is to prevent the positioning pins 27d and the substrate structure 14 from colliding and being damaged when the substrate structure 14 is disposed.

  A plurality of substrate clamps 27e (see FIG. 7), which are fixing means for the substrate structure 14, are disposed on the substrate placement portion 27a of the attaching stage 27. The substrate clamp 27e is, for example, a rubber tube having an opening connected to the intake path, and can adsorb and fix the substrate structure 14.

  On the other hand, the position of the holding frame 13 is defined by a guide 27 f formed on the holding frame arrangement portion 27 b of the attaching stage 27. The outer shape of the holding frame 13 is not a perfect circle, but has four tapered portions 13a as shown in FIG. The guide 27 f of the holding frame arrangement portion 27 b also has a tapered portion 27 c corresponding to the tapered portion of the holding frame 13. The direction of the holding frame 13 is defined by combining the tapered portion 13a and the tapered portion 27c.

  Further, a holding frame clamp 27g (see FIG. 7) as a fixing means for the holding frame 13 is formed on the holding frame arrangement portion 27b of the bonding stage 27, whereby the holding frame 13 is fixed to the bonding stage 27. . For example, as shown in FIG. 7, the holding frame clamps 27g are arranged at four locations along the position where the holding frame 13 (see FIG. 6) is arranged. As shown in FIG. 10, the holding frame clamp 27g has a cylinder body 27ga and a cylinder rod 27gb. Further, as shown in FIG. 12, permanent magnets 27gd are housed in the magnet housing portions 27gc arranged at the end portions (tip ends) of the cylinder rods 27gb. The holding frame clamp 27g fixes the holding frame 13 to the holding frame arrangement portion 27b with a first fixing force by the magnetic force of the permanent magnet 27gd. The detailed structure and effects of the holding frame clamp 27g will be described later. This will be described in detail.

  Further, in the holding frame arrangement portion 27b of the affixing stage 27, sensors 27h for detecting the lifting of the holding frame 13 by a vacuum suction method are arranged at four locations. This is a detector for detecting an inconvenience caused by the lifting of the holding frame 13 at an early stage and stopping the pasting apparatus 20 in a process described later. Since the sensor 27h vacuum-sucks the holding frame 13, this vacuum suction force is also a part of the first fixing force. However, this vacuum attraction force is a small force as compared with the permanent magnet 27gd.

  In this step, the height of the holding frame 13 and the substrate structure 14 is also adjusted. That is, the height adjustment is performed so that the upper surface of the holding frame 13 and the upper surface of the substrate structure 14 (the surface of the collective sealing body 5 in FIG. 6) are substantially the same plane. This is because the dicing tape 12 (see FIG. 8) is uniformly applied in the next step. The height adjustment method can be adjusted by moving one or both of the substrate placement portion 27a and the holding frame placement portion 27b of the attaching stage 27 in the height direction. In the present embodiment, the height adjustment is performed by making the holding frame arrangement part 27b movable in the height direction independently of the board arrangement part 27a.

  FIG. 6 shows a state in which two substrate structures 14 are arranged as an arrangement example. Thus, if a plurality of substrate structures 14 are arranged, the manufacturing efficiency can be improved. However, the number of substrate structures 14 to be arranged can be appropriately selected from one to several according to the dimensions of the substrate structure 14, and is not limited to two.

  In the present embodiment, an embodiment in which the adhesive sheet is attached to the surface of the collective sealing body 5 in the adhesive sheet attaching process described later will be described. did.

  (B) Next, the dicing tape 12 shown in FIG. 8 is affixed, and the holding frame 13 and the substrate structure 14 are fixed.

  In this step, for example, the dicing tape 12 can be continuously pasted using the pasting apparatus 20 shown in FIG.

  When the dicing tape 12 is stuck continuously, the dicing tape 12 is set in the supply unit 21 in a state where a long strip-shaped tape is wound up by a roll as shown in FIG. 8, for example. In addition, in the state set to the supply part 21, the dicing tape 12 is set in the state in which the cover tape 16 was affixed on the surface of the adhesion layer.

  The dicing tape 12 delivered from the supply unit 21 is fed so as to sew between a plurality of rollers 22 and is wound around the collection unit 23. The cover tape 16 is peeled off before the attaching portion 24 and is taken up by the cover tape collecting portion 25. In addition, tension rollers 26 are disposed before and after the pasting portion 24, and the dicing tape 12 is in a state of being stretched with a predetermined tension.

  The holding frame 13 and the substrate structure 14 described with reference to FIG. 6 are disposed on a pasting stage 27 installed in the pasting unit 24. The affixing device 20 has an affixing roller (affixing jig) 28 and has a structure capable of moving the area of the affixing portion 24. In FIG. 8, the affixing roller 28 moves along the surface of the affixing stage 27 from the collection unit 23 toward the supply unit 21.

  The affixing roller 28 moves from one end of the holding frame 13 to the other end while pressing the substrate structure 14 with a predetermined pressure from above via the dicing tape 12, whereby the holding frame 13 and the substrate are moved. Dicing tape 12 is affixed to structure 14 (in this embodiment, dicing tape 12 is affixed to batch sealing body 5 shown in FIG. 6).

  (C) Next, the dicing tape 12 is cut on the surface side of the holding frame 13 where the dicing tape 12 is attached. Here, for example, the end of the rotary blade 29a attached to the cutter support 29 shown in FIG. 8 is in contact with the surface of the holding frame 13 to which the dicing tape 12 is attached, as shown in FIG. The holding frame 13 is rotated along the circumferential orbit and cut.

  The cutter support portion 29 has a structure that can be raised and lowered in the height direction, and is disposed above the attaching portion 24 in the steps (a) and (b) as shown in FIG. Then, the cutter support portion 29 can be automatically lowered onto the pasting portion 24. In addition, the cutter support portion 29 has a structure that can rotate around the center of the holding frame 13 as a central axis, so that the cutter frame supports the circumferential track of the holding frame 13 on the surface of the holding frame 13 on which the dicing tape 12 is attached. The dicing tape 12 can be cut along.

  Through this step, the dicing tape 12 is used as shown in FIG. 9 in which a use portion (first adhesive sheet) 12a for fixing the substrate structure 14 and the holding frame 13 and a surplus portion (second portion) separated from the use portion 12a. Adhesive sheet) 12b. FIG. 9 shows a state in which the use portion 12a is cut into a circle along the circumferential track of the holding frame 13.

  (D) Next, the excess part 12 b of the dicing tape 12 is peeled off from the holding frame 13. In this step, the excess roller 12b is sequentially peeled off by moving in the direction of arrow 30a while rotating the peeling roller (peeling means) 30 shown in FIG.

  Here, the substrate structure 14 is hard, and a strong force is required for cutting. For this reason, the dicing tape 12 used for dividing the substrate structure 14 is generally one having higher adhesive strength than the dicing tape used for dividing the wafer. Therefore, in this step, when the surplus portion 12b of the dicing tape 12 is peeled off, if the holding frame 13 is not peeled off in a state of being fixed with a strong force, the holding frame 13 is in the middle of being peeled off. It may rise with it.

  For this reason, as shown in FIG. 10, the affixing roller 28 is arranged in front of the advancing direction (arrow 30 a) of the peeling roller 30, and the peeling roller 30 is pressed while holding the holding frame 13 and the substrate structure 14 with the affixing roller 28. It is preferable to pull it up and peel it off. Thereby, it can suppress to some extent that the holding frame 13 or the board | substrate structure 14 floats during this process. Moreover, it can peel with stronger force, so that the angle which pulls up the remainder part 12b with respect to the sticking surface (upper surface) of the holding frame 13 is enlarged. For this reason, it is preferable to make the distance between the affixing roller 28 and the peeling roller 30 closer.

  In the present embodiment, as shown in FIG. 12, a permanent magnet 27gd is attached to an end (tip) of a holding frame clamp 27g which is a fixing means for fixing the holding frame 13, and this holding frame clamp 27g. Are attached to the surface of the attaching stage 27 facing the holding frame 13 (four places in FIG. 7). Therefore, the holding frame 13 can be firmly fixed to the affixing stage 27 by the magnetic force of the permanent magnet 27gd. That is, the lifting of the holding frame 13 can be prevented in this step.

  By the way, fixing by vacuum suction can be considered as fixing means other than magnetic force. For example, the holding frame 13 is fixed by arranging a plurality of suction pads, each of which has an intake path substantially at the center, on the surface of the holding frame arrangement portion 27b facing the holding frame 13 shown in FIG. However, when vacuum suction is used as the fixing means, the number of pads becomes large. Further, if the holding frame 13 is slightly distorted or warped, a gap is generated between the suction pad and the holding frame 13, which causes the suction force to be significantly reduced.

  On the other hand, since the magnetic force is used as the fixing means in the present embodiment, it is possible to fix the permanent magnet 27gd with a smaller number than in the case of vacuum suction by selecting a permanent magnet having a strong magnetic force. Further, if the holding frame 13 is slightly distorted or warped, a gap may be formed between the permanent magnet 27gd and the holding frame 13, but the force with which the permanent magnet 27gd fixes the holding frame 13 is a case of vacuum suction. Compared with, it does not decrease so much. Therefore, when the magnetic force is used as the fixing means, the holding frame 13 can be fixed more stably than in the case of vacuum suction.

  In FIG. 12, the most distal surface of the holding frame clamp 27g is located at a position lower than the surface of the holding frame arrangement portion 27b that faces the holding frame 13. That is, the most advanced surface of the holding frame clamp 27g is set to be slightly lower than the lower surface of the holding frame 13. For this reason, when the cylinder rod 27gb is raised in the direction of the holding frame 13, it is possible to prevent the tip of the holding frame clamp 27g from colliding with the holding frame 13 and shifting its position.

However, the height relationship between the foremost surface of the holding frame clamp 27g and the surface of the holding frame arrangement portion 27b facing the holding frame 13 is not limited to the mode shown in FIG. For example, as shown in FIG. 13, the foremost surface of the holding frame clamp 27g may be flush with the surface facing the holding frame 13 of the holding frame arrangement portion 27b. That is, you may set so that the front-end | tip surface of the holding frame clamp 27g and the lower surface of the holding frame 13 may become the same height.

  In this case, since the foremost surface of the holding frame clamp 27g contacts the lower surface of the holding frame 13, the holding frame 13 can be fixed with high strength. In this case, it is preferable that the drive source for raising and lowering the cylinder rod 27gb is a fluid pressure such as a gas pressure or a hydraulic pressure. This is because even when the tip of the holding frame clamp 27g collides with the holding frame 13, the impact is alleviated and the position of the holding frame 13 is prevented from being displaced by a fluid such as gas or oil as a driving source. . In the structure shown in FIG. 12, it goes without saying that a gas pressure or a fluid pressure such as a hydraulic pressure may be used as a drive source for the cylinder rod 27gb.

  12 and 13, the permanent magnet 27gd is housed in the magnet housing portion 27gc disposed at the tip of the cylinder rod. However, the structure is not limited to this structure. Other structures may be used as long as the predetermined magnetic force of the permanent magnet 27gd is transmitted to the holding frame 13 and the permanent magnet 27gd is not peeled off from the cylinder rod 27gb even when a force for peeling off the dicing tape 12 is applied. good. For example, it is good also as a structure stuck on the front-end | tip of cylinder rod 27gb with an adhesive agent. However, in this case, it is necessary to use an adhesive having such a strength that the permanent magnet 27gd is not peeled off from the cylinder rod 27gb even when a force for peeling off the dicing tape 12 is applied.

  (E) Next, the substrate structure 14 is taken out together with the holding frame 13 and conveyed to the dicing apparatus. In the step (d), the holding frame 13 and the substrate structure 14 are fixed via the dicing tape 12. Therefore, in this step, for example, as shown in FIG. The jig 31 is lifted and conveyed.

  Here, as described in the step (d), when the holding frame 13 is fixed by the holding frame clamp 27g which is a strong fixing means, the holding frame 13 cannot be lifted by the suction force of the suction jig 31. . Although a method of lifting the holding frame clamp 27g with a larger suction force than the force for fixing the holding frame 13 is also conceivable, in this case, it is not practical from the viewpoint of the apparatus size and energy cost.

  Therefore, in the present embodiment, as shown in FIG. 14, the holding frame clamp 27g has a cylinder body portion 27ga and a cylinder rod 27gb, and the permanent magnet 27gd attached to the end of the cylinder rod 27gb is a holding frame. 13 is arranged so as to be movable in a direction crossing 13.

  When the cylinder rod 27gb is lowered, the distance between the permanent magnet 27gd disposed at the end and the holding frame 13 is increased. That is, the permanent magnet 27gd is moved away from the holding frame 13. For this reason, after the step (d), before the holding frame 13 is lifted, the holding frame clamp 27g fixes the holding force of the holding frame 13 when the first fixing force (the holding frame 12b is peeled off). The second fixing force smaller than the force (fixing force 13) can be set. Thus, the holding frame 13 is lifted even if the suction force of the suction jig 31 is small, by setting the fixing force for fixing the holding frame 13 as the second fixing force smaller than the first fixing force described above. be able to.

  That is, since the steps (a) to (e) can be continuously processed by each mechanism provided in the attaching device 20 (see FIG. 8), the substrate structure 14 is held by the dicing tape 12 with the holding frame 13. The process of fixing to can be automated.

  In this step, it is preferable that the fixing force of the fixing means other than the holding frame clamp 27g is reduced in advance before the holding frame 13 is lifted. This is for easily lifting the holding frame 13. In the present embodiment, vacuum suction means such as the substrate clamp 27e and the sensor 27h shown in FIG. 7 correspond to this. These vacuum suction means can reduce the fixing force by stopping the intake.

<First Modification of Holding Frame Clamp>
Next, a first modification of the holding frame clamp 27g shown in FIGS. 10 to 14 will be described with reference to FIGS. FIG. 15 is an enlarged cross-sectional view of a main part showing a cross-sectional structure of a holding frame clamp as a first modification of the present embodiment, and FIG. 16 shows a state in which the holding frame is fixed using the holding frame clamp shown in FIG. It is a principal part expanded sectional view.

  The structure of the holding frame clamp 27k shown in FIGS. 15 and 16 is the same as the structure of the holding frame clamp 27g shown in FIGS. 10 to 14 except for the following differences. Therefore, repeated description is omitted.

  The first difference between the holding frame clamp 27k shown in FIGS. 15 and 16 and the holding frame clamp 27g shown in FIGS. 10 to 14 is that the most distal surface of the holding frame clamp 27k is the holding frame 13 of the holding frame arranging portion 27b. It is the point which becomes a position higher than the surface which opposes. The second difference is that rubber (elastic body) 27ke is disposed between the permanent magnet 27kd and a cylinder body (not shown) that drives the cylinder rod 27kb.

  In the present embodiment, since the process of fixing the substrate structure 14 to the holding frame 13 with the dicing tape 12 is automated, the processing is continuously performed using the plurality of holding frames 13. As described above, after all the CSPs 7 separated from the dicing tape 12 are picked up, the dicing tape 12 is peeled off from the holding frame 13 and the holding frame 13 is reused. Since the holding frame 13 is reused in this way, distortion or warping may occur due to deterioration over time or trouble during work.

  Here, in FIGS. 10 to 14, the foremost surface of the holding frame clamp 27 g is lower than or the same plane as the surface facing the holding frame 13 of the holding frame arrangement portion 27 b. For this reason, depending on the degree of warping or distortion of the supplied holding frame 13, the holding frame 13 may not be sufficiently fixed.

  Accordingly, as shown in FIG. 15, by setting the foremost surface of the holding frame clamp 27k to be higher than the surface facing the holding frame 13 of the holding frame arranging portion 27b, the permanent frame as shown in FIG. Since the magnet 27kd can be brought into contact with the holding frame 13, it can be more reliably fixed.

  However, when the foremost surface of the holding frame clamp 27g shown in FIGS. 10 to 14 is made higher than the surface facing the holding frame 13 of the holding frame arrangement portion 27b, the lower surface of the holding frame 13 is the surface of the holding frame arrangement portion 27b. It is not stable because it does not come into contact with.

  Therefore, as shown in FIG. 16, the rubber 27ke is disposed between the permanent magnet 27kd and the cylinder body (not shown) for driving the cylinder rod 27kb, so that when the holding frame 13 is placed, the rubber 27ke is deformed. It can be stabilized.

  15 and 16, the rubber 27ke is disposed between the permanent magnet 27kd and the cylinder rod 27kb, but the position of the rubber 27ke is not limited to this. If the cylinder rod 27kb rises to the highest point and the holding frame 13 and the permanent magnet 27kd come into contact with each other, if the lower surface of the holding frame 13 can be brought into contact with the surface of the holding frame arrangement portion 27b when the holding frame 13 and the permanent magnet 27kd come into contact, It can be arranged at an arbitrary position between the cylinder main body (not shown) that drives the cylinder rod kb.

  Further, in the present embodiment, rubber 27ke is shown as an example of the elastic body because of good workability, but other springs or the like can be used as the elastic body.

<Second Modification of Holding Frame Clamp>
Next, a second modification of the holding frame clamp 27g shown in FIGS. 10 to 14 will be described with reference to FIG. FIG. 17 is an enlarged cross-sectional view of a main part showing a cross-sectional structure of a holding frame clamp which is a modification of the present embodiment. The structure of the holding frame clamp 27m shown in FIG. 17 is the same as the structure of the holding frame clamp 27g shown in FIGS. 10 to 14 except for the following differences. Therefore, repeated description is omitted.

  A first difference between the holding frame clamp 27m shown in FIG. 17 and the holding frame clamp 27g shown in FIGS. 10 to 14 is that the holding frame clamp 27m is an electromagnet. The second difference is that the holding frame clamp 27m does not have the cylinder body 27ga, the cylinder rod 27gb, the permanent magnet storage 27gc, and the permanent magnet 27gd shown in FIG.

  In the first embodiment, the substrate structure 14 is held by the dicing tape 12 by changing the force of the fixing means for fixing the holding frame 13 before and after the step of peeling the dicing tape 12 (weakening after peeling). Automation of the process of fixing to the frame 13 is realized.

  Therefore, when an electromagnet is used like the holding frame clamp 27m shown in FIG. 17, it can be changed before and after the step of peeling off the dicing tape 12 by turning it on and off (weakening after peeling). Therefore, the process of fixing the substrate structure 14 to the holding frame 13 with the dicing tape 12 can be automated.

  Moreover, by using an electromagnet, the mechanism which raises / lowers the permanent magnets 27gd and 27kd like the case shown in FIGS. 10-14 or the case shown in FIG. 15 and FIG. 16 becomes unnecessary. Therefore, the failure frequency of the device can be reduced by reducing the number of drive units of the device.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in this embodiment, MAP has been described as an example of a method for manufacturing a semiconductor device. However, the manufacturing process of the semiconductor device is not limited to this. For example, a method of sealing using a mold having a plurality of cavities corresponding to the number of package regions of the multi-cavity substrate 9 (individual mold) It can be applied to a method for obtaining a substrate structure.

  Further, the present invention can also be applied to a process in which a semiconductor wafer is regarded as a substrate structure and an adhesive sheet such as a dicing tape is attached to the semiconductor wafer. Since the semiconductor wafer can generally be separated into pieces with a smaller force than the substrate structure 14 described in the first embodiment, the dicing tape used for the semiconductor wafer has the dicing strength described in the present embodiment. Lower than tape 12. However, even in the case of a semiconductor wafer, when it is necessary to use a dicing tape with high adhesive strength, the semiconductor wafer and the holding frame are separated using the dicing tape by applying the method described in this embodiment. The fixing process can be automated.

  The present invention is applicable to a BGA or LGA type semiconductor device.

It is principal part sectional drawing of the structure of the semiconductor device which is one embodiment of this invention. It is a manufacturing process flowchart which shows an example of the assembly to the resin mold in the assembly of the semiconductor device shown in FIG. FIG. 2 is a manufacturing process flow diagram illustrating an example of assembly after resin molding in the assembly of the semiconductor device illustrated in FIG. 1. FIG. 3 is a plan view of a multi-piece substrate prepared in the substrate preparation step shown in FIG. 2. It is a perspective view which shows the whole structure of the board | substrate structure by which the main surface of the multi-cavity board | substrate was resin-sealed by the process of the resin mold shown in FIG. It is a top view which shows the state which has arrange | positioned the board | substrate structure by which the main surface side was sealed in the holding frame. It is a principal part enlarged plan view which shows the stage which mounts the holding frame and board | substrate structure shown in FIG. It is principal part sectional drawing which shows the outline | summary of the sticking apparatus which is one embodiment of this invention. It is a top view which shows the positional relationship of the dicing tape after a cutting | disconnection, and a holding frame. It is an expanded sectional view which shows the process of peeling off the surplus part of a dicing tape to the board | substrate structure shown in FIG. It is a principal part expansion perspective view which expands and shows the holding frame clamp periphery shown in FIG. It is a principal part expanded sectional view which mounts a holding frame on the holding frame clamp shown in FIG. 11, and shows the cross section along the AA. It is a principal part expanded sectional view which shows the holding frame clamp which is a modification of one Embodiment of this invention. It is principal part sectional drawing which shows the process of taking out the holding frame shown in FIG. 10, and conveying to a dicing apparatus. It is a principal part expanded sectional view which shows the cross-section of the holding frame clamp which is the 1st modification of this invention. It is a principal part expanded sectional view which shows the state which fixed the holding frame using the holding frame clamp shown in FIG. It is a principal part expanded sectional view which shows the cross-section of the holding frame clamp which is the 2nd modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Main surface 1b Back surface 1c Pad (electrode)
2 Adhesive 3 Package substrate (wiring substrate)
3a Main surface 3b Back surface 3c Core material 3d Land portion 3e Bonding terminal (wire bonding portion)
3f Solder resist film 4 Wire 5 Batch encapsulant 6 Resin body 7 CSP (semiconductor device)
8 Solder balls (external connection terminals)
9 Multiple substrate 9a Package area 10 Marking 11 Dicing blade 12 Dicing tape 12a Used part (first adhesive sheet)
12b Extra part (second adhesive sheet)
13 Holding frame 13a Tapered portion 14 Substrate structure 15 Resin molding die 15a Cavity 16 Cover tape 20 Adhering device 21 Supply unit 22 Roller 23 Collecting unit 24 Adhering unit 25 Cover tape collecting unit 26 Tension roller 27 Adhering stage 27a Substrate Arrangement portion 27b Holding frame arrangement portion 27c Taper portion 27d Positioning pin 27e Substrate clamp 27f Guides 27g, 27k, 27m Holding frame clamp (fixing means)
27ga Cylinder body part 27gb, 27kb Cylinder rod 27gc Magnet storage part 27gd, 27kc Permanent magnet 27ke Rubber (elastic body)
27h Sensor 28 Affixing roller (Affixing jig)
29 Cutter support part 29a Rotary blade 30 Peeling roller 30a Arrow 31 Suction jig

Claims (5)

Having a step of dividing a substrate structure having a substrate into pieces,
In the step of dividing the substrate structure into pieces,
Preparing a ring-shaped holding frame, placing the substrate structure inside the holding frame, and fixing the holding frame to the stage with a first fixing force by a fixing means using magnetic force;
Bonding the adhesive sheet, the holding frame and the substrate structure;
Cutting the adhesive sheet along the holding frame and separating the first adhesive sheet for fixing the substrate structure and the holding frame, and a second adhesive sheet separated from the first adhesive sheet; ,
Peeling the second adhesive sheet from the holding frame;
After the second adhesive sheet is peeled from the holding frame, the fixing means fixes the holding frame to a second fixing force smaller than the first fixing force, and then the holding frame is moved to the holding frame. A step of taking out and transporting together with the substrate structure;
And a step of separating the substrate structure in a state of being fixed to the holding frame,
The fixing means is a plurality of permanent magnets arranged in a state of being movable in a direction intersecting the holding frame on a surface facing the holding frame of the stage on which the holding frame is placed,
In the step of setting the fixing force of the fixing means as the second fixing force, the fixing force is weakened by moving the permanent magnet away from the holding frame. In the manufacturing method of the semiconductor device according to claim 1,
The method of manufacturing a semiconductor device, wherein the permanent magnet is attached to an end of a cylinder rod that is driven in a direction intersecting a surface of the stage facing the holding frame by gas pressure or hydraulic pressure. In the manufacturing method of the semiconductor device according to claim 2,
A method of manufacturing a semiconductor device, wherein an elastic body is disposed between the permanent magnet and a cylinder body that drives the cylinder rod. Having a step of dividing a substrate structure having a substrate into pieces,
In the step of dividing the substrate structure into pieces,
Preparing a ring-shaped holding frame, placing the substrate structure inside the holding frame, and fixing the holding frame to the stage with a first fixing force by a fixing means using magnetic force;
Bonding the adhesive sheet, the holding frame and the substrate structure;
Cutting the adhesive sheet along the holding frame and separating the first adhesive sheet for fixing the substrate structure and the holding frame, and a second adhesive sheet separated from the first adhesive sheet; ,
Peeling the second adhesive sheet from the holding frame;
After the second adhesive sheet is peeled from the holding frame, the fixing means fixes the holding frame to a second fixing force smaller than the first fixing force, and then the holding frame is moved to the holding frame. A step of taking out and transporting together with the substrate structure;
And a step of separating the substrate structure in a state of being fixed to the holding frame,
The method of manufacturing a semiconductor device, wherein the fixing means is a plurality of electromagnets arranged on a surface of the stage on which the holding frame is placed, facing the holding frame. Mounting a semiconductor chip on each of the package regions of the substrate having a plurality of package regions;
A step of encapsulating a plurality of the package regions on the main surface side of the substrate on which the semiconductor chip is mounted with a single cavity of a resin mold to form a substrate structure by resin sealing;
A step of separating the substrate structure,
In the step of dividing the substrate structure into pieces,
(A) preparing a ring-shaped holding frame, arranging the substrate structure inside the holding frame, and then fixing the holding frame to the stage with a first fixing force by a fixing means using magnetic force; ,
(B) a step of attaching the adhesive sheet, the holding frame and the substrate structure;
(C) The adhesive sheet is cut along the holding frame, and separated into a first adhesive sheet that fixes the substrate structure and the holding frame, and a second adhesive sheet that is separated from the first adhesive sheet. And a process of
(D) a step of peeling the second adhesive sheet from the holding frame;
(E) After the step (d), the fixing means fixes the holding frame to a second fixing force smaller than the first fixing force, and then the holding frame is taken out together with the substrate structure. And the process of carrying
(F) A method of manufacturing a semiconductor device, including a step of dividing the substrate structure into pieces while being fixed to the holding frame.

Images