JP2009088102A - Method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To apply an adhesive sheet onto a substrate structure to be formed into individual pieces as an target structure without leaving bonding areas or air bubbles. <P>SOLUTION: In a step of applying a dicing tape (adhesive sheet) 12 to a substrate structure 14, applying operation is carried out by moving an applying roller (applying jig) 28 from one end of the substrate structure 14 to the other end thereof while depressing the substrate structure 14 via the dicing tape 12. When bonding the substrate structure 14 and the dicing tape 12, the bonding operation between the structure 14 and the tape 12 is started, by tilting the substrate structure 14 relative to a bonding stage 27 on which the substrate structure 14 is positioned by a tilting pin (substrate tilting means) 27f, under such a condition that one end of the substrate structure 14 located farther than a moving direction 28a of the applying roller 28 is located at a level higher than the nearer end thereof. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device manufacturing technique, and more particularly, to a semiconductor device manufacturing method in which a structure to be separated such as a multi-piece substrate and an adhesive sheet are bonded to each other in an individualization step. It is related to effective technology.

  There is a semiconductor device having a structure in which a semiconductor chip is mounted on one main surface of a substrate and the main surface side is sealed with a sealing resin.

  As an example of a method for manufacturing a semiconductor device having the above structure, for example, in Japanese Patent Laid-Open No. 2000-12745 (Patent Document 1), a large number of semiconductor elements are mounted in a matrix on the main surface of an insulating frame (substrate). A technique is disclosed in which a plate-shaped package panel (substrate structure) is formed by resin-sealing them all over the entire surface with a sealing resin, and the package panel is cut.

Moreover, in the said patent document 1, before separating the said package panel into pieces, an adhesive sheet is affixed on the main surface side (surface sealed with sealing resin) of the package panel, and this adhesive sheet is affixed In this state, the package panel is cut by abrasive cutting of a circular blade.
JP 2000-12745 A

  In the case of cutting with the adhesive sheet attached to the substrate structure that is an individualized structure, the adhesive sheet plays a role of fixing the position of the substrate structure so as not to shift during the cutting process. For this reason, in the process of affixing an adhesive sheet, it is preferable to affix so that a non-pasting location may arise in the affixing surface of a board | substrate structure, or a bubble may enter between a board | substrate structure and an adhesive sheet. .

  If it is subjected to a cutting process in a state where there is a residue or bubbles, there is a case where a product cut by a dicing blade or the like is scattered (referred to as product jump) because the holding force by the adhesive sheet is insufficient. In addition, cutting waste and cutting water generated at the time of cutting may infiltrate into the remaining portion and bubbles, and the product may be contaminated (contaminated).

  This inventor examined the technique which affixes an adhesive sheet to the board | substrate structure which is an individualized structure, and discovered the following subjects.

  First, the following method was examined as a technique for attaching the adhesive sheet to the substrate structure without causing wrinkles or the like on the adhesive sheet.

  A substrate structure, which is a structure to be separated, is placed at a predetermined position of the attaching stage with the attaching surface facing up. Next, an adhesive sheet that is tensed with a predetermined tension is disposed above the pasting surface. Next, the adhesive sheet is pressed against the substrate structure with an attaching jig such as an attaching roller, and is sequentially attached from one end of the substrate structure to the opposite end.

  If the attachment surface of the substrate structure, which is the structure to be separated, is a flat surface (with no warpage or the like), the adhesive sheet can be prevented from wrinkling by the above method. Occurrence can be suppressed.

  However, if the substrate structure is warped, the position of the substrate structure placed on the pasting stage is not stable, so the substrates are pasted in order from one end of the substrate structure to the opposite end. You may not be able to follow. For this reason, the area | region where a board | substrate structure and an adhesive sheet do not contact generate | occur | produces, or a wrinkle arises in an adhesive sheet, As a result, it is easy to generate | occur | produce a sticking and a bubble.

  By the way, the warpage of the substrate structure occurs due to various factors. For example, in the method of manufacturing a semiconductor device called MAP (Mold Array Process), it occurs as follows.

  In the MAP, a multi-chip substrate having a plurality of package areas arranged in an array is prepared, and a semiconductor chip is mounted in each package area. Next, an external connection terminal of the semiconductor chip is electrically connected to a conductor pattern such as a pad included in the multi-chip substrate. Next, the main surface side of the substrate on which the semiconductor chip is mounted is sealed with a sealing resin. In this sealing process, for example, a multi-cavity substrate on which a semiconductor chip is mounted is sandwiched between an upper mold having a cavity large enough to accommodate a plurality of package regions on the lower surface side and a lower mold having a flat upper surface, and the cavity A sealing resin is injected into the interior and cured. In MAP, a multi-chip substrate structure (a structure in which a semiconductor chip is mounted on the main surface of a multi-chip substrate and the mounting surface is resin-sealed) used in the singulation process is obtained by, for example, the above method. can get.

  If a temperature cycle of heating and heat dissipation is applied when manufacturing a multi-piece substrate structure, warpage occurs due to the difference in the linear expansion coefficient of various members constituting the structure.

  In order to suppress such warpage, various methods have been studied so far, but it has not yet completely prevented warpage.

  Therefore, in order to affix the adhesive sheet to the substrate structure to be subjected to the singulation process, even if the substrate structure is warped, it can be stably affixed without generating leftover spots or bubbles. A technology that can be attached is required.

  This invention is made | formed in view of the said subject, The objective is to provide the technique which can be affixed on a board | substrate which is a to-be-divided object structure, without sticking and generating a bubble. It is in.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

That is, the method for manufacturing a semiconductor device according to one embodiment of the present invention includes a step of preparing a substrate structure, and a step of attaching the substrate structure and an adhesive sheet.
In the step of attaching the substrate structure and the adhesive sheet, a predetermined pressure is applied from above through the adhesive sheet from one end of the substrate structure to the other end using an attaching jig. By sticking by moving while holding the substrate structure,
When starting the bonding of the substrate structure and the adhesive sheet, the substrate structure is inclined with respect to the surface of the bonding stage on which the substrate structure is arranged using the substrate tilting means, and the bonding is performed. Affixing the substrate structure and the adhesive sheet is started in a state where the end of the substrate structure on the side far from the moving direction of the attaching jig is at a higher position than the end on the near side. Is.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, according to one embodiment of the present invention, the edge of the substrate structure that starts the bonding of the adhesive sheet and the adhesive sheet can be reliably brought into contact with each other. Even if a certain substrate structure is warped, it can be attached without leaving any residue or bubbles.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like. Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges. Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted as much as possible. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Structure of semiconductor device>
FIG. 1 is a plan view showing an example of the structure of a semiconductor device according to an embodiment of the present invention through a sealing body, and FIG. 2 is a cross-sectional structure taken along line AA shown in FIG. FIG. 3 is an enlarged partial sectional view showing the structure of the B portion shown in FIG.

  The semiconductor device of this embodiment is a resin-sealed small semiconductor package in which a semiconductor chip 1 is mounted on a wiring board. In this embodiment, as an example, a CSP (Chip as shown in FIG. 1) is used. (Size Package) 7 will be described. Note that the CSP 7 has a plurality of solder balls 8 which are external terminals arranged and attached to the back surface 3b of the wiring board in a grid pattern. Therefore, the CSP 7 is a BGA (Ball Grid Array) type semiconductor package.

  The structure of the CSP 7 shown in FIGS. 1 to 3 will be described. The package substrate 3 as a wiring substrate, the semiconductor chip 1 mounted on the main surface 3a of the package substrate 3 and having an integrated circuit, and the electrodes of the semiconductor chip 1 A conductive wire 4 that electrically connects a certain pad 1c and a bonding terminal 3p of the package substrate 3, and solder that is a plurality of external terminals provided on a plurality of land portions 3d on the back surface 3b of the package substrate 3. It consists of a ball 8 and a resin body 6.

  The semiconductor chip 1 is made of, for example, silicon, and an integrated circuit is formed on the main surface 1a. Further, the planar shape intersecting with the thickness of the semiconductor chip 1 is a square shape, and in this embodiment, it is a square. Further, as shown in FIG. 1, a plurality of pads 1c electrically connected to the integrated circuit are formed on the peripheral portion of the main surface 1a. Further, the pads 1 c and the bonding terminals 3 p disposed on the peripheral edge of the main surface 3 a of the package substrate 3 are electrically connected to each other by the conductive wires 4. The wire 4 is, for example, a gold wire.

  Further, as shown in FIG. 3, the back surface 1 b of the semiconductor chip 1 is fixed to the package substrate 3 via an adhesive 2 such as a paste agent or a die attach film, and the main surface 1 a faces upward. It is mounted on the package substrate 3.

  The resin body 6 is made of, for example, an epoxy resin and is formed on the main surface 3a side of the package substrate 3 and seals the semiconductor chip 1 and the plurality of conductive wires 4 with resin.

  Also, the solder balls 8 that are a plurality of external terminals provided on the back surface 3b of the package substrate 3 are made of solder such as Pb-Sn, and are arranged in a grid pattern on the back surface 3b of the package substrate 3.

  Here, the package substrate 3 includes a main surface 3a, a back surface 3b opposite to the main surface 3a, a core material 3c, and a plurality of bonding terminals (wire bonding portions) 3p formed on the peripheral edge of the main surface 3a. A plurality of land portions 3d formed on the back surface 3b, and a plurality of through holes 3e formed on the main surface 3a and the back surface 3b and formed between the plurality of bonding terminals 3p and the plurality of land portions 3d, respectively. have. That is, the plurality of bonding terminals 3p formed on the peripheral edge portion of the main surface 3a are electrically connected to the land portions 3d of the back surface 3b through the corresponding through holes 3e.

  The planar shape intersecting with the thickness of the package substrate 3 is a square shape, and is a square in the present embodiment.

  In addition, the CSP 7 of the present embodiment is a small semiconductor package, but as shown in FIGS. 1 and 2, the chip size and the package substrate 3 are particularly substantially the same. That is, the package substrate 3 has a slightly larger area than the semiconductor chip 1, and a plurality of bonding terminals 3 p are provided side by side in the peripheral region of the package substrate 3 outside the semiconductor chip 1. These bonding terminals 3p and the pads 1c of the semiconductor chip 1 are electrically connected by wires 4 respectively.

  The plurality of bonding terminals 3p are exposed in the opening window 3f of the solder resist film 3q at the peripheral edge of the main surface 3a of the package substrate 3 as shown in FIGS. Further, one end of the bonding terminal 3p is connected to the through hole 3e via the wiring 3n formed on the main surface 3a, and the power supply line 3r for electrolytic plating is connected to the other end. Therefore, the electrolysis plating process is performed on the bonding terminal 3p, the wiring 3n, and the through hole 3e. Conductive patterns such as bonding terminals 3p, wirings 3n, power supply lines 3r, through holes 3e, and land portions 3d of the package substrate 3 are made of, for example, a copper alloy, and plating applied to these conductive patterns is, for example, Ni / Au plating. In the present embodiment, for example, the case where the package substrate 3 is manufactured by the subtractive method has been described. However, the present invention is not limited to this. For example, when the package substrate 3 is manufactured by a semi-additive method, a Cu seed layer as a base may be formed by an electroless plating process, and then a Cu wiring may be formed by an electrolytic plating process.

  On the other hand, on the back surface 3b of the package substrate 3, a plurality of conductor patterns each formed by connecting the through hole 3e and the land portion 3d to each other are formed.

  As shown in FIG. 3, the through hole 3e on the main surface 3a side and the through hole 3e on the back surface 3b side are electrically connected by a plating film 3g formed on the inner wall of the hole.

<Method for Manufacturing Semiconductor Device>
Next, a manufacturing method of the CSP 7 shown in FIGS. 1 to 3 will be described. In the present embodiment, a manufacturing method called MAP will be described as an example of a manufacturing method of CSP7.

  4 is a manufacturing process flow diagram showing an example of assembly up to the resin mold in the assembly of the semiconductor device shown in FIG. 1, and FIG. 5 is a manufacturing process flow diagram showing an example of assembly after the resin mold in the assembly of the semiconductor device shown in FIG. 6 is a plan view of a multi-cavity substrate prepared in the substrate preparation step shown in FIG. 4, and FIG. 7 is a substrate in which the main surface of the multi-cavity substrate is resin-sealed in the resin molding step shown in FIG. It is a perspective view which shows the whole structure of a structure.

  (A) First, substrate preparation shown in step S1 of FIG. 4 is performed. Here, a multi-chip substrate 9 is prepared in which a plurality of package areas 9a (40 in FIG. 6) are arranged as shown in FIG. The package region 9a is partitioned and arranged in a matrix.

  (B) Thereafter, die bonding shown in step S2 is performed, and the semiconductor chip 1 is mounted (fixed) on the multi-chip substrate 9 via the adhesive 2. Here, the semiconductor chip 1 is mounted on each of the plurality of package regions 9a shown in FIG.

  By the way, since the multi-chip substrate 9 has a plurality of package areas 9a, some of the package areas 9a may be defective (for example, conduction failure due to disconnection). If a non-defective semiconductor chip 1 is mounted on the defective package area 9a, the completed CSP 7 becomes a defective product.

  Therefore, the multi-chip substrate 9 is inspected for each package area before the semiconductor chip 1 is mounted, and the semiconductor chip 1 is mounted only in the package area 9a that has passed the inspection (the package area 9a determined to be defective). The semiconductor chip 1 is not mounted). In this way, the non-defective semiconductor chip 1 can be saved, so that the manufacturing efficiency can be improved.

  Thereafter, wire bonding shown in step S3 is performed. Here, the semiconductor chip 1 and the multi-chip substrate 9 are electrically connected. Specifically, as shown in FIG. 3, a pad 1 c on the main surface 1 a of the semiconductor chip 1 and a bonding terminal 3 p that is a wire bonding portion of the package substrate 3 of the multi-chip substrate 9 corresponding to the pad 1 c are gold wires or the like. The conductive wires 4 are electrically connected.

  (C) Thereafter, resin molding shown in step S4 is performed. Here, on the multi-cavity substrate 9, a plurality of semiconductor chips 1 and a plurality of wires 4 are collectively covered with a single cavity 15a of the resin molding die 15 and resin-sealed, whereby a collective sealing body 5 is obtained. Form. The sealing resin forming the collective sealing body 5 is, for example, a thermosetting epoxy resin.

  When the encapsulating resin 5 is formed by curing the encapsulating resin, the encapsulating body 5 is formed on the main surface (semiconductor chip mounting surface) 3a side of the multi-chip substrate 9 shown in FIGS. 4 and 7. The formed substrate structure 14 is obtained.

  (D) After that, ball mounting shown in step S5 of FIG. 5 is performed, and each land portion 3d (see FIG. 3) on the back surface 3b (see FIG. 3) of the multi-piece substrate 9 (package substrate 3 shown in FIG. 3). Solder balls 8 are connected. Here, after applying solder to the land portions 3d of the multi-chip substrate 9, the solder balls 8 are formed by reflow processing.

  (E) After that, the mark shown in step S6 is performed. Here, marking 10 is performed to mark the collective sealing body 5. The marking 10 can be performed by, for example, an ink marking method or a laser marking method.

  By the way, the order of the ball mounting process shown in step S5 and the mark process shown in step S6 may be interchanged.

  As described above, in the step (d), after the solder is applied to the land portion 3d of the package substrate 3 (multiple substrate 9), the reflow process is performed. For this reason, even in the ball mounting process, the substrate structure 14 (multiple substrate 9 and batch sealing body 5) may be further warped by this reflow process. In the marking process, marking is performed by a laser marking method or the like. However, when the substrate structure 14 is warped, it is difficult to irradiate the surface of the batch sealing body 5 with a laser beam vertically. In some cases, a marking failure occurs in which no mark is attached to the surface of 5.

  Therefore, when marking by the laser marking method, the order of step S5 and step S6 shown in FIG. 5 is changed, and the reflow process at the time of forming the solder ball 8, which is one of the factors that warp the substrate structure 14, is performed. It is preferable to perform the mark step first. Thereby, marking failure can be suppressed.

  (F) Thereafter, individualization shown in step S7 is performed. When the singulation is completed, the assembly of the CSP 7 is completed as shown in step S8, and the product is completed.

  By the way, in order to divide into pieces, it is necessary to fix the substrate structure 14 at a predetermined position of the dicing apparatus. The fixing means is roughly divided into a method of directly adsorbing and fixing the substrate structure 14 to the dicing stage (hereinafter referred to as adsorption dicing method), a dicing tape between the substrate structure 14 and a holding frame for holding the substrate structure 14. There is a method (hereinafter referred to as a tape dicing method) in which these are fixed in a predetermined positional relationship by being pasted and fixed to the stage of the dicing apparatus for each holding frame.

  Since the adsorption dicing method does not require a dicing tape to be attached, the process can be simplified as compared with the tape dicing method. However, for example, when applied to a small semiconductor device such as CSP 7 manufactured by MAP described in this embodiment, it is necessary to provide a suction means for each package region (scattering of products during cutting, misalignment). Therefore, the adsorption mechanism becomes complicated. Therefore, the suction dicing method is an individualization method suitable for manufacturing a relatively large semiconductor device.

  On the other hand, in the tape dicing method, since the dicing tape is applied so as to cover one surface of the substrate structure 14, the entire substrate structure 14 being cut is more easily fixed at a predetermined position than the suction dicing method. Therefore, the tape dicing method is an individualization method suitable for manufacturing a relatively small semiconductor device.

  Therefore, the tape dicing method is applied in the present embodiment. The outline of the individualization process shown in step S7 will be described below.

  First, by attaching a dicing tape (adhesive sheet) 12 to the multi-piece substrate 9 (ie, the substrate structure 14) whose main surface 3a side is sealed in the step (c) and a holding frame for holding the substrate. Are fixed in a predetermined positional relationship.

  Next, the substrate structure 14 fixed to the holding frame is conveyed to a dicing apparatus, cut using a cutting jig such as the dicing blade 11, and separated into individual pieces. When the substrate structure 14 is divided into pieces, the CSP 7 shown in FIGS. 1 to 3 is obtained.

  Next, the individual CSPs 7 are transported to the pickup device in a state of being fixed to the holding frame, and after the adhesive sheet has weakened the adhesive strength, each of the CSPs 7 is picked up from the adhesive sheet and then transferred to the next process (sorting process, packaging process, etc.). Sent.

  Of the series of singulation steps, the step of fixing the substrate structure 14 to the holding frame will be described in detail below.

  FIG. 8 is a plan view showing a state in which the substrate structure sealed on the main surface side is arranged in the holding frame, FIG. 9 is a cross-sectional view of the main part showing an outline of the attaching apparatus of the present embodiment, and FIG. FIG. 10 is an enlarged cross-sectional view showing a state where affixing of a dicing tape is started on the substrate structure shown in FIG. 9. 11 is a plan view showing the planar position of the tilt pin shown in FIG. 10, and FIG. 12 is a cross-sectional view showing a state in which the tilt pin shown in FIG. 10 is housed.

  (F1) First, the holding frame 13 shown in FIG. 8 is prepared, and the substrate structure 14 is arranged in the holding frame 13.

  The holding frame 13 is a metal (for example, stainless steel) frame used for arranging the substrate structure 14 at a predetermined position in each apparatus in the above-described series of individualization steps. The holding frame 13 has a ring shape, and a recess 13a for positioning at a predetermined position of each device is formed on the outer edge thereof.

  In this arrangement step, the holding frame 13 and the substrate structure 14 are arranged in a predetermined positional relationship. For example, as shown in FIG. 10, the substrate placement portion 27a of the attaching stage 27 has a structure that can be raised and lowered independently of the holding frame placement portion 27b. Further, the outer shape of the substrate placement portion 27a is circular corresponding to the contour of the inner edge of the holding frame 13, as shown in FIG. Accordingly, the position at which the holding frame 13 is arranged is defined by the board arrangement portion 27a. The direction of the holding frame 13 is defined by combining the holding frame positioning pins 27c formed in the holding frame arrangement portion 27b and the recess portion 13a.

  On the other hand, the position of the substrate structure 14 is defined by a plurality of positioning pins 27 d that extend from the substrate placement portion 27 a of the attaching stage 27. In addition, it is preferable that the positioning pin 27d can be moved up and down by using a lifting jig such as a cylinder 27e as shown in FIG. This is to prevent the positioning pins 27d and the substrate structure 14 from colliding and being damaged when the substrate structure 14 is disposed.

  FIG. 8 shows a state in which two substrate structures 14 are arranged as an arrangement example. Thus, if a plurality of substrate structures 14 are arranged, the manufacturing efficiency can be improved. However, the number of substrate structures 14 to be arranged can be appropriately selected from one to several according to the dimensions of the substrate structure 14, and is not limited to two.

  In the present embodiment, an embodiment in which the adhesive sheet is attached to the surface of the collective sealing body 5 in the adhesive sheet attaching process described later will be described. did.

  (F2) Next, the dicing tape 12 shown in FIG. 9 is affixed, and the holding frame 13 and the substrate structure 14 are fixed.

  In this step, for example, the dicing tape 12 can be continuously pasted using the pasting apparatus 20 shown in FIG.

  When the dicing tape 12 is stuck continuously, the dicing tape 12 is set in the supply unit 21 in a state where a long strip-shaped tape is wound up by a roll as shown in FIG. In addition, in the state set to the supply part 21, the dicing tape 12 is set in the state in which the cover tape 16 was affixed on the surface of the adhesion layer.

  The dicing tape 12 delivered from the supply unit 21 is fed so as to sew between a plurality of rollers 22 and is wound around the collection unit 23. The cover tape 16 is peeled off before the attaching portion 24 and is taken up by the cover tape collecting portion 25.

  In addition, tension rollers 26 are disposed before and after the pasting portion 24, and the dicing tape 12 is in a state of being stretched with a predetermined tension. Further, in the attaching part 24, the dicing tape 12 is stretched in an inclined state with respect to the attaching stage 27. FIG. 9 shows a state in which the supply unit 21 side is inclined so as to be higher than the collection unit 23 side.

  On the other hand, the holding frame 13 and the substrate structure 14 described with reference to FIG. 8 are disposed on the pasting stage 27 installed in the pasting portion 24.

  Further, the affixing device 20 includes an affixing roller (affixing jig) 28 and has a structure that can move the area of the affixing portion 24. As shown in FIG. 10, the sticking roller 28 moves in the moving direction 28 a along the surface of the sticking stage 27. The pasting roller 28 moves while rotating in the rotation direction 28b.

  The affixing roller 28 moves from one end of the holding frame 13 to the other end while pressing the substrate structure 14 with a predetermined pressure from above via the dicing tape 12, whereby the holding frame 13 and the substrate are moved. Dicing tape 12 is affixed to structure 14 (in this embodiment, dicing tape 12 is affixed to collective sealing body 5 shown in FIG. 8).

  Here, the substrate structure 14 includes a heating process such as a reflow process during the manufacturing process. For this reason, warpage occurs due to a difference in linear expansion coefficient of each member constituting the substrate structure 14.

  As shown in FIG. 10, the shape of the warp is often a shape in which the end portions (particularly both end portions in the longitudinal direction) of the substrate structure 14 are lifted to the upper side (collective sealing body 5 side) from the central portion. However, depending on the material, layout, and dimensions of each member constituting the substrate structure 14, the end of the substrate structure 14 may be lowered to the lower side (multiple substrate 9 side) than the center portion. is there.

  Further, as described above, in order to save the non-defective semiconductor chip 1 (see FIG. 5), when the semiconductor chip 1 is not mounted in the package area 9a (see FIG. 6) determined to be defective, depending on the presence or absence of the semiconductor chip 1. Since the linear expansion coefficient changes, warping having a different shape may occur for each individual substrate structure 14.

  When the substrate structure 14 warped in such a complicated shape is placed on the affixing stage 27, the position of the substrate structure 14 is not stable because rattling occurs. When the application of the dicing tape 12 is started in a state where the position of the substrate structure 14 is not stable, wrinkles and twists are generated in the dicing tape 12, and a residue and bubbles (generated between the substrate structure 14 and the dicing tape 12). Cause air bubbles).

  Therefore, in the present embodiment, as shown in FIG. 10, the substrate structure 14 is inclined with respect to the affixing stage 27 on which the substrate structure 14 is arranged using an inclination pin (substrate inclination means, push-up member) 27 f. In this state, the attachment of the substrate structure 14 and the dicing tape 12 was started.

  The inclined pins 27f are arranged in a region where the substrate structure 14 of the attaching stage 27 (substrate arranging portion 27a) is arranged, and the lower surface of the substrate structure 14 (the back surface of the multi-piece substrate 9) is disposed from the surface of the attaching stage 27. It pushes upward.

  The substrate structure 14 has an end (on the left side in FIG. 10) on the side where the pasting starts contacting the pasting stage 27, and an end on the opposite side (the right end in FIG. 10). Is lifted from the attaching stage 27 by the inclined pin 27f. That is, when starting the pasting, the end of the substrate structure 14 on the side far from the moving direction 28a of the pasting roller 28 is located higher than the end on the near side.

  In this way, by setting the substrate structure 14 to be inclined with respect to the attaching stage 27, even if the substrate structure 14 is warped, the backlash is eliminated and the substrate structure 14 is eliminated. The position of can be stabilized.

  In addition, by starting attachment of the substrate structure 14 and the dicing tape 12 in a state where the position of the substrate structure 14 is stabilized, an end portion of the substrate structure 14 that starts attaching the dicing tape 12 The dicing tape 12 can be reliably brought into contact. That is, the dicing tape 12 can be attached in order from one end of the substrate structure 14 to the opposite end. Therefore, the dicing tape 12 can be attached to the attachment surface of the substrate structure 14 (the surface of the collective sealing body 5) without leaving any residue or bubbles.

  Further, as shown in FIGS. 10 and 11, the inclined pin 27 f is arranged behind the center of the substrate structure 14 with respect to the moving direction 28 a of the attaching roller 28. For this reason, the end portion on the side where the pasting of the substrate structure 14 is started is supported by the pasting stage 27. By adopting such a structure, the stress applied to the inclined pin 27f can be reduced even when the sticking roller 28 is pushed downward with a predetermined pressure at the time of sticking. In addition, since the reaction force applied to the substrate structure 14 from the inclined pin 27f can be reduced, damage to the substrate structure 14 can be prevented.

  The inclined pins 27f are preferably arranged between the end of the multi-chip substrate 9 and the region where the solder balls 8 (see FIG. 5) are formed. This is to prevent contact between the inclined pin 27f and the solder ball 8 and prevent damage to the solder ball 8 and poor conduction.

  Further, for example, as shown in FIG. 11, two inclined pins 27 f are arranged for each substrate structure 14. By arranging the two inclined pins 27f for each substrate structure, the position of the substrate structure 14 can be made more stable.

  However, the number of inclined pins 27f is not limited to this. For example, when one inclined pin 27 f is arranged for one substrate structure 14, it may be arranged near the center of the short side of the substrate structure 14. In this case, the stability is inferior to the case where two are arranged, but it can be more stable than the case where the inclined pin 27f is not provided.

  Alternatively, three or more inclined pins 27 f may be arranged for one substrate structure 14. In this case, since the stress applied to the inclined pin 27f or the reaction force applied to the inclined pin 27f when being pushed down by the attaching roller 28 can be further distributed to the plurality of inclined pins 27f, the damage to the inclined pin 27f or the substrate structure 14 is further increased. Can be prevented. Further, by increasing the number of inclined pins 27f, the height of each inclined pin 27f can be finely adjusted, so that the degree of freedom of adjustment is improved.

  Next, as shown in FIG. 12, after the attachment of the substrate structure 14 and the dicing tape 12 is started, the inclined pin 27 f is placed below the surface of the attachment stage 27 until the attachment is completed. Store. By accommodating the inclined pins 27 f below the surface of the attaching stage 27, the inclination of the substrate structure 14 using the inclined pins 27 f is eliminated, and the substrate structure 14 is in a state parallel to the attaching stage 27.

  Here, the parallel state means a state in which the substrate structure 14 is disposed along the surface of the attaching stage 27 by accommodating the inclined pins 27f. Therefore, since the substrate structure 14 is warped, it is not completely parallel to the pasting stage 27, but this is not excluded. The inclined pin 27f is connected to the cylinder 27e and has a structure capable of moving up and down.

  If the dicing tape 12 is stuck to the end while the inclined pin 27f is pushed up, stress may be applied to the substrate structure 14 and the substrate structure 14 may be damaged. On the other hand, since the dicing tape 12 is pasted from one end of the substrate structure 14 without any wrinkles or twists, it is left unattached and bubbles are generated without tilting the substrate structure 14. It is difficult.

  That is, according to the present embodiment, after starting the attachment of the substrate structure 14 and the dicing tape 12, the inclination of the substrate using the inclined pins 27f is eliminated until the attachment is completed. While avoiding damage to the substrate structure 14, it is possible to prevent the sticking and the generation of bubbles.

  When the inventor conducted an experiment under various conditions, if the end portion (end portion of the collective sealing body 5) where the substrate structure 14 starts to be attached and the dicing tape 12 are attached, the attachment is performed. Even if the inclined pin 27f was housed immediately after the start of attachment, no sticking or generation of bubbles was observed.

  That is, from the viewpoint of avoiding damage to the substrate structure 14, the end of the substrate structure 14 to be attached (the end of the collective sealing body 5) and the dicing tape 12 are immediately attached and then the inclined pin is immediately attached. It is preferable to eliminate the inclination using 27f.

  10 and 12 has a surface with a highly elastic material such as silicone rubber wound around it. Therefore, the surface of the attaching roller 28 that contacts the dicing tape 12 has higher elasticity than the surface of the substrate structure 14 to which the dicing tape 12 is attached (that is, the collective sealing body 5).

  In this way, by covering the surface of the affixing roller 28 with a highly elastic material, even when the substrate structure 14 is warped in a complicated shape, the dicing tape 12 is affixed following this. Can do. That is, it is possible to prevent the sticking and the generation of bubbles.

  Further, as shown in FIG. 10, even when the substrate structure 14 is inclined with respect to the bonding stage 27, the region for starting the bonding of the substrate structure 14 and the bonding roller 28 are parallel to each other. The holding frame 13 and the dicing tape 12 at various positions can be brought into contact with each other. For this reason, the substrate structure 14 and the holding frame 13 can be fixed in a predetermined positional relationship.

  (F3) Next, the dicing tape 12 is cut on the surface side of the holding frame 13 where the dicing tape 12 is attached. Here, for example, in a state where the end of the rotary blade attached to the cutter support portion is brought into contact with the surface of the holding frame 13 to which the dicing tape 12 is attached, it is cut by rotating on the circumferential track of the holding frame. To do.

<Modification of substrate structure>
Next, a modified example of the substrate structure will be described with reference to FIG. FIG. 13 is an enlarged cross-sectional view showing a state in which affixing of a dicing tape is started on a substrate structure that is a modification of the present embodiment.

  The difference between the substrate structure 17 shown in FIG. 13 and the substrate structure 14 shown in FIG. 10 is the direction of warpage. The substrate structure 14 shown in FIG. 10 has a shape in which end portions (particularly, both end portions in the longitudinal direction) are lifted to the upper side (collective sealing body 5 side) from the center portion.

  On the other hand, the end portion of the substrate structure 17 shown in FIG. 13 is lowered to the lower side (multiple substrate 9 side) than the center portion.

  The technique for attaching the dicing tape 12 to the substrate structure 14 described in the present embodiment can also be applied to the substrate structure 17 as shown in FIG.

  That is, by setting the substrate structure 17 to be inclined with respect to the attaching stage 27, even if the substrate structure 17 is warped, the backlash is eliminated and the position of the substrate structure 17 is reduced. Can be stabilized.

  Further, by starting the attachment of the substrate structure 17 and the dicing tape 12 in a state where the position of the substrate structure 17 is stabilized, the end of the substrate structure 17 that starts the attachment of the dicing tape 12 The dicing tape 12 can be reliably brought into contact. That is, the dicing tape 12 can be attached in order from one end of the substrate structure 17 to the opposite end. Therefore, the dicing tape 12 can be attached to the attachment surface of the substrate structure 17 (the surface of the collective sealing body 5) without leaving any residue or bubbles.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the embodiment, MAP has been described as an example of a method for manufacturing a semiconductor device. However, the manufacturing process of the semiconductor device is not limited to this. For example, a method of sealing using a mold having a plurality of cavities corresponding to the number of package regions of the multi-cavity substrate 9 (individual mold) It can be applied to a method for obtaining a substrate structure.

  Further, the present invention can also be applied to a process in which a semiconductor wafer is regarded as a substrate structure and an adhesive sheet such as a dicing tape is attached to the semiconductor wafer. For example, when the semiconductor wafer is warped due to thinning or the like, there may be a case where a sticking residue or a bubble is generated between the dicing tape and the semiconductor wafer.

  However, if the method described in the present embodiment is applied, the dicing tape can be attached without causing sticking or bubbles.

  INDUSTRIAL APPLICABILITY The present invention can be used in a semiconductor device that separates a structure to be separated such as a multi-piece substrate, etc., into a holding frame via an adhesive sheet in the individualization step.

It is a top view which permeate | transmits and shows an example of the structure of the semiconductor device which is one embodiment of this invention through a sealing body. It is sectional drawing which shows the structure of the cross section cut | disconnected along the AA line shown in FIG. FIG. 3 is an enlarged partial sectional view showing a structure of a B portion shown in FIG. It is a manufacturing process flowchart which shows an example of the assembly to the resin mold in the assembly of the semiconductor device shown in FIG. FIG. 2 is a manufacturing process flow diagram illustrating an example of assembly after resin molding in the assembly of the semiconductor device illustrated in FIG. 1. FIG. 5 is a plan view of a multi-cavity substrate prepared in the substrate preparation step shown in FIG. 4. It is a perspective view which shows the whole structure of the board | substrate structure by which the main surface of the multi-cavity board | substrate was resin-sealed at the process of the resin mold shown in FIG. It is a top view which shows the state which has arrange | positioned the multi-piece wiring board by which the main surface side was sealed in the holding frame. It is principal part sectional drawing which shows the outline | summary of the sticking apparatus which is one embodiment of this invention. It is an expanded sectional view which shows the state which affixed the dicing tape on the board | substrate structure shown in FIG. It is a top view which shows the plane position of the inclination pin shown in FIG. It is sectional drawing which shows the state which accommodated the inclination pin shown in FIG. It is an expanded sectional view which shows the state which affixed the dicing tape on the board | substrate structure which is a modification of one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 1a Main surface 1b Back surface 1c Pad (electrode)
2 Adhesive 3 Package substrate (wiring substrate)
3a Main surface 3b Back surface 3c Core material 3d Land portion 3e Through hole 3f Opening window 3g Plating film 3h Metal film 3n Wiring 3p Bonding terminal (wire bonding portion)
3q Solder resist film 3r Feed line 4 Wire 5 Batch encapsulant 6 Resin body 7 CSP (semiconductor device)
8 Solder balls (external terminals)
9 Multiple substrate 9a Package area 10 Marking 11 Dicing blade 12 Dicing tape 13 Holding frame 13a Recessed part 14 Substrate structure 15 Resin molding die 15a Cavity 16 Cover tape 17 Substrate structure 20 Pasting device 21 Supply part 22 Roller 23 Collecting unit 24 Pasting unit 25 Cover tape collecting unit 26 Tension roller 27 Pasting stage 27a Substrate placing unit 27b Holding frame placing unit 27c Holding frame positioning pin 27d Positioning pin 27e Cylinder 27f Tilt pin (substrate tilting means, push-up member)
28 Sticking roller (sticking jig)
28a Movement direction 28b Rotation direction

Claims (5)

Preparing a substrate structure; and
A step of attaching the substrate structure and the adhesive sheet;
In the step of attaching the substrate structure and the adhesive sheet,
Affixing is performed by using an affixing jig from one end of the substrate structure to the other end while holding the substrate structure with a predetermined pressure from above via the adhesive sheet. And
When starting the bonding of the substrate structure and the adhesive sheet, the substrate structure is inclined with respect to the surface of the bonding stage on which the substrate structure is arranged using the substrate tilting means, and the bonding is performed. Affixing the substrate structure and the adhesive sheet is started in a state where the end of the substrate structure on the side far from the moving direction of the attaching jig is at a higher position than the end on the near side. A method for manufacturing a semiconductor device. In the manufacturing method of the semiconductor device according to claim 1,
Before the step of attaching the substrate structure and the adhesive sheet, a step of mounting a semiconductor chip on the main surface of the substrate, and sealing the main surface of the substrate with a resin body to form the substrate structure. A process,
In the step of attaching the substrate structure and the adhesive sheet,
A method of manufacturing a semiconductor device, characterized in that the inclination using the substrate tilting means is eliminated between the start of bonding of the substrate structure and the adhesive sheet and the completion of bonding. In the manufacturing method of the semiconductor device according to claim 1,
Before the step of attaching the substrate structure and the adhesive sheet, a step of mounting a semiconductor chip on the main surface of the substrate, and sealing the main surface of the substrate with a resin body to form the substrate structure. A process,
The method of manufacturing a semiconductor device, wherein the substrate tilting means is a push-up member disposed in a region where the substrate structure of the pasting stage is disposed. In the manufacturing method of the semiconductor device according to claim 1,
Before the step of attaching the substrate structure and the adhesive sheet, a step of mounting a semiconductor chip on the main surface of the substrate, and sealing the main surface of the substrate with a resin body to form the substrate structure. A process,
In the step of attaching the substrate structure and the adhesive sheet,
The method of manufacturing a semiconductor device, wherein a surface of the attaching jig that contacts the adhesive sheet has higher elasticity than a surface of the substrate structure to which the adhesive sheet is attached. (A) preparing a substrate having a plurality of package regions;
(B) mounting a semiconductor chip in each of the plurality of package regions, and electrically connecting the semiconductor chip and the substrate;
(C) a step of resin-sealing by covering the main surface side of the substrate on which the semiconductor chip is mounted with a single cavity of a resin molding die to form a substrate structure;
(D) dividing the substrate structure into pieces,
In the step (d),
(D1) after preparing the holding frame, placing the substrate structure in a predetermined positional relationship inside the holding frame;
(D2) including a step of fixing the holding frame and the substrate structure by adhering the adhesive sheet and the holding frame and the substrate structure;
Affixing is performed by using an affixing jig from one end of the substrate structure to the other end while holding the substrate structure with a predetermined pressure from above via the adhesive sheet. And
When starting the bonding of the substrate structure and the adhesive sheet, the substrate structure is inclined with respect to the surface of the bonding stage on which the substrate structure is arranged using the substrate tilting means, and the bonding is performed. Affixing the substrate structure and the adhesive sheet is started in a state where the end of the substrate structure on the side far from the moving direction of the attaching jig is at a higher position than the end on the near side. A method for manufacturing a semiconductor device.

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