JP6255221B2 - Transport device - Google Patents

Description

  The present invention relates to a transport device that transports a plate-shaped workpiece, and more particularly to a transport device that can transport plate-shaped workpieces having different diameters.

  In a grinding apparatus that grinds a plate-shaped workpiece such as a semiconductor wafer, it is required that the center of the chuck table that holds the plate-shaped workpiece and the center of the plate-shaped workpiece coincide with each other during grinding. For this reason, before grinding, the plate workpiece is positioned by the positioning table, and the positioned plate workpiece is conveyed to the chuck table so that the center of the chuck table and the center of the plate workpiece are aligned. (For example, refer patent document 1).

  As a transport device used for such transport, the one disclosed in Patent Document 2 is known. The conveyance device of Patent Document 2 includes a holding mechanism that sucks and holds a plate-like workpiece and a moving mechanism that moves the holding mechanism. The holding mechanism is connected to the arm of the moving mechanism via a bolt. The holding mechanism communicates with a suction source via a suction tube made of a tube, and suction force is supplied from the suction source by this communication.

JP 2013-71230 A JP 2004-91196 A

  By the way, in a grinding apparatus, the diameter of the semiconductor wafer used as a plate-shaped workpiece may change with 200 mm or 300 mm. Further, depending on the grinding conditions, grinding is performed by attaching a glass substrate having substantially the same shape to the plate-like workpiece or by supporting the plate-like workpiece inside the ring frame via an adhesive tape. Therefore, in the transfer device, the plate-like workpiece to be transferred may include not only the semiconductor wafer but also the ring frame, and this also changes the diameter of the plate-like workpiece.

  In order to cope with such a change, it is conceivable to prepare a plurality of holding mechanisms in the conveying device of Patent Document 2 and to make the diameters of the holding devices different depending on the plate-shaped workpiece. In this case, since the holding mechanism attached to the arm of the moving means is exchanged when the diameter of the plate-like workpiece to be transferred changes, it is necessary to detach the holding mechanism. However, in Patent Document 2, since one end of the suction pipe is connected to the holding mechanism and the other end of the suction pipe is connected to the suction source, the suction pipe is connected and disconnected separately from the attaching and detaching work of the holding mechanism. Is called. For this reason, there is a problem that not only the work is complicated and takes a long time, but also a suction pipe connection error is caused.

  This invention is made | formed in view of this point, and even if the diameter of the plate-shaped workpiece to convey changes, it aims at providing the conveying apparatus which can reduce the work burden accompanying this change.

The conveying apparatus of the present invention includes two or more holding mechanisms that suck and hold a plate-shaped workpiece, and a moving mechanism that selectively connects the two or more holding mechanisms with a connecting mechanism to move the holding mechanism. The two or more holding mechanisms are connected to the suction source by coupling with the moving mechanism by the coupling mechanism , and the holding mechanism is in contact with one surface of the plate-shaped workpiece and sucked and held by the suction holding unit. And a first connection port connected to the other end of the first suction tube, and the moving mechanism includes a second suction port corresponding to the first connection port. A connection port, and a second suction pipe that connects one end to the second connection port and connects the other end to a suction source, and the coupling mechanism is a first coupling provided in the holding mechanism. And a second connecting part provided in the moving mechanism, and the holding mechanism and the moving mechanism are connected to the first connecting part and the second connecting part. The first connection port and the second connection port are connected to each other by the connection portion to connect the suction holding portion to the suction source, and the second connection portion is a plate-like work held by the holding mechanism. A rotating shaft disposed perpendicular to the rotating shaft and a connecting bar connected orthogonally to the rotating shaft, the first connecting portion including an insertion port for inserting the second connecting portion, and an insertion port when the inserting the second connecting portion, and a connecting bar rotation hole including a ramp for maintaining the connection state of the holding mechanism and the moving mechanism by contact with the connecting bar by the rotation of the rotary shaft, the Rukoto includes a Features.

According to this configuration, the holding mechanism and the suction source can be connected and disconnected by detaching the holding mechanism from the moving mechanism by the coupling mechanism. That is, apart from the operation of detaching the moving mechanism and the holding mechanism by the coupling mechanism, the operation of connecting and releasing the connection between the holding mechanism and the suction source can be omitted. Thereby, when two or more holding mechanisms are selectively connected in accordance with a change in the diameter of the plate-shaped workpiece to be conveyed, the time required for the work can be shortened and the work load can be reduced. Thus, it is possible to prevent a connection error with respect to the suction source. Further, by bringing the connecting bar and the inclined surface of the connecting bar rotation hole into contact with each other by the rotation of the rotating shaft, a force in the direction of pressing the holding mechanism against the moving mechanism can be generated, and the connecting state of the holding mechanism and the moving mechanism Can be maintained well.

  In the transport apparatus of the present invention, the moving mechanism may include a tilt variable mechanism that varies the tilt of the holding mechanism. According to this configuration, even when the table on which the plate-like workpiece is placed is tilted, the holding mechanism can be tilted according to the tilt.

  According to the present invention, even if the diameter of the plate-shaped workpiece to be conveyed changes, the work burden associated with such change can be reduced.

It is a decomposition cross-section schematic diagram of the conveying apparatus which concerns on 1st Embodiment. It is a top view of the 1st holding mechanism concerning a 1st embodiment. It is a top view of the 2nd holding mechanism concerning a 1st embodiment. It is a cross-sectional schematic diagram just before connecting the 1st holding mechanism which concerns on 1st Embodiment to a moving mechanism. It is a cross-sectional schematic diagram of the state with which the 1st holding mechanism which concerns on 1st Embodiment was connected with the moving mechanism. It is a cross-sectional schematic diagram just before connecting the 2nd holding mechanism which concerns on 1st Embodiment to a moving mechanism. It is a cross-sectional schematic diagram of the state with which the 2nd holding mechanism which concerns on 1st Embodiment was connected with the moving mechanism. It is a decomposition section mimetic diagram of the 1st maintenance mechanism and move mechanism concerning a 2nd embodiment. It is a cross-sectional schematic diagram of the state with which the 1st holding mechanism which concerns on 2nd Embodiment was connected with the moving mechanism. It is a cross-sectional schematic diagram of the state in which the 1st holding mechanism which concerns on 2nd Embodiment hold | maintains a plate-shaped workpiece.

  Hereinafter, a transport device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The conveying device can be applied to a grinding device that grinds a plate-shaped workpiece, and can also be applied to other processing devices that convey two or more plate-shaped workpieces having different diameters.

(First embodiment)
With reference to FIG. 1, the structure of the conveying apparatus which concerns on 1st Embodiment is demonstrated. FIG. 1 is an exploded cross-sectional schematic view of the transport apparatus according to the first embodiment. As shown in FIG. 1, the transport apparatus 1 includes a moving mechanism 5 that is selectively connected to two holding mechanisms 3 and 4. In the following description, the holding mechanism illustrated on the left side in FIG. 1 is referred to as a first holding mechanism 3, and the holding mechanism illustrated on the right side is referred to as a second holding mechanism 4.

  FIG. 2 is a plan view of the first holding mechanism. As shown in FIGS. 1 and 2, the first holding mechanism 3 includes a disk-shaped main body 31 and a suction holding portion 32 fitted on the lower surface side of the main body 31. The suction holding unit 32 is made of, for example, a porous ceramic material and is generally formed in a disk shape. The first holding mechanism 3 includes a plurality of first connection ports 33 formed in a concave shape on the upper surface of the main body 31. In the present embodiment, four first connection ports 33 are formed at intervals of 90 ° in the circumferential direction around an insertion port 63 described later in plan view. In the main body 31, a first suction pipe 34 extending linearly in the vertical direction is formed between the suction holding portion 32 and each first connection port 33. One end (lower end) of the first suction pipe 34 is connected to the suction holding portion 32, while the other end (upper end) of the first suction pipe 34 is connected to the first connection port 33. ing.

  FIG. 3 is a plan view of the second holding mechanism. As shown in FIGS. 1 and 3, the second holding mechanism 4 includes a disk-shaped main body 41 having a diameter larger than that of the main body 31 of the first holding mechanism 3. A suction holding portion 42 formed in a sucker shape is provided on the outer peripheral side of the lower surface of the main body 41, and the suction holding portions 42 are arranged at four positions at intervals of 90 ° in the outer peripheral direction of the main body 41. . The second holding mechanism 4 includes a plurality of first connection ports 43 formed on the upper surface of the main body 41. Each first connection port 43 has a concave shape that is the same shape as the first connection port 33 in the first holding mechanism 3. The relative position between each first connection port 43 and an insertion port 63 described later is set in the same manner as the relative position between the first connection port 33 and the insertion port 63 in the first holding mechanism 3. In the main body 41, a first suction pipe 44 extending in a crank shape in a sectional view is formed between the suction holding portion 42 and the first connection port 43. One end (lower end) of the first suction pipe 44 is connected to a flow path 42 a (not shown in FIG. 1) formed at the center of the suction holding portion 42, while the other end of the first suction pipe 44. This end (upper end) is connected to the first connection port 43.

  As shown in FIG. 1, the moving mechanism 5 includes an arm 52 that is moved up and down by the lifting means 51 and a second connection port 53 that is provided on the lower surface side of the arm 52. The arm 52 is connected to a rotating means (not shown) and is configured to be rotatable with the left end in FIG. The second connection ports 53 are provided at four positions (two locations are not shown in FIG. 1) that overlap corresponding to the first connection ports 33 and 43 of both the first and second holding mechanisms 3 and 4. ing. The second connection port 53 is formed in a sucker shape having a size that can be received inside the first connection ports 33 and 43. In the arm 52, a second suction pipe 55 is formed between the adapter 54 disposed on the upper surface of the arm 52 and the second connection port 53. One end (lower end) of the second suction pipe 55 is connected to a flow path (not shown) formed at the center of the second connection port 53, while the other end of the second suction pipe 55 is connected. The (upper end) is connected to a suction source 57 via a tube body 56 made of an adapter 54 and a tube.

  The first holding mechanism 3 and the second holding mechanism 4 are connected by a connecting mechanism 6. The connection mechanism 6 includes a first connection portion 61 provided in each of the first holding mechanism 3 and the second holding mechanism 4 and a second connection portion 62 provided in the moving mechanism 5.

  The first connecting portion 61 provided in the first holding mechanism 3 and the first connecting portion 61 provided in the second holding mechanism 4 are formed in the same shape. The first connecting portion 61 has an insertion port 63 that extends downward from the upper surfaces of the main bodies 31 and 41, and a connection bar rotation hole 64 that continues to the lower end of the insertion port 63. The insertion port 63 is formed in a slot hole shape extending in the vertical direction in FIGS. 2 and 3 in plan view. The connecting bar rotation hole 64 includes an inclined surface 64a formed in a truncated cone shape having a larger diameter from the upper end in FIG. 1 toward the lower side, and a recessed portion 64b continuous below the inclined surface 64a.

  The second connecting portion 62 includes a rotating shaft 62a that is rotatably supported by the arm 52 via a bearing, a connecting bar 62b that is connected to the lower end of the rotating shaft 62a and extends in a direction perpendicular to the rotating shaft 62a. It has. The rotary shaft 62a is oriented in the vertical direction in FIG. 1, and is arranged in the vertical direction with respect to the plate-like workpieces W1 and W2 (see FIGS. 5 and 7) held by the holding mechanisms 3 and 4 in a transport operation described later. Established. A handle 62c is fixed to the upper end of the rotating shaft 62a. By rotating the handle 62c in the direction of arrow R in FIG. 1, the rotating shaft 62a can be rotated to change the direction of the connecting bar 62b. The connecting bar 62b can be inserted into the insertion opening 63 and has a length and size that can be received in the recessed portion 64b (see FIGS. 5 and 7). An urging member 62 d made of a coil spring is provided between the handle 62 c and the upper surface of the arm 52. When the handle 62c is pushed down, the urging member 62d exerts an elastic force that raises the handle 62c, the rotary shaft 62a, and the connecting bar 62b against the push-down.

  Subsequently, with reference to FIG. 4 and FIG. 5, an operation of connecting the first holding mechanism 3 to the moving mechanism 5 and an operation of releasing the connection will be described. FIG. 4 is a schematic cross-sectional view immediately before the first holding mechanism is connected to the moving mechanism, and FIG. 5 is a schematic cross-sectional view in a state where the first holding mechanism is connected to the moving mechanism.

  As shown in FIG. 4, first, the main body 31 of the first holding mechanism 3 is arranged below the arm 52 and the second holding port 3 is inserted into the insertion port 63 in order to connect the first holding mechanism 3 to the moving mechanism 5. The connecting bar 62b and the rotating shaft 62a of the connecting part 62 are inserted. And while performing such insertion, the second connection port 53 is also received inside the first connection port 33. From this state, while pushing down the handle 62c against the elastic force of the biasing member 62d, the handle 62c is rotated to rotate the rotating shaft 62a and the connecting bar 62b. Then, as shown in FIG. 5, the upper end of the connecting bar 62 b and the inclined surface 64 a come into contact with each other, and a force pressing the main body 31 against the arm 52 acts by this contact. As a result, the arm 52 and the main body 31 are prevented from separating, and the connection state between the first holding mechanism 3 and the moving mechanism 5 is maintained. In this state, the elastic force of the urging member 62d is also acting, and the main body 31 is pressed against the arm 52 by this elastic force. Simultaneously with the connection of the first holding mechanism 3 and the moving mechanism 5, each sucker-like second connection port 53 comes into close contact with the bottom of the first connection port 33. Accordingly, the first connection port 33 and the second connection port 53 are connected to allow the suction holding unit 32 to communicate with the suction source 57, and the first plate-like workpiece W1 can be sucked and held by the suction holding unit 32. It becomes a state.

  On the other hand, in the operation of releasing the connection between the moving mechanism 5 and the first holding mechanism 3, the handle 62c is rotated from the state shown in FIG. 5 to rotate the connecting bar 62b. Then, the first holding mechanism 3 is lowered with respect to the arm 52, and the connecting bar 62b and the rotating shaft 62a are extracted from the insertion port 63. By this extraction, the second connection port 53 is detached from the first connection port 33. Is done. Thereby, the connection between the moving mechanism 5 and the first holding mechanism 3 is released, and at the same time, the connection between the first connection port 33 and the second connection port 53 is also released.

  FIG. 6 is a schematic cross-sectional view immediately before the second holding mechanism is connected to the moving mechanism, and FIG. 7 is a schematic cross-sectional view in a state where the second holding mechanism is connected to the moving mechanism. As shown in FIGS. 4 to 7, the first and second holding mechanisms 3 and 4 are formed with a first connecting portion 61 having the same configuration, and the first connection port 33 in the first holding mechanism 3 and The first connection port 44 in the second holding mechanism 4 has the same configuration. Therefore, the operation of connecting the second holding mechanism 4 to the moving mechanism 5 and the operation of releasing the connection can be performed in the same manner as the operation of connecting and releasing the connection of the first holding mechanism 3. Accordingly, the description of the connection and release work of the second holding mechanism 4 is omitted because the description is duplicated.

  Next, the carrying operation of the carrying device 1 will be described. Here, the first holding mechanism 3 is used to hold the first plate-like workpiece W1 shown in FIG. 5, and the second holding mechanism 4 is the second plate shown in FIG. Is used to hold the workpiece W2. As shown in FIG. 5, the first plate-like workpiece W1 is obtained by attaching a substrate S to a lower surface of a semiconductor wafer Wf via a wax for grinding. Therefore, the planar shape of the suction holding unit 32 of the first holding mechanism 3 is formed in a circular shape slightly smaller than the semiconductor wafer Wf. On the other hand, as shown in FIG. 7, the second plate-like workpiece W2 is obtained by supporting the semiconductor wafer Wf on the inner side of the ring frame R via the adhesive tape Tp. Therefore, the four suction holding portions 42 of the second holding mechanism 4 are provided on the upper surface of the ring frame R at positions that can be simultaneously arranged.

  When the first plate-like workpiece W1 is conveyed, the first holding mechanism 3 is connected to the moving mechanism 5 as shown in FIG. Then, the first holding mechanism 3 is positioned at a position immediately above the first plate-like workpiece W1 sucked and held by the table T connected to a suction source (not shown). Thereafter, the first holding mechanism 3 is lowered, and the suction holding unit 32 is brought into contact with the upper surface of the semiconductor wafer Wf in the first plate-like workpiece W1. In this state, the suction force by the suction source 57 is communicated with the tube 56, the second suction tube 55, the second connection port 53, the first connection port 33, the first suction tube 34, and the suction holding unit 32. It acts on the first plate-like workpiece W1 that comes into contact with the suction holding portion 32. Thereby, the first plate-like workpiece W1 is sucked and held by the first holding mechanism 3, and the first plate-like workpiece W1 is conveyed to another table or the like (not shown) by moving the arm 52 in this state. can do.

  The conveyance of the second plate-like workpiece W2 is also performed in the same manner as the conveyance of the first plate-like workpiece W1. As a precaution, as shown in FIG. 7, the second holding mechanism 4 is connected to the moving mechanism 5, and the second holding mechanism 4 is held at a position immediately above the second plate-like workpiece W2 sucked and held by the table T. Position mechanism 4. Thereafter, the second holding mechanism 4 is lowered, and each suction holding portion 42 is brought into contact with the upper surface of the ring frame R in the second plate-like workpiece W2. In this state, the suction force by the suction source 57 is communicated with the tube 56, the second suction tube 55, the second connection port 53, the first connection port 43, the first suction tube 44, and each suction holding unit. It acts on the 2nd plate-shaped workpiece W2 which contacts each suction holding | maintenance part 42 through 42. FIG. As a result, the second plate-like workpiece W2 is sucked and held by the second holding mechanism 4, and the second plate-like workpiece W2 is conveyed to another table or the like (not shown) by moving the arm 52 in this state. can do.

  As described above, according to the transport device 1 according to the present embodiment, the first connection port 33 is simultaneously attached to and detached from the moving mechanism 5 in any of the first and second holding mechanisms 3 and 4. , 43 and the second connection port 53 can be connected and disconnected. Accordingly, even when the plate-like workpieces W1 and W2 to be conveyed are changed and the holding mechanisms 3 and 4 connected to the moving mechanism 5 are exchanged, such an operation can be performed quickly and easily. As a result, it is possible to reduce the burden of work associated with changes in the diameters of the plate-like workpieces W1 and W2, and it is possible to avoid a connection error with respect to the suction source as in the prior art.

  In addition, since the inclined surface 64a is formed in the connecting bar rotation hole 64, the arm 52 and the main bodies 31, 41 can be brought into pressure contact with each other by the contact between the rotating connecting bar 62b and the inclined surface 64a. Can be maintained.

(Second Embodiment)
Next, a second embodiment different from the first embodiment will be described. Note that, in the second embodiment, components that are the same as those in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.

  FIG. 8 is an exploded cross-sectional schematic diagram of the first holding mechanism and the moving mechanism according to the second embodiment. FIG. 9 is a schematic cross-sectional view of the state where the first holding mechanism is connected to the moving mechanism, and FIG. 10 is a schematic cross-sectional view of the state where the first holding mechanism holds the plate-like workpiece. As shown in FIGS. 8 to 10, the transport apparatus 101 according to the second embodiment is obtained by changing the configuration of the moving mechanism 5 of the transport apparatus 1 according to the first embodiment. Here, the transport apparatus 101 of the second embodiment includes first and second holding mechanisms 3 and 4 having the same configuration as the transport apparatus 1 of the first embodiment. Then, illustration of the second holding mechanism 4 is omitted.

  The moving mechanism 105 according to the second embodiment includes an arm 152 that moves up and down by the lifting means 51 and a tilt variable mechanism 156 that is provided on the tip (left end) side of the arm 152. The tilt varying mechanism 156 includes a male screw member 156a made of a bolt or the like inserted into a stepped hole 152a formed on the distal end side of the arm 152, and a plate-shaped adjusting member 156b screwed by the male screw member 156a. Yes. The adjustment member 156b is provided with a second connecting portion 62, a second connection port 53, an adapter 54, and a second suction pipe 55 similar to those in the first embodiment. Therefore, the adjustment member 156b is connected to the first holding mechanism 3 via the first and second connecting portions 61 and 62, and the first and second connection ports 33 and 53 are connected in this connected state. . Note that an opening 152 b is formed in a region above the second connecting portion 62 in the arm 152.

  The male screw member 156a is disposed at a plurality of locations on the outer peripheral side of the adjustment member 156b. The male screw member 156a can be moved forward and backward from a screw hole 156d formed in the adjustment member 156b by rotating around the axis, and by this advancement and retraction, the separation distance between the arm 152 and the adjustment member 156b in the vicinity of the male screw member 156a. Can be adjusted.

  The male screw member 156a passes through an urging member 156c made of a coil spring, and the urging member 156c is interposed between the arm 152 and the adjustment member 156b. The biasing member 156c normally exhibits an elastic force in a direction in which the arm 152 and the adjustment member 156b are separated from each other. The urging member 156c can be elastically deformed so that the vertical length is reduced when the suction holding portion 32 is brought into contact with the first plate-like workpiece W1, and the impact applied to the first plate-like workpiece W1 can be reduced. .

  Here, for example, as shown in FIG. 10, when the placement surface (upper surface) of the table T is inclined with respect to the horizontal direction, the first plate-like workpiece W1 placed on the table T is similarly inclined. It becomes a state. In the present embodiment, the variable tilt mechanism 156 can adjust the lower surface of the suction holding unit 32 to be parallel to the upper surface of the tilted first plate-like workpiece W1. This adjustment is performed by rotating at least one of the plurality of male screw members 156a. As a result, the amount of advancement / retraction of each male screw member 156a with respect to the screw hole 156d is different, and the separation distance between the arm 152 and the adjustment member 156b in the vicinity of each male screw member 156a is also different. As a result, the inclination of the adjustment member 156b and the first holding mechanism 3 connected to the adjustment member 156b is variable, and the lower surface of the suction holding portion 32 is adjusted to the first level by appropriately adjusting the amount of advance and retreat of each male screw member 156a. It can be made parallel to the plate-like workpiece W1.

  Therefore, according to the second embodiment, even when the table T is tilted, the suction holding unit 32 is tilted according to the tilt, and the suction holding unit 32 and the first plate-like workpiece W1 are in surface contact. Can be adjusted. Thereby, when making the suction holding | maintenance part 32 contact the 1st plate-shaped workpiece W1, it can prevent that the load which concentrated locally on the 1st plate-shaped workpiece W1 arises.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in each of the above-described embodiments, the transport apparatus 1 has two holding mechanisms (first and second holding mechanisms 3 and 4). However, the holding mechanism that can be connected to the moving mechanism 5 by the connecting mechanism 6. Three or more mechanisms may be added.

  Further, the plate-like workpiece may be not only a wafer to be ground and a member that holds the workpiece, but also various plate-like processing materials and conveyance objects that can be sucked and held by a holding mechanism.

  As described above, the present invention is applied to an apparatus that transports two plate-like workpieces having different diameters, and even if the diameter of the plate-like workpiece to be transported changes, the work burden associated with the change in the diameter of the plate-like workpiece is reduced. There is an effect that it can be reduced.

DESCRIPTION OF SYMBOLS 1,101 Conveying device 3 1st holding mechanism 4 2nd holding mechanism 5,105 Movement mechanism 6 Connection mechanism 32,42 Suction holding part 33,43 1st connection port 34,44 1st suction pipe 53 2nd Connection port 55 second suction pipe 57 suction source 61 first connection portion 62 second connection portion 63 insertion port 64 connection bar rotation hole 64a slope 156 tilt variable mechanism W1 plate-like workpiece (first plate-like workpiece)
W2 Plate workpiece (second plate workpiece)

Claims (2)

Two or more holding mechanisms for sucking and holding the plate-like workpiece, and a moving mechanism for selectively connecting the two or more holding mechanisms with a connecting mechanism to move the holding mechanism,
The two or more holding mechanisms are connected to a suction source by coupling with the moving mechanism by the coupling mechanism ,
The holding mechanism includes a suction holding unit that contacts and holds one surface of the plate-shaped workpiece, a first suction pipe that connects one end to the suction holding part, and the other of the first suction pipes A first connection port connected to the end of the
The moving mechanism includes a second connection port corresponding to the first connection port, and a second suction pipe that connects one end to the second connection port and connects the other end to the suction source. And comprising
The coupling mechanism includes a first coupling portion provided in the holding mechanism and a second coupling portion provided in the moving mechanism, and the holding mechanism and the moving mechanism are connected to the first coupling portion. The first connection port and the second connection port are connected to each other and the suction holding unit is communicated with the suction source.
The second connecting portion includes a rotating shaft disposed perpendicular to the plate-like workpiece held by the holding mechanism, and a connecting bar connected orthogonally to the rotating shaft,
The first connecting portion is brought into contact with the connecting bar by rotation of the rotating shaft when the second connecting portion is inserted through the insertion port into which the second connecting portion is inserted and the second connecting portion is inserted through the insertion port. And a connecting bar rotating hole including a slope that maintains the connection state between the holding mechanism and the moving mechanism . The moving mechanism includes a transport apparatus according to claim 1, further comprising a tilt adjustment mechanism for varying the inclination of the holding mechanism.

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