CN104821288A - Transport mechanism - Google Patents
Transport mechanism Download PDFInfo
- Publication number
- CN104821288A CN104821288A CN201510038481.XA CN201510038481A CN104821288A CN 104821288 A CN104821288 A CN 104821288A CN 201510038481 A CN201510038481 A CN 201510038481A CN 104821288 A CN104821288 A CN 104821288A
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- China
- Prior art keywords
- wafer
- holding
- suction
- maintaining part
- holding head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
Abstract
The invention provides a transport mechanism. Even if when a warped wafer is carried to a holding workbench, the workbench can still suck and hold the wafer. The transport mechanism transports the wafer to the holding workbench which sucks and holds the wafer. The transport mechanism has a holding head (12) and a holding head moving component (13). The holding head has a plurality of sucking holding portions (24a-24c) which suck and hold the wafer and a plurality of pressing parts (25a-25c) which can move between a pressing position where the peripheral portion of the wafer which is carried on the holding workbench (50) is pressed towards the holding workbench and a withdrawing position which in not in contact with the wafer held by the sucking holding portions. The holding head moving component enables the holding head to approach and get away from the workbench. Even if in a condition that the peripheral portion of the wafer is warped upwards, the warping of the wafer can be rectified on the holding workbench to eliminated the gap between the wafer and the holding workbench and to suck and hold the wafer.
Description
Technical field
The present invention relates to carrying wafers to the carrying mechanism of holding table.
Background technology
Wafer is being carried out in the processing unit (plant) of various processing, there is the processing unit (plant) (for example, referring to patent documentation 1) possessed the holding table that the wafer as processing object keeps.In the processing unit (plant) possessing such holding table, usually possesses the carrying mechanism (for example, referring to patent documentation 2) of handling wafers between holding table and other positions.
Patent documentation 1: Japanese Unexamined Patent Publication 11-284056 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2013-144323 publication
But, there is such situation: the wafer after thinning, be laminated with the materials such as glass, silicon or sealing resin stacked wafers on produce and have warpage.When the wafer this creating warpage is placed in holding table, between the holding surface and wafer of holding table, there is gap, even if therefore there is the problem utilizing negative-pressure ward wafer also possibly wafer cannot be kept such.
Summary of the invention
The present invention completes in view of such problem just, its object is to: even if when the carrying wafers that will there is warpage is to holding table, holding table also can aspirate maintenance wafer.
The present invention is a kind of carrying mechanism, it keeps the holding table handling wafers of wafer to suction, and wherein, described carrying mechanism possesses holding head and holding head mobile member, described holding head possesses: multiple suction maintaining part, and described multiple suction maintaining part suction keeps wafer; With multiple pressing component, described multiple pressing component at the pressing position pressed towards this holding table by the peripheral part of the wafer be placed on this holding table and and between the retreating position of the contact wafers kept by this suction maintaining part can not move, and described holding head mobile member makes this holding head close relative to this holding table and leave.
Preferably, described multiple suction maintaining part be adapted to can than described pressing component inner side in the inner part and and this pressing component be between same outer fix circumferentially and move.
According to carrying mechanism of the present invention, multiple pressing component is towards the outer peripheral portion of holding table pressing wafer, even if therefore when the outer peripheral portion of wafer is upturned, also the warpage of wafer can be corrected on holding table, eliminate the gap between holding table, aspirate maintenance wafer.
And, if suction maintaining part can move between inner side and outer fix, then when the outer peripheral portion of wafer is upturned, by suction maintaining part is configured in outer fix, can not only pressing component be utilized thus, suction maintaining part also can be utilized towards the outer peripheral portion of holding table pressing wafer.And, when the outer peripheral portion downsagging of wafer, by suction maintaining part is configured in inner side, thus, can, while utilize pressing component to press the outer peripheral portion of wafer, utilize suction maintaining part towards the middle body of holding table pressing wafer.Thus, no matter be when the outer peripheral portion of wafer is upturned or downsagging when, can both correct the warpage of wafer, eliminate the gap between holding table, thus holding table can aspirate maintenance wafer.
Accompanying drawing explanation
Fig. 1 is the stereogram that carrying mechanism is shown.
Fig. 2 illustrates that carrying mechanism keeps the sectional view of the appearance of wafer.
Fig. 3 illustrates that wafer is placed in the sectional view of the appearance of holding table by carrying mechanism.
Fig. 4 is the sectional view that the appearance that wafer presses to holding table by carrying mechanism is shown.
Fig. 5 illustrates that carrying mechanism keeps the sectional view of the appearance of wafer.
Fig. 6 is the sectional view that the appearance that wafer presses to holding table by carrying mechanism is shown.
Label declaration
10: carrying mechanism;
12: holding head;
21: central portion;
22a ~ 22c, 23a ~ 23c: arm;
24,24a ~ 24c: suction maintaining part;
25,25a ~ 25c: pressing component;
26,26a ~ 26c: pressing mobile member;
13: holding head mobile member;
31: support;
32: arm;
33: axle portion;
41,43: suction source;
42,44: check-valves;
50: holding table;
51: holding surface;
60: wafer.
Embodiment
Carrying mechanism 10 shown in Fig. 1 is assembled in the mechanism in the processing unit (plant) such as processed wafer, and this carrying mechanism 10 such as loads carrying wafers on the interim mounting workbench of wafer to keeping on the holding table of wafer man-hour adding before processing by being placed in temporarily.Holding table carries out suction maintenance to being carried the wafer come by carrying mechanism 10.The wafer being held in holding table is such as processed by tool member such as grinding component or cutting members.Carrying mechanism 10 possesses the holding head mobile member 13 keeping the holding head 12 of wafer and make holding head 12 movement in handling process.
Holding head 12 possesses: discoideus central portion 21 parallel plane with XY, and it is parallel with the holding surface loading workbench and holding table temporarily; 6 arm 22a ~ 22c, 23a ~ 23c, they with the parallel plane plane of XY in radially extend toward the outer side from central portion 21; 3 suction maintaining part 24a ~ 24c, they are arranged at each arm 23a ~ 23c; And 3 pressing component 25a ~ 25c and 3 pressing mobile member 26a ~ 26c, they are arranged at each arm 22a ~ 22c.
The adjacent angle between arm 22a ~ 22c, 23a ~ 23c is 60 degree.Further, suction maintaining part 24a ~ 24c is connected via suction sources 41 such as check-valves 42 and vacuum sources, aspirates maintenance wafer.Suction maintaining part 24a ~ 24c is configured to move diametrically along arm 23a ~ 23c.
The radius of the wafer that the distance between the center (central shaft of central portion 21) of holding head 12 and each pressing component 25a ~ 25c will be carried than carrying mechanism 10 is slightly little, and pressing component 25a ~ 25c is configured to press the outer peripheral portion of wafer.
Distance between the center of holding head 12 and each suction maintaining part 24a ~ 24c changes according to suction maintaining part 24a ~ moving radially of 24c.When each suction maintaining part 24a ~ 24c is in the position farthest, center leaving holding head 12, distance between the center of the distance between the center of holding head 12 and each suction maintaining part 24a ~ 24c and holding head 12 and each pressing component 25a ~ 25c is equal, and each suction maintaining part 24a ~ 24c is positioned at identical circumferentially with each pressing component 25a ~ 25c.The position of suction maintaining part 24a ~ 24c is now called " outer fix ".When aspirating maintaining part 24a ~ 24c and being in outer fix, suction maintaining part 24a ~ 24c carries out suction to the outer peripheral portion of wafer and keeps.On the other hand, when each suction maintaining part 24a ~ 24c is in the position closest to the center of holding head 12, distance between the center of holding head 12 and each suction maintaining part 24a ~ 24c is less than the distance between the center of holding head 12 and each pressing component 25a ~ 25c, and each suction maintaining part 24a ~ 24c is positioned at than the circumference position in the inner part by each pressing component 25a ~ 25c.The position of suction maintaining part 24a ~ 24c is now called " inner side ".When aspirating maintaining part 24a ~ 24c and being in inner side, suction maintaining part 24a ~ 24c carries out suction maintenance in the ectocentral position that connects to wafer.
Pressing mobile member 26a ~ 26c possesses: such as at the bar that end is connected with pressing component 25a ~ 25c; With make bar to XY plane orthogonal ± cylinder of Z-direction movement, move by making bar and pressing component 25a ~ 25c moved to ± Z-direction.Cylinder is such as the two benches stroke cylinder that bar can be made to extend with 2 stages.When pressing mobile member 26a ~ 26c and making pressing component 25a ~ 25c move to+Z-direction, pressing component 25a ~ 25c retreat to not with the position being sucked maintaining part 24a ~ 24c and aspirating the contact wafers kept.The position of pressing component 25a ~ 25c is now called " retreating position ".On the other hand, when pressing mobile member 26a ~ 26c and making pressing component 25a ~ 25c move to-Z-direction, pressing component 25a ~ 25c abuts with wafer, and presses wafer to-Z-direction.The position of pressing component 25a ~ 25c is now called " pressing position ".For pressing position, the end that there is pressing component 25a ~ 25c is positioned at by " first pressing position " of-Z side and the end of pressing component 25a ~ 25c than the end of suction maintaining part 24a ~ 24c " second pressing position " of the position of the height identical with the end of suction maintaining part 24a ~ 24c in ± Z-direction in ± Z-direction.
Holding head mobile member 13 possesses: the support 31 of supporting holding head 12; The arm 32 of support 31 is arranged at end; With the axle portion 33 making arm 32 movement.Axle portion 33 makes arm 32 at XY rotation with in surface, and arm 32 is moved to ± Z-direction.Thus, holding head 12 moves, and makes holding head 12 close to the holding table being placed with the interim mounting workbench of the wafer carried or the carrying destination as wafer, or holding head 12 is left from interim mounting workbench or holding table.
Next, the step of handling wafers is described.Below, using suction maintaining part 24a ~ 24c in arbitrary 1 as aspirate maintaining part 24, using in pressing component 25a ~ 25c any 1 as pressing component 25, and using in mobile member 26a ~ 26c any 1 as mobile member 26, be described.
(1) under wafer is umbilicate situation
As shown in Figure 2, at the outer peripheral portion of wafer 60 in the situation (umbilicate situation) of+Z-direction warpage, make suction maintaining part 24 move to outer peripheral side and be positioned outer fix, pressing mobile member 26 makes pressing component 25 move to+Z-direction and be positioned retreating position.In this condition, holding head mobile member 13 makes arm 32 rotate, holding head 12 is positioned at the wafer 60 being placed in interim mounting workbench etc.+Z-direction, holding head mobile member 13 makes arm 32 move to-Z-direction, thus make suction maintaining part 24 be connected to the outer peripheral portion of wafer 60.Then, open check-valves 42 (with reference to Fig. 1), start the suction carrying out realizing based on suction source 41 (with reference to Fig. 1), suction maintaining part 24 is aspirated and is kept wafer 60.
As shown in Figure 3, holding table 50 possesses the holding surface 51 be connected with suction sources 43 such as vacuum sources via check-valves 44.Holding head mobile member 13 makes arm 32 move to+Z-direction, and carry being sucked on wafer 60 that maintaining part 24 keeps, holding head mobile member 13 makes arm 32 rotate, holding head 12 is positioned the holding table 50 of the carrying destination as wafer 60+Z-direction.Then, holding head mobile member 13 makes arm 32 decline to-Z-direction, will be sucked wafer 60 that maintaining part 24 keeps and be placed in the holding surface 51 of holding table 50.
Next, as shown in Figure 4, close check-valves 42 (with reference to Fig. 1), stop the suction carrying out realizing based on suction source 41 (with reference to Fig. 1), suction maintaining part 24 releasing wafer 60, pressing mobile member 26 makes pressing component 25 move to-Z-direction and be positioned the first pressing position, to the outer peripheral portion of-Z-direction pressing wafer 60.Then, open the suction that check-valves 44 starts to carry out realizing based on suction source 43, holding table 50 aspirates and keeps wafer 60.By the outer peripheral portion of pressing component 25 to-Z-direction pressing wafer 60, corrected the warpage of wafer 60, the gap between wafer 60 and holding surface 51 disappears.In this condition, holding table 50 aspirates, and can reliably keep wafer 60 thus.In addition, also pressing component 25 can be positioned the second pressing position, instead of the first pressing position.Like this, pressing component 25 can be utilized, suction maintaining part 24 can also be utilized to press wafer 60.
(2) when wafer is center protrusion
As shown in Figure 5, at the outer peripheral portion of wafer 60 in the situation (situation of center protrusion) of-Z-direction warpage, suction keeps mobile member to make suction maintaining part 24 move to central side and be positioned inner side, and pressing mobile member 26 makes pressing component 25 move to-Z-direction and be positioned retreating position.In this condition, holding head mobile member 13 makes arm 32 rotate, holding head 12 is positioned at the wafer 60 being placed in interim mounting workbench etc.+Z-direction, holding head mobile member 13 makes arm 32 move to-Z-direction, and suction maintaining part 24 is connected near the central authorities of wafer 60.Then, open check-valves 42 (with reference to Fig. 1), start the suction carrying out realizing based on suction source 41 (with reference to Fig. 1), suction maintaining part 24 is aspirated and is kept wafer 60.
Next, holding head mobile member 13 makes arm 32 move to+Z-direction, mention being sucked the wafer 60 that maintaining part 24 keeps, holding head mobile member 13 makes arm 32 rotate, holding head 12 is positioned the holding table 50 of the carrying destination as wafer 60+Z-direction.Then, holding head mobile member 13 makes arm 32 decline to-Z-direction, is placed in being sucked the wafer 60 that maintaining part 24 keeps in the holding surface 51 of holding table 50.
As shown in Figure 6, pressing mobile member 26 makes pressing component 25 move to-Z-direction and be positioned the second pressing position, holding head mobile member 13 makes arm 32 decline to-Z-direction, utilize pressing component 25 to the outer peripheral portion of-Z-direction pressing wafer 60, utilize suction maintaining part 24 simultaneously near the central authorities of-Z-direction pressing wafer 60.Then, open the suction that check-valves 44 starts to carry out realizing based on suction source 43, holding table 50 aspirates and keeps wafer 60, closes check-valves 42 (with reference to Fig. 1), stop the suction carrying out realizing based on suction source 41 (with reference to Fig. 1), suction maintaining part 24 releasing wafer 60.
Pressing component 25 to the outer peripheral portion of-Z-direction pressing wafer 60, and aspirates maintaining part 24 near the central authorities of-Z-direction pressing wafer 60, and corrected the warpage of wafer 60 thus, the gap between wafer 60 and holding surface 51 disappears.Holding table 50 aspirates in this condition, can reliably keep wafer 60 thus.
In addition, the quantity of suction maintaining part is not limited to 3, also can be more than 4.Similarly, the quantity of pressing component is not limited to 3, also can be more than 4.Further, aspirating maintaining part 24a ~ 24c also can be larger apart from the distance at center than pressing component 25a ~ 25c in the distance at the situation Xia Ju center being in outer fix.And, also can be such structure: not only aspirate maintaining part 24a ~ 24c and radially move, pressing component 25a ~ 25c also radially moves.
Claims (2)
1. a carrying mechanism, it keeps the holding table handling wafers of wafer to suction, wherein,
Described carrying mechanism possesses holding head and holding head mobile member,
Described holding head possesses: multiple suction maintaining part, and described multiple suction maintaining part suction keeps wafer; With multiple pressing component, described multiple pressing component at the pressing position pressed towards this holding table by the peripheral part of the wafer be placed on this holding table and and between the retreating position of the contact wafers kept by this suction maintaining part can not move,
Described holding head mobile member makes this holding head close relative to this holding table and leave.
2. carrying mechanism according to claim 1, wherein,
Described multiple suction maintaining part be adapted to can than described pressing component inner side in the inner part and and this pressing component be between same outer fix circumferentially and move.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014015444A JP6255259B2 (en) | 2014-01-30 | 2014-01-30 | Transport mechanism |
| JP2014-015444 | 2014-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104821288A true CN104821288A (en) | 2015-08-05 |
| CN104821288B CN104821288B (en) | 2019-04-19 |
Family
ID=53731546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510038481.XA Active CN104821288B (en) | 2014-01-30 | 2015-01-26 | Carrying mechanism |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6255259B2 (en) |
| KR (1) | KR102154718B1 (en) |
| CN (1) | CN104821288B (en) |
| TW (1) | TWI611499B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6859075B2 (en) * | 2016-11-04 | 2021-04-14 | 株式会社東京精密 | Wafer transfer holding device |
| JP6879807B2 (en) * | 2017-04-07 | 2021-06-02 | 株式会社ディスコ | Processing equipment |
| CN113003185A (en) * | 2021-02-23 | 2021-06-22 | 胡慧红 | Flat pasting equipment for wafer photoetching development |
Citations (5)
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|---|---|---|---|---|
| JP2006049490A (en) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Board conveying device, part mounting device and board conveying method |
| JP2009107097A (en) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | Machining apparatus |
| CN101712155A (en) * | 2008-09-29 | 2010-05-26 | 优志旺电机株式会社 | Substrate conveying arm |
| JP2012099755A (en) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | Transporting device |
| JP2012156415A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support device and support method of plate-like member |
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| JP3993296B2 (en) | 1998-03-27 | 2007-10-17 | 株式会社ディスコ | Adsorption fixing device |
| JP4796249B2 (en) * | 2001-09-14 | 2011-10-19 | 株式会社ディスコ | Plate-like object conveyance mechanism and dicing apparatus equipped with the conveyance mechanism |
| JP4841355B2 (en) * | 2006-08-08 | 2011-12-21 | 日東電工株式会社 | Method for holding semiconductor wafer |
| TWM312404U (en) * | 2006-11-07 | 2007-05-21 | Hiwin Tech Corp | Arm mechanism for transporting wafer |
| JP2008227134A (en) * | 2007-03-13 | 2008-09-25 | Matsushita Electric Ind Co Ltd | Component mounting apparatus and substrate conveying method |
| TWM410333U (en) * | 2011-01-18 | 2011-08-21 | Xintec Inc | Loading device |
| TWM421587U (en) * | 2011-07-28 | 2012-01-21 | Nutrim Technology Inc | Leveling apparatus for wafer |
| JP5943581B2 (en) * | 2011-11-01 | 2016-07-05 | 株式会社ディスコ | Transport device |
| JP5877719B2 (en) | 2012-01-13 | 2016-03-08 | 株式会社ディスコ | Transport method |
-
2014
- 2014-01-30 JP JP2014015444A patent/JP6255259B2/en active Active
- 2014-12-04 TW TW103142141A patent/TWI611499B/en active
-
2015
- 2015-01-06 KR KR1020150001033A patent/KR102154718B1/en active IP Right Grant
- 2015-01-26 CN CN201510038481.XA patent/CN104821288B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049490A (en) * | 2004-08-03 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Board conveying device, part mounting device and board conveying method |
| JP2009107097A (en) * | 2007-10-31 | 2009-05-21 | Disco Abrasive Syst Ltd | Machining apparatus |
| CN101712155A (en) * | 2008-09-29 | 2010-05-26 | 优志旺电机株式会社 | Substrate conveying arm |
| JP2012099755A (en) * | 2010-11-05 | 2012-05-24 | Disco Abrasive Syst Ltd | Transporting device |
| JP2012156415A (en) * | 2011-01-28 | 2012-08-16 | Lintec Corp | Support device and support method of plate-like member |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150090997A (en) | 2015-08-07 |
| KR102154718B1 (en) | 2020-09-10 |
| TWI611499B (en) | 2018-01-11 |
| TW201537664A (en) | 2015-10-01 |
| JP2015142087A (en) | 2015-08-03 |
| JP6255259B2 (en) | 2017-12-27 |
| CN104821288B (en) | 2019-04-19 |
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