TW201913831A - Adsorption mechanism, adsorption hand, transport mechanism, resin molding device, transfer method, and method of manufacturing resin molded article - Google Patents

Abstract

The present invention provides an absorption mechanism, an absorption hand, a transfer mechanism, a resin forming device, a transfer method, and a method for producing a resin molded product, which can stably adsorb and hold an object to be adsorbed. The absorption mechanism comprises: a support portion provided with an inner space, a piston rod having at least one portion inserted into the inner space and capable of moving along the axial direction, an elastic member disposed between the piston rod and the bottom of the inner space, and an absorption pad on one side of the piston rod opposite to the side of elastic member. A flow channel that fluidly connects the space surrounded by the main body portion, the adsorption portion, and the wall portion of the adsorption pad to the internal space is provided.. Before adsorption of the object to be adsorbed, the adsorption portion can be brought into contact with the object to be adsorbed by the restoring force of the elastic member.

Description

Adsorption mechanism, adsorption hand, conveying mechanism, resin molding device, conveying method, and method for manufacturing resin molded product

The present invention relates to an adsorption mechanism, an adsorption hand, a transport mechanism, a resin molding device, a transport method, and a method for manufacturing a resin molded product.

For example, Japanese Patent Laid-Open No. 2013-42017 (Patent Document 1) discloses a resin mold device having a robot arm at three positions on the front end and the root side, and the robot arm is formed with a work piece capable of being adsorbed. The suction holes on the outer periphery and the suction path communicating with them.

In recent years, since the surface of an adsorption target such as a plate-shaped member (including a wafer) tends to be enlarged, the amount of bending of the adsorption target also tends to increase. However, the robot described in Patent Document 1 may not be able to stably adsorb and hold the adsorption target depending on the amount of bending of the adsorption target.

According to the embodiments disclosed herein, an adsorption mechanism may be provided, which includes a support portion provided with an internal space, a piston rod inserted in at least a part of the internal space and movable in an axial direction, a piston rod and An elastic member between the bottom surfaces of the internal space, an adsorption pad on the piston rod side opposite to the elastic member side; and the adsorption pad includes a main body portion, an adsorption portion that is in contact with the adsorption object when the adsorption object is adsorbed, And a wall portion connecting the body portion and the suction portion; providing a flow path for fluidly connecting the space surrounded by the body portion, the suction portion, and the wall portion with the internal space; and before the adsorption of the object to be adsorbed, the elastic member is used for recovery The suction part can contact the object to be suctioned. In addition, according to the embodiments disclosed herein, an adsorption mechanism may be provided, which includes a support portion provided with an internal space, a piston rod inserted into at least a portion of the internal space and movable in an axial direction, a piston rod, and an internal space. An elastic member between the bottom surfaces of the piston, and an adsorption pad on the side opposite to the elastic member side of the piston rod; and the adsorption pad includes a main body portion, an adsorption portion that is in contact with the adsorption object when the adsorption object is adsorbed, and A wall portion connecting the main body portion and the suction portion; a flow path for fluidly connecting a space surrounded by the main body portion, the suction portion, and the wall portion with the internal space; and an area where the suction portion is projected on the bottom side of the internal space is larger than The bottom surface of the piston rod is projected onto the area on the bottom surface side of the internal space.

According to an embodiment disclosed herein, an adsorption hand may be provided, which includes the adsorption mechanism.

According to the embodiments disclosed herein, a transport mechanism may be provided, which includes a suction hand provided with the suction mechanism and a moving unit of the suction hand.

According to the embodiments disclosed herein, a resin molding apparatus may be provided, which includes the transport mechanism and the resin molding mechanism.

According to the embodiments disclosed herein, a transfer method may be provided, which includes a step of bringing the adsorption part of the adsorption hand into contact with an adsorption object, a step of adsorbing the adsorption object, and transporting the adsorbed object. step.

According to the embodiments disclosed herein, there can be provided a method for manufacturing a resin molded article, which includes a step of using the transfer method to transfer an adsorption target and a step of sealing the adsorption target with a resin.

These and other objects, features, viewpoints, and advantages of the present invention will be made clear by the following detailed description of the present invention understood in association with the accompanying drawings.

Hereinafter, embodiments will be described. In the drawings used in the description of the embodiments, the same reference symbols indicate the same or corresponding portions.

<Adsorption Hand> FIG. 1 is a schematic plan view of an adsorption hand 10 as an embodiment of an adsorption mechanism of the present invention. The adsorption hand 10 according to the embodiment includes a quadrilateral adsorption mechanism 1, and each of the quadrilateral adsorption mechanisms 1 includes three adsorption pads 2. The shape of the suction hand 10 is of course not limited to the shape of the suction mechanism 1 having a quadrangular shape. It is needless to say that the number of the adsorption pads 2 is not limited to three each.

A schematic cross-sectional view along II-II of FIG. 1 is shown in FIG. 2. As shown in FIG. 2, the suction mechanism 1 includes a suction pad 2, a piston rod 3, a support portion 4, and an elastic member 5.

The adsorption pad 2 includes a main body portion 2c having a generally cylindrical shape with an increasingly thinner upper portion, an adsorption portion 2b that is a portion that comes into contact with an adsorption target to be described later during adsorption, and a wall portion 2g that extends from the body portion 2c It extends diagonally upward, and connects the main-body part 2c and the adsorption | suction part 2b. The main body portion 2c includes an upper end 2d and a lower end 2e, and a first flow path 2a is provided between the upper end 2d and the lower end 2e. The first flow path 2a penetrates the main body portion 2c between the upper end 2d and the lower end 2e. The first flow path 2a is for fluid communication with the space 2f so as to allow communication between the space 2f surrounded by the body portion 2c, the adsorption portion 2b, and the wall portion 2g.

The piston rod 3 includes a cylindrical body portion 3c and a flange 3f extending outward from an upper portion of the body portion 3c. The main body portion 3c includes an upper end 3d and a lower end 3b, and an intermediate flow path 3a is provided between the upper end 3d and the lower end 3b. The intermediate flow path 3a is a through hole penetrating the main body portion 3c. An adsorption pad 2 is attached to the upper end 3d of the main body portion 3c. On the lower end 3b side of the main body portion 3c of the intermediate flow path 3a, a flow path enlarged portion 3e having a locally enlarged flow path width is provided. Fluid connection is established between the first flow path 2a and the intermediate flow path 3a, and between the intermediate flow path 3a and the flow path enlarged portion 3e so that gas can be communicated with each other.

An internal space 4 a fluidly connected to the flow path enlarged portion 3 e is provided inside the support portion 4. At least a part of the piston rod 3 is inserted in the internal space 4 a, and the piston rod 3 is movable in the direction (axis direction) of the shaft 9. A second flow path 4c fluidly connected to the internal space 4a is provided inside the support portion 4 so that the gas in the internal space 4a can be exhausted to the outside of the adsorption mechanism 1 by using a suction mechanism (not shown). Thereby, the gas existing in the space 2f surrounded by the body part 2c, the adsorption part 2b, and the wall part 2g of the adsorption pad 2 can pass through the first flow path 2a, the intermediate flow path 3a, the flow path expansion part 3e, The internal space 4a and the second flow path 4c are sucked by the suction mechanism and discharged to the outside of the suction mechanism 1.

The elastic member 5 is a member capable of expanding and contracting in the axial direction of the piston rod 3, and for example, a spring or the like can be used. By expanding and contracting the elastic member 5 in the axial direction, the piston rod 3 mounted on the elastic member 5 can also be moved in the axial direction, and the suction pad 2 on the piston rod 3 can also be moved in the axial direction. In this embodiment, it is configured as follows: one end 5b of the elastic member 5 is embedded in the flow path enlarged portion 3e, and the other end 5a of the elastic member 5 is embedded in the recessed portion 4d of the bottom surface 4b of the internal space 4a; The member between the rod 3 and the bottom surface 4b of the internal space 4a and capable of moving the suction pad 2 and the piston rod 3 in the axial direction is not particularly limited.

In addition, a sealing member 6 is provided between the outer peripheral surface of the main body portion 3c of the piston rod 3 and the internal space 4a of the support portion 4, and can suppress air from the outer peripheral surface of the main body portion 3c of the piston rod 3 and the internal space of the support portion 4. Leaked between 4a. The bush 7 is a cylindrical member for smoothly moving the piston rod 3 up and down.

The area X projecting the suction portion 2b on the bottom surface 4b side of the internal space 4a may be larger than the area Y projecting the bottom surface 3b of the piston rod 3 on the bottom surface 4b side of the internal space 4a. In this case, when the adsorption unit 2b sucks and transports the object to be adsorbed, for example, when the force of warpage acts on the object to be adsorbed and moves the piston rod 3 up and down, the relationship between area X and area Y may be Since it is comprised so that X> Y, it can suppress that the adsorption target object falls off from the adsorption pad 2 more effectively. The relationship between the area X and the area Y can also be expressed as: the outer edge of the suction portion 2b of the suction pad 2 is projected in the first direction with respect to a plane orthogonal to the first direction (moving direction of the piston rod 3). The relationship between the area X in the case and the area Y when the bottom surface 3b of the piston rod 3 is projected in the first direction is X> Y.

In addition, the adsorption target includes, for example, a lead frame, a substrate, an interposer, a semiconductor substrate (such as a silicon wafer), a metal substrate, a glass substrate, a ceramic substrate, and a resin substrate. And plate-like members such as wiring boards. The shape can be circular or quadrangular. In addition, wiring may or may not be included in the adsorption target.

The adsorption target includes, for example, a plate-shaped member used in a fan-out wafer-level package (FO-WLP) or a fan-out panel-level package (FO-PLP). Carrier.

In addition, the object to be adsorbed includes, for example, a glass substrate of a plate-shaped member used in a display panel such as a liquid crystal panel or an organic electroluminescence (EL) panel, and includes a film formed of a driving element, an electrode, and a color filter. Glass substrate.

<Resin Molding Apparatus> A schematic plan view of a resin molding apparatus according to an embodiment of an example of the resin molding apparatus of the present invention is shown in FIG. 3. In this embodiment, an example of a resin molding apparatus for manufacturing a resin molded product by performing resin molding of the plate-shaped member 20 using the plate-shaped member 20 on which an electronic component is mounted as an adsorption target will be described.

As shown in FIG. 3, the resin molding apparatus according to the embodiment includes a transport mechanism 540, a resin sealing mechanism 530, a resin spreading mechanism 520, and a release film cutting mechanism 510. The resin molding apparatus according to the embodiment is disposed on the transport mechanism 540.

The transfer mechanism 540 is not particularly limited as long as it includes the above-mentioned suction hand 10 and the moving unit 544 that can move the suction hand 10. The transfer mechanism 540 of the embodiment includes a substrate loader 541, in addition to the moving unit 544, The plate-like member storage portion 542 after molding and the plate-like member storage portion 543 before molding. The substrate loader 541 can hold the plate-like member 20 cut from the suction hand 10, and can move between the transfer mechanism 540, the resin sealing mechanism 530, the resin spreading mechanism 520, and the release film cutting mechanism 510.

The molded plate-shaped member storage portion 542 can store the resin-sealed plate-shaped member 20. The plate-shaped member storage portion 543 before molding can store the plate-shaped member 20 before resin sealing. The moving unit 544 can move the suction hand 10.

The resin sealing mechanism 530 includes an upper mold (not shown) and a lower mold 531 including a cavity 532. A release film 11 may be provided on the mold cavity 532. The resin sealing mechanism 530 can perform resin sealing of the plate-shaped member 20 on which an electronic component or the like is mounted.

The resin spreading mechanism 520 includes a resin loader 521, a post-processing mechanism 522, a film fixing table moving mechanism 523, a linear feeder 15, a resin supply mechanism 14, and a frame 12. The resin dispersing mechanism 520 can use a resin loader 521 to adsorb and fix the release film 11 on the lower end surface of the frame 12 including, for example, a quadrangular frame, and then disperse the granular resin from the resin supply mechanism 14 through the linear feeder 15 to the release film. 11 on. The frame 12 is not particularly limited to a quadrangular frame, and may be, for example, a circular frame.

The release film cutting mechanism 510 includes a roll-shaped release film 512, a film fixing table mounting mechanism 511, and a film gripper 513. In the release film cutting mechanism 510, the long release film 11 is drawn from the roll-shaped release film 512, and a part of it is set on a film fixing table (not shown) placed on the film fixing table mounting mechanism 511. ), It is cut into a quadrangular shape, thereby obtaining a quadrangular release film 11. The film holder 513 can fix the front end of the release film 11 drawn out from the roll-shaped release film 512, and can extract the release film 11 from the roll-shaped release film 512.

<Manufacturing method of a resin molded article> Hereinafter, the manufacturing method of the resin molded article which concerns on embodiment of an example of the manufacturing method of the resin molded article of this invention is demonstrated with reference to FIGS. 4-23. In the method for manufacturing a resin molded product according to the embodiment, an example in which a plate-shaped member 20 on which an electronic component or the like is mounted is used as an object to be adsorbed will be described.

First, as shown in FIG. 4, the suction hand 10 is inserted under the plate-shaped member 20 on which the electronic component 13 is accommodated, which is housed in the plate-shaped member storage portion 543 before forming, and the plate is suctioned on the suction pad 2 of the suction hand 10.状 件 20。 20 members. For example, the space for accommodating the plate-shaped member 20 on which the electronic component 13 is housed in the plate-shaped member storage section 543 before forming is narrow, and the suction hand 10 cannot be inserted between the plate-shaped member 20 and the plate-shaped member 20. In this case, the suction hand 10 may be inserted from below. The adsorption of the adsorption pad 2 by the plate-like member 20 can be performed, for example, by bringing the adsorption portion 2b of the adsorption pad 2 into contact with the plate-like member 20 and then adsorbing the plate-like member 20.

For example, when the plate-shaped member 20 is bent within a certain allowable range, the contact of the suction portion 2b of the suction pad 2 to the plate-shaped member 20 can be performed by: accommodating the plate-shaped member receiving portion 543 before being accommodated in the molding. In the lower side of the plate-shaped member 20 on which the electronic component 13 is mounted, the suction hand 10 is inserted, and the suction hand 10 is moved toward the plate-shaped member 20, whereby all the suction pads 2 come into contact with the plate-shaped member 20.

When the plate-shaped member 20 is bent beyond a certain allowable range, for example, the plate-shaped member 20 may be fixed, and the suction hand 10 may be pressed against the plate-shaped member 20 to contact all the suction pads 2. Here, for example, as shown in FIG. 5 and FIG. 6, when the plate-shaped member 20 is bent beyond a certain allowable range, the position of the plate-shaped member 20 that is farthest from the suction portion 2 b of the suction pad 2 and the suction portion 2 b are formed. When the suction hand 10 is pressed against the plate-shaped member 20, the plate-shaped member 20 moves the piston rod 3 downward in the axial direction (internal space 4a) at all parts closer to the suction portion 2b than it is. (In the direction of the bottom surface 4b side), and the plate-like member 20 is in contact with the adsorption portion 2b of the adsorption pad 2. At this time, the amount by which the plate-shaped member 20 presses the piston rod 3 downward in the axial direction is determined according to the magnitude of the force with which the plate-shaped member 20 presses the piston rod 3, and the amount of the elastic member 5 is determined according to the amount. Restoring force in the axial direction. Then, at a position where the force of the plate-like member 20 pressing the adsorption pad 2 and the restoring force of the elastic member 5 are balanced, the adsorption pad 2 stops. At the position where the suction pad 2 stops, the suction section 2b suctions the plate-like member 20.

For example, in the robot described in Patent Document 1, when the plate-like member 20 is bent as shown in FIG. 5, for example, there is a portion where the plate-like member 20 has a large bend, and the suction holes of the robot cannot be connected to the plate-like member 20. Situation of exposure. The adsorption holes that are not in contact with the plate-like member 20 cannot adsorb the plate-like member 20. Therefore, in the robot described in Patent Document 1, when the plate-like member 20 has a large bending, the plate-like member 20 may not be stably held by suction.

However, in the present embodiment, before the adsorption of the plate-like member 20 as an object to be adsorbed, all the adsorption portions 2b can be brought into contact with the plate-like member 20 using the restoring force of the elastic member 5. Therefore, it is described in Patent Document 1. Compared with the robot arm, it can stably adsorb and hold the object to be adsorbed. In addition, in this embodiment, since the suction portion 2b is brought into contact with the plate-like member 20 by the restoring force of the elastic member 5, it is not necessary to introduce a complicated control mechanism that controls the movement of each suction pad 2. In addition, the adsorption mechanism 1 of the present embodiment may be configured so that the adsorption portion 2 b is brought into contact with the object to be adsorbed by using the restoring force of the elastic member 5, and it does not mean that the restoring force of the elastic member 5 must be used. The adsorption part 2b is in contact with an object to be adsorbed.

Then, as shown in, for example, the schematic cross-sectional view of FIG. 7, the plate-shaped member 20 is adsorbed on the adsorption portion 2 b of the adsorption mechanism 1. The adsorption of the adsorption portion 2b by the plate-shaped member 20 is performed by, for example, as shown in a schematic cross-sectional view of FIG. 8, suctioned by a suction mechanism (not shown), and suctioned in the direction of the arrow in FIG. 8. The gas in the internal space 4a of the support portion 4 is sucked. At this time, the suction portion 2b and the plate-like member 20 are adhered by the suction mechanism, and the gas existing in the space 2f passes through the first flow path 2a, the intermediate flow path 3a, the flow path enlarged portion 3e, the internal space 4a, And the second flow path 4c and is discharged to the outside of the adsorption mechanism 1. Thereby, the space 2f can be made into a vacuum state.

Then, the suction of the suction mechanism is continued to further press the plate-like member 20 on the suction portion 2b side. Therefore, the suction pad 2 and the piston rod 3 are pressed in the axial direction on the bottom surface 4b side of the internal space 4a. Next, the elastic member 5 is contracted in the axial direction. Thereby, the plate-shaped member 20 is sucked and held on the suction mechanism 1.

At this time, for example, after the suction pad 2 and the piston rod 3 are pushed down to the maximum extent on the bottom surface 4b side of the internal space 4a, as the suction member 2b draws the plate-like member 20 closer, the bending of the plate-like member 20 is corrected, The plate-like member 20 may be made flat. In addition, for example, when the bending of the plate-like member 20 is corrected, a force in the bending direction (a force close to the original bending shape) acts on the plate-like member 20 and a part or all of the piston rod 3 moves upward, Also as shown in FIG. 2, if the area Y of the suction portion 2 b projected on the bottom surface 4 b side of the internal space 4 a is larger than that, the suction pad 2 can be prevented from falling off the plate-like member 20. The reason is that, since the suction force of the suction pad 2 is greater than the downward force of the piston rod 3, it is preferred that the piston rod 3 moves upward.

Next, as shown in the schematic side view of FIG. 9, the plate-shaped member 20 adsorbed on the suction hand 10 is reversed, and the mounting side of the electronic component 13 of the plate-shaped member 20 is taken as the lower side. Then, the suction hand 10 is moved by the moving unit 544. As shown in the schematic side view of FIG. 10, the mounting side of the electronic component 13 of the plate-shaped member 20 suctioned on the suction hand 10 is taken as the lower side, and the plate-shaped member is set. 20 is provided on the substrate loader 541, and the adsorption of the plate-shaped member 20 is released, and the plate-shaped member 20 is separated from the suction hand 10.

At this time, for example, as shown in FIG. 11, as the elastic member 5 contracts, the suction pad 2 and the piston rod 3 that are pushed down in the axial direction (the direction of the bottom surface 4b side of the internal space 4a) follow the elastic member. When the contracted state of 5 is released, for example, as shown by the arrow in FIG. 12, the plate-like member 20 is separated by being pressed upward in the axial direction (the direction of the inner space 4 a opposite to the direction of the bottom surface 4 b side).

Next, as shown in the schematic side view of FIG. 13, the substrate loader 541 provided with the plate-like member 20 is moved between the upper mold 551 and the lower mold 531 of the resin sealing mechanism 530. The plate-shaped member 20 is set on the upper mold 551 with the mounting side of the electronic component 13 as the lower side. The lower mold 531 includes a side member 531a, a bottom member 531b, an elastic member 533, and a lower mold base plate 534 which constitute a cavity 532.

Next, as shown in the schematic side view of FIG. 14, between the upper mold 551 and the lower mold 531 provided with the plate-like member 20, the release film 11 containing the particulate resin 81 a in the frame 12 is transported. The transfer of the release film 11 is performed by the resin loader 521. Although the granular resin 81a is used in this embodiment, a powdery resin or a liquid (fluid) resin may be used instead of the granular resin 81a.

Then, as shown in the schematic side view of FIG. 15, the release film 11 provided with the particulate resin 81 a is provided on the cavity 532 of the lower mold 531. Then, as shown in a schematic side view of FIG. 16, the air in the mold cavity 532 is exhausted from between the side members 531 a and the bottom surface member 531 b, so that the release film 11 is adhered to the inner surface of the mold cavity 532. Thereby, the granular resin 81a is supplied into the cavity 532. The method of supplying the resin material to the cavity 532 includes, for example, the following methods. As shown in FIGS. 17 (a) and 17 (b), for the cavity 532 of the lower mold 531 in which the release film 11 is disposed, The resin holding tray 537 composed of the upper tray 535 and the lower tray 536 having a plurality of parallel slits is inserted into the slit 535a of the upper tray in a state where the crossbar 536b of the lower tray is inserted into the slit 535a of the upper tray. The resin material is supplied, and the resin holding tray 537 is arranged on the cavity 532, and the upper tray 535 and the lower tray 536 are slid relative to each other, so that the resin material in the slit 535a of the upper tray passes through the slit 536a of the lower tray. Drop into the mold cavity 532.

Next, as shown in the schematic side view of FIG. 18, the particulate resin 81a in the cavity 532 is heated by using the lower mold 531 heated by a heating section (not shown) to melt into the molten resin 81b, so that The lower mold 531 rises. At this time (before the lower mold 531 is raised, and the upper mold 551 and the lower mold 531 are in contact with each other through the plate-like member 20 and the release film 11), an external air blocking member (not shown) may be used to block external air from entering the forming mold. The air in the forming mold is exhausted using a vacuum pump or the like. Next, as shown in a schematic side view of FIG. 19, the upper mold 551 and the lower mold 531 are in contact with each other through the plate-shaped member 20 and the release film 11, and the lower mold 531 is further raised, thereby allowing electrons on the plate-shaped member 20 to be raised. The element 13 is immersed in the molten resin 81b, and the molten resin 81b is hardened by elapse of a predetermined time, and the resin sealing of the electronic element 13 is performed.

Then, as shown in the schematic side view of FIG. 20, by moving the lower mold 531 downward, the release film 11 is peeled from the cured sealing resin (resin molded body) 81. Next, as shown in the schematic side view of FIG. 21, the substrate loader 541 removes the plate-shaped member 20 sealed with the resin of the sealing resin (resin molding) 81 from the upper mold 551, and mounts the electronic component 13. The side is placed on the substrate loader 541 as a lower side. Then, the substrate loader 541 provided with the resin-sealed plate-like member 20 is moved from the resin sealing mechanism 530 to the transfer mechanism 540.

Then, as shown in the schematic side view of FIG. 22, the resin-sealed plate-like member 20 is adsorbed on the adsorption pad 2 of the adsorption hand 10 with the mounting side of the electronic component 13 as the lower side. In addition, the adsorption of the plate-shaped member 20 using the adsorption pad 2 of the adsorption hand 10 can be performed in the same manner as described above. Then, as shown in the schematic side view of FIG. 23, the plate-shaped member 20 adsorbed on the adsorption pad 2 is reversed, the mounting side of the electronic component 13 of the plate-shaped member 20 is set as the upper side, and the adsorption is performed by the moving unit 544. The hand 10 moves.

Next, as shown in the schematic side view of FIG. 24, the suction mechanism 1 holds the plate-shaped member 20 in a cassette in the plate-shaped member storage portion 542 after molding with the mounting side of the electronic component 13 as the upper side. After that, the adsorption is released. As described above, the method for manufacturing a resin molded product according to the embodiment and the subsequent storage of the plate-like member 20 are completed.

<Modification of Suction Hand> The suction hand 10 according to the embodiment may change the arrangement of the suction pad 2 according to the shape of the suction target. For example, as shown in the schematic plan view of FIG. 25, when the plate-shaped member 20 that is an object to be adsorbed is bent from the center to the outside and opposite to the side of the adsorption hand 10, the center of the adsorption hand 10 can be made larger than the center of the adsorption hand 10. In other words, the arrangement of the adsorption pads 2 is changed so that the number of the outer adsorption pads 2 is increased. In addition, as shown in the schematic plan view of FIG. 26, when the plate-shaped member 20 as the object to be adsorbed is bent from the center to the outside and the side of the suction hand 10 is bent, the center suction can be performed more than the outside of the suction hand 10. The arrangement of the suction pads 2 is changed so that the number of the pads 2 is increased.

<Modification of Resin Molding Apparatus> FIG. 27 is a schematic plan view showing a modification of the resin molding apparatus according to the embodiment. There are three resin sealing mechanisms 530 according to the embodiment shown in FIG. 27, and the number of resin sealing mechanisms 530 may be increased or decreased. Other than that, it has the same configuration as the resin sealing device of the embodiment. In addition, for example, the suction mechanism 1 may be provided on the substrate loader 541. In addition, by arranging the suction mechanism 1 on the conveying mechanism 540 that takes out the formed plate-like member 20 from the forming mold, it is possible not only to suppress warpage of the plate-like member 20 after forming, but also to place the plate-like member. 20 cooling and heating. In addition, by providing the suction mechanism 1 as a table-shaped unit such as an XY table or a fixed table, not only the warpage of the plate-like member 20 can be suppressed, but also inspection and processing can be performed.

As mentioned above, although embodiment and the modification were demonstrated, the structure of each said embodiment and each modification is also planned to combine suitably at first.

The embodiments of the present invention have been described, but the embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is shown by the scope of the scope of patent application, and includes the meaning and scope of all changes within the scope of the scope of patent application.

1‧‧‧ Adsorption mechanism

2‧‧‧ Adsorption Pad

2a‧‧‧The first flow path

2b‧‧‧Adsorption

2c‧‧‧Body

2d‧‧‧upper

2e‧‧‧bottom

2f‧‧‧ space

2g‧‧‧Wall

3‧‧‧Piston rod

3a‧‧‧Middle Stream

3b‧‧‧ lower end (bottom)

3c‧‧‧Body

3d‧‧‧upper

3e‧‧‧Enlarged flow path

3f‧‧‧ flange

4‧‧‧ support

4a‧‧‧Internal space

4b‧‧‧ underside

4c‧‧‧The second flow path

4d‧‧‧ recess

5‧‧‧ Elastic member

5a‧‧‧ the other end

5b‧‧‧One end

6‧‧‧sealing member

7‧‧‧ bush

9‧‧‧ axis

10‧‧‧ Adsorption Hand

11‧‧‧ release film

12‧‧‧ frame

13‧‧‧Electronic components

14‧‧‧Resin supply mechanism

15‧‧‧Linear feeder

20‧‧‧ plate member

81‧‧‧ Sealing resin (resin molding)

81a‧‧‧ granular resin

81b‧‧‧ molten resin

510‧‧‧Release film cutting mechanism

511‧‧‧Film fixing table mounting mechanism

512‧‧‧ roll-shaped release film

513‧‧‧ membrane holder

520‧‧‧Resin distribution mechanism

521‧‧‧resin loader

522‧‧‧ post-processing agency

523‧‧‧Film moving mechanism

530‧‧‧resin sealing mechanism

531‧‧‧mould

531a‧‧‧side member

531b‧‧‧underside member

532‧‧‧cavity

533‧‧‧Elastic member

534‧‧‧ bottom plate

535‧‧‧on the tray

535a‧‧‧Slit on the tray

536‧‧‧lower tray

536a‧‧‧Slit of the lower tray

536b‧‧‧Lower tray rung

537‧‧‧Resin holding tray

540‧‧‧Transportation agency

541‧‧‧ substrate loader

542‧‧‧ Plate-shaped member storage section after forming

543‧‧‧ Plate member storage section before forming

544‧‧‧mobile unit

551‧‧‧Mould

X, Y‧‧‧ Area

FIG. 1 is a schematic plan view of a suction hand according to the embodiment. FIG. 2 is a schematic cross-sectional view taken along II-II of FIG. 1. FIG. 3 is a schematic plan view of a resin molding apparatus according to the embodiment. FIG. 4 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 5 is a schematic cross-sectional view illustrating an example of a step of bringing a suction part of a suction hand into contact with a suction target. FIG. 6 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 5. FIG. 7 is a schematic cross-sectional view illustrating an example of a step of adsorbing an object to be adsorbed on an adsorption section. FIG. 8 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 7. FIG. 9 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 10 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 11 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 10. FIG. 12 is a schematic cross-sectional view of the adsorption mechanism at the stage of the step shown in FIG. 10. FIG. 13 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 14 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 15 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 16 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 17 (a) is a perspective view of a resin holding tray of a resin molded product according to an embodiment, and FIG. 17 (b) is a cross-sectional view of the resin holding tray of FIG. 17 (a). FIG. 18 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 19 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 20 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. 21 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. 22 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 23 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. FIG. 24 is a schematic side view illustrating a part of the manufacturing steps of the method for manufacturing a resin molded product according to the embodiment. 25 is a schematic plan view of a modified example of the suction hand according to the embodiment. FIG. 26 is a schematic plan view of a modified example of the suction hand according to the embodiment. 27 is a schematic plan view of a modified example of the resin molding apparatus according to the embodiment.

Claims (11)

An adsorption mechanism includes: a support portion provided with an internal space; a piston rod inserted in the internal space and capable of moving in an axial direction; and an elastic member between the piston rod and a bottom surface of the internal space. And an adsorption pad of the piston rod on the side opposite to the elastic member side; and the adsorption pad includes a main body portion, an adsorption portion that is in contact with the adsorption object when the adsorption object is adsorbed, And a wall portion connecting the body portion and the suction portion; providing a flow path for fluidly connecting a space surrounded by the body portion, the suction portion, and the wall portion with the internal space; and Prior to the adsorption of the adsorption target, the adsorption portion can be brought into contact with the adsorption target by using a restoring force of the elastic member. An adsorption mechanism includes: a support portion provided with an internal space; a piston rod inserted in the internal space and capable of moving in an axial direction; and an elastic member between the piston rod and a bottom surface of the internal space. And an adsorption pad of the piston rod on the side opposite to the elastic member side; and the adsorption pad includes a main body portion, an adsorption portion that is in contact with the adsorption object when the adsorption object is adsorbed, And a wall portion connecting the body portion and the suction portion; providing a flow path for fluidly connecting a space surrounded by the body portion, the suction portion, and the wall portion with the internal space; and The area of the suction portion projected on the bottom surface side of the internal space is larger than the area of the bottom surface of the piston rod projected on the bottom surface side of the internal space. The suction mechanism according to item 1 or 2 of the patent application scope, wherein the piston rod moves on the bottom surface side of the internal space when the suction object is sucked. The adsorption mechanism according to item 1 or 2 of the scope of patent application, further comprising: a second flow path for fluidly connecting the internal space with the suction mechanism. An adsorption hand includes: the adsorption mechanism according to any one of items 1 to 4 of the scope of patent application. According to the adsorption hand described in claim 5, the arrangement of the adsorption mechanism can be changed according to the shape of the adsorption object. A conveying mechanism includes: the suction hand according to item 5 or 6 of the scope of patent application, and a moving unit of the suction hand. A resin molding apparatus includes the conveying mechanism according to item 7 of the scope of patent application, and a resin molding mechanism. A transport method, comprising: a step of bringing the adsorption part of the adsorption hand according to item 5 or 6 of the patent application scope into contact with the adsorption object; a step of adsorbing the adsorption object; and a transport station The procedure for adsorbing an object is described. The conveyance method according to item 9 of the scope of the patent application, wherein the step of adsorbing the adsorption target on the adsorption section further includes a step of correcting a curvature of the adsorption target. A manufacturing method of a resin molded article includes a step of transporting the adsorption target by the transport method according to item 9 or 10 of the patent application scope, and a step of resin sealing the adsorption target.