JP2018120938A - Semiconductor manufacturing apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of reducing stress applied to a die.SOLUTION: A semiconductor manufacturing apparatus comprises a push-up unit, a collet, and a control device for controlling operations of the push-up unit and the collet. The push-up unit includes: a block part which pushes up the die; and a suction part which is provided on a circumference of the block part and has vacuum holes. The block part includes: a first block having a square shape in plan view; a second block having a square shape in plan view and a plane area larger than that of the first block; and a slender gap provided between the first block and the second block. A length direction of the gap in plan view extends in a first direction and a width direction of the gap in plan view extends in a second direction. The control device has means of shifting the push-up unit in a horizontal direction in the second direction in a state where the first block is pushed up higher than a top face of the suction part during the die is absorbed to the collet.SELECTED DRAWING: Figure 5

Description

  The present disclosure relates to a semiconductor manufacturing apparatus, and can be applied to, for example, a die bonder including a push-up unit.

  Generally, in a die bonder in which a semiconductor chip called a die is mounted on the surface of, for example, a wiring board or a lead frame (hereinafter collectively referred to as a board), the die is generally used by using a suction nozzle such as a collet. The operation (work) of transporting the substrate onto the substrate, applying a pressing force, and performing bonding by heating the bonding material is repeatedly performed.

  In the die bonding process by a semiconductor manufacturing apparatus such as a die bonder, there is a peeling process for peeling a divided die from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling step, the die is pushed up from the back surface of the dicing tape by a push-up pin or block, peeled off one by one from the dicing tape held in the die supply unit, and conveyed onto the substrate using a suction nozzle such as a collet.

  In recent years, packages have been made thinner for the purpose of promoting high-density mounting of semiconductor devices. For example, a stacked package in which a plurality of dies are three-dimensionally mounted on a wiring board has been put into practical use. When assembling such a stacked package, it is required to reduce the die thickness to 20 μm or less in order to prevent an increase in the package thickness.

JP 2012-4393 A

When the die is pushed up with a pin or block, the die is stressed.
An object of the present disclosure is to provide a semiconductor manufacturing apparatus capable of reducing stress applied to a die.
Other problems and novel features will become apparent from the description of the specification and the accompanying drawings.

An outline of typical ones of the present disclosure will be briefly described as follows.
That is, the semiconductor manufacturing apparatus includes a push-up unit that pushes up a die from below a dicing tape, a collet that sucks the die, and a control device that controls operations of the push-up unit and the collet. The push-up unit includes a block portion that pushes up the die through the dicing tape, and a suction portion that is provided on the outer periphery of the block portion and has a suction hole. The block portion includes a square-shaped first block in plan view, a second block that is square-shaped in plan view and has a larger flat area than the first block, and between the first block and the second block. A long gap in a plan view extending in the first direction and a width direction extending in the second direction. The control device moves the push-up unit in the horizontal direction of the second direction with the first block pushed up higher than the upper surface of the suction portion while the collet is sucking the die. Means.

  According to the semiconductor manufacturing apparatus, it is possible to reduce the stress applied to the die.

Conceptual diagram of the die bonder according to the embodiment as seen from above FIG. 1 is a view for explaining operations of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. The figure which shows the external appearance perspective view of the die | dye supply part of FIG. Schematic cross-sectional view showing the main part of the die supply unit of FIG. Plan view of the push-up unit according to the embodiment 5 is a vertical sectional view of the push-up unit in FIG. Plan view for explaining the relationship between the shape of the first block and the second block and the die shape Flowchart for explaining the pick-up operation of the die bonder according to the embodiment FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. FIG. 8 is a longitudinal sectional view of a push-up unit and the like for explaining the pickup operation of FIG. Diagram for explaining the relationship between the push-up height and the slide height Flowchart for explaining a method of manufacturing a semiconductor device according to the example

  Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be denoted by the same reference numerals and repeated description may be omitted. In order to clarify the description, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to the actual embodiment, but are merely examples, and the interpretation of the present invention is not limited to them. It is not limited.

  When the die is thin, the rigidity of the die is extremely low compared to the adhesive strength of the dicing tape. Therefore, for example, in order to pick up a thin die of 10 to 20 μm, it is necessary to reduce the stress applied to the die (lower stress). Lowering stress is reducing the stress concentration on the die. In order to reduce the stress concentration, it is necessary to reduce the angle (peeling angle) at which the dicing tape peels from the die, but the peeling angle becomes larger than ideal due to the vacuum suction of the push-up unit. To reduce the peel angle, the number of push-up steps can be increased and the push-up height can be set arbitrarily to optimize the peel angle. The peel angle depends on the die conditions (die thickness, die attach film (DAF) type , Dicing process, etc.), it is difficult to optimize.

In the semiconductor manufacturing apparatus according to the embodiment, the die back surface is peeled around the die back surface by a plurality of blocks of the push-up unit, which is a die pick-up jig, and then the entire back-up unit is moved in a horizontal direction step by step. The whole is peeled off and the die is picked up. It is preferable that the push-up unit operates in a stepwise manner in the horizontal direction below the height of the block in which the periphery of the die is peeled by a plurality of blocks. For example,
(1) The collet is landed and the collet adsorbs the die. (2) The first block is raised, and the dicing tape is adsorbed by the push-up unit. (3) The second block is raised to the same level or slightly higher than the first block. (4) Height of moving the first block and the second block in the horizontal direction (for example, the first block is made lower than the height of (3) above, and the second block (5) Stop the suction of the dicing tape by the push-up unit, move the push-up unit in the horizontal direction (first direction), and suck the dicing tape by the push-up unit (6) Stop adsorbing the dicing tape by the push-up unit, move the push-up unit in the horizontal direction (second direction opposite to the first direction) Adsorb the dicing tape with the unit. (7) Repeat the above (5) and (6), and peel the back of the die from the dicing tape. By changing the distance of movement in the horizontal direction, it is possible to deal with a die that is difficult to peel off.

  According to the embodiment, it is possible to peel the entire die back surface while suppressing stress on the die. The stability of the pickup can be improved by peeling the entire back surface of the die.

  FIG. 1 is a top view schematically illustrating a die bonder according to an embodiment. FIG. 2 is a diagram for explaining the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

  The die bonder 10 roughly divides the die supply unit 1, the pickup unit 2, the intermediate stage unit 3, the bonding unit 4, the transfer unit 5, the substrate supply unit 6, the substrate carry-out unit 7, and monitors the operation of each unit. And a control device 8 for controlling. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is disposed on the front side of the die bonder 10 and the bonding unit 4 is disposed on the back side.

  First, the die supply unit 1 supplies a die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a dotted line that pushes up the die D from the wafer 11. The die supply unit 1 is moved in the XY directions by a driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

  The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and drive units (not shown) that move the collet 22 up and down, rotate, and move in the X direction. Have. The pickup head 21 has a collet 22 (see also FIG. 2) that holds the pushed-up die D at the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has driving units (not shown) that move the collet 22 up and down, rotate, and move in the X direction.

  The intermediate stage unit 3 includes an intermediate stage 31 on which the die D is temporarily placed and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds the die D on the transported substrate P or laminates the die D on the die already bonded on the substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) for attracting and holding the die D at the tip like the pickup head 21, a Y driving unit 43 for moving the bonding head 41 in the Y direction, and a substrate. It has a substrate recognition camera 44 that picks up an image of a P position recognition mark (not shown) and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. Bond die D to P.

The transport unit 5 includes a substrate transport pallet 51 on which one or a plurality of substrates P (four in FIG. 1) are placed, and a pallet rail 52 on which the substrate transport pallet 51 moves, and is provided in parallel. And the first and second transfer units having the same structure. The substrate transfer pallet 51 is moved by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.
With such a configuration, the substrate transport pallet 51 places the substrate P on the substrate supply unit 6, moves to the bonding position along the pallet rail 52, moves to the substrate unloading unit 7 after bonding, and unloads the substrate. Pass the substrate P to the unit 7. The first and second transfer units are driven independently of each other, and while the die D is being bonded to the substrate P placed on one substrate transfer pallet 51, the other substrate transfer pallet 51 carries out the substrate P. Returning to the substrate supply unit 6, preparations such as mounting a new substrate P are made.

  The control device 8 includes a memory that stores a program (software) that monitors and controls the operation of each unit of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

  Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing the main part of the die supply unit.

  The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holder 12 includes an expand ring 15 that holds the wafer ring 14 and a support ring 17 that horizontally positions the dicing tape 16 that is held by the wafer ring 14 and to which a plurality of dies D are bonded. The push-up unit 13 is disposed inside the support ring 17.

  The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the die D is pushed up from below the die D by the push-up unit 13 to improve the pick-up property of the die D. Note that the adhesive that bonds the die to the substrate in accordance with the reduction in thickness is changed from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. Yes. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. Hereinafter, the peeling process will be described ignoring the presence of the die attach film 18.

  Next, the push-up unit 13 will be described with reference to FIGS. FIG. 5 is a top view of the push-up unit according to the embodiment. FIG. 6 is a cross-sectional view of the main part at A1-A2 in FIG.

  The push-up unit 13 has a cylindrical shape, and includes an opening 131 located at the center of the upper surface, a suction part 132 around the opening 131, and a block part 133 in the opening 131. The shape of the opening 131 in a plan view is a quadrangle, and is configured similar to the planar shape of the die D.

  The block unit 133 includes a first block 1331 and a second block 1332 having a square shape in plan view. For example, the first block 1331 is located on the front side (Y-axis negative side) of the die bonder 10, and the second block 1332 is located on the back side (Y-axis positive side). The upper surfaces of the first block 1331 and the second block 1332 have irregularities, respectively. A gap 1333 is provided between the opening 131, the first block 1331, and the second block 1332. The first block 1331 and the second block 1332 have a planar shape along the four sides of the opening 131. The combined flat area of the first block 1331 and the second block 1332 is smaller than the flat area of the die D. The vertical length (X-axis direction) of the first block 1331 and the vertical length (X-axis direction) of the second block 1332 are the same, but the horizontal length (Y-axis direction) of the first block 1331 is the first length. It is shorter than the horizontal (Y-axis direction) length of the two blocks 1332. Therefore, the plane area of the first block 1331 is smaller than the plane area of the second block 1332. The horizontal (Y-axis direction) length of the first block 1331 is, for example, about 1/2 to 1/5 of the horizontal (Y-axis direction) length of the second block 1332.

  A gap 1333 between the first block 1331 and the second block 1332 has a rectangular shape elongated in the X-axis direction in plan view. In other words, the horizontal side of the surface where the first block 1331 and the second block 1332 face each other with the gap 1333 therebetween extends in the X-axis direction.

  The first block 1331 and the second block 1332 can move up and down independently. The push-up unit 13 can move horizontally in the Y-axis direction at least by the length of the second block 1332 in the Y-axis direction with the block 133 raised during the pickup operation.

  A plurality of suction ports 1321 and a plurality of grooves 1322 connecting the plurality of suction ports 1321 are provided in the suction portion 132 provided in the peripheral portion of the upper surface of the push-up unit 13. The suction port 1321 and the inside of the groove 1322 are depressurized by a suction mechanism (not shown) when the push-up unit 13 is raised and its upper surface is brought into contact with the back surface of the dicing tape 16. At this time, the back surface of the dicing tape 16 is sucked downward and comes into close contact with the upper surface of the push-up unit 13. The adsorbing part 132 closely contacts the dicing tape 16 outside the die D to be picked up. The suction mechanism of the peripheral gap (opening) 1333 between the first block 1331 and the second block 1332 and the suction mechanism of the suction unit 132 are common, and suction ON / OFF is performed at the same time.

  The relationship between the shape of the first block and the second block and the die shape will be described with reference to FIG. FIG. 7 is a plan view of the die, the first block, and the second block. FIG. 7A shows a case where the block portion is vertically long, and FIG. 7B shows a case where the block portion is horizontally long.

  When the die D is rectangular, depending on the characteristics of the die, as shown in FIG. 7 (A), the block 133 is vertically long in plan view (the length in the X-axis direction is longer than the length in the Y-axis direction) As shown in FIG. 7B, the block 133 is horizontally long (the length in the Y-axis direction is longer than the length in the X-axis direction). In any case, the first block 1331 is preferably vertically long (the length in the X-axis direction is longer than the length in the Y-axis direction) in plan view.

  Next, the pickup operation by the push-up unit 13 having the above-described configuration will be described with reference to FIGS. FIG. 8 is a flowchart showing a processing flow of the pickup operation. 9-17 is principal sectional drawing which shows the relationship between the pushing-up unit and collet in each step. FIG. 18 is a diagram for explaining the relationship between the push-up height and the slide height.

  Step S1: The controller 8 moves (pitch movement) the wafer holder 12 so that the die D to be picked up is positioned directly above the push-up unit 13, and the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. The push-up unit 13 is moved as follows.

  Step S2: At this time, as shown in FIG. 9, the control device 8 makes the upper surfaces of the first block (1BLK) 1331 and the second block (2BLK) 1332 of the block unit 133 slightly lower than the surface of the suction unit 132. Thus, the dicing tape 16 is sucked by the suction port 1321 and the groove 1322 of the suction portion 132 and the gap 1333 between the blocks.

  Step S3: As shown in FIG. 10, the control device 8 lowers the pickup head 21 (collet 20), positions it on the die D to be picked up, lands on the collet 22, and sucks the collet (not shown). To adsorb die D. At this time, in order to sufficiently adsorb the die D, the collet 22 is further pushed in a predetermined amount (pushing amount) after contacting the die D.

  Step S4: As shown in FIG. 11, the control device 8 raises the first block 1331 to the set first push-up height (H1). At this time, the dicing tape 16 is sucked by the suction portion 132 or the like (suction ON). At this time, the collet 22 rises by the first thrust height (H1). The first push-up height (H1) is, for example, 300 μm from the upper surface of the suction part 132.

  Step S5: As shown in FIG. 12, the control device 8 raises the second block 1332 to the set second push-up height (H2). Thereby, the dicing tape 16 around the die D is peeled off. The second push-up height (H2) may be the same as the first push-up height (H1) or may be higher than the first push-up height (H1).

  Step S6: The control device 8 raises the collet 22 by the pushing amount, and then, as shown in FIG. 13, the control device 8 has a height (slide height (HS)) at which the push-up unit 13 moves in the horizontal direction. The first block 1331 is lowered and the second block 1332 is lowered so as to be lower than the first block 1331. At the timing when the second block 1332 descends to the first thrust height (H1), the collet 22 is lowered by a distance of (first thrust height (H1) −slide height (HS)). Here, the first push-up height (H1), the second push-up height (H2), and the slide height (HS) are heights based on the upper surface of the suction portion 132.

  Step S7: The controller 8 stops the adsorption of the dicing tape 16 by the adsorption unit 132 or the like (adsorption OFF), and allows the push-up unit 13 to move in the horizontal direction. Thereafter, as shown in FIG. 14, the control device 8 moves the push-up unit 13 in the horizontal direction (for example, the Y-axis direction), and then sucks the dicing tape 16 by the suction portion 132 or the like (suction ON). Then, the die D is peeled off. The moving direction is a direction from the small first block 1331 toward the large second block 1332 (the positive direction of the Y axis). This horizontal operation is repeated step by step according to the setting. The horizontal movement distance and the block height can be arbitrarily set.

  Step S8: As shown in FIG. 15, the controller 8 stops the suction of the dicing tape 16 by the suction portion 132 or the like (suction OFF), and returns the push-up unit 13 to the original position ((Y-axis negative). Then, the dicing tape 16 is sucked by the suction part 132 or the like (suction ON).

  Step S9: As shown in FIG. 16, the control device 8 raises the collet 22.

  Step SA: As shown in FIG. 17, the control device 8 causes the first block 1331 and the second block 1332 of the block portion 133 to form the same plane as the surface of the suction portion 132, and the dicing tape by the suction portion 132 or the like. 16 adsorption is stopped (adsorption OFF). The control device 8 moves the push-up unit 13 so that the upper surface of the push-up unit 13 is separated from the back surface of the dicing tape 16.

  Step SB: The controller 8 determines whether or not the pickup from the wafer 11 is completed. If yes, the process ends. If no, the process returns to step S1.

  The control device 8 repeats steps S1 to SB to pick up a good die of the wafer 11.

  Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. FIG. 19 is a flowchart showing a method for manufacturing a semiconductor device.

  Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control device 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. Also, the substrate P is prepared and carried into the die bonder 10. The control device 8 places the substrate P on the substrate transport pallet 51 by the substrate supply unit 6.

  Step S12: The control device 8 picks up the die peeled off in steps S1 to S8 from the wafer.

  Step S13: The control device 8 stacks the picked-up die on the substrate P mounted or already bonded. The control device 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds the die D to the transported substrate P.

  Step S <b> 14: The control device 8 takes out the substrate P to which the die D is bonded from the substrate transport pallet 51 at the substrate carry-out unit 7. The substrate P is unloaded from the die bonder 10.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments. However, the present invention is not limited to the above-described embodiments, and needless to say, various modifications can be made.

  For example, in the embodiment, the example in which the block unit is configured by two blocks of the first block and the second block has been described. However, the block unit may be configured by three or more blocks. When moving the push-up unit 13, the block in contact with the dicing tape 16 may be a block near the center or a block near the periphery.

  Although the case where the die is thin (10 to 20 μm) has been described, the present invention can be applied to a case where the die is thicker than 20 μm and a case where the die is thinner than 10 μm.

  Further, in the embodiment, the push-up unit moves in the horizontal direction, but the pick-up unit is fixed and the wafer fixed to the wafer ring holder and the bonding head are moved in the same direction synchronously to perform the same pickup operation. You may do.

  Further, when the push-up unit is moved, it may be moved while repetitively moving forward and backward.

  In addition, the corner of the first unit in contact with the wafer of the first block is rounded or chamfered to reduce catching with the dicing tape, the first block is tilted obliquely when moving, It may be tilted and moved.

  In the embodiment, the suction vacuum is turned off when the push-up unit is moved, but the first block and the second block are each provided with a function of adjusting the degree of vacuum, and each block is sucked weakly at the set degree of vacuum. It may be moved while.

  Further, the moving speed of the push-up unit may be freely set by the apparatus for each position and interval between movements.

  Moreover, although the example which uses a die attach film was demonstrated in the Example, the preform part which apply | coats an adhesive agent to a board | substrate is provided and it is not necessary to use a die attach film.

In the embodiment, the die bonder for picking up the die from the die supply unit with the pickup head and placing it on the intermediate stage and bonding the die placed on the intermediate stage to the substrate with the bonding head has been described. However, the present invention can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.
For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pickup head and bonds a die of a die supply unit to a substrate with a bonding head.
Further, the present invention can be applied to a flip chip bonder that has no intermediate stage, picks up a die from a die supply unit, rotates the die pickup head upward, transfers the die to the bonding head, and bonds the die to the substrate with the bonding head.
Further, the present invention can be applied to a die sorter in which a die picked up by a pickup head from a die supply unit is placed on a tray or the like without an intermediate stage and a bonding head.

1: Die supply part 11: Wafer 13: Push-up unit 131: Opening part 132: Suction part 1321: Suction hole 1322: Groove 133: Block part 1331: First block 1332: Second block 1333: Gap 16: Dicing tape 2 : Pickup unit 21: Pickup head 3: Intermediate stage unit 31: Intermediate stage 4: Bonding unit 41: Bonding head 8: Control device 10: Die bonder D: Die P: Substrate

Claims (16)

Semiconductor manufacturing equipment
A push-up unit that pushes the die from below the dicing tape;
A collet that adsorbs the die;
A control device for controlling the operation of the push-up unit and the collet;
With
The push-up unit is
A block portion that pushes up the die through the dicing tape;
A suction part provided on the outer periphery of the block part and having a suction hole;
With
The block part is
A square-shaped first block in plan view;
A second block that is square in plan view and has a larger planar area than the first block;
An elongated gap provided between the first block and the second block;
The length direction of the gap in plan view extends in the first direction, the width direction extends in the second direction,
The control device moves the push-up unit in the horizontal direction of the second direction with the first block pushed up higher than the upper surface of the suction portion while the collet is sucking the die. Means. The semiconductor manufacturing apparatus according to claim 1.
The height of the second block when the push-up unit moves in the horizontal direction is lower than that of the first block. The semiconductor manufacturing apparatus according to claim 1.
The block height of the first block, the block height of the second block, and the horizontal movement distance of the push-up unit in the second direction can be set. The semiconductor manufacturing apparatus according to claim 1.
The controller is
With the adsorbing part adsorbing the dicing tape, the first block is raised to the first push-up height, the second block is raised to the second push-up height, and then the first block is moved to the first push-up height. Means for lowering to a slide height lower than the push-up height and lowering the second block to a height lower than the slide height;
Means for moving the push-up unit in the second direction in a state where the suction of the dicing tape of the suction portion is stopped, and then sucking the dicing tape by the suction portion;
Means for moving the push-up unit in a horizontal direction opposite to the second direction in a state in which the suction of the dicing tape of the suction portion is stopped, and then sucking the dicing tape by the suction portion;
Is provided. The semiconductor manufacturing apparatus according to claim 4.
The second push-up height is higher than the first push-up height. The semiconductor manufacturing apparatus according to claim 4.
When the control device lands the collet on the die and sucks the die, the collet pushes the collet by a predetermined amount even after the collet contacts the die, and the collet is moved down when the second block is lowered. Means for raising the predetermined amount are provided. The semiconductor manufacturing apparatus according to claim 6.
When the control device lowers the second block, the control device lowers the collet by the difference between the first push-up height and the slide height at the timing when the second block reaches the first push-up height. Is provided. The semiconductor manufacturing apparatus according to claim 1.
The die further includes a die attach film between the die and the dicing tape. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising:
A pickup head to which the collet is attached is provided. The semiconductor manufacturing apparatus according to claim 9, further comprising:
An intermediate stage for mounting a die picked up by the pickup head;
A bonding head for bonding a die placed on the intermediate stage onto a substrate or an already bonded die;
Is provided. The manufacturing method of the semiconductor device is as follows:
(A) A die is pushed up from below the dicing tape, a collet that sucks the die, and a controller that controls the push-up unit and the operation of the collet, and the push-up unit includes the dicing A block part that pushes up the die through a tape, and a suction part that is provided on the outer periphery of the block part and has a suction hole. The block part is a first block that is square in plan view, and in plan view. A second block having a square shape and a plane area larger than that of the first block, and an elongated gap provided between the first block and the second block, the length direction of the gap in plan view Is a step of preparing a semiconductor manufacturing apparatus extending in the first direction and the width direction extending in the second direction;
(B) preparing a wafer ring for holding a dicing tape having a die;
(C) preparing the substrate;
(D) pushing up the die with the push-up unit and picking up the die with the collet;
Have
In the step (d), while the collet sucks the die, the push-up unit is moved in the horizontal direction of the second direction in a state where the first block is pushed up higher than the upper surface of the sucking portion. Moving. In the manufacturing method of the semiconductor device of Claim 11,
The step (d)
(D1) a step of raising the first block to a first push-up height and the second block to a second push-up height in a state where the suction portion sucks the dicing tape;
(D2) After the step (d1), lowering the first block to a slide height lower than the first push-up height, and lowering the second block to a height lower than the slide height;
(D3) After the step (d2), the step of moving the push-up unit in the second direction in a state where the suction of the dicing tape of the suction portion is stopped;
(D4) After the step (d3), the step of adsorbing the dicing tape by the adsorption unit;
(D5) After the step (d4), the step of moving the push-up unit in the horizontal direction opposite to the second direction in a state where the suction of the dicing tape of the suction portion is stopped;
(D6) After the step (d5), the step of adsorbing the dicing tape by the adsorption unit;
Have In the manufacturing method of the semiconductor device of Claim 12,
In the step (d), (d7) when the collet lands on the die and sucks the die, the collet is pushed in a predetermined amount even after the collet contacts the die, and the second block is lowered. Sometimes raising the collet by the predetermined amount. In the manufacturing method of the semiconductor device of Claim 13,
In the step (d), (d8) when lowering the second block, the collet is moved to the first push-up height and the slide height at the timing when the second block reaches the first push-up height. The step of lowering by the difference of. 12. The method of manufacturing a semiconductor device according to claim 11, further comprising:
(E) bonding the die onto a substrate or an already bonded die. In the manufacturing method of the semiconductor device of Claim 15,
The step (d) further includes a step of placing the picked-up die on an intermediate stage,
The step (e) further includes a step of picking up the die from the intermediate stage.

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