JP7023740B2 - Mounting device - Google Patents

Mounting device Download PDF

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JP7023740B2
JP7023740B2 JP2018029257A JP2018029257A JP7023740B2 JP 7023740 B2 JP7023740 B2 JP 7023740B2 JP 2018029257 A JP2018029257 A JP 2018029257A JP 2018029257 A JP2018029257 A JP 2018029257A JP 7023740 B2 JP7023740 B2 JP 7023740B2
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substrate
board
mounting
magazine rack
transport
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JP2019145692A (en
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勝美 寺田
孝志 晴
賢 北村
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to KR1020207026812A priority patent/KR102713884B1/en
Priority to PCT/JP2019/004924 priority patent/WO2019163586A1/en
Priority to TW108105963A priority patent/TWI756517B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

本発明は半導体チップ等のチップ部品を基板に実装する実装装置に関する。より詳しくは基板マガジンラックに収容された基板を取り出し、チップ部品を実装してから基板マガジンラックに収容する実装装置に関する。 The present invention relates to a mounting device for mounting chip components such as semiconductor chips on a substrate. More specifically, the present invention relates to a mounting device in which a board housed in a board magazine rack is taken out, chip components are mounted, and then the board is housed in the board magazine rack.

フリップチップ実装等を行なう実装装置は図２０に示すように、実装部３において、基板ステージ４が保持した基板ＰＢに、実装ヘッド５が半導体チップ等のチップ部品Ｃを実装するもので、基板ステージ４が基板位置を移動させながらチップ部品供給機構６から順次供給されるチップ部品Ｃを基板ＰＢ上の所定箇所に実装する機能を有している。 As shown in FIG. 20, in the mounting unit 3, the mounting head 5 mounts the chip component C such as a semiconductor chip on the board PB held by the board stage 4, and the board stage is used to mount the flip chip or the like. 4 has a function of mounting chip components C sequentially supplied from the chip component supply mechanism 6 at a predetermined position on the substrate PB while moving the substrate position.

また、従来の実装装置は、図２０に示す実装装置３０１のように、基板ＰＢを収容する基板マガジンラックＭ１から基板ＰＢを１枚ずつ押し出す機能を有したローダ２１１と、チップ部品Ｃを所定箇所に実装した後の基板（以後、実装済基板ＭＢと記す）を基板マガジンラックＭ１とは別の基板マガジンラック（以後、実装基板マガジンラックＭ２と記す）に１枚ずつ収容する機能を有したアンローダ２１２を備えており、基板マガジンラックＭ１から取り出された基板ＰＢは白抜き矢印のように移動して実装済基板ＭＢとして実装基板マガジンラックＭ２に収容される。 Further, in the conventional mounting device, as in the mounting device 301 shown in FIG. 20, a loader 211 having a function of pushing out the board PBs one by one from the board magazine rack M1 accommodating the board PB, and a chip component C at a predetermined position. An unloader having a function of accommodating a board (hereinafter referred to as a mounted board MB) mounted on the board in a board magazine rack (hereinafter referred to as a mounted board magazine rack M2) different from the board magazine rack M1. The board PB taken out from the board magazine rack M1 moves as shown by the white arrow and is accommodated in the mounted board magazine rack M2 as the mounted board MB.

なお、最近では生産性向上の観点から図２１に示す実装装置３０２のような構成の実装装置も実用化されている。実装装置３０２では、２つの実装部（実装部３Ａと実装部３Ｂ）がチップ部品供給機構６、ローダ２１１およびアンローダ２１２を共有しており、コストパフォーマンスに優れている（特許文献１）。 Recently, from the viewpoint of improving productivity, a mounting device having a configuration like the mounting device 302 shown in FIG. 21 has also been put into practical use. In the mounting device 302, two mounting units (mounting unit 3A and mounting unit 3B) share a chip component supply mechanism 6, a loader 211 and an unloader 212, and are excellent in cost performance (Patent Document 1).

ところで、従来、図２０および図２１の白抜き矢印で示したように基板ＰＢおよび実装済基板ＭＢを移動させるのに際して、基板上面の四隅を吸着して吊上げる方法が用いられてきた。すなわち、図２２に示すような先端部に真空パッド２９１を有する吊上アーム２９０を用い、基板ＰＢ（または実装済基板ＭＢ）を吊上げた状態でレール等により所定箇所に搬送してから降下して吸着解除するという手法が用いられている（例えば特許文献２）。 By the way, conventionally, when moving the substrate PB and the mounted substrate MB as shown by the white arrows in FIGS. 20 and 21, a method of sucking and lifting the four corners of the upper surface of the substrate has been used. That is, using a lifting arm 290 having a vacuum pad 291 at the tip as shown in FIG. 22, the board PB (or the mounted board MB) is lifted, transported to a predetermined position by a rail or the like, and then lowered. A method of releasing adsorption is used (for example, Patent Document 2).

特願２０１７－０２２２７５号Japanese Patent Application No. 2017-022275 特開２００５－２４３７０３号公報Japanese Unexamined Patent Publication No. 2005-243703

図２３（ａ）に基板ＰＢにチップ部品Ｃを実装した実装済基板ＭＢの上面図を示すが、基板ＰＢ内においてチップ部品Ｃを実装する実装エリアＡＭに対して実装エリアの周囲に非実装エリアＡＦが存在し、図２２の真空パッド２９１が吸着できるのが非実装エリアに限定されることが判る。ここで、図２３（ａ）のように、基板ＰＢのサイズに対して非実装エリアの比率が比較的大きい場合は、基板ＰＢを吊上げるのに充分な吸着力が得られる吸着パッド２９１のサイズを選定することが出来る。 FIG. 23A shows a top view of the mounted board MB in which the chip component C is mounted on the board PB, but the non-mounting area around the mounting area with respect to the mounting area AM in which the chip component C is mounted in the board PB. It can be seen that AF is present and the vacuum pad 291 of FIG. 22 can be attracted only to the non-mounting area. Here, as shown in FIG. 23A, when the ratio of the non-mounting area to the size of the substrate PB is relatively large, the size of the adsorption pad 291 that can obtain sufficient adsorption force for lifting the substrate PB. Can be selected.

ところが、最近では、１枚の基板ＰＢに極力多くのチップ部品Ｃを実装することが求められており、図２３（ｂ）に示すように非実装エリアＡＦが狭まり、真空パッド２９１も小さくせざるを得なくなっている。このため、基板ＰＢを吊上げるのに充分な吸着力を得るのが困難となっている。 However, recently, it has been required to mount as many chip components C as possible on one substrate PB, the non-mounting area AF is narrowed as shown in FIG. 23 (b), and the vacuum pad 291 must also be made smaller. I'm not getting any. Therefore, it is difficult to obtain a sufficient suction force to lift the substrate PB.

更に、実装過程において基板ＰＢが加熱される場合においては、図２４のように基板ＰＢが湾曲して、真空パッド２９１と基板ＰＢの間に空隙ＶＧが生じ真空吸着自体が困難となることもある。 Further, when the substrate PB is heated in the mounting process, the substrate PB may be curved as shown in FIG. 24, and a gap VG may be generated between the vacuum pad 291 and the substrate PB, making vacuum adsorption itself difficult. ..

本発明は上記課題に鑑みてなされたものであり、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置を提供するものである。 The present invention has been made in view of the above problems, and provides a mounting device capable of reliably transporting a board even when the chip components are mounted close to the outer periphery of the board.

上記の課題を解決するために、請求項１に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
実装ヘッドと基板ステージを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から前記基板マガジンラックの収容位置まで搬送する機能を有する基板搬送機構とを備え、
前記基板ステージが前記基板を吸着保持する吸着テーブルと前記吸着テーブルを基板面内方向に位置調整するＸＹ駆動機構と、上下方向に位置調整可能な基板レールと基板ガイドを用いて前記吸着テーブル上の前記基板の側辺を固定する基板クランプを有し、
前記基板搬送機構は、直線的な搬送レールと、前記搬送レールに沿った方向に移動可能で、前記基板または前記実装済基板を搬送対象として、前記搬送対象の搬送方向側の縁または搬送方向と反対側の縁の何れかを把持することが可能なアームを有し、
前記搬送対象を一方から他方に搬送する際に、前記アームが、前記搬送対象の搬送方向側の縁を保持して前記搬送レールに沿って引いて移動させた後に前記搬送方向と反対側の縁を保持して前記搬送レールに沿って押して移動させる機能を有した実装装置である。 In order to solve the above problems, the invention according to claim 1 is
A mounting device that takes out a board housed in a board magazine rack, mounts chip components on the board, and then houses the mounted board on which the chip parts are mounted in the board magazine rack.
A mounting unit having a mounting head and a board stage, and mounting the chip components on the board arranged on the board stage by the mounting head.
A substrate transfer mechanism having a function of transporting the board in the accommodation position in the substrate magazine rack onto the substrate stage and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack. Equipped with
On the suction table, the substrate stage uses a suction table for sucking and holding the substrate, an XY drive mechanism for adjusting the position of the suction table inward in the substrate surface, and a substrate rail and a substrate guide whose position can be adjusted in the vertical direction. It has a substrate clamp that secures the sides of the substrate.
The substrate transport mechanism has a linear transport rail and is movable in a direction along the transport rail, with the substrate or the mounted substrate as a transport target and an edge or a transport direction on the transport direction side of the transport target. Has an arm capable of gripping any of the opposite edges,
When transporting the transport target from one side to the other, the arm holds the edge of the transport target on the transport direction side and pulls and moves it along the transport rail, and then the edge opposite to the transport direction. It is a mounting device having a function of holding and pushing and moving along the transport rail.

請求項２に記載の発明は、
基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から前記実装基板マガジンラックの収容位置まで搬送する機能を有する基板搬送機構とを備え、
前記基板ステージが前記基板を吸着保持する吸着テーブルと前記吸着テーブルを基板面内方向に位置調整するＸＹ駆動機構と、上下方向に位置調整可能な基板レールと基板ガイドを用いて前記吸着テーブル上の前記基板の側辺を固定する基板クランプを有し、
前記基板搬送機構は、直線的な搬送レールと、前記搬送レールに沿った方向に移動可能で、前記基板または前記実装済基板を搬送対象として、前記搬送対象の搬送方向側の縁または搬送方向と反対側の縁の何れかを把持することが可能なアームを有し、
前記搬送対象を一方から他方に搬送する際に、前記アームが、前記搬送対象の搬送方向側の縁を保持して前記搬送レールに沿って引いて移動させた後に前記搬送方向と反対側の縁を保持して前記搬送レールに沿って押して移動させる機能を有した実装装置である。 The invention according to claim 2 is
It is a mounting device that takes out the board housed in the board magazine rack, mounts the chip components on the board, and then houses the mounted board on which the chip parts are mounted in the mounting board magazine rack.
The board magazine rack and the mounted board magazine rack are arranged so that the board take-out surface of the board magazine rack and the mounted board accommodating surface of the mounted board magazine rack are arranged side by side on the same surface in the same direction. A magazine rack moving mechanism that moves in the direction in which they are lined up,
A mounting unit having a board stage and a mounting head, and mounting the chip components on the board arranged on the board stage by the mounting head.
A board transfer mechanism having a function of transporting the board in the accommodation position in the substrate magazine rack onto the substrate stage and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the mounting substrate magazine rack. And with
On the suction table, the substrate stage uses a suction table for sucking and holding the substrate, an XY drive mechanism for adjusting the position of the suction table inward in the substrate surface, and a substrate rail and a substrate guide whose position can be adjusted in the vertical direction. It has a substrate clamp that secures the sides of the substrate.
The substrate transport mechanism has a linear transport rail and is movable in a direction along the transport rail, with the substrate or the mounted substrate as a transport target and an edge or a transport direction on the transport direction side of the transport target. Has an arm capable of gripping any of the opposite edges,
When transporting the transport target from one side to the other, the arm holds the edge of the transport target on the transport direction side and pulls and moves it along the transport rail, and then the edge opposite to the transport direction. It is a mounting device having a function of holding and pushing and moving along the transport rail.

請求項３に記載の発明は、請求項１または請求項２に記載の実装装置であって、
前記基板搬送機構は、前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置である。 The invention according to claim 3 is the mounting apparatus according to claim 1 or 2.
The substrate transport mechanism is a mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack.

請求項４に記載の発明は、請求項１から請求項３のいずれかの請求項に記載の実装装置であって、
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置である。 The invention according to claim 4 is the mounting apparatus according to any one of claims 1 to 3.
It is a mounting device further provided with a chip component supply mechanism for supplying the chip components to the mounting head.

請求項５に記載の発明は、請求項４記載の実装装置であって、
前記実装部を２つ備え、前記実装部夫々と１対１で対応する前記基板搬送機構を備え、
前記チップ部品供給機構は、前記２つの実装部の間に配置され、２つの前記実装部夫々にチップ部品を供給する機能を有する実装装置である。
更に、請求項６に記載の発明は、請求項１から請求項５の何れかに記載の実装装置であって、前記基板クランプの前記基板ガイドが前記基板を前記基板ステージ上に搬送する際のガイドとしても機能する実装装置である。
The invention according to claim 5 is the mounting apparatus according to claim 4.
It is provided with two mounting portions, and is provided with the substrate transport mechanism having a one-to-one correspondence with each of the mounting portions.
The chip component supply mechanism is a mounting device that is arranged between the two mounting portions and has a function of supplying chip components to each of the two mounting portions.
Further, the invention according to claim 6 is the mounting apparatus according to any one of claims 1 to 5, when the substrate guide of the substrate clamp conveys the substrate onto the substrate stage. It is a mounting device that also functions as a guide.

本発明により、チップ部品を基板の外周近くまで実装する場合においても、基板搬送を確実に行うことが可能な実装装置が提供できる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a mounting device capable of reliably transporting a board even when the chip component is mounted near the outer periphery of the board.

本発明の実施形態に係る実装装置の構成を示す概略図である。It is a schematic diagram which shows the structure of the mounting apparatus which concerns on embodiment of this invention. 基板マガジンラックについて説明する断面図であり、（ａ）基板が入っていない状態、（ｂ）基板が入った状態で基板出入り状態を示す図である。It is sectional drawing explaining the substrate magazine rack, and is the figure which shows (a) the state which the substrate is not contained, (b) the state which the substrate is in and out with the substrate inserted. 本発明の実施形態に係る基板と基板マガジンラックの関係を説明する断面図であり、（ａ）基板マガジンラックから基板が取り出される状態、（ｂ）実装済基板が基板マガジンラックに収容される状態、（ｃ）実装済基板を収容後に別の基板が基板マガジンラックから取り出される状態を示す図である。It is sectional drawing explaining the relationship between the substrate and the substrate magazine rack which concerns on embodiment of this invention, (a) the state which the substrate is taken out from the substrate magazine rack, (b) the state where the mounted substrate is accommodated in the substrate magazine rack. , (C) It is a figure which shows the state which another board is taken out from a board magazine rack after accommodating a mounted board. 本発明の実施形態に係る実装装置の基板クランプの動作を説明する図であり、（ａ）基板搬送時、（ｂ）基板固定時、（ｃ）実装済基板搬送時の断面図である。It is a figure explaining the operation of the board clamp of the mounting apparatus which concerns on embodiment of this invention, is a sectional view at the time of (a) board transfer, (b) board fixing, (c) mounted board transfer. 本発明の実施形態に係る実装装置における基板クランプ改良例について説明する図であり、（ａ）上面図、（ｂ）断面図を示す図である。It is a figure explaining the substrate clamp improvement example in the mounting apparatus which concerns on embodiment of this invention, and is the figure which shows (a) top view, (b) sectional view. 本発明の実施形態に係る実装装置における基板クランプ改良例の動作について説明する断面図であり、（ａ）基板搬送時の状態、（ｂ）基板固定時の状態を示す図である。It is sectional drawing explaining the operation of the substrate clamp improvement example in the mounting apparatus which concerns on embodiment of this invention, and is the figure which shows (a) the state at the time of board transfer, (b) the state at the time of fixing a board. 本発明の実施形態に係る実装装置の基板搬送方向を説明する図である。It is a figure explaining the substrate transport direction of the mounting apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る基板搬送機構の、（ａ）ステージ側保持部周辺、（ｂ）マガジンラック側保持部周辺を説明する図である。It is a figure explaining (a) the periphery of the stage side holding part, (b) the periphery of the magazine rack side holding part of the substrate transfer mechanism which concerns on embodiment of this invention. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）基板を引いて一部が吸着テーブル上に達した状態、（ｄ）基板を吸着テーブル上の所定位置に押して行く状態を示す図である。It is a figure explaining the operation of the substrate transfer mechanism which concerns on embodiment of this invention, (a) the state which pulls out a substrate from a substrate magazine rack, (b) the state which pulls a substrate to a stage side and conveys (c) pulls a substrate. It is a figure which shows the state which a part reached on the suction table, and (d) the state which pushes a substrate to a predetermined position on a suction table. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ｅ）基板を押して吸着テーブル上の所定位置に配置した状態、（ｆ）基板を吸着テーブル上に固定した状態、（ｇ）基板上へのチップ部品の実装が完了した状態、（ｈ）実装済基板を吸着テーブル上から基板マガジンラック側に引き出す状態を示す図である。It is a figure explaining the operation of the substrate transfer mechanism which concerns on embodiment of this invention, (e) the state which pushed the substrate and placed it in the predetermined position on the suction table, (f) the state where the substrate was fixed on the suction table, ( g) It is a figure which shows the state which the mounting of the chip component is completed on the substrate, (h) the state which pulls out the mounted substrate from the suction table to the substrate magazine rack side. 本発明の実施形態に係る基板搬送機構の動作を説明する図であり、（ｉ）実装済基板を基板マガジンラック側に引いて搬送する状態、（ｊ）実装済基板を基板マガジンラック側に押して搬送する状態、（ｋ）実装済基板を基板マガジンラックに押し込む状態、（ｌ）実装済基板を基板マガジンラックに収容した状態を示す図である。It is a figure explaining the operation of the substrate transfer mechanism which concerns on embodiment of this invention, (i) the state which pulls and conveys the mounted substrate to the substrate magazine rack side, (j) pushes the mounted substrate to the substrate magazine rack side. It is a figure which shows the state which carries out, (k) the state which pushed the mounted board into a board magazine rack, and (l) the state where the mounted board is housed in a board magazine rack. 本発明の実施形態に係り、基板のステージ側のみを保持する装置構成を示した図である。It is a figure which showed the apparatus structure which holds only the stage side of a substrate which concerns on embodiment of this invention. 本発明の実施形態に係る基板搬送機構の変形例を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）基板を引いて一部が吸着テーブル上に達した状態、（ｄ）基板を吸着テーブル上の所定位置に押して行く状態を示す図である。It is a figure explaining the modification of the substrate transfer mechanism which concerns on embodiment of this invention, (a) the state which pulls out a substrate from a substrate magazine rack, (b) the state which pulls a substrate to a stage side and conveys (c) a substrate. It is a figure which shows the state which a part reached on the suction table by pulling, and (d) the state which pushes a substrate to a predetermined position on a suction table. 実装済基板を元の基板マガジンラックとは別の実装基板マガジンラックに収容する場合の装置構成の一例である。This is an example of an apparatus configuration in which the mounted board is housed in a mounted board magazine rack different from the original board magazine rack. 本発明の第二実施形態に係る実装装置の構成を示す概略図である。It is a schematic diagram which shows the structure of the mounting apparatus which concerns on 2nd Embodiment of this invention. 本発明の第二実施形態に係る基板搬送機構の動作を説明する図であり、（ａ）基板マガジンラックから基板を引き出す状態、（ｂ）基板をステージ側に引いて搬送する状態（ｃ）実装済基板をマガジンラック側に押して搬送する状態、（ｄ）実装済基板を実装基板マガジンラックに押し込む状態を示す図である。It is a figure explaining the operation of the substrate transfer mechanism which concerns on 2nd Embodiment of this invention, (a) the state which pulls out a substrate from a substrate magazine rack, (b) the state which pulls a substrate to a stage side, and (c) mounts. It is a figure which shows the state which pushes and conveys a finished board to a magazine rack side, and (d) the state which pushes a mounted board into a mounted board magazine rack. 本発明の第二実施形態に係る基板搬送機構の動作を説明する図であり、（ｅ）基板マガジンから基板を引き出す準備段階、（ｆ）基板マガジンラックから基板を引き出す状態を示す図である。It is a figure explaining the operation of the substrate transfer mechanism which concerns on 2nd Embodiment of this invention, is a figure which shows (e) the preparatory stage which pulls out a substrate from a substrate magazine, and (f) the state which pulls out a substrate from a substrate magazine rack. 本発明の実施形態に係り、複数の実装部を備えた装置構成を示す概略図である。It is a schematic diagram which shows the apparatus configuration which concerns on the Embodiment of this invention, and includes a plurality of mounting parts. 本発明の第二実施形態に係り、複数の実装部を備えた装置構成を示す概略図である。It is a schematic diagram which shows the apparatus configuration which concerns on the 2nd Embodiment of this invention and includes a plurality of mounting parts. 従来の実装装置の装置構成を示す概略図である。It is a schematic diagram which shows the apparatus structure of the conventional mounting apparatus. 従来の実装装置で複数の実装部を備えた装置構成を示す概略図である。It is a schematic diagram which shows the apparatus structure which provided a plurality of mounting parts in the conventional mounting apparatus. 従来の実装装置で基板を搬送するのに用いる基板吊上げ手法を説明する図である。It is a figure explaining the substrate lifting method used for transporting a substrate by a conventional mounting apparatus. （ａ）実装済基板の実装エリアと非実装エリアについて説明する図であり、（ｂ）非実装エリアが狭まっている状況を説明する図である。(A) It is a figure explaining the mounting area and the non-mounting area of a mounted board, and (b) it is a figure explaining the situation where the non-mounting area is narrowed. 非実装エリアが狭まった実装済基板の表面を吸着して吊上げる際の問題点を説明する図である。It is a figure explaining the problem at the time of adsorbing and hoisting the surface of the mounted board which the non-mounting area is narrowed.

本発明の実施形態について、図面を用いて説明する。
図１は本発明の実施形態に係る実装装置の一例を示す概略図である。図１の実装装置１は、基板マガジンラックＭ１から基板ＰＢを取り出し、基板ＰＢに半導体チップ等のチップ部品Ｃを実装し、基板ＰＢの所定箇所にチップ部品Ｃを実装した実装済基板ＭＢを基板マガジンラックＭ１に収容するものである。 An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view showing an example of a mounting device according to an embodiment of the present invention. The mounting device 1 of FIG. 1 takes out the board PB from the board magazine rack M1, mounts the chip component C such as a semiconductor chip on the board PB, and mounts the mounted board MB on which the chip component C is mounted at a predetermined position on the board PB. It is housed in the magazine rack M1.

ここで、基板マガジンラックＭ１は、基板ＰＢ同士を適度な隙間を開けて積層収容するものであり、図２（ａ）に基板ＰＢが入っていない断面図を示し、図２（ｂ）には基板ＰＢが収容された断面図を示している。また、基板ＰＢの取り出しは、図２（ｂ）に示すように、基板ＰＢを１枚ずつ面方向に移動させて行なうため、基板マガジンラックＭ１の４側面の中の１面は、基板ＰＢの出し入れを行なう開口を有している（以下、基板ＰＢを取り出す開口を有する面を基板取り出し面と記す）。 Here, the substrate magazine rack M1 stacks and accommodates the substrate PBs with an appropriate gap between them. FIG. 2A shows a cross-sectional view in which the substrate PB is not contained, and FIG. 2B shows a cross-sectional view. The cross-sectional view which accommodated the substrate PB is shown. Further, as shown in FIG. 2B, the substrate PB is taken out by moving the substrate PB one by one in the surface direction. Therefore, one surface of the four side surfaces of the substrate magazine rack M1 is the substrate PB. It has an opening for taking in and out (hereinafter, the surface having the opening for taking out the substrate PB is referred to as a substrate taking-out surface).

図３は、基板マガジンラックＭ１から基板ＰＢを取り出して（図３（ａ）、実装済基板ＭＢを収容する（図３（ｂ））様子を示したものであるが、図３（ｃ）に示すように順次新たな基板ＰＢを取り出せるようになっている。 FIG. 3 shows a state in which the substrate PB is taken out from the substrate magazine rack M1 (FIG. 3 (a) and the mounted substrate MB is accommodated (FIG. 3 (b)), and FIG. 3 (c) shows the state. As shown, new substrates PB can be taken out in sequence.

図１の実装装置１は、架台２、基板ステージ４と実装ヘッド５を有する実装部３、チップ部品ピックアップ手段７とチップ部品搬送手段８とを有するチップ部品供給機構６、および基板搬送機構９を備えている。 The mounting device 1 of FIG. 1 includes a mount 2, a mounting unit 3 having a board stage 4 and a mounting head 5, a chip component supply mechanism 6 having a chip component pick-up means 7 and a chip component transporting means 8, and a board transport mechanism 9. I have.

架台２は実装装置１の構造体であり、基板ステージ４、実装ヘッド５、チップ部品ピックアップ手段７、チップ部品搬送手段８および基板搬送機構９を支持する基礎構造体となっている。 The gantry 2 is a structure of the mounting device 1, and is a basic structure that supports the board stage 4, the mounting head 5, the chip component pick-up means 7, the chip component transport means 8, and the board transport mechanism 9.

基板ステージ４は、吸着テーブル４１、ＸＹ駆動機構４２、基板クランプ４３を有し、基板ＰＢを保持するとともに、基板ＰＢを面内方向に移動させ、チップ部品Ｃを実装すべき位置を移動させる機能を有している。吸着テーブル４１は基板ＰＢを吸着保持する機能を有し、ＸＹ駆動機構４２は基板ＰＢの面内方向（ＸＹ方向）に吸着テーブル４１を移動させ位置調整する機能を有し、基板クランプ４３は基板ＰＢを吸着テーブル４１に搬送する際のガイドとして機能するとともに、基板ＰＢの側辺をクランプして固定する機能も有している。 The board stage 4 has a suction table 41, an XY drive mechanism 42, and a board clamp 43, and has a function of holding the board PB, moving the board PB in the in-plane direction, and moving the position where the chip component C should be mounted. have. The suction table 41 has a function of sucking and holding the substrate PB, the XY drive mechanism 42 has a function of moving the suction table 41 in the in-plane direction (XY direction) of the substrate PB, and the substrate clamp 43 has a function of adjusting the position. In addition to functioning as a guide when transporting the PB to the suction table 41, it also has a function of clamping and fixing the side sides of the substrate PB.

図４（ａ）に示すように、基板クランプ４３は、基板レール４３０と基板ガイド４３１を構成要素としている。基板レール４３０および基板ガイド４３１は吸着テーブル４１に対しＸＹ方向には固定されているものの、上下方向（Ｚ方向）には位置調整可能になっている。すなわち、基板レール４３０上面を吸着テーブル４１の上面より高くすれば、基板ＰＢを吸着テーブル４１と接触させずに搬送することが出来、基板レール４３０上面を吸着テーブル４１上面と同高さにすれば、基板ガイド４３１によって基板ＰＢの側辺を吸着テーブル上に固定することが出来る。 As shown in FIG. 4A, the board clamp 43 includes a board rail 430 and a board guide 431 as components. Although the board rail 430 and the board guide 431 are fixed to the suction table 41 in the XY directions, their positions can be adjusted in the vertical direction (Z direction). That is, if the upper surface of the substrate rail 430 is made higher than the upper surface of the suction table 41, the substrate PB can be conveyed without coming into contact with the suction table 41, and if the upper surface of the substrate rail 430 is made the same height as the upper surface of the suction table 41. , The side side of the substrate PB can be fixed on the suction table by the substrate guide 431.

ただし、基板レール４３０の上面と吸着テーブル４１上面の高さを同一にする際に誤差が生じると、基板ＰＢの側辺部が折れ曲がった状態になる懸念がある。その対策を盛り込んだ改良例を示したのが図５であり、図５（ａ）が上面図で、図５（ｂ）が断面図であるが、基板レール４３０と吸着テーブル４１の端部を櫛歯状でかみ合うような形状にしている。このようにすることで、図６（ａ）のような基板ＰＢ搬送状態から、図６（ｂ）のような基板ＰＢ固定状態にする際、基板レール４３０上面が吸着テーブル４１より低くなっても、吸着テーブル４１両端の凸部と基板ガイド４３１によって基板ＰＢの側辺部を固定することが出来る。このため、基板ＰＢの側辺部が折れ曲がることはなく、基板ＰＢ側辺の非実装エリアが狭い場合にも好適である。 However, if an error occurs when the heights of the upper surface of the substrate rail 430 and the upper surface of the suction table 41 are made the same, there is a concern that the side side portions of the substrate PB may be bent. FIG. 5 shows an improved example incorporating the countermeasures, FIG. 5 (a) is a top view, and FIG. 5 (b) is a sectional view, but the end portions of the substrate rail 430 and the suction table 41 are shown. It is shaped like a comb and meshes. By doing so, even if the upper surface of the substrate rail 430 is lower than the suction table 41 when the substrate PB is transferred from the substrate PB transport state as shown in FIG. 6 (a) to the substrate PB fixed state as shown in FIG. 6 (b). The side portions of the substrate PB can be fixed by the convex portions at both ends of the suction table 41 and the substrate guide 431. Therefore, the side side portion of the substrate PB does not bend, and it is suitable even when the non-mounting area on the side side of the substrate PB is narrow.

実装ヘッド５は、先端部で保持したチップ部品Ｃを降下させて、基板ＰＢに加圧して実装する機能を有しており、加圧と同時にチップ部品を加熱する機能や、加圧面内の方向に超音波振動を付与する機能、等を有していてもよい。更に、先端部に保持したチップ部品Ｃを、Ｚ方向を軸として回転して角度調整する機能を有していてもよい。 The mounting head 5 has a function of lowering the chip component C held at the tip portion and pressurizing the substrate PB for mounting, and has a function of heating the chip component at the same time as the pressurization and a direction in the pressurizing surface. It may have a function of applying ultrasonic vibration to the device, and the like. Further, the chip component C held at the tip portion may have a function of rotating around the Z direction to adjust the angle.

なお、本明細書の説明において、チップ部品を基板Ｃに熱や超音波とともに圧着して固定することを想定して実装という言葉を用いているが、これに限定されるものではなく、未硬化の熱硬化性接着材を介して、基板ＰＢ上にチップ部品Ｃを仮固定するケースも本発明における実装に含まれる。 In the description of the present specification, the term mounting is used on the assumption that the chip component is crimped and fixed to the substrate C together with heat and ultrasonic waves, but the term is not limited to this and is not limited to uncured. The case of temporarily fixing the chip component C on the substrate PB via the thermosetting adhesive of the present invention is also included in the mounting in the present invention.

チップ部品ピックアップ手段７は、チップ部品Ｃをピックアップして、チップ部品搬送手段８に受け渡すものである。図１の実装装置１では、チップ部品ピックアップ手段７は、ダイシングされたウェハ基板Ｗからチップ部品をピックアップする例を示しているが、ピックアップ元はこれに限定されるものではなく、容器に収容されたチップ部品Ｃをピックアップする構成であってもよい。 The chip component pick-up means 7 picks up the chip component C and delivers it to the chip component transport means 8. In the mounting device 1 of FIG. 1, the chip component picking-up means 7 shows an example of picking up a chip component from the diced wafer substrate W, but the pick-up source is not limited to this, and is housed in a container. It may be configured to pick up the chip component C.

チップ部品搬送手段８は、チップ部品ピックアップ手段７によって受け渡されたチップ部品Ｃを実装ヘッド５まで搬送し、チップ部品Ｃを実装ヘッド５に受け渡すものである。 The chip component transporting means 8 transports the chip component C delivered by the chip component picking-up means 7 to the mounting head 5, and delivers the chip component C to the mounting head 5.

基板搬送機構９は、図７に示すように基板ＰＢを基板マガジンラックＭ１から取り出して基板ステージ４に搬送する機能と、実装済基板ＭＢを基板ステージ４から搬送して基板マガジンラックＭ１に収容する機能の両機能を有するものである。 As shown in FIG. 7, the board transfer mechanism 9 has a function of taking out the board PB from the board magazine rack M1 and transporting it to the board stage 4, and transporting the mounted board MB from the board stage 4 and accommodating it in the board magazine rack M1. It has both functions.

図１および図７においては、基板搬送機構９を構成する搬送レール９０のみを表示しているが、図８（ａ）および図８（ｂ）に示すように、基板ＰＢの端部を保持して搬送する機能を有している。 In FIGS. 1 and 7, only the transfer rail 90 constituting the substrate transfer mechanism 9 is shown, but as shown in FIGS. 8A and 8B, the end portion of the substrate PB is held. Has the function of transporting.

図８（ａ）において、ステージ側保持部９１は、基板ＰＢ（または実装済基板ＭＢ）の基板ステージ４側の縁を保持（および解除）する機能を有しており、ステージ側保持部９１はＺアーム９２に設けられていて、Ｚアーム９２の動作により上下（Ｚ方向）移動が可能である。図８（ｂ）において、マガジンラック側保持部９６は、基板ＰＢ（または実装済基板ＭＢ）の基板マガジンラックＭ１側（基板ステージ４側の反対）の縁を保持（および解除）する機能を有しており、マガジンラック側保持部９６はＺアーム９７に設けられていて、Ｚアーム９７の動作により上下（Ｚ方向）移動が可能である。 In FIG. 8A, the stage-side holding portion 91 has a function of holding (and releasing) the edge of the board PB (or the mounted board MB) on the board stage 4 side, and the stage-side holding section 91 has a function of holding (and releasing) the edge of the board PB (or the mounted board MB) on the board stage 4. It is provided on the Z arm 92 and can be moved up and down (Z direction) by the operation of the Z arm 92. In FIG. 8B, the magazine rack side holding portion 96 has a function of holding (and releasing) the edge of the board PB (or the mounted board MB) on the board magazine rack M1 side (opposite to the board stage 4 side). The magazine rack side holding portion 96 is provided on the Z arm 97, and can be moved up and down (Z direction) by the operation of the Z arm 97.

ここで、ステージ側保持部９１およびマガジンラック側保持部９６が保持するのは、外縁から１ｍｍ以上あることが望ましく、基板ＰＢの非実装エリアに応じて深く保持することが望ましいが最大でも８ｍｍあれば充分である。 Here, it is desirable that the stage side holding portion 91 and the magazine rack side holding portion 96 hold 1 mm or more from the outer edge, and it is desirable to hold deeply according to the non-mounting area of the substrate PB, but the maximum is 8 mm. Is enough.

更に、Ｚアーム９２はステージ側保持部９１が保持した基板ＰＢ（または実装済基板ＭＢ）の縁を水平方向に押し引き可能な可動範囲を有しており、同様にＺアーム９７はマガジンラック側保持部９６が保持した基板ＰＢ（または実装済基板ＭＢ）の縁を水平方向に押し引き可能な可動範囲を有している。その具体例が、図９（ａ）に上面図を示した実施形態である。 Further, the Z arm 92 has a movable range in which the edge of the board PB (or the mounted board MB) held by the stage side holding portion 91 can be pushed and pulled in the horizontal direction. Similarly, the Z arm 97 has a magazine rack side. It has a movable range in which the edge of the substrate PB (or the mounted substrate MB) held by the holding portion 96 can be pushed and pulled in the horizontal direction. A specific example thereof is the embodiment in which the top view is shown in FIG. 9 (a).

図９（ａ）で説明すると、Ｚアーム９２はＸアーム９３を介してスライドレール９４に沿ってＹ方向に可動範囲を有しており、Ｚアーム９７もＸアーム９８を介してスライドレール９９に沿って可動範囲を有している。すなわち、本実施形態における基板搬送機構９は、搬送レール９０、ステージ側保持部９１、Ｚアーム９２、Ｘアーム９３、スライドレール９４、マガジンラック側保持部９６、Ｚアーム９７、Ｘアーム９８およびスライドレール９９を構成要素として有している。 Explained with reference to FIG. 9A, the Z arm 92 has a movable range in the Y direction along the slide rail 94 via the X arm 93, and the Z arm 97 also becomes the slide rail 99 via the X arm 98. It has a range of motion along it. That is, the substrate transfer mechanism 9 in the present embodiment includes the transfer rail 90, the stage side holding portion 91, the Z arm 92, the X arm 93, the slide rail 94, the magazine rack side holding portion 96, the Z arm 97, the X arm 98, and the slide. It has a rail 99 as a component.

以下、図９（ａ）に示した基板搬送機構９を備えた実装装置１について、基板マガジンラックＭ１から基板ＰＢを取り出してから、実装済基板ＭＢとして基板マガジンラックＭ１に収容するまでの動作を、図９から図１１を用いて説明する。 Hereinafter, regarding the mounting device 1 provided with the board transport mechanism 9 shown in FIG. 9A, the operation from taking out the board PB from the board magazine rack M1 to accommodating the board PB as the mounted board MB in the board magazine rack M1 is performed. , FIGS. 9 to 11 will be described.

図９（ａ）は、基板マガジンラックＭ１から基板ＰＢを取り出す状態を示したものである。ここで、基板マガジンラックＭ１の基板取り出し面は、吸着テーブル４１の方を向いており、吸着テーブル４１から基板搬送機構９に連なる直線上に（取り出すべき）基板ＰＢが配置されている。 FIG. 9A shows a state in which the substrate PB is taken out from the substrate magazine rack M1. Here, the substrate take-out surface of the substrate magazine rack M1 faces the suction table 41, and the substrate PB (to be taken out) is arranged on a straight line connected from the suction table 41 to the substrate transfer mechanism 9.

この状態で、基板搬送機構９はステージ側保持部９１が、基板マガジンラックＭ１内の収容位置にある基板ＰＢのステージ側（図の上側）の縁を保持するように動作する。 In this state, the substrate transfer mechanism 9 operates so that the stage-side holding portion 91 holds the edge of the substrate PB at the accommodation position in the substrate magazine rack M1 on the stage side (upper side in the figure).

この後、基板搬送機構９は基板ＰＢを保持した状態で、図９（ｂ）に示す様にステージ側に引いて移動させる。その際、基板ＰＢは搬送レール９０上に載った状態で移動するので、一方の縁だけを保持した状態であっても水平に移動させることが出来る。 After that, the substrate transfer mechanism 9 is moved toward the stage side as shown in FIG. 9B while holding the substrate PB. At that time, since the substrate PB moves while being placed on the transport rail 90, it can be moved horizontally even when only one edge is held.

更に基板ＰＢを移動させると、図９（ｃ）のように、基板ＰＢの一部が吸着テーブル４１上に達する。この状態において、図４（ａ）のように、基板クランプ４３を構成する基板レール４３０の上面は吸着テーブル４１より高く、搬送レール９０の上面と等しくすることにより、基板ＰＢをスムーズに搬送することが出来る。また、基板ガイド４３１は基板ＰＢを通過させつつ、基板ＰＢの反り等の変形を規制する程度に、基板レール４３０との間に隙間を形成している。なお、基板ガイド４３１は基板ＰＢの幅を規制する役割も有している。このため、基板ＰＢのＸ方向位置がずれた状態で搬送すると、基板ＰＢは基板ガイド４３１間を通過することが出来ない。そこで、図９（ｂ）の段階で、基板のＸ方向位置が修正できるよう、Ｘアームの長さを調整できるような機構を有していてもよい。 When the substrate PB is further moved, a part of the substrate PB reaches the suction table 41 as shown in FIG. 9 (c). In this state, as shown in FIG. 4A, the upper surface of the substrate rail 430 constituting the substrate clamp 43 is higher than the suction table 41 and equal to the upper surface of the transfer rail 90, so that the substrate PB can be smoothly conveyed. Can be done. Further, the substrate guide 431 forms a gap between the substrate guide 431 and the substrate rail 430 to the extent that the substrate PB is allowed to pass through the substrate PB and the deformation such as warpage of the substrate PB is restricted. The substrate guide 431 also has a role of regulating the width of the substrate PB. Therefore, if the substrate PB is conveyed in a state where the position in the X direction is deviated, the substrate PB cannot pass between the substrate guides 431. Therefore, at the stage of FIG. 9B, a mechanism may be provided so that the length of the X arm can be adjusted so that the position of the substrate in the X direction can be corrected.

ところで、図９（ｃ）の状態から、ステージ側保持部９１が基板ＰＢを保持した状態のままで、基板ＰＢを吸着テーブル４１の所定位置まで搬送するような構成とすることは可能である。しかし、そのような構成とする場合、図１２に示すように、吸着テーブル４１を超えた位置（図１２における吸着テーブルの上側）までステージ側保持部９１を移動させる必要がある。図１２のように、吸着テーブル４１を超えた部分にスペースを設けた装置構成としてもよいが、本発明ではステージ側保持部９１とは別に、マガジンラック側保持部９６を設けた構成として装置スペースの削減を図っている。 By the way, from the state of FIG. 9C, it is possible to configure the stage side holding portion 91 to carry the substrate PB to a predetermined position of the suction table 41 while holding the substrate PB. However, in such a configuration, as shown in FIG. 12, it is necessary to move the stage side holding portion 91 to a position beyond the suction table 41 (upper side of the suction table in FIG. 12). As shown in FIG. 12, the device configuration may be such that a space is provided in a portion beyond the suction table 41, but in the present invention, the device space is provided as a magazine rack side holding section 96 in addition to the stage side holding section 91. We are trying to reduce the number of items.

図９（ｃ）のようにステージ側保持部９１を用いて基板ＰＢの一部を吸着テーブル４１方向に引いた状態から、図９（ｄ）のようにマガジンラック側保持部９６が、基板ＰＢのマガジンラック側の縁を保持し、ステージ側保持部９１は保持を解除して待機位置に移動する。その後は、図１０（ｅ）のようにマガジンラック側保持部９６が保持した基板ＰＢを吸着テーブル４１上の所定位置まで押して行く。 From the state where a part of the substrate PB is pulled toward the suction table 41 by using the stage side holding portion 91 as shown in FIG. 9 (c), the magazine rack side holding portion 96 is the substrate PB as shown in FIG. 9 (d). Holds the edge of the magazine rack side, and the stage side holding portion 91 releases the holding and moves to the standby position. After that, as shown in FIG. 10E, the substrate PB held by the magazine rack side holding portion 96 is pushed to a predetermined position on the suction table 41.

基板ＰＢが吸着テーブル４１上の所定位置に配置されたなら、図１０（ｆ）のようにマガジンラック側保持部９６は保持を解除して吸着テーブル４１上から離れる。その後、基板クランプ４３を構成する基板レール４３０は、図４（ｂ）のように、上面が吸着テーブル４１上面と同じ高さとなるように下降させる（あるいは吸着テーブル４１を上昇させる）。この状態から、吸着テーブル４１は基板ＰＢを吸着するとともに、基板ガイド４３１が下降して、基板レール４３０とともに基板ＰＢの側辺を挟み込み、基板ＰＢを吸着テーブル４１上に固定する。このように、基板レール４３０と基板ガイド４３１により、基板ＰＢの側辺を固定した状態で、吸着テーブル４１が吸着動作することで、基板ＰＢに若干の反り等の変形があったとしても、確実に全面吸着される。 When the substrate PB is arranged at a predetermined position on the suction table 41, the magazine rack side holding portion 96 releases the holding and separates from the suction table 41 as shown in FIG. 10 (f). After that, the substrate rail 430 constituting the substrate clamp 43 is lowered (or the suction table 41 is raised) so that the upper surface thereof is at the same height as the upper surface of the suction table 41 as shown in FIG. 4 (b). From this state, the suction table 41 sucks the substrate PB, the substrate guide 431 descends, sandwiches the side side of the substrate PB together with the substrate rail 430, and fixes the substrate PB on the suction table 41. In this way, the suction table 41 is suction-operated with the side sides of the board PB fixed by the board rail 430 and the board guide 431, so that even if the board PB is slightly warped or otherwise deformed, it is reliable. Is totally adsorbed on.

この後、基板ステージ４を構成するＸＹ駆動機構４２により、吸着テーブル４１とともに基板ＰＢを移動させながら、チップ部品供給機構６により供給されたチップ部品Ｃを自走ヘッド５が基板ＰＢ上に順次実装し、図１０（ｇ）のように実装済基板ＭＢが得られる。 After that, the self-propelled head 5 sequentially mounts the chip component C supplied by the chip component supply mechanism 6 on the substrate PB while moving the substrate PB together with the suction table 41 by the XY drive mechanism 42 constituting the substrate stage 4. Then, the mounted substrate MB is obtained as shown in FIG. 10 (g).

この後、実装済基板ＭＢを吸着テーブル４１上から搬送して、基板マガジンラックＭ１に収容する工程になる。 After that, the mounted substrate MB is conveyed from the suction table 41 and accommodated in the substrate magazine rack M1.

まず、基板ＰＢへのチップ部品Ｃの実装が完了し、実装済基板ＭＢが得られたら、吸着ステージ４１による吸着を解除し、基板レール４３０を上昇（あるいは吸着テーブル４１を下降）させるとともに、基板ガイド４３１を基板レール４３０に対して上昇させ、図４（ｃ）のように実装済基板ＭＢが基板レール４３０上をスライドできる状態とする。この状態において、基板レール４３０の上面は搬送レール９０の上面と等しくする。 First, when the mounting of the chip component C on the board PB is completed and the mounted board MB is obtained, the suction by the suction stage 41 is released, the board rail 430 is raised (or the suction table 41 is lowered), and the board is lowered. The guide 431 is raised with respect to the board rail 430 so that the mounted board MB can slide on the board rail 430 as shown in FIG. 4 (c). In this state, the upper surface of the substrate rail 430 is made equal to the upper surface of the transport rail 90.

この状態から、図１０（ｈ）のように、マガジンラック側保持部９６が実装済基板ＭＢの基板マガジンラック側の縁を保持し、図１１（ｉ）のようにマガジンラック側に引く。 From this state, the magazine rack side holding portion 96 holds the edge of the mounted substrate MB on the board magazine rack side as shown in FIG. 10 (h), and pulls it toward the magazine rack side as shown in FIG. 11 (i).

ところで、マガジンラック側保持部９６は、実装済基板ＭＢを基板マガジンラックＭ１の基板取り出し面の内側まで移動させることは出来ない。そこで、図１１（ｊ）のように、ステージ側保持部９１が実装済基板ＭＢのステージ側の縁を保持し、マガジンラック側保持部９６は保持を解除して待機位置に戻る。 By the way, the magazine rack side holding portion 96 cannot move the mounted substrate MB to the inside of the substrate take-out surface of the substrate magazine rack M1. Therefore, as shown in FIG. 11 (j), the stage-side holding portion 91 holds the stage-side edge of the mounted board MB, and the magazine rack-side holding portion 96 releases the holding and returns to the standby position.

その後、ステージ側保持部９１が実装済基板ＭＢを保持した状態で、マガジンラック側に押していき（図１１（ｋ））、実装済基板ＭＢを、基板マガジンラックＭ１の収容位置まで搬送する（図１１（ｌ））。 After that, with the stage-side holding portion 91 holding the mounted board MB, the mounted board MB is pushed toward the magazine rack side (FIG. 11 (k)), and the mounted board MB is conveyed to the accommodation position of the board magazine rack M1 (FIG. 11). 11 (l)).

その後は、図３（ｃ）に示したように基板マガジンラックＭ１から新たな基板ＰＢを取り出し、実装済基板ＭＢとして収容する動作を繰り返し、基板マガジンラックＭ１内の基板ＰＢ全てを実装済基板ＭＢとする。 After that, as shown in FIG. 3C, the operation of taking out a new board PB from the board magazine rack M1 and accommodating it as a mounted board MB is repeated, and all the board PBs in the board magazine rack M1 are mounted board MB. And.

以上のように、本発明の基板搬送機構９は、基板ＰＢ（および実装済基板ＭＢ）をレール上で直線的に移動する機構であり、基板ＰＢ（実装済基板ＭＢ）の縁の限られた範囲を保持しただけでも確実に搬送することが可能である。このため、基板ＰＢの外周付近までチップ部品が実装されていたとしても基板搬送を確実に実施することが出来る。 As described above, the substrate transfer mechanism 9 of the present invention is a mechanism for linearly moving the substrate PB (and the mounted substrate MB) on the rail, and the edge of the substrate PB (mounted substrate MB) is limited. It is possible to reliably transport even if the range is maintained. Therefore, even if the chip parts are mounted up to the vicinity of the outer periphery of the board PB, the board can be reliably transported.

ところで、図１２において、ステージ側保持部９１のみで基板ＰＢ（または実装済基板ＭＢ）を搬送する装置構成では、装置スペース的に不利である旨を既に記したが、図１３に示すようにステージ側保持部９１を設置したＺアーム９２にマガジンラック側保持部９６も設置する構成とすることは可能である。その構成を本実施形態の変形例として、図１３に示す。図１３（ａ）～図１３（ｄ）は、図９（ａ）～図９（ｄ）に示した状態を、変形例で実施した状態を示したものであり、同様に、図１０（ｅ）から図１１（ｌ）までの動作も変形例で実施可能である。 By the way, in FIG. 12, it has already been described that the device configuration in which the board PB (or the mounted board MB) is conveyed only by the stage side holding portion 91 is disadvantageous in terms of device space, but as shown in FIG. 13, the stage It is possible to configure the magazine rack side holding portion 96 to be installed on the Z arm 92 in which the side holding portion 91 is installed. The configuration is shown in FIG. 13 as a modified example of the present embodiment. 13 (a) to 13 (d) show a state in which the state shown in FIGS. 9 (a) to 9 (d) is carried out in a modified example, and similarly, FIG. 10 (e). ) To FIG. 11 (l) can also be carried out in the modified example.

以上の実施形態において、基板マガジンラックＭ１に収容された基板ＰＢを実装済基板ＭＢとして元の基板マガジンラックＭ１に戻しているが、実装済基板ＭＢを基板マガジンラックＭ１とは別のマガジンラックに収容することが望ましいケースもある。 In the above embodiment, the board PB housed in the board magazine rack M1 is returned to the original board magazine rack M1 as the mounted board MB, but the mounted board MB is placed in a magazine rack different from the board magazine rack M1. In some cases it is desirable to contain it.

例えば、一般的な基板マガジンラックは樹脂製であることが多いが、実装済基板ＭＢの後工程において熱処理等を行なう場合では、基板マガジンラックごとオーブンに入れることもある。このため、実装済基板ＭＢを収容する基板マガジンラックを金属製にするようなこともあり、基板マガジンラックＭ１とは別に実装済基板ＭＢを収容するための実装基板マガジンラックＭ２を別に設けることがある。 For example, a general substrate magazine rack is often made of resin, but when heat treatment or the like is performed in a post-process of the mounted substrate MB, the entire substrate magazine rack may be placed in an oven. Therefore, the board magazine rack for accommodating the mounted board MB may be made of metal, and the mounted board magazine rack M2 for accommodating the mounted board MB may be provided separately from the board magazine rack M1. be.

基板マガジンラックＭ１とは別に実装基板マガジンラックＭ２を設ける場合、図１４のように、基板マガジンラックＭ１、吸着テーブル４１、実装基板マガジンラックＭ２を直線状に配置する構成がある。しかし、図１４の構成では、基板マガジンラックＭ１から吸着テーブル４１までと、吸着テーブル４１から実装基板マガジンラックＭ２までの、２つの基板搬送機構が別に必要となり、その分のスペースも必要となる。 When the mounting board magazine rack M2 is provided separately from the board magazine rack M1, there is a configuration in which the board magazine rack M1, the suction table 41, and the mounting board magazine rack M2 are linearly arranged as shown in FIG. However, in the configuration of FIG. 14, two substrate transfer mechanisms, one from the substrate magazine rack M1 to the suction table 41 and the other from the suction table 41 to the mounting board magazine rack M2, are required separately, and the space for that is also required.

そこで、以下に、基板マガジンラックＭ１とは別の実装基板マガジンラックＭ２が必要な場合にも対応した、本発明の第二実施形態について説明する。 Therefore, the second embodiment of the present invention will be described below, which also corresponds to the case where a mounting board magazine rack M2 different from the board magazine rack M1 is required.

図１５は本発明の第二実施形態に係る実装装置１０１の該略図である。図１５において、図１の実装装置１と共通の記号については同一の機能を有するものであるが、実装装置１０１には実装基板マガジンラックＭ２とマガジンラック移動機構１０が付加されている。 FIG. 15 is a schematic view of the mounting device 101 according to the second embodiment of the present invention. In FIG. 15, the symbols common to the mounting device 1 of FIG. 1 have the same functions, but the mounting board magazine rack M2 and the magazine rack moving mechanism 10 are added to the mounting device 101.

実装装置１０１は、基板マガジンラックＭ１から基板ＰＢを取り出し、基板ＰＢに半導体チップ等のチップ部品Ｃを実装し、基板ＰＢの所定箇所にチップ部品Ｃを実装した実装済基板ＭＢを実装基板マガジンラックＭ２に収容するものである。実装基板マガジンラックＭ２も、基板マガジンラックＭ１と同じく４側面の中の１面は、実装済基板ＭＢの収容を行なう開口を有している（以下、実装済基板ＭＢの収容を行なう開口を有する面を実装基板収容面と記す）。 The mounting device 101 takes out the board PB from the board magazine rack M1, mounts the chip component C such as a semiconductor chip on the board PB, and mounts the mounted board MB on which the chip component C is mounted at a predetermined position on the board PB. It is to be accommodated in M2. Like the board magazine rack M1, one of the four side surfaces of the mounted board magazine rack M2 also has an opening for accommodating the mounted board MB (hereinafter, has an opening for accommodating the mounted board MB). The surface is referred to as the mounting board accommodating surface).

図１５の実装装置１０１において、基板マガジンラックＭ１の基板取り出し面と、実装基板マガジンラックＭ２の実装基板収容面とは、同一面上で同一方向を向いて並ぶように配置されている。また、マガジンラック移動機構１０は、実装ステージ４から基板搬送機構９に連なる直線上に、基板マガジンラックＭ１の基板取り出し面か、実装基板マガジンラックＭ２の実装基板収容面の何れかが配置されるよう、基板マガジンラックＭ１と実装基板マガジンラックＭ２を並べた方向に、基板マガジンラックＭ１および実装基板マガジンラックＭ２を移動させるものである。 In the mounting device 101 of FIG. 15, the board take-out surface of the board magazine rack M1 and the mounting board accommodating surface of the mounting board magazine rack M2 are arranged on the same surface so as to face in the same direction. Further, in the magazine rack moving mechanism 10, either the board take-out surface of the board magazine rack M1 or the mounting board accommodating surface of the mounting board magazine rack M2 is arranged on a straight line connected from the mounting stage 4 to the board transport mechanism 9. The board magazine rack M1 and the mounting board magazine rack M2 are moved in the direction in which the board magazine rack M1 and the mounting board magazine rack M2 are arranged side by side.

図１６（ａ）～図１６（ｄ）、図１７（ｅ）および図１７（ｆ）は実装装置１０１による基板ＰＢの搬送および実装基板ＭＢの搬送動作を説明する上面図である。図１６（ａ）と図１６（ｂ）は基板マガジンＭ１から基板ＰＢを引出す状態を示したものであり、基板搬送機構９の動作としては図９（ａ）と図９（ｂ）に示した実装装置１と同じである。この段階で、マガジンラック移動機構１０は、実装ステージ４から基板搬送機構９に連なる直線上に基板マガジンラックＭ１を配置している。 16 (a) to 16 (d), FIGS. 17 (e), and 17 (f) are top views illustrating the transfer operation of the substrate PB and the transfer operation of the mounting board MB by the mounting device 101. 16 (a) and 16 (b) show a state in which the substrate PB is pulled out from the substrate magazine M1, and the operation of the substrate transport mechanism 9 is shown in FIGS. 9 (a) and 9 (b). It is the same as the mounting device 1. At this stage, the magazine rack moving mechanism 10 arranges the board magazine rack M1 on a straight line connected from the mounting stage 4 to the board transport mechanism 9.

この後、実装装置１０１の基板搬送機構９も、実装装置１と同様に図９（ｃ）から図１０（ｆ）に示したように、基板ＰＢを吸着テーブル４１上に配置し、半導体チップＣを実装した実装済基板ＭＢを吸着テーブル４１から搬出するよう動作する。その際、マガジンラック移動機構１０は、実装済基板マガジンラックＭ２を実装ステージ４から基板搬送機構９に連なる直線上に配置するように動作する。すなわち、基板ＰＢのマガジンラック側が基板マガジンラックＭ１から出てから、実装済基板ＭＢのマガジンラック側が搬送レール９０上に存在している間に、マガジンラック移動機構１０は、実装済基板マガジンラックＭ２を実装ステージ４から基板搬送機構９に連なる直線上に配置する。このようにすることにより、図１６（ｃ）、（ｄ）に示すように、基板搬送機構９は実装基板マガジンラックＭ２の収容位置に実装済基板ＭＢを搬送することになる。なお、実装基板マガジンラックＭ２の収容位置への実装済基板ＭＢの収容が完了したならば、再び、実装ステージ４から基板搬送機構９に連なる直線上に基板マガジンラックＭ１を配置し（図１７（ｅ））、基板マガジンラックＭ１から基板ＰＢを引出す状態（図１６（ａ）と同じ）になる。以上の動作を、基板マガジンラックＭ１内の基板ＰＢがなくなるか、実装基板マガジンラックＭ２内が実装済基板ＭＢで満たされるまで続けることになる。 After that, as shown in FIGS. 9 (c) to 10 (f), the substrate transport mechanism 9 of the mounting apparatus 101 also arranges the substrate PB on the suction table 41 and semiconductor chip C. It operates so as to carry out the mounted board MB on which the above is mounted from the suction table 41. At that time, the magazine rack moving mechanism 10 operates so as to arrange the mounted board magazine rack M2 on a straight line connected to the board transport mechanism 9 from the mounting stage 4. That is, after the magazine rack side of the board PB comes out of the board magazine rack M1 and the magazine rack side of the mounted board MB exists on the transport rail 90, the magazine rack moving mechanism 10 uses the mounted board magazine rack M2. Is arranged on a straight line connected from the mounting stage 4 to the board transfer mechanism 9. By doing so, as shown in FIGS. 16C and 16D, the substrate transfer mechanism 9 transfers the mounted substrate MB to the accommodation position of the mounting substrate magazine rack M2. When the mounting of the mounted board MB in the housing position of the mounting board magazine rack M2 is completed, the board magazine rack M1 is arranged again on a straight line connected from the mounting stage 4 to the board transport mechanism 9 (FIG. 17 (FIG. 17). e)), the substrate PB is pulled out from the substrate magazine rack M1 (same as in FIG. 16A). The above operation is continued until the board PB in the board magazine rack M1 disappears or the mounting board magazine rack M2 is filled with the mounted board MB.

以上のように、第二実施形態は、基板マガジンラックＭ１とは別の実装基板マガジンラックＭ２が必要な場合においても、基板マガジンラックＭ１から吸着テーブル４１までの搬送と、吸着テーブル４１から実装基板マガジンラックＭ２までの搬送を１つの搬送機構で兼用するためスペース効率的に優れている。 As described above, in the second embodiment, even when a mounting board magazine rack M2 different from the board magazine rack M1 is required, the board magazine rack M1 transfers to the suction table 41 and the suction table 41 to the mounting board. Since the transport to the magazine rack M2 is also shared by one transport mechanism, it is excellent in space efficiency.

特に、実装基板ＰＢが長方形の場合、基板の長手方向を基板搬送方向（図１５におけるＹ方向）とすれば、マガジンラック移動機構１０による基板マガジンラックＭ１および実装基板マガジンラックＭ２の移動方向は、基板の短手方向であるため、移動距離が短くスペース的にも装置負荷的にも優れている。 In particular, when the mounting board PB is rectangular, if the longitudinal direction of the board is the board transport direction (Y direction in FIG. 15), the moving directions of the board magazine rack M1 and the mounting board magazine rack M2 by the magazine rack moving mechanism 10 are Since it is in the short direction of the board, the moving distance is short and it is excellent in terms of space and device load.

ところで、本発明は、図２０に示したような実装装置３０１に比べて、ローダ２１１もアンローダも不要であり、基板搬送に必要なスペースも僅かである。このため、複数の実装部を有する実装装置において、図１８に示す実装装置１０１や、図１９に示す実装装置２０２のような構成としても本発明は有効である。すなわち、図１９の実装装置２０２においても、実装部毎にマガジンラック移動機構（１０Ａ、同１０Ｂ）を必要とするものの、基板ＰＢ（および実装済基板ＭＢ）の搬送距離が短いため、図２１に示した実装装置３０２に比べて、装置のコンパクト化が図れる。 By the way, in the present invention, as compared with the mounting device 301 as shown in FIG. 20, neither the loader 211 nor the unloader is required, and the space required for transferring the substrate is small. Therefore, in a mounting device having a plurality of mounting units, the present invention is also effective as a configuration such as the mounting device 101 shown in FIG. 18 and the mounting device 202 shown in FIG. That is, even in the mounting device 202 of FIG. 19, although the magazine rack moving mechanism (10A, 10B) is required for each mounting unit, the transport distance of the board PB (and the mounted board MB) is short, so that FIG. 21 shows. Compared with the mounting device 302 shown, the device can be made more compact.

また、図２１のような実装装置３０２の場合、実装部３Ａで得た実装済基板ＭＢと、実装部３Ｂで得た実装済基板ＭＢが同じ実装基板マガジンラックＭ２に収容されているため、実装部３Ａと実装部３Ｂの機差の影響を後工程で考慮する必要が生じることがある。具体的には、実装基板マガジンラックＭ２に収容された実装済基板ＭＢが何れの実装部で実装されたものかを追跡しながら、必要に応じて後工程で、実装部毎に条件変更する場合がある。これに対して、図１８に示す実装装置１０１および図１９に示す実装装置２０２では、実装基板マガジンラックＭ２（図１８の実装装置２０１では基板マガジンラックＭ１）に収容されている実装済基板ＭＢの全てが何れかの実装部（実装部３Ａまたは実装部３Ｂ）に限定されるので、実装済基板ＭＢ単位で後工程の条件変更をするようなことが不要となる。
なお、ここまでの説明で、チップ部品Ｃは半導体チップであって、基板ＰＢは四角形状の例について説明してきたが、これに限定されるものではない。例えば、基板ＰＢがウェハ基板のような円形のものであってもよく、素材も樹脂、セラミックス、シリコン等の半導体の素材およびこれらの複合材から選んでよい。また、チップ部品Ｃも、半導体チップに限定されるものではなく、抵抗やキャパシタンスのような受動素子のチップであってもよい。 Further, in the case of the mounting device 302 as shown in FIG. 21, since the mounted board MB obtained by the mounting unit 3A and the mounted board MB obtained by the mounting unit 3B are housed in the same mounting board magazine rack M2, they are mounted. It may be necessary to consider the influence of the difference between the parts 3A and the mounting part 3B in a later process. Specifically, when the conditions are changed for each mounting unit in a later process while tracking which mounting section the mounted board MB housed in the mounting board magazine rack M2 is mounted. There is. On the other hand, in the mounting device 101 shown in FIG. 18 and the mounting device 202 shown in FIG. 19, the mounted board MB housed in the mounting board magazine rack M2 (the board magazine rack M1 in the mounting device 201 of FIG. 18) is Since everything is limited to any mounting unit (mounting unit 3A or mounting unit 3B), it is not necessary to change the conditions in the subsequent process for each mounted board MB.
In the above description, the chip component C is a semiconductor chip, and the substrate PB has a rectangular shape, but the present invention is not limited to this. For example, the substrate PB may be a circular one such as a wafer substrate, and the material may be selected from semiconductor materials such as resin, ceramics, and silicon, and composite materials thereof. Further, the chip component C is not limited to the semiconductor chip, and may be a chip of a passive element such as a resistor or a capacitance.

１ 実装装置
２ 架台
３ 実装部
４ 基板ステージ
５ 実装ヘッド
６ チップ部品供給機構
７ チップ部品ピックアップ手段
８ チップ部品搬送手段
９ 基板搬送機構
１０ マガジンラック移動機構
４１ 吸着テーブル
４２ ＸＹ駆動機構
４３ 基板クランプ
１０１ 実装装置
２０１ 実装装置
２０２ 実装装置
４３０ 基板レール
４３１ 基板ガイド
９０ 搬送レール
９１ ステージ側保持部
９２ Ｚアーム
９３ Ｘアーム
９４ スライドレール
９６ マガジンラック側保持部
９７ Ｚアーム
９８ Ｘアーム
９９ スライドレール
Ｃ チップ部品
Ｍ１ 基板マガジンラック
Ｍ２ 実装基板マガジンラック
ＭＢ 実装済基板
ＰＢ 基板 1 Mounting device 2 Mount 3 Mounting part 4 Board stage 5 Mounting head 6 Chip parts supply mechanism 7 Chip parts pick-up means 8 Chip parts transport means 9 Board transport mechanism 10 Magazine rack moving mechanism 41 Suction table 42 XY drive mechanism 43 Board clamp 101 mounting Equipment 201 Mounting equipment 202 Mounting equipment 430 Board rail 431 Board guide
90 Transport rail 91 Stage side holding part 92 Z arm 93 X arm 94 Slide rail 96 Magazine rack side holding part 97 Z arm 98 X arm 99 Slide rail C Tip parts
M1 board magazine rack M2 mounting board magazine rack MB mounted board PB board

Claims (6)

基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を前記基板マガジンラックに収容する実装装置であって、
実装ヘッドと基板ステージを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から前記基板マガジンラックの収容位置まで搬送する機能を有する基板搬送機構とを備え、
前記基板ステージが前記基板を吸着保持する吸着テーブルと前記吸着テーブルを基板面内方向に位置調整するＸＹ駆動機構と、上下方向に位置調整可能な基板レールと基板ガイドを用いて前記吸着テーブル上の前記基板の側辺を固定する基板クランプを有し、
前記基板搬送機構は、直線的な搬送レールと、前記搬送レールに沿った方向に移動可能で、前記基板または前記実装済基板を搬送対象として、前記搬送対象の搬送方向側の縁または搬送方向と反対側の縁の何れかを把持することが可能なアームを有し、
前記搬送対象を一方から他方に搬送する際に、前記アームが、前記搬送対象の搬送方向側の縁を保持して前記搬送レールに沿って引いて移動させた後に前記搬送方向と反対側の縁を保持して前記搬送レールに沿って押して移動させる機能を有した実装装置。 A mounting device that takes out a board housed in a board magazine rack, mounts chip components on the board, and then houses the mounted board on which the chip parts are mounted in the board magazine rack.
A mounting unit having a mounting head and a board stage, and mounting the chip components on the board arranged on the board stage by the mounting head.
A substrate transfer mechanism having a function of transporting the board in the accommodation position in the substrate magazine rack onto the substrate stage and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the substrate magazine rack. Equipped with
On the suction table, the substrate stage uses a suction table for sucking and holding the substrate, an XY drive mechanism for adjusting the position of the suction table inward in the substrate surface, and a substrate rail and a substrate guide whose position can be adjusted in the vertical direction. It has a substrate clamp that secures the sides of the substrate.
The substrate transport mechanism has a linear transport rail and is movable in a direction along the transport rail, with the substrate or the mounted substrate as a transport target and an edge or a transport direction on the transport direction side of the transport target. Has an arm capable of gripping any of the opposite edges,
When transporting the transport target from one side to the other, the arm holds the edge of the transport target on the transport direction side and pulls and moves it along the transport rail, and then the edge opposite to the transport direction. A mounting device having a function of holding and pushing and moving along the transport rail. 基板マガジンラックに収容された基板を取り出し、前記基板にチップ部品を実装してから、チップ部品が実装された実装済基板を実装基板マガジンラックに収容する実装装置であって、
前記基板マガジンラックの基板取り出し面と、前記実装基板マガジンラックの実装済基板収容面とを同一面上の同一方向にして並べた状態に配置して、前記基板マガジンラックと前記実装基板マガジンラックを並べた方向に移動させるマガジンラック移動機構と、
基板ステージと実装ヘッドとを有し、前記基板ステージ上に配置した前記基板に、前記実装ヘッドにより前記チップ部品を実装する実装部と、
前記基板マガジンラック内の収容位置にある前記基板を前記基板ステージ上に搬送する機能と、前記実装済基板を前記基板ステージ上から前記実装基板マガジンラックの収容位置まで搬送する機能を有する基板搬送機構とを備え、
前記基板ステージが前記基板を吸着保持する吸着テーブルと前記吸着テーブルを基板面内方向に位置調整するＸＹ駆動機構と、上下方向に位置調整可能な基板レールと基板ガイドを用いて前記吸着テーブル上の前記基板の側辺を固定する基板クランプを有し、
前記基板搬送機構は、直線的な搬送レールと、前記搬送レールに沿った方向に移動可能で、前記基板または前記実装済基板を搬送対象として、前記搬送対象の搬送方向側の縁または搬送方向と反対側の縁の何れかを把持することが可能なアームを有し、
前記搬送対象を一方から他方に搬送する際に、前記アームが、前記搬送対象の搬送方向側の縁を保持して前記搬送レールに沿って引いて移動させた後に前記搬送方向と反対側の縁を保持して前記搬送レールに沿って押して移動させる機能を有した実装装置。 It is a mounting device that takes out the board housed in the board magazine rack, mounts the chip components on the board, and then houses the mounted board on which the chip parts are mounted in the mounting board magazine rack.
The board magazine rack and the mounted board magazine rack are arranged so that the board take-out surface of the board magazine rack and the mounted board accommodating surface of the mounted board magazine rack are arranged side by side on the same surface in the same direction. A magazine rack moving mechanism that moves in the direction in which they are lined up,
A mounting unit having a board stage and a mounting head, and mounting the chip components on the board arranged on the board stage by the mounting head.
A board transfer mechanism having a function of transporting the board in the accommodation position in the substrate magazine rack onto the substrate stage and a function of transporting the mounted substrate from the substrate stage to the accommodation position of the mounting substrate magazine rack. And with
On the suction table, the substrate stage uses a suction table for sucking and holding the substrate, an XY drive mechanism for adjusting the position of the suction table inward in the substrate surface, and a substrate rail and a substrate guide whose position can be adjusted in the vertical direction. It has a substrate clamp that secures the sides of the substrate.
The substrate transport mechanism has a linear transport rail and is movable in a direction along the transport rail, with the substrate or the mounted substrate as a transport target and an edge or a transport direction on the transport direction side of the transport target. Has an arm capable of gripping any of the opposite edges,
When transporting the transport target from one side to the other, the arm holds the edge of the transport target on the transport direction side and pulls and moves it along the transport rail, and then the edge opposite to the transport direction. A mounting device having a function of holding and pushing and moving along the transport rail. 請求項１または請求項２に記載の実装装置であって、
前記基板搬送機構は、
前記基板を、前記基板マガジンラックから前記基板ステージ上まで、前記基板マガジンラックの基板取り出し面に対して直角方向に直線搬送する機能を有する実装装置。 The mounting device according to claim 1 or 2.
The substrate transfer mechanism is
A mounting device having a function of linearly transporting the substrate from the substrate magazine rack to the substrate stage in a direction perpendicular to the substrate take-out surface of the substrate magazine rack. 請求項１から請求項３のいずれかの請求項に記載の実装装置であって、
前記実装ヘッドに前記チップ部品を供給するチップ部品供給機構を更に備えた実装装置。 The mounting device according to any one of claims 1 to 3.
A mounting device further provided with a chip component supply mechanism for supplying the chip components to the mounting head. 請求項４記載の実装装置であって、
前記実装部を２つ備え、
前記実装部夫々と１対１で対応する前記基板搬送機構を備え、
前記チップ部品供給機構は、前記２つの実装部の間に配置され、２つの前記実装部夫々にチップ部品を供給する機能を有する実装装置。 The mounting device according to claim 4.
The two mounting parts are provided.
It is provided with the substrate transfer mechanism having a one-to-one correspondence with each of the mounting portions.
The chip component supply mechanism is a mounting device that is arranged between the two mounting portions and has a function of supplying chip components to each of the two mounting portions. 請求項１から請求項５の何れかに記載の実装装置であって、
前記基板クランプの前記基板ガイドが前記基板を前記基板ステージ上に搬送する際のガイドとしても機能する実装装置。 The mounting device according to any one of claims 1 to 5.
A mounting device in which the board guide of the board clamp also functions as a guide when transporting the board onto the board stage.
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