JP5334822B2 - Resin sealing device and resin sealing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for conveying a substrate before being sealed which has an irregular shape in the resin sealing of an electronic unit, a resin sealing apparatus using the jig, and a resin sealing method using the jig. <P>SOLUTION: The resin sealing apparatus used in the manufacturing of the electronic unit is equipped with a tray 7 on which the substrate 4 before being sealed is arranged, a preheating mechanism in which the tray 7 is arranged, a first transfer mechanism which transfers and arranges the tray 7 to/in the preheating mechanism, a resin-sealed mold having a cavity filled with a fluid resin, and a carry-in mechanism which carries and arranges the preheated substrate 4 before being sealed in the resin-sealed mold. A recess 39 corresponding to the projection 30 of the substrate 4 before being sealed is formed at the tray 7 and the recess 39 is aligned with the projection 30, and the substrate 4 before being sealed is arranged on the tray 7. A heater block 41 is installed in the preheating mechanism, and the upper surface of the pedestal-shaped part 42 of the heater block 41 which projects in the opening 47 of the tray 7 is contacted with the lower surface of the heat dissipation member 27 of the substrate 4 before being sealed. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a resin sealing device and a resin sealing method for an electronic unit having a special shape.

  In recent years, fields in which electronic units for control are used are expanding. In particular, in the field of transportation equipment, conventional machine control is being replaced by electronic control. As an electronic unit used for transportation equipment, an internal combustion engine control unit (Engine Control Unit) for controlling ignition timing, fuel injection, idle-up, limiter, and the like of the internal combustion engine was initially employed. Recently, the functions and control scale of electronic units for transportation equipment have been expanded, and electronic units are used in a wide range of fields such as drive systems, braking systems, and steering systems. Accordingly, in recent years, an electronic unit for transport equipment is called an electronic control unit (hereinafter referred to as “ECU”). Here, “transport equipment” is a generic term for equipment that has an engine such as an internal combustion engine, an electric motor, etc., and moves with a person or cargo.

  The outline of the structure of the ECU is as follows. First, passive elements such as resistors, capacitors, coils, crystal oscillators, semiconductor elements such as microcomputers, power ICs, sensors, connectors having plastic bodies, etc. on printed circuit boards (hereinafter referred to as “circuit boards” as appropriate) (The above-described components are hereinafter referred to as “components”). A plastic or metal cover (plastic lid or metal housing) is attached to the circuit board so as to cover a space in which a plurality of components are attached. Depending on the type of ECU, a heat radiating member such as a metal heat radiating plate is further attached (for example, see Non-Patent Document 1).

  By the way, the ECU is mounted in a place where the temperature environment, the vibration environment, and the like are good, that is, in a room inside the space in which the occupant rides. However, in recent years, the ECU is mounted near the control target for reasons such as reducing the amount of wire harness used to connect the control target and the ECU and reducing the weight of the transportation equipment by reducing the use amount. It has become. Here, in comparison with the room, the temperature environment, the vibration environment, and the like are often harsh for the ECU at the mounting location near the control target. Therefore, there is an increasing tendency for ECUs to be further required to have heat resistance and vibration resistance. In particular, in a place where an internal combustion engine control ECU (hereinafter referred to as “internal combustion engine control ECU”) is mounted, that is, in an engine room, the temperature environment, vibration environment, and the like are inferior compared to the room. In addition, since there is a possibility that water, oil or the like exists in the engine room, the internal combustion engine control ECU is also required to be waterproof and oil resistant.

  Under such trends, the conventional structure in which a cover is attached to a circuit board on which a plurality of components are mounted has become insufficient as a structure of the ECU. Therefore, a structure in which a sealing resin made of a cured resin typified by epoxy resin or silicone resin is formed on a circuit board (hereinafter referred to as “pre-sealing board”) on which a plurality of components are mounted is employed. It has come to be. In this case, with the exception of connectors and the like, the periphery of the plurality of components mounted on the circuit board is completely covered with the sealing resin. And in order to form sealing resin, the resin sealing technique used by the manufacturing process of a semiconductor package is employ | adopted (for example, refer patent document 1).

  Here, the planar shape of a printed circuit board, a lead frame or the like (hereinafter referred to as “circuit board or the like”) used in manufacturing a normal semiconductor package is a rectangle (including a square, the same applies hereinafter). Further, the dimensions of the circuit board and the like are standardized to some extent, the thickness is not greatly different, and the thickness itself is small. Therefore, the circuit board and the like can be preheated in a short time before the resin sealing step. Moreover, the planar shape of the resin sealing body in which the components mounted on the circuit board or the like are resin-sealed is also rectangular. Furthermore, the planar shape of the semiconductor package completed by dividing the resin sealing body into pieces is also rectangular. As a result, when manufacturing a wide variety of semiconductor packages, it is possible to use a thin magazine that accommodates an object made up of a circuit board or the like, a resin sealing body, and a semiconductor package.

JP 2007-243146 (Page 4-5)

Hirotaka Ueda, “Mounting Zoom-in (2)”, JPCA NEWS, Japan Electronic Circuits Association, December 2008, P.A. 22-P. 26

  However, when a resin sealing technique used for manufacturing a semiconductor package is employed in the manufacturing process of the ECU, the following problem occurs as compared with the case of manufacturing a normal semiconductor package. The problem is that a thin magazine cannot be used in the manufacturing process due to the size and shape of the pre-sealing substrate used in the ECU. In addition, since it takes a long time for the pre-sealing substrate to be preheated, the efficiency of the resin sealing process is limited. Another problem is that the sealing resin may be peeled off due to the occurrence of a temperature gradient in the preheated pre-sealing substrate.

  The factors that cause these problems are as follows. First, the dimensions and shape of the substrate before sealing vary depending on the model. Second, the pre-sealing substrate has a certain thickness. Third, the pre-sealing substrate has an irregular shape having protrusions caused by heat radiating members such as connectors and heat radiating plates, and the positions, dimensions, and shapes of these protrusions vary depending on the model. The term “irregular shape” as used herein refers to a shape in which at least one protrusion having a certain thickness is provided on a rectangular parallelepiped. Fourth, the pre-sealing substrate is made of a material having greatly different thermal conductivity, represented by a heat sink having high thermal conductivity and a connector having a main body made of plastic having low thermal conductivity. Yes.

  The present invention has been made to solve the above-described problems. In addition, the present invention provides a jig for transporting an unsealed substrate having an irregular shape in resin sealing of an electronic unit, and uses the jig to fasten the unsealed substrate for a short time. It is another object of the present invention to provide a resin sealing device and a resin sealing method in which preheating is performed with a temperature gradient as small as possible.

  Hereinafter, the reference numerals in parentheses in the descriptions of “means for solving the problems” and “effects of the invention” are described for the purpose of facilitating the comparison between the terms in the description and the components shown in the drawings. It is. Further, these symbols and the like do not mean that “the meaning of the terms in the description is limited to the components shown in the drawings”.

  In order to solve the above-mentioned problem, a resin sealing device according to the present invention includes a circuit board (26) and a pre-sealing board having a plurality of components (25) mounted on the circuit board (26). (4) is a resin sealing device used when manufacturing an electronic unit (6) by collectively sealing a plurality of components (25) with a resin, A preheating mechanism (14, 41) in which a tray (7) in which one or a plurality of 4) are arranged and a tray (7) in which one or a plurality of pre-sealing substrates (4) are arranged are arranged A first transfer mechanism (1) for transferring the tray (7) on which one or a plurality of pre-sealing substrates (4) are arranged to the preheating mechanism (14, 41) and arranging the tray (7) on the preheating mechanism (14, 41). 12) and a resin-sealed mold (17) having a cavity composed of a space filled with a fluid resin, and preheated A space including at least a carry-in mechanism (16) for carrying one or a plurality of pre-sealing substrates (4) to the resin-sealing mold (17) and arranging them at predetermined positions in the resin-sealing mold (17). One or a plurality of resin sealing bodies formed by resin-sealing one or a plurality of pre-sealing substrates (4) with a cured resin formed by curing a fluid resin filled in (5) is provided with a carry-out mechanism (19) for carrying out the resin-sealed mold (17), and the tray (7) is provided with a recess (39) corresponding to the shape of the substrate (4) before sealing. The pre-sealing substrate (4) and the recess (39) are aligned, and one or a plurality of pre-sealing substrates (4) are arranged on the tray (7). Opening so as to overlap at least a part of each of the one or more pre-sealing substrates (4). 47) is provided, and the preheating mechanism (14, 41) is provided with one or a plurality of platform portions (42) each containing the first heat generating means, and the preheating mechanism (14, 41) is provided. ) Is one or a plurality of pre-sealing substrates (4) arranged on the tray (7) by contacting the base portion (42) protruding at the opening (47) with the pre-sealing substrate (4). ) Are directly preheated.

  In the resin sealing device according to the present invention, in the above-described resin sealing device, the preheating mechanism (14) has one or more pre-sealing substrates (4), each of which is preheated. A second heat generating means (48) is provided, the second heat generating means (48) irradiates a specific place on the pre-sealing substrate (4) with infrared rays (49), and the specific place is a pre-sealing substrate ( 4), which is a boundary portion (33) between a portion having low thermal conductivity and a cured resin.

  In the resin sealing device according to the present invention, in the above-described resin sealing device, a plurality of preheating mechanisms (14, 41) are provided, and the tray (7) sequentially moves in the plurality of preheating mechanisms (14, 41). The tray (7) is arranged in each of the plurality of preheating mechanisms (14, 41).

  The resin sealing device according to the present invention includes a cooling mechanism (15) for cooling the tray (7) after one or a plurality of pre-sealing substrates (4) are taken out in the above-described resin sealing device. ), A second transfer mechanism (13) for transporting the tray (7) from which one or a plurality of pre-sealing substrates (4) have been taken out to the cooling mechanism (15), and a cooled tray ( 7) and a storage mechanism (11) that stores one or more pre-sealing substrates (4) on the tray (7) taken out from the storage mechanism (11). .

  In the resin sealing device according to the present invention, a plurality of cooling mechanisms (15) are provided in the above-described resin sealing device, and the tray (7) is arranged so as to move sequentially in the plurality of cooling mechanisms (15). Or the tray (7) is arranged in each of the plurality of cooling mechanisms (15).

  The resin sealing method according to the present invention uses a pre-sealing substrate (4) having a circuit board (26) and a plurality of components (25) mounted on the circuit board (26). A resin sealing method used for manufacturing an electronic unit (6) by collectively sealing a plurality of components (25) with a resin, and includes one or a plurality of pre-sealing substrates (4 And a tray (7) on which one or a plurality of pre-sealing substrates (4) are arranged are transferred to a preheating mechanism (14, 41) and a preheating mechanism is prepared. (14, 41), a step of preheating one or a plurality of pre-sealing substrates (4), and a preheating of one or a plurality of pre-sealing substrates (4) with resin sealing A step of carrying in the mold (17) and arranging it at a predetermined position in the resin-sealed mold (17); A step of immersing the plurality of components (25) in the fluid resin filled in the cavity, and a step of forming a cured resin by curing the fluid resin filled in the space including at least the cavity. A step of carrying out one or a plurality of resin sealing bodies (5) formed by resin-sealing one or a plurality of pre-sealing substrates (4) from the resin sealing mold (17); The tray (7) has a recess corresponding to the shape of the pre-sealing substrate (4), and the tray (7) has one or more pre-sealing substrates (4) in plan view. ) And an opening (47) overlapping at least a part of the preheating mechanism, and the preheating mechanism has one or a plurality of table-like portions (42) each containing the first heat generating means, and the step of arranging Then, the pre-sealing substrate (4) and the concave portion are aligned to provide one or a plurality of pre-sealing substrates. 4) is placed on the tray (7), and in the preheating step, the base portion (42) and the substrate (4) before sealing are brought into contact with each other to thereby bring one or more pieces arranged on the tray (7). Each of the pre-sealing substrates (4) is directly preheated.

  In addition, the resin sealing method according to the present invention is the above-described resin sealing method, wherein the preheating mechanism (14) includes one or a plurality of first preheated substrates (4). In the preheating step, the second heat generating means (48) irradiates a specific place on the pre-sealing substrate (4) with infrared rays (49), and the specific place is It is a boundary part (33) of the part with low heat conductivity in the board | substrate (4) before sealing, and cured resin, It is characterized by the above-mentioned.

  In the resin sealing method according to the present invention, in the above-described resin sealing method, the tray (7) is sequentially moved in the plurality of preheating mechanisms (14, 41) in the preheating step. Alternatively, the tray (7) is gradually heated by arranging the tray (7) in each of the plurality of preheating mechanisms (14, 41).

  Further, the resin sealing method according to the present invention is the above-described resin sealing method, wherein the tray (7) after one or a plurality of pre-sealing substrates (4) is taken out to the cooling mechanism (15). The step of transporting, the step of cooling the tray (7) after the one or more pre-sealing substrates (4) are taken out by the cooling mechanism (15), and the cooled tray (7) are stored. And a process.

  In the resin sealing method according to the present invention, in the above-described resin sealing method, in the cooling step, the plurality of cooling mechanisms (15) are arranged so as to sequentially move the tray (7), Alternatively, the tray (7) is gradually cooled by disposing the tray (7) in each of the plurality of cooling mechanisms (15).

  According to the present invention, one or a plurality of pre-sealing substrates (4) are provided on a tray (7) provided with a recess (39) corresponding to the shape of one or a plurality of pre-sealing substrates (4). ). The pre-sealing substrate (4) arranged on the tray (7) is pre-heated using the pre-heating mechanism (14, 41, 48). Furthermore, after carrying the preheated pre-sealing substrate (4) from the tray (7) to a predetermined position in the resin sealing mold (17), the pre-sealing substrate (4) is resin-sealed. Thereby, the substrate (4) before sealing can be conveyed and resin-sealed using the tray (7).

  Further, the pre-sealing substrate (4) disposed on the tray (7) is sequentially preheated using the preheating mechanism (14, 41, 48). Furthermore, the pre-sealing substrate (4) arranged on the tray (7) is sequentially preheated using a plurality of preheating mechanisms (14, 41, 48). Thus, the thermal shock applied to the pre-sealing substrate (4) can be suppressed, and the pre-sealing substrate (4) can be preheated in a short time and with a temperature gradient as small as possible.

  Further, by using the second heat generating means (48) provided in the preheating mechanism (14), the boundary portion (33) between the portion having low thermal conductivity and the cured resin in the pre-sealing substrate (4), Irradiate with infrared (49). Thereby, the temperature gradient in a boundary part (33) can be made still smaller, and the board | substrate (4) before sealing can be preheated.

  In addition, the cooling mechanism (15) is used to cool the tray (7) from which the pre-sealing substrate (4) is taken out, that is, the empty tray (7), and then the trays (7) are stored. Further, after the empty trays (7) are sequentially cooled using a plurality of cooling mechanisms (15) or after the empty trays (7) are cooled, the trays (7) are stored. Thus, the stored tray (7) can be cooled and circulated in a short time and used as a tray (7) for arranging a new pre-sealing substrate (4).

FIG. 1 (1) is a schematic plan view of a resin sealing device according to the present invention, and FIG. 1 (2) is a resin sealing mold of the resin sealing device formed by sealing the substrate before sealing with resin. It is a schematic plan view which shows a resin sealing body. 2 (1) and 2 (2) are a plan view and a front view, respectively, showing a pre-sealing substrate that is the object of the resin sealing method according to the present invention, and FIGS. 2 (3) and 2 (4) are the resin sealing method. FIG. 7 is a plan view and a front view showing the package completed by the steps of FIG. It is a fragmentary front sectional view which shows the state by which the board | substrate before sealing arrange | positioned at a tray is preheated. It is a fragmentary front sectional view which shows the state by which the tray which became empty is forcibly cooled.

  Embodiments of the present invention will be described below with reference to the drawings. Example 1 is an example relating to transporting a pre-sealing substrate using a tray and preheating the pre-sealing substrate being transported. The second embodiment is an embodiment related to forcibly cooling and circulating the tray.

  Example 1 of the resin sealing device and the resin sealing method according to the present invention will be described with reference to FIGS. FIG. 1 (1) is a schematic plan view of a resin sealing device according to the present invention, and FIG. 1 (2) is a resin sealing mold of the resin sealing device formed by sealing the substrate before sealing with resin. It is a schematic plan view which shows a resin sealing body. 2 (1) and 2 (2) are a plan view and a front view, respectively, showing a pre-sealing substrate that is the object of the resin sealing method according to the present invention, and FIGS. 2 (3) and 2 (4) are the resin sealing method. FIG. 7 is a plan view and a front view showing the package completed by the steps of FIG. FIG. 3 is a partial front sectional view showing a state in which the pre-sealing substrate disposed on the tray is preheated. In addition, in order to make it easy to understand, all figures are schematically omitted or exaggerated as appropriate.

  As shown in FIG. 1, the resin sealing device includes a pre-processing unit 1, a resin sealing unit 2, and a post-processing unit 3. The pretreatment unit 1 receives the pre-sealing substrate 4 from the previous process. The resin sealing unit 2 forms the resin sealing body 5 by resin sealing the pre-sealing substrate 4 received from the pretreatment unit 1. FIG. 1B is an enlarged view of part A in FIG. 1A, and shows four resin sealing bodies 5. The post-processing unit 3 performs predetermined post-processing on the resin sealing body 5 received from the resin sealing unit 2 to complete individual electronic unit packages 6, and pays out those packages 6.

  The tray 7 is a jig used when the pre-sealing substrate 4 is transported, and is a tray-like container in which the pre-sealing substrate 4 received from the previous process is disposed. Further, the tray 7 has a sufficient depth such that the pre-sealing substrate 4 is completely contained in the tray 7 in a state where the pre-sealing substrate 4 is accommodated (see FIG. 3). FIG. 1 shows an example in which four pre-sealing substrates 4 are arranged on one tray 7.

  The preprocessing unit 1 includes a receiving unit 8, a preheating unit 9, a tray cooling unit 10, and a tray storage unit 11. The receiving part 8 is a part for arranging the pre-sealing substrate 4 received from the previous process at a predetermined position in the tray 7. The preheating unit 9 is a part that receives the tray 7 from the receiving unit 8 and preheats the pre-sealing substrate 4 disposed on the tray 7. The tray cooling unit 10 is a part that cools the empty tray 7 after the preheated pre-sealing substrate 4 is transported to the resin sealing unit 2. The tray storage unit 11 is a part that stacks and stores the trays 7 that have been cooled to an appropriate temperature (for example, approximately near room temperature).

  The first transfer mechanism 12 is a transfer mechanism that transfers the tray 7 on which the four pre-sealing substrates 4 are arranged to the preheating unit 9. The second transfer mechanism 13 transfers the empty tray 7 to the tray storage unit 11 via the tray cooling unit 10 after the preheated pre-sealing substrate 4 is transferred to the resin sealing unit 2. This is a transfer mechanism. Each of the first transfer mechanism 12 and the second transfer mechanism 13 has a plurality of claw-shaped portions (not shown), and holds the tray 7 by hooking these claw-shaped portions on the tray 7. Transport.

  In the present embodiment, the preheating unit 9 is provided with three preheating mechanisms 14 along the X direction in FIG. The preheating mechanism 14 will be described later. Then, the tray 7 on which the four pre-sealing substrates 4 are arranged is sequentially moved onto the three preheating mechanisms 14 and sequentially arranged on the respective preheating mechanisms 14. As a result, the four pre-sealing substrates 4 arranged on the tray 7 can be gradually heated. Each preheating mechanism 14 directly preheats the pre-sealing substrate 4 disposed on the tray 7 without using the tray 7 by using a heater block, an infrared lamp, or the like. The tray cooling unit 10 is provided with three cooling mechanisms 15 along the X direction in FIG.

  The resin sealing unit 2 is provided with the following components. The first is a loading mechanism 16 that hooks and loads four preheated substrates 4 before sealing. The carry-in mechanism 16 carries four preheated substrates 4 before sealing into the resin sealing mold 17. Secondly, the resin-sealed mold 17 includes a pair of molds composed of an upper mold (not shown) and a lower mold 18 facing each other. Thirdly, there is an unloading mechanism 19 for hooking and unloading the four resin sealing bodies 5 respectively. The resin sealing die 17 may be constituted by an upper die (not shown) and a lower die 18, and may further be constituted so as to have an intermediate die. In the present embodiment, an example in which four pre-sealing substrates 4 are arranged on the lower mold 18 is shown.

  The resin sealing mold 17 is a molding mold for resin sealing using a known transfer molding technique. The components of the resin sealing mold 17 (not shown except for the lower mold 18) will be briefly described. The lower mold 18 is provided with a pot in which a resin material is stored and a plunger that is fitted in the pot so as to be movable up and down and presses the fluid resin. The upper mold includes a cal which is a space in which a fluid resin formed by melting a resin material flows, a runner which is a passage through which the fluid resin is transferred, and a cavity which is a space in which the fluid resin is filled. And are provided.

  The post-processing unit 3 is provided with the following components along the Y direction in FIG. First, the receiving unit 20 receives the resin sealing body 5 from the resin sealing unit 2. Secondly, the separation part 21 forms a package 6 of an individual electronic unit by separating unnecessary portions from the resin sealing body 5 (described later). The separation unit 22 is provided with a separation jig 22. Thirdly, there is a payout unit 23 that pays out four packages 6 to the next process. The dispensing unit 23 is provided with a dispensing pallet 24, and the package 6 accommodated in the dispensing pallet 24 is dispensed to the next process such as an appearance inspection process or a curing process by heating.

  Hereinafter, the pre-sealing substrate 4, the resin sealing body 5, and the package 6 will be described with reference to FIG. 1 (2) and FIG. First, the pre-sealing substrate 4 will be described with reference to FIG. As shown in FIGS. 2A and 2B, the pre-sealing substrate 4 includes a circuit board 26 on which a component 25 made of a semiconductor element, a sensor, a connector and the like is mounted, and a heat dissipation member made of a copper plate or the like. 27.

  A connector 28 for transmitting and receiving power and signals between the package 6 and the control unit of the transport device is attached to the circuit board 26. The connector 28 includes a pin 29 and a plastic housing (hereinafter referred to as “main body”). The connector 28 is attached to the circuit board 26 by pin 29 being soldered or press-fitted into the mounting hole of the circuit board 26. The connector 28 attached to the pre-sealing board 4 has a protrusion 30 that is a part that is gripped by the operator when the connector on the mating side (control unit side of the transport device) is inserted and removed, and the mating connector is dropped. And a protrusion 31 for preventing the above. Further, an end of the connector 28 on the side of the circuit board 26 becomes a boundary portion 33 between the package 6 and the sealing resin 32 included in the package 6.

  The heat dissipation member 27 also functions as an attachment member when attaching the completed package 6 to a transportation device. For this purpose, a mounting hole 34 is provided in the heat dissipation member 27.

  Next, the resin sealing body 5 is demonstrated with reference to FIG. 1 (2) and FIG. The resin sealing body 5 has a sealing resin 32 made of a cured resin. As shown in FIG. 2, the sealing resin 32 is formed so as to completely cover the pins 29 of the connector 28, the circuit board 26, and the component 25 mounted on the circuit board 26. Further, as shown in FIG. 1 (2), the resin sealing body 5 includes a cull portion 35 made of a cured resin formed in a cull and a runner (both not shown) of the resin sealing mold 17. And a runner portion 36. The cull part 35 and the runner part 36 together constitute an unnecessary resin 37.

  Next, the package 6 will be described with reference to FIGS. 2 (3) and (4). The package 6 shown in FIGS. 2 (3) and 2 (4) is completed by separating the unnecessary resin 37 from the resin sealing body 5 shown in FIG. 1 (2). A sealing resin 32 is formed on the package 6 so as to completely cover the pins 29 of the connector 28, the circuit board 26, and the component 25 mounted on the circuit board 26. The sealing resin 32 is made of, for example, a thermosetting resin such as an epoxy resin or a silicone resin. As a material constituting the sealing resin 32, a resin that satisfies characteristics required in terms of high temperature resistance, low temperature resistance, moisture resistance, insulation, mechanical strength, and the like is used. The sealing resin 32 is provided with a protrusion 38 for the purpose of ensuring mechanical strength.

  Hereinafter, the tray 7 and the preheating mechanism 14 for preheating the four pre-sealing substrates 4 arranged on the tray 7 will be described with reference to FIG.

  As shown in FIG. 3, the tray 7 is provided with a protrusion 30 included in the pre-sealing substrate 4 and a recess 39 corresponding to the main body of the connector 28 as the protrusion. Thereby, the protrusion 30 which the board | substrate 4 before sealing 4 has and the lower part of the main body of the connector 28 as a protrusion are accommodated in the recessed part 39, respectively. Further, a convex frame 40 is provided inside the tray 7 so that the pre-sealing substrate 4 is stably disposed and does not cause a positional shift after being disposed. Accordingly, the tray 7 is formed in conformity with the substrate 30 before sealing having the protrusion 30 and the main body of the connector 28 as the protrusion.

  As shown in FIG. 1, the preheating unit 9 is provided with three preheating mechanisms 14. As shown in FIG. 3, a heater block 41 is provided as a preheating mechanism 14 (see FIG. 1 (1)) of the preheating unit 9. In other words, the preheating unit 9 is provided with three heater blocks 41 as the preheating mechanism 14. Each heater block 41 has four platform portions 42 corresponding to the four pre-sealing substrates 4 respectively. Each of the table-like portions 42 is provided with heating means such as a cartridge heater (not shown). Therefore, each heater block 41 is provided with four platform portions 42 each having heating means so as to correspond to the four pre-sealing substrates 4. In FIG. 3, only one table-like portion 42 is shown, and the other table-like portions 42 are not shown.

  Each heater block 41 is fixed on a base member 43 of the preheating unit 9 (see FIG. 1). On the heater block 41, a heat insulating plate 44 made of a fluororesin having a low thermal conductivity is provided. An opening 45 is provided in the heat insulating plate 44, and the base portion 42 of the heater block 41 projects from the opening 45. On the heat insulating plate 44, a frame-shaped or a plurality of columnar spacers 46 are provided. In a state where the tray 7 on which the pre-sealing substrate 4 is disposed is disposed in the preheating unit 9 (see FIG. 1), the base portion 42 passes through the opening 45 of the heat insulating plate 44 and the opening 47 of the tray 7. Protruding. And the upper surface of the base-like part 42 contacts the lower surface of the heat radiating member 27 which the board | substrate 4 before sealing has.

  With the above configuration, the following actions and effects occur in a state where the tray 7 on which the pre-sealing substrate 4 is disposed is disposed on the preheating portion 9. First, the heater block 41 and the tray 7 are thermally insulated by the heat insulating plate 44 and the spacer 46. Here, “the heater block 41 and the tray 7 are thermally insulated” means that the heat conduction between the heater block 41 and the tray 7 excludes the heat conduction in the vicinity of the base portion 42 of the heater block 41. Is small enough to be ignored. Secondly, the heat generated by the heater block 41 is directly conducted to the pre-sealing substrate 4 through the base portion 42 and the heat radiating member 27 sequentially. Third, the substrate 4 before sealing is gradually heated by the three heater blocks 41. Thus, the pre-sealing substrate 4 is directly and gradually heated by the heater block 41 without using the tray 7. Therefore, before the resin sealing, the pre-sealing substrate 4 is preheated to a sufficient temperature efficiently and without receiving a thermal shock. In addition, the connector 28 having a main body made of a plastic having low thermal conductivity is gradually heated. As a result, the temperature gradient is reduced at the boundary 33 between the sealing resin 32 (see FIG. 2) and the main body of the connector 28. Therefore, since the adhesiveness between the sealing resin 32 and the connector 28 is improved, peeling of the sealing resin 32 is suppressed.

  Moreover, in the preheating part 9 of FIG. 1, as FIG. 3 shows, it is preferable to further provide the infrared lamp 48 above the board | substrate 4 before sealing as another preheating mechanism 14. As shown in FIG. First, the position where the infrared lamp 48 is arranged is the true position of the boundary portion 33 between the connector 28 and the sealing resin 32 (see FIG. 2) that should be formed after the pre-sealing substrate 4 is preheated. It is preferable that it is above. Thus, since the infrared ray 49 emitted from the infrared lamp 48 irradiates the boundary portion 33, the connector 28 in the boundary portion 33 is heated in a non-contact manner. Accordingly, the pre-sealing substrate 4 is sent out from the preheating portion 9 (see FIG. 1) in a state where the boundary portion 33 in the connector 28 is sufficiently preheated.

  Secondly, the position where the infrared lamp 48 is disposed is preferably on the last preheating mechanism 14 in the preheating unit 9, that is, on the preheating mechanism 14 closest to the resin sealing unit 2. Thereby, the boundary part 33 in the connector 28 is preheated at the position closest to the resin sealing unit 2 in the preheating part 9.

  By disposing the infrared lamp 48 at a position that satisfies these two conditions, the temperature gradient at the boundary portion 33 between the connector 28 and the sealing resin 32 is further reduced immediately before resin sealing. Thereby, the adhesiveness between the main body of the connector 28 and the sealing resin 32 can be further improved. Therefore, peeling between the main body of the connector 28 and the sealing resin 32 can be further suppressed (see FIGS. 2 (3) and (4)).

  Hereinafter, the resin sealing method according to the present embodiment will be described with reference to FIGS. First, as shown in FIG. 1, a plurality of trays 7 prepared to match the substrate 4 before sealing are prepared. These trays 7 are stacked on the tray storage unit 11 and arranged.

  Next, as shown in FIG. 1, one tray 7 is transferred from the tray storage unit 11 to the receiving unit 8. In this step, the operator may transfer the tray 7 or use an appropriate transfer means.

  Next, four pre-sealing substrates 4 are arranged on the tray 7. Here, the protrusion 30 and the connector 28 main body as the protrusion each of the substrate 4 before sealing and the concave portion 39 of the tray 7 are aligned, and the four substrates 4 before sealing are respectively arranged on the tray 7. In this step, the operator may arrange the four pre-sealing substrates 4 on the tray 7 or may use an appropriate arrangement means for clamping and arranging the four pre-sealing substrates 4. .

  A plurality of trays 7 each having four pre-sealing substrates 4 arranged in advance may be stacked on the tray storage unit 11. In this case, one tray 7 on which the four pre-sealing substrates 4 are arranged is transferred from the tray storage unit 11 to the receiving unit 8. Alternatively, one tray 7 on which the four pre-sealing substrates 4 are arranged may be transferred from the previous process to the receiving unit 8.

  Next, using the first transfer mechanism 12, the tray 7 on which the four pre-sealing substrates 4 are arranged is transferred to the preheating unit 9 having the three preheating mechanisms 14. As shown in FIG. 3, the preheating unit 9 is provided with a heater block 41 as the preheating mechanism 14. And the number of the preheating mechanism 14, ie, the heater block 41, is three (refer FIG. 1). Then, the first transfer mechanism 12 is used to sequentially transfer the trays 7 on which the four pre-sealing substrates 4 are arranged on the three heater blocks 41. As a result, the four pre-sealing substrates 4 arranged on the tray 7 are gradually heated.

  Further, in at least one of the three preheating mechanisms 14, an infrared lamp 48 is used to irradiate the boundary portion 33 of the connector 28 with the infrared ray 49 (see FIG. 3). Thereby, the boundary part 33 in the connector 28 having a main body made of a plastic having low thermal conductivity is preheated.

  Next, the tray 7 on which the four preheated substrates 4 are arranged is transferred from the preheating unit 9 to the tray cooling unit 10 using an appropriate transfer mechanism.

  Next, the preheated four pre-sealing substrates 4 are taken out from the tray 7 using the carry-in mechanism 16. Then, these pre-sealing substrates 4 are carried to a predetermined position in the lower mold 18 and arranged.

  Next, the arranged pre-sealing substrate 4 is fixed to the mold surface of the lower mold 18. Then, by clamping the resin sealing die 17, the component 25 (see FIG. 2) mounted on the upper surface of the pre-sealing substrate 4 is placed in a cavity (not shown) provided in the upper die (not shown). Accommodate. Thereafter, the cavity is filled with a fluid resin (not shown).

  Next, the fluid resin is cured while the resin sealing mold 17 is still clamped. Thereby, a cured resin including the sealing resin 32 and the unnecessary resin 37 is formed (see FIG. 1B).

  Next, the resin sealing mold 17 is opened. Then, using the carry-out mechanism 19, the four resin sealing bodies 5 are carried out from the resin sealing unit 2 to the receiving portion 20 of the post-processing unit 3.

  Next, the four resin sealing bodies 5 are transferred from the receiving unit 20 to the separating unit 21 using an appropriate transfer mechanism. And in the separation part 21, the unnecessary resin 37 (refer FIG. 1 (2)) is isolate | separated from each resin sealing body 5 using the jig | tool 22 for isolation | separation. This separation is performed by a known method called gate cut or degate. By this process, four packages 6 are completed from the four resin sealing bodies 5.

  Next, using an appropriate transfer mechanism, the four packages 6 are transferred from the separation unit 21 to the discharge unit 23 and accommodated in the discharge pallet 24. Then, the package 6 accommodated in the dispensing pallet 24 is dispensed to the next process such as an appearance inspection process or a curing process by heating.

  Through the steps so far, the pre-sealing substrate 4 received from the previous step is placed on the tray 7, and the resin-sealed substrate 4 is resin-sealed by using the resin-sealing mold 17 to form the resin sealing body 5. The package 6 can be completed by forming and separating the unnecessary resin 37 from the resin sealing body 5.

  According to the present embodiment, by using the tray 7 suitable for the pre-sealing substrate 4 having an irregular shape, the pre-sealing substrate 4 is stably carried to the resin sealing mold 17. Therefore, the pre-sealing substrate 4 having an irregular shape can be stably conveyed using the tray 7.

  Further, the substrate 4 before sealing is directly and gradually heated by the plurality of heater blocks 41 until the substrate 4 before sealing is carried into the resin sealing mold 17. Therefore, the pre-sealing substrate 4 can be preheated to a sufficient temperature efficiently and without giving a thermal shock. Further, the connector 28 having a main body made of a plastic having low thermal conductivity is gradually heated. Accordingly, the temperature gradient is reduced at the boundary portion 33 between the sealing resin 32 (see FIG. 2) and the main body of the connector 28. Therefore, since the adhesiveness between the sealing resin 32 and the connector 28 is improved, peeling of the sealing resin 32 can be suppressed.

  In addition, the infrared lamp 48 can be used to sufficiently heat the boundary portion 33 in the connector 28 having a main body made of plastic having low thermal conductivity. This further reduces the temperature gradient at the boundary portion 33 between the connector 28 and the sealing resin 32 immediately before resin sealing. Accordingly, since the adhesion between the main body of the connector 28 and the sealing resin 32 is further improved, the separation between the main body of the connector 28 and the sealing resin 32 can be further suppressed.

  FIG. 1 (1) shows an example in which two resin sealing units 2 are provided in the resin sealing device. Here, one resin sealing unit 2 can be attached to and detached from any of the pretreatment unit 1, another resin sealing unit 2, and the posttreatment unit 3. preferable. According to this, the resin sealing device can be configured by mounting one or a plurality of resin sealing units 2 between the pre-processing unit 1 and the post-processing unit 3. Thus, even after the resin sealing device is installed in the user's manufacturing factory, the number of resin sealing units 2 can be easily increased or decreased according to the increase in demand, the user's product strategy, or the like. Therefore, the manufacturing capability of the resin sealing device can be easily adjusted.

  Further, the case where the four pre-sealing substrates 4 are arranged on one tray 7 has been described. Not limited to this, the number of the pre-sealing substrates 4 arranged on one tray 7 may be one or a plurality other than four according to the size / shape of the pre-sealing substrate 4.

  Further, one tray 7 on which four pre-sealing substrates 4 are arranged is transferred to one preheating mechanism 14 and preheated. Not limited to this, a plurality of trays 7 can be simultaneously transferred to one preheating mechanism 14 and preheated. For example, two trays 7 each having two pre-sealing substrates 4 arranged thereon may be set as one set, and the set may be simultaneously transferred to one preheating mechanism 14 and preheated.

  In addition, in the step of resin-sealing the substrate 4 before sealing, a fluid resin formed by melting a resin material in a pot (not shown) is passed through a cavity (not shown) via a runner (not shown). ) To fill and fill, that is, transfer molding. Not limited to this, injection molding or compression molding may be used.

  When compression molding is used, a cavity is provided in the lower mold 18 and resin sealing is performed as follows. First, a resin material such as powder, granule, or sheet is supplied to the cavity. Next, the resin material is melted by heating to produce a fluid resin. As a result, the cavity is filled with the fluid resin. Next, by clamping the resin mold, the component 25 mounted on the lower surface of the pre-sealing substrate 4 fixed to the upper mold is immersed in the fluid resin filled in the cavity. Next, the curable resin is formed by subsequently heating and curing the fluid resin. The resin sealing body 5 is formed by the steps so far. In addition, you may supply resin (liquid resin) which is liquid at normal temperature to a cavity. Also by this method, the cavity can be filled with the fluid resin.

  In this embodiment, an example in which three preheating mechanisms 14, that is, three heater blocks 41 are provided has been described. However, the present invention is not limited to this, and one preheating mechanism 14 may be provided, or a plurality other than three may be provided. The number of the preheating mechanisms 14 can be appropriately determined in relation to the target temperature to be heated, the processing speed at which the resin sealing unit 2 performs resin sealing, and the like.

  Further, the infrared lamp 48 is arranged on the last preheating mechanism 14 (heater block 41) in the preheating unit 9. Not only this but the infrared lamp 48 may be arrange | positioned on the several preheating mechanism 14 including the last preheating mechanism 14, respectively. Further, when a sufficient space for arranging the infrared lamp 48 on the last preheating mechanism 14 cannot be obtained, the infrared lamp 48 is placed on the preheating mechanism 14 as close as possible to the last preheating mechanism 14 in the preheating unit 9. May be arranged.

  Further, while the tray 7 on which the pre-sealing substrate 4 is arranged is preheated, the identification information (ID information) relating to each pre-sealing substrate 4 is read, and the identification information is sent to the resin sealing device or the post-process. The step of transmitting to the control unit of the semiconductor manufacturing apparatus in FIG. In this case, a two-dimensional code or the like previously marked on the circuit board 26 may be read using a reading sensor. Further, based on the ID information transmitted to the control unit of the semiconductor manufacturing apparatus in the subsequent process, a laser or the like is used on the surface of the main body of the connector 28 or the sealing resin 32 after resin sealing, It is also possible to mark a symbol or the like. Further, the package 6 can be inspected based on the ID information transmitted to the control unit of the semiconductor manufacturing apparatus in the subsequent process.

  Example 2 of the resin sealing device and the resin sealing method according to the present invention will be described with reference to FIG. 1 and FIG. FIG. 4 is a partial front sectional view showing a state in which the empty tray is forcibly cooled.

  As shown in FIG. 1, after the preheated pre-sealing substrate 4 is conveyed to the resin sealing unit 2, the tray 7 that has been emptied after the preheated pre-sealing substrate 4 is taken out is replaced with a tray cooling unit 10. It cools using the three cooling mechanisms 15 provided in this. The three cooling mechanisms 15 are each provided with empty trays 7. Then, the second transfer mechanism 13 is used to sequentially transfer and arrange the tray 7 to each cooling mechanism 15.

  As shown in FIG. 4, the cooling mechanism 15 is provided with a net-like, slat-like, or lattice-like holding member 50 having an opening of an appropriate size and shape. A gas injection nozzle 51 is disposed at least above or below the holding member 50. FIG. 4 shows an example in which the nozzles 51 are arranged both above and below. The holding member 50 and the nozzle 51 together constitute the cooling mechanism 15. The tray 7 is disposed on the holding members 50. A circular opening is provided at the tip of the nozzle 51. Further, at the tip of the nozzle 51, an elongated rectangular opening extending between the near side and the far side in FIG. 4 may be provided.

  One nozzle 51 may be arranged above or below one tray 7 according to the size and shape of the tray 7. Further, as shown in FIG. 4, a plurality of nozzles 51 may be arranged above or below one tray 7 according to the size and shape of the tray 7. Further, as shown in FIG. 4, the nozzles 51 are preferably disposed both above and below the tray 7.

  In this embodiment, the nozzles 51 are used to inject the gas 52 toward the tray 7 from above and below the holding member 50. As a result, the emptied trays 7 are forcibly cooled sequentially (air cooled). Then, the emptied tray 7 is transferred to the tray storage unit 11 in a state where the emptied tray 7 is cooled to an appropriate temperature (for example, nearly room temperature).

  According to the present embodiment, when the four pre-sealing substrates 4 are preheated, the trays 7 preheated together are sequentially forcibly cooled using the three cooling mechanisms 15. As a result, the emptied tray 7 is cooled to the tray storage unit 11 after being cooled in a short time. Therefore, since the tray 7 can be circulated in a short time between the receiving portion 8 and the tray storage portion 11, the pre-sealing substrate 4 can be efficiently resin-sealed using a small number of trays 7. it can.

  In addition, as the gas 52 injected toward the tray 7, a gas used in the semiconductor manufacturing process, such as compressed air, is used. Moreover, the gas 52 injected toward the tray 7 may be at room temperature or may be cooled. When the cooled gas is used, the empty tray 7 can be cooled in a shorter time.

  In the description so far, in Example 1, the tray is gradually heated by sequentially moving the tray to the plurality of preheating mechanisms. However, the present invention is not limited to this, and the trays may be sequentially arranged in the plurality of preheating mechanisms, and the trays may be sequentially carried out from the sufficiently preheated trays. In the second embodiment, the tray is gradually cooled by sequentially moving the tray to a plurality of cooling mechanisms. However, the present invention is not limited to this, and the trays may be sequentially arranged in the plurality of cooling mechanisms, and the trays may be sequentially transported from the sufficiently cooled trays. In these cases, a so-called first-in first-out (FIFO) method, in which the first placed tray is first taken out, can be employed.

  In the above, the Example which applies this invention to manufacture of the electronic unit for transport equipment was demonstrated. However, the present invention can be applied to the case where an electronic unit is manufactured by resin-sealing a pre-encapsulation substrate having an irregular shape.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

DESCRIPTION OF SYMBOLS 1 Pre-processing unit 2 Resin sealing unit 3 Post-processing unit 4 Pre-sealing board | substrate 5 Resin sealing body 6 Package (electronic unit)
7 tray 8 receiving part 9 preheating part 10 tray cooling part 11 tray storage part (storage mechanism)
DESCRIPTION OF SYMBOLS 12 1st transfer mechanism 13 2nd transfer mechanism 14 Preheating mechanism 15 Cooling mechanism 16 Loading mechanism 17 Resin sealing type 18 Lower mold 19 Unloading mechanism 20 Receiving part 21 Separating part 22 Separation jig (separating mechanism)
DESCRIPTION OF SYMBOLS 23 Discharge part 24 Discharge pallet 25 Parts 26 Circuit board 27 Radiation member 28 Connector 29 Pin 30, 31, 38 Protrusion 32 Sealing resin 33 Boundary part 34 Mounting hole 35 Cal part 36 Runner part 37 Unnecessary resin 39 Concave part 40 Frame 41 Heater Block (preheating mechanism)
42 Base part 43 Base member 44 Heat insulation plate 45, 47 Opening 46 Spacer 48 Infrared lamp (preheating mechanism)
49 Infrared 50 Holding member (cooling mechanism)
51 nozzle (cooling mechanism)
52 Gas

Claims (10)

Used when manufacturing an electronic unit by using a pre-sealing substrate having a circuit board and a plurality of components mounted on the circuit board, and sealing the plurality of components together with resin. A resin sealing device,
A tray on which one or a plurality of the substrates before sealing are arranged;
A preheating mechanism in which the tray on which one or a plurality of the pre-sealing substrates are arranged is arranged;
A first transfer mechanism for transferring the tray on which one or a plurality of the pre-sealing substrates are arranged to the preheating mechanism and arranging the tray on the preheating mechanism;
A resin-sealed mold having a cavity composed of a space filled with a fluid resin;
A carry-in mechanism for carrying in one or a plurality of pre-sealed pre-sealing substrates to the resin-sealed mold and arranging them at predetermined positions in the resin-sealed mold;
One or a plurality of one or a plurality of pre-sealing substrates formed by resin sealing with a cured resin formed by curing the fluid resin filled in a space including at least the cavity. An unloading mechanism for unloading the resin sealing body from the resin sealing mold,
The tray is provided with a recess corresponding to the shape of the substrate before sealing,
The pre-sealing substrate and the recess are aligned and one or a plurality of the pre-sealing substrates are arranged on the tray,
The tray is provided with an opening so as to overlap at least a part of one or a plurality of the pre-sealing substrates in plan view,
The preheating mechanism is provided with one or a plurality of trapezoidal portions each incorporating a first heating means,
The preheating mechanism directly preheats one or a plurality of the pre-sealing substrates disposed on the tray by bringing the base portion protruding at the opening into contact with the pre-sealing substrate. A resin sealing device. The resin sealing device according to claim 1,
The preheating mechanism is provided with one or a plurality of second heating means for preheating one or a plurality of the pre-sealing substrates, respectively.
The second heat generating means irradiates a specific place on the substrate before sealing with infrared rays,
The specific location is a boundary portion between a portion having low thermal conductivity in the pre-sealing substrate and the cured resin. The resin sealing device according to claim 1 or 2,
A plurality of the preheating mechanisms are provided, and the trays are arranged so as to sequentially move in the plurality of preheating mechanisms, or the trays are arranged in the plurality of preheating mechanisms, respectively. Stop device. The resin sealing device according to any one of claims 1 to 3,
A cooling mechanism for cooling the tray after one or a plurality of the pre-sealing substrates are taken out;
A second transfer mechanism for transferring the tray after one or a plurality of the pre-sealing substrates have been taken out to the cooling mechanism;
A storage mechanism for storing the cooled tray,
One or more pre-sealing substrates are arranged on the tray taken out from the storage mechanism. The resin sealing device according to claim 4,
A plurality of the cooling mechanisms are provided, and the trays are arranged so as to sequentially move in the plurality of cooling mechanisms, or the trays are arranged in the plurality of cooling mechanisms, respectively. Stop device. Used when manufacturing an electronic unit by using a pre-sealing substrate having a circuit board and a plurality of components mounted on the circuit board, and sealing the plurality of components together with resin. A resin sealing method,
Preparing a tray on which one or a plurality of the pre-sealing substrates are arranged;
Transferring the tray on which one or a plurality of the pre-sealing substrates are arranged to a preheating mechanism and arranging the tray on the preheating mechanism;
Preheating one or a plurality of the pre-sealing substrates;
Carrying one or a plurality of preheated pre-sealing substrates to a resin-sealed mold and disposing them at predetermined positions in the resin-sealed mold;
A step of immersing the plurality of parts in a fluid resin filled in a cavity provided in the resin-sealed mold; and
Curing the fluid resin filled in a space including at least the cavity to form a cured resin;
A step of carrying out one or a plurality of resin sealing bodies formed by resin-sealing one or a plurality of the pre-sealing substrates from the resin sealing mold,
The tray has a recess corresponding to the shape of the substrate before sealing,
The tray has an opening that overlaps at least a part of one or a plurality of the pre-sealing substrates in plan view,
The preheating mechanism has one or a plurality of trapezoidal portions each incorporating a first heat generating means,
In the step of arranging, the pre-sealing substrate and the recess are aligned, and one or a plurality of the pre-sealing substrates are arranged on the tray,
In the preheating step, one or a plurality of the pre-sealing substrates arranged on the tray are directly preheated by bringing the platform portion and the pre-sealing substrate into contact with each other. Sealing method. A resin sealing method according to claim 6,
The preheating mechanism includes one or a plurality of second heat generating means for preheating one or a plurality of the pre-sealing substrates, respectively.
In the preheating step, the second heat generating means irradiates a specific place on the pre-sealing substrate with infrared rays,
The resin sealing method, wherein the specific place is a boundary portion between the portion having low thermal conductivity in the substrate before sealing and the cured resin. A resin sealing method according to claim 6 or 7,
In the preheating step, the trays are sequentially moved by the plurality of preheating mechanisms provided, or the trays are gradually heated by respectively arranging the trays in the plurality of preheating mechanisms. Resin sealing method characterized by carrying out. A resin sealing method according to any one of claims 6 to 8,
Transporting the tray after the one or more pre-sealing substrates are taken out to a cooling mechanism;
Cooling the tray after one or a plurality of the pre-sealing substrates are taken out by the cooling mechanism;
And a step of storing the cooled tray. The resin sealing method according to claim 9,
In the cooling step, the plurality of cooling mechanisms are arranged so that the trays are sequentially moved, or the trays are gradually cooled by arranging the trays in the plurality of cooling mechanisms, respectively. Resin sealing method characterized by carrying out.

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