JP2019030971A - Resin molding device and method of producing resin molded article - Google Patents

Abstract

To provide a resin molding device capable of preventing warpage of a resin molded article from occurring.SOLUTION: A resin molding device 10 of this invention configured to perform resin molding by sealing a molding target article with thermosetting resin comprises: a molding die 111 configured of a first die (a lower die 1111) provided with a cavity and a second die (an upper die 1112) including a molding target article mounting part that mounts the molding target article; a molding die heating mechanism (a molding die heater 112) that heats the molding die 111 to a temperature within a temperature range where the thermosetting resin is set; a temperature maintaining room 13 that stores an intermediate molded article M composed of the thermosetting resin that is formed by the molding die 111 and is not yet completely set and maintains the temperature within the temperature range; and an intermediate molded article transport mechanism (a first transport mechanism 12) that transports the intermediate molded article M from the molding die 111 to the temperature maintaining room 13 while maintaining the temperature higher than a room temperature and equal to or lower than an upper limit of the temperature range.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding device and a resin molded product manufacturing method using the resin molding device.

  In order to protect an electronic component from an environment such as light, heat, and moisture, the electronic component is generally sealed with a resin. For the resin sealing, a resin molding method such as a compression molding method or a transfer molding method is used. In the compression molding method, a mold composed of a lower mold and an upper mold is used, a resin material is supplied to the cavity of the lower mold, a molding object is attached to the upper mold, and then the lower mold is softened or melted. Resin molding is performed by clamping the two while heating the mold and the upper mold. In the transfer molding method, a cavity is provided in one of the upper mold and the lower mold, a molding object is attached to the other, the both molds are clamped while heating the lower mold and the upper mold, and the resin is placed in the cavity with a plunger. Resin molding is performed by supplying.

  In general during resin molding, resin cures to the extent that it can maintain its shape within several tens of seconds to several minutes after the start of mold clamping, but it takes several hours to several tens of hours until it is completely cured. It is necessary to maintain the temperature within. Therefore, in the mold, the mold is opened when the resin is cured to such an extent that the shape can be maintained, and an intermediate molded product made of the molding object and the resin that has not been completely cured is taken out and after-curing (or post-curing). ) To produce a resin molded article made of a molded object and a completely cured resin (for example, Patent Document 1). In the after-curing process, first, the taken intermediate molded product is conveyed into a temperature maintenance chamber provided outside the mold. Then, the resin is completely cured by maintaining the temperature within a predetermined range at a temperature within a predetermined range for several hours to several tens of hours.

Japanese Patent Laid-Open No. 06-151491

  In this way, the resin molded product obtained by carrying out the after-curing by transporting the intermediate molded product from the mold to the temperature maintaining chamber may be warped. When the resin molded product is warped, for example, in a resin molded product in which an electronic component mounted on a substrate is sealed with a resin, the electronic component may be peeled off or damaged due to stress.

  The problem to be solved by the present invention is to provide a resin molding apparatus and a resin molded product manufacturing method capable of suppressing warpage of the resin molded product.

The resin molding apparatus according to the present invention made to solve the above problems is an apparatus that performs resin molding by sealing a molding object with a thermosetting resin,
a) a mold comprising a first mold provided with a cavity, and a second mold having a molding object mounting portion for mounting the molding object;
b) a mold heating mechanism for heating the mold to a temperature within a temperature range in which the thermosetting resin is cured;
c) a temperature maintaining chamber for storing an intermediate molded product made of the molding object and made of the thermosetting resin that is not completely cured, and is maintained at a temperature within the temperature range;
d) An intermediate molded product transport mechanism that transports the intermediate molded product from the mold to the temperature maintaining chamber while maintaining the intermediate molded product at a temperature higher than room temperature and not more than an upper limit of the temperature range.

The resin molded product manufacturing method according to the present invention is a method of manufacturing a resin molded product by sealing a molding object with a thermosetting resin,
Intermediate molding consisting of a molding object and the thermosetting resin that is not completely cured by performing resin molding while heating to a temperature within a temperature range in which the thermosetting resin is cured using a mold. Intermediate molded product production process for producing products,
An intermediate molded article conveying step of conveying the intermediate molded article from the mold to the temperature maintaining chamber while maintaining the intermediate molded article at a temperature higher than room temperature and not more than the upper limit of the temperature range;
A resin curing step for producing a resin molded product by completely curing the thermosetting resin by maintaining the intermediate molded product at a temperature within the temperature range in the temperature maintenance chamber. To do.

  According to the present invention, it is possible to suppress warping of the resin molded product.

The top view which shows the whole structure of one Embodiment of the resin molding apparatus which concerns on this invention. The schematic block diagram (left figure) and its partial enlarged view (right figure) which show the compression molding apparatus containing the shaping | molding die and the shaping | molding die heating mechanism in the resin molding apparatus of this embodiment. The schematic block diagram which shows the cooling pressurization mechanism in the resin molding apparatus of this embodiment. The flowchart which shows one Embodiment of the operation | movement of the resin molding apparatus of this embodiment, and the resin molded product manufacturing method which concerns on this invention. Schematic which shows operation | movement of the compression molding apparatus in the resin molding apparatus of this embodiment. Schematic which shows operation | movement of the cooling pressurization mechanism in the resin molding apparatus of this embodiment. The top view which shows an example of the resin molding unit which is other embodiment of the resin molding apparatus which concerns on this invention.

  In the resin molding apparatus and the resin molded product manufacturing method according to the present invention, when the resin molding is performed with the molding die, the molding die is heated to a temperature within a temperature range in which the thermosetting resin is cured by the molding die heating mechanism. As a result, the thermosetting resin is cured in the mold, but as described above, it takes time until the thermosetting resin is completely cured. Therefore, the mold is not completely cured before the thermosetting resin is completely cured. By performing opening, an intermediate molded product is obtained. Then, the intermediate molded product is transferred from the mold to the temperature maintaining chamber by the resin molded product transfer mechanism. Then, the resin is completely cured by heating the resin molded product to a temperature within the temperature range for a predetermined time in the temperature maintaining chamber. Note that the temperature of the temperature maintaining chamber does not have to be the same as the temperature for heating the mold because the purpose of completely curing the resin can be achieved as long as the temperature is within the above temperature range.

  In the conventional resin molding apparatus and resin molded product manufacturing method, when the intermediate molded product is transported from the mold to the temperature maintenance chamber, the intermediate molded product is cooled by passing through the room temperature space, and then the temperature is increased. It was heated again in the maintenance room. As a result, a temperature change occurs in which the temperature of the intermediate molded product once decreases and then increases, and the difference in linear expansion coefficient between the substrate and the resin, that is, the difference in the length that expands when the substrate and the resin are subjected to the same temperature change. The presence of this causes warping in the resin molded product finally obtained. Therefore, in the resin molding apparatus and the resin molded product manufacturing method according to the present invention, the intermediate molded product is maintained in the temperature maintaining chamber while maintaining the resin molded product at a temperature higher than room temperature and below the upper limit of the temperature range in the resin molded product transport mechanism. Transport to. Thereby, since a temperature change can be suppressed rather than the case where a resin molded product passes through the inside of room temperature, it can suppress that a resin molded product warps.

  Conventionally, when resin molding is performed by a technique called WLP (Wafer Level Package) in which electronic components are mounted on a wafer made of a semiconductor such as silicon without wiring with bonding wires, resin molding is performed. Warpage occurred remarkably. This is because a semiconductor such as silicon has a larger difference in coefficient of thermal expansion from the resin used for resin sealing than the material of the substrate on which wiring by bonding wires is performed. According to the resin molding apparatus and the resin molded product manufacturing method of the present invention, it is possible to effectively suppress the warpage of the resin molded product even when resin molding is performed using such WLP.

  In the resin molding apparatus according to the present invention, it is desirable that the temperature maintained in the intermediate molded article conveyance mechanism is a temperature within the temperature range (that is, within a temperature range where the thermosetting resin is cured). Similarly, in the method for producing a resin molded product according to the present invention, it is desirable that the temperature maintained in the intermediate molded product conveyance step is a temperature within the temperature range. Thereby, compared with the case where it maintains at the temperature below the said temperature range (it is higher than room temperature), the curvature of a resin molded product can be suppressed further. Moreover, the thermosetting resin of the intermediate molded product can be cured also during the conveyance.

  It is desirable that the resin molding apparatus according to the present invention further includes a cooling mechanism for cooling the resin molded product produced by being maintained at a temperature within the temperature range in the temperature maintenance chamber. Similarly, it is desirable that the method for producing a resin molded product according to the present invention further includes a cooling step for cooling the resin molded product produced in the resin curing step. By cooling the resin molded product by these cooling mechanisms or cooling processes, the resin molded product can be easily handled. As the cooling mechanism, one provided with a cooling water circulation mechanism, one provided with a Peltier element, or one provided with both of them can be used.

  In the resin molding apparatus according to the present invention, it is desirable that the cooling mechanism further includes a pressurizing mechanism that pressurizes the resin molded product during cooling of the resin molded product. Similarly, in the resin molded product manufacturing method according to the present invention, it is desirable to pressurize the resin molded product in the cooling step. By applying pressure during cooling of the resin molded product, it is possible to suppress warping of the resin molded product due to a temperature change during cooling.

  Hereinafter, more specific embodiments of the resin molding apparatus and the resin molded product manufacturing method according to the present invention will be described with reference to FIGS.

(1) Configuration of Resin Molding Apparatus of this Embodiment FIG. 1 is a plan view showing the overall configuration of a resin molding apparatus 10 that is an embodiment of the present invention. The resin molding apparatus 10 includes a compression molding apparatus 11 including a molding die 111 and a heater (mold heating mechanism) 112, a first conveyance mechanism (corresponding to the intermediate molded article conveyance mechanism) 12, and a temperature maintenance chamber 13 described later. A second transport mechanism 14, a cooling mechanism 15, a third transport mechanism 16, a cooling and pressurizing mechanism (corresponding to the cooling mechanism including the pressurizing mechanism) 17, and a finished product storage unit 18. In addition, although not shown in FIG. 1, the resin molding apparatus 10 includes a resin material input unit that inputs a resin material into a resin material supply tray for supplying the resin material to the mold 111, and a resin in which the resin material is input. It has a material supply tray, a material conveyance mechanism for conveying a substrate to be molded to the mold 111, a substrate holding unit for holding the substrate, and the like.

  As shown in FIG. 2, the compression molding apparatus 11 used in the resin molding apparatus of the present embodiment has two sets of molding molds 111 including a lower mold 1111 and an upper mold 1112. Each of the lower mold 1111 and the upper mold 1112 of each mold 111 is provided with a mold heater (mold heating mechanism) 112. Between the mold heater 112 and a platen described later (the lower movable platen 1152, the upper movable platen 1153 or the fixed platen 1154) is insulated by a heat insulating material 113. A substrate can be mounted on the lower surface of the upper mold 1112. The lower mold 1111 includes a plate-like bottom surface member 11111 whose plate surface is directed in the vertical direction, and a peripheral wall member 11112 that slides up and down along the side surface of the bottom surface member 11111, and the bottom surface of the peripheral wall member 11112 is the elastic member 114. Is held in. A cavity C is formed by the upper surface of the bottom surface member 11111 and the inner surface of the peripheral wall member 11112. A slight gap exists between the side surface of the bottom surface member 11111 and the inner side surface of the peripheral wall member 11112, and the gas in the cavity C is sucked from the gap by a vacuum pump (not shown) to separate as described later. The inner surface of the cavity C can be covered with a mold film.

  The mold heater 112 heats the mold 111 to a predetermined temperature within a temperature range in which the resin material can be cured in a state where a molten resin material made of a thermosetting resin is supplied into the cavity C. (Hereinafter, the amount of heat generated is adjusted so that the predetermined temperature, that is, the heating temperature of the mold heater 112 is referred to as a “first predetermined temperature”).

  The compression molding apparatus 11 includes a base 1151, four (only two are shown in FIG. 2) tie bars 116 erected on the base 1151, and a toggle link 117 provided on the base 1151. A tie bar 116 holds a lower movable platen 1152 and an upper movable platen 1153 so as to be movable up and down, and a fixed platen 1154 is fixed to the upper end of the tie bar 116. One of the two sets of molds 111 includes a lower mold 1111 provided on the upper surface of the lower movable platen 1152 and an upper mold 1112 provided on the lower surface of the upper movable platen 1153 via the heat insulating material 113 and the mold heater 112, respectively. It has been. In the other mold 111, the lower mold 1111 is provided on the upper surface of the upper movable platen 1153, and the upper mold 1112 is provided on the lower surface of the fixed platen 1154 via the heat insulating material 113 and the mold heater 112, respectively.

  The first transport mechanism 12 is a device that transports the intermediate molded product produced by the compression molding device 11 from the compression molding device 11 to the temperature maintenance chamber 13. The first transport mechanism 12 heats the mounting part for mounting the intermediate molded product and the mounting part to a predetermined temperature that is higher than room temperature and below the upper limit of the temperature range for curing the thermosetting resin ( Hereinafter, a transport mechanism heater 121 which is a heater having the predetermined temperature, that is, the heating temperature in the first transport mechanism 12 is referred to as a “second predetermined temperature” is provided. Here, if the second predetermined temperature is higher than room temperature, it is acceptable even if it is less than the lower limit of the temperature range for curing the thermosetting resin, but in order to further accelerate the curing of the thermosetting resin, It is desirable to be within the range.

  The temperature maintenance chamber 13 is a chamber in which the intermediate molded product carried in from the first transport mechanism 12 is accommodated, and is maintained at a predetermined temperature within a temperature range in which the thermosetting resin is cured (hereinafter referred to as the predetermined temperature). Temperature, ie, the temperature in the temperature maintenance chamber 13 is set as a “third predetermined temperature”). In the present embodiment, 64 intermediate molded products can be accommodated in the temperature maintenance chamber 13.

  The second transport mechanism 14 is a device that transports a resin molded product obtained by heating the intermediate molded product in the temperature maintaining chamber 13 for a predetermined time from the temperature maintaining chamber 13 to the cooling mechanism 15. Unlike the first transport mechanism 12, the second transport mechanism 14 is not provided with a heater. As will be described later, the second transport mechanism 14 is also used when the intermediate molded product is carried into the finished product storage unit 18.

  The cooling mechanism 15 is a device that cools the resin molded product carried in from the temperature maintenance chamber 13. In the present embodiment, the cooling mechanism 15 includes a mounting table 151 on which a resin molded product is mounted and a cooling water circulation mechanism 152 in which a tube through which cooling water passes is brought into contact with the mounting table 151. Instead of the cooling water circulation mechanism 152 or in addition to the cooling water circulation mechanism 152, the Peltier element may be brought into contact with the mounting table 151. The cooling mechanism 15 is intended to remove rough heat from the resin molded product before the processing by the cooling and pressurizing mechanism 17, and it is not necessary to cool the resin molded product to room temperature.

  The third transport mechanism 16 is a device that transports the resin molded product from the cooling mechanism 15 to the cooling and pressurizing mechanism 17. Similarly to the second transport mechanism 14, the third transport mechanism 16 is not provided with a heater. The third transport mechanism 16 is also used when the intermediate molded product is carried into the finished product storage unit 18.

  As shown in FIG. 3, the cooling and pressurizing mechanism 17 has a columnar shape, a mounting table 171 on which a resin molded product is mounted, and a donut plate inserted through the column of the mounting table 171 so as to be movable up and down. Shaped lower plate 172, fixed upper plate 173 facing the mounting table 171 and lower plate 172, a moving mechanism (not shown) for moving the mounting table 171 and lower plate 172 up and down, and the upper plate 173, respectively. And a Peltier element 174 provided to come into contact with the peltier element. The lower plate 172 and the upper plate 173 have the same planar shape as the substrate of the resin molded product manufactured by the resin molding apparatus 10 or a planar shape that can include the substrate. On the other hand, the upper surface of the mounting table 171 has a smaller planar shape than the substrate of the resin molded product.

  The Peltier element 174 may be provided on the lower plate 172, or may be provided on both the lower plate 172 and the upper plate 173. Instead of the Peltier element 174 or in addition to the Peltier element 174, a pipe through which the cooling water of the cooling water circulation mechanism passes may be brought into contact with the lower plate 172 and / or the upper plate 173. A gas suction hole 175 is provided on the upper surface of the mounting table 171, and a resin molded product is adsorbed on the upper surface of the mounting table 171 by sucking gas from the gas suction hole 175 using a vacuum pump (not shown). It can be made to.

  The finished product housing portion 18 is a room for housing a resin molded product (finished product) completed by being cooled and pressurized by the cooling and pressurizing mechanism 17. A plurality of finished product storage units 18 are provided adjacent to the room in which the second transfer mechanism 14 is provided and the room in which the third transfer mechanism 16 is provided. The resin molded product is transported by the third transport mechanism 16 and the second transport mechanism 14 to the finished product storage unit 18 adjacent to the room in which the second transport mechanism 14 is provided, and the room in which the third transport mechanism 16 is provided. Is transported by the third transport mechanism 16 to the finished product storage section 18 adjacent to.

(2) Operation of Resin Molding Apparatus of the Present Embodiment and Resin Molded Product Manufacturing Method of the Present Embodiment Using FIGS. 4 to 6, the operation of the resin molding apparatus of the present embodiment and the resin molded article of the present embodiment A manufacturing method will be described. FIG. 4 is a flowchart showing an operation resin molded product manufacturing method of the resin molding apparatus of the present embodiment, FIG. 5 is a schematic diagram showing the operation of the compression molding apparatus 11, and FIG. 6 is a schematic diagram showing the operation of the cooling and pressurizing mechanism 17. It is.

  First, in the compression molding apparatus 11, resin molding is performed using the molding die 111 while heating the resin material P to a temperature within a temperature range in which the resin material P made of a thermosetting resin is cured by the molding die heater 112. Thus, an intermediate molded product M is produced (step S1).

  Details of the operation in step S1 will be described with reference to FIG. The compression molding apparatus 11 has two molds 111, but the operation of the two molds is the same. First, the substrate S on which a plurality of electronic components are mounted is attached to the lower surface of the upper mold 1112 with the mounting surface facing downward (FIG. 5A). Subsequently, the resin material transfer tray T is carried between the lower mold 1111 and the upper mold 1112 (FIG. 5B). The resin material transfer tray T is obtained by stretching a release film F on the bottom surface of a frame-shaped member having a space corresponding to the planar shape of the cavity C in the center so as to cover the space. In the resin material transfer tray T, the resin material P is charged into the space on the release film F at the resin material charging portion.

  Next, after the resin material transfer tray T carried between the lower mold 1111 and the upper mold 1112 is lowered, the gas is sucked from the gap between the side surface of the bottom member 11111 and the inner surface of the peripheral wall member 11112, and the resin Since the material transfer tray T is adsorbed, the release film F is released from the resin material transfer tray T. As a result, the inner surface of the cavity C of the lower mold 1111 is covered with the release film F, and the resin material P is supplied to the cavity C (FIG. 5C).

  Next, the lower mold 1111 and the upper mold 1112 are heated to a first predetermined temperature by the mold heater 112. Thereby, the resin material P in the cavity C of the lower mold 1111 is initially melted or softened (FIG. 5D). When the resin material P is thus melted or softened, the lower movable platen 1152 is raised by the toggle link 117. As a result, first, the lower mold 1111 and the upper mold 1112 of the lower mold 111 are brought into contact with each other, the upper movable platen 1153 to which the upper mold 1112 is attached is raised, and the lower mold 1111 and the upper mold 111 of the upper mold 111 are raised. The mold 1112 contacts. Further, the lower movable platen 1152 is raised by the toggle link 117, whereby the two molds 111 are respectively clamped (FIG. 5 (e)).

  If the resin material P is maintained at the first predetermined temperature by the mold heater 112 with the mold clamped in this manner, the resin material P, which is a thermosetting resin, begins to cure (FIG. 5 (f)). . And when predetermined time passes, the resin material P will harden | cure to the grade which can maintain a shape. At this stage, the mold is opened, and an intermediate molded product M made of a resin and a substrate S in which the resin material P is cured to some extent is taken out from the mold 111 (FIG. 5G). At this time, since the inner surface of the cavity C is covered with the release film F, the intermediate molded product M can be easily released from the lower mold 1111. The time for performing the mold clamping is appropriately determined according to the material of the resin material (thermosetting resin) P to be used.

  Returning to the flowchart of FIG. 4, a process after the intermediate molded product M is manufactured with the mold 111 will be described. First, the first transport mechanism 12 transports the intermediate molded product M from the compression molding apparatus 11 to the temperature maintenance chamber 13 while heating it to the second predetermined temperature (step S2). Thereby, it is suppressed that the intermediate molded product M is cooled, and thereby the intermediate molded product M is prevented from warping.

  Next, by holding the intermediate molded product M at a third predetermined temperature for a predetermined time in the temperature maintenance chamber 13, the thermosetting resin is completely cured to obtain a resin molded product PM (step S3). This predetermined time is appropriately determined according to the material of the thermosetting resin to be used. Here, normally, a plurality of intermediate molded products M are produced in the compression molding apparatus 11 while one intermediate molded product M is held in the temperature maintaining chamber 13. Therefore, the number of intermediate molded products that can be accommodated in the temperature maintaining chamber 13 at a time is set to be plural or more so that the production of the intermediate molded product M can be continuously performed by the compression molding apparatus 11 without interruption. Even if it goes, all the produced intermediate molded articles M can be accommodated in the temperature maintenance chamber 13.

  Next, the second transport mechanism 14 places the resin molded product PM in which the thermosetting resin is completely cured on the placement table 151 of the cooling mechanism 15 (step S4). The cooling mechanism 15 cools the resin molded product PM by allowing the cooling water to pass through the pipe of the cooling water circulation mechanism 152 that is in contact with the mounting table 151 (step S5). Then, although the resin molded product PM has been cooled to some extent, the third transport mechanism 16 transports the resin molded product PM to the cooling and pressurizing mechanism 17 in a state where the temperature is still higher than room temperature (step S6).

  The cooling and pressurizing mechanism 17 cools the resin molded product PM while applying pressure (step S7). Hereinafter, the details of the operation in step S7 will be described with reference to FIG. First, the resin article PM is mounted on the mounting table 171 by the third transport mechanism 16 (FIG. 6A). Here, as described above, since the upper surface of the mounting table 171 has a planar shape smaller than the substrate of the resin molded product PM, when the resin molded product PM is mounted on the mounting table 171, a part of the resin molded product PM. Protrudes from the mounting table 171. Therefore, the arm 161 of the third transport mechanism 16 transports the resin molded product PM so as to support the lower side of the protruding portion, places the resin molded product PM on the mounting table 171, and then the resin molded product PM. And the mounting table 171 can be extracted without being sandwiched. After placing the resin molded product PM on the mounting table 171 in this way, the resin molded product PM is adsorbed to the mounting table 171 by sucking gas from the gas suction holes 175.

  Next, the mounting table 171 is raised until the upper surface of the resin molded product PM contacts the lower surface of the upper plate 173, and the lower plate 172 is raised until the upper surface of the lower plate 172 contacts the lower surface of the resin molded product PM. . Then, by further pushing up the mounting table 171 and the lower plate 172, the resin molded product PM is pressed between the upper plate 173 and the mounting table 171 and the lower plate 172 (FIG. 6B). ). At the same time, by passing an electric current through the Peltier element 174, the resin molded product PM is cooled via the upper plate 173. Here, the pressure to pressurize the resin molded product PM is determined within a range in which the warpage of the resin molded product PM can be suppressed and the resin molded product PM is not damaged by conducting a preliminary experiment or the like. Thus, by performing pressurization and cooling, it is possible to bring the temperature of the resin molded product PM to room temperature while suppressing the warpage of the resin molded product PM.

  The resin molded product PM cooled to room temperature by the cooling and pressurizing mechanism 17 is transported to the finished product storage unit 18 by the third transport mechanism 16 (or the third transport mechanism 16 and the second transport mechanism 14), and the finished product is stored. It is accommodated in the part 18 (step S8). With the above operation, one resin molded product PM is completed. And by performing the above operation continuously, a plurality of resin molded products PM are continuously manufactured.

(3) Example of Resin Molding Unit Next, a resin molding unit 30 which is a modified example of the resin molding apparatus 10 will be described with reference to FIG. The resin molding unit 30 according to this modification includes a material receiving module 31, a molding module 32, and a dispensing module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending them to the molding module 32. The material receiving module 31 is provided with a substrate receiving portion 311 and a resin material transfer tray T (see FIG. 5B). A resin material supply device 312 that supplies the resin material P is provided. One or a plurality of molding modules 32 are provided in one set of resin molding units 30, and one of the above-described compression molding apparatuses 11 is provided in one molding module 32. Although three molding modules 32 are shown in FIG. 7, an arbitrary number of molding modules 32 can be provided in the resin molding unit 30. Even after the resin molding unit 30 is assembled and used, the molding module 32 can be increased or decreased. The payout module 33 is a module that houses the temperature maintaining chamber 13, the second transport mechanism 14, the cooling mechanism 15, the third transport mechanism 16, the cooling and pressurizing mechanism 17, and the finished product storage unit 18.

  The resin molding unit 30 is provided with a main transfer path 36 that passes through the material receiving module 31, one or a plurality of molding modules 32, and reaches the entrance of the temperature maintaining chamber 13 of the dispensing module 33. Further, in the material receiving module 31 and each molding module 32, a sub-transport path 37 for transporting the substrate S, the resin material transfer tray T, and the intermediate molded product M between the main transport path 36 and the apparatus in the module. Is provided. The first transport mechanism 12 described above moves in the main transport path 36 from each molding module 32 to the entrance of the temperature maintenance chamber 13. Further, a non-heating type transfer device 38 for transferring the substrate S and the resin material transfer tray T from the material receiving module 31 to the molding module 32 without heating is disposed in the main transfer path 36.

  The operation of the resin molding unit 30 will be described. The board | substrate S is hold | maintained at the board | substrate receiving part 311 of the material reception module 31 by the operator. The non-heating type conveying device 38 passes the substrate S from the substrate receiving unit 311 through the sub conveying path 37 of the material receiving module 31, the main conveying path 36, and one sub conveying path 37 of the molding module 32. The substrate S is conveyed to the compression molding apparatus 11 of the molding module 32 and attached to the upper mold 1112 of the compression molding apparatus 11. Subsequently, the resin material supply device 312 supplies the resin material P to the resin material transfer tray T. Then, the non-heating type conveyance device 38 is arranged so that the resin material transfer tray T supplied with the resin material P is transferred from the resin material supply device 312 to the sub conveyance path 37, the main conveyance path 36, and the substrate S in the material receiving module 31. The resin material P is supplied to the cavity C of the lower mold 1111 of the molding module 32 through the sub conveyance path 37 of the molding module 32 attached to the upper mold 1112. Thereafter, the compression molding apparatus 11 produces the intermediate molded product M by the above-described method. While the compression molding apparatus 10 performs compression molding in this way, the same operation as before is performed on the compression molding apparatuses 10 in the other molding modules 32, whereby a plurality of molding modules 32 are obtained. The intermediate molded product M can be manufactured in parallel while shifting the time.

  Next, the first transport mechanism 12 pays out the intermediate molded product M produced by the compression molding apparatus 11 through the sub-transport path 37 and the main transport path 36 of the molding module 32 while heating to the second predetermined temperature. The module 33 is transferred to the temperature maintenance chamber 13. Hereinafter, the operation from when the resin is completely cured in the temperature maintaining chamber 13 to produce the resin molded product PM until the resin molded product PM is accommodated in the finished product accommodating portion 18 is the same as that of the resin molding apparatus 10. .

  According to this resin molding unit 30, a necessary number of resin molded products can be efficiently manufactured by using the number of molding modules 32 corresponding to the number of resin molded products produced per unit time. Further, the production scale can be easily increased by adding the molding module 32.

  In the example of the resin molding unit 30 shown here, only one dispensing module 33 is provided. However, as a result of adding the molding module 32, the intermediate molded product M is produced exceeding the number that can be accommodated in the temperature maintenance chamber 13. In some cases, a plurality of payout modules 33 may be provided. In that case, the temperature maintenance chamber 13 in each payout module 33 is moved from the position shown in FIG. 7 so that the main transfer path 36 penetrates the plurality of payout modules 33.

  The present invention is not limited to the above embodiment.

  For example, in the above embodiment, the compression molding apparatus 11 having two sets of the molds 111 is used, but the mold 111 may be only one set, or three or more sets. A transfer molding device may be used instead of the compression molding device 11.

  Moreover, in the said embodiment, although two cooling mechanisms, the cooling mechanism 15 (without a pressurization mechanism) and the cooling pressurization mechanism 17, were used, you may use only any one of them. The cooling method is not limited to the above-described cooling water circulation mechanism or Peltier element, and an air cooling device or the like may be used. Further, the resin molded product taken out from the temperature maintaining chamber 13 may be naturally cooled without providing a cooling mechanism in the resin molding apparatus. Alternatively, in order to prevent the resin molded product from being rapidly cooled in the cooling mechanism 15 or the cooling pressure mechanism 17, the resin molding is performed on a heat medium heated to a temperature between room temperature and the temperature maintaining chamber 13 in the first stage. Temperature control may be performed so that the temperature of the heat medium is gradually lowered while the product is in contact with the product.

DESCRIPTION OF SYMBOLS 10 ... Resin molding apparatus 11 ... Compression molding apparatus 111 ... Mold 1111 ... Lower mold 11111 ... Bottom member 11112 ... Peripheral wall member 1112 ... Upper mold 112 ... Mold heater 113 ... Heat insulating material 114 ... Elastic member 1151 ... Base 1152 ... Lower movable Platen 1153 ... Upper movable platen 1154 ... Fixed platen 116 ... Tie bar 117 ... Toggle link 12 ... First transfer mechanism 121 ... Transfer mechanism heater 13 ... Temperature maintenance chamber 14 ... Second transfer mechanism 15 ... Cooling mechanism 151 ... Mounting table for cooling mechanism 152 ... Cooling water circulation mechanism 16 ... Third transport mechanism 161 ... Third transport mechanism arm 17 ... Cooling / pressurizing mechanism 171 ... Cooling / pressurizing mechanism mounting base 172 ... Lower plate 173 ... Upper plate 174 ... Peltier element 175 ... Gas suction Hole 18 ... Finished product container 30 ... Resin molding unit 31 ... Material receiving module 311 ... Substrate receiving Section 312 ... Resin material supply device 32 ... Molding module 33 ... Dispensing module 36 ... Main transport path 37 ... Sub transport path 38 ... Unheated transport device F ... Release film M ... Intermediate molded product P ... Resin material PM ... Resin molding Product S ... Substrate T ... Resin material transfer tray

Claims (10)

An apparatus for performing resin molding by sealing a molding object with a thermosetting resin,
a) a mold comprising a first mold provided with a cavity, and a second mold having a molding object mounting portion for mounting the molding object;
b) a mold heating mechanism for heating the mold to a temperature within a temperature range in which the thermosetting resin is cured;
c) a temperature maintaining chamber for storing an intermediate molded product made of the molding object and made of the thermosetting resin that is not completely cured, and is maintained at a temperature within the temperature range;
d) a resin comprising an intermediate molded product transport mechanism that transports the intermediate molded product from the mold to the temperature maintaining chamber while maintaining the intermediate molded product at a temperature higher than room temperature and not more than an upper limit of the temperature range. Molding equipment.   The resin molding apparatus according to claim 1, wherein the temperature maintained in the intermediate molded article conveyance mechanism is a temperature within the temperature range.   Furthermore, the resin molding apparatus of Claim 1 or 2 provided with the cooling mechanism which cools the resin molded product produced by being maintained by the temperature within the said temperature range in the said temperature maintenance chamber.   The resin molding apparatus according to claim 3, wherein the cooling mechanism includes a cooling water circulation mechanism.   The resin molding apparatus according to claim 3, wherein the cooling mechanism includes a Peltier element.   The resin molding apparatus according to claim 3, wherein the cooling mechanism further includes a pressurizing mechanism that pressurizes the resin molded product during cooling of the resin molded product. A method for producing a resin molded product by sealing a molding object with a thermosetting resin,
Intermediate molding consisting of a molding object and the thermosetting resin that is not completely cured by performing resin molding while heating to a temperature within a temperature range in which the thermosetting resin is cured using a mold. Intermediate molded product production process for producing products,
An intermediate molded article conveying step of conveying the intermediate molded article from the mold to the temperature maintaining chamber while maintaining the intermediate molded article at a temperature higher than room temperature and not more than the upper limit of the temperature range;
A resin curing step for producing a resin molded product by completely curing the thermosetting resin by maintaining the intermediate molded product at a temperature within the temperature range in the temperature maintenance chamber. Resin molded product manufacturing method.   The method for producing a resin molded product according to claim 7, wherein the temperature maintained in the intermediate molded product manufacturing step is a temperature within the temperature range.   The method for producing a resin molded product according to claim 7, further comprising a cooling step of cooling the resin molded product produced in the resin curing step.   The method for producing a resin molded product according to claim 9, wherein the resin molded product is pressurized in the cooling step.

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