JP2000037745A - Method and apparatus for manufacture of thermosetting resin molded product, and mold assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method and an apparatus for manufacturing a thermosetting resin molded product and its mold assembly wherein a cycle time of a resin sealing process is shortened, and a production capacity of the sealing process can be improved. SOLUTION: Molds 1, 2 wherein resin molding part 5a to 5d (5) in which a fluid state thermosetting resin is cast and molded, and resin curing part 6a to 6b (6) in which a curing reaction of the thermosetting resin is completed are formed by being adjacent to each other, are used. A semiconductor element 4 is cast into the resin molding part 5 in a state wherein the molds 1, 2 are open. A semicured sealing body 9a in the resin molding part 5 is transferred to the resin curing part 6. A resin sealing body 9b having completed curing in the resin curing part 6 is taken out, and a resin is molded onto the semiconductor element 4 cast into the resin molding part 5. Then, curing of the semicured sealing body 9a cast into the resin curing part 6, is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a thermosetting resin molded product for sealing a lead frame or the like on which a semiconductor element is mounted with a thermosetting resin. It concerns the device.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 4, a resin sealing process for a lead frame 33 on which a semiconductor element is mounted with a thermosetting resin has a molding space (hereinafter referred to as a cavity) and is uniformly formed. Upper mold 31 kept at high temperature
And using the lower mold 32. The lower mold 32 is provided with a recess called a pot for loading a resin material,
An extrusion rod called a plunger for pushing resin is built in the bottom. Usually, the upper mold 31 has
A recess called a cull is provided at a position corresponding to the pot of the lower mold 32. Further, grooves called runners, which serve as flow paths for the resin from the pot and the cull to the cavity, are formed in the upper and lower dies 31, 32, respectively.

The procedure of the resin sealing step is as follows. First, the lead frame 33 is sandwiched between the upper and lower dies 31, 32, and then the fluidized thermosetting resin material heated and melted by the dies is supplied to the plunger. The upper and lower dies 31, 32 are kept closed until the curing reaction of the resin material is completed, and the curing reaction is advanced by the heating action of the upper and lower dies 31, 32. Is completed. After that, the upper and lower molds 31 and 32 were opened to take out the resin sealing body 34 which completed the resin sealing.

[0004]

However, in the conventional resin sealing process, it is necessary to keep the upper and lower dies 31, 32 closed until the curing reaction of the resin material is completed. Usually, 3 hours until the curing reaction of the resin material is completed.
It took about 0 seconds to about 2 minutes, which was a major factor in reducing the production capacity in the sealing step.

[0005] The present invention provides a method and apparatus for manufacturing a thermosetting resin molded product capable of shortening the cycle time of the resin sealing step and improving the productivity of the sealing step, and a mold apparatus. It is.

[0006]

According to a first aspect of the present invention, there is provided a method for manufacturing a thermosetting resin molded article, comprising: a resin molding section for injecting and molding a thermosetting resin in a flowing state; This is a method using a mold formed adjacent to a resin cured part that completes the reaction. With the mold opened, the sealed object is put into the resin molded part, and semi-cured in the resin molded part. The cured semi-cured body is moved to the cured resin section, the cured resin body is taken out of the cured resin section, and the mold is closed. Then, the curing of the semi-cured sealing body charged into the resin curing section is completed.

According to a second aspect of the present invention, there is provided an apparatus for manufacturing a thermosetting resin molded article, comprising: a resin molding section for injecting and molding a thermosetting resin in a flowing state; and a resin curing section for completing a curing reaction of the thermosetting resin. With the mold formed adjacent to the part and the mold opened, the sealed object is put into the resin molding part, and the semi-cured sealed body semi-cured by the resin molding part is moved to the resin cured part And a sealed body conveying means for taking out the resin sealed body which has been completely cured in the resin cured section.

According to a thirteenth aspect of the present invention, in the mold apparatus, a resin molding section for injecting and molding a thermosetting resin in a flowing state and a resin curing section for completing a curing reaction of the thermosetting resin are adjacent to each other. It is formed by forming. According to the method for manufacturing a thermosetting resin molded product, the manufacturing apparatus, and the mold apparatus according to claim 1, claim 2, or claim 13, the mold is opened, and the resin sealing body that has been completely cured in the resin cured section is formed. Take out and move the semi-cured sealed body that has been semi-cured in the resin molding section to the resin cured section, and then put the next sealed object into the resin molding section, and close the mold and throw it into the resin molding section The resin is molded into the sealed body, and the resin is sealed during one cycle of opening and closing of the mold, which includes a step of completing the curing of the semi-cured sealed body charged into the resin cured portion, and injecting the sealing resin. As compared with the conventional example in which the mold is kept closed from the start until the curing of the resin material is completed, the production capacity in the sealing step can be dramatically improved.

According to a third aspect of the present invention, there is provided a method for producing a thermosetting resin molded article, comprising: a resin molding die having a resin molding portion for injecting and molding a thermosetting resin in a flowing state; A resin curing mold having a resin curing section that completes the curing reaction of the resin curing section is separated and arranged at a position adjacent to each other, and in a state where each mold is opened, the sealed body is put into the resin molding section, The semi-cured sealing body that was semi-cured in the resin molding section was moved to the resin curing section, and the resin sealing body that had been completely cured in the resin curing section was taken out and put into the resin molding section with each mold closed. The method is characterized in that the resin is molded into the object to be sealed, and the curing of the semi-cured member put into the resin cured portion is completed.

According to a fourth aspect of the present invention, there is provided an apparatus for producing a thermosetting resin molded product, comprising: a resin molding die having a resin molding portion for injecting and molding a thermosetting resin in a flowing state; A resin curing mold that has a resin curing section that completes the curing reaction of the thermosetting resin by being separated and placed at adjacent positions of the mold, and sealed with the resin molding section with each mold open A body to be sealed, a semi-cured sealed body that has been semi-cured in the resin molding section is moved to the resin cured section, and a sealed body conveying means for taking out the resin sealed body that has been completely cured in the resin cured section. It is.

According to a fourteenth aspect of the present invention, there is provided a mold device having a resin molding part having a resin molding part for injecting and molding a thermosetting resin in a flowing state, and a position adjacent to the resin molding mold. And a resin curing mold having a resin curing portion for completing the curing reaction of the thermosetting resin. According to the manufacturing method, the manufacturing apparatus, and the mold apparatus of the thermosetting resin molded product according to claim 3, claim 4, or claim 14, the mold is opened, and the resin sealing body that has been completely cured in the resin cured section is formed. Take out and move the semi-cured sealed body that has been semi-cured in the resin molding section to the resin cured section, and then put the next sealed object into the resin molding section, and close the mold and throw it into the resin molding section The resin is molded into the sealed body, and the resin is sealed during one cycle of opening and closing of the mold, which includes a step of completing the curing of the semi-cured sealed body charged into the resin cured portion, and injecting the sealing resin. As compared with the conventional example in which the mold is kept closed from the start until the curing of the resin material is completed, the production capacity in the sealing step can be dramatically improved.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a thermosetting resin molded product according to the first or third aspect, wherein a temperature adjusting device is incorporated inside the plunger of the mold and near the cull contact portion to adjust the temperature of the resin. It is characterized by being cured and compressed while being cured. According to a sixth aspect of the present invention, there is provided an apparatus for manufacturing a thermosetting resin molded product according to the second or fourth aspect, wherein a temperature adjusting device is incorporated inside the plunger of the mold and near the cull contact portion.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the fifth or sixth aspect of the present invention,
In addition to the functions described in the fourth aspect, by incorporating a temperature adjusting device inside the plunger of the mold and near the cull contact portion, the resin is cured and compressed while adjusting the temperature. It is relatively easy to promote the curing of the resin in the cull and pot portions, where the progress of curing is delayed compared to other filling portions, shortening the cycle time of the sealing step, and further improving the production capacity .

According to a seventh aspect of the present invention, there is provided a method for manufacturing a thermosetting resin molded article according to the first or third aspect, wherein the resin cured portion is brought into contact with the semi-cured sealing body to change the surface properties of the semi-cured sealing body. A highly heat conductive contact member having a maintainable rigidity and a high heat conductive elastic holding member for bringing the contact member into contact with the semi-cured sealing body are provided, and the contact member accompanies the curing reaction of the semi-cured sealing body. It is characterized by following volume shrinkage.

According to an eighth aspect of the present invention, there is provided the apparatus for manufacturing a thermosetting resin molded product according to the second or fourth aspect, wherein the resin cured portion is brought into contact with the semi-cured sealing body to change the surface properties of the semi-cured sealing body. A highly thermally conductive contact member having a stiffness that can be maintained, and a highly thermally conductive elastic holding member that makes the contact member contact the semi-cured sealing body while following the volume shrinkage accompanying acceleration of the curing reaction of the semi-cured sealing body Is provided.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the present invention,
In addition to the function of claim 4, even if the semi-cured sealing body undergoes volume shrinkage with the progress of the curing reaction, there is no space between the contact member and the resin surface of the semi-cured sealing body. An elastic holding member having high thermal conductivity for the semi-cured sealing body,
By constantly contacting the contact member, heat transfer to the semi-cured sealing body can be performed with higher efficiency, and furthermore, the semi-cured sealing body is supported by a contact member having rigidity capable of maintaining the surface properties thereof. Therefore, deformation of the semi-cured sealing body can be prevented.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a thermosetting resin molded product, wherein the lead frame is transported at a feed amount which is a multiple of an installation interval of the object to be sealed. Is what you do. According to a tenth aspect of the present invention, in the manufacturing apparatus for a thermosetting resin molded product according to the second or fourth aspect, the distance between the adjacent resin molded parts and the resin cured part is a multiple of the installation interval of the sealed body of the lead frame. It is characterized by having.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the ninth or tenth aspect, in addition to the functions according to the first to fourth aspects, an adjacent resin molded part and a resin cured part are provided. Is set to a multiple of the installation interval of the object to be sealed of the lead frame, the lead frame is transported by a feed amount that is a multiple of the installation interval of the object to be sealed, and The feed pitches for the charging, the movement of the sealed body from the resin molding section to the resin cured section, and the removal of the resin sealed body from the resin cured section are the same. That is,
By unifying the lead frame feed mechanism at each position and performing the feed operation at the same time, it is possible to reduce the lead frame transport time.

According to the eleventh aspect of the present invention, there is provided a method for manufacturing a thermosetting resin molded product according to the first or third aspect, wherein the lead frame is continuously conveyed by a hoop feed mechanism. According to a twelfth aspect of the present invention, in the thermosetting resin molded product manufacturing apparatus according to the second or fourth aspect, the lead frame is continuously conveyed by a hoop feed mechanism.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the eleventh or twelfth aspect, in addition to the operation according to the first to fourth aspects, the lead frame is not interrupted in the feed direction. Since it is continuously conveyed by the hoop feed mechanism, thermosetting resin molding that can be produced at once without increasing the number of objects to be sealed existing in the continuous lead frame without supplying a new lead frame The number of articles can be increased.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of a resin-sealing mold in which a semiconductor element 4 to be sealed is resin-molded, heated and cured, and FIG. 2 is a II-II cross-sectional view thereof.

1 and 2, reference numeral 1 denotes an upper mold, 2
Denotes a lower mold, and 3 denotes a lead frame on which the semiconductor element 4 is mounted. The upper mold 1 and the lower mold 2 have resin molded portions 5a, 5
b, 5c, 5d and resin cured portions 6a, 6b are provided. Contact members 7a and 7b are provided on the resin cured portions 6a and 6b via elastic holders 8a and 8b having high thermal conductivity, respectively.

The resin sealing paths of the lead frame 3 are provided on the left and right sides of the resin sealing mold, respectively. Reference numeral 21 denotes a plunger for pushing the resin into the mold, and a temperature adjusting device 2 is provided inside the plunger 21 of the mold and near the cull contact portion.
2, 23 and 24 are built-in. Temperature control device 22,
The positions for incorporating the 23 and 24 are, for example, the upper mold 1, the lower mold 2, and the plunger 21, but are not particularly limited as long as the resin can be more effectively cured. It is only necessary to be located at a close distance. Further, regarding the material of the mold located between the temperature adjusting devices 22, 23, 24 and the resin, the temperature adjusting devices 22, 23, 2
No particular limitation is imposed as long as the heat amount of No. 4 can be efficiently transmitted to the resin.

When the lead frame 3 passes between the upper mold 1 and the lower mold 2 by the object-to-be-sealed conveying means from the left side in FIG. 1, the semiconductor element 4 bonded to the lead frame 3 is made of resin. After being sealed, it is taken out as a resin sealing body 9b in the right direction in the figure. That is, the resin molded parts 5a, 5b, 5c, 5d
After the thermosetting resin in the fluidized state is supplied, the semi-cured sealing body (state before curing) 9a is formed around the semiconductor element 4 by the heating and compressing actions of the upper and lower dies 1, 2.

Thereafter, the upper mold 1 and the lower mold 2 are opened, and the lead frame 3 is fed by a frame feed mechanism (not shown) in the direction of the arrow in FIG. The distance between adjacent semiconductor elements 4 in the feed direction of the lead frame 3 is defined as L,
The distance between the adjacent resin molded portions 5a, 5b, 5c, 5d or the cured resin portions 6a, 6b in the mold was also L. The feed amount of the lead frame 3 is, for example, 2 L in the case of the present embodiment.
It is. The feed amount of the lead frame 3 is changed according to the size of the mold and the pitch of the semiconductor element 4 on the lead frame 3, and all the semi-cured parts formed at one time by the resin molding parts 5a, 5b, 5c, 5d. There is no particular limitation as long as each part of the apparatus is optimally adjusted so that the sealing body 9a moves to the resin cured portions 6a and 6b by opening and closing the next mold.

In the cured resin portions 6a and 6b, when the upper mold 1 and the lower mold 2 start closing, the contact members 7a and 7b contact the semi-cured sealing body 9a. Further, when the upper mold 1 and the lower mold 2 are completely closed, the contact members 7a and 7b become semi-cured sealing bodies 9a.
The elastic holders 8a and 8b contract in a state where they are in contact with.
The contact members 7a and 7b have predetermined rigidity to maintain the surface shape of the semi-cured sealing body 9a, and
It is configured to be able to follow the volume shrinkage accompanying the acceleration of the curing reaction of a. Note that the material and surface shape of the contact members 7a and 7b and the material and cross-sectional area that determine the rigidity of the elastic holders 8a and 8b do not impair the shape, characteristics, and surface shape of the semi-cured sealing body 9a. It is not particularly limited.

Then, the upper mold 1 and the lower mold 2 are opened, and the resin sealing body 9b which has been completely cured in the resin curing sections 6a and 6b.
Is taken out from the direction of the arrow in FIG. 1 by a frame feed mechanism (not shown). The lead frame 3 is
By a hoop feeding mechanism that is continuous before and after the mold is inserted, the paper is conveyed without interruption in the feeding direction. However, the length of the lead frame 3 in the feed direction may be, for example, a strip-shaped lead frame 3 as long as the quality of the product after the transportation and sealing steps is within the specified range, and is particularly limited. Not something.

According to the manufacturing method, the manufacturing apparatus, and the mold apparatus for the thermosetting resin molded product thus configured, the upper mold 1 and the lower mold 2 are opened, and the curing is completed in the resin curing sections 6a and 6b. The removed resin sealing body 9b is taken out, and the resin molded portions 5a, 5
moving the semi-cured sealing body 9a semi-cured by b, 5c, 5d to the resin cured portions 6a, 6b, and newly charging the next semiconductor element 4 into the resin molded portions 5a, 5b, 5c, 5d; The upper mold 1 and the lower mold 2 are closed, and the resin molding portions 5a, 5b, 5
c and 5d, the resin molding is performed on the semiconductor element 4 and the curing of the semi-cured sealing body 9a charged into the resin cured portions 6a and 6b is completed. Resin sealing can be performed between opening and closing, dramatically increasing the production capacity of the sealing process compared to the conventional example where the mold is kept closed from the start of injection of the sealing resin until the curing of the resin material is completed. Can be improved.

The plunger 2 of the upper mold 1 and the lower mold 2
1 Temperature control devices 22 and 2 inside and near the cull contact part
By incorporating 3 and 24, the resin is cured and compressed while controlling the temperature, so that the curing of the resin in the cull and pot portions, where the progress of the curing of the resin is delayed as compared with other filling portions, as in the related art, is reduced. It is relatively easy to accelerate, the cycle time of the sealing step is shortened, and the production capacity can be further improved.

Further, even if the semi-cured sealing body 9a undergoes volume shrinkage as the curing reaction proceeds, there is no space between the contact members 7a and 7b and the resin surface of the semi-cured sealing body 9a. By constantly bringing the semi-cured sealing body 9a into contact with the elastic holding members 8a, 8b and the contact members 7a, 7b having high thermal conductivity, heat transfer to the semi-cured sealing body 9a can be performed with higher efficiency. Moreover, since the semi-cured sealing body 9a is supported by the contact members 7a and 7b having rigidity capable of maintaining the surface properties of the semi-cured sealing body 9a, the deformation of the semi-cured sealing body 9a can be prevented.

The adjacent resin molded parts 5a, 5b, 5
Since the distance between c and 5d and the resin cured portions 6a and 6b, the installation interval of the semiconductor element 4 on the lead frame 3 is L, and the feed amount of the lead frame 3 is 2L, the semiconductor element 4
Into the resin molding sections 5a, 5b, 5c, 5d, and from the resin molding sections 5a, 5b, 5c, 5d to the resin curing sections 6a, 6b.
Of the semiconductor element 4 and removal of the resin sealing body 9b from 6a and 6b. That is, by unifying the feed mechanism of the lead frame 3 at each position and performing the feed operation simultaneously,
The transport time of the lead frame 3 can be reduced. However, it is important to set the feed amount of the lead frame 3 each time the mold is opened and closed so that each resin sealing body 9b is produced in the same molding time and curing time. The number of the parts 5a, 5b, 5c, 5d and the resin cured parts 6a, 6b,
The distance is not particularly limited, and may be any condition as long as it does not hinder the promotion of curing of the thermosetting resin.

Further, since the lead frame 3 is continuously conveyed by the hoop feed mechanism without interruption in the feed direction, the number of semiconductor elements 4 existing in the continuous lead frame 3 is increased, so that the lead frame 3 is newly added. The number of thermosetting resin molded articles that can be produced at one time can be increased without supplying the resin. In the above-described embodiment, the temperature adjustment devices 22, 23, and 24 are built in the upper mold 1, the lower mold 2, and the plunger 21.
2, 23 and 24 need not be provided. The contact members 7a, 7b and the elastic holding members 8a,
Although 8b is provided, it need not be particularly provided. Further, the feed amount of the lead frame 3 does not have to be a multiple of the installation interval of the semiconductor elements 4. Further, the lead frame 3 does not need to be continuously transported by the hoop feed mechanism.

Second Embodiment A second embodiment of the present invention will be described with reference to FIG.
FIG. 3 is a cross-sectional view of the resin-sealing mold. The same parts as those in FIG. In FIG.
11 is an upper mold 11a for resin molding and a lower mold 11 for resin molding.
b, a resin molding die, 12 is an upper resin curing mold 1
This is a resin curing mold composed of 2a and a resin curing lower mold 12b, and the resin molding mold 11 and the resin curing mold 12 are separately arranged at adjacent positions. Also, resin molding portions 5a, 5b,
5c and 5d are provided, and upper and lower molds 1 for curing the resin.
Resin cured portions 6a and 6b are provided in 2a and 12b.

3, the lead frame 3 passes between the upper mold 11a for resin molding and the lower mold 11b for resin molding, and the upper mold 12a for resin curing and the lower mold 12b for resin curing. At this time, the semiconductor element 4 bonded to the lead frame 3 is resin-sealed, and is taken out as a resin-sealed body 9b in the right direction in the drawing. That is, the resin molded portions 5a, 5b, 5
In c and 5d, after the thermosetting resin in the fluid state is supplied, the upper mold 11a for resin molding and the lower mold 1 for resin molding are supplied.
1b, the semi-cured sealing body 9a is molded around the semiconductor element 4.

Thereafter, the upper mold 11a for resin molding and the lower mold 11b for resin molding are opened, and the lead frame 3 is fed by a frame feed mechanism (not shown) in the direction of the arrow in FIG. The feed amount of the lead frame 3 is the same as that in the example of FIG. 1, and is changed by the size of the mold and the pitch of the semiconductor element 4 on the lead frame 3, and the resin molded portions 5a, 5b,
All semi-cured sealing bodies 9a formed at a time by 5c and 5d
However, there is no particular limitation as long as each unit of the apparatus is optimally adjusted so as to move to the resin cured portions 6a and 6b by opening and closing the next mold.

In the resin cured portions 6a and 6b, the contact members 7
After the semi-cured sealing body 9a is held from above and below at a and 7b, heated and cured, the resin curing upper mold 12a and the resin curing lower mold 12b are opened, and the cured resin molding is completed. 9b
Is taken out from the direction of the arrow in FIG. 3 by a frame feed mechanism (not shown). In the method and apparatus for manufacturing a thermosetting resin molded product and the mold apparatus configured as described above, the resin molding mold 11 and the resin curing mold 12 are opened, and the resin is cured by the resin curing sections 6a and 6b. Completed resin seal 9
b, the semi-cured sealing body 9a semi-cured by the resin molding parts 5a, 5b, 5c, 5d is moved to the resin curing parts 6a, 6b, and the next semiconductor element 4 is newly formed by the resin molding parts 5a, 5b, 5d.
5c, 5d, and closing the resin molding die 11 and the resin curing die 12 to close the resin molding portions 5a, 5b, 5
c, resin molding on the semiconductor element 4 charged into 5d, and a one-cycle resin molding die 11, comprising a step of completing the curing of the semi-cured sealing body 9a charged into the resin cured portions 6a, 6b.
Resin sealing can be performed between opening and closing of the resin curing mold 12, and the sealing process can be performed in comparison with the conventional example in which the mold is kept closed from the start of injection of the sealing resin until the curing of the resin material is completed. Can dramatically improve the production capacity.

A temperature adjusting device may be built in the plunger of the resin molding die 11 and in the vicinity of the cull contact portion. Further, the lead frame 3 may be continuously transported by the hoop feed mechanism. In addition, although the contact members 7a and 7b and the elastic holding members 8a and 8b are provided in the resin cured portions 6a and 6b, they are not particularly required. Furthermore, the feed amount of the lead frame 3 does not have to be a multiple of the installation interval of the semiconductor elements 4.

[0038]

According to the present invention, claim 1 or claim 2 or claim 1 is provided.
According to the method and apparatus for manufacturing a thermosetting resin molded product and the mold apparatus described in 3, the mold is opened to take out the resin sealed body that has been completely cured in the resin cured section, and the semi-cured half is cured in the resin molded section. Moving the cured encapsulant to the resin cured part, and newly adding the next encapsulant to the resin molding part, and closing the mold and performing resin molding on the encapsulant injected into the resin molding part; Resin sealing can be performed during one cycle of opening and closing of the mold, which includes a step of completing the curing of the semi-cured sealing body charged into the resin curing section, from the start of the injection of the sealing resin to the completion of the curing of the resin material. As compared with the conventional example in which the mold is kept closed, the production capacity in the sealing step can be dramatically improved.

[0039] Claim 3 or Claim 4 or Claim 14
According to the method and apparatus for manufacturing a thermosetting resin molded article and the mold apparatus described in the above, the mold is opened, the resin sealed body that has been completely cured in the resin cured section is taken out, and the semi-cured article is semi-cured in the resin molded section. Moving the encapsulant to the resin-cured part and adding the next encapsulant to the resin molding part; and closing the mold and resin-molding the encapsulant to the resin molding part. Resin sealing can be performed during the opening and closing of the mold in one cycle consisting of the step of completing the curing of the semi-cured sealing body charged into the curing section. As compared with the conventional example in which the mold is kept closed, the production capacity in the sealing step can be dramatically improved.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the fifth or sixth aspect of the present invention,
In addition to the effects described in claim 4, by incorporating a temperature adjusting device inside the plunger of the mold and in the vicinity of the cull contact portion, the resin is cured and compressed while adjusting the temperature. It is relatively easy to promote the curing of the resin in the cull and pot portions, where the progress of curing is delayed compared to other filling portions, shortening the cycle time of the sealing step, and further improving the production capacity .

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the seventh or eighth aspect of the present invention,
In addition to the effects of claim 4, even if the semi-cured sealing body undergoes volume shrinkage with the progress of the curing reaction, no space is created between the contact member and the resin surface of the semi-cured sealing body. An elastic holding member having high thermal conductivity for the semi-cured sealing body,
By constantly contacting the contact member, heat transfer to the semi-cured sealing body can be performed with higher efficiency, and furthermore, the semi-cured sealing body is supported by a contact member having rigidity capable of maintaining the surface properties thereof. Therefore, deformation of the semi-cured sealing body can be prevented.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the ninth or tenth aspect, in addition to the effects according to the first to fourth aspects, an adjacent resin molded part and a resin cured part are provided. Is set to a multiple of the installation interval of the object to be sealed of the lead frame, the lead frame is transported by a feed amount that is a multiple of the installation interval of the object to be sealed, and The feed pitches for the charging, the movement of the sealed body from the resin molding section to the resin cured section, and the removal of the resin sealed body from the resin cured section are the same. That is,
By unifying the lead frame feed mechanism at each position and performing the feed operation at the same time, it is possible to reduce the lead frame transport time.

According to the method and the apparatus for manufacturing a thermosetting resin molded product according to the eleventh or twelfth aspect, in addition to the effects according to the first to fourth aspects, the lead frame is not interrupted in the feed direction. Since it is continuously conveyed by the hoop feed mechanism, thermosetting resin molding that can be produced at once without increasing the number of objects to be sealed existing in the continuous lead frame without supplying a new lead frame The number of articles can be increased.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a resin sealing mold used in a thermosetting resin molded product manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a cross-sectional view of a resin sealing mold used in an apparatus for manufacturing a thermosetting resin molded product according to another embodiment of the present invention.

FIG. 4 is a cross-sectional view of a resin sealing mold used in a conventional thermosetting resin molded product manufacturing apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper mold 2 Lower mold 3 Lead frame 4 Semiconductor element (encapsulated body) 5a, 5b, 5c, 5d Resin molded part 6a, 6b Resin cured part 7a, 7b Contact member 8a, 8b Elastic holding member 9a Semi-cured Sealing body 9b Resin sealing body 11 Mold for resin molding 11a Upper mold for resin molding 11b Lower mold for resin molding 12 Mold for resin curing 12a Upper mold for resin curing 12b Lower mold for resin curing 21 Plan Jar 22, 23, 24 Temperature control device L Resin sealing body interval

Continuation of the front page (72) Inventor Zenichiro Tabuchi 1-1, Yukicho, Takatsuki-shi, Osaka, Japan Inside Matsushita Electronics Industrial Co., Ltd. (72) Inventor Tsugio Murayama 1-1-1, Yukicho, Takatsuki-shi, Osaka, Matsushita Electronics Corporation (72) Inventor Shoichi Tanaka 1-1, Kochi-cho, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd.F-term (reference) JN43 JQ81 5F061 AA01 BA01 CA21 DA01 DA03 DA06 DA12 DA16 DD02 DD04

Claims (14)

[Claims] 1. A mold in which a resin molding section for injecting and molding a thermosetting resin in a flowing state and a resin curing section for completing a curing reaction of the thermosetting resin are used adjacently. A method for manufacturing a thermosetting resin molded product, wherein a sealed object is put into the resin molded portion while the mold is opened, and a semi-cured sealed material semi-cured by the resin molded portion is formed of a resin. Moved to the curing section, take out the resin sealed body that has been cured in the resin cured section, and in a state in which the mold is closed, perform resin molding on the sealed body put in the resin molded section, and cure the resin. A method for producing a thermosetting resin molded product, wherein the curing of the semi-cured sealing body put into the section is completed. 2. A mold in which a resin molding part for injecting and molding a thermosetting resin in a flowing state and a resin curing part for completing a curing reaction of the thermosetting resin are formed adjacent to each other; With the mold open, the sealed object is put into the resin molded part, the semi-cured sealed body that has been semi-cured by the resin molded part is moved to the resin cured part, and curing is completed by the resin cured part. A device for manufacturing a thermosetting resin molded article, comprising: a sealed object conveying means for extracting a sealed resin sealed body. 3. A resin molding die having a resin molding portion for injecting and molding a thermosetting resin in a flowing state, and a resin having a resin curing portion for completing a curing reaction of the thermosetting resin. The curing molds are separated and arranged at adjacent positions, and in a state where the respective molds are opened, an object to be sealed is put into the resin molding portion, and a semi-cured seal semi-cured in the resin molding portion. The stopper is moved to the resin-cured portion, and the resin-encapsulated body that has been completely cured at the resin-cured portion is taken out. A method for producing a thermosetting resin molded product, which comprises molding and curing the semi-cured sealing body put into the resin curing section. 4. A resin molding die having a resin molding portion for injecting and molding a thermosetting resin in a flowing state, and a thermosetting resin which is separately arranged at a position adjacent to the resin molding die. A resin curing mold having a resin curing section that completes the curing reaction of the curable resin, and in a state where each of the molds is opened, an object to be sealed is put into the resin molding section, and the resin molding section Production of a thermosetting resin molded article comprising: a semi-cured semi-cured sealed body that is moved to the resin cured section, and a sealed body transporting unit that takes out the resin sealed body that has been completely cured in the resin cured section. apparatus. 5. The thermosetting resin according to claim 1, wherein a temperature adjusting device is incorporated inside the plunger of the mold and in the vicinity of the cull contact portion, and the resin is cured and compressed while adjusting the temperature. Manufacturing method of resin molded product. 6. A temperature adjusting device built in the plunger of the mold and near the cull contact portion.
An apparatus for manufacturing a thermosetting resin molded product according to the above. 7. A highly heat-conductive contact member having a rigidity capable of contacting the semi-cured sealing body and maintaining the surface properties of the semi-cured sealing body, and the semi-cured resin member. The elastic holding member having high thermal conductivity to be brought into contact with the sealing body is provided, and the contact member follows volume shrinkage accompanying acceleration of a curing reaction of the semi-cured sealing body. Method for producing a thermosetting resin molded article. 8. A highly heat-conductive contact member having rigidity capable of contacting the semi-cured sealing body and maintaining the surface properties of the semi-cured sealing body, 5. The thermosetting device according to claim 2, further comprising a highly heat-conductive elastic holding member for bringing the contact member into contact with the semi-cured sealing body while following the volume contraction accompanying the acceleration of the curing reaction. Manufacturing equipment for conductive resin molded products. 9. The method for producing a thermosetting resin molded product according to claim 1, wherein the lead frame is transported by a feed amount that is a multiple of an installation interval of the object to be sealed. 10. The thermosetting resin according to claim 2, wherein the distance between the adjacent resin molded portion and the cured resin portion is a multiple of the installation interval of the sealed body of the lead frame. Equipment for manufacturing molded products. 11. The method for producing a thermosetting resin molded product according to claim 1, wherein the lead frame is continuously conveyed by a hoop feed mechanism. 12. The thermosetting resin molded product manufacturing apparatus according to claim 2, wherein the lead frame is continuously conveyed by a hoop feed mechanism. 13. A mold apparatus in which a resin molding section for injecting and molding a thermosetting resin in a flowing state and a resin curing section for completing a curing reaction of the thermosetting resin are formed adjacent to each other. . 14. A resin molding die having a resin molding portion for injecting and molding a thermosetting resin in a fluid state, and the thermosetting resin which is separately arranged at a position adjacent to the resin molding die. A mold apparatus comprising: a resin curing mold having a resin curing section for completing a curing reaction of a curable resin.