KR20180015568A - Mold, resin molding apparatus and method for manufacturing resin molded article - Google Patents

Abstract

The present invention reduces the manufacturing cost of a molding die used for producing a plurality of kinds of resin molded articles. The molding die (17) has a first die (18) and a second die (2) arranged opposite to each other, wherein the first die (18) has a frame member (6) and an inner member (5) disposed inside the frame member (6), wherein the frame member (6) and the inner member (5) are relatively movable in the vertical direction and the inner member (5) is provided with a step part (7) at the outer peripheral part of the die surface. The frame member (6) can be provided with the first member (19) at a position corresponding to the step part (7) and the inner member (5) can be provided with the first member (19) and an optional second member.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a molding method, a resin molding apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding method, a resin molding apparatus, and a method of manufacturing a resin molded article, which are used for resin sealing an electronic component on a chip such as a transistor, an integrated circuit (IC) or a light emitting diode .

BACKGROUND ART Conventionally, a substrate on which a semiconductor chip is mounted or an object such as a semiconductor wafer is resin-sealed by using a resin molding apparatus. In the resin molding apparatus, the object is resin-sealed by clamping the molds disposed opposite to each other. For example, a molding die used in a resin molding apparatus using a compression molding method is disclosed (see Patent Document 1).

Japanese Patent Application Laid-Open No. 2005-88395

However, the molding die disclosed in Patent Document 1 has the following problem. As shown in Fig. 1 of Patent Document 1, the molding die includes a cavity piece 22, a cavity piece supporting block 24, a clamper 26, a clamper set block 28, a clamper closing block 29, And an element member. Objects to be resin-sealed vary in size and shape. If the size and shape of the object are different, it is necessary to newly manufacture the mold. If the number of element members constituting the forming die is large, the manufacturing cost of the forming die is increased. If a large number of products with a small quantity of various types of products are produced, there is a problem that the manufacturing cost of the molding type is greatly increased. In addition, there is also a problem of a decrease in productivity accompanying the above.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a resin composition which is capable of reducing the production cost of a molding die used for producing a plurality of kinds of resin molded articles and capable of improving productivity in resin molding of a plurality of varieties, A molding apparatus and a method of manufacturing a resin molded article.

Means for Solving the Problems In order to solve the above problems, a mold according to the present invention is a mold having a first mold and a second mold arranged opposite to each other, and the first mold is disposed inside the frame- Wherein the frame member and the inner member are movable in a relatively vertical direction and the inner member is provided with a step portion on the outer peripheral portion of the mold surface, One member can be installed, and the inner member can be provided with the first member and the second member alternatively.

Means for Solving the Problems In order to solve the above problems, a mold according to the present invention is a mold having a first mold and a second mold arranged opposite to each other, and the first mold is disposed inside the frame- Wherein the frame member and the inner member are movable in a relatively vertical direction and the inner member includes a member having a shape provided with a step portion on the outer peripheral portion of the mold surface and a member having a shape not provided with a step portion, And the frame member is provided with the first member at a position corresponding to the step portion.

Means for Solving the Problems In order to solve the above problems, a mold according to the present invention is a mold having a first mold and a second mold arranged opposite to each other, and the first mold is disposed inside the frame- Wherein the frame member and the inner member are movable in a relatively upward and downward direction and the inner member is provided with a step portion on the outer peripheral portion of the mold surface and the second member can be provided, It is possible to replace the member of the shape provided with the protrusion protruding to the position corresponding to the stepped portion and the member of the shape without the protrusion.

Industrial Applicability According to the present invention, it is possible to reduce the manufacturing cost of a molding die used for producing a plurality of kinds of resin molded articles, and to improve the productivity in resin molding of a plurality of kinds.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a molding die used in the first embodiment of the molding die according to the first embodiment. FIG. 1 (a) is a plan view and FIG.
Fig. 2 is a schematic view showing a molding die used in the second embodiment in the molding die according to the first embodiment. Fig. 2 (a) is a plan view and Fig.
Fig. 3 is a schematic view showing a molding die used in the third embodiment in the molding die according to the first embodiment. Fig. 3 (a) is a plan view and Fig.
Fig. 4 is a schematic view showing a molding die used in the fourth embodiment in the molding die according to the first embodiment. Fig. 4 (a) is a plan view, and Fig.
5A and 5B are schematic cross-sectional views each showing a molding die used in the fifth embodiment in the molding die according to the first embodiment.
Fig. 6 is a schematic view showing a molding die used in the sixth embodiment in the molding die according to the second embodiment. Fig. 6 (a) is a plan view and Fig. 6 (b) is a sectional view taken along the line EE.
Fig. 7 is a schematic view showing a molding die used in the seventh embodiment of the molding die according to the second embodiment. Fig. 7 (a) is a plan view and Fig.
8 is a plan view showing the outline of the apparatus in the resin molding apparatus according to the third embodiment.
9 (a) to 9 (d) are schematic cross-sectional views showing a process of manufacturing a resin molded article in the third embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any of the drawings in the present application is schematically shown by being omitted or exaggerated appropriately in order to facilitate understanding. The same components are denoted by the same reference numerals, and the description thereof is appropriately omitted. Further, in the present application document, "resin molding" means molding a resin by a molding die, and is a concept expression including "resin sealing" for molding a sealing resin portion by a molding die. The term " resin molded product " means a product including at least a resin-molded resin part, and includes a sealed substrate in the form of a resin-sealed form in which a semiconductor chip mounted on a substrate is resin- Is an expression of the concept.

[Embodiment 1]

(Configuration of Molding Type)

The molding die according to the present invention is a molding die capable of manufacturing a resin molded product having different sizes and shapes by selectively providing a part of the molding die. The forming die is constituted by a common member commonly used for all products and a selection member used corresponding to a specific product. Embodiment 1 shows a case where a substrate such as a printed board or a lead frame is resin molded as an object to be resin molded. Hereinafter, the configurations of the five molds used in the first embodiment will be described with reference to Figs. 1 to 5, respectively. The selection member means a member that is selectively installed with respect to other selection members.

(First Embodiment)

The configuration of the mold used as the first mold in the mold of the first embodiment will be described with reference to Fig. The molding die shown in Fig. 1 is a molding die used in, for example, a resin molding apparatus using a compression molding method. The molding die shown in the first embodiment is, for example, a molding die used when the substrate to be resin molded is rectangular and has a large size. Since the substrate to be resin-molded is large, the cavity formed in the mold corresponding to the substrate is also large.

As shown in Fig. 1 (b), the forming die 1 includes a lower die 3 arranged opposite to the upper die 2 and the upper die 2. The lower mold 3 is provided with a base 4 as a base of the lower mold 3, an inner member 5 fixed on the base 4, and an inner member 5 surrounding the inner member 5 And a frame-shaped member (6). The frame-shaped member 6 has a rectangular opening 6a. The inner member (5) is provided with a step portion (7) at the outer peripheral portion of the inner surface of the inner member (5). The inner member 5 has the upper member 5a constituting the upper portion of the inner member 5 and the lower member 5b constituting the lower portion of the inner member 5. [ An elastic member 8 such as a spring is provided between the frame member 6 and the base frame 4 to support the frame member 6. [

In the lower mold 3, the base member 4, the inner member 5, the frame member 6, and the elastic member 8 are common members used in common for all products. At the position of the stepped portion 7, a selection member is provided corresponding to the size and shape of the substrate to be resin molded. Even if the products are different, a molding type can be used by providing a selection member in the common member.

The inner member 5 can move up and down along the rectangular opening 6a of the frame member 6. [ In other words, the frame member 6 and the inner member 5 move relatively up and down. The gap between the inner surface of the frame member 6 and the outer surface of the lower member 5b of the inner member 5 is larger than the gap between the inner member 5 (the lower member 5b of the inner member 5) (9) for sliding movement.

In the first embodiment, the bottom member 10 is provided as a selection member in the stepped portion 7 of the inner member 5. [ The bottom member 10 is sandwiched from the stepped portion 7 of the inner member 5. The upper surface of the bottom member 10 coincides with the upper surface of the inner member 5 (the upper member 5a of the inner member 5), and the outer surface of the bottom member 10 corresponds to the inner member 5 (The lower member 5b of the lower member 5), the bottom member 10 is provided at the stepped portion 7. [0064] 1 (b), a space surrounded by the inner surface of the frame member 6 and the upper surface of the inner member 5 and the bottom surface member 10 is formed in the lower mold 3 The cavity 11 is formed.

The gap between the inner surface of the frame member 6 and the outer surface of the bottom surface member 10 becomes the sliding portion 12 where the bottom surface member 10 slides. The sliding portion (gap) 9 and the sliding portion (gap) 12 are communicated with each other. Therefore, the inner member 5 and the bottom member 10 can be integrated with each other and can move up and down along the sliding section 9 and the sliding section 12. [

In the upper die 2, for example, a substrate 14 having a relatively large size on which the semiconductor chip 13 is mounted is supplied. The substrate 14 is fixed to the upper die 2 by clamping or adsorption with the side on which the semiconductor chip 13 is mounted downward. The present embodiment shows a case where the substrate 14 is fixed to the upper die 2 by suction through a plurality of suction holes 15 formed in the upper die 2 by a suction mechanism (not shown). The molding die 1 shown in the first embodiment is a molding die used when the substrate 14 to be resin-molded is relatively large. More specifically, the size of the substrate 14 is larger than the size of the substrate 24 of the second type shown in FIG. 2 and the substrate 35 of the third type shown in FIG. 3, which will be described later.

The lower mold 3 is supplied with a release film 16 for facilitating release of the resin molded article. The release film 16 is adsorbed along the mold surface of the cavity 11 by a suction mechanism (not shown). The release film 16 is adsorbed on the mold surface of the cavity 11 through the sliding section 12 and the sliding section 9. In this case,

According to the first embodiment, the bottom member 10 is provided as a selection member in the stepped portion 7 of the inner member 5. [ The cavity 11 in the lower mold 3 is constituted by the inner surface of the frame member 6 and the upper surface of the inner member 5 and the bottom member 10. [ In the molding die 1 shown in the first embodiment, the cavity 11 having the relatively large size can be formed in the lower mold 3 by providing the bottom face member 10 as the selection member. Therefore, the semiconductor chip 13 mounted on the substrate 14 having a relatively large size can be resin-sealed using the molding die 1.

(Second Embodiment)

The configuration of the molding die used as the second embodiment in the molding die according to the first embodiment will be described with reference to Fig. The molding die shown in the second embodiment is a molding die used when the substrate to be resin-molded is relatively small. Since the substrate to be resin-molded is relatively small, the cavity also becomes relatively small corresponding to the substrate. Here, the fact that the substrate and the cavity are relatively small means that it is smaller than the substrate 14 of the first type shown in Fig. 1 described above.

As shown in Fig. 2 (b), the forming die 17 has a lower die 18 arranged opposite the upper die 2 and the upper die 2. As shown in Fig. The lower die 18 includes a base 4 as a base of the lower die 18, an inner member 5 fixed on the base 4, And a frame member (6) surrounding the frame member (6). The inner member (5) is provided with a step portion (7) at the outer peripheral portion of the mold surface. The inner member 5 has an upper member 5a constituting the upper portion of the inner member 5 and a lower member 5b constituting the lower portion of the inner member 5. [ An elastic member 8 such as a spring is provided between the frame member 6 and the base 4. In the lower die 18, these element members constituting the lower die 18 are the same as those of the first embodiment. These element members are element members common to all products. More specifically, the lower mold 3 of the first embodiment (FIG. 1) and the fifth embodiment (FIG. 5A) described later, the second mold (FIG. 2), and the fifth mold 5 (b)), the lower mold 28 of the third mold (FIG. 3) described later and the lower mold 38 of the fourth mold (FIG. 4) The inner member 5, and the frame member 6 become the common element members.

In the second embodiment, the side member 19 is provided as a selection member on the inner upper side of the frame-like member 6. 2 (b), the side member 19 is provided at a position corresponding to the step portion 7 of the inner member 5. As shown in Fig. The side members 19 are provided on the inner upper side of the frame member 6 such that the upper surface of the side member 19 coincides with the upper surface of the frame member 6. [ The space surrounded by the inner surface of the side member 19 and the upper surface of the inner member 5 (the upper member 5a of the inner member 5) Thereby forming the cavity 20 of the first embodiment. Between the side member 19 and the lower member 5b of the inner member 5, an elastic member 21 for supporting the side member 19 is provided.

The gap between the inner surface of the side member 19 provided on the upper portion of the frame member 6 and the outer surface of the upper member 5a of the inner member 5 is set to be smaller than the gap And becomes the moving part 22. The sliding portion 22 (gap) communicates with the sliding portion 9 (gap) via the stepped portion 7. The upper member 5a of the inner member 5 ascends and descends along the sliding portion 22 and the lower member 5b of the inner member 5 ascends and descends along the sliding portion 9. [

The upper die 2 is supplied with a substrate 24 having a relatively small size on which the semiconductor chip 23 is mounted. The substrate 24 is attracted to the upper die 2 by sucking from the plurality of suction holes 15 formed in the upper die 2 with the side on which the semiconductor chip 23 is mounted facing downward.

The molding die 17 shown in the second embodiment is a molding die used when the substrate 24 to be resin-molded is relatively small. The substrate 24 is sucked by using the suction holes 15 included in the size of the substrate 24 among the suction holes 15 formed in the upper die 2. The suction hole 15a not included in the size of the substrate 24 becomes an unnecessary suction hole for sucking the substrate 24. Therefore, when sucking the substrate 24, the suction hole 15a is closed by the fixing member 25 or the like so that air is not leaked. Alternatively, the suction holes 15 for sucking the suction holes 15a and the substrate 24 may be connected to other suction mechanisms, respectively, so that only the suction mechanism connected to the suction holes 15 is used to suck the substrate 24 You can.

As in the first embodiment, the release film 26 is supplied to the lower mold 18. The release film 26 is adsorbed along the mold surface of the cavity 20 by a suction mechanism (not shown). The release film 26 is adsorbed on the mold surface of the cavity 20 through the sliding portion 22, the stepped portion 7 and the sliding portion 9.

According to the second aspect, the side member 19 is provided as the selecting member on the inner upper side of the frame member 6. [ The cavity 20 in the lower mold 18 is constituted by the inner surface of the side member 19 and the upper surface of the inner member 5 (the upper member 5a of the inner member 5) do. In the molding die 17 shown in the second embodiment, the side member 19 is provided as the selection member, so that the cavity 20 having a relatively small size can be formed in the lower die 18. [ Therefore, the semiconductor chip 23 mounted on the substrate 24 having a relatively small size can be resin-sealed by using the molding die 17.

As shown in the first and second embodiments, the step portion 7 is provided on the outer peripheral portion of the mold surface of the inner member 5. The inner member 5 has an upper member 5a constituting the upper portion of the inner member 5 and a lower member 5b constituting the lower portion of the inner member 5. [ The plane of the upper member 5a of the inner member 5 corresponds to the plane of the smallest cavity and the plane of the lower member 5b of the inner member 5 corresponds to the plane of the largest cavity. Therefore, the size of the cavity usable in the lower mold is set by the planar portion of the upper member 5a of the inner member 5 and the planar portion of the lower member 5b.

(Third Embodiment)

The configuration of the molding die used as the third embodiment in the molding die according to the first embodiment will be described with reference to Fig. The molding die shown in the third embodiment is a molding die used when resin-molding a substrate having these intermediate sizes with respect to the sizes of the substrates shown in the first and second embodiments.

As shown in Fig. 3 (b), the mold 27 has a top mold 2 and a bottom mold 28 arranged opposite to the top mold 2. As shown in Fig. The lower mold 28 includes a base frame 4, an inner member 5 fixed on the base frame 4, and a frame member 6 surrounding the periphery of the inner member 5. The inner member (5) is provided with a step portion (7) at the outer peripheral portion of the mold surface. The inner member 5 has an upper member 5a constituting the upper portion of the inner member 5 and a lower member 5b constituting the lower portion of the inner member 5. [ An elastic member (8) is provided between the frame member (6) and the base (4). In the lower die 28, these element members constituting the lower die 28 are the same as those of the first and second embodiments.

In the third embodiment, the bottom member 29 is provided as a selection member in the stepped portion 7 of the inner member 5. [ The upper surface of the bottom member 29 coincides with the upper surface of the inner member 5 (the upper member 5a of the inner member 5) so that the bottom member 29 is provided on the stepped portion 7 of the inner member do.

A side member (30) is provided as an optional member on the inner upper side of the frame member (6). The side member 30 is provided at a position corresponding to the step portion 7 of the inner member 5. The side members 30 are provided on the inner upper side of the frame member 6 so that the upper surface of the side member 30 coincides with the upper surface of the frame member 6. [

The space surrounded by the inner surface of the side member 30 and the upper surface of the inner member 5 and the bottom member 29 of the lower mold 28 constitutes the cavity 31 in the lower mold 28 . Between the side member 30 and the lower member 5b of the inner member 5, an elastic member 32 for supporting the side member 30 is provided.

The gap between the inner surface of the side member 30 provided on the upper portion of the frame member 6 and the outer surface of the bottom member 29 provided on the upper member 5a of the inner member 5 is larger than the gap between the upper member 5a and the bottom member 29 are integrally formed and slid. The sliding portion (gap) 33 is communicated with the sliding portion (gap) 9 through the stepped portion 7. The upper member 5a and the bottom member 29 of the inner member 5 ascend and descend along the sliding portion 33 and the lower member 5b of the inner member 5 moves up and down along the sliding portion 9 ).

In the upper die 2, a medium size substrate 35 on which the semiconductor chip 34 is mounted is supplied. The substrate 35 is attracted to the upper die 2 by sucking it from the plurality of suction holes 15 formed in the upper die 2 with the side on which the semiconductor chip 34 is mounted downward.

The molding die 27 shown in the third embodiment is a molding die used when the size of the substrate 35 to be resin-molded is medium. The substrate 35 is sucked by suction from the suction holes 15 included in the size of the substrate 35 among the suction holes 15 formed in the upper die 2 as in the second embodiment. The suction holes 15a not included in the size of the substrate 35 are blocked by the fixing member 25 so that air is not leaked.

A release film 36 is supplied to the lower mold 28. The release film 36 is adsorbed along the mold surface of the cavity 31 by a suction mechanism (not shown). The release film 36 is adsorbed on the mold surface of the cavity 31 through the sliding portion 33, the stepped portion 7 and the sliding portion 9.

According to the third embodiment, the bottom member 29 is provided as the selecting member on the stepped portion 7 of the inner member 5. A side member (30) is provided as an optional member inside the frame member (6). The cavity 31 in the lower mold 28 is constituted by the inner surface of the side member 30 and the upper surface of the inner member 5 and the bottom member 29. [ In the molding die 27 shown in the third embodiment, the bottom face member 29 and the side face member 30 are provided as selection members, so that the cavity 31 having a medium size can be formed on the bottom die 28. [ Therefore, the semiconductor chip 34 mounted on the substrate 35 having a medium size can be resin-sealed by using the mold 27. [ The cavity 31 having the middle size means that the size of the cavity 31 of the third type is between the size of the cavity 11 of the first type and the size of the cavity 20 of the second type have.

As shown in the first to third embodiments, the step portion 7 is provided on the outer peripheral portion of the mold surface of the inner member 5. A bottom surface member can be provided as a selection member at the stepped portion 7 of the inner member 5. [ On the other hand, on the inner upper side of the frame-shaped member 6, a side member may be provided as a selection member at a position corresponding to the stepped portion 7 of the inner member 5. [ Therefore, by selecting and installing the bottom surface member and the side surface member as the selection member, it is possible to form a cavity of a desired size on the bottom surface. This makes it possible to perform resin molding by replacing only the selection member with a substrate having a different size.

(Fourth Embodiment)

The configuration of the molding die used as the fourth embodiment in the molding die according to the first embodiment will be described with reference to Fig. The molding die shown in the fourth embodiment is a molding die used when the shape of the resin molded article to be resin molded differs from the shape of the resin molded article shown in the first to third embodiments. In other words, the shape of the cavity is a molding type different from the shape of the cavity shown in the first to third embodiments.

As shown in Fig. 4 (b), the forming die 37 has a lower die 38 arranged opposite the upper die 2 and the upper die 2. As shown in Fig. The lower mold 38 includes a base 4, an inner member 5 fixed on the base 4, a frame 6 surrounding the periphery of the inner member 5, (8) provided between the base (6) and the base (4). These configurations are the same as those of the first to third embodiments.

4 (a), for example, a bottom member 39 having a polygonal (hexagonal) shape in plan view as a selection member is disposed on the stepped portion of the inner member 5 7). The bottom member 39 is fitted from the outer surface of the upper member 5a of the inner member 5. [ The bottom surface member 39 is provided on the step portion 7 of the inner member 5 so that the top surface of the bottom surface member 39 coincides with the top surface of the inner member 5. [

A side member 40 is provided on the inner upper portion of the frame member 6 so as to correspond to the shape (polygonal (hexagonal) shape) of the bottom member 39 as a selection member. As shown in Fig. 4 (a), the side member 40 has a polygonal opening 40a corresponding to the shape of the bottom member 39. Fig. The side member 40 is provided on the inner upper side of the frame member 6 with the upper surface of the side member 40 coinciding with the upper surface of the frame member 6. [

The space enclosed by the inner surface of the side member 40 and the upper surface of the inner member 5 and the bottom member 39 of the lower mold 38 constitutes the cavity 41 in the lower mold 38 . The cavity 41 has a polygonal shape corresponding to the shape of the bottom surface member 39. Between the side member 40 and the lower member 5b of the inner member 5 is provided an elastic member 42 for supporting the side member 40. [

The gap between the inner surface of the side member 40 provided on the upper part of the frame member 6 and the outer surface of the bottom member 39 provided on the upper member 5a of the inner member 5 is larger than the gap between the upper member 5a and the bottom surface member 39 are integrally formed and slid. The sliding portion (gap) 43 is communicated with the sliding portion (gap) 9 through the stepped portion 7.

In the upper die 2, for example, a semiconductor chip 44 including a high-voltage device and a substrate 46 on which the control system semiconductor chip 45 is mounted are supplied. The substrate 46 is adsorbed on the upper die 2 with the side on which the semiconductor chips 44 and 45 are mounted facing downward. The suction holes 15a not included in the size of the substrate 46 are blocked by the fixing member 25 so that air is not leaked.

A release film 47 is supplied to the lower mold 38. The release film 47 is adsorbed along the mold surface of the cavity 41 by a suction mechanism (not shown). The release film 47 is adsorbed on the mold surface of the cavity 41 through the sliding portion 43, the stepped portion 7 and the sliding portion 9.

According to the fourth embodiment, the bottom surface member 39 having a polygonal shape is provided as a selection member on the stepped portion 7 of the inner member 5. As shown in Fig. A side member 40 corresponding to the shape of the bottom surface member 39 is provided as the selecting member in the upper part of the inside of the frame member 6. [ The cavity 41 having a polygonal shape can be formed on the lower mold 38 by the inner surface of the side member 40 and the upper surface of the inner member 5 and the bottom surface member 39. [ Therefore, by using the molding die 37, it is possible to produce a resin molded article having a polygonal shape.

In the fourth embodiment, the step member 7 of the inner member 5 is provided with a bottom member 39 having a polygonal shape as a selecting member. The present invention is not limited thereto and a bottom surface member having a circular shape, an elliptical shape, a trapezoidal shape, and a special shape may be provided on the stepped portion 7 of the inner member 5 as the selection member. Therefore, by selecting the shape of the bottom surface member and the side surface members, which are selection members, corresponding to the product, a resin molded product having an arbitrary shape can be manufactured.

(Fifth Embodiment)

The configuration of the molding die used as the fifth embodiment in the molding die according to the first embodiment will be described with reference to Fig. The molding die shown in the fifth embodiment is a molding die capable of adjusting the thickness of the resin molded article by changing the depth of the cavity.

The molding die shown in Fig. 5 (a) is a molding die used for resin molding of a substrate having a relatively large size. As shown in Fig. 5 (a), in the molding die 1 shown in the first embodiment (Fig. 1), the inner member 5 (the upper member 5a of the inner member 5) A plate-like member (48) is provided on the upper surface of the member (10) as a selection member. In other words, the plate-like member 48 is provided on the mold surface of the cavity 11. Thereby, the depth of the cavity 11 can be arbitrarily changed. The release film 16 is disposed on the plate member 48. 5 (a), the bottom member 10 may be omitted.

The molding die shown in Fig. 5 (b) is a molding die used for resin molding of a substrate having a relatively small size. 5 (b), in the mold 17 shown in the second embodiment (Fig. 2), the inner surface of the upper surface of the inner member 5 (the upper member 5a of the inner member 5) A plate-like member 49 is provided as a selection member. A plate-like member (49) is provided on the mold surface of the cavity (20). Thereby, the depth of the cavity 20 can be arbitrarily changed. The release film 26 is disposed on the plate member 49.

According to the fifth aspect, the plate member is provided as the selection member on the mold surface of the cavity. Thus, the depth of the cavity can be arbitrarily changed. Therefore, the thickness of the resin molded article can be adjusted by changing the depth of the cavity corresponding to the product. The plate-shaped member can be provided for a cavity having an arbitrary size and shape.

As shown in the first to fifth embodiments, in the present embodiment, the lower mold is provided with the base member 4, the inner member 5, the frame member 6, and the elastic member 8 as a common member do. The bottom surface member, the side surface member, and the plate-like member can be selectively installed in the bottom surface as the selecting member corresponding to the shape, size (area), and thickness of the resin molded article. As a result, even if the product is different, resin molding can be performed by manufacturing only some of the selection members and not by newly manufacturing the molding-type molding. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

(Action effect)

In this embodiment, the molds 1 and 17 are molding molds having the lower molds 3 and 18 of the first type arranged opposite to each other and the upper mold 2 of the second type, And a frame member 6 and an inner member 5 disposed inside the frame member 6. The frame member 6 and the inner member 5 are relatively movable in the vertical direction, The inner member 5 is provided with a step portion 7 on the outer peripheral portion of the mold surface and the side member 19 serving as the first member is provided on the frame member 6 at a position corresponding to the step portion 7 The inner member 5 is configured such that the side member 19 and the bottom member 10, which is a second member, can be installed.

With this configuration, the inner member 5 and the frame member 6 can be made common to all the products, and the bottom member 10 and the side member 19 can be selected in accordance with the specified product It can be made as a member. Therefore, a cavity having an arbitrary shape, size and depth corresponding to the product can be formed on the lower mold. Even if the substrate to be resin-molded is different, resin can be molded by preparing only some selection members without newly forming a mold-type mold. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

According to the first embodiment, in the lower die 3, the bottom member 10 is provided as a selecting member on the stepped portion 7 of the inner member 5. The cavity 11 in the lower mold 3 is constituted by the inner surface of the frame member 6 and the upper surface of the inner member 5 and the bottom member 10. [ The cavity 11 having a relatively large size can be formed in the lower mold 3 by providing the bottom member 10 as the selecting member in the inner member 5. [ Therefore, the semiconductor chip 13 mounted on the substrate 14 having a relatively large size can be resin-sealed using the molding die 1.

According to the second aspect, in the lower mold 18, the side member 19 is provided as the selecting member on the inner upper side of the frame-like member 6. The cavity 20 in the lower mold 18 is constituted by the inner surface of the side member 19 and the upper surface of the inner member 5. [ The cavity 20 having a relatively small size can be formed on the lower mold 18 by providing the side member 19 as the selecting member on the frame member 6. [ Therefore, the semiconductor chip 23 mounted on the substrate 24 having a relatively small size can be resin-sealed by using the molding die 17.

According to the third embodiment, in the lower mold 28, the bottom member 29 is provided as the selecting member on the stepped portion 7 of the inner member 5, and the upper portion of the inner side of the frame- A side member 30 is provided. The cavity 31 in the lower mold 28 is constituted by the inner surface of the side member 30 and the upper surface of the inner member 5 and the bottom member 29. [ The bottom member 29 is provided as the selecting member in the inner member 5 and the side member 19 is provided as the selecting member in the frame member 6. The lower mold 28 is provided with the cavity 31, Can be formed. Therefore, the semiconductor chip 34 mounted on the substrate 35 having a medium size can be resin-sealed by using the mold 27. [

A bottom surface member 39 having a polygonal shape is provided as a selection member on the stepped portion 7 of the inner member 5 and the inner surface of the frame member 6 A side member 40 corresponding to the shape of the bottom surface member 39 is provided as a selection member on the upper side. The cavity 41 having the polygonal shape in the lower mold 38 is formed by the inner surface of the side member 40 and the upper surface of the inner member 5 and the bottom surface member 39. [ The bottom member 39 having a different shape is provided on the inner member 5 and the side member 40 corresponding to the shape of the bottom member 39 is provided on the frame member 6, So that the different cavities 41 can be formed. Thus, by using the molding die 37, it is possible to produce a resin molded article having a different shape.

According to the fifth aspect, in the lower mold, the plate member is provided as the selecting member on the mold surface of the cavity. Thus, the depth of the cavity can be arbitrarily changed. Therefore, the thickness of the resin molded article can be adjusted by changing the depth of the cavity corresponding to the product. The plate-shaped member can be provided for a cavity having any shape and size.

According to the present embodiment, the lower mold comprises the base 4, the inner member 5, the frame member 6, and the elastic member 8 as a common member. The bottom surface member, the side surface member, and the plate-like member can be selectively installed in the lower mold as the selecting member, corresponding to the shape, size, and thickness of the resin molded article. As a result, even if the product is different, resin molding can be performed by manufacturing only some of the selection members and not by newly manufacturing the molding-type molding. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

[Embodiment 2]

(Sixth embodiment)

The configuration of the molding die used as the sixth embodiment in the molding die according to the second embodiment will be described with reference to Fig. The molding die shown in Embodiment 2 is a molding die used when a wafer having a circular shape such as a silicon wafer is resin-sealed as an object to be resin molded. In the sixth embodiment, for example, a molding die for resin-sealing a silicon wafer having a diameter of 300 mm as the largest wafer will be described.

As shown in Fig. 6 (b), the mold 50 has a top mold 51 and a bottom mold 52 arranged opposite to the top mold 51. As shown in Fig. The lower mold 52 includes an inner member 54 fixed on the base 53 and the base 53 and a frame member 55 surrounding the periphery of the inner member 54. [ The inner member (54) is provided with a step portion (56) at the outer peripheral portion of the inner surface of the inner member (54). The inner member 54 includes an upper member 54a constituting the upper portion of the inner member 54 and a lower member 54b constituting the lower portion of the inner member 54. [ As shown in Fig. 6 (a), the upper member 54a and the lower member 54b constituting the inner member 54 have a circular shape. Between the frame member 55 and the base 53, an elastic member 57 for supporting the frame member 55 is provided.

The base member 53 and the inner member 54, the frame member 55 and the elastic member 57 are formed in the same manner as in the first embodiment Is a common member commonly used for resin molding of wafers having different diameters. At the position of the stepped portion 56, a selection member is provided corresponding to the diameter of the wafer. Even if the diameter of the wafer is different, the wafer can be resin-sealed by exchanging only the selection member.

In the second embodiment, a mold capable of resin-sealing a wafer having a diameter of, for example, 150 mm (6 inches) to 300 mm (12 inches) will be described. The clamping range of the upper die 51 and the lower die 52 around the wafer is set within a range of 5 mm from the wafer end when the die is clamped. The diameter of the upper member 54a of the inner member 54 is set to 140 mm (see Fig. 7A), and the diameter of the lower member 54b of the inner member 54 is set to 290 mm 6 (a)). The diameters of the upper member 54a and the lower member 54b constituting the inner member 54 set the diameter of the wafer capable of resin sealing.

The frame member 55 and the inner member 54 move relatively up and down. The gap between the inner surface of the frame member 55 and the outer surface of the lower member 54b of the inner member 54 is larger than the gap between the inner member 54 (the lower member 54b of the inner member 54) The slidable portion 58 is slid.

In the sixth embodiment, a bottom member 59 is provided as a selection member at the stepped portion 56 of the inner member 54. The bottom member 59 has an annular shape and is fitted into the stepped portion 56 of the inner member 54. The bottom surface of the bottom member 59 coincides with the top surface of the inner member 54 and the outer surface of the bottom member 59 coincides with the outer surface of the inner member 54, 56). 6 (b), a space surrounded by the inner surface of the frame member 55 and the upper surface of the inner member 54 and the bottom surface member 59 is formed in the lower mold 52 The cavity 60 is formed.

The gap between the inner surface of the frame member 55 and the outer surface of the bottom surface member 59 becomes the sliding surface portion 61 in which the bottom surface member 59 slides. The sliding portion (gap) 61 and the sliding portion (gap) 58 are communicated with each other. Thus, the inner member 54 and the bottom member 59 integrally move up and down along the sliding portion 58 and the sliding portion 61.

The upper mold 51 is supplied with, for example, a 300 mm wafer 63 on which the semiconductor chip 62 is mounted. The 300 mm wafer 63 is attracted to the upper mold 51 by sucking from the plurality of suction holes 64 formed in the upper mold 2 with the side on which the semiconductor chip 62 is mounted as the lower side.

The lower mold 52 is supplied with a release film 65 for facilitating release of the resin-sealed wafer. The release film 65 is adsorbed along the mold surface of the cavity 60 by a suction mechanism (not shown). The release film 65 is adsorbed on the mold surface of the cavity 60 through the sliding portion 61 and the sliding portion 59. In this case,

According to the sixth aspect, the bottom surface member 59 is provided as the selection member on the stepped portion 56 of the inner member 54. The cavity 60 in the lower mold 52 is formed by the inner surface of the frame member 55 and the upper surface of the inner member 54 and the bottom member 59. [ In the molding die 50 shown in the sixth embodiment, the cavity 60 corresponding to the 300 mm wafer 63 can be formed on the lower mold 52 by providing the bottom member 59 as the selection member. Therefore, the semiconductor die 62 mounted on the 300 mm wafer 63 can be resin-sealed using the die 50. [

(Seventh Embodiment)

The configuration of the molding die used as the seventh embodiment in the molding die according to the second embodiment will be described with reference to Fig. The molding die shown in the seventh embodiment is described as a molding die in which a silicon wafer having a diameter of 150 mm is resin-sealed as the smallest wafer.

As shown in Fig. 7 (b), the forming die 66 has a top die 51 and a bottom die 67 arranged opposite to the top die 51. As shown in Fig. The lower mold 67 includes a base 53, an inner member 54 fixed on the base 53, a frame member 55 surrounding the periphery of the inner member 54, (57) provided between the base (55) and the base (53). These configurations are the same as those of the sixth embodiment.

In the seventh aspect, the side member 68 is provided as the selecting member on the inner upper side of the frame member 55. The side member 68 has an annular shape and is provided at a position corresponding to the step portion 56 of the inner member 54. The upper surface of the side member 68 is aligned with the upper surface of the frame member 55 so that the side member 68 is provided on the upper inside of the frame member 55. The space surrounded by the inner surface of the side member 68 and the upper surface of the inner member 54 constitutes the cavity 69 in the lower mold 67 in the lower mold 67. Between the side member 68 and the lower member 54b of the inner member 54, an elastic member 70 for supporting the side member 68 is provided.

The gap between the inner surface of the side member 68 provided on the upper portion of the frame member 55 and the outer surface of the upper member 54a of the inner member 54 is set to be smaller than the gap And becomes the moving part 71. [ The sliding portion (gap) 71 communicates with the sliding portion (gap) 58 via the stepped portion 56.

The upper die 51 is supplied with a 150 mm wafer 73 on which the semiconductor chip 72 is mounted. The 150 mm wafer 73 is attracted to the upper die 51 by sucking from the plurality of suction holes 64 formed in the upper die 51 with the side on which the semiconductor chip 72 is mounted as the lower side. As in Embodiment 1, the suction holes 64a, which are not included in the size of the 150 mm wafer 73, are blocked by the fixing member 74 so that air is not leaked.

A release film 75 is supplied to the lower mold 67. The release film 75 is adsorbed along the mold surface of the cavity 69 by a suction mechanism (not shown). The release film 75 is adsorbed on the mold surface of the cavity 69 through the sliding portion 71, the stepped portion 56 and the sliding portion 58.

According to the seventh aspect, the side member 68 is provided as the selecting member on the inner upper side of the frame member 55. The cavity 69 of the lower mold 67 is formed by the inner surface of the side member 68 and the upper surface of the inner member 54. [ The cavity 69 corresponding to the 150 mm wafer 73 can be formed on the lower mold 67 by providing the side member 68 as the selection member in the molding die 66 shown in the seventh embodiment. Therefore, the semiconductor die 72 mounted on the 150 mm wafer 73 can be resin-sealed using the die 66. [

In addition, like the first embodiment, the plate member can be provided as the selecting member on the mold surface of the cavity. Thus, the depth of the cavity can be arbitrarily changed. Therefore, even when the wafer is resin-sealed, the thickness of the resin molded article can be adjusted.

(Action effect)

In this embodiment, the molds 50 and 66 are molding molds having the lower molds 52 and 67 of the first type and the upper mold 51 of the second type arranged to face each other. The lower molds 52 and 67, And a frame member 55 and an inner member 54 disposed on the inner side of the frame member 55. The frame member 55 and the inner member 54 are relatively movable in the vertical direction, The inner member 54 is provided with a step portion 56 at the outer periphery of the mold surface and the side member 68 which is the first member is provided on the frame member 55 at a position corresponding to the step portion 56 And the inner member 54 is configured such that the side member 68 and the bottom member 59, which is a second member, can be installed.

With such a constitution, the inner member 54 and the frame member 55 can be resin-sealed and can be used as a common member commonly used for wafers. The bottom member 59 and the side member 68 are resin- The selection member can be selected in correspondence with the wafer of FIG. Therefore, a cavity corresponding to a wafer having a diameter to be resin-sealed can be formed on the lower mold. Even if the diameters of the wafers are different, resin molding can be performed by manufacturing only some of the selection members without newly forming a molding die. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

According to the sixth embodiment, in the lower mold 52, the bottom member 59 is provided as a selection member on the step portion 56 of the inner member 54. The cavity 60 in the lower mold 52 is formed by the inner surface of the frame member 55 and the upper surface of the inner member 54 and the bottom member 59. [ The cavity 60 corresponding to the 300 mm wafer 63 can be formed on the lower mold 52 by providing the bottom member 59 as the selecting member in the inner member 54. [ Therefore, the semiconductor die 62 mounted on the 300 mm wafer 63 can be resin-sealed using the die 50. [

According to the seventh aspect, in the lower die 67, the side member 68 is provided as the selecting member on the inner upper side of the frame member 55. The cavity 69 of the lower mold 67 is formed by the inner surface of the side member 68 and the upper surface of the inner member 54. [ It is possible to form the cavity 69 corresponding to the 150 mm wafer 73 on the lower mold 67 by providing the side member 68 as the selecting member on the frame member 55. [ Therefore, the semiconductor die 72 mounted on the 150 mm wafer 73 can be resin-sealed using the die 66. [

According to the present embodiment, the lower die has the base 53, the inner member 54, the frame member 55, and the elastic member 57 as a common member. The bottom surface member, the side surface member, and the plate-like member can be selected as the selecting member and can be selected as the lower surface corresponding to the diameter of the wafer to be resin-sealed. As a result, even if the diameter of the wafer is different, resin sealing can be achieved by manufacturing only some selection members and not by newly forming a molding die. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

According to the present embodiment, a molding die capable of resin-sealing a silicon wafer having a diameter of 150 mm to 300 mm has been described. The present invention is not limited to this, and a molding die capable of resin-sealing a 450 mm wafer having a large diameter can be used. Conversely, as the wafer having a small diameter, a forming mold capable of resin-sealing a wafer having a diameter of 50 mm to 125 mm may be used. Further, the compound semiconductor wafer may be resin-sealed without being limited to the silicon wafer.

[Embodiment 3]

(Configuration of resin molding apparatus)

A configuration of a resin molding apparatus having a molding die according to the present invention will be described with reference to Fig. The resin molding apparatus shown in Fig. 8 is a resin molding apparatus using a compression molding method. And a substrate such as a printed board or a lead frame is resin-molded as an object to be resin-molded.

The resin molding apparatus 76 includes a substrate supply and storage module 77, three molding modules 78A, 78B, and 78C, and a resin supply module 79 as components. The substrate supply and storage module 77 as a component and the molding modules 78A, 78B and 78C and the resin supply module 79 can be detached from each other and replaced with each other .

The substrate supply / storage module 77 is provided with a pre-sealing substrate supply section 81 for supplying the pre-sealing substrate 80, a sealed substrate storage section 83 for storing the sealed substrate 82, A substrate loading section 84 for transferring the substrate 80 and the sealed substrate 82 to each other and a substrate transport mechanism 85 for transporting the unsealed substrate 80 and the sealed substrate 82 are provided. The predetermined position S1 is a stand-by position in a state in which the substrate transport mechanism 85 is not operated.

In each molding module 78A, 78B, 78C, for example, the molding die 1 shown in the first form (Fig. 1) is provided. The forming die 1 is provided with a lower die 3 which is disposed opposite to the upper die 2 and the upper die 2 and can be lifted and lowered. Each of the molding modules 78A, 78B and 78C has a mold clamping mechanism 86 for clamping and releasing the upper mold 2 and the lower mold 3 (a portion indicated by a chain double-dashed line in the figure). A cavity 11 is formed in the lower mold 3 as a space to which the resin material is supplied. The lower mold 3 is provided with a release film supply mechanism 87 for supplying a release film 16 of a long shape (see Fig. 1).

The resin supply module 79 includes an XY table 88, a resin material accommodating portion 89 for accommodating a resin material, a resin material introducing mechanism 90 for injecting a resin material into the resin material accommodating portion 89, And a resin material conveying mechanism 91 for conveying the resin material receiving portion 89 are provided. The predetermined position R1 is a stand-by position in a state in which the resin material transport mechanism 91 does not operate.

The substrate supply / storage module 77 is provided with a control unit CTL. The control unit CTL controls the transportation of the substrate before the sealing 80 and the sealing substrate 82, the transportation of the resin material, the heating of the molding die 1, the mold clamping of the molding die 1, . In other words, the control unit CTL controls each operation in the substrate supply / storage module 77, the molding modules 78A, 78B, and 78C, and the resin supply module 79. [ The control unit CTL may be installed in each of the molding modules 78A, 78B, and 78C, in the resin supply module 79, or in the exterior of each module. The control unit CTL may be configured as a plurality of control units that are at least partially separated according to the operation to be controlled.

(Operation for manufacturing a resin molded article)

8 and 9, an operation for manufacturing a resin molded article using the resin molding apparatus 76 will be described. First, in the substrate supply / storage module 77, the unsealed substrate 80 is delivered from the unseasoned substrate supply portion 81 to the substrate loading portion 84. Subsequently, the substrate transport mechanism 85 is moved in the -Y direction from the predetermined position S1, and the substrate 80 is received from the substrate stacking section 84. The substrate transport mechanism 85 is returned to the predetermined position S1.

Next, the substrate transport mechanism 85 is moved in the + X direction up to a predetermined position M1 of the forming module 78B, for example. Subsequently, in the forming module 78B, the substrate transport mechanism 85 is moved in the -Y direction to stop at a predetermined position C1 above the lower die 3. Subsequently, the substrate transport mechanism 85 is raised to supply the unsealed substrate 80 to the mold surface of the upper mold 2 (see Fig. 9 (a)). The substrate transport mechanism 85 is returned to the predetermined position S1 of the substrate supply / storage module 77. [

The resin material accommodating portion 89 loaded on the XY table 88 is moved in the -Y direction so that the resin material accommodating portion 89 is inserted into the resin material injecting mechanism 90, As shown in Fig. A predetermined amount of the resin material is charged into the resin material receiving portion 89 from the resin material charging mechanism 90 by moving the X-Y table 88 in the X direction and the Y direction. The X-Y table 88 on which the resin material accommodating portion 89 is loaded is returned to its original position.

Subsequently, the resin material conveying mechanism 91 is moved in the -Y direction from the predetermined position R1 to receive the resin material accommodating portion 89 stacked on the X-Y table 88. The resin material transport mechanism 91 is returned to the predetermined position R1.

Subsequently, the resin material transport mechanism 91 is moved in the -X direction to the predetermined position M1 of the forming module 78B. Subsequently, in the forming module 78B, the resin material transport mechanism 91 is moved in the -Y direction to stop at a predetermined position C1 above the lower mold 3. The resin material conveying mechanism 91 is lowered to supply the resin material 92 to the cavity 11 (see Fig. 9 (a)). The resin material transport mechanism 91 is returned to the predetermined position R1. 9 shows a case in which granular resin is used as the resin material 92. Fig.

Then, as shown in Fig. 9 (b), the resin material 92 is melted to produce a fluid resin 93. [ The lower mold 3 is lifted by the mold clamping mechanism 86 and the upper mold 2 and the lower mold 3 are clamped together. The semiconductor chip 94 mounted on the unsealed substrate 80 is immersed in the molten fluid resin 93 in the cavity 11. [

9 (c), the inner member 5 is raised by further raising the lower mold 3, and a predetermined resin pressure is applied to the fluid resin 93 in the cavity 11. As shown in Fig. Subsequently, the fluid resin 93 is heated for a time required for curing the fluid resin 93 by using a heater (not shown) provided in the lower mold 3. The fluid resin (93) is cured to form the cured resin (95). Thus, the semiconductor chip 94 mounted on the pre-sealing substrate 80 is resin-sealed with the molded resin 95 corresponding to the shape of the cavity 11.

9 (d), the upper mold 2 and the lower mold 3 are opened using the mold clamping mechanism 86 after the fluid resin 93 is cured. A resin-molded resin molded article 96 (a sealed substrate 82) is fixed to the mold surface of the upper mold 2.

The substrate transport mechanism 85 is moved from the predetermined position S1 of the substrate supply and storage module 77 to the predetermined position C1 below the upper mold 2 to receive the sealed substrate 82. [ Subsequently, the substrate transport mechanism 85 is moved to transfer the sealed substrate 82 to the substrate loading section 84. And the sealed substrate 82 is stored in the sealed substrate storage portion 83 from the substrate loading portion 84. In this step, resin sealing is completed.

(Action effect)

According to the present embodiment, a part of the molding die used in the resin molding apparatus can be selectively installed. The forming die is constituted by a common member commonly used for all products and a selection member used corresponding to each product. The selection member can be selected and installed in the common member of the molding die corresponding to the shape, size and thickness of the resin molded article. Thus, even if the product is different, only a part of the selection member can be manufactured without newly forming a molding die. Therefore, in the resin molding apparatus, the manufacturing cost of the molding die can be reduced. Further, the delivery period for manufacturing the mold can be shortened. In addition, the productivity of resin molding can be improved.

In this embodiment, the case where the molding die shown in the first embodiment (Fig. 1) is provided in the molding module is shown. The present invention is not limited to this, and the molds shown in the second form (FIG. 2) to the seventh form (FIG. 7) can be provided corresponding to the product to be resin molded. In the resin molding apparatus, by replacing only a selection member of a molding die, various kinds of products can be dealt with.

In each embodiment, the case where the cavity is formed in the lower mold is shown. The present invention is not limited to this, and the same effect can be obtained even when the cavity is formed in the upper mold. Further, when the cavity is formed in the upper mold, the mold provided by the frame-like member and the inner member disposed inside thereof is disposed on the upper side, so that the mold opposite to the mold is disposed on the lower side. Therefore, in this case, the bottom surface member, the side surface member, and the plate-like member, which are selectively installed selection members, are also arranged on the upper side.

The present invention is also applied to a resin molding apparatus for molding a general resin molded article. The present invention is applicable not only to the case where the electronic parts are resin-sealed but also when the optical parts such as a lens, a reflector (reflector), a light guide plate, an optical module, and other resin products are produced by resin molding.

As described above, in the molding die of the above-described embodiment, the molding die having the first die and the second die disposed opposite to each other is used. In the first die, an inner member disposed on the inner side of the frame- Wherein the frame member and the inner member are movable in a relatively vertical direction and the inner member is provided with a step portion on the outer peripheral portion of the mold surface and the frame member is provided with a first member And the inner member is configured such that the second member can be selectively installed with the first member.

According to this configuration, by providing the first member or the second member selectively, it is possible to provide a mold capable of resin-molding an object having a different size or shape. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

In the molding die of the above-described embodiment, when the first member is provided on the frame-like member, the gap between the side surfaces of the first member and the inner member, which face each other, And is configured to communicate with the gap between the opposing side surface of the frame member and the side surface of the inner member.

According to this configuration, by providing the first member on the frame member, it is possible to provide a mold capable of resin-molding an object having a small size. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

In the molding die of the above-described embodiment, when the second member is provided on the inner member, the gap between the side surfaces of the second member facing each other and the side of the frame member is set to a distance And is configured so as to communicate with a gap between the opposing side surface of the frame member and the inner member.

According to this configuration, by providing the second member on the inner member, it is possible to provide a mold capable of resin-molding an object having a large size. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

In the molding die of the above-described embodiment, when the first member is provided on the frame member, an elastic member can be provided between the first member and the inner member.

According to this configuration, by providing the first member on the frame member, it is possible to provide a mold capable of resin-molding an object having a small size. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

The molding die of the above embodiment is a molding die having a first die and a second die disposed opposite to each other. The first die includes an inner member disposed on the inner side of the frame member and the frame member, The upper member and the inner member are movable in a relatively vertical direction and the inner member can be replaced by a member having a shape provided with a step portion on the outer peripheral portion of the mold surface and a member having a shape not provided with a step portion, And the first member can be installed at a position corresponding to the stepped portion.

According to this configuration, by replacing the inner member, it is possible to provide a mold capable of resin-molding an object having a different size or shape. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

The molding die of the above embodiment is a molding die having a first die and a second die disposed opposite to each other. The first die includes an inner member disposed on the inner side of the frame member and the frame member, The upper member and the inner member are movable in a relatively upward and downward direction and the inner member is provided with a step portion on the outer peripheral portion of the mold surface and the second member can be provided and the frame member is located at a position corresponding to the step portion A member having a shape in which the protruding protrusion is provided and a member in a shape in which the protrusion is not provided can be exchanged.

According to this configuration, by replacing the frame member, it is possible to provide a mold capable of resin-molding an object having a different size or shape. Therefore, it is possible to reduce the manufacturing cost of the molding die used in the production of the resin molded article. In addition, the productivity of resin molding can be improved.

The resin molding apparatus of the above-described embodiment is configured to use any of the above-described molding types.

According to this configuration, an object having a different size or shape can be resin-molded by using any of the above-described molds.

In the method of manufacturing a resin molded article of the above embodiment, resin molding is performed using a resin disposed in a cavity formed by the frame member and the inner member.

According to this method, it is possible to form a cavity whose size and shape are different from each other in accordance with the frame member and the inner member, and resin molding can be performed using the resin disposed in the cavity.

The present invention is not limited to the above-described embodiments, and can be appropriately combined, changed, or selected as needed within the scope of the present invention.

1, 17, 27, 37, 50, 66: mold
2, 51: Upper type (Type 2, Type 1)
3, 18, 28, 38, 52, 67: lower type (Type 1, Type 2)
4, 53: foundation stand
5, 54: inner member
5a, 54a:
5b, 54b:
6, 55: frame member
6a, 40a:
7, 56: stepped portion
8, 57: elastic member
9, 12, 22, 33, 43, 58, 61, 71:
10, 29, 39, 59: bottom member (second member)
11, 20, 31, 41, 60, 69: cavity
13, 23, 34, 44, 45, 62, 72: semiconductor chips
14, 24, 35, 46: substrate
15, 15a, 64, 64a: suction hole
16, 26, 36, 47, 65, 75: release film
19, 30, 40, 68: side member (first member)
21, 32, 42, 70: elastic member
25, 74: Fixing member
48, 49: Plate member
63: 300 mm wafer
73: 150 mm wafer
76: resin molding device
77: Substrate supply / storage module
78A, 78B, 78C: molding module
79: Resin supply module
80: Pre-sealing substrate
81: Pre-sealing substrate supply part
82: Sealed substrate
83: Sealed substrate storage section
84:
85: substrate transport mechanism
86: Mold fastening mechanism
87: release film feeding mechanism
88: XY table
89: Resin material receiving portion
90: resin material input mechanism
91: resin material conveying mechanism
92: resin material (resin)
93: Fluid Resin
94: Semiconductor chip
95: Cured resin
96: Resin molding product
CTL:
S1, R1, M1, C1:

Claims (8)

A molding die having a first die and a second die disposed opposite to each other,
The first mold has a frame-shaped member and an inner member disposed inside the frame-shaped member,
Wherein the frame-shaped member and the inner member are movable in a relatively vertical direction,
Wherein the inner member is provided with a stepped portion at an outer peripheral portion of the mold surface,
Wherein the frame member is provided with a first member at a position corresponding to the step portion,
Wherein the inner member is provided with the first member and optionally the second member. The image forming apparatus according to claim 1, wherein, when the first member is provided on the frame-like member, a gap between the first member side surface and the inner member side surface facing each other is larger than a gap And communicates with the gap between the frame member side surface and the inner member side surface facing each other. 2. The image forming apparatus according to claim 1, wherein, when the second member is provided on the inner member, a gap between the second member side surface and the frame member side surface facing each other is larger than a gap between the second member side surface and the frame- And communicates with the gap between the frame member side surface facing each other and the inner member. The forming die according to claim 1, wherein when said first member is provided on said frame member, an elastic member can be provided between said first member and said inner member. A molding die having a first die and a second die disposed opposite to each other,
The first mold has a frame-shaped member and an inner member disposed inside the frame-shaped member,
Wherein the frame-shaped member and the inner member are movable in a relatively vertical direction,
Wherein the inner member includes a member having a stepped portion at an outer peripheral portion of the mold surface and a member having a shape not provided with the stepped portion,
Wherein the frame member is provided with a first member at a position corresponding to the step portion. A molding die having a first die and a second die disposed opposite to each other,
The first mold has a frame-shaped member and an inner member disposed inside the frame-shaped member,
Wherein the frame-shaped member and the inner member are movable in a relatively vertical direction,
Wherein the inner member is provided with a stepped portion on the outer peripheral portion of the mold surface,
Wherein the frame-shaped member is capable of exchanging a member having a shape provided with a protruding portion protruding to a position corresponding to the stepped portion, and a member having a shape not provided with the protruding portion. A resin molding apparatus comprising the molding die according to any one of claims 1 to 6. A method of manufacturing a resin molded article using the molding die according to any one of claims 1 to 6,
And a step of performing resin molding using a resin disposed in a cavity formed by the frame member and the inner member.

Images