JP2005088395A - Resin molding method and resin molding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform resin molding without the occurrence of a resin fin by discharging air from a cavity without providing a resin molding die with an air vent at all. <P>SOLUTION: In a resin molding method, a die, which is not provided with the air-vent, is used as the resin molding die; a resin 50 is clamped with an article 30 to be molded, by the resin molding die; and the resin molding is performed by compression molding. When the resin 50 is clamped with the article 30 by using the resin molding dies 20 and 21, firstly, a clamp surface pressure for clamping the article to be molded is set at a set pressure which enables the discharge of the air from the cavity 42 and which inhibits the leakage of the resin from the cavity; in a state wherein the article 30 is clamped by the set pressure, mold clamping is performed until the resin 50 is infilled into the cavity 42, so that the air can be discharged from inside the cavity 42; the clamp surface pressure is set at a closing pressure which prevents the resin from being leaked from the cavity by a molding pressure in the molding of the resin infilled into the cavity; and after that, the molding pressure is applied to the resin, so that the resin molding can be performed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin molding method and a resin molding apparatus, and more particularly to a resin molding method and a resin molding apparatus that enable resin molding without providing an air vent in a mold.

As a method of resin-molding a molded product such as a substrate or semiconductor wafer on which a large number of semiconductor chips are mounted using a resin mold, the resin is supplied to the cavity with the mold open, and the molded product is compressed and molded There is a method of resin molding.
In this way, when the molded product is clamped with a resin mold and resin molded, air remains in the cavity, so that air is prevented from being mixed into the resin and causing voids in the molded resin. For the purpose, the mold is provided with an air vent, and the resin is molded so that the air in the cavity is discharged from the air vent to the outside when the cavity is filled with resin.

The air vent allows the air in the cavity to be discharged out of the cavity by the resin pressure at the time of resin molding. The mold surface is slightly ground, and the resin does not leak when the resin pressure is applied. It is provided to discharge only the outside. Although the site | part which provides an air vent changes with shapes of a to-be-molded product, it provides so that it may connect with the cavity with which resin is filled.
JP 2002-176067 A JP-A-10-217286

  As a method of resin molding without providing an air vent in the mold, there is a method of evacuating the air remaining in the cavity when the molded product is clamped with the resin mold mold and performing resin molding. In a resin molding apparatus, a method of resin molding by providing an air vent in a mold is common. As described above, since the air vent gives priority to the discharge of air in the cavity, the resin is actually discharged slightly together with the air. For this reason, when resin molding is performed using a mold in which an air vent is formed, the resin discharged from the air vent portion becomes a resin flash and adheres to the surface of the molded product, and the mold surface of the resin mold mold Will also adhere to.

FIG. 13 shows an example in which a resin flash is generated on a molded product by an air vent provided in a resin mold. In the figure, 10 is a molded product, 12 is a resin mold part, and 14 is a resin beam. In the illustrated example, an air vent is provided around the cavity, and the resin flash 14 is generated around the resin mold portion 12. Since the resin beam adheres to the mold surface at the portion where the resin beam 14 is generated, the mold surface is cleaned and resin-molded for each resin molding operation during resin molding.
Moreover, when providing an air vent around the resin mold part 12 as shown in FIG. 13, it is necessary to secure an air vent region between adjacent cavities, and there is a problem that the arrangement of the cavities close to each other is restricted. is there.

  The present invention has been made to solve these problems, and the object of the present invention is to suitably discharge air remaining in the cavity without providing an air vent in the mold. It is an object of the present invention to provide a resin molding method and a resin molding apparatus that make it possible to mold a resin while preventing the product from being soiled by a resin beam.

The present invention has the following configuration in order to achieve the above object.
That is, a resin molding method in which a mold without an air vent is used as a resin mold, the resin is clamped together with a molded product by the resin mold, and the resin mold is molded by compression molding. When clamping the resin together with the molded product by the mold, first set the clamping surface pressure that clamps the molded product to a set pressure that enables air to be discharged from the cavity and prevents the resin from leaking from the cavity, With the set pressure clamped, the mold is clamped until the resin is filled in the cavity, air is discharged from the cavity, and the clamping surface pressure is molded into the resin filled in the cavity. After setting the closing pressure so that the resin does not leak from the cavity due to the molding pressure when Characterized by fat mold.

  Also, a resin molding method in which a mold without an air vent is used as a resin mold, the resin is clamped together with a molded product by the resin mold, and the resin mold is molded by compression molding. When clamping the resin together with the molded product with the mold, first set the clamp interval between the molded product and the resin mold die to the set interval that allows air to be discharged from the cavity and prevents the resin from leaking out of the cavity Then, in a state where the molded product is clamped by this set interval, the mold is clamped until the resin is filled in the cavity, and air is discharged from the cavity, and the clamp interval is set to the resin filled in the cavity. After setting the closing interval so that the resin does not leak from the cavity due to the molding pressure during molding, the molding pressure is applied to the resin. Multiplied characterized by a resin mold.

Also, a resin mold apparatus that uses a mold without an air vent as a resin mold, clamps the resin together with the molded product with the resin mold, and molds the resin by compression molding. A clamper that is supported movably and clamps a workpiece to define a cavity region by clamping, and a cavity piece that is slidably contacted with the clamper and is movably supported in a mold opening and closing direction to define a bottom surface of the cavity, The clamping surface pressure that clamps the molded product is a set pressure that allows air to be discharged from the cavity and prevents resin leakage when discharging air from the cavity, and prevents resin leakage from the cavity during resin molding. A clamper driving means for driving the clamper as a closing pressure to be blocked, and the clamper causes the product to be molded by the set pressure. When clamping, the cavity piece is driven to discharge air from the cavity, and when the clamper clamps the molded product by the closing pressure, the cavity piece is driven to fill the cavity. And a driving means for the cavity piece for molding the resin.
Further, a spring that springs in the mold opening / closing direction is used as the clamper driving means, and the mold of the resin mold is clamped by program control that regulates the prescribed operation.
In addition, a detection unit that detects the clamp surface pressure and the cavity internal pressure is provided, and the mold clamping of the resin mold is performed by feedback control that controls the clamp surface pressure and the cavity internal pressure to a predetermined value based on information detected by the detection unit. It is characterized by performing.

  According to the resin molding method and the resin molding apparatus according to the present invention, when clamping the molded product together with the resin and resin molding, the clamping surface pressure for clamping the molded product is adjusted to the set pressure and the closing pressure, and the resin is molded. At the same time, resin molding is performed by combining the operation of clamping the molded product with the clamped state of the molded product, so that air can be surely discharged from the cavity without causing an air vent at all and a resin flash can be generated. It is possible to mold the resin without using it. As a result, there is no void in the molding resin, and the semiconductor device can be provided as a highly reliable semiconductor device, and resin molding can be performed without soiling the mold.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
1-4 is explanatory drawing which shows one Embodiment of the resin mold method which concerns on this invention. In the figure, a configuration of a resin mold is shown as a characteristic component in the resin mold apparatus. In the present embodiment, the upper mold 20 of the resin mold is supported by the fixed platen of the press device, and the lower mold 21 is supported by the movable platen and is driven to open and close the mold to resin mold the product to be molded. Of course, the upper mold 20 can be supported by the movable platen of the press apparatus, and the lower mold 21 can be supported by the fixed platen.

First, the configuration of the resin mold will be described with reference to FIG. The resin mold mold according to the present embodiment is one in which the molded product 30 is supported by the upper mold 20 and the molded product 30 is compression-molded together with the resin 50 supplied to the lower mold side. The molded product 30 has a plurality of semiconductor chips 32 arranged in a matrix on a substrate 31. The plurality of semiconductor chips 32 arranged in a region surrounded by the cavity are collectively resin-molded. It is comprised so that.
The molded product 30 can be a semiconductor wafer, a product in which a semiconductor chip is mounted on a lead frame, or the like in addition to a substrate 31 on which a semiconductor chip 32 is mounted. The product 30 is supported on the mold surface of the upper mold 20 by, for example, air adsorption.

  Reference numeral 22 denotes a cavity piece formed corresponding to a planar area of a cavity for resin molding the article 30 to be molded. A cavity piece support block 24 is provided so as to be able to come into contact with the lower surface of the cavity piece 22, and 24 a is provided so as to repel between the cavity piece support block 24 and the lower mold 21 in the mold opening / closing direction. It is a spring. When the molded product 30 is resin-molded by a plurality of cavities, a plurality of cavity pieces 22 are also provided in accordance with the arrangement of the cavities.

Reference numeral 26 denotes a clamper provided in an arrangement surrounding the cavity piece 22. The cavity piece 22 is supported by the clamper 26 such that the cavity piece 22 is movable in the opening / closing direction of the mold in the storage hole provided in the clamper 26, and the lowered position with respect to the clamper 26 is regulated by a step provided on the bottom side of the storage hole. . Reference numeral 28 denotes a clamper set block that comes into contact with the lower surface of the clamper 26, and reference numeral 28 a denotes a spring that is elastically provided between the clamper set block 28 and the lower mold 21.
Reference numeral 29 denotes a clamper closing block disposed below the clamper 26, and 29 a denotes a spring that is provided between the clamper closing block 29 and the lower mold 21.

As shown in FIG. 1, when the mold is opened, the clamper 26 is supported by a spring 28a and a clamper set block 28, and the cavity piece support block 24 and the clamper closing block 29 are separated from the cavity piece 22 and the clamper 26, respectively. In the position.
In the mold open state, the release film 40 is disposed so as to cover the cavity recess 25 formed by the clamper 26 and the cavity piece 22, and the resin mold operation is performed by supplying the resin 50 to the cavity recess 25 covered by the release film 40. Be started.

  The release film 40 can be pre-formed according to the shape of the cavity recess 25 and set in the cavity recess 25, or the release film 40 having the required flexibility and heat resistance can be adsorbed to the clamper 26 by air. You can also set it. In this case, air is sucked from the bottom surface side of the cavity recess 25, so that the release film 40 can be adsorbed by air following the inner surface shape of the cavity recess 25.

  As the resin 50, for example, a liquid resin is measured and supplied to the cavity recess 25. As shown in FIG. 1, the resin 50 can be supplied as one lump, or divided and applied in accordance with the position of the semiconductor chip 32 mounted on the molded product 30 in order to suppress the flow of the resin. The application form can be arbitrarily selected. In addition, the resin 50 can be supplied into the cavity recess 25 after the release film 40 is set in the mold, or the resin 50 is applied to the release film 40 in advance outside the mold, and the release film together with the resin 50. It is also possible to set 40 in a mold.

2 to 4 show a process of resin molding the article 30 by moving the lower mold 21 upward from the state in which the resin 50 is supplied to the mold as shown in FIG.
In the resin molding apparatus of the present embodiment, a cavity into which the resin 50 is compression-molded (filled) is formed by clamping the molded product 30 with the upper end surface which is the clamp surface of the clamper 26. Therefore, if it is a form similar to the conventional resin molding apparatus, an air vent is provided on the clamp surface of the clamper 26. However, in this embodiment, the clamper 26 is resin-molded without providing any air vent. The resin mold can be resin-molded without providing an air vent. In the resin mold apparatus according to the present embodiment, the clamp surface pressure and the like of the clamper 26 are functionally adjusted to perform resin molding. by.

Below, the process of resin-molding using the resin mold metal mold | die of this embodiment is demonstrated with FIGS.
With the resin 50 supplied to the mold, the lower mold 21 is moved up, the molded product 30 is clamped by the upper end surface of the clamper 26, and the surface pressure of the clamper 26 reaches the set pressure. The set pressure means a surface pressure state where air in the cavity leaks but the resin 50 does not leak. By setting the surface pressure of the clamper 26 to the set pressure, the joint surface between the release film 40 and the molded product 30 can be set so that air passes but the resin 50 does not pass.

The operation of setting the clamper 26 to the set pressure is performed by the action of elastically pushing up the clamper 26 via the clamper set block 28 by the spring 28a. The set pressure, which is a clamping surface pressure state in which air leaks but resin 50 does not leak, varies depending on the viscosity of the resin 50 used and the size of the clamp area of the clamper 26. When it is difficult for both air and resin to leak out, it may be appropriate to set the setting pressure to 0 and leave a slight gap between the release film 40 and the molded product 30. By adjusting the elastic force or displacement amount of the spring 28a, the clamp surface pressure by the clamper 26 can be adjusted to a required set pressure.
FIG. 2 shows a state in which after the workpiece 30 is clamped by the clamper 26, the lower die 21 is further moved upward so that the upper end surface of the cavity piece support block 24 contacts the lower surface of the cavity piece 22.

  When the lower mold 21 is further moved upward from the state in which the upper end surface of the cavity piece support block 24 is in contact with the lower surface of the cavity piece 22, the cavity piece 22 is pushed up via the spring 24a and the cavity piece support block 24. When the cavity piece 22 is moving up, the clamper 26 clamps the molded product 30 with the set pressure, and the cavity piece 22 moves up relative to the clamper 26. Thus, the cavity piece 22 moves upward with respect to the clamper 26, so that only the air can be discharged without discharging the resin 50 from the cavity 42.

FIG. 3 shows a state where the cavity piece 22 is moved upward to discharge air from the cavity 42, in other words, a state where the cavity 42 is filled with the resin 50. When the air is completely discharged from the cavity 42, the pressure of the resin 50 in the cavity 42 rapidly increases and reaches the filling pressure.
In this state, as shown in FIG. 3, the upper end surface of the clamper closing block 29 comes into contact with the lower surface of the clamper 26. In other words, the cavity piece 22 is moved upward to discharge air from the cavity 42, and when the cavity 42 is filled with the resin 50, the clamper closing block 29 so that the upper end surface of the clamper closing block 29 contacts the lower surface of the clamper 26. 29 and a spring 29a are arranged.

  When the lower die 21 is further moved upward from the state in which the upper end surface of the clamper closing block 29 is in contact with the lower surface of the clamper 26, the clamper 26 is pressed against the molded product 30 via the elastic force of the spring 29 a and the clamper closing block 29. The The elastic force (pressing force) of the spring 29a is set to be larger than the pressing force of the spring 28a that supports the clamper set block 28, and the clamper 26 is filled in the cavity 42 by the operation of further moving the lower die 21 upward. When a molding pressure is applied to the existing resin 50, the molded product 30 is clamped by a closing pressure that does not leak the resin 50 from the cavity 42.

In a state where the molded product 30 is clamped by the clamper 26 with a closing pressure at which the resin 50 does not leak from the cavity 42, the lower mold 21 is finally moved up to the clamping position, and the inside of the cavity 42 is set as a molding pressure. The cavity piece 22 is pushed up to the final molding position, and the resin 50 is cured in a state where the cavity 42 reaches the molding pressure.
FIG. 4 shows a state in which the molded product 30 is clamped by the clamper 26 with a closing pressure, and the resin 50 in the cavity 42 is resin-molded by the molding pressure. When the molding pressure is applied to the cavity 42, the molded product 30 is clamped by the clamper 26 with the closing pressure, so that the resin does not leak to the outside of the cavity 42, and the resin flashes outside the cavity 42. Will not occur.

After the resin molding, the lower mold 21 is lowered to the original position so that the clamp between the molded product 30 and the clamper 26 is released, the mold is opened, and the molded product is taken out from the mold with the mold opened. .
Thus, the molded product 30 can be resin-molded by the resin molding process shown in FIGS. According to the resin molding method of this embodiment, air can be reliably discharged from the cavity 42 and resin molding can be performed without providing an air vent at all in the mold, and a resin beam is generated on the molded product or the mold surface. Resin molding can be performed without any problem.

In FIG. 5, the above-described resin mold has the opposite arrangement between the upper mold side and the lower mold side, the upper mold 20 is provided with a cavity piece 22, a clamper 26, etc. An example in which 50 is supplied and resin molding is performed is shown. As described above, the resin mold apparatus can be configured by arranging the upper mold side and the lower mold side in reverse.
In the above embodiment, the molded product 30 is supported on the mold surface of the upper mold 20. However, after the resin 50 is supplied to the cavity recess 25, the molded product 30 is set on the upper surface of the clamper 26. The molded product 30 does not necessarily have to be supported by the upper mold 20.
In the present embodiment, the program control for clamping the lower die 21 with the drive speed and stroke determined in advance is performed. However, in order to optimize the resin mold conditions, the die drive is performed by more precise feedback control. It is also possible to do.

6 to 9 show another embodiment of the resin molding apparatus according to the present invention, a resin molding apparatus configured to clamp the resin mold by feedback control using a driving cylinder and drive the clamper. The resin mold process using a resin mold apparatus is shown.
FIG. 6 shows a state in which the release film 40 and the resin 50 are supplied to the cavity recess 25 formed by the cavity piece 22 and the clamper 26 in a state where the mold is opened. The resin mold apparatus of this embodiment includes a main drive cylinder 70 that drives the lower mold 21 in the mold opening / closing direction and a sub drive cylinder 72 that drives the clamper 26, and the upper mold is fixed.
FIG. 6 shows a state in which the pistons of the main drive cylinder 70 and the sub drive cylinder 72 are in the lower position and the resin mold is opened.

In this embodiment, the surface pressure of the clamper 26 and the internal pressure of the cavity 42 are measured by a pressure sensor, and feedback control is performed to control the output of each drive cylinder according to the flow shown in FIG. 11 based on the measured pressure value. .
In FIG. 7, the main drive cylinder 70 is driven to move the lower die 21 upward, the molded product 30 is clamped by the upper end surface of the clamper 26, and the clamping surface pressure that presses the molded product 30 by the clamper 26 is set pressure. The output control state is shown as follows.
In the control flowchart shown in FIG. 11, the mold is driven and controlled in step 60 so that the clamping surface pressure becomes a prescribed set pressure.

  FIG. 8 shows a state in which the main drive cylinder 70 is driven and the cavity piece 22 is moved up until the internal pressure of the cavity 42 reaches the filling pressure. In FIG. 11, the mold is driven and controlled in step 62 so that the internal pressure of the cavity becomes a specified filling pressure. Since the molded product 30 is clamped by the clamper 26 with a set pressure, only the air is discharged from the cavity 42 by moving the cavity piece 22 upward. When the cavity piece 22 is moved upward, the spring 26a is compressed, and the surface pressure of the clamper 26 slightly increases. Maintaining the state to do. When the air is completely discharged, the internal pressure of the cavity rapidly rises to reach the filling pressure, so that the air discharge can be completed.

Next, in FIG. 9, the auxiliary drive cylinder 72 is driven to push up the clamper 26, the molded product 30 is clamped with a closing pressure, and the lower mold 21 is finally moved up by the main drive cylinder 70 to be molded into the resin 50. The state where pressure is applied is shown. In FIG. 11, after the mold is driven and controlled so that the clamping surface pressure becomes the prescribed closing pressure in step 63, the die is driven and controlled so that the internal pressure of the cavity becomes the prescribed molding pressure in the following step 64. The sub-drive cylinder 72 is for clamping the molded product 30 with the closing pressure by the clamper 26 so that the resin 50 does not leak from the cavity 42, and the resin 50 in a state where the molded product 30 is clamped with the closing pressure. By applying a molding pressure to the resin 50, it is possible to mold the resin without leaking the resin 50 from the cavity 42 when the molding pressure is applied to the resin 50.
As described above, it is possible to discharge the air from the cavity 42 without providing an air vent at all in the resin mold and perform resin molding without generating a resin flash.
FIG. 10 shows an example in which the configurations of the upper mold and the lower mold of the resin mold are reversed.

  In the resin molding apparatus of this embodiment, the clamper 26 is elastically pressed by the spring 26a, and the auxiliary drive cylinder 72 that pushes the clamper 26 and the spring 26a are used in combination. However, the spring is not used at all. It is also possible to configure the resin molding apparatus with only the drive cylinder. Further, as in the above embodiment, the entire lower die 21 can be controlled by being driven by the main drive cylinder 70, and the cavity piece 22 and the clamper 26 are controlled by separate drive cylinders. It is also possible. As described above, various methods can be adopted as the mold driving method.

  Further, in the resin mold apparatus of the present embodiment, the surface pressure of the clamper 26 and the internal pressure of the cavity 42 are measured by a pressure sensor, and the feedback control method is used to control the output of the drive cylinder based on the measured pressure value. Various configurations such as a feedback control system for controlling the output or stroke of the drive cylinder based on the upward movement positions of the clamper 26 and the cavity piece 22 or the output value of each drive cylinder are possible. In the present invention, the control flow shown in FIG. 11 may be realized.

FIG. 12 is a diagram for explaining how the clamping surface pressure for clamping the molded product 30 and the cavity internal pressure change with time in the resin molding method according to the present invention. The figure shows how the clamping surface pressure changes on the upper side and how the cavity internal pressure changes on the lower side.
As shown in the figure, at the start of resin molding, that is, when the mold is opened, the clamper 26 does not clamp the molded product 30, the clamping surface pressure is 0, and the cavity internal pressure is atmospheric pressure.
Next, the clamper 26 clamps the product 30 and the clamp surface pressure becomes the set pressure, and the clamper is set.
After the clamper is set, air bleeding from the cavity 42 is started. The arrow indicates that after the clamper is set, the operation moves to the air bleeding start operation on the cavity side. When the air is vented from the cavity 42, the internal pressure of the cavity increases slightly due to the air venting resistance.

The state in which air bleeding is completed is a state in which the resin 50 is filled in the cavity 42. The filling pressure by the resin 50 acts as an internal pressure on the cavity 42, and the pressure rapidly increases.
After the cavity 42 is filled with the resin 50, the operation shifts to the operation of setting the clamping surface pressure of the clamper 26 to the closing pressure on the clamper side. When the surface pressure of the clamper 26 becomes the closing pressure, the operation shifts to an operation for increasing the internal pressure of the cavity 42 to the molding pressure. The resin 50 is cured and molded by using the clamping surface pressure as the closing pressure and the cavity internal pressure as the molding pressure.

  In the resin molding step shown in FIG. 12, the state where the clamping surface pressure is set to the set pressure is a state where air can be discharged from the cavity 42, and the resin 50 is in a state where leakage is difficult. Until the cavity 42 is filled with the resin 50, only a low internal pressure is applied to the cavity to release air, and a sudden pressure change when the resin filling pressure acts on the cavity 42 is captured. By switching the clamp surface pressure from the set pressure to the closing pressure, it is possible to prevent the resin 50 from leaking from the cavity 42. As described above, by switching between the set pressure and the closing pressure, it is possible to discharge the air from the cavity 42 and perform resin molding without providing an air vent in the mold.

In FIG. 12, after the cavity internal pressure becomes the filling pressure, the clamping surface pressure is set as the closing pressure, and further the cavity internal pressure is increased to the molding pressure. However, depending on the resin mold product, the filling pressure may be increased. Some products have the same value as the molding pressure, and the boosting as shown is not necessarily performed. When the filling pressure is equal to the molding pressure, after the cavity internal pressure becomes the filling pressure, the clamping surface pressure is set as the closing pressure, and the molding pressure equal to the filling pressure is applied to complete the resin mold.
Moreover, in each embodiment mentioned above, although resin molding is carried out using the release film 40, even when resin molding is carried out without using the release film 40, the method of the present invention can be applied.

It is explanatory drawing which shows the structure of 1st Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 1st Embodiment. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 1st Embodiment. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 1st Embodiment. It is explanatory drawing which shows the modification of a 1st resin mold apparatus. It is explanatory drawing which shows the structure of 2nd Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 2nd Embodiment. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 2nd Embodiment. It is explanatory drawing which shows the resin mold process by the resin mold apparatus of 2nd Embodiment. It is explanatory drawing which shows the modification of a 2nd resin mold apparatus. It is a flowchart which shows a resin mold process. It is explanatory drawing which shows the clamp surface pressure and cavity internal pressure in a resin mold process. It is explanatory drawing which shows a mode that the resin flash produced in the to-be-molded product.

Explanation of symbols

20 Upper mold 21 Lower mold 22 Cavity block 24 Cavity block support block 25 Cavity recess 26 Clamper 28 Clamper set block 29 Clamper closing block 30 Molded product 32 Semiconductor chip 40 Release film 42 Cavity 50 Resin 70 Main drive cylinder 72 Secondary drive cylinder

Claims (5)

A resin mold method in which a mold not provided with an air vent is used as a resin mold, a resin is clamped together with a molded product by the resin mold, and resin molding is performed by compression molding.
When clamping the resin together with the molded product with the resin mold, the clamping surface pressure for clamping the molded product is a set pressure that allows the air to be discharged from the cavity and prevents the resin from leaking out of the cavity. Set to
With the molded product clamped by this set pressure, the mold is clamped until the resin is filled in the cavity, and air is discharged from the cavity.
The clamping surface pressure is set to a closing pressure at which the resin does not leak from the cavity by a molding pressure when molding the resin filled in the cavity, and then the resin is molded by applying molding pressure to the resin. Resin mold method. A resin mold method in which a mold not provided with an air vent is used as a resin mold, a resin is clamped together with a molded product by the resin mold, and resin molding is performed by compression molding.
When clamping the resin together with the molded product by the resin mold, first, the clamp interval between the molded product and the resin mold can be discharged from the cavity to prevent the resin from leaking out of the cavity. Set to set interval,
With the molded product clamped by this set interval, the mold is clamped until the resin is filled in the cavity, and the air is discharged from the cavity.
The clamp interval is set to a close interval at which the resin does not leak from the cavity due to the molding pressure when molding the resin filled in the cavity, and then the resin is molded by applying molding pressure to the resin. Mold method. A resin mold device that uses a mold without an air vent as a resin mold, clamps the resin together with the molded product by the resin mold, and molds the resin by compression molding.
A clamper that is movably supported in a mold opening and closing direction, and a clamp surface clamps a molded product to define a cavity region;
A cavity piece that is slidably contacted with the clamper and is movably supported in the mold opening and closing direction, and that defines the bottom surface of the cavity;
The clamping surface pressure that clamps the molded product is set pressure that allows air to be discharged from the cavity when the air is discharged from the cavity and prevents resin leakage, and resin leakage from the cavity during resin molding Clamper driving means for driving the clamper as a closing pressure to prevent
When the clamper clamps the molded product with the set pressure, the cavity piece is driven to discharge air from the cavity, and when the clamper clamps the molded product with the closing pressure, A resin molding apparatus, comprising: a driving means for driving the cavity piece to mold the resin filled in the cavity.   4. The resin mold apparatus according to claim 3, wherein a spring that repels in the mold opening / closing direction is used as the clamper driving means, and the mold of the resin mold is clamped by program control that regulates a prescribed operation.   And a clamping unit for clamping the resin mold by feedback control for controlling the clamping surface pressure and the cavity internal pressure to a specified value, based on detection information detected by the sensing unit. The resin molding apparatus according to claim 3.

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