JP2006027098A - Resin molding method and resin molding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a quality resin molding without making un-filling and voids of a resin in a resin molding section and to reduce fraction defective of a product. <P>SOLUTION: The resin molding method comprises the compression molding of an article 60 to be molded while the article 60 to be molded with a sealing resin 70 is clamped by using a resin molding mold 20. In a filling process which fills up a cavity with a resin, an upper fixture 36 and a lower fixture 38 which support the article 60 to be molded and the above resin 70 are separated from an upper mold 32 which is arranged facing the above upper fixture 36 or a lower mold 34 which is arranged facing the above lower fixture 38. After the above filling process, in a compression molding process which compresses and molds the resin which was filled in the above cavity, the above upper fixture 36 and the upper mold 32 are abutted, the above lower fixture 38 and the lower mold 34 are abutted, and the resin molding is performed by carrying out the thermosetting of the above resin 70. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin molding method and a resin molding apparatus, and more particularly to a resin molding method and a resin molding apparatus that can be suitably used for manufacturing a resin molded product having a thin resin mold portion.

Conventionally, a resin molding apparatus is widely used for manufacturing a semiconductor device formed by resin molding of a semiconductor chip. In this resin molding apparatus, a substrate or a lead frame on which a semiconductor chip is mounted is clamped with a resin mold mold attached to a press apparatus, and a resin is molded by filling a cavity with a molten resin. There are various resin molding methods such as transfer molding and compression molding. In resin mold products such as semiconductor devices, the cavity is filled with a thermosetting resin, and the resin mold is heated by heat. The resin is cured and cured.
JP 2000-277551 A

As described above, when a resin mold is filled with a thermosetting resin and the resin mold is molded, the resin mold is heated in advance to a temperature higher than the curing temperature of the thermosetting resin. When the resin is filled, the resin is thermally cured by the heat of the resin mold.
By the way, in recent resin mold products, since the semiconductor chip has become thinner and the thickness of the resin package has become extremely thin, the amount of resin injected into the cavity has decreased, and the resin has a short time during resin molding. In the meantime, the resin is heated to the curing temperature, and the resin gels in a short time, and the fluidity of the resin has been inhibited. For this reason, the resin is cured before the cavity is completely filled with the resin, and there is a problem that the resin mold portion is not filled with the resin.

As a method for preventing such unfilling of the resin, for example, a method of increasing the flow rate of the resin when filling the resin can be considered, but in this case, the bonding wire connected to the semiconductor chip is deformed, This leads to a problem that voids are generated inside the resin mold portion, and is not always effective.
The problem that the fluidity of the resin is hindered when filling the cavity with the resin is likely to occur in products in which a plurality of semiconductor chips are collectively molded with a substrate on which a plurality of semiconductor chips are mounted, This is an important issue for products that are resin-molded over a relatively wide range.

  Therefore, the present invention has been made to solve these problems, and the object of the present invention is a product in which the thickness of the resin mold portion is thin and the resin mold is performed over a relatively wide range of the molded product. Resin molding method that can reliably mold resin without causing problems such as unfilled resin and voids, improve product quality, and reduce product defect rate And providing a resin molding apparatus.

The present invention has the following configuration in order to achieve the above object.
That is, in a resin molding method in which a molded product is clamped together with a sealing resin using a resin mold, and the molded product is compression-molded, in the filling step of filling the cavity with resin, The upper jig and the lower jig for supporting the resin are separated from the upper mold arranged to face the upper jig or the lower mold arranged to face the lower jig, and after the filling step, In the compression molding process of compressing and molding the resin filled in the cavity, the upper jig and the upper mold are brought into contact with each other, and the lower jig and the lower mold are brought into contact with each other to thermally cure the resin. It is characterized by carrying out resin molding.

  The upper jig and the lower jig are detachably provided on the resin mold, and after the resin molding operation, the upper jig and the lower jig are carried out of the resin mold and cooled. The upper jig and the lower jig are cooled to below the thermosetting temperature of the resin using a resin, and then the upper jig and the lower jig are mounted on a resin mold and resin molded. To do. When the upper and lower jigs heated above the resin thermosetting temperature during the resin mold operation are forcibly cooled by the cooling device, the resin is thermoset in the resin filling process of the next molding process. This can be reliably prevented.

Further, in a resin molding method in which a molded product is clamped together with a sealing resin using a resin mold, and the molded product is compression-molded, an upper jig and a lower jig that support the molded product and the resin. Is provided detachably on the resin mold, and after the upper jig and the lower jig are mounted on the resin mold and resin molded, the upper jig and the lower jig are connected to the resin mold. The upper jig and the lower jig are cooled to below the thermosetting temperature of the resin using a cooling device, and then the upper jig and the lower jig are mounted on a resin mold. And resin molding.
In addition, after supplying the molded product and the resin to the resin mold, the resin mold region is evacuated and resin-molded by using a vacuum device, and the resin mold is in contact with the resin during resin molding. These parts are covered with a release film and resin molded.

  Also, an upper jig and a lower jig for supporting the molded product and the resin in a resin molding apparatus that clamps the molded product together with the sealing resin using a resin mold and compresses the molded product. In a filling process in which a work set part provided with at least one of the above is detachably provided on a resin mold, the work set part is mounted on a resin mold, and a cavity is filled with resin, the upper jig and the The upper mold disposed opposite to the upper jig is spaced apart, and the lower jig and the lower mold disposed opposed to the lower jig are spaced apart and supported, after the filling step, In the compression molding process of compressing and molding the resin filled in the cavity, the floating support means for bringing the upper jig and the upper mold into contact with each other and bringing the lower jig and the lower mold into contact with each other is made of resin mold metal. Specially provided in the mold To.

Further, as the floating support means, an upper lifter that movably supports the upper jig in the mold opening / closing direction and biases it toward the lower mold, and the lower jig is movable in the mold opening / closing direction and to the upper mold. A lower lifter that is biased toward and supported is provided.
Further, the present invention is characterized in that a cooling device is provided for cooling the work set part carried out from the resin mold to the heat curing temperature of the resin or lower.

Further, in a resin mold apparatus that clamps a molded product together with a sealing resin using a resin mold and compresses the molded product, the molded product and the resin are supported in the resin mold. In the filling step in which the upper jig and the lower jig are arranged to face the upper mold and the lower mold, respectively, and the resin is filled in the cavity, the upper jig and the upper mold are separated from each other, In the compression molding step of compressing and molding the resin filled in the cavity after the filling step and supporting the lower die apart from each other, the upper jig and the upper die are brought into contact with each other and the lower cure The resin mold is provided with floating support means for bringing the tool and the lower mold into contact with each other.
In addition, a cooling means for cooling the upper jig and the lower jig to be equal to or lower than the thermosetting temperature of the resin is incorporated.
The resin mold region may be provided with a shut-off means for air-sealing the resin mold region from the outside of the resin mold, and a vacuum device for evacuating the resin mold region may be provided.

  According to the resin molding method and the resin molding apparatus according to the present invention, the upper mold and the lower jig are separated from the upper mold and the lower mold in the filling process of filling the cavity with the resin. In addition, heat is not directly conducted from the lower mold to the resin, the resin is prevented from being heated to the thermosetting temperature, and the fluidity of the resin is ensured, so that the resin can be filled into the cavity. Become good. In the compression molding process, the upper jig and the lower jig are clamped in a state where they are in contact with the upper mold and the lower mold, respectively. Curing is done. As a result, even when a thin package is resin-molded, the resin can be reliably filled in the cavity, and there is no unfilled resin, enabling a high-quality resin mold without defects such as voids. Become.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
(First embodiment)
FIG. 1 shows a configuration of a first embodiment of a resin molding apparatus according to the present invention. FIG. 1 shows a state in which a resin mold die, which is a characteristic component in the resin mold apparatus according to the present invention, is attached to a movable platen 10 and a fixed platen 12 provided in a press apparatus of the resin mold apparatus. The movable platen 10 is guided by a tie bar 14 and is moved up and down in the mold opening / closing direction with respect to the fixed platen 12 by a press mechanism.

The resin mold 20 according to this embodiment is mounted on a press apparatus with an upper mold base 22 fixed to the movable platen 10 and a lower mold base 23 fixed to the fixed platen 12. On the upper mold base 22, an upper mold seal block 26 having a cylindrical shape with a planar shape is extended along the peripheral edge of the upper mold base 22 toward the lower mold base 23. On the other hand, in the lower mold base 23, a lower mold seal block 28 having a rectangular cylindrical shape is extended along the peripheral edge of the lower mold base 23 toward the upper mold base 22.
FIG. 2 shows a planar arrangement of the upper mold seal block 26 and the lower mold seal block 28. The upper mold seal block 26 and the lower mold seal block 28 are both provided in a planar and rectangular tube shape, and a seal ring is provided between the inner peripheral surface of the upper mold seal block 26 and the outer peripheral surface of the lower mold seal block 28. 30 is provided so as to go around.

The upper mold seal block 26 and the lower mold seal block 28 are slidably in contact with each other at the time of resin molding, and are interposed on the sliding surfaces of the upper mold seal block 26 and the lower mold seal block 28. The sealing ring 30 is provided as a blocking means for blocking the internal space of the resin mold 20 while being air-sealed from the outside. In this embodiment, the end edge portion of the lower mold seal block 28 is provided so as to slide into the inner edge of the upper mold seal block 26, and the seal ring 30 is connected to the outer peripheral surface of the lower mold seal block 28 and the upper mold. It is interposed between the inner peripheral surface of the seal block 26. The upper mold seal block 26 is provided with an exhaust hole 27, and the internal space of the resin mold 20 can be evacuated through the exhaust hole 27.
The upper mold seal block 26 and the lower mold seal block 28 can be cut off in a state where the resin mold 20 is movable in the mold opening / closing direction and the internal space of the resin mold 20 is air sealed from the outside. For example, the configuration is not limited to the configuration of the embodiment.

As shown in FIG. 1, an upper die 32 having a heater 31 is fixed to the upper die base 22, and a lower die 34 having a heater 33 is fixed to the lower die base 23.
The resin mold 20 of the present embodiment clamps the molded product 60 between the upper mold 32 and the lower mold 34 between the upper jig 36 that supports the molded product 60 and the upper jig 36. Then, the work set unit 40 including the lower jig 38 for compressing and molding the resin 70 is detachably attached to the resin mold 20. Below, according to FIG. 3, 4, the structure of the work set part 40 provided with these upper jig | tools 36, lower jig | tool 38 grade | etc., And the resin mold metal mold | die 20 is demonstrated.

  FIG. 3 shows a state where the work set unit 40 is taken out from the resin mold 20. The work setting unit 40 includes the upper jig 36 and the lower jig 38 described above, and the lower jig 38 includes a cavity block 39 having an outer peripheral shape that is substantially opposite to the upper jig 36, and a cavity block 39. A first clamper 42 provided in an arrangement surrounding the cavity block 39 in sliding contact with the outer surface of the cavity block 39, and an arrangement surrounding the first clamper 42 in sliding contact with the outer surface of the first clamper 42. And a second clamper 44. On the sliding contact surface between the first clamper 42 and the second clamper 44, a vent hole 46a communicating with the resin mold space A is provided at an arbitrary position.

FIG. 2 shows a planar arrangement of the cavity block 39, the first clamper 42, and the second clamper 44. The cavity block 39 constitutes the bottom surface (resin mold region) of the cavity in which the resin 70 is filled and the molded product 60 is resin-molded. In the present embodiment, the cavity block 39 is formed in a square shape with a planar shape.
The first clamper 42 is formed in a rectangular frame shape surrounding the cavity block 39, and similarly, the second clamper 44 is formed in a rectangular frame shape surrounding the first clamper 42. ing. A spring 42 a is interposed between the first clamper 42 and the lower jig 38, so that the first clamper 42 is movably supported in the mold opening / closing direction. A spring 44 a is interposed between the first clamper 42 and the lower jig 38. It is mounted and movably supported in the mold opening and closing direction. As shown in FIG. 2, the springs 42 a and 44 a are arranged at equal intervals in the circumferential direction of the first clamper 42 and the second clamper 44.

  FIG. 3 shows a state in which the resin 70 is supplied to the lower jig 38 and the molded product 60 is set on the second clamper 44. Thus, in a state where the molded product 60 is set on the second clamper 44, the pressing end surface (upper end surface) of the second clamper 44 is positioned above the pressing end surface of the first clamper 42 (superposition). The springs 42a and 44a are adjusted so as to be closer to the tool 36). The second clamper 44 is provided with a vent hole 46 at a position communicating with the resin mold space A in a state in which the molded product 60 is set on the second clamper 44.

  FIG. 4 shows a state where the work set unit 40 is mounted on the main body of the resin mold 20. An upper lifter 50 that elastically presses and contacts the upper jig 36 of the work setting unit 40 is attached to the upper mold 32 via a spring 50a, and the lower mold 34 supports a lower jig 38 of the work setting unit 40. A lower lifter 52 is attached via a spring 52a. When the work set unit 40 is mounted on the body of the resin mold 20, the springs 50 a and 52 a are slightly separated from the upper mold 32 and the upper jig 36 of the work set unit 40, The work set unit 40 is slightly separated from the lower jig 38. That is, the elastic force is set so that the work set unit 40 is in a floating state in the resin mold 20. The upper lifter 50 and the lower lifter 52 are both members having a planar shape formed in a frame shape, and constitute floating support means together with the springs 50a and 52a.

Next, a method for resin molding using the resin mold 20 according to the above configuration will be described.
First, in the state shown in FIG. 3, that is, in a state where the work set unit 40 is unloaded from the resin mold 20, the paste-like resin 70 is supplied onto the cavity block 39 of the lower jig 38, and the second clamper A molded product 60 is set on 44. Since the first clamper 42 slightly protrudes from the outer peripheral side surface of the cavity block 39 and the region where the resin 70 is supplied has a concave shape, the resin 70 may be supplied into the concave portion.

  It should be noted that the cavity block 39, the first clamper 42, and the resin 70 of the second clamper 44 are arranged so that the upper surface of the cavity block 39, the first clamper 42, and the second clamper 44 do not directly contact the resin 70. It is effective to supply the resin 70 by covering the contact area with the release film 100. By covering the contact portion between the resin 70 and the mold with the release film 100, the resin 70 can be prevented from entering the sliding contact portion (gap portion) between the cavity block 39 and the first clamper 42. The first clamper 42 and the second clamper 44 can be moved smoothly. Of course, it is also possible to resin mold without using the release film 100.

  The molded product 60 has a semiconductor chip 64 mounted on one surface of a circuit board 62 having a rectangular planar shape. The molded product 60 is set on the second clamper 44 with the surface on which the semiconductor chip 64 is mounted facing the lower jig 38. On the inner peripheral edge side of the pressing end surface of the second clamper 44, a set concave portion is provided for positioning and setting the molded product 60. The molded product 60 has the peripheral portion of the circuit board 62 in the set concave portion. Align and set. Since the second clamper 44 is higher than the first clamper 42, the molded product 60 and the resin 70 are separated from each other.

After the resin 70 and the molded product 60 are set on the work set unit 40, the work set unit 40 is mounted on the resin mold 20 installed in the press apparatus. The upper base 22 of the resin mold 20 is lifted upward, and the work set unit 40 is set on the lower lifter 52 with the upper portion of the lower base 23 opened.
After the work set unit 40 is placed on the lower lifter 52, the upper mold base 22 is lowered so that the upper mold seal block 26 and the lower mold seal block 28 are in sliding contact with each other via the seal ring 30.

  When the upper mold seal block 26 and the lower mold seal block 28 are in sliding contact with each other via the seal ring 30, the inside of the resin mold 20 is sealed by being air sealed from the outside. In this state, the inside of the resin mold 20 is evacuated from the exhaust hole 27 using the vacuum device 29. During this evacuation operation, the resin mold space A to which the resin 70 is supplied is also evacuated through the vent hole 46 and the vent hole 46 a provided in the first clamper 42. It is possible to prevent air from being mixed into the resin during compression molding and to discharge (degas) the air contained in the resin.

FIG. 5 shows a state in which the cavity is filled with resin while the inside of the resin mold 20 is evacuated by the vacuum device 29. When the upper mold base 22 of the resin mold 20 is lowered, the spring 44a that supports the second clamper 44 begins to bend first, and the pressing end surface of the first clamper 42 is the workpiece 60. It contacts the circuit board 62. As a result, a cavity region to be filled with the resin 70 is defined, and the spring 42a starts to bend in conjunction with the lowering of the upper mold base 22.
FIG. 5 shows a state in which the cavity block 39 of the lower jig 38 gradually approaches the molding 60, the back surface of the first clamper 42 abuts the cavity block 39, and the resin 70 is almost filled in the cavity. (Filling step). However, even in this state, the upper jig 36 and the end surface of the upper mold 32 are still separated from each other, and the cavity block 39 of the lower jig 38 and the end surface of the lower mold 34 are also separated from each other.

  FIG. 6 shows a state where the upper mold base 22 is finally lowered to the mold clamping position and compression molded. That is, when the upper mold base 22 is lowered to the mold clamping position, the spring 50a mounted on the upper lifter 50 and the spring 52a mounted on the lower lifter 52 are compressed by the mold clamping force, and the back surface of the upper jig 36 is The upper mold 32 comes into contact with each other, and the back surface of the cavity block 39 of the lower jig 38 comes into contact with the lower mold 34 and comes into contact with each other. In this way, heat is directly transmitted from the upper mold 32 to the molded product 60 and the resin 70 via the upper jig 36, and heat is directly transmitted from the lower mold 34 via the cavity block 39 to the resin. 70 is heated and thermoset and compression molded (compression molding process).

  3 to 6 is characterized in that the work set unit 40 is located above the upper lifter 50 and the lower lifter 52 when the work set unit 40 is first mounted on the resin mold 20. The mold 32 and the lower mold 34 are supported without being in direct contact with each other, and the work set unit 40 is not in contact with the upper mold 32 and the lower mold 34 even in the filling process. In other words, the work set unit 40, the upper mold 32, and the lower mold 34 are in contact with each other in the process of being clamped and compressed (compression molding process).

  In the present embodiment, such a resin molding method is used because the heat from the upper mold 32 and the lower mold 34 is prevented from being conducted to the resin 70 in the step of filling the cavity with resin. Thus, it is possible to delay the resin from gelling, thereby making it possible to reliably fill the resin 70 in the cavity. After the resin is filled into the cavity, the heat from the upper mold 32 and the lower mold 34 is efficiently used. This is because the curing of the resin is promoted by conducting to the resin 70.

  In an actual resin mold, the upper mold 32 and the lower mold 34 are heated to about 180 ° C. for resin molding, but the work set unit 40 contacts the upper mold 32 and the lower mold 34 as shown in FIGS. In such a state that the work set unit 40 is supported, the work set unit 40 can be held at about 100 ° C., the gelation of the resin 70 can be effectively delayed, and the resin 70 is filled in the cavity (resin mold region). It becomes possible to improve the property.

7 and 8 show a process after the work set unit 40 is unloaded from the resin mold 20 after resin molding.
FIG. 7 shows a state in which the upper jig 36 is lifted upward from the lower jig 38 and the molded product 66 is taken out from the work set unit 40. In the molded product 66, one surface of the circuit board 62 on which the semiconductor chip 64 is mounted is resin-sealed by the resin mold part 70a.
After the molded product 66 is taken out from the work set unit 40, the work set unit 40 is forcibly cooled by the cooling device 80. This cooling operation is an operation for cooling the temperature of the work set unit 40, which is in contact with the upper mold 32 and the lower mold 34 in the resin mold 20 and heated to about 180 ° C., to about 100 ° C. It is.

The cooling device 80 includes cooling plates 82a and 82b that support the upper jig 36 and the lower jig 38 so as to sandwich the upper jig 36 and the lower jig 38 from above and below. The work set unit 40 is sandwiched between the cooling plates 82a and 82b, and the work set unit 40 is cooled by heat conduction. As a method of cooling the work set unit 40, a method of passing a coolant such as cooling water through the cooling plates 82a and 82b, a method of using a cooling element, a method of using cold air, and the like can be used.
It is effective to use a material having a large heat capacity for the cooling plates 82a and 82b, such as copper, which has good heat conduction and can conduct heat quickly. On the other hand, the upper jig 36 and the lower jig 38 constituting the work set unit 40 can be cooled in a short time by using a material having a small heat capacity, a specific heat and a low specific gravity, such as aluminum, and the upper die 32 or When it comes into contact with the lower mold 34, the temperature can be raised within a short time, which is effective.

  After the work set unit 40 is cooled to a temperature lower than the thermosetting temperature of the resin, the resin 70 is supplied to the work set unit 40 and the molded product 60 is set. Set. Since the upper jig 36 and the lower jig 38 of the work set unit 40 are cooled to a temperature at which the resin 70 is cured or less, the upper mold 32 and the lower mold 34 and the work set unit 40 are not directly in contact with each other. By making it, it becomes possible to prevent resin 70 from gelling in a short time and to perform resin molding.

  According to the resin molding method of this embodiment, as described above, in the process until the cavity is filled with the resin, the resin is directly applied to the resin from the upper mold and the lower mold that are heated to the curing temperature of the resin. Heat conduction is suppressed, and by maintaining the temperature of the resin at a temperature lower than the thermosetting temperature, the fluidity of the resin in the cavity can be secured, and the resin in the cavity (resin mold region) This prevents gelation of the resin and prevents molding defects such as unfilling of the resin in the resin mold portion. In addition, since the fluidity of the resin can be ensured, it is not necessary to excessively increase the flow rate of the resin, so that no molding defects such as wire flow occur, and the generation of voids in the mold resin is prevented, thereby preventing high-quality resin. Molding is possible. Moreover, generation of voids can be suppressed by evacuating the cavity.

(Second Embodiment)
9 and 10 show the configuration of the second embodiment of the resin molding apparatus according to the present invention. In the first embodiment described above, a cavity (resin mold region) is provided on the lower mold (lower jig 38) side, whereas in this embodiment, the upper mold (upper jig 36) side is provided. The cavity is provided with a structure.

  FIG. 9 shows a configuration of a work set unit 401 used in the resin molding apparatus of this embodiment. The upper jig 36 of the work set unit 401 is provided with a cavity block 39, a first clamper 42 that defines the cavity region, and a second clamper 44 that biases the molded product 60. Is provided with a support recess 38b for supporting the product 60 in a flat shape. The first clamper 42 is movably supported by a spring 42a in the mold opening / closing direction. The second clamper 44 is movable in the mold opening / closing direction by a spring 44a, and in a free state, the pressing end surface of the second clamper 44 is closer to the lower jig 38 than the pressing end surface of the first clamper 42. It is supported so that it may be located in. FIG. 9 shows a state in which the molded product 60 is set on the lower jig 38 and the resin 70 is supplied onto the molded product 60.

  FIG. 10 shows a state where the work set unit 401 is mounted on the resin mold 20. Similar to the first embodiment, the resin mold 20 is provided with an upper lifter 50 and a lower lifter 52. In the state where the work set unit 401 is mounted on the lower lifter 52, the upper mold seal block 26 and the lower mold seal block 28 are brought into sliding contact with each other, and the internal space of the resin mold 20 is sealed by air sealing from the outside. 32 and the rear surface 39c of the cavity block 39 of the upper jig 36 are separated from each other, and the rear surface 38c of the lower jig 38 and the lower mold 34 are separated from each other.

In the resin mold apparatus of this embodiment, the molded product 60 is compression-molded while the resin mold 20 is evacuated by the vacuum device 29 in the state shown in FIG. By lowering the upper mold base 22, the first clamper 42 abuts the product 60 to define a resin mold region, and by further lowering the upper mold base 22, the resin 70 is filled into the cavity. The
Also in this case, until the resin 70 is filled in the cavity, the upper die 32 and the cavity block 39 are not in contact with each other, and the lower die 34 and the lower jig 38 are not in contact with each other. The upper jig 36 and the upper mold 32 are brought into contact with each other and the lower jig 38 and the lower mold 34 are brought into contact with each other only when the elastic force of the springs 50a and 52a is adjusted and the resin 70 is filled in the cavity. By doing so, a resin mold similar to that of the first embodiment is possible.

The resin mold apparatus of the present embodiment is the same as the resin mold apparatus in the first embodiment except that the cavity is formed in the upper jig 36. That is, when one side of the molded product 60 is resin-molded, the lower cavity method can be used, or the upper cavity method can be used as in this embodiment.
The work set unit 401 is carried into and out of the resin mold 20 and, after resin molding, the work set unit 401 is taken out from the resin mold 20 and the temperature at which the resin 70 is thermoset using a cooling device is below the temperature. After the work set unit 401 has been cooled to, the work set unit 401 can be mounted on the resin mold again and resin molded, as in the above embodiment.

(Third embodiment)
11 and 12 show the configuration of the third embodiment of the resin molding apparatus according to the present invention. In the first and second embodiments, an example in which only one surface of the molded product 60 is resin-molded is shown, but the same can be applied to the case where both surfaces of the molded product 60 are molded.
FIG. 11 shows the configuration of the work set unit 402 used in the resin molding apparatus of this embodiment. The work set unit 402 is different from the configuration of the work set unit 40 used in the first embodiment only in the configuration in which the cavity recess 37 is provided in the upper jig 36. The circuit board 62 is provided with communication holes (not shown) for filling the cavities disposed on both surfaces of the circuit board 62 with resin.

FIG. 12 shows a state where the work set unit 402 including the upper jig 36 in which the cavity concave portion 37 is formed is mounted on the resin mold 20. Since the cavity recess 37 is formed in the upper jig 36 of the work set unit 402, when the upper mold base 22 is lowered to the mold clamping position, the resin 70 is placed in the cavity disposed with the circuit board 62 interposed therebetween. The both sides of the circuit board 62 are resin-molded.
Also in this embodiment, when the resin is filled in the cavity, the resin filling is performed because the upper mold 32 and the upper jig 36 and the lower mold 34 and the cavity block 39 are separated from each other. Occasionally, the resin 70 is suppressed from being hardened, the filling property of the resin into the cavity is improved, and the resin mold without the filling of the resin 70 and the void can be realized.
In the resin mold apparatus of the present embodiment, as in the case of the second embodiment, the configurations of the upper jig 36 and the lower jig 38 can be arranged upside down. It is also possible to suppress the generation of voids by evacuation, and to cool the upper jig and the lower jig using a cooling device.

(Fourth embodiment)
FIGS. 13-16 shows the structure of 4th Embodiment of the resin mold apparatus which concerns on this invention. In the resin molding apparatus of each of the above embodiments, a plurality of semiconductor chips 64 mounted on the circuit board 62 are collectively resin-molded in one cavity, whereas the resin molding apparatus of the present embodiment is a circuit. Each of the semiconductor chips 64 mounted on the substrate 62 is individually resin-molded.

  FIG. 13 shows a configuration of a work setting unit 403 used in the resin molding apparatus of this embodiment. In the work set unit 403 in the present embodiment, the first clamper 42 is provided with a partition unit 45 that individually partitions the resin mold region in accordance with the planar arrangement of the semiconductor chip 64 mounted on the molded product 60. A cavity plate 45a is disposed in each partition portion so as to be movable in the mold opening and closing direction, and a spring spring 45b is interposed between the back surface of the cavity plate 45a and the cavity block 39. The elastic spring 45b is for pressing the resin 70 with a predetermined pressure during mold clamping, and a spring having a required elastic force is used.

FIG. 13 shows a state in which a required amount of resin 70 is supplied to each partition space B partitioned by the partition portion 45 of the first clamper 42 and the product 60 is set in the second clamper 44.
FIG. 14 shows a state where the work setting unit 403 is mounted on the resin mold 20. Since the work set unit 403 is supported by the upper lifter 50 and the lower lifter 52, the upper jig 36 and the upper mold 32 are separated from each other, and the cavity block 39 and the lower mold of the lower jig 38 are separated. 34 is spaced apart. In this state, the inside of the resin mold 20 is evacuated.

In FIG. 15, the upper mold base 22 is lowered, the molded product 60 is pushed down by the upper jig 36, the spring 42 a supporting the first clamper 42 is bent, and the pressing end surface of the first clamper 42 is pressed. The end surface of the partition 45 is brought into contact with the product 60, and the back surface of the first clamper 42 is brought into contact with the cavity block 39.
In conjunction with the first clamper 42 being pushed down, the spring plate 45b is actuated to push up the cavity plate 45a, and the partitions 70 are filled with the resin 70 into the individual divisions for each semiconductor chip 64. The In the state shown in FIG. 15, that is, in the state where the resin 70 is filled in the cavities of the respective sections, the upper mold 32 and the upper jig 36 are separated from each other, and the lower mold 34 and the cavity block 39 are separated from each other. Thus, heat does not directly conduct, the fluidity of the resin 70 is ensured, and the resin 70 is reliably filled in the cavity.

  FIG. 16 shows a state in which the upper mold base 22 is lowered to the mold clamping position. The end of the upper mold 32 and the upper jig 36 come into contact with each other, and the lower mold 34 and the cavity block 39 come into contact with each other, and the molded product 60 is interposed via the cavity plate 45a and the elastic spring 45b. Is pressed. When the upper mold 32 and the lower mold 34 come into contact with the upper jig 36 and the lower jig 38, heat from the upper mold 32 and the lower mold 34 is effectively transmitted to the resin 70, and the resin 70 is thermoset. Resin molded.

Also in the resin mold apparatus of the present embodiment, after resin molding, the work set unit 403 is carried out of the resin mold mold 20 from the resin mold mold 20, and the upper jig 36 and the lower jig 38 are used by using a cooling device. Are forcibly cooled to a temperature equal to or lower than the curing temperature of the resin 70, thereby ensuring the fluidity of the resin 70 during resin molding and individually molding each semiconductor chip 64.
The resin molding method of the present embodiment can be applied to the case where resin molding is performed as a section divided for each of a plurality of semiconductor chips 64, in addition to the case of individually resin molding for each single semiconductor chip 64.

(Fifth embodiment)
FIGS. 17-19 shows the structure of 5th Embodiment of the resin mold apparatus which concerns on this invention. The resin mold apparatus of the present embodiment supports the work set unit 40 separately from the upper mold 32 and the lower mold 34 when the work set unit 40 in the first embodiment is mounted on the resin mold 20. The lifter for this purpose is omitted from the resin mold 20.
FIG. 17 shows a state in which the resin 70 is supplied to the work setting unit 40 and the molded product 60 is set outside the resin mold 20. The configuration of the upper jig 36 and the lower jig 38 provided in the work set unit 40 is the same as the configuration of the work set unit 40 in the first embodiment shown in FIG.

  FIG. 18 shows a state where the work setting unit 40 is mounted on the resin mold 201. Since the lifter is omitted in the resin mold 201 used in this embodiment, the work set unit 40 is mounted on the resin mold 20 and the upper mold seal block 26 and the lower mold seal block 28 are used. In the closed state, the upper die 32 and the upper jig 36 are in contact with each other, and the lower die 34 and the cavity block 39 of the lower jig 38 are in contact with each other. FIG. 18 shows a state in which the molded product 60 is supported at a position spaced apart from the first clamper 42 by the second clamper 44 and the upper jig 36. In this state, the inside of the resin mold 201 is evacuated from the exhaust hole 27 using the vacuum device 29.

In FIG. 19, the upper mold base 22 is lowered, the planar area of the resin mold portion (cavity) is defined by the first clamper 42, and after filling the cavity with the resin 70, the upper mold base 22 is further moved to the mold clamping position. A state in which the resin is molded by being lowered and the resin 70 is thermally cured is shown.
After resin molding in the resin mold 201, the work set unit 40 is taken out from the resin mold 201 and the molded product is taken out from the work set 40. Then, as shown in FIG. Then, the upper jig 36 and the lower jig 38 of the work set unit 40 are cooled to a temperature lower than the thermosetting temperature of the resin 70. And after cooling the work set part 40, the resin 70 is supplied to the work set part 40, the to-be-molded product 60 is set, the work set part 40 is mounted on the resin mold 201, and the next resin mold operation is performed. Do.

In the resin mold apparatus of this embodiment, when the work set unit 40 is mounted on the resin mold 201, the upper mold 32 contacts the upper jig 36 and the lower mold 34 contacts the cavity block 39 of the lower jig 38. Since they are in contact with each other, heat is directly transferred from the upper mold 32 and the lower mold 34 to the resin 70, but the upper jig 36 and the lower jig 38 are cooled in advance to a temperature lower than the curing temperature of the resin 70. Since it is mounted on the resin mold 201, the resin 70 is prevented from curing in a short time after the work set unit 40 is mounted on the resin mold 201, and the filling property of the resin 70 in the cavity is suppressed. The resin mold can be improved.
In this embodiment, the cavity is provided on the lower mold side of the resin mold. However, as shown in the second embodiment and the third embodiment, the upper mold of the resin mold is used. A configuration in which cavities are provided on the side and the lower mold side is also possible.

(Sixth embodiment)
FIGS. 20-23 shows the structure of 6th Embodiment of the resin mold apparatus which concerns on this invention. In the resin mold apparatus of this embodiment, the molded product 60 is supported by the upper mold 32, a cavity is formed on the lower mold side by the cavity block 49 and the lower mold clamper 48, and the molded product 60 is resin-molded by compression molding. Mold.
On the upper mold side, an upper mold clamper 47 that moves in the mold opening / closing direction while being air-sealed with the side peripheral surface of the upper mold 32 is supported. In addition, a lower mold clamper 48 that moves in the mold opening / closing direction is provided on the outer periphery of the cavity block 49 while being air-sealed with the side surface of the cavity block 49. A flange portion 48 a that supports the cavity block 49 is provided on the inner peripheral side surface of the lower mold clamper 48, and the upper surface of the cavity block 49 and the lower mold clamper 48 are in a state where the lower surface of the cavity block 49 is in contact with the flange portion 48 a. Thus, a cavity recess is formed. In the present embodiment, the cavity block 49 and the lower mold clamper 48 correspond to the lower jig of the work set unit in the above-described embodiment.

  The lower mold base 23 that supports the lower mold 34 has a spring 24a that urges the clamp pin 24 that movably supports the lower mold clamper 48 in the mold opening and closing direction to push the lower mold clamper 48 upward. Is attached through. In the present embodiment, the clamp pin 24 and the spring 24a constitute a floating support means. A fitting hole 48 b into which the protruding end portion of the clamp pin 24 is fitted is provided on the lower surface of the lower mold clamper 48 facing the upper end surface of the clamp pin 24. FIG. 20 shows a state in which the lower mold clamper 48 is detached from the clamp pin 24. The lower mold clamper 48 is supported by the clamp pin 24 by inserting the protruding end portion of the clamp pin 24 into the insertion hole 48 b of the lower mold clamper 48. Is done.

  In FIG. 20, the release film 100 is disposed between the upper surface of the cavity block 49 and the upper end surface of the lower mold clamper 48, and the release film 100 is aspirated using the air path 29 c by the vacuum device 29 b. The release film 100 is air-adsorbed along the inner surface of the recess formed by the lower mold clamper 48.

  In the resin mold apparatus of the present embodiment, the lower mold clamper 48 is detachably provided on the clamp pin 24, so a unit in which the lower mold clamper 48 and the cavity block 49 are combined is carried into and out of the resin mold mold 202. It is possible to perform an operation. Therefore, an operation in which the release film 100 is set on the unit body and the resin 70 is supplied in a state where the unit body of the lower mold clamper 48 and the cavity block 49 is carried out of the resin mold 202 using the transport device. Can be easily done. Further, when the lower mold clamper 48 and the cavity block 49 are carried out of the resin mold 202, the cavity block 49 and the lower mold clamper 48 can be cooled using a cooling device.

In FIG. 21, the upper die base 22 is lowered, and the vacuum device 29a is operated in a state where the end surface of the upper die clamper 47 is in contact with the end surface of the lower die clamper 48, and the upper die 32, the upper die clamper 47, and the lower die are operated. The state where the inside of the area (resin mold area) shielded by air sealing from the outside by the clamper 48 and the cavity block 49 is evacuated is shown. 30a-30c are air seal members.
In this state, the cavity block 49 is supported by being separated from the lower mold 34 by the action of the clamp pin 24 and the spring 24 a, and therefore heat from the lower mold 34 is not directly conducted to the resin 70. .

  In FIG. 22, the upper mold base 22 is further lowered, the end surface of the lower mold clamper 48 is pressed against the molded product 60 to define a resin mold region, and the spring 24a is further bent so that the back surface of the cavity block 49 faces the lower mold. 34 shows a state of being brought into contact with 34. The end surface of the lower mold clamper 48 comes into contact with the product 60, and the cavity block 49 moves upward relative to the lower mold clamper 48 so that the resin 70 is filled into the cavity. When the cavity block 49 moves upward relative to the lower mold clamper 48 without contacting the lower mold 34, the resin 70 can be prevented from being heated by the lower mold 34, so that the fluidity of the resin 70 can be secured, The filling property of the resin 70 in the cavity is improved.

  FIG. 23 shows a state where the upper surface of the cavity block 49 is lowered to the mold clamping position while the back surface of the cavity block 49 is in contact with the lower mold 34. When the upper mold base 22 is lowered to the mold clamping position, the spring 24a is further compressed, the lower mold clamper 48 is pushed down, the cavity block 49 is relatively pushed up, and the resin 70 is compressed to the final resin mold position. The The heat is directly transferred from the lower mold 34 to the resin 70 when the cavity 70 is almost filled with the resin 70 and is finally compression-molded. At this time, the resin 70 is heated to the thermosetting temperature. Resin molded.

  According to the resin molding method of the present embodiment, the heat acting on the resin 70 at the start of the resin molding is suppressed as compared with the conventional resin molding method in which the resin 70 receives the heat of the mold from the start of the resin molding. Therefore, the acceleration of the curing of the resin 70 is suppressed, the fluidity and filling property of the resin in the cavity are ensured, the resin can be prevented from being unfilled, and the occurrence of defects such as voids in the resin can be prevented. .

(Seventh embodiment)
24 to 27 show the configuration of the seventh embodiment of the resin mold apparatus according to the present invention. In the resin mold device of this embodiment, in addition to the configuration in which the clamp pin 24 can be fitted to the lower mold clamper 48 in the sixth embodiment, the second clamp pin 25 is provided on the lower surface of the cavity block 49. It is provided so that it can be fitted.
In FIG. 24, a fitting hole 49a into which the tip of the second clamp pin 25 is fitted is provided on the lower surface of the cavity block 49, and the second clamp pin 25 is attached to the lower mold base 23 via a spring 25a. Indicates the state. The spring 25 a urges the second clamp pin 25 in a direction in which the tip end portion protrudes from the lower mold 34. Moreover, the state which air-sucked the release film 100 is shown similarly to 6th Embodiment.

25, the upper mold base 22 is lowered, the vacuum mold 29a is operated in a state where the upper mold clamper 47 is in contact with the lower mold clamper 48, and the inside of the resin mold area blocked by air sealing from the outside is evacuated. It shows the state. Since the cavity block 49 and the lower mold 34 are held apart from each other, heat is transferred from the lower mold 34 to the resin 70 through the cavity block 49 except for heat conduction by the second clamp pin 25. Is prevented.
FIG. 26 shows a state in which the upper die base 22 is further moved downward to bring the pressing end surface of the lower die clamper 48 into contact with the product 60. The resin mold region is surrounded by the lower mold clamper 48 and the cavity block 49, and the resin 70 is filled in the cavity. Unlike the sixth embodiment, the cavity block 49 is separated from the lower mold 34 by the action of the second clamp pin 25 and the spring 25a.

  FIG. 27 shows a state where the upper mold base 22 is lowered to the mold clamping position. By lowering the upper mold base 22 to the mold clamping position, the lower mold clamper 48 is pushed down against the elastic force of the spring 24 a, and the cavity block 49 comes into contact with the lower mold 34, and against the lower mold clamper 48. The resin 70 is compression-molded in the cavity. At this time, when the cavity block 49 comes into contact with the lower mold 34, heat is transferred from the lower mold 34 to the resin 70 through the cavity block 49, and the resin 70 is heated to the thermosetting temperature and cured.

  Also in this embodiment, since the cavity block 49 and the lower mold clamper 48 can be detached from the resin mold 203 and removed, the cavity block 49 is removed from the lower mold clamper 48 using a transfer device after resin molding. At the same time, the cavity block 49 and the lower mold clamper 48 are cooled to a temperature lower than the thermosetting temperature of the resin 70 using a cooling device, and then a new resin 70 is supplied. Then, the molded product 60 can be set to perform the next resin molding.

(Eighth embodiment)
28-30 shows the structure of 8th Embodiment of the resin mold apparatus based on this invention.
The resin molding apparatus described in each of the above-described embodiments has a work set unit 40 in which a molded product 60 and a resin 70 are set, or a unit including a cavity block and a lower mold clamper. The resin mold was carried in and out. The resin molding apparatus of this embodiment is characterized in that resin molding is performed without bringing the upper jig 36 and the lower jig 38 into and out of a resin mold.

That is, in the resin mold apparatus of this embodiment, as shown in FIG. 28, an upper mold seal block 26 and a lower mold seal block 28 are provided on the upper mold base 22 and the lower mold base 23, respectively. The upper mold 32 fixed to the upper mold base 22 and the lower mold 34 fixed to the lower mold base 23 are placed inside the resin mold die 204 which is air-sealed by the lower mold block 26 and the lower mold seal block 28 and cut off from the outside. The upper jig 32 is provided with the upper jig 36, and the lower mold 34 is provided with the lower jig 38.
The upper jig 36 is always provided by the spring 36a so that the upper mold 32 and the upper jig 36 are separated from each other. The lower jig 38 is composed of a cavity block 39, a first clamper 42, and a second clamper 44, and the cavity block 39 and the lower mold 34 are always separated by a spring 38a. In the present embodiment, the springs 36a and 38a constitute a floating support means.

In FIG. 28, the resin 70 is supplied onto the cavity block 39 of the lower jig 38, the molded product 60 is set on the second clamper 44, and then the upper mold base 22 is lowered to move the upper surface of the molded product 60. In this state, the upper jig 36 is in contact with the upper jig 36. The operation of supplying the resin 70 and setting the molded product 60 is performed in a state where the upper mold base 22 is opened and the upper mold seal block 26 and the lower mold seal block 28 are separated from each other.
In this state, the upper jig 36 and the upper mold 32 are separated from each other, and the cavity block 39 and the lower mold 34 of the lower jig 38 are separated from each other. 70 is not overheated. In this state, the inside of the resin mold 204 is evacuated from the exhaust hole 27 and the vent hole 46a using the vacuum device 29.

29, the upper die base 22 is moved downward, the spring 44a of the second clamper 44 is bent, and the pressing end surface of the second clamper 42 is brought into contact with the product 60, and then the upper die base is further moved. 22 shows a state in which the first clamper 42 is pushed down until the back surface of the first clamper 42 abuts against the cavity block 39 as the spring 42a of the first clamper 42 is bent. In this state, the resin 70 is filled into the cavity.
In this state in which the resin 70 is filled and compressed in the cavity, the upper jig 36 and the upper mold 32 are separated from each other, and the cavity block 39 and the lower mold 34 are also separated from each other. That is, since the upper jig 36 and the upper mold 32 are not in contact with each other and the cavity block 39 and the lower mold 34 are not in contact with each other, heat is directly transferred from the upper mold 32 and the lower mold 34 to the resin 70. This suppresses the heat curing of the resin 70, thereby improving the filling property of the resin 70 in the cavity.

  FIG. 30 shows a state where the upper mold base 22 is moved down to the mold clamping position and the resin 70 is cured and compression molded. When the upper mold base 22 is moved down to the mold clamping position, the upper mold 32 and the upper jig 36 come into contact with each other, and the lower mold 34 and the cavity block 39 come into contact with each other to come into contact with each other. Then, heat is directly conducted from the upper mold 32 and the lower mold 34 to the resin 70, and the resin 70 is thermoset. Since the heat is most applied when the resin 70 is finally compression-molded, the filling property of the resin in the cavity is not hindered, and the thermosetting of the resin 70 is promoted and a suitable resin molding operation is performed.

  According to the resin mold apparatus of this embodiment, for example, even when the thermosetting temperature of the resin 70 is about 180 ° C. and the upper mold 32 and the lower mold 34 are heated to 180 ° C. or more by the heaters 31 and 33, By separating the upper mold 32 and the lower mold 34, it is possible to hold the upper jig 36 and the lower jig 38 at 180 ° C. or lower, and this improves the fluidity when the resin 70 is filled in the cavity. It can be secured.

Note that a cooling means for forcibly cooling the upper jig 36 and the lower jig 38 may be incorporated in the resin mold apparatus so that the upper jig 36 and the lower jig 38 are not excessively heated. After compression molding with the upper jig 36 and the lower jig 38, the molded product is taken out from the lower jig 38, and the upper jig 36 and the lower jig 38 are moved below the thermosetting temperature of the resin 70 using the built-in cooling means. Allow to cool. Then, the next resin mold operation is performed. As this cooling means, for example, a method of allowing a cooling refrigerant or air to flow inside the upper jig 36 and the lower jig 38 can be used.
According to the resin mold apparatus of this embodiment, the resin filling property in the cavity is improved without performing the operation of taking the work set unit 40 out of the resin mold die as in the above-described embodiment. It becomes possible to mold.

As described above, various examples of the configuration of the resin mold device according to the present invention have been described. However, the resin mold device according to the present invention is not limited to the above-described embodiment, and various configurations can be adopted as the device configuration. For example, in the above embodiment, the upper mold is described as the movable side, but the lower mold side may be configured as the movable side.
In addition, as described above, when resin is supplied to the work set part and resin molding is performed, the inner surface of the cavity can be covered with a release film, and resin molding can be performed without using the release film. You can also.
Moreover, in each embodiment mentioned above, although the resin mold area | region is evacuated and resin-molded (reduced pressure mold), this invention is applied also when resin-molding without evacuating the resin mold area | region. Can do.

  In addition, according to the method of evacuating the resin mold area and resin molding, the resin is filled in the state where the air and moisture remaining in the resin mold are discharged, so that air is caught in the resin. Therefore, a high-quality resin mold is possible without causing voids in the resin. However, when the vacuum is exhausted from the resin mold region, it is not preferable that the effective component is discharged from the resin supplied to the resin mold region because the characteristics of the resin may be changed. The phenomenon in which the active ingredient is discharged from the resin during the decompression molding has been conventionally seen as a phenomenon in which the resin foams when the resin mold region is decompressed. If the resin is foamed and bubbles are generated in the resin, it causes a defect such as deformation of the bonding wire.

Foaming from the resin is likely to occur when the resin is heated to a higher temperature, and is more likely to occur as the degree of vacuum in the resin mold region increases (the pressure in the resin mold space decreases).
Using the resin actually used in the resin mold, the resin was heated under reduced pressure, and the time from the start of foaming to the end of foaming was measured. According to the test results, it takes about 8 minutes from the start of foaming to the end of foaming at a pressure of 15 Pa when heated to 40 ° C, whereas foaming takes about 1 minute under a pressure of 15 Pa heated to 120 ° C. Ended. This test result means that the components in the resin are more easily discharged as the resin is heated to a higher temperature and the degree of vacuum in the resin mold region is higher.

  In the resin molding method of the present embodiment, as described above, when the resin is filled in the cavity, the resin is held at a low temperature so that the resin is not heated to the curing temperature. Even when the space is evacuated to a vacuum, it is possible to prevent the active ingredient from being discharged from the resin. That is, it is possible to perform resin molding without changing the characteristics of the resin at the time of resin molding, and there is an advantage that a high-quality resin mold can be obtained also in this respect.

It is explanatory drawing which shows the structure of 1st Embodiment of the resin mold apparatus. It is a top view of the 1st clamper, the 2nd clamper, etc. It is explanatory drawing which shows the structure of a work set part. It is explanatory drawing which shows the resin mold method by 1st Embodiment. It is explanatory drawing which shows the resin mold method by 1st Embodiment. It is explanatory drawing which shows the resin mold method by 1st Embodiment. It is explanatory drawing which shows the state which takes out a molded article from a work set part. It is explanatory drawing which shows the structure of the cooling device of a work set part. It is explanatory drawing which shows the structure of the work set part in 2nd Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 2nd Embodiment. It is explanatory drawing which shows the structure of the work set part in 3rd Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 3rd Embodiment. It is explanatory drawing which shows the structure of the work set part in 4th Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 4th Embodiment. It is explanatory drawing which shows the resin mold method by 4th Embodiment. It is explanatory drawing which shows the resin mold method by 4th Embodiment. It is explanatory drawing which shows the structure of the work set part in 5th Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 5th Embodiment. It is explanatory drawing which shows the resin mold method by 5th Embodiment. It is explanatory drawing which shows the structure of 6th Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 6th Embodiment. It is explanatory drawing which shows the resin mold method by 6th Embodiment. It is explanatory drawing which shows the resin mold method by 6th Embodiment. It is explanatory drawing which shows the structure of 7th Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 7th Embodiment. It is explanatory drawing which shows the resin mold method by 7th Embodiment. It is explanatory drawing which shows the resin mold method by 7th Embodiment. It is explanatory drawing which shows the structure of 8th Embodiment of the resin mold apparatus. It is explanatory drawing which shows the resin mold method by 8th Embodiment. It is explanatory drawing which shows the resin mold method by 8th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Movable platen 12 Fixed platen 20, 201, 202, 203, 204 Resin mold die 22 Upper mold base 23 Lower mold base 24 Clamp pin 25 Second clamp pin 26 Upper mold seal block 28 Lower mold seal block 29, 29a, 29b Vacuum device 32 Upper mold 36 Upper jig 38 Lower jig 39, 49 Cavity block 40, 401, 402, 403 Work set section 42 First clamper 44 Second clamper 45 Partition section 46, 46a Vent hole 47 Upper mold Clamper 48 Lower mold clamper 50 Upper lifter 52 Lower lifter 60 Molded product 70 Resin 80 Cooling device 82a, 82b Cooling plate 100 Release film

Claims (11)

In a resin mold method of clamping a molded product together with a sealing resin using a resin mold, and compression molding the molded product,
In the filling step of filling the cavity with the resin, the molded product, the upper jig and the lower jig for supporting the resin, and the upper mold or the lower jig arranged to face the upper jig are opposed. And the lower mold placed
In the compression molding step of compressing and molding the resin filled in the cavity after the filling step, the upper jig and the upper die are brought into contact with each other, and the lower jig and the lower die are brought into contact with each other. A resin molding method, wherein the resin is molded by thermosetting the resin. The upper jig and the lower jig are detachably provided on the resin mold,
After the resin mold operation, the upper jig and the lower jig are taken out of the resin mold,
After cooling the upper jig and the lower jig to below the thermosetting temperature of the resin using a cooling device, mounting the upper jig and the lower jig on a resin mold and performing resin molding The resin molding method according to claim 1, characterized in that: In a resin mold method of clamping a molded product together with a sealing resin using a resin mold, and compression molding the molded product,
An upper jig and a lower jig for supporting the molded product and the resin are detachably provided on the resin mold,
After the upper jig and the lower jig are mounted on a resin mold and resin molded, the upper jig and the lower jig are taken out of the resin mold,
After cooling the upper jig and the lower jig to below the thermosetting temperature of the resin using a cooling device, mounting the upper jig and the lower jig on a resin mold and performing resin molding A resin molding method.   The resin according to any one of claims 1 to 3, wherein after the article to be molded and the resin are supplied to the resin mold, the resin mold region is evacuated by using a vacuum device to perform resin molding. Mold method.   The resin molding method according to any one of claims 1 to 4, wherein a resin mold mold part that is in contact with the resin during resin molding is covered with a release film and resin molding is performed. In a resin mold apparatus that clamps a molded product together with a sealing resin using a resin mold and compresses the molded product.
A work set part provided with at least one of an upper jig and a lower jig for supporting the molded product and the resin is detachably provided on the resin mold,
In the filling step in which the work set part is mounted on a resin mold and the cavity is filled with resin, the upper jig and the upper mold arranged to face the upper jig are separated from each other, and the lower A jig and a lower mold arranged opposite to the lower jig are separated and supported,
After the filling step, in the compression molding step of compressing and molding the resin filled in the cavity, the floating is performed such that the upper jig and the upper mold are brought into contact with each other and the lower jig and the lower mold are brought into contact with each other. A resin molding apparatus characterized in that a supporting means is provided in a resin mold.   As the floating support means, an upper lifter that urges and supports the upper jig in a mold opening / closing direction and toward the lower mold, and a lower jig that is movable in the mold opening / closing direction and toward the upper mold. The resin mold apparatus according to claim 6, further comprising a lower lifter that biases and supports the apparatus.   The resin mold apparatus according to claim 6 or 7, further comprising a cooling device for cooling a work set portion carried out of the resin mold die to a temperature equal to or lower than a thermosetting temperature of the resin. In a resin mold apparatus that clamps a molded product together with a sealing resin using a resin mold and compresses the molded product.
In the resin mold, an upper jig and a lower jig for supporting the product to be molded and the resin are respectively arranged facing the upper mold and the lower mold,
In the filling process of filling the cavity with the resin, the upper jig and the upper mold are separated from each other, and the lower jig and the lower mold are separated and supported. After the filling process, the cavity is filled. In the compression molding process of compressing and molding the resin, a floating support means for bringing the upper jig and the upper mold into contact with each other and bringing the lower jig and the lower mold into contact is provided in the resin mold. Resin mold mold.   10. The resin molding apparatus according to claim 9, further comprising a cooling means for cooling the upper jig and the lower jig to a temperature equal to or lower than a thermosetting temperature of the resin.   11. The apparatus according to claim 6, further comprising: a blocking unit that air-seals and blocks the resin mold region from the outside of the resin mold, and a vacuum device that evacuates the resin mold region. The resin molding apparatus according to one item.

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