JPS62269331A - Manufacture of semiconductor device fit for multple-product small-quantity production - Google Patents

Abstract

PURPOSE:To shorten the time required for the replacement of cavity blocks by a method wherein removably installed fixed-side and movable-side cavity blocks are respectively installed in fixed-side and movable-side metal mold bases heated to a prescribed resin-forming temperature. CONSTITUTION:Removable-type fixed top-force-side and movable bottom- forceside cavity blocks 7 and 8 are installed in metal mold bases 3 and 4 heated to a prescribed resin-forming temperature and accommodating said fixed top force and movable bottom force. This design facilitates the installation or removal of the fixed-side and movable-side cavity blocks 7 and 8 in or from the fixed-side and movable-side metal mold bases 3 and 4, which shortens the time period required for the replacement of the cavity blocks 7 and 8.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an improvement in a method of manufacturing semiconductor devices by resin-sealing TO, LSI, etc., and particularly relates to the production of a wide variety of semiconductor devices in small quantities. The present invention relates to a manufacturing method of the device suitable for various cases, and is utilized in the field of manufacturing technology industry for this type of device.

(Prior Art) It is widely known today that the transfer resin molding method is used as a method for manufacturing semiconductor devices.
There is one described in Japanese Patent No. 39889.

Since the main purpose of this method and mold device is to improve the quality and efficiently (large quantity) production of semiconductor devices, the shapes of the resin molding cavities in the cavity block of the mold are all formed in the same shape. In addition, the cavity block is configured to be used while being fixed to the mold base.In other words, the main purpose of the conventional method is to mold a larger number of semiconductor devices of the same shape. The above-mentioned cavity block, which is drilled into a conventional mold device that forms a shaped cavity, is not configured to have positive interchangeability such that the mold base can be frequently replaced with another one.

(Problems to be Solved by the Invention) By the way, in the conventional method and mold apparatus as described above, along with improvements in the processing technology of the mold itself and complete automation of the entire resin sealing process, The objectives of high quality and highly efficient production of semiconductor devices have been fully achieved.

However, when manufacturing semiconductor devices, for example, initially there is a tendency to produce a wide variety of products in small quantities. This has the disadvantage of not only making replacement work troublesome but also reducing overall production efficiency.

An object of the present invention is to provide a manufacturing method suitable for producing a wide variety of resin-sealed molded semiconductor devices in small quantities.

(Means for Solving the Problems) A method for manufacturing a semiconductor device according to the present invention includes the following steps as a means for achieving the above-mentioned object.

That is, both the mold bases 3 and 4 on the fixed upper mold side and the movable lower mold side are heated to a predetermined resin molding temperature, respectively, to a predetermined resin molding temperature.
The process of mounting both cavity blocks onto each of the above (A>) and transporting the lead frames 21 and 27 with semiconductor elements mounted between the cavities 20 and 10 disposed opposite to the cavity blocks 7 and 8. and a lead frame supply step (B) in which the element is supplied and set in the cavities 20 and 10, and a resin material 29 is supplied into the bot 9 provided on either side of the mold bases. (C), a mold clamping process (D) in which the movable lower mold side -5=moves the mold base 4 upward and joins both cavity blocks, and processes the supplied resin material 29 in the pot 9. By pressure-melting the molten resin material and injecting the molten resin material into the cavities 20 and 10 under pressure through the transfer passage consisting of the cull part 24 and the gate part 26, the semiconductor element in the cavity is sealed with the resin. A resin sealing step (E) of the semiconductor element, a mold opening step (') of moving the movable lower mold side mold base 4 downward to separate both cavity blocks 7 and 8, and a resin sealing process of the semiconductor element. A lead frame ejection step (G) in which the lead frames 27a and 27a are taken out between both cavity blocks 7 and 8, and an unnecessary solidified resin 29a and 29a in the transfer passage fixed to the lead frames 27a and 27a are removed. Removal step (H) of the resin molded body and the lead frames 27a and 27a
The unnecessary parts except for each lead 27b...27b are cut off to form a resin-sealed molded body 29b...29 of the semiconductor element.
a lead frame cutting step (1) of separately separating the leads 27a from the lead frames 27a, 27a, and each lead 27b protruding from the outer surface of the resin-sealed molded body 29b of the semiconductor element 29b. This method is characterized by comprising a lead bending step (J) of bending the lead 27b at a required angle.

(Function) According to the method of the present invention, it becomes easy to attach and detach both the fixed and movable side capacity blocks (7 and 8) to and from both the fixed and movable mold bases (3 and 4), respectively. Therefore, the time required for replacing the cavity blocks (7, 8) is shortened.

(Example) Next, the present invention will be explained based on embodiment figures.

FIG. 2 shows the main parts of a mold device for resin encapsulation of semiconductor devices. This device includes a fixed upper mold 1 fixed to a fixed plate (not shown) at the upper end of the device frame, and A movable lower mold 2 placed oppositely below the mold, and heat sources 5 such as oil or heaters placed on the bases 3 and 4 sides of both the molds 1 and 2, respectively.
・6 is provided.

A fixed cavity block 7 is removably fitted to the base 3 of the upper mold using a type of dovetail groove fitting, and a movable cavity block 8 is also fitted to the base 4 of the lower mold using a type of dovetail groove. It is fitted and mounted in a groove-fitting manner so that it can be freely attached.

Further, in the movable cavity block 8, a required plurality of pots 9...9 are arranged in the vertical direction, and around these pots 9, a required plurality of lower mold cavities 10, 10 (Fig. In the example, two cavities are provided for one pot. Further, in the vicinity of the lower mold cavity 10 in the block 8, there are provided heat sources 11, . Further, below the block 8, there are ejector turbines 12a...12a for ejecting the resin molded body molded in the lower mold cavity 10.
A lower ejector plate 12 equipped with a pressure plunger 13a for pressurizing the resin supplied into the pot 9.
・A plunger holder 13 that can accommodate one plunger holder 13a is arranged, and each of the ejector turbines 12a has a vertical insertion hole 14 bored in each lower mold cavity 10.
... 111, and the plungers 13a are inserted into the respective pots 9 by passing through the insertion holes 15 and 16 formed in the lower die base 4 and the ejector plate 12. There is. In addition, at least one screw hole 17 in the vertical direction is formed in the fitting dovetail portion 8a that fits into the block 8, and this screw hole 17 is formed so that the block 8 is When fitted into a predetermined position of the mold base 4, the holes J are provided so as to match the vertical bolt insertion holes 18 formed in the dovetail groove 4a of the lower mold base. Therefore, the block 8 can be reliably fixed at a predetermined position on the lower die base 4 by screwing the fixing holes 1 to 19 into the screw holes 17 through the above-mentioned insertion holes 18.

In addition, the heat source 11 of the movable cavity block 8 described above
... 11 is configured to operate at -9=4 temperature by a power source (not shown) placed on the base 4 side after being fitted and attached to the lower mold base 4. heat source 1
1...11 in the block whose temperature was increased by
The temperature of 10 parts of hide 2r is a temperature set arbitrarily, for example,
When the temperature reaches approximately 180 degrees, the active and direct heating action of the cavity 10 by the heat sources 11...11 is stopped, and thereafter only the heating action is caused by the conductive heat of the heat source 6 on the lower mold base 4 side. is configured to continue.

As such a heat source 11 that can freely switch between heating and heat insulation, an electric heater may be used as the heat source 11, for example. That is, in this case, the shaft ends of the heat sources 11 . , a connection with the power supply side) is provided (not shown).
Further, a temperature controller (not shown) is disposed in the insertion hole to electrically connect and disconnect the shaft end and the insertion hole based on a detection signal from a temperature detector in the cavity 10. Just configure it. Therefore, in this case, when the room-temperature block 8 is fitted into the predetermined position of the lower die base 4, the long-sleeved heat source 11...
11 is heated, and then the block 8 is heated by the amount of heat.

Furthermore, when the 10 parts of the cavity that are in one block due to the heat sources 11...11 reach the set humidity, the controller stops the heating and temperature raising action of the internal body of the heat sources 11...11, The heating for the block 1] is performed by heating the lower mold base 4.
Only the conductive heat from the heat source 6 of the lower mold base 4 is transmitted from the joint surface with the side. At this point, the humidity of the lower mold base 4 is usually set equal to the above-mentioned set temperature (approximately 180 degrees), so the temperature of the cavity 10 in the block quickly reaches the temperature of the lower mold base 4. Since the temperature of the molded resin is heated up to a certain temperature and the temperature is not raised to a higher temperature, it is possible to ensure humidity control of the 10 parts of the cavity by maintaining the 10 parts of the cavity at a preset appropriate resin molding temperature state.

By the way, when an electric heater is used as the elongated heat source 11, for example, the amount of heat generated at the middle portion and both end portions may not be constant. This can cause problems with heating. In order to demonstrate the variation in temperature during such heating, it is necessary to
...11, it generates heat evenly over the entire area, and
It is preferable to use a thermopipe (transient conduction element) that can uniformly heat each of the 110 parts of the vibrator with its heat amount.

This 4-no-mo pipe connects the heat source (11) to
For example, it is composed of a hollow pipe-shaped container body made of stainless steel or the like and a heat medium such as mercury (not shown) housed in the body, and this heat medium is heated by the power source on the base 1 side. In this case, [jl, the heat source (
11) It can be heated in the range of about 180 degrees to about 500 degrees. When using such a thermopipe, only temperature fluctuations occur in the heat source (11) itself;
Therefore, it is possible to uniformly heat each cavity 10 of the block 8, which has the advantage of correcting the above-mentioned adverse effects caused by temperature gradients caused by electricity overnight. The temperature roll of each of the 10 cavities due to the heating and insulation of the thermopipe itself can be reliably carried out by a controller similar to the temperature controller described above, and the The heat sources 5 and 6 may use oil.

The above-described arrangement of the lower mold base 4, movable cavity block 8, and its heat source 11 is substantially the same as the arrangement of the upper mold base 3, fixed cavity block 7, and its heat source (21). .

That is, the fixed side cavity block 7 is provided with a required plurality of upper mold cavities 20...20 facing the lower mold cavities 10...10, and the cavities 20...
. . 20 are provided with elongated heat sources 21 . Further, above the block 7, an ejector turbine 22a...
an upper ejector plate 22 with a support pin 22b...22b of the plate 22;
A spring 23 is provided to push down the plate 22 via a spring 23. As shown in FIG. The ejector plates 22 are fitted into vertical insertion holes 25...25 formed in the cull portions 24 facing the ejector plates 25, respectively.
When the mold is opened as shown in FIG. 2, the elasticity of the spring 23 pushes down the upper mold cavity 20 and the cull portion
The cured resin molded bodies are respectively protruded from the gate portions 26 . . . 26 that communicate the cavity 20 and the cull portion 24 .

At this time, the lower ejector plate 12 is
It is pushed up by the cutter bar 12b, and the resin molded body inside the lower mold cavity 10 is similarly pushed out.

However, when the lower mold 2 side is raised and both molds 1 and 2 are clamped at their parting line (P and L) surfaces, the upper and lower ejector plates 22 and
Upper and lower return pins (not shown) arranged opposite to the plate 12 cause the plates 22, 12 to move upward and downward, respectively.

Therefore, as shown in FIGS. 3 to 5, the semiconductor element (not shown) on the lead frame 27 is
The upper and lower cavities 20, 10 are set at predetermined positions by the upper and lower cavities 20, 10, and then the mold is clamped with the resin material 29 supplied into the lower mold pots 9...9. When pressurized at 13a, the resin material I429 is melted and injected into the upper and lower cavities 20 and 10 through the upper die cull part 24 and the gate part 26, and the semiconductor element in the cavity is sealed with resin. Transfer resin molding can be performed.

In addition, the fixed cavity block 7 has a movable cavity block 8 and a lower die base 4 (pull dovetail part 8a).
The same structure (7a, 3a) as the dovetail groove part 4a is provided, and the screw hole 17, the insertion hole 18, and the holes 1 to 1 are provided.
The same structure as the fixing means consisting of 9 is provided.

Furthermore, the heat sources 21...2 of the fixed cavity block 7
1, the arrangement relationship between the heat source 21 and the power source on the upper mold base 3 side, and the temperature control of the upper mold cavity 20 located in the block 7, as well as the lower mold 2 described above.
(not shown).

d3, attaching the movable cavity block 8 to the lower mold 2 side It is sufficient if they are mated and uncoupled at the same time.

In addition, to attach/detach the fixed side cavity block 7 to the upper mold 1 side (for example, -F section ejector plates 1 to 2
2 and its support pin 22b are removed, the block 7 and the plays 1 to 22 are simultaneously fitted together as one unit.
Just let them leave.

That is, the blocks 7 and 8 have +V with respect to bases 3 and 4.
It can be attached and detached reliably and easily by the simple means of fitting.

Next, a case will be described in which a semiconductor device is manufactured using the mold apparatus described above.

First, both cavity blocks 7 and 7 on the fixed upper mold side and the movable lower mold side are removable and equipped with the heating heat sources 21 and 11, respectively.
8 are heated to a predetermined resin molding temperature (for example, about 180 degrees Celsius) by heat sources 5 and 6. Carry out the cavity block installation process (A>, then
As shown in FIG. 3, both the gavity blocks 7 and 8
A semiconductor element is mounted between the cavities 20 and 10 which are arranged opposite to each other. After performing the step (B) of supplying the lead frame to the supply cell, as shown in the figure, the bot 9 installed on the mold base 4 on the movable lower mold side
A resin material supply step (C) of supplying the resin material 29 inside
Next, as shown in FIG. 4, a mold clamping step (D> is performed in which the movable lower mold side mold base 4 is moved upward to join both cavity blocks together, and then, as shown in FIG. As shown in FIG. 2, the supplied resin material (1129) in the bot 9 is pressurized and melted by the plunger 13a, and the molten resin material is passed through the transfer passage consisting of the cull section 24 and the goo section 26 into both the cavities. The first step (F) of resin sealing of the semiconductor element in the cavity is carried out by pressurized injection into the cavity 20.10, and then, as shown in FIG. A mold opening process (F
), and then, as shown in the same figure, the lead frames 27a, 27a in which the semiconductor elements are sealed with resin are not taken out between the cavity blocks 7, 8, and the lead frame protrusion step (G) is performed, and then , as shown in FIGS. 6 and 7, an unnecessary resin molded body removal step (]") of removing the solidified resin 29a...29a in the transfer passage fixed to the lead frames 27a and 27a. Then, as shown in FIG. 8, the lead frames 27a and 27a are
The unnecessary parts except for each lead 27b...27b are cut off to form a resin-sealed molded body 29b...29 of the semiconductor element.
A lead frame cutting step (I) is performed in which the lead frames 27a and 27a are separated from each other, and then,
As shown in FIGS. 9 and 10, each lead 27b...27b protruding from the outer surface of the resin-sealed molded body 29b...29b of the semiconductor element is connected to a support 30a of the molded body 29b. The semiconductor device 31 can be manufactured by performing a bending step (J) of bending the lead to a required angle using a bending mechanism 30 comprising a bending roller 30b and the like.

In addition, heat sources 21 and 1 are installed in both cavity blocks 7 and 8 themselves.
1, but if it is not necessary to quickly raise the temperature of both the cavity blocks 7 and 8, the heat sources 21 and 11 provided therewith and the two blocks 7 and 8 provided therewith are used.
It is possible to omit the heating action of the above, and furthermore, the above-mentioned temperature control of the cavity block can also be omitted.

As mentioned above, the method of the present invention includes the cavity block 7.
This objective can be achieved by using a mold device configured such that the mold bases 8 can be attached to and detached from the mold bases 3 and 4 at will.

By the way, when the cavity blocks 7 and 8 are replaced, the ejector plates 22 and 12, which are integrally attached to the gearing blocks, are usually replaced at the same time as described above.

Further, the mold device shown in FIG. 2 is of a multi-plunger type that includes a plurality of required pots 9 and the same number of plungers 13a fitted into the pots 9.
If the positions of the pots in the cavity block to be newly mounted on the mold base 4 are different from the positions before replacement, that is, due to the requirements and constraints of sequentially manufacturing semiconductor devices of different types, each plunger 13a ...13a
It is expected that the pitch interval will be different from the previous one.

Therefore, in such a case, it is necessary to change or adjust the pitch interval of each plunger as appropriate to correspond to the pitch interval of each pot after replacement, or to change or adjust the pitch interval of each plunger and its holder 13 as a whole. There will be a need to exchange it for the same amount).

In addition, in order to quickly start the next resin molding operation, the mold apparatus is required to have a configuration that allows the above-mentioned parts to be easily replaced and adjusted.

The mold apparatus shown in FIGS. 11 to 21 proposes a configuration example that can meet the above-mentioned requirements that must necessarily be taken into consideration when implementing the method of the present invention efficiently and reliably. This is what I did.

Furthermore, FIG. 22 shows an example of an improved mold configuration that takes into consideration other objectives such as miniaturization of the mold device so as to increase speed.

Hereinafter, the structure of the above-mentioned mold structure example used in the method of the present invention will be explained based on FIGS. 11 to 22 (in addition,
The basic mold configuration is substantially the same as the configuration shown in FIG. 2, so its constituent members are designated by the same reference numerals as in FIG. 2).

FIG. 11 shows a disassembled state of the mold device in which each component is detachable. The plungers 13a...13a in this mold device are shown in FIGS. 12 to 15.
As shown in the figure, the pitch interval of each plunger can be freely changed and adjusted, and each plunger 13a and its holder 13 can be detachably attached to the lower mold base 4. It is composed of

That is, in the lower part of the plunger holder 13, a rail part vJ32 is arranged parallel to the left and right direction of the plungers 13a... Horizontal groove 13
b and 13b are engaged with left and right horizontal protrusions 32a and 32a provided on both the front and rear surfaces of the rail member 32, respectively, so that the plunger 13a and its holder 13 as a whole are connected to the rail member 32. It is supported by the protrusion 32a, is guided by the protrusion, and is fitted into the mounting space 4b of the lower mold base 4, and conversely, as shown in FIG. It can be taken out. Further, each plunger 13a...13a is provided with an elastic member 33 having equal elasticity disposed within the holder 13.
. . 33, each of which is elastically protruded upward, so that, for example, each bolt 9 . . .
- Even if there is an excess or deficiency in the amount of resin material 29 supplied into the molten resin material 9, the pressing force of each plunger 13a...13a for each monthly charge is equalized, and the molten resin material is A mechanism for uniformly pressurizing the resin material is constructed so that the resin molding conditions can be made the same when the resin material is injected under pressure into each cavity block 20, 10. Further, the bottom of each plunger 13a...13a is connected to a sliding surface in the left and right horizontal direction formed on the inner bottom of the holder 13 via the seats (spring seats) 34...34 of the elastic member 33. 13c and 13c in a movable manner, and a long hole 13d in the left and right direction is formed in the upper surface of the holder 13. Therefore, each plunger moves on the sliding surface 13c of the holder. It is provided so that it can freely slide in the left and right horizontal directions within the range of the elongated hole 13d. Furthermore, a plunger pitch corresponding to the position of each bot 9...9 in the left and right direction arranged in the lower mold cavity block 8 is set at 1.11 on the cover plate 13e which is removably fitted on the upper surface of the boulder 13. Regulation hole 13f...
- 13f is formed (see Figure 15). Therefore, the pitch interval of each of the plungers p-13a...13a is the same as that of each of the bots 9...9.
By attaching the 3e, it can be changed and adjusted freely. In addition, the holder 13 and the rail member 32
The holder has the above-mentioned engagement relationship, but the holder is a rod provided to be reciprocated up and down by a drive mechanism (not shown) such as a hydraulic, pneumatic or electric motor fixed to the lower part of the rail member 32. 32b, each of the plungers 13a...13a can be fitted into each of the bots 9...9 of the lower cavity block 8 (see FIG. 13). Therefore, the resin molding action described above is performed in this state.

The lower ejector plate 12 is disposed at the lower part of the lower mold cavity block 8, and grooves 12c...12C are formed in the left and right horizontal directions on both the front and rear surfaces thereof. Furthermore, engaging members 12e and 12e for engaging the plate fixed to the upper surface of the support bar 12d for the play 1 are arranged at both left and right ends of the plate 12 (see FIG. 16). The engaging protrusions 12f and 12f provided on both the front and rear surfaces of the mating member are connected to the side grooves 12c and 1 of the plate.
2c, respectively. Further, each of the plungers 13a...13a has a long hole 12q in the left and right direction formed in the support bar 12d, a long hole 12h in the left and right direction formed in the lower mold base 4, and a lower ejector plate 12.
Each bot 9.
...It is fitted inside 9. Therefore, in order to attach and detach the lower ejector plate 12 together with the lower mold cavity block 8 to the lower mold base 4, as described above, each plunger 13a... 9...9 and the elongated hole 12i of the lower ejector plate.

Further, during this attachment/detachment, the plate 12 is smoothly slid in the left-right direction by the guiding action of the engaging member 12e and its protrusion 12f.

Furthermore, when the ejector bar 12b is moved up and down, the ejector turbines (12a) provided in the plays 1 to 12 are
The support bar 12d, the engaging member 12e, and the plate 1
It is configured to be moved up and down at the same time via 2.

FIGS. 17 to 20 show that when the cavity blocks 7 and 8 are attached to and detached from the mold bases 3 and 4, the cavity blocks can be easily fitted and attached and securely fixed in a predetermined position. An example of the configuration is shown.
Since this configuration can be substantially the same for both the upper and lower molds 1 and 2, only the lower mold 2 will be described below.

The cavity block 8 and the lower die base 4 are configured to be removable by a kind of dovetail fitting (8a, 4a>) as described above. part 8a and the dovetail groove 4a on the base side
is formed as follows.

That is, as shown in the figure, the width W of the upper part of the key V piti block 8 is narrower than the width wl of the fitting part in the base, and therefore, this part is narrower than the width wl of the fitting part of the block 8. At some point it becomes free. Also, the width W2 between the tip portion 8b of the dovetail portion 8a of the block and the fitting portion 4C of the dovetail groove 48 of the base that is fitted with the tip portion 8b.
is formed and processed with high precision, and the rear end portion 8C of the dovetail portion and the dovetail groove/! a
The width W3 of the fitting portion 4d is also formed with high precision, and the two sections 8b and 4C (and 8C and 4d) are tightly fitted. Furthermore, the width W2 of the tip portion 8b is
is narrower than the width W3 of the rear end portion 8C of letter L, and
The space between the front end portion 8b and the rear end portion 8C is set in a free state with respect to the dovetail groove 4a. Therefore, the block 8 can be easily fitted into the base 4 in a free state. At the same time, the fitting at the predetermined position can be set with high precision (the pulled end and rear end are firmly attached by dovetail groove fitting). Instead of the mating portion 4C, or together with it, a positioning protrusion 8d provided on the distal end surface of the block 8 and a recess 4e for engagement with the protrusion 8d provided on the base 4 side. A positioning means may be formed.Furthermore, as the positioning means, a positioning member 35 (Jf may be set.

Note that it is also possible to adopt a configuration in which the tip of the fixture 35c is directly fitted into and removed from a hole (not shown) provided on the side surface of the dovetail portion 8a for confirming a predetermined position.

Further, as shown in FIGS. 17 and 18, after the block 8 is fitted into a predetermined position of the base 4, a stopper pin 36 fitted to the block 8 is formed on the base 4. By engaging with the engagement hole 4f of the pin 36,
The block 8 is configured to be handled (stopped).Furthermore, the shaft diameter of the stopper pin 36 is formed to be smaller than the diameter of the engagement hole 4f, as described above. , when the temperature of the cavity 10 of the block is raised to a predetermined temperature, the block 8 and the base 4 are made to fit well by utilizing the thermal expansion. In addition to the structure of 8a-4a), both the dovetail portion 8a and the dovetail groove 48 are provided with a tapered surface 37 that slopes to become narrower toward the tip end of the block 8, as shown in FIG. The tapered surface 37a on the side of the dovetail groove 4a may be configured so that the block 8 and the base 4 are fitted together smoothly. It may be formed only on the lower end surface at a plurality of locations that join with the tapered surface 37b on the side of the dovetail portion 8a (see FIG. 19). However, instead of the tapered surface 37a, the 20th
As shown in the figure, a horizontal surface 37C may be formed, in which case it will be in line contact with the tapered surface 37b on the dovetail portion side (in addition, in this case, a horizontal surface may be formed on the corresponding surface on the dovetail portion 8a side). Therefore, when fitting the block 8 to the base 4, the fitting action can be performed smoothly, and only when fitting in a predetermined position.
This allows the block 8 to be fitted tightly onto the base 4 with high precision.

FIG. 21 shows a configuration in which a boulder 38 for supporting the ejector plates 22, 12 is fixed to the cavity blocks 7, 8.

Therefore, according to this configuration, the ejector plates 22 and 12 are connected to the cavity block 7 with respect to the bases 3 and 4.
・It is easy to attach and detach at the same time as 8 and as one unit.

FIG. 22 shows a configuration example aimed at reducing the size of the lower mold 4. As shown in FIG.

That is, the structure of the lower die 4 shown in FIG. 11 has the advantage that the plunger 13a and its holder 13 can be easily replaced, but each plunger 13a...13a is provided to protrude upward. In this connection, the vertical interval of the space 4b becomes longer, which means that the rest of the mold apparatus becomes larger. Therefore, in order to solve this problem, each plunger 13a...13a is constructed so that it can be divided into a plurality of parts and assembled. In this case, lower mold 4
In addition to the advantage of being able to downsize the plunger, it is also possible to replace only the plunger tip 13g that fits into Bottle 9, so the clearance between the tip 13g and Bots 1 to 9 can always be maintained at an appropriate level. Therefore, for example, due to abrasion, the clearance expands and the resin material 2
Even in cases where it is not possible to obtain a predetermined pressing force for the plunger 9, the plunge r-holder 13 can be disassembled and the
This has the advantage that there is no need to replace the plunger 13.

In addition, a stopper mechanism consisting of the above-mentioned positioning protrusion 8d and recess 4e, positioning part vJ35, stopper pin 36, engagement hole 1'', etc., and tapered surfaces 37 and 37a that are covered by the dovetail and dovetail grooves.・Since the configuration of the arrangement of the 37b and the horizontal surface 37C is such that they are relatively arranged between the cavity blocks 7 and 8 and the mold bases 3 and 4, the manufacturing of the mold is performed using the mold. This can be changed as appropriate depending on the actual usage of the device.

Further, reference numeral 39 in the figure indicates a fixing block for fixing both front and rear ends of the cavity blocks 7 and 8.

As described above, according to the above embodiment, both the fixed and movable cavity blocks 7 and 8 can be easily attached to and detached from the bases 3 and 4 on the fixed and movable sides, respectively.
The time required to replace the cavity blocks 7 and 8 is shortened.

(Effects of the Invention) According to the method of the present invention, since a mold device having positive replaceability such as frequently exchanging the cavity block with respect to the mold base is used, both the mold bases on the fixed side and the movable side are used. In contrast, it is possible to provide a manufacturing method suitable for high-mix, low-volume production of semiconductor devices in which both the fixed side and movable side cavity blocks are frequently replaced, thereby solving the problems of the conventional method as described in (e) above. This has an excellent effect of reliably eliminating the problem.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the overall configuration of the method of the present invention, and FIG.
Figures to Figures 10 do not show examples of the method of the present invention, Figure 2 is a partially cutaway longitudinal sectional front view showing the main parts of the mold device used in the method, and Figures 3 to 5 6 to 8 are explanatory diagrams of the effect of resin sealing of a semiconductor element, and FIGS. 6 to 8 are explanatory diagrams of the removal of unnecessary parts of the lead frame and unnecessary resin molded bodies fixed to the lead frame. FIGS. 9 and 10 FIG. 2 is an explanatory diagram of the bending action of the lead. 11 to 22 show other configuration examples of the mold device used in the method of the present invention, FIG. 11 is an exploded perspective view of the mold device, and FIG. 12 is a part of the device. 13 is a partially cutaway enlarged vertical sectional side view showing the main parts of the device; FIG. 14 is a plan view of a portion of the plunger holder; FIG. 15 is a plan view of the cover plate of the holder; Fig. 16 is a bottom view of the lower ejector plate portion, Fig. 17 is a partially cutaway plan view showing the main parts of the lower mold, and Fig. 18 is a diagram showing the dovetail portion of the lower mold cavity block and the dovetail groove of the lower mold base. 19 and 20 are partially cutaway exploded front views showing an example of the configuration; FIGS. 19 and 20 are exploded front views showing essential parts of other configuration examples of the dovetail portion and the dovetail groove; FIG. 21 is a cavity block and ejector plate. FIG. 22 is a partially cutaway front view showing another example of the structure of the mold device. 1 or less margin 1 (explanation of symbols) A... Cavity block installation process, B... Lead frame supply process, C... Resin material supply process, D... Mold clamping process, E...・Resin sealing process of semiconductor element, F... Mold opening process, G... Lead frame protrusion process, H... Removal process of unnecessary resin molding, ■... Lead frame cutting process, J... Lead bending process, 1... Fixed upper die, 2... Movable lower die, 3... Upper die base, 4... Lower die base, 4a... Dovetail groove, 4b ...Space, 4G, 4d...Mating portion, 4e...Recess, 4"...Engagement hole, 5, 6...Heat source, 7...Upper mold cavity block, 8. ... lower mold cavity block, 8a ... dovetail part, 8b ... tip part, 8G ... rear end part, 8d ... protrusion, 9 ... pot, 10 ... lower mold cavity, DESCRIPTION OF SYMBOLS 11... Heat source, 12... Lower ejector plate, 12a... Ejector turbine, 12b... Ejector bar, 12c... Groove, 12d... Support bar, 12e... Engaging member , 12f... protrusion, 12(J, 12h, 12i... long hole, 13... plunger holder, 13a... plunger, 13b... groove, 13c... sliding surface , 13d...long hole, 13e...cover plate, 13f...hole, 13C]...tip, 20...upper mold cavity, 21...heat source, 24...cull part , 26... Gate portion, 27... Lead frame, 28... Attachment/detaching mechanism, 29... Resin material, 29a... Anabolic resin, 30... Bending mechanism, 30a... Support tool , 30b...Bending roller, 31...Semiconductor device, 32...Rail member, 32a...Protrusion, 32b...Rod, 33...Elastic material, 34...Socket, 35... Positioning member, 35a... Ball, 35b... Ball spring, 35c... Fixture, 36... Stopper pin, 37, 37a, 37b... Tapered surface, 37c... Horizontal surface , 38...Holder, 39...Fixing block.

Claims (1)

[Claims] a mounting step of mounting both the fixed and movable cavity blocks of the removable type onto the fixed and movable mold bases heated to a predetermined resin molding temperature; A lead frame supply step of transporting a lead frame with a semiconductor element mounted between cavity parts arranged to face each other in both cavity blocks, and supplying and setting the element to both the cavity parts, and either of the above-mentioned mold bases. A resin material supply process in which the resin material is supplied into the pot provided on one side, a mold clamping process in which the movable mold base is moved to join both cavity blocks, and the resin material supplied in the pot is A process for resin-sealing a semiconductor element in which the semiconductor element in the cavity is sealed with resin by melting the resin material under pressure and injecting the molten resin material into the cavities through a transfer passage consisting of a cull part and a gate part. a mold opening step in which the movable mold base is retracted to separate both cavity blocks; a lead frame protrusion step in which a lead frame in which a semiconductor element is sealed with resin is taken out between both cavity blocks; an unnecessary resin molded body removal step of removing the solidified resin in the transfer passage that is fixed to the lead frame; and a step of removing the unnecessary resin molded body except for each lead in the lead frame, and removes the resin-sealed molded body of the semiconductor element from the lead frame. a lead frame cutting step in which each lead frame is separated from the semiconductor element; and a lead bending step in which each lead protruding from the outer surface of the resin-sealed molded body of the semiconductor element is bent at a required angle. A semiconductor device manufacturing method suitable for low-volume production of various types.