JPS59110126A - Mold package forming apparatus - Google Patents
Mold package forming apparatusInfo
- Publication number
- JPS59110126A JPS59110126A JP22043782A JP22043782A JPS59110126A JP S59110126 A JPS59110126 A JP S59110126A JP 22043782 A JP22043782 A JP 22043782A JP 22043782 A JP22043782 A JP 22043782A JP S59110126 A JPS59110126 A JP S59110126A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heater block
- block
- rear surface
- movable bed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 230000013011 mating Effects 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術０奇〕
この発明は半導体素子を熱硬化性樹脂などＫよりモール
ド成形するモールド／ぐツケージ成形装置纜に関する。DETAILED DESCRIPTION OF THE INVENTION [Technology of the Invention] The present invention relates to a mold/gut cage forming apparatus for molding a semiconductor element from K such as a thermosetting resin.
ＩＣなどの電子部品の製造工程においては、半導体素子
をたとえばエポキシ樹脂などの熱硬化性樹脂によってモ
ールド成形する工程があるが、これには第１図に示すよ
うに１対の金型ａ。In the manufacturing process of electronic components such as ICs, there is a process of molding semiconductor elements using thermosetting resin such as epoxy resin, and this involves a pair of molds a as shown in FIG.
ｂの型合わせ面にキャビティｃｆ形成し、このキャビテ
ィＣに半導体素子ｄおよび熱硬化性樹脂ｅを充填し、第
２図に示すように金型ａ、ｂの背面に金型ａ、ｂと異々
る材質のヒータブロックｆ、ｆを強固に固定して金型ｊ
、ｂを加熱するという方法がとられている。そして、モ
ールドパッケージ成形装置はさらに上記金型ａ。A cavity cf is formed on the mold matching surface of mold b, and this cavity C is filled with a semiconductor element d and a thermosetting resin e.As shown in FIG. firmly fix the heater blocks f and f made of the same material as
, b is heated. The mold package forming apparatus further includes the mold a.
ｂヒータブロックｆ、ｆのほかに構成部分として断熱材
ｇ、ｇスペーサｈ、ｈおよびペースｉ。b Heater blocks f, f and other constituent parts include heat insulating material g, g spacers h, h, and space i.
ｉを有し、これら□を介して移動ペッドｊおよびフレー
ムｋに取付けられている。また、上記移動ベッドｊの下
面中央部にはピストン！が設けられている。i, and is attached to the moving ped j and the frame k via these □. Also, there is a piston in the center of the bottom of the moving bed j! is provided.
上記の金型ａ、ｂでモールド成形するには金型ａ、ｂの
型合わせ面にピストン！により圧力を加えた状態でヒー
タブロックｆ、ｆを加熱するが、金型ａ、ｂとヒータブ
ロックｆ、ｆとは材質が異なり、しかもこれらが強固に
結合されているためバイメタルの効果により変形即ち湾
曲が生じ金型ａ、ｂが第３図に示すように凸面状に湾曲
し、金型ａ、ｂ間に隙間が形成され樹脂パリが生ずると
いう欠点があった。また、バイメタル効果は同一材質の
場合であっても、均一な温度に保たれない２個の部材に
おいては同様に起る。そのため、従来は金型ａ、ｂを予
め凹面状に仕上げておき加熱後の熱変形により平面にな
るようにしたが、実際問題として上記バイメタル効果の
影響を完全に補正することは極めて困難であった。即ち
、問題にする金型の隙間は数ミクロン程度であり、この
ような歌手な型挙動に対し、熱変形前の金型形状を割り
出すことは理論、実験両面からの厳密なアプローチが要
求され、実際に金型に設ける凹面形状の把握が困難であ
る。また熱変形前の金型形状が把握できたとしてもその
加工には高精度が要求されるだけでなく、金型の温度管
理に厳密さが要求されるという欠点がある。また、金型
の型合わせ面に圧力を加える場合に移動ペッドｊの中央
部下面の１本のピストン！で押印すると移動ベッドｊが
第４図のように変形し型合わせ面の湾曲をおさえること
ができないので、ピストン！の本数を増加したり、また
は移動ベッドｊの厚さを増す必要があり、装置が大形と
なりそれだけ高価になるという欠点があった。To mold with the molds a and b above, use a piston on the mating surfaces of molds a and b! Heater blocks f and f are heated under pressure, but since molds a and b and heater blocks f and f are made of different materials and are firmly connected, they may be deformed or deformed due to the bimetallic effect. The molds a and b are curved in a convex shape as shown in FIG. 3, and a gap is formed between the molds a and b, resulting in resin fringing. Furthermore, even if the two members are made of the same material, the bimetal effect occurs in the same way when two members are not kept at a uniform temperature. For this reason, in the past, molds a and b were finished in a concave shape in advance, and then thermally deformed after heating to make them flat, but as a practical matter, it is extremely difficult to completely correct the influence of the bimetallic effect. Ta. In other words, the gap between the molds in question is on the order of a few microns, and determining the shape of the mold before thermal deformation in response to such unusual mold behavior requires a rigorous approach from both theoretical and experimental perspectives. It is difficult to grasp the concave shape actually provided in the mold. Further, even if the shape of the mold before thermal deformation can be determined, not only high precision is required for processing the mold, but also strict temperature control of the mold is required. Also, when applying pressure to the mold mating surface of the mold, one piston on the lower center of the moving ped j! When stamping with , the moving bed j deforms as shown in Figure 4 and the curvature of the molding surface cannot be suppressed, so the piston! It is necessary to increase the number of movable beds j or increase the thickness of the moving bed j, which has the drawback of making the device larger and correspondingly more expensive.
この発明は上記の事情を考慮してなされたもので、その
目的とするところ°は、上記問題点を解消し、樹脂パリ
を生じないモールド・千ツヶージ成形装置を提供しよう
とするものである。This invention has been made in consideration of the above circumstances, and its purpose is to solve the above problems and provide a mold/chitsugaji molding apparatus that does not cause resin flakes.
この発明においては、金型を加熱するヒータブロックお
よびその池数形装置の構成部分を分割しこれを取付板に
取付けることにより、高温のヒータブロックとスペーサ
ブロック、ベース等の低温部との温度差によるバイメタ
ル効果を抑制し金型に隙間を生じさせないようにしたも
のである。In this invention, by dividing the heater block that heats the mold and the component parts of its pond number shaping device and attaching them to the mounting plate, the temperature difference between the high temperature heater block and the low temperature parts such as the spacer block and base can be reduced. This suppresses the bimetallic effect caused by metallization and prevents gaps from forming in the mold.
以下、この発明の一実施例を添付図面を参照して説明す
る。第５図中１は可動金型、１２は固定金型で、これら
金型１および１２にはキャピテイを掘りこんであるプレ
ート３が固定され金
ている。また、椀型へ１の背面にはほぼ角形断面の溝４
が形成されている。この溝４には長手方向に２部分に分
割されたヒータブロック５゜５が上面に形成された凸部
５ａ、５ａが嵌合され、この凸部５ａ、５ｍを介し摺動
自在に取付けられているう上記ヒータブロック５，５の
背面の両側には断熱板６，６を介してスペーサブロック
７．７が重合されている。さらに、このスペーサブロッ
ク７．７の背面にはベース８が移動ベッド９に固定され
ている。移動ベッド９にはヒータブロック５．５および
スペーサプロ ′ツク７．７が移動ベッド９に取付けし
れた複数のクランプ１０・・・により取付けられている
。なオ上記移動ペッド９はその厚さを充分大きくし撓み
を生じないようにしである。また、移動ベト９の背面に
は複数のピストン１１・・・を配設し、これら複数のピ
ストン１１・・・の押圧力により移動ベッド９に撓みが
生じないよう罠なっている。An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 5, 1 is a movable mold, and 12 is a fixed mold. A plate 3 having a cavity cut therein is fixed to these molds 1 and 12. In addition, there is a groove 4 with an almost square cross section on the back of the bowl-shaped part 1.
is formed. A heater block 5.5, which is divided into two parts in the longitudinal direction, is fitted into the groove 4 with projections 5a and 5a formed on the upper surface thereof, and is slidably attached via the projections 5a and 5m. Spacer blocks 7.7 are superimposed on both sides of the back surfaces of the heater blocks 5, 5 with heat insulating plates 6, 6 interposed therebetween. Furthermore, a base 8 is fixed to the movable bed 9 on the back side of this spacer block 7.7. A heater block 5.5 and a spacer block 7.7 are attached to the movable bed 9 by a plurality of clamps 10 attached to the movable bed 9. The thickness of the movable ped 9 is made sufficiently large so that it does not bend. Further, a plurality of pistons 11 are disposed on the back surface of the movable bed 9, and a trap is formed to prevent the movable bed 9 from being deflected by the pressing force of the plurality of pistons 11.
さらに、上記金型１の上方には同様に前記固定金型１２
が成形装置構成部分としてのヒータブロック５・・・断
熱板６・・・スペーサブロック７°°。Further, above the mold 1, the fixed mold 12 is also provided.
are the heater block 5, the heat insulating plate 6, and the spacer block 7° as constituent parts of the molding device.
およびベース８を介して固定ペッド１３に取付けられて
いる。and is attached to the fixed ped 13 via the base 8.
しかして、上記のように構成された成形装置においてヒ
ータブロック５・・・に通電して加熱した状態で金型１
を固定金型１２に対して押庄すると、移動ベッド９は材
厚が充分に厚くかつ、ピストン１１が複数設けられてい
るので、移動ベッド９が従来のように凸状に肩面するこ
とが防止される。また、金型１，１２とヒータブロック
５・・・とは異なる材質からなるが、これらは摺動自在
に取付けられているので、バイメタル効果が抑制される
。また、ヒータブロック５・・・、スペーサブロック７
・・・が分割され、それぞれクランプ１０・・・で強く
固定されるので高温のヒータブロック５・・・と低温の
スペーサブロック７・・・、ペース８との温度差による
バイメタル効果も抑制され金型１，１２の湾曲が防止さ
れ金型１と金
固定倫型１２との間に隙間が発生することが防止される
。Therefore, in the molding apparatus configured as described above, the mold 1 is heated while the heater blocks 5 are energized and heated.
When pressed against the fixed mold 12, the movable bed 9 has a sufficiently thick material and is provided with a plurality of pistons 11, so the movable bed 9 does not have a convex shoulder surface as in the conventional case. Prevented. Further, although the molds 1 and 12 and the heater block 5 are made of different materials, since they are slidably attached, the bimetal effect is suppressed. In addition, heater block 5..., spacer block 7
... are divided and strongly fixed with clamps 10, respectively, so that the bimetallic effect caused by the temperature difference between the high temperature heater block 5 and the low temperature spacer block 7 and spacer block 8 is also suppressed. Curving of the molds 1 and 12 is prevented, and generation of a gap between the mold 1 and the gold-fixing mold 12 is prevented.
なお、上記実施例においてはヒータブロック５・−・、
スペーサブロック７・・・を固定するのにクラツプ１０
を用いたがボルト締めを併用してもよくこれにより金型
１，１２の湾曲を一層少なくすることができる。In addition, in the above embodiment, the heater block 5...
Clap 10 for fixing spacer block 7...
Although bolting may be used in conjunction with this method, the curvature of the molds 1 and 12 can be further reduced.
。上記興施例のように金型１，１２とヒータブロック５
・・・とを摺動自在にしたので異種金属材料の場合にお
いても互いに異なる挙動が可能となりバイメタル効果を
解除することができる。. As in the above example, the molds 1 and 12 and the heater block 5
. . . are made slidable, so even in the case of dissimilar metal materials, mutually different behavior becomes possible, and the bimetallic effect can be canceled.
々お、構成部分の・分割は２分割に限らず必要に応じて
さらに細分割してもよい。Furthermore, the division of the constituent parts is not limited to two, but may be further divided as necessary.
〔発明の効果Ｊ
この発明は以上説明したように、金型を加熱するヒータ
ブロック等の構成部材を分割し金型に対して摺動自在に
収付けたので、バイメタルの効果による金型の湾曲が防
止され、金ＱＪ’温度に関係なく型合わせ面形状が平面
に保たれる。[Effect of the invention J As explained above, in this invention, the constituent members such as the heater block that heats the mold are divided and housed in a slidable manner with respect to the mold, so that the mold is curved due to the bimetallic effect. is prevented, and the shape of the mold mating surface is kept flat regardless of the gold QJ' temperature.
したがって金型製作において、型合わせ面を予め凹面状
に仕上げる必要がなくなり経験と晶精度を要する作業が
解消されたので製作時間を大幅に短縮することができる
。また、樹脂パリの発生が抑制されるのでパリ収り作業
に要する時間が節約できる。さらに、金型温度管埋も従
来に比して容易になる等の効果がある。Therefore, in mold manufacturing, it is no longer necessary to finish the mold mating surfaces into a concave shape in advance, and the work that requires experience and crystal precision is eliminated, so that the manufacturing time can be significantly shortened. Furthermore, since the occurrence of resin debris is suppressed, the time required for debris removal work can be saved. Furthermore, there are effects such as easier installation of mold temperature pipes than in the past.
第１図は一般のモールドＡツケージ成形装置の金型を示
す断面図、第２図は従来のモールトノ＋ツケージ成形装
置を示す側面図、第３図は同じく作用の説明図、第４図
は同じく作用の説明図、第５図およ・び第６図はこの発
明の一実施例を示すもので、第５図は側面図、第６図は
要部のみを示す斜視図である。
１．１２・・・金型、２・・・型合わせ面、３・・・キ
ャビティ、５・・・ヒータブロック。
出願人代理人 弁理士 鈴 江 武 彦第１図
第２図
第３図
第４図Fig. 1 is a sectional view showing the mold of a general mold A-cage forming device, Fig. 2 is a side view showing a conventional mold A-cage forming device, Fig. 3 is an explanatory diagram of the operation, and Fig. 4 is the same. Explanatory drawings of the operation, FIGS. 5 and 6, show one embodiment of the present invention, with FIG. 5 being a side view and FIG. 6 being a perspective view showing only the main parts. 1.12... Mold, 2... Mold mating surface, 3... Cavity, 5... Heater block. Applicant's Representative Patent Attorney Takehiko Suzue Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
子およびこれをモールドする熱硬化性樹脂を充填しヒー
タブロック、スペーサブロックなどの構成部分を介して
上記金型を圧接してモールド成形するものにおいて、上
記金型を加熱するヒータブロックおよび上記構成部分を
複数に分割するとともに上記ヒータブロックを上記金型
に対して摺動可能にしたことを特徴とするモールドパッ
ケージ成形装置。A semiconductor element and a thermosetting resin for molding the semiconductor element are filled into a cavity formed on the mating surfaces of a pair of molds, and the mold is pressed against the mold through component parts such as a heater block and a spacer block. A mold package forming apparatus, characterized in that a heater block for heating the mold and the constituent parts are divided into a plurality of parts, and the heater block is made slidable with respect to the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22043782A JPS59110126A (en) | 1982-12-16 | 1982-12-16 | Mold package forming apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22043782A JPS59110126A (en) | 1982-12-16 | 1982-12-16 | Mold package forming apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59110126A true JPS59110126A (en) | 1984-06-26 |
Family
ID=16751092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22043782A Pending JPS59110126A (en) | 1982-12-16 | 1982-12-16 | Mold package forming apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59110126A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62269331A (en) * | 1986-09-04 | 1987-11-21 | Michio Osada | Manufacture of semiconductor device fit for multple-product small-quantity production |
| JPS637915A (en) * | 1986-06-28 | 1988-01-13 | Mitsubishi Metal Corp | Mold for transfer molding |
-
1982
- 1982-12-16 JP JP22043782A patent/JPS59110126A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637915A (en) * | 1986-06-28 | 1988-01-13 | Mitsubishi Metal Corp | Mold for transfer molding |
| JPS62269331A (en) * | 1986-09-04 | 1987-11-21 | Michio Osada | Manufacture of semiconductor device fit for multple-product small-quantity production |
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