JPS59232840A - Package molding device - Google Patents

Abstract

PURPOSE:To prevent a metallic mold from being deformed due to a bimetal effect and prevent flashes from being generated, by a method wherein a pair of metallic molds are provided respectively with heaters, and support blocks having high stiffness are slidably provided ont the back side of the molds. CONSTITUTION:When a movable metallic mold 1 is pressed against a fixed metallic mold 2 by a piston 15 in the condition where electric currents are passed to the heaters 8, 8 for the metallic molds 1, 2, a movable head 13 is prevented from being bent into a protruded form and the molds 1, 2 are prevented from being bent, since the support block 17 having sufficient thickness and high stiffness is firmly fitted to an upper part of the head 13 by clamps 16. Accordingly, generation of a gap between faying surfaces of cavity blocks provided respectively in the molds 1, 2 is prevented from occurring. In addition, since the support blocks 17, 17 are slidably provided on the back side of the molds 1, 2, a bimetal effect is restrained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mold package forming apparatus for molding a semiconductor element using a thermosetting resin or the like.

[Technical background of the invention and its problems]

In the manufacturing process of electronic components such as ICs, there is a process of molding semiconductor elements using a thermosetting resin such as epoxy resin. Cavity blocks 4, 4 are provided to form cavities 3, 3, and heaters 8, 8 are used to fill the cavities 3, 3 with a semiconductor element 5 and a molding material 6 such as an epoxy resin, and pressurize and heat the molded material 6.
A heater block 9°9 equipped with a heater block 9°9 is firmly fixed. The heater blocks 9, 9 are made of a different material from the molds 1, 2. In addition to the molds 1 and 2 and the heater block 9.9, the mold package forming apparatus further includes a heat insulating material 10=10s spacer block 11.11 and a base 12.12 as constituent parts,
It is attached to the moving bed 13 and frame 14 via these. Further, a piston 15 is provided at the center of the lower surface of the movable bed 13. The spacer block 11.11 is mounted on the moving bed 1 with a plurality of clamps Z6.
It is fixed to 3 or 7 frames 14.

To mold the mold package 7 with the above gold M1.2, place the piston 15 on the mold matching surface of gold waves 1 + 2.
The heater blocks 9 and 9 are heated under pressure, but the molds 1 and 2 and the heater blocks 9 and 9 have different company costs, and since they are firmly connected, the bimetallic effect prevents curvature. However, the mating surface of the cavity block 4.4, which was flat as shown in FIG. 3(a), is deformed into a convex shape as shown in FIG.
．． There was a drawback that gaps were formed between the four sides, resulting in cracks on all sides.

Furthermore, even if the two members are made of the same material, the bimetal effect occurs between two members that do not maintain uniform heat. As a countermeasure against this, conventionally, the mating surfaces of the cavity blocks 4 and 40 are finished in advance into a concave shape as shown in FIG. 3(C), and then thermally deformed after heating to become flat as shown in FIG. 3(d). However, it was actually extremely difficult to completely compensate for the bimetallic effect mentioned above.In other words, the gap between the mating surfaces of the cavity block 4゜4 in question was on the order of several micrometers. Determining the shape of the cavity block 4.4 before thermal deformation with respect to minute star behavior requires a rigorous approach from both theory and experimentation. It is difficult to understand. Further, even if the shape of the cavity block 4.4 before thermal deformation can be grasped, processing requires not only a high degree of sheathing but also strict temperature control. In addition, when applying pressure to the mating surfaces of the cavity blocks 4 and 40, when pressing with one piston 15 on the lower center surface of the moving bed 13, the moving W1 bed 13 is deformed as shown in FIG. 4, and the cavity blocks 4.4 Since it is not possible to suppress the curvature of the mold mating surface, it is necessary to increase the number of pistons 15 or increase the thickness of the transfer bed I3 to increase the rigidity, which increases the size and cost of the device. This is undesirable as it invites close-ups.

[Purpose of the invention]

This invention was made in consideration of the above circumstances, and its purpose is to provide a mold package forming apparatus that prevents deformation of the mold due to the bimetal effect and does not cause burrs. It is.

[Summary of the invention]

In this invention, a cavity block for forming a cavity is provided on the mold mating surface of a one-hole mold, and a heater is provided to surround this cavity block to directly heat the mold. A highly rigid support block is slidably provided on the back of the mold via a heat insulating material, thereby preventing the mold from bending due to the bimetallic effect.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described with reference to FIG. 5, in which the same parts in FIGS. 1 and 2 are denoted by the same reference numerals. In the figure, 1 is a movable mold, and 2 is a fixed mold. These molds 1 and 2 are provided with a heater 8 surrounding a cavity block 4.4, and the mold zIz and the cavity blocks 4, 4 are It is designed to heat up. On the back side of the mold 1.2, a support block 17.1 which is sufficiently thick and has a large PIlj property is installed via a heat insulating material 10.10.
7 is slidably provided.

This support block 17 * l 7 has a plurality of clamps 1
6 are fixed to the movable bed 13 and frame 14, respectively. A piston 15 is provided on the lower surface of the center of the movable bed 13.

In the molding apparatus configured as described above, the mold 1.
When the movable metal mz is pressed against the fixed metal m2 by the piston 15 while the heaters 8, 8 of No. 2 are energized and heated, a support block 17 with a sufficiently thick thickness and large rigidity is placed in the upper part of the movable bed I3. Since it is firmly attached with a plurality of clamps 16, the movable bed 13 is prevented from curving into a convex shape as shown in FIG.

Curving of the molds 1 and 2 is prevented. Therefore mold 1.2
The cavity blocks 4.degree. 4 provided in the cavity blocks 4.degree.

Further, since the support block 17° I7 is slidably provided on the back surface of the molds 1 and 2, the bimetal effect is suppressed.

〔Effect of the invention〕

As explained above, in this invention, each of the pair of molds is provided with a peak, and a support block having high rigidity is slidably provided on the back of the mold, so that the molds can be fixed due to the bimetallic effect. 4 bends are prevented, and the difficult processing work of finishing the mating surfaces of the molds in advance into a concave surface is no longer necessary, improving productivity. Furthermore, temperature control during molding becomes easier. Furthermore, the force components of the molding apparatus are limited to the mold, the support block, and the bed, eliminating the need for a heater block, spacer block, and base, thereby making it possible to downsize the apparatus.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view showing a cavity provided on the mating surfaces of a general metal, Figure 2 is a diagram showing a conventional molding device, and Figure 3 is a side view explaining the behavior of a cavity block due to thermal deformation. Figures 4 and 4 are side views showing a curved moving bed compressed by pistons, and Figure 5 is a perspective view showing an embodiment of the present invention. 1.2... Gold N, a*:t... Cavity, 4.4
...Cavity block, 5... Half-body element, 6.
...Epoxy tree 1""ti (thermosetting resin), 8...
・Heater ・10...Insulation material, 13.14...Bed, 17...Support block. Applicant's Agent 9F Takehiko Suzue 1 Figure 2 Figure 3 Figure 4 (d)-44 Figure 5

Claims (1)

[Claims] A semiconductor element and a thermosetting resin for molding the semiconductor element are filled into a cavity formed by a cavity block provided on the mating surfaces of a pair of molds, and the above-mentioned amount of gold is heated and molded under pressure, A heater is provided surrounding the cavity block of the mold, a support block with great rigidity is provided on the back of the mold through a heat insulating material and is movable, and the support block is clamped to the support block. A mold package forming device comprising: a bed;