JPH0222259Y2 - - Google Patents
Info
- Publication number
- JPH0222259Y2 JPH0222259Y2 JP12697781U JP12697781U JPH0222259Y2 JP H0222259 Y2 JPH0222259 Y2 JP H0222259Y2 JP 12697781 U JP12697781 U JP 12697781U JP 12697781 U JP12697781 U JP 12697781U JP H0222259 Y2 JPH0222259 Y2 JP H0222259Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sealing material
- upper mold
- lower mold
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003566 sealing material Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910000734 martensite Inorganic materials 0.000 description 3
- 239000012778 molding material Substances 0.000 description 2
- 229910018507 Al—Ni Inorganic materials 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Description
【考案の詳細な説明】
本考案はプラスチツクまたは金属などの成形の
為の金型に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold for molding plastic or metal.
従来、第1図に示すような成形部を得る為に例
えば第2図に示す金型が用いられる。1は成形品
の外部を形造る下金型、2は成形品の内部を形造
る上金型であり、上金型2と下金型1の間に成形
材料3を注入し(同図a)、上金型2を上方より
下金型1に押圧すれば(同図b)成形品を得る。
しかしながら、この種のものでは、上金型2と下
金型1の当接部4に僅かな隙間があれば得られる
成形品にバリが発生する。従つて金型接触表面を
平滑にし、上金型2と下金型1の位置合わせを正
確にすることが重要であり、そしてその為の作業
上の負坦は大きかつた。 Conventionally, in order to obtain a molded part as shown in FIG. 1, a mold shown in FIG. 2, for example, is used. 1 is a lower mold that forms the outside of the molded product, and 2 is an upper mold that forms the inside of the molded product.The molding material 3 is injected between the upper mold 2 and the lower mold 1 (a in the same figure). ), a molded product is obtained by pressing the upper mold 2 onto the lower mold 1 from above (see figure b).
However, in this type of mold, if there is a slight gap between the contact portion 4 of the upper mold 2 and the lower mold 1, burrs will occur in the molded product obtained. Therefore, it is important to make the mold contact surface smooth and to accurately align the upper mold 2 and the lower mold 1, and this requires a large amount of work.
本考案は以上のような従来の欠点を除去するも
のであり、簡単な構造でありながらバリの発生を
防止し、作業上の負担を軽減せしめる成形金型を
提供することを目的とするものである。 The purpose of this invention is to eliminate the above-mentioned conventional drawbacks, and to provide a molding die that has a simple structure, prevents the occurrence of burrs, and reduces the burden on the work. be.
以下、本考案の一実施例を図面を用いて説明す
る。第3図は本考案の成形金型の一実施例の側面
断面図である。第2図と異なる点は上金型2と下
金型1の当接部4に形状記憶合金からなるシール
材5を介在させることである。形状記憶合金には
Ti−Ni合金、Cu−Zu−Al−Ni合金等があるが、
これらの合金はマルテンサイト相から母相への変
態終了温度(Af点)以上の加熱状態では、応力
付与によつて大歪変形させても応力除荷すれば元
の形状に戻る所謂擬弾性効果を有する。第4図は
形状記憶合金の擬弾性効果を示す応力−歪特性グ
ラフ図である。 An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a side sectional view of one embodiment of the molding die of the present invention. The difference from FIG. 2 is that a sealing material 5 made of a shape memory alloy is interposed between the contact portion 4 of the upper mold 2 and the lower mold 1. For shape memory alloys
There are Ti-Ni alloy, Cu-Zu-Al-Ni alloy, etc.
When these alloys are heated above the transformation end temperature (Af point) from the martensitic phase to the parent phase, they exhibit a so-called pseudoelastic effect, which allows them to return to their original shape when the stress is released, even if they undergo large strain deformations due to the application of stress. has. FIG. 4 is a graph of stress-strain characteristics showing the pseudoelastic effect of shape memory alloys.
第3図bにおいて上金型2を下金型1に対して
プレスした時、シール材5は高温(Af点以上)・
高圧状態になる。その時シール材は変形され応力
誘起マルテンサイト相が誘起される。そして応力
誘起マルテンサイト相の状態で形状記憶合金は非
常に柔かくなるので、上金型2と下金型1の当接
部における表面の凹凸に応じて変形し隙間を無く
すものである。以上の成形金型により成形すれば
バリができず品質の良い製品ができる。成形加工
後、上金型2と下金型1を離間すればシール材5
への応力付与は除去される為に擬弾性効果により
元のシール材5の形状に戻る。こうしてシール材
5は成形金型の圧力付与の度に変形と回復を繰り
返すので、取り換える必要もなく反復使用可能な
ものである。 When the upper mold 2 is pressed against the lower mold 1 in Fig. 3b, the sealing material 5 is at a high temperature (above point Af).
Becomes under high pressure. At that time, the sealing material is deformed and a stress-induced martensitic phase is induced. Since the shape memory alloy becomes extremely soft in the state of stress-induced martensitic phase, it deforms according to the surface irregularities at the abutting portion of the upper mold 2 and the lower mold 1, thereby eliminating the gap. When molded using the above-mentioned molding die, a high-quality product can be produced without burrs. After the molding process, if the upper mold 2 and lower mold 1 are separated, the sealing material 5
Since the stress applied to the sealing material 5 is removed, the sealing material 5 returns to its original shape due to the pseudoelastic effect. In this way, the sealing material 5 repeatedly deforms and recovers each time pressure is applied by the molding die, so that it can be used repeatedly without needing to be replaced.
以上説明したように本考案によれば簡単な構造
でバリを防止できるという作業上便利な成形金型
を得るものである。 As explained above, according to the present invention, it is possible to obtain a molding die that is convenient for work and can prevent burrs with a simple structure.
第1図は成形品の外観斜視図、第2図は従来の
金型の側面断面図、第3図本考案の金型の一実施
例の側面断面図、第4図は形状記憶合金の応力一
歪特性グラフ図を示す。
図中、1:下金型、2:上金型、3:成形材
料、4:当接部、5:シール材。
Figure 1 is an external perspective view of a molded product, Figure 2 is a side sectional view of a conventional mold, Figure 3 is a side sectional view of an embodiment of the mold of the present invention, and Figure 4 is stress in shape memory alloy. A distortion characteristic graph diagram is shown. In the figure, 1: lower mold, 2: upper mold, 3: molding material, 4: contact part, 5: sealing material.
Claims (1)
るシール材を介在させたことを特徴とする成形金
型。 A molding die characterized in that a sealing material made of a shape memory alloy is interposed at the abutting portion of an upper die and a lower die.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12697781U JPS5831111U (en) | 1981-08-26 | 1981-08-26 | molding mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12697781U JPS5831111U (en) | 1981-08-26 | 1981-08-26 | molding mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5831111U JPS5831111U (en) | 1983-03-01 |
JPH0222259Y2 true JPH0222259Y2 (en) | 1990-06-15 |
Family
ID=29920731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12697781U Granted JPS5831111U (en) | 1981-08-26 | 1981-08-26 | molding mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5831111U (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0725146B2 (en) * | 1986-09-12 | 1995-03-22 | 住友電気工業株式会社 | Fiber-reinforced plastics, its molding die, and manufacturing method using the same |
US20140190233A1 (en) * | 2011-08-29 | 2014-07-10 | Toyota Jidosha Kabushiki Kaisha | Metal mold for hot pressing |
-
1981
- 1981-08-26 JP JP12697781U patent/JPS5831111U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5831111U (en) | 1983-03-01 |
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