KR20160013202A - Resin molding device and resin molding method - Google Patents

Abstract

And to provide a technique capable of improving the quality of a molded article. The lower mold 32 includes a lower cavity piece 34 constituting a bottom portion of the cavity 33, a lower clamper 35 constituting a side portion of the cavity 33, a resin R A film loader 57 capable of holding and carrying a film F on which the film F mounted on the lower mold cavity 34 is placed and a film F arranged to cover the end face of the lower cavity film 34 and the end face of the lower clamper 35, (67). The lower mold cavity piece 34 moves relative to the lower mold clamper 35. The film loader 57 is fixed to the lower mold 32 in which the end face of the lower mold cavity piece 34 and the end face of the lower mold clamper 35 are held horizontally and the resin R is placed on the lower mold cavity piece 34 The adsorption section 67 follows the inner surface of the cavity 33 to adsorb and hold the film F and supply the resin R to the cavity 33. [

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a resin mold apparatus,

TECHNICAL FIELD [0001] The present invention relates to a technology effective for applying to a resin mold apparatus and a resin mold method.

For example, in molding a wafer such as a wafer level package (WLP), a plurality of chip parts mounted on a large work (for example, a substrate) are bonded to a lower mold through a substrate and a bonding wire (Which is electrically connected), and a mold is used for forming a cavity in the upper mold (a cavity in the clamping of the work). However, when the resin is supplied to the workpiece by using such a mold and compression molding is performed, the resin placed on the center of the workpiece flows outward. Therefore, the problem of poor quality of the molded article due to the incorporation of air, wire sweep, .

On the other hand, by using a mold mold constituting the cavity recess (lower mold cavity) in the lower mold, resin is supplied to the cavity recess, and chip parts and bonding wires of the work held by the upper mold are melted It can be dipped into a resin mold. The resin mold in such a lower mold cavity can reduce quality defects in molded articles such as vauxhall or wire sweep. A mold for forming such a lower mold cavity is described in, for example, Japanese Patent Application Laid-Open No. 2004-148621 (Patent Document 1).

In this patent document 1, the release film is deformed in conformity with the shape of the cavity and the resin is supplied to the preform (bottom) corresponding to the bottom of the cavity, Is introduced into the inside of the mold and placed therein.

Japanese Patent Application Laid-Open No. 2004-148621

As the release film as described in Patent Document 1, for example, a film having a certain flexibility, stretchability, and heat resistance is used. Such a release film may be heated to a certain temperature, and may be thermally shrunk so as to shrink toward its center, or may be shrunk to become non-uniform wrinkles. In addition, when the release film is deformed to conform to the shape of the cavity, for example, it can be said that distortion is gathered in a small amount.

For this reason, when the release film is placed in a mold mold that has been heated in advance, for example, in a deformed state as in the shape of the cavity, it is not possible to maintain the shape of the release film in a desired shape. For example, wrinkles may occur on the release film, wrinkles may overlap, or gaps may occur. If the release film is wrinkled or overlapped in this way, there is a problem that the release film is transferred to the outer surface of the molded article or the resin is leaked from the overlapped portion.

It is an object of the present invention to provide a technique capable of improving the quality of a molded article. These and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

Outline of representative ones of inventions disclosed in the present application will be briefly described as follows.

A resin mold apparatus according to an embodiment of the present invention is a resin mold apparatus in which a lower mold on which an upper mold and a cavity are formed is closed and a work is resin molded by the resin filled in the cavity, A lower mold cavity constituting a bottom portion of the cavity, a lower mold clamper constituting a side portion of the cavity, a loader capable of holding and carrying a film on which the resin is mounted, And a suction part for sucking the film placed (or set) so as to cover the end face of the lower clamper, wherein the lower cavity piece is configured to be movable relative to the lower clamper, The end face of the lower mold cavity piece and the end face of the lower mold clamper are held horizontally (also referred to as " The film is disposed on the lower mold so that the resin is positioned on the lower cavity piece, and the adsorption section follows the inner surface of the cavity recess to adsorb and hold the film, and the resin is supplied to the cavity recess .

A resin mold apparatus according to another embodiment of the present invention is a resin mold apparatus in which a first mold and a second mold in which a cavity is formed are closed and a work is resin molded by resin filled in the cavity , The second mold comprises a cavity piece constituting a bottom portion of the cavity recess, a clamper constituting a side portion of the cavity recess, a movable portion relatively moving the cavity piece with respect to the clamper, And a suction part for picking up a film disposed so as to cover an end face of the clamper. The film is transported in a flat state, and the end face of the cavity piece and the end face of the clamper are equal in height (also referred to as a horizontal face or a face face). And a loader for placing the film in a flat state on the end face of the cavity piece and the end face of the clamper .

A resin mold method according to an embodiment of the present invention is a resin mold method in which a mold having a top mold and a cavity recess is closed by using a resin mold apparatus and a resin molded by resin filling the cavity A mold method, wherein the lower mold comprises a lower cavity piece constituting a bottom of the cavity, a lower clamper constituting a side of the cavity, a loader capable of holding and carrying the film on which the resin is mounted, And a suction portion for sucking the film disposed so as to cover the end face of the lower clamper and the end face of the lower clamper, wherein (a) the lower mold having the end face of the lower cavity piece and the end face of the lower clamper held horizontally, Placing the film so that the resin is located on the lower cavity piece; While the film is being sucked by the lower clamper, the lower cavity piece is relatively moved with respect to the lower clamper to form the cavity, thereby adsorbing and holding the film while following the inner surface of the cavity, And a step of supplying the molten metal to the concave portion.

According to the present invention, it is possible to deform the film following the shape of the cavity after arranging the film in the flat state, for example, to prevent the occurrence of wrinkles of the film or to prevent the film from overlapping. Therefore, it is possible to prevent the appearance defect of the molded article from being formed, or to prevent the leakage of the resin from the overlapping portions, thereby improving the quality of the molded article. In addition, by forming the cavity concave portion in the lower mold, by immersing, for example, a chip component (for example, a semiconductor chip or a chip condenser) or a bonding wire into the resin melted in the cavity, It is possible to reduce the defective quality of the product.

In the resin mold apparatus according to an embodiment of the present invention, the loader may include: a holding surface for holding the film; and a holding surface for holding the film from the holding surface And a hand portion connected to the holding surface around the concave portion and having an air path for sucking the film.

According to this, the state (shape and amount) of the resin mounted on the film can be maintained and the resin can be supplied to the cavity. Further, the film can be adsorbed and held so as not to bend due to the weight of the resin in the concave portion mounted on the film.

In the resin mold apparatus according to an embodiment of the present invention, the loader may include a roll-shaped shutter portion capable of opening and closing the holding surface, and the film may be supported by the shutter portion in a closed state of the shutter portion And the film is disposed on the lower mold in the opened state of the shutter portion.

According to this, the film can be held flat by the shutter so that the film does not bend due to the weight of the resin in the concave portion mounted on the film. When the film is placed on the lower mold, the shutter can be wound to save space.

In the resin mold apparatus according to the embodiment of the present invention, it is preferable that the loader includes a heating section and a cooling section.

This makes it easy to assemble or cool the film or the resin mounted thereon.

In the resin mold apparatus according to an embodiment of the present invention, an upper portion of the lower cavity piece is detachably installed, an upper portion of the lower clamper is detachably installed, and an upper portion of the lower cavity piece, Wherein the upper portion of the lower mold clamp piece is connected to the lower mold clamp piece by the connecting member and the end portion of the lower mold cavity piece and the lower mold clamp piece are connected to each other, It is preferable to transport the film disposed so as to cover the cross section of the upper portion of the film.

According to this, the film and the resin mounted thereon can be placed in a mold in a stable state.

In the resin mold apparatus according to the embodiment of the present invention, the ring-shaped upper and lower plates are provided, and the lower plate has, at its peripheral edge, A step-shaped part extending concavely in the circumferential direction is formed, and the film is sandwiched between the upper plate and the lower plate, and the inner diameter of the upper plate Wherein the upper plate is engaged with the upper plate to constitute a film plate portion, the lower clamper is formed with a stepped portion extending in a circumferential direction concave from the end face at a peripheral end thereof, It is preferable that the film plate portion is fitted to correspond to the neck portion.

According to this, the film can be held flat with a simple structure, and can be arranged in the lower mold in a state of being as it is.

In the resin mold apparatus according to the embodiment of the present invention, the upper portion of the lower cavity piece is detachably provided, and in a state of being open, the end face of the lower cavity piece and the end face of the lower clamper It is preferable that an upper portion of the lower cavity piece is floated and supported.

According to this, for example, it is not necessary to push the lower clamper by the carry section to lower the end face of the lower cavity piece and the end face of the lower clamper, thereby simplifying the operation and construction of the carry section. Further, when the film is arranged on the lower mold, since the upper portion of the lower cavity piece is in a floating state, heat shrinkage of the film can be prevented, overheating of the resin mounted on the film can be prevented, .

In the resin mold apparatus according to the embodiment of the present invention, the lower clamper is provided with a plurality of fins floatingly supported so as to protrude from the end face of the lower clamper,

It is preferable that the plurality of fins protrude from the end surface of the lower clamper to support the work, and are accommodated in the lower clamper when the work is clamped.

According to this, it is possible to prevent the work held by the top mold from falling down before clamping.

Briefly explaining the effects obtained by the representative ones of the inventions disclosed in the present application can improve the quality of a molded article.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an overall structural view showing a resin mold apparatus according to an embodiment of the present invention in a planar layout. FIG.
Fig. 2 is a view for explaining the operation of the resin supply unit for supplying the granular type resin. Fig.
3 is a schematic cross-sectional view of a press section in a resin mold step in the first embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 3;
Fig. 5 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 4;
Fig. 6 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 5;
Fig. 7 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 6;
Fig. 8 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 7;
Fig. 9 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 8;
10 is a schematic cross-sectional view of a press section in the resin mold step in the second embodiment of the present invention.
11 is a schematic cross-sectional view of the press part in the resin mold step following FIG.
Fig. 12 is a schematic cross-sectional view of the press section in the resin mold step following Fig.
13 is a schematic cross-sectional view of the press section in the resin mold step following FIG.
Fig. 14 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 13;
Fig. 15 is a schematic cross-sectional view of a press section in the resin mold step in the third embodiment of the present invention. Fig.
Fig. 16 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 15;
Fig. 17 is a schematic cross-sectional view of the press section in the resin mold process subsequent to Fig. 16;
Fig. 18 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 17;
Fig. 19 is a schematic cross-sectional view of the press portion in the resin mold step following Fig. 18;
20 is a schematic cross-sectional view of a press section in a resin mold step in the fourth embodiment of the present invention.
21 is an exploded sectional view of the film plate portion shown in Fig.
Fig. 22 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 20;
Fig. 23 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 22;
Fig. 24 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 23. Fig.
25 is a schematic cross-sectional view of a press section in the resin mold step in the fifth embodiment of the present invention.
26 is a schematic cross-sectional view of the press section in the resin mold step following FIG. 25. FIG.
27 is a schematic cross-sectional view of a press section in the resin mold step in the sixth embodiment of the present invention.
28 is a schematic cross-sectional view of a press section in a resin mold process in another configuration example of the present invention.
Fig. 29 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 28;
30 is a schematic cross-sectional view of a press section in a resin mold process in another constitutional example of the present invention.
31 is a schematic cross-sectional view of a press section in the resin mold step following FIG. 30. FIG.
32 is a schematic cross-sectional view of the press section in the resin mold step following FIG. 31;
33 is a schematic cross-sectional view of a press section in a resin mold step in the seventh embodiment of the present invention.
34 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 33. Fig.
Fig. 35 is a schematic cross-sectional view of the press section in the resin mold step following Fig.
Fig. 36 is a schematic cross-sectional view of the press section in the resin mold step following Fig. 35;
37 is a front explanatory view of a mold-releasing state of a resin mold apparatus according to the eighth embodiment of the present invention.
Fig. 38 is a plan view of the movable platen of Fig. 37;
Figs. 39A and 39B are cross-sectional explanatory diagrams of a mold die during the mold closing operation subsequent to Fig. 37. Fig.
40A to 40C are cross-sectional explanatory views showing an example of a mold die and a mold closing operation.
Figs. 41A to 41C are cross-sectional explanatory views showing another example of the mold die and a mold closing operation.

In the following embodiments of the present invention, a plurality of sections and the like are described as necessary when they are required. In principle, they are not related to each other, and one of them is a modification of a part or all of the other And so on. Therefore, in the entire drawings, members having the same functions are denoted by the same reference numerals, and repetitive description thereof may be omitted. In addition, repeated description of the same effect obtained from the same configuration may be omitted.

Furthermore, the number (including the number, the numerical value, the amount, the range, etc.) of the constituent elements is not limited to the specific number except for the case where it is specifically stated, The number may be more or less than a specific number. When reference is made to the shape of a component or the like, it is to be understood that the shape or the like of the component is substantially similar to or similar to the shape of the component, except when it is specifically stated or when it is considered that the component is not clearly apparent in principle.

(First Embodiment)

First, a resin mold apparatus 100 according to the present embodiment will be described with reference to Fig. BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is an overall structural view showing a resin mold apparatus 100 in a planar layout. FIG. The resin mold apparatus 100 includes not only a structure for performing a resin mold but also a structure for inspecting a work (molded product) after the resin mold and then storing a good product by heat curing (post cure) have.

The resin mold apparatus 100 is a processing section for performing various processing steps and includes a work supply section 110, a resin supply section 120, a press section 130, a work inspection / cooling section 140, a cure section 150 A curing furnace), and a work storage portion 160. [ The resin mold apparatus 100 is provided with a control section 170 for controlling each processing step. Each of the processing sections may be constituted by at least a single unit. In the present embodiment, the resin supply section 120 and the press section 130 are each composed of two units (plural units). As described above, by configuring a plurality of apparatuses that take longer processing time than other processing units, the operation rate of the entire resin mold apparatus 100 can be improved.

The resin mold apparatus 100 also includes a robot mechanism section 180 having a transfer robot for transferring a work or a resin between processing sections. The carrying robot is, for example, a robot capable of rotating and linearly moving between processing sections and having a hand at the end of each joint. In the resin mold apparatus 100, the respective processing sections are arranged around the robot mechanism section 180 (carrying robot). Therefore, the moving distance of the work or resin between the respective processing sections (indicating the movement of the work or resin by the dashed line in Fig. 1) is shortened, and efficient work transfer can be performed. Instead of the robot mechanism unit 180, a workpiece or a resin may be transported between the processing units by a transport mechanism other than the transport robot configured by a linear motion mechanism such as an air cylinder or a linear motor.

The work supply unit 110 (see FIG. 1) is a processing unit for supplying a work to the press unit 130 where the resin mold is performed. The workpiece supply unit 110 is provided with a magazine (not shown) capable of storing a plurality of workpieces (molded products) before molding. The workpiece supplied from the magazine is temporarily mounted on a workpiece mounting portion (not shown) of the robot mechanism portion 180 by the carrying robot of the robot mechanical portion 180 so that the loader 190 provided in the press portion 130, (Conveying portion) to the press portion 130. [

The resin supply unit 120 (see Fig. 1) is a processing unit for supplying resin to the press unit 130 where the resin mold is performed. Here, the resin supply unit 120 will be described with reference to Fig. 2 is a view for explaining the operation of the resin supply unit 120 for supplying the granular resin R (hereinafter, referred to as granular resin).

2, the resin supply unit 120 includes a resin reservoir 121 capable of reserving the granular resin R, a plurality of small resin reservoirs 122, a resin supply region (supply target) And a plurality of troughs 123 for supplying the granular resin R to the granules. The pair of resin reservoirs 122 and the trough 123 are communicated with each other and are movable by an XY driving mechanism (not shown). The resin reservoir 121 is fixed and installed to store a large amount of the granular resin R and supplies the granular resin R with a small fraction to the smaller resin reservoir 122. Then, the granular resin R is fed from the resin reservoir 122 to the trough 123 by an electronic feeder (not shown) and fed into the resin supply region in a predetermined shape (for example, a flat shape) do.

At least one pair of the resin reservoir 122 and the trough 123 may be provided, but a plurality of pairs (three pairs in FIG. 2) are provided to shorten the delivery time of the granular resin R into the resin supply region can do. The three pairs of resin storage portions 122 and troughs 123 are connected by a connecting member 124. With this connection, even if an electronic feeder is not provided for each pair, it is possible to supply the same amount of resin to the resin supplying region at the same time by a single electronic feeder so as to have a desired shape. Thus, by providing a plurality of resin supply structures, it is possible to quickly supply an accurate amount of resin. Similarly, a plurality of dispensers for supplying the liquid resin may be provided. Even in this case, the correct amount of the liquid resin can be quickly supplied.

The supply target in the resin supply unit 120 is the release film F. [ Flexible, stretchable and heat-resistant films such as FEP film, PET film, fluorine-impregnated glass cloth, polyvinylidene chloride, PTFE, and ETFE are used for the release film (F). The release film F to be a resin supply object is drawn out from the roll state by one of the gripping members 126 on the support table 125 to be gripped by the gripping members 126, (For example, an elongated shape) by cutting with a cutting member 127 (for example, a cutter) at a film width of one molding portion in a state of being gripped by a cutting member 127

The supply of the resin to the release film F (resin supply region) is performed by first supplying the granular resin R while each of the troughs 123 move in the extension direction (X direction) of the first row supply region, (Y direction) after the supply of the resin to the rectangular shaped supply region of the array is completed. Next, each of the troughs 123 is fed in the extending direction (X direction) of the second row of supply regions, and the granular resin R is supplied. After the supply of one column of the resin is completed, . Subsequently, each of the troughs 123 is fed in the extending direction (X direction) of the third row of the supply regions to supply the granular resin R, the supply of one column of resin is terminated, and the resin supply Lt; / RTI >

With such a resin supply unit 120, the granular resin R can be supplied (mounted) on the release film F at a predetermined area (area) and a predetermined thickness (height) at a predetermined time. The granular resin R supplied onto the release film F is conveyed to the loader 190 by the robot mechanism unit 180 together with the release film F and thereafter, (130). Therefore, the release film (F) is also a carrier film for transporting the resin (R).

The press part 130 (see Fig. 1) is a processing part for molding a workpiece with a resin mold and molding a mold resin part (molded part). This processing step will be described later in detail. The molded workpiece is temporarily mounted on a workpiece mounting portion (not shown) of the robot mechanism portion 180 by the loader 190 and handed over to the carrying robot of the robot mechanism portion 180.

The work inspection unit / cooling unit 140 (see FIG. 1) is a processing unit for inspecting the state of a work (molded product) after molding, and is a processing unit for cooling the heated work. The cooling section can be provided separately from the work inspection section, but can be made compact by disposing the cooling section in a blank area of the work inspection section.

Examples of inspection items of the workpiece inspection section include, for example, measurement of the thickness of the workpiece and inspection of the workpiece. These inspection results are transmitted to the control unit 170 and processed. For example, it is checked whether or not there is a defective molding such as unfilled by taking an image of the molded product at a time or by observing the appearance. In the case where the molding is good or bad, the type of defect and the sensed image are stored in the storage unit of the control unit 170 as the operation information. When abnormality (such as uncharging exceeding the assumption) is detected, the operation of the entire apparatus is stopped and the maintenance is performed, whereby the defective products can be prevented from being continuously produced. When the inspection is completed, the workpiece is transferred to the cure unit 150 by the transfer robot from the workpiece transfer position of the workpiece inspection unit / cooling unit 140.

The curing unit 150 (see Fig. 1) is a processing unit for thermally curing (post-curing) the mold resin portion of the work. The cure unit 150 is closed by an opening / closing door (not shown) with respect to the outside, and the inside thereof is heated to a predetermined temperature. When the work held by the transfer robot approaches the cure furnace 150, the opening / closing door is opened. When the work is disposed inside and the transfer robot is avoided, the opening / closing door is closed and the object is heated and cured for a predetermined time. Thereafter, the work carried out by the carrier robot from the cure unit 150 is cooled by the work inspection unit / cooling unit 140, and then returned to the work storage unit 160.

The work storage portion 160 (see Fig. 1) is a processing portion for storing a work as a final step of the resin mold apparatus 100. As shown in Fig. The workpiece storage section 160 has the same magazine as the workpiece supply section 110, and a workpiece (molded article) is accommodated in the magazine by the transport robot of the robot mechanism section 180.

Next, the press section 130 of the resin mold apparatus 100 according to the present embodiment will be described with reference to Fig. 3 is a schematic cross-sectional view of the press section 130 in this embodiment. 3 also shows a workpiece W in the state of the workpiece. The workpiece W is obtained by mounting a chip component 11 (for example, a semiconductor chip) on a substrate 10 (for example, a wiring board) by a die bond, (10) and the chip component (11) are electrically connected.

The press portion 130 includes a mold metal mold 30 (upper mold 31 and lower mold 32 forming a pair). The upper mold 31 may be a movable type and the lower mold 32 may be a fixed type and the upper mold 31 and the lower mold 32 may be fixed. ) May be a movable type.

In the mold 30, the workpiece W is held in the upper mold 31 and the cavity 31 is formed in the lower mold 32 (constituting the cavity C at the time of work clamping). The mold metal mold 30 includes a lower mold cavity piece 34 constituting a bottom portion of the cavity recess 33 and a lower mold clamper 35 constituting a side portion (wall portion) of the cavity recess portion 33 surrounding the cavity piece 34 . In the mold metal mold 30, the lower mold cavity piece 34 relatively moves with respect to the lower mold clamper 35, so that the depth (height) of the cavity cavity 33 is changed and the volume of the cavity C is changed.

The configuration of the upper die 31 will be described in detail. The upper die 31 is provided with a upper die base 36, an upper die insert 37 and an upper die clamper 40. The upper mold base 36 is fixed to the lower face of the upper mold base 36 with a heater (not shown) so that the workpiece W can be heated, and the upper mold clamper 40 is movable vertically It is assembled. The upper clamper 40 is constituted by a single plate-like metal mold, and a through hole 41 is formed in the plate clamp. The upper die insert 37 is inserted and arranged in the through hole 41 of the upper die clamper 40. That is, the upper insert 37 is surrounded by the upper clamper 40.

The upper clamper 40 is assembled so as to be movable up and down via an elastic member 42 (for example, a spring) constituting a movable portion of the upper die base 36 and is suspended . Therefore, the relationship between the fixed upper type insert 37 and the movable upper type clamper 40 with respect to the upper die base 36 is such that the upper die insert 37 is elastically deformed by the expansion and contraction of the upper type clamper 40 ). ≪ / RTI >

The lower face (lower end face) of the upper die insert 37 is engaged with the lower die of the upper die clamper 40 in a state in which the elastic member 42 is not pressurized (Upper side) of the lower surface (upper side) of the lower surface In other words, the lower surface of the upper type clamper 40 is located at a lower position (lower position) than the lower surface (lower side surface) of the upper die insert 37. As will be described later, by forming the closed space (chamber) with the upper mold clamper 40 and the lower mold clamper 35 at the time of mold closing by placing such a high and low mold, the resin mold can be performed under reduced pressure. The workpiece W can be clamped at a uniform height position regardless of the thickness of the workpiece W by providing the upper insert 37 relatively movably with respect to the upper clamper 40. [

The upper die 31 is provided with a seal member 43 (for example, O-ring) provided between the outer circumferential surface of the upper insert 37 and the inner circumferential surface of the through hole 41 of the upper clamper 40 . The seal member 43 is provided between the outer circumferential surface of the upper insert 37 and the inner circumferential surface of the through hole 41 of the upper clamper 40 so as to reduce the pressure in the cavity C formed during the work clamping. And the gap is sealed so as to be the air path 41A (see Fig. 7).

The upper clamper 40 is formed with an air path 44 communicating with the outside of the mold from the inner circumferential surface of the through hole 41 so as to communicate with the air path 41A. The air path 44 is in communication with a depressurizing portion 45 (for example, a pump) outside the mold. The cavity C is depressurized by the depressurization portion 45 via the air path 41A and the air path 44 which will be described later.

The upper mold 31 is provided with a work holding portion for holding the work W (see Fig. 27). The work holding portion is provided with an air path 90 communicating with an end surface of the upper insert 37 and a pressure sensitive portion 91 communicating with the air path 90. The lower surface of the upper insert 37, So that the back surface of the substrate 10 of the workpiece W is joined. Alternatively, the work holding portion may be a claw portion provided on the end face of the upper die insert 37 or a case where the work W is held by the electrostatic chuck.

The configuration of the lower mold 32 will be described in detail. The lower mold 32, which is a movable type, is formed by a known clamping mechanism for lifting and lowering the lower movable platen through a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (an electric motor) Thereby opening and closing. In this case, the lowering motion of the lower mold 32 can arbitrarily set the moving speed, the pressing force, and the like.

The lower mold 32 includes a lower mold base 46, a lower cavity piece 34 and a lower clamper 35. A lower mold cavity piece 34 is fixedly mounted on the upper surface of the lower mold base 46 and the lower mold clamper 35 is assembled so as to be movable in the vertical direction. The lower clamper 35 is constituted by a single plate-like metal mold, and a through hole 47 is formed in the plate-like metal mold. A lower cavity piece 34 is inserted and arranged in the through hole 47 of the lower clamper 35. That is, the lower cavity piece 34 is surrounded by the lower clamper 35. In addition, the lower mold cavity piece 34 is provided with a heater (not shown) so that the resin R can be heated as will be described later.

The lower clamper 35 is assembled to the lower die base 46 so as to be movable up and down via an elastic member 50 (for example, a spring) constituting a movable portion, and is floated and supported. The lower mold cavity piece 34 fixed to the lower mold base 46 and the lower mold clamper 35 movable are arranged such that the lower cavity piece 34 is elastically deformed by the elastic member 50 35, respectively.

The upper surface (upper end surface) of the lower cavity piece 34 is engaged with the lower clamper 35 (the upper end surface) in a state in which the elastic member 50 is not pressurized (Lower side) than the upper surface (upper side surface) The depth of the cavity 33 (the volume of the cavity C) can be changed by varying the height of the lower mold cavity piece 34 relative to the lower mold clamper 35, .

The lower mold 32 has a seal member 51 (for example, an O-ring) provided between the outer circumferential surface of the lower cavity piece 34 and the inner circumferential surface of the through hole 47 of the lower clamper 35 Respectively. The seal member 51 is disposed on the inner circumferential surface of the through hole 47 of the lower mold cavity piece 34 and the outer circumferential surface of the lower mold cavity piece 34 to attract the release film F disposed on the parting surface of the lower mold 32. [ (See Fig. 5) so that the air space 47A is formed. The upper surface of the lower mold cavity piece 34 and the inner circumferential surface of the through hole 47 of the lower mold clamper 35 constitute the cavity recess 33 so that the air path 47A is formed at the bottom of the cavity recess 33, And communicates with the corners of the body.

The lower clamper 35 is formed with an air path 52 communicating with the outside of the mold from the inner circumferential surface of the through hole 47 so as to communicate with the air path 47A. The air path 52 is in communication with a suction portion 53 (for example, a pump) outside the mold. The central portion of the release film F follows the shape of the cavity recess 33 and is adsorbed and held by the suction portion 53 via the air passage 47A and the air passage 52 to be described later.

An air path 54 is formed in the lower type clamper 35 so as to pass from the upper surface of the lower type clamper 35 to the outside of the mold. The air path 54 is in communication with the suction portion 55 (for example, a pump) outside the mold. The outer peripheral portion of the release film F is adsorbed and held on the clamp surface of the lower clamper 35 by the suction portion 55 via the air path 54 as will be described later.

A work loader 56 is provided adjacent to each press section 130 and capable of transporting the work W to the upper mold 31. The work loader 56 is capable of transporting the resin R and the release film F to the lower mold 32, A loader 190 (see Fig. 1) having a loader 57 is provided. In the loader 190, the work loader 56 and the film loader 57 are configured to be able to exchange the work W and the release film F from the robot mechanism unit 180 into the press unit 130, And the work W and the release film F can be carried in and out of the press section 130 by a different system by a drive mechanism (not shown). The film loader 57 may be configured to receive the resin R and the release film F from the robot mechanism 180 in the loader 190. The film loader 57 may be configured to receive the resin R and the release film F from the robot mechanism 180, To supply the resin (R) and the release film (F).

The work loader 56 includes a support plate 60, a support portion 61, and a positioning portion 62. The size of the planar region of the support plate 60 is larger than that of the through hole 41 of the upper clamper 40, for example. On the upper surface of the support plate 60, a ring-shaped support portion 61 is provided at a predetermined height in a plan view. A plurality of positioning portions 62 (for example, pins) are provided on the upper surface of the support plate 60 on the outer side of the support portion 61 at a predetermined height.

The support portion 61 is provided such that its planar region is provided along the inner side of the outer edge of the substrate 10 of the workpiece W and as close as possible to the planar region of the substrate 10. [ The supporting portion 61 is provided such that its height is higher than the height of a member mounted on the substrate 10 of the work W (for example, the thickness of the chip component 11 or the height of the bonding wire) . The work W is held by the support portion 61 at the outer peripheral portion of the surface of the substrate 10 so that the support plate 60 does not contact (interfere with) the chip component 11 and the bonding wire do.

The positioning portion 62 is configured to be capable of positioning with respect to the upper die insert 37 by contacting the inner peripheral surface of the through hole 41 of the upper die clamper 40, Shaped through-holes 41 as viewed from the plane of the upper-type clamper 40. The positioning portion 62 is provided such that its height is in contact with the inner peripheral surface of the through hole 41 before the work W is handed over to the upper insert 37. [ Thereby, the workpiece W is positioned by the positioning section 62 so as to be arranged in a predetermined area on the lower surface of the upper die insert 37.

The work loader 56 having such a configuration brings the back surface of the substrate 10 of the work W into contact with the lower surface of the upper die insert 37 and the work W is handed over to the upper die 31. At this time, the substrate 10 is pushed by the support portion 61 to the lower surface of the upper insert 37, and the substrate 10 (work W) is held by the holding portion of the upper die 31.

The film loader 57 is provided with a hand portion 63 for holding and holding the release film F on which the resin R is mounted. The hand portion 63 includes a holding surface 64 (suction surface) for holding the release film F, an air path 65 communicating with the holding surface 64, and a concave portion 66 ).

The retaining surface 64 has a size such that the size thereof (the size of the planar region of the hand portion 63) can be adsorbed along the outer periphery of the planar region of the elongated release film F, for example. A plurality of concave portions 66 are formed in the hand portion 63 such that a matrix of, for example, n rows and m columns (at least one of n and m is two or more) is arranged in the region of the holding surface 64 . The air path 65 extends from the holding surface 64 (for example, the outer peripheral portion of the holding surface 64 or the holding surface 64 between the recesses 66) without interfering with the recess 66, (63) of the hand portion (63). An air path 65 leading to the holding surface 64 is provided around the recess 66 (between the recesses 66). The air path 65 is in communication with the suction portion 67 (for example, a pump) on the outside of the hand portion 63. As a result, the release film F on which the resin R is mounted can be held while being stretched around the resin R, if necessary, and the release film F can be held by the weight of the resin R F can be adsorbed and held flat so as not to bend. Here, the flat state of the release film F means a flat state such that the release film F is not bent or distorted and the resin R is conveyed or set on the mold metal 30 It does not have to be a complete plane.

With the film loader 57 having such a constitution, the resin R mounted on the release film F in the concave portion 66 is pressed against the air path 65 around the concave portion 66, The release film F is sucked. The resin R and the release film F are handed over to the lower mold 32 in a state in which the release film F is kept flat on the holding surface 64 Since the concave portion 66 can ensure the skin against the resin R, the state (shape, quantity) of the resin R mounted on the release film F can be maintained. In the present embodiment, the resin R is mounted on the entire surface of the release film F, but is divided into a plurality of areas (corresponding to the plurality of recesses 66). Depending on the strength of the release film (F) and the weight of the resin (R), it may be sucked and held only on the outer periphery of the release film (F).

Next, the resin mold method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described with reference to Figs. 3 to 9. Fig. Figs. 3 to 9 are schematic cross-sectional views of the press section 130 in the resin mold process in this embodiment.

The resin mold apparatus 100 according to the present embodiment is provided with a release film F disposed on the parting surface of the lower mold 32. By using the release film F, resin leakage from the gap between the lower cavity piece 34 and the lower clamper 35 can be prevented. It is also possible to prevent clogging of the resin between the lower mold cavity piece 34 and the lower mold clamper 35 to ensure relative movement of the lower mold cavity piece 34 relative to the lower mold clamper 35. Depending on the strength of the release film (F) and the weight of the resin (R), it may be sucked and held only on the outer periphery of the release film (F).

As shown in Fig. 3, the workpiece W is carried by the work loader 56 from the outside of the mold while the mold metal mold 30 is opened.

The resin R and the release film F are carried by the film loader 57 while the mold metal mold 30 is opened. Prior to this, the resin R is loaded (supplied) onto the roll-like release film F and the release film F is cut in a predetermined shape (for example, elongated shape) (see Fig. 2) . The release film F is sucked by the suction portion 67 and adsorbed on the holding surface 64 and brought into a flat state. The sucking operation of the sucking portion 67 and the like is indicated by an arrow (see Fig. 3, etc.).

Subsequently, as shown in Fig. 4, the work loader 56 is lifted and the work W is transferred to the upper die 31. Then, as shown in Fig. Specifically, after the work loader 56 is raised, the positioning portion 62 is brought into contact with the inner peripheral surface of the through hole 41 of the upper clamper 40, and then the back surface of the substrate 10 is inserted into the upper insert 37). Subsequently, the substrate 10 (workpiece W) is held on the lower surface of the upper die insert 37 by a work holding portion (not shown). In this way, the work W is transferred from the work loader 56 to the upper die 31.

4, the film loader 57 is lowered, and the release film F on which the resin (R) is mounted is transferred to the lower mold 32 to start the melting of the resin (R). Specifically, first, the lower surface of the lower clamper 35 is brought into contact with the upper surface of the holding surface 64 via the release film F by the lowering of the film loader 57, and then the elastic member 50 is compressed (Activates the movable part). That is, by lowering the film loader 57, the lower clamper 35 is pushed down. Then, the film loader 57 is lowered until the upper surface (upper end surface) of the lower cavity piece 34 and the upper surface (upper end surface) of the lower clamper 35 become horizontal. Here, instead of the operation of lowering the film loader 57, the release film F may be passed to the lower mold 32 by the action of raising the lower mold 32. [

At this time, the resin (R) on the release film (F) is heated by the lower mold cavity piece (34) to start melting. The film loader 57 holds the release film F flattened by the holding surface 64. [ That is to say, the resin R is pressed by the film loader 57 to the lower mold 32 in which the upper face (upper end face) of the lower mold cavity piece 34 and the upper face (upper end face) of the lower clamper 35 are held horizontally, And a flat release film F is arranged so as to be positioned on the lower cavity piece 34. [ Further, the release film F is required to be flat when it is arranged (supplied) to the lower mold 32. 4, when the holding surface 64 of the film loader 57 is made to have the same shape or size as that pushed by the cavity recess portion 33 via the release film F, It is possible to supply the release film F to the lower mold 32 in the horizontal state simply by pushing the lower mold 57 downward until it abuts the end face of the cavity piece 34, Can supply.

The upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 are horizontally aligned with each other so as to cover the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35, (F) is adsorbed and held by the adsorption units (53, 55). Thereby, the resin (R) and the release film (F) are transferred from the film loader (57) to the lower mold (32). Further, the adsorption units 53 and 55 may be of different systems or may be of the same system.

Subsequently, after holding the work W as described later, the work loader 56 is lowered as shown in Fig. Thereby, the work loader 56 is isolated from the work W. Then, the work W is retained only by the upper die 31. Fig.

5, while the release film F flattened by the suction portions 53 and 55 is suctioned from the air passages 47A, 52, and 54, the film loader 57 is lifted to move the elastic member 50) (activates the movable portion). The cavity 33 is formed by relatively moving the lower cavity piece 34 with respect to the lower clamper 35 by the elastic member 50. At this time, the outer peripheral portion of the release film F is sucked by the sucking portion 55 and the portion corresponding to each portion of the cavity recess portion 33 of the release film F is sucked by the sucking portion 53 , The release film (F) is deformed while following the inner surface of the cavity recessed portion (33). Thereby, the release film F follows the inner surface of the cavity 33 and is adsorbed and held.

The release film F is sucked and held while following the inner surface of the cavity 33 and the resin R is supplied to the cavity 33 as it is. Since the resin R is arranged on the lower cavity piece 34 via the release film F by the film loader 57, the lower cavity piece 34 relatively moves with respect to the lower clamper 35 Even if the cavity 33 is formed, the resin R is maintained in the state of being supplied to the cavity 33. Therefore, the shape of the resin (R) is not collapsed, the position is not changed, and the resin (R) can be supplied to the bottom of the cavity (33). Supplying the resin R to the cavity recess 33 in a desired state in this manner serves to reduce quality defects of the molded product due to voids and wire sweeps.

Subsequently, as shown in Fig. 6, the work loader 56 and the film loader 57 are avoided from the inside of the mold metal mold 30.

Subsequently, as shown in Fig. 7, the lower mold 32, which is a movable type, is raised to mold-close (mold) the mold metal mold 30. Specifically, the lower die 32 is lifted up to a position where the release film F is clamped by the lower die clamper 35 and the upper die clamper 40. Thereby, the inside of the mold metal mold 30 including the cavity recess 33 is airtight. At this time, by driving the decompression section 45, the interior of the mold metal 30 including the cavity recess 33 is depressurized (degassed) via the air path 41A and the air path 44. By reducing the pressure inside the mold 30, the air mixed in the molten resin R in the subsequent resin mold is removed, and the occurrence of voids in the molded article can be prevented.

Subsequently, as shown in Fig. 8, the movable lower mold 32 is further raised so that the upper surface of the lower clamper 35 is brought into contact with the outer peripheral portion of the substrate 10 with the release film F interposed therebetween. At this time, since the elastic member 42 is weaker than the elastic member 50, the elastic member 42 is compressed via the upper clamper 40 by the lower mold 32 (lower clamper 35) . As a result, the work W is clamped by the upper insert 37 (upper die 31) and the lower die clamper 35 (lower die 32), and the lower surface of the upper die clamper 40 Is in a horizontal state. As described above, by relatively moving the upper insert 37 relative to the upper clamper 40, the work W can be clamped at a uniform height position irrespective of the thickness of the work W.

Subsequently, as shown in Fig. 9, the movable lower mold 32 is further raised to immerse the chip component 11 in the molten resin R at the mold temperature, and thereafter, the cavity C 33) is heated and cured to mold the work W into a resin mold. At this time, since the lower clamper 35 comes into contact with the upper die 31 via the substrate 10 and is prevented from moving, the lower die 32 (lower base 46) Is compressed. The resin mold is performed at the desired molding thickness (molding position) by adjusting the rising stop position of the lower mold 32 (in other words, the shrinkage amount of the elastic member 50). As a result, the molded article is almost completed.

Thereafter, the work W (molded product) is held by the upper die 31 by the work holding portion and the release film F is held by the lower die 32 by the suction portions 53 and 55 Open the mold in the state. At this time, since the release film F is used, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage section 160 via the inspection section / cooling section 140 and the cure section 150.

The release film F can be deformed by following the shape of the cavity recess 33 after the release film F is disposed in the flat state by using the resin mold apparatus 100 in this embodiment. For example, there is no case where the release film F is fed to the mold metal mold 30 in a state where the release film F is wrinkled or overlapped. Therefore, it is possible to prevent the transfer of the molded article to the outer surface due to wrinkles or the like of the release film F, or to prevent the resin leakage from the overlapping portions, thereby improving the quality of the molded article. It is also possible to form the cavity 31 in the lower mold 32 by forming the chip part 11 or the bonding wire 33 on the molten resin R supplied to the entire surface of the cavity 33, By minimizing the flow of the resin (R), it is possible to reduce quality defects of molded articles such as vaults and wire sweeps.

(Second Embodiment)

The work W based on the work loader 56 is placed (set) on the upper die 31 together with the jig (lower portion of the upper die insert 37) 57 are provided with a heating unit, a cooling unit, and a shutter unit. Hereinafter, these differences will be mainly described with reference to Figs. 10 to 14. Fig. Figs. 10 to 14 are schematic sectional views of the press section 130 in this embodiment. Fig.

As the work W (substrate 10) becomes large, warp (warpage) largely occurs in the work W. Therefore, as in the first embodiment, In the case where the workpiece W is held by the loader 56 (supporting portion 61), it is difficult to maintain the substrate 10 in the warp type due to its own weight, Problems arise. Thus, in this embodiment, a plate-like jig 37A (member) is placed on the back surface of the large substrate 10 to prevent the occurrence of warpage, and the work W is moved together with the jig 37A to the work loader 56 ). The jig 37A is made of the same material (stainless steel) as the upper die insert 37, for example. For this reason, the jig 37A may be regarded as having the lower portion of the upper die insert 37 detachably installed.

In the case where the film loader 57 is provided with a plurality of recesses 66 as in the first embodiment, the outer circumferential portion of the recess 66 (the air path 65 communicating with the holding surface 64) The resin R can not be mounted on the release film F in the region where the release film F is provided. However, when a single recess 66 having a wide opening is formed in the hand portion 63 and the resin R is widely mounted on the release film F, It is conceivable that it is difficult to maintain the flatness F too flat and flat. Thus, in the present embodiment, a shutter unit 70 capable of holding the release film F on which the resin R is mounted is provided under the opening of the hand unit 63. [

Here, the film loader 57 in the present embodiment will be specifically described. The film loader 57 is provided with a roll-shaped shutter unit 70 capable of opening and closing the holding surface 64. The shutter portion 70 is wound by the driving portion not shown in the state in which the holding surface 64 is opened (open state) and is avoided from the holding surface 64. In the state where the holding surface 64 is closed (Closed state), it is sent out to the holding surface 64. The film loader 57 supports the release film F by the shutter unit 70 in the closed state of the shutter unit 70 and transfers the release film F to the lower unit 32 in the opened state of the shutter unit 70. [ The release film F can be disposed.

The shutter unit 70 is made of, for example, a material that can be wound like a thin sheet metal or a resin material. It is preferable that the material of the shutter unit 70 has a material or shape with a low frictional resistance against the release film F. Thereby, the release film F can be wound without being distorted. The shutter portion 70 is preferably provided with a padding 71 such as a support bar extending in a direction perpendicular to the take-up direction so as to keep the release film F flat.

According to the film loader 57 as described above, the releasing film F is released from the shutter portion 70 by the weight of the resin R in the concave portion 66 mounted on the release film F, The film F can be held (supported) flat. When the release film F is placed on the lower mold 32, the shutter 70 can be wound to save space. However, the shutter unit 70 need not necessarily be constituted to be capable of being wound, and the release film F (that is, the resin R) can be held even when the plate-like member is configured to be openable and closable.

The film loader 57 is provided with a cooling section 72 and a heating section 73. This facilitates heating of the release film (F) and the resin (R) mounted thereon, or cooling. It is also possible to preheat the release film F so that the release film F can conform to the shape of the cavity recess 33 more reliably by providing the heating section in the shutter section 70. [ In this case, for example, the heating portion may be provided to the shutter portion 70 by making the shim 71 a hot wire.

Next, the resin mold method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described.

The work W is carried along with the jig 37A by the work loader 56 from the outside of the mold while the mold metal mold 30 is opened as shown in Fig.

The resin R and the release film F are carried by the film loader 57 while the mold metal mold 30 is opened. At this time, when it is desired to prevent the resin R from being heated by the radiant heat from the mold, the cooling section 72 is turned on (or off) and the heating section 73 is turned off , The release film (F) and the resin (R) can be prevented from being heated.

The resin R loaded on the release film F is carried into the mold 30 by the shutter 70 in the closed state. The release film F is sucked by the suction portion 67 and adsorbed on the holding surface 64 and brought into a flat state.

11, the work loader 56 is lifted and the work W is transferred to the upper die 31 together with the jig 37A. More specifically, after the work loader 56 rises, the positioning portion 62 is brought into contact with the inner peripheral surface of the through hole 41 of the upper clamper 40, and then the jig 37A are brought into contact with the lower surface of the upper die insert 37. Subsequently, the work W and the jig 37A are held on the lower surface of the upper die insert 37 by a work holding portion (not shown). In this way, the work W is transferred from the work loader 56 to the upper die 31.

Further, as shown in Fig. 11, the film loader 57 is lowered. Concretely, first, the holding surface 64 is brought into contact with the upper surface of the lower clamper 35 via the release film F and the shutter portion 70 by the lowering of the film loader 57, Thereby compressing the member 50 (activating the movable portion). That is, by lowering the film loader 57, the lower clamper 35 is pushed down. Then, the film loader 57 is lowered until the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 become horizontal. 11, it is preferable to set the cooling section 72 to the OFF state so as not to lower the mold temperature of the mold metal 30 when the cooling section 72 is in the ON state.

Subsequently, as shown in Fig. 12, the work loader 56 is lowered. Thereby, the work loader 56 is isolated from the work W. Then, the work W is held by the upper mold 31. [

12, the releasing film F on which the resin R is mounted is transferred to the lower mold 32. As shown in Fig. Specifically, the shutter 70 is first wound and the film loader 57 applies a resin (not shown) to the lower mold 32 where the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally, The flat release film F is disposed such that the lower mold release piece R is positioned on the lower mold cavity piece 34. [ Subsequently, a flat release film F is formed on the parting surface of the lower mold 32 where the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 are horizontal by the suction portions 53 and 55 Adsorbed and retained. Thereby, the resin (R) and the release film (F) are transferred from the film loader (57) to the lower mold (32). In addition to the heating from the lower mold 32 side (lower side), the heating portion 73 can be heated from above even by heating the heating portion 73, thereby shortening the time for melting have. As a result, the productivity can be improved.

13, the film loader 57 is lifted while sucking the release film F flattened by the suction portions 53, 55 from the air passages 47A, 52, 54, (Activates the movable part). The cavity 33 is formed by relatively moving the lower cavity piece 34 with respect to the lower clamper 35 by the elastic member 50. At this time, the outer peripheral portion of the release film F is sucked by the sucking portion 55 and the portion corresponding to each portion of the cavity recess portion 33 of the release film F is sucked by the sucking portion 53 , The release film (F) is deformed while following the inner surface of the cavity recessed portion (33). Thereby, the release film F follows the inner surface of the cavity 33 and is adsorbed and held.

At this time, the release film F is sucked and held while following the inner surface of the cavity recess 33, so that the resin R is supplied to the cavity recess 33 as it is. In other words, since the resin R is disposed on the lower cavity piece 34 via the release film F by the film loader 57, the lower cavity piece 34 is relatively moved relative to the lower clamper 35 The resin R is maintained in the state of being supplied to the cavity 33 even if the cavity 33 is formed. Therefore, the shape of the resin (R) is not collapsed, the position is not changed, and the resin (R) can be supplied to the bottom of the cavity (33).

Subsequently, as shown in Fig. 14, the work loader 56 and the film loader 57 are avoided from the inside of the mold metal mold 30. Thereafter, through the steps described with reference to Figs. 7 to 9 in the first embodiment, the molded product is almost completed.

(Third Embodiment)

In the second embodiment, as the film loader 57, a hand portion 63 for holding and holding the release film F on the mounting surface side on which the resin (R) is mounted, and a release film F is used as the shutter unit 70 is described. On the other hand, in this embodiment, the film loader 57 is different in that a resin (R) and a release film (F) are supported and a jig (member) Hereinafter, these differences will be mainly described with reference to Fig. 15 to Fig. Figs. 15 to 19 are schematic sectional views of the press section 130 in this embodiment. Fig.

As in the second embodiment, when the release film F is arranged on the lower mold 32, the shutter unit 70 for holding the release film F is provided with the shutter unit 70, There is a need. At this time, there is a possibility that the distribution of the resin (R) on the release film (F) may be distorted. Thus, in the present embodiment, a flat release film F is held by placing a plate-shaped jig 34A under the release film F, and the release film F together with the jig 34A is fixed to the film loader 57 , And the jig 34A in the state in which the release film F is disposed is used as the lower die 32. [ That is, since the jig 34A is made of the same material (stainless steel) as the lower cavity piece 34, the upper portion of the lower cavity piece 34 can be regarded as being removably installed.

Here, the film loader 57 and the press section 130 in the present embodiment will be described in detail. The film loader 57 has a jig 34A on which an upper portion of the lower cavity piece 34 is detachably mounted and a jig 35A on which the upper portion of the lower clamper 35 is detachably mounted. The jig 34A is disposed in the through hole of the jig 35A and the outer peripheral surface of the jig 34A and the inner peripheral surface of the jig 35A are connected to the plurality of connection members 74 . The connecting member 74 is also used as a movable portion that can move the jig 35A in the vertical direction with respect to the jig 34A, for example, like a leaf spring.

The thicknesses of the jig 34A and the jig 35 are different from each other and the thickness of the jig 34A is smaller than that of the jig 35A. The end surface of the jig 34A and the end surface of the jig 35A are held horizontally by the connecting member 74 in a state in which they are not influenced by the outside. In the press portion 130, when the elastic member 50 is not pressed (in a state in which the elastic member 50 is not influenced from the outside) as in the case of opening the mold, And the lower upper surface of the lower type clamper 35 can be set at the same height position. In this embodiment, the jig 34A (the lower portion of the lower cavity piece 34) is provided with respect to the jig 35A (upper portion of the lower clamper 35) with the difference in thickness It is possible to change the depth of the cavity 33 (the volume of the cavity C).

The press section 130 (the film loader 57) according to the present embodiment is provided with the pressing sections 75 and 76 for pressing the release film F from the upper surface (the surface on which the resin R is mounted) . The pressing portion 75 is formed in a flange shape such as a combination of two angular ring members having different outer shapes so that the release film F can be pressed around the resin R and the jig 34A Of the outer circumferential portion. The pressing portion 76 is provided so as to oppose the end face of the jig 35A so as to press the outer peripheral portion of the release film F against the end face of the lower type clamper 35. [

The release film F is carried by the film loader 57 while keeping the end face of the jig 34A and the end face of the jig 35A horizontally while keeping the release film F flat on these end faces. According to this, the release film (F) and the resin (R) mounted thereon can be placed in the mold metal mold (30) in a stable state.

Next, the resin mold method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described.

As shown in Fig. 15, in a state in which the mold metal mold 30 is opened, the workpiece W is carried by the work loader 56 from the outside of the metal mold. The resin R and the release film F are carried by the film loader 57 while the mold metal mold 30 is opened.

The roll release film F may be fed in a state in which the end face of the jig 34A and the end face of the jig 35A are horizontally held in the resin supply portion 120, The resin (R) is mounted (supplied) on the release film (F). The release film F is cut into a predetermined shape (for example, an elongated shape) (see Fig. 2), whereby the release film F is formed in such a manner that the cross section of the jig 34A and the jig 35A is horizontal Therefore, the state when it is placed there is also flat. This is supplied to the press section 130 via the robot mechanism section 180 and the loader 190.

Subsequently, as shown in Fig. 16, the work loader 56 is lifted and the work W is transferred to the upper die 31. Then, as shown in Fig.

Further, as shown in Fig. 16, the film loader 57 is lowered. Concretely, the jig 35A is brought into contact with the upper surface of the lower clamper 35 by the lowering of the film loader 57. At this time, the release film F is held in a state in which the end face of the jig 34A (upper portion of the lower cavity piece 34) and the end face of the jig 35A (upper portion of the lower clamper 35) ) By a film loader (57). At this time, the jig 34A is not in contact with the upper surface of the lower cavity piece 34.

Subsequently, as shown in Fig. 17, the work loader 56 is lowered. Thereby, the work loader 56 is isolated from the work W.

17, the release film F is sucked by the suction units 53 and 55. [0154] More specifically, the outer peripheral portion of the release film F is sucked by the sucking portion 55, the central portion of the release film F is sucked by the sucking portion 53, and the jig 35A is moved up and down The jig 34A provided in the lower portion is lowered by the connecting member 74 (the movable portion is activated).

The lower cavity clips 35 are relatively moved with respect to the lower clamper 35 by the connecting member 74 so that the cavity recesses 33 are formed. At this time, the outer peripheral portion of the release film F is sucked by the sucking portion 55 and the portion corresponding to each portion of the cavity recess portion 33 of the release film F is sucked by the sucking portion 53 , The release film (F) is deformed while following the inner surface of the cavity recessed portion (33). Thereby, the release film F follows the inner surface of the cavity 33 and is adsorbed and held.

The release film F is sucked and held while following the inner surface of the cavity 33 and the resin R is supplied to the cavity 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R remains unchanged And is supplied to the cavity recess 33. Therefore, the shape of the resin (R) is not collapsed, the position is not changed, and the resin (R) can be supplied to the bottom of the cavity (33).

18, the film loader 57 is lifted while the release film F is being sucked from the air paths 52, 54 by the suction portions 53, 55, and the resin (R) and the release film (F).

Subsequently, as shown in Fig. 19, the work loader 56 and the film loader 57 are avoided from the inside of the mold metal mold 30. Thereafter, through the steps described with reference to Figs. 7 to 9 in the first embodiment, the molded article is almost completed.

(Fourth Embodiment)

In the first embodiment, the case of using the hand portion 63 for holding the release film F flat as the film loader 57 is described. On the other hand, in the present embodiment, the film loader 57 is different in that a release film F is supported as a plate, and a jig (member) for placing (setting) the release film F directly on the lower die 32 is used. Hereinafter, these differences will be mainly described with reference to Figs. 20 to 24. Fig. Figs. 20 and 22 to 24 are schematic sectional views of the press section 130 in this embodiment. Fig. 21 is an exploded sectional view of the film loader 57 (film plate portion) shown in Fig.

The press section 130 in this embodiment will be described in detail. The film loader 57 is provided with a ring-shaped upper plate 80 and a lower plate 81 so that the release film F can be held while being stretched from the entire circumference by being fitted from above and below 21 in particular). In the example shown in Fig. 21, the lower plate 81 is formed with a step-like portion 82 that extends in the circumferential direction concave from the surface of the peripheral edge of the upper plate 80, so as to have a flange shape. The release film F is sandwiched between the upper plate 80 and the lower plate 81 so that the lower end of the upper plate 80 is inserted into the cutout portion 82 (small diameter portion) The film plate portion (film loader 57) is constructed by fitting the upper plate 80 in correspondence with the neck portion 80a (see FIG. 20 in particular). The release film F is stretched so as to be flat on the inner periphery of the upper plate 80 and the lower plate 81. [

For example, by using the upper plate 80 and the lower plate 81 of the same ring shape, holes penetrating from their peripheral portions are fixed by bolts or the like (avoiding the position of the release film F) Or the like.

The lower clamper 35 is formed with a step-like portion 83 extending in the circumferential direction concave from the end face at the peripheral edge. The film plate portion (film loader 57) is fitted and fixed by associating the inner diameter portion 81a of the lower plate 81 with the stepped portion 83 of the lower clamper 35. In the present embodiment, the release film F can be held flat by a simple structure, and the release film F can be disposed in the lower die 32 in a flat state.

Next, the resin mold method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described.

As shown in Fig. 20, the work W is carried by the work loader 56 from the outside of the mold while the mold metal mold 30 is opened. The resin R and the release film F are carried by the film loader 57 while the mold metal mold 30 is opened.

21, a release film F is sandwiched between the upper plate 80 and the lower plate 81 to form a film plate portion. On the release film F of the film plate portion, Resin (R) is mounted (supplied).

Subsequently, as shown in Fig. 22, the work loader 56 is lifted up and the work W is transferred to the upper die 31. Then, as shown in Fig.

22, the film loader 57 is lowered, and the release film F on which the resin R is mounted is transferred to the lower mold 32. As shown in Fig. Specifically, first, the lower surface of the lower plate 81 is brought into contact with the upper surface of the step-like portion 83 of the lower clamper 35 by fixing the film loader 57 down, and then the elastic member 50 is compressed (Activates the movable part). That is, by lowering the film loader 57, the lower clamper 35 is pushed down. Then, the film loader 57 is lowered until the upper surface (upper end surface) of the lower cavity piece 34 and the upper surface (upper end surface) of the lower clamper 35 become horizontal.

At this time, the film loader 57 keeps the flat release film F in a full length. That is, the resin R is placed on the lower mold cavity 34 by the film loader 57 on the lower mold 32 where the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 are held horizontally The release film F is flattened.

The upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35 are horizontally aligned so as to cover the upper surface of the lower cavity piece 34 and the upper surface of the lower clamper 35, The film (F) is adsorbed and held by the adsorbing part (53).

Subsequently, as shown in Fig. 23, the work loader 56 is lowered. Thereby, the work loader 56 is isolated from the work W. Then, the work W is retained only by the upper die 31. Fig. Subsequently, the work loader 56 is avoided from the inside of the mold metal mold 30.

23, while the release film F flattened by the suction portion 53 is suctioned from the air passages 47A and 52, the film loader 57 is lifted and the elastic member 50 is stretched (Activates the movable part). The cavity 33 is formed by relatively moving the lower cavity piece 34 with respect to the lower clamper 35 by the elastic member 50. At this time, the outer peripheral portion of the release film F is fixed by engagement of the inner diameter portion 81a of the lower plate 81 and the stepped portion 83 of the lower clamper 35, The release film F is deformed while following the inner surface of the cavity 33 because the portions corresponding to the corner portions of the cavity 33 of the film F are adsorbed. Thereby, the release film F follows the inner surface of the cavity 33 and is adsorbed and held.

At this time, the release film F is sucked and held while following the inner surface of the cavity recess 33, so that the resin R is supplied to the cavity recess 33 as it is. In other words, since the resin R is disposed on the lower cavity piece 34 via the release film F by the film loader 57, the lower cavity piece 34 is relatively moved relative to the lower clamper 35 The resin R is maintained in the state of being supplied to the cavity 33 even if the cavity 33 is formed. Therefore, the shape of the resin (R) is not collapsed, the position is not changed, and the resin (R) can be supplied to the bottom of the cavity (33). Supplying the resin R to the cavity recess 33 in a desired state in this manner serves to reduce quality defects of the molded product due to voids and wire sweeps.

Subsequently, as shown in Fig. 24, the lower mold 32, which is a movable type, is raised and the mold metal mold 30 is closed (clamped). Thereby, the release film F is clamped, that is, the film plate portion (film loader 57) is sandwiched by the upper mold 31 and the lower mold 32. [ Thereafter, through the steps described with reference to Figs. 8 to 9 in the first embodiment, the molded product is almost completed.

(Fifth Embodiment)

In the first embodiment, the upper and lower surfaces of the lower cavity piece 34 and the lower clamper 35 are horizontally arranged by pushing down the lower clamper 35 by the film loader 57 (hand 63) As shown in FIG. On the other hand, in this embodiment, a plate-shaped jig 34A (upper part of the lower cavity piece 34) supported by floating in the lower mold 32 is provided, and the upper surface of the jig 34A and the lower clamper 35 And the upper surface of the substrate is horizontal. Hereinafter, these differences will be mainly described with reference to Fig. 25 to Fig. 25 to 26 are schematic cross-sectional views of the press section 130 in this embodiment.

The press section 130 in this embodiment will be described in detail. The press section 130 has a plate-shaped jig 34A on which an upper portion of the lower cavity piece 34 is detachably mounted. The press section 130 is provided with a plurality of support pins 84 for supporting four corners of the plate-like jig 34A, for example. The press part 130 is assembled so as to be movable in the up and down direction with respect to the lower die base 46 and has the same number of elastic members 85 as the support pins 84 Spring). The support pins 84 and the elastic members constituting the movable portion are arranged such that the upper surface of the jig 34A (the upper portion of the lower cavity piece 34) and the upper surface of the lower clamper 35 are horizontal, And the jig 34A is floated and supported by the jig 85. As shown in Fig. The plate-shaped jig 34A may be configured to be movable up and down by using a drive mechanism such as an air cylinder or a servo motor without using the elastic member 85. [

Next, the resin mold method (operation method of the resin mold apparatus 100) using the resin mold apparatus 100 according to the present embodiment will be described.

The resin R and the release film F are carried into the lower mold 32 while the mold metal mold 30 is opened as shown in Fig. At this time, the release film F is attached to the lower mold 32 where the upper surface of the jig 34A (upper portion of the lower cavity piece 34) and the upper surface of the lower clamper 35 are held horizontally, As shown in Fig. Then, suction of the release film (F) is started by the suction portions (53, 55).

Subsequently, as shown in Fig. 26, the release film F is sucked by the suction units 53 and 55. [ Concretely, the outer peripheral portion of the release film F is sucked by the suction portion 55 and the air in the space below the release film F is sucked by the suction portion 53, and the air is sucked to the lower type clamper 35 The jig 34A, which is movable in the vertical direction, descends (activates the movable portion) while compressing the elastic member 85. As shown in Fig.

The cavity recess portion 33 is formed by relatively moving the jig 34A (the upper portion of the lower cavity piece 34) relative to the lower clamper 35 by the elastic member 85. [ At this time, the outer peripheral portion of the release film F is sucked by the sucking portion 55 and the portion corresponding to each portion of the cavity recess portion 33 of the release film F is sucked by the sucking portion 53 , The release film (F) is deformed while following the inner surface of the cavity recessed portion (33). Thereby, the release film F follows the inner surface of the cavity 33 and is adsorbed and held.

The release film F is sucked and held while following the inner surface of the cavity 33 and the resin R is supplied to the cavity 33 as it is. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity recess 33 is formed, the resin R remains unchanged And is supplied to the cavity recess 33. Therefore, the shape of the resin (R) is not collapsed, the position is not changed, and the resin (R) can be supplied to the bottom of the cavity (33). Thereafter, through the steps described with reference to Figs. 7 to 9 in the first embodiment, the molded article is almost completed.

This eliminates the need to push down the lower clamper 35 by the film loader 57 to make the end face of the lower cavity piece 34 and the end face of the lower clamper 35 horizontal, 57) can be simplified (for example, the output of the drive motor and the reduction of the stroke). When the release film F is disposed on the lower mold 32, since the jig 34A (the upper portion of the lower cavity piece 34) is floating, the heat shrinkage of the release film F can be prevented And it is easy to prevent overheating of the resin R mounted on the release film F or to perform heating adjustment.

(Sixth Embodiment)

In the first embodiment, as described with reference to Fig. 7, the inside of the mold metal mold 30 is depressurized (degassed) in a state in which the interior of the mold metal mold 30 including the cavity recess 33 is closed, ) Is described. At this time, when the substrate 10 (workpiece W) is held on the upper die 31 by suction by the work holding portions (air path 90 and suction portion 91) of the upper die 31, The attracting force for attracting the substrate is lowered by the suction force for the substrate 10, and there is a fear that the substrate 10 falls. In contrast to the first embodiment, in the present embodiment, a plurality of pins are floated on the lower clamper 35 to support the substrate 10 so as to be pressed against the upper mold 31 in the state of forming the reduced-pressure space The present invention is not limited thereto. Hereinafter, this difference will be mainly described with reference to Fig. 27 is a schematic cross-sectional view of the press section 130 in this embodiment.

The press section 130 includes a plurality of pins 86 provided inside the lower clamper 35 along the perimeter of the through hole 47 of the lower clamper 35. The pressing portion 130 is assembled in the lower clamper 35 so that the pin 86 can move up and down with respect to the lower clamper 35 and the same number of elastic members 87 (For example, a spring).

Therefore, in order to support the workpiece W by abutting the surface of the substrate 10 via the release film F and projecting from the end face of the lower clamper 35 in the state of forming the reduced pressure space, And the pin 86 is floated and supported by the elastic member 87. [ Then, in a state where the work W is clamped (see Fig. 8), the pin 86 is housed inside the lower clamper 35. Therefore, it is possible to prevent the workpiece W held by the upper die 31 from dropping before clamping.

27, when the reduced pressure space is formed by the reduced pressure portion 45 through the air path 44, the suction path appears to be clogged. However, since the pin 86 is partially disposed, There is no.

(Seventh Embodiment)

The present embodiment differs from the first embodiment in that only one side of the work W (substrate 10) is resin-molded, in that the both surfaces of the work W are resin-molded. Hereinafter, these differences will be mainly described with reference to Figs. 33 to 36. Fig. 33 to 36 are schematic sectional views of the press section 130 in the resin mold process in this embodiment.

The workpiece W in this embodiment includes a substrate 10 having one surface 10a and the other surface 10b opposite to the other surface 10b and a plurality of balls 10b provided on each of the surfaces 10a and 10b, (First component, second component), and is formed of, for example, a wafer shape (plate shape). The bumps 11A and 11A of the both surfaces 10a and 10b are resin molded so that the resin molded parts 14 and 15 are formed on the both surfaces 10a and 10b respectively Is almost completed as a resin molded product (molded product).

Such a resin mold of the wafer W is called a WLP (Wafer Level Package). The parts to be mounted on the workpiece W are not limited to the bumps 11A as the wiring parts but may be chip parts (for example, semiconductor chips, MEMS chips, chip capacitors, etc.) Both of the parts may be used. The substrate 10 may be a carrier or a semiconductor wafer which includes not only a general substrate but also a plate-shaped member, on which components are temporarily mounted.

In this embodiment, the workpiece W is not a resin mold, but is formed by exposing parts (bumps 11A) on both sides (see FIG. 33) (See Fig. 35) exposed only by the bump 11A (see Fig. 35) are separately supplied by the robot mechanism unit 180 (see Fig. 1). Therefore, the press portion 130 in the present embodiment is provided with the plate-like first jig 12 (see FIG. 33) and the second jig 13 (see FIG. 35).

The jigs 12 and 13 are provided on the lower surface of the upper insert 37 when the work W is clamped by the upper die 31 and the lower die 32, respectively. The jig 12 has a first opening 12a (a plurality of openings in FIG. 33) larger than a mounting area of the bumps 11A mounted on the semiconductor chip to be manufactured as a product on the surface 10a. Lt; / RTI > In other words, the first through hole 12a is formed so that the work W and the jig 12 are overlapped while avoiding a component provided as the bump 11A. The jig 13 has a second hole 13a (one in Fig. 35) larger than the hole 12a.

When the jig 12 is used, the bump 11A is made to enter the opening 12a (that is, the avoiding portion is secured for the bump 11A by the opening 12a) (See Fig. 33). When the jig 13 is used, the resin mold part 15 is inserted into the opening 13a (that is, the avoiding part is secured with respect to the resin mold part 15 by the opening 13a) And mounted on the surface 10b of the work W (see Fig. 35). In this embodiment, by using the jigs 12 and 13, the work W can be clamped by avoiding (avoiding) the bumps 11A and the resin molded part 15 (see Figs. 34 and 36).

Further, since the jigs 12 and 13 can be exchanged, when molding other products, the molds 30 can be shared and other jigs can be used. The jigs 12 and 13 may be fixed to the upper die 31 and used.

The loader 190 brings the jig 12 or the jig 13 into contact with the workpiece W transferred from the robot mechanism unit 180 and then transfers them to the press unit 130. In this case, The loader 190 removes the jig 12 or the jig 13 from the resin-molded workpiece W transferred from the press section 130 and takes it out to the robot mechanism section 180. The jig 12 or the jig 13 is prepared in the loader 190 so that the work W is transferred to and from the press section 130 together with the jig 12 or the jig 13. [

Next, a manufacturing method (resin mold method) of a molded product (resin mold product) using the resin mold apparatus 100 (compression molding apparatus) in the present embodiment will be described. Specifically, in forming the resin molded parts 14 and 15 on each of the two surfaces (the surfaces 10a and 10b) of the work W as a molded product, a method of molding one side by one method (primary molding, Two-step mold method) will be described.

The work W carried by the robot mechanism unit 180 is guided to the loader 12A by the bump 11A in the loader 190 so that the jig 12 ). In this case, in order to mount the jig 12 in the loader 190, the robot mechanism unit 180 can only transport the work W and can use the robot mechanism unit 180 having a small transportable weight, The manufacturing cost can be reduced.

Next, the work W and the jig 12 are carried from the outside of the mold by the work loader 56 (see Fig. 3) while the mold metal mold 30 is opened, (12) th workpiece W (see Fig. 33). As a result, the work W is held by the mold surface of the upper mold 31.

Concretely, the jig 12 is brought into contact with the lower surface of the upper die insert 37 while the surface 10b of the workpiece W is directed toward the lower die 32. By the work holding section (not shown) The workpiece W (substrate 10) is held by suction through the jig 12 on the mold surface of the upper mold 31 (upper mold insert 37). The jig 12 is provided with the hole 12a for avoiding the bump 11A mounted on the surface 10a of the work W (substrate 10). For example, the bump 11A Can be protected. The bumps 11A may be avoided by inserting recesses in the lower surface of the upper insert 37 without using the jig 12. [

The resin R and the release film F are carried by the film loader 57 (see FIG. 3) while the mold metal mold 30 is opened, and the lower mold 32 ) To transfer the resin (R) and the release film (F) (see Fig. 33). At this time, the release film F follows the deformation of the lower cavity concave portion 33 from the flat, and the release film F is formed on the mold surface of the lower mold 32 including the lower cavity recess 33 The resin R is supplied to the lower mold cavity 33 as it is.

Further, by using the release film F, resin leakage from the gap between the lower die insert 34 and the lower die clamper 35 can be prevented. However, in the case where the resin R can be transported without affecting the resin leakage, the release film F may not be used.

34, the movable mold 32 is lifted to immerse all the bumps 11A provided on the surface 10b of the molten resin R at the mold temperature, The lower mold insert 34 is moved to the molding position while clamping the work W by the lower mold 32 and the lower mold 32. [ Then, the resin (R) filled in the lower mold cavity (C) is heated and cured to mold the work (W) with a resin. Thereby, the resin mold portion 15 is formed on the surface 10b of the work W.

Thereafter, the work W (molded product) is held by the upper die 31 by the work holding portion and the release film F is held by the lower die 32 by the suction portions 53 and 55 Open the mold in the state. At this time, since the release film F is used, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 via the inspection unit / cooling unit 140 and the cure unit 150 (see FIG. 1).

Next, in the work accommodating portion 160, the work W having the resin molded portion 15 formed on the surface 10b is stored in the magazine, and the magazine is moved to the work supply portion 110. [ At this time, by reversing the work W so that the resin mold portion 14 can be formed on the surface 10a of the work W, the secondary molding can be prepared. In order to form the resin mold part 14, the same process as the step of forming the resin mold part 15 by changing the jig 12 and the jig 13 is performed.

The resin mold part 15 of the workpiece W carried into the loader 190 by the robot mechanism part 180 is inserted into the opening 13a so as to be fixed to one surface 10b of the workpiece W 13). The openings 13a of the jig 13 are larger than the planar regions of the resin mold portions 15 and in other words the lower mold inserts 34 constituting the lower mold cavity C forming the resin mold portions 15, .

Subsequently, the work W and the jig 13 are carried by the work loader 56 (see Fig. 3) from the outside of the mold while the mold metal mold 30 is opened, The work W is transferred to the jig 13 (see Fig. 35). Since the jig 13 is provided with the holes 13a for avoiding the resin mold portions 15 mounted on the surface 10b of the work W (substrate 10), for example, (15) can be protected. It is also possible to engrave recesses on the lower surface of the upper mold insert 37 without using the jig 13 to avoid the resin mold section 15.

The resin R and the release film F are carried by the film loader 57 (see FIG. 3) while the mold metal mold 30 is opened, and the lower mold 32 ) To transfer the resin (R) and the release film (F) (see Fig. 35). At this time, the release film F follows the deformation of the lower cavity concave portion 33 from the flat, and the release film F is formed on the mold surface of the lower mold 32 including the lower cavity recess 33 The resin R is supplied to the lower mold cavity 33 as it is.

The resin R forms the resin mold part 14 and is made of the same amount and homogeneous as the resin mold part 15 formed previously so that the bump 11A can be sealed in the same shape. However, in the present embodiment, when the height of parts mounted on the substrate 10 indicated as the bumps 11A is different, a suitable amount of resin R may be used for each. In this case, the resin (R) having different properties may be used depending on the purpose of preventing the warping due to the difference in the thickness of the resin molding and the function of the mounted component.

Subsequently, as shown in Fig. 36, the movable lower mold 32 is lifted to immerse all of the bumps 11A provided on the surface 10a to the molten resin R at the mold temperature, The lower mold insert 34 is moved to the molding position while clamping the work W by the lower mold 32 and the lower mold 32. [ Then, the resin (R) filled in the lower mold cavity (C) is heated and cured to mold the work (W) with a resin. Thus, the resin mold portion 14 is formed on the surface 10a of the work W.

Thereafter, the work W (molded product) is held by the upper die 31 by the work holding portion and the release film F is held by the lower die 32 by the suction portions 53 and 55 Open the mold in the state. At this time, since the release film F is used, the work W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 via the inspection unit / cooling unit 140 and the cure unit 150 (see FIG. 1).

The bumps 11A are exposed by grinding the end faces of the resin mold portions 14 and 15 to the succeeding work W and are singulated for each area corresponding to one chip One package (resin mold product) in which connection terminal surfaces are formed is formed. In the case where the bumps 11A are used as the workpiece W by attaching one side of the substrate 10 on one side to each other, the substrates 10 are peeled off and then separated into areas corresponding to one chip , The package having the connection terminal face on one side can be efficiently formed.

According to the present embodiment, both surfaces 10a and 10b of the plate-like workpiece W can be resin-molded by a compression molding method. In addition, since the resin R can be supplied to the lower mold cavity 33 (lower mold cavity C) to mold the resin, even the large work W can be efficiently molded.

After the resin mold part 15 is formed on one side of the work W, the work W is carried into the press part 130 without storing the work W in the work storage part 160 to form the resin mold part 14, The resin mold portions 14 and 15 can be continuously formed.

In the above-described embodiment, in place of the shutter unit 70 provided to keep the resin R and the release film F flat, a resin holding plate The release film F may be transported while the shape member is sandwiched between the resin R and the release film F. [ The plate-like member for holding the resin may be, for example, a metal plate, a glass plate, or a silicon wafer, or a structure such as a lead frame or a substrate. In this case, the plate-like member for holding the resin can be peeled off after molding and remains in the package as it is, so that the functional layer such as the heat radiation layer, the electromagnetic shielding layer, the filter layer, the lens layer, the wavelength conversion layer, . By using the plate-like member for holding the resin as described above, it is possible to carry out the flat transport of the resin (R) and the release film (F) by the plate-shaped member capable of high- The product can be simply manufactured. Further, the plate-like member for holding the resin and the shutter unit 70 may be used in combination.

(Eighth embodiment)

In the press section of the resin mold apparatus according to the first embodiment, the mold clamping mechanism is used to open and close the mold. In the present embodiment, a resin mold apparatus provided with a clamp mechanism corresponding to the enlargement (WLP) of the work W in particular is described. According to the resin mold apparatus of the present embodiment, the mold closing can be performed with high precision while maintaining the parallelism of the movable platen in the mold closing operation, and the final resin pressure can be made high, thereby improving the molding quality.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a resin mold apparatus having a clamp mechanism for opening and closing a mold die according to the present invention will be described in detail with reference to the accompanying drawings. The resin mold apparatus 201 is provided with a mold metal mold 204 having a top mold 202 and a bottom mold 203 and a clamp mechanism 205 for opening and closing the mold metal mold 204.

37, the clamping mechanism 205 is provided in the base portion 206 having a rectangular shape. The base portion 206 and the stationary platen 207 are connected by a tie bar 208 disposed at each corner portion (see Fig. 38). The upper mold 202 is supported by the stationary platen 207 and the lower mold 203 is supported on the front surface (upper surface) side of the movable platen 209. The movable platen 209 is guided by the tie bar 208 which passes through and is moved up and down.

A ball screw mechanism 210 for closing the mold die 204 to the first type clamping force between the fixed platen 207 and the movable platen 209 in association with the movable platen 209 is provided on the back side of the movable platen 209, (First type opening and closing mechanism) is provided.

Specifically, the base portion 206 is provided with four screw shafts 211 at four positions on the inner side of the tie bars 208, and a first drive motor 212 for rotating the respective screw shafts 211 Are provided at four places. The first drive motor 212 is driven by synchronizing between a plurality of motors, and the speed can be controlled with high accuracy by servo control. In addition, on the back side of the movable platen 209, there are provided four fixing nuts 213 for screwing the screw shaft 211 thereinto. 38, the tie bar 208 and the screw shaft 211 are disposed at equal intervals from each other at the diagonal positions of the base portion 206 (movable platen 209). If three or more ball screw mechanisms 210 are provided, several ball screw mechanisms 210 may be provided.

A toggle link mechanism 214 (a second type opening / closing mechanism) is provided at the center of the back side of the movable platen 209. The toggle link mechanism 214 closes the mold clamping force until the clamping force is stronger than the first clamping force in conjunction with the movable platen 209 to maintain the final resin pressure. Specifically, a second drive motor 216 (servo motor) for rotationally driving the screw shaft 215 and its screw shaft 215 is provided at the center of the base portion 206. [ A movable nut 217 is screw-engaged with the screw shaft 215. The link nut 217 is integrally provided with a link connecting portion 218. Each of the drive motors 216 and 212 may be disposed on the side of the base 206 by using a belt mechanism.

The toggle link mechanism 214 increases (amplifies) the output from the second drive motor 216 by means of the toggle link structure constituted by the following link members as a so-called power mechanism, and supplies the output to the movable platen 209 Output. Specifically, one end of the connecting link 219 is rotatably connected to the link connecting portion 218. The other end of the connecting link 219 is rotatably connected to the vertex angle portion of the triangular link 220. One of the base portions of the triangular link 220 is rotatably connected to the base portion 206 and the other base portion is rotatably connected to one end of the slide link 221. The other end of the slide link 221 is rotatably connected to a connecting portion 209a provided on the back surface of the movable platen 209. [ With this structure, in the toggle link mechanism 214, the connecting portion 209a provided on the back surface of the movable platen 209 is driven by the second driving motor 216 in which the movable nut 217 is screwed .

The first drive motor 212 and the second drive motor 216 are driven and controlled by the control unit 222. [ Further, a pressure sensor 223 is provided on each tie bar 208. The control unit 222 detects the clamping pressure of the mold die 204 from the pressure sensor 223 and drives and controls the first drive motor 212 and the second drive motor 216 so that the ball screw mechanism 210 and / The mold clamping operation by the toggle link mechanism 214 is controlled.

Specifically, when the mold closing operation is started, the controller 222 drives the first drive motor 212 and the second drive motor 216 synchronously, and the ball screw mechanism 210 drives the movable platen 209 to clamp the workpiece supplied to the mold metal mold 204 by the first type fastening force and then to apply the pressurized state of the ball screw mechanism 210 to the pressurized state by the toggle link mechanism 214, The movable platen 209 is clamped by the mechanism 214 to a second type fastening force larger than the first type fastening force.

An example of the mold die 204 will be described with reference to Fig. The upper mold 202 is supported on the solid platen 7 by the upper mold base 202a. An upper die insert 202b is assembled to the upper die base 202a. A workpiece holding portion 202c for holding the workpiece W of the upper die insert 202b in a clamping face and a face side is formed.

In the lower mold 203, the lower mold base 203a is supported by the movable platen 209. A concave portion is formed on the clamping surface of the lower die base 203a. A lower mold cavity piece 203b is supported on the concave portion and a lower clamper 203c is supported by a coil spring 203d around the lower cavity piece 203b. The lower clamper 203c protrudes upward from the upper surface of the lower cavity piece 203b, and a lower cavity recess 203e is formed. The release film F is adsorbed and held so as to cover the lower mold cavity 203e.

The release film F is adsorbed and held on the upper clamp face. The release film F has a thickness of about 0.5 mm and has heat resistance and is easily peeled off from the mold surface and has flexibility and extensibility such as PTFE, ETFE, PET, FEP film , A fluorine-impregnated glass cloth, a polypropylene film, polyvinylidene chloride, and the like are suitably used.

Next, an example of the opening and closing operations of the clamp mechanism 205 and the resin mold operation will be described with reference to Figs. 37, 39A, 39B, and 40A to 40C.

37, the workpiece W is supplied to the mold metal mold 204 by a feeding device (not shown) while the mold metal mold 204 is in the mold-opened state. The lower mold cavity 203e of the lower mold 203 is previously covered with the release film F to be adsorbed and held.

The work W (for example, a substrate on which a semiconductor chip is mounted, a semiconductor wafer, or the like) is attracted and held by the work holding portion 202c of the upper mold 202, Molded resin R (liquid resin, granular resin, granular resin (powder resin), sheet resin, tablet resin or the like) is supplied to the covered lower mold cavity 203e. Further, the mold resin R may be supplied to the lower mold cavity 203e together with the release film (F).

The control unit 222 drives the first drive motor 212 and the second drive motor 216 while synchronizing them. 39A, by driving the first drive motor 212, the ball screw mechanism 210 rotates the screw shaft 211 at four positions and rotates the fixing nut 213 The movable platen 209 is screwed with the fixed platen 207 while maintaining the parallelism with respect to the fixed platen 207. That is, the lower mold 203 (specifically, the parting surface thereof) rises while maintaining parallelism with the upper mold 202 (specifically, the parting surface thereof).

Since the movable nut 217 threadedly engaged with the screw shaft 215 is moved upward by the drive of the second drive motor 216 by the toggle link mechanism 214, The connection link 219 connecting to both sides is tilted to both sides toward the horizontal direction and the triangular link 220 is rotated so as to stand up to push up the slide link 221. At this time, the toggle link mechanism 214 does not receive a load through the movable platen 209 due to the gap formed between the slide link 221 and the connecting portion 209a.

40B, the coil spring 203d is compressed while the lower clamper 203c contacts the work W (substrate) and the upper die insert 202b via the release film F, as shown in Fig. 40B. Thereby, a closed space (a reduced pressure space and a closed space) is formed in the mold 204, and the resin R is filled in the cavity 203e (cavity). In this case, the movable platen 209 is raised while maintaining the parallelism, so that the fixed platen 207 is approached while maintaining the parallelism. Therefore, the upper mold 202 and the lower mold 203 can also be clamped while maintaining the parallelism. 40, the resin R is spread toward the outside of the lower cavity concave portion 203e as in the case where the resin R is supplied to the center of the lower cavity concave 203e, 203e (cavity), the ball screwing mechanism 210 can appropriately control the mold clamping speed.

When the mold clamping is continued and the pressure sensors 223 at four locations detect the first type clamping pressure (for example, 36 tons in total; resin pressure of the mold resin R), the first drive motor 212 and stops the driving of the second drive motor 216. [ As a result, the toggle link mechanism 214 takes over the pressurized state of the movable platen 209 by the ball screw mechanism 210, and the pressure sensors 223 each press the second mold clamping force For example, 125 ton in total, final pressure) is detected. 39B, the movable nut 217 moves further upward along the screw shaft 215 and the slide link 221, which is connected via the connecting portion 209a of the movable platen 209, And is in a state of being upright together with the upper case 220. The movable platen 209 may be pressed by both the ball screw mechanism 210 and the toggle link mechanism 214 without stopping the driving of the first drive motor 212. [ The ball screw mechanism 210 may be in a state in which it is not pressurized while being driven.

At this time, as shown in Fig. 40C, the mold die 204 is pressed against the movable platen 209 with the upper die insert 202b and the lower die clamper 203c abutted with each other. Therefore, the lower die clamper 203c The coil spring 203d of the mold resin R is compressed and the mold resin R is filled in the lower mold cavity 203e and remains at the final resin pressure so that the mold resin R is heated and cured.

As described above, the work W supplied to the mold die 204 through the movable platen 209 by the ball screw mechanism 210 is clamped by the first type fastening force, so that the inside of the mold die 204 is closed Space can be formed. The toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210 and the movable platen 209 is clamped by the toggle link mechanism 214 to the second type fastening force larger than the first type fastening force , And the mold resin (R) is thermally cured by the final resin pressure.

Therefore, mold closing can be performed with high precision while maintaining the parallelism of the movable platen 209 in mold closing operation, and molding pressure can be made high, thereby improving the molding quality. That is, until the mold resin R in which the parallelism or the type fastening speed is particularly important, the mold is tightened while controlling the drive amount with high accuracy by the ball screw mechanism 210, and the mold resin R, Thereafter, the toggle link mechanism 214 that increases the output of the second drive motor 216 is clamped and pressurized, whereby the required performance can be achieved before and after the mold closing of the mold metal mold 204, respectively.

As the clamp mechanism 205 for opening and closing the mold metal mold 204, by using a toggle link mechanism 214 for increasing the output of the second drive motor 216, for example, a mechanism for increasing the output is used (The first drive motor 212 and the second drive motor 216) for driving the mechanism can be used as compared with the case in which the mold opening and closing operation is performed using only the direct drive mechanism without using a screw By reducing the diameter of the shaft 211, the apparatus can be downsized, power consumption can be reduced, and the manufacturing cost can be reduced. Therefore, it is possible to cope with the enlargement of the work W at a lower cost.

40A to 40C, the workpiece W is held in the upper mold 202 of the mold metal mold 204 and the mold resin R is supplied to the cavity formed in the lower mold 203. However, .

That is, in Fig. 41A, the upper mold 202 is supported by the stationary platen 207 on the upper mold base 202a. The upper mold base 202a is provided with a concave portion on the clamping surface thereof. The upper mold cavity piece 202d is supported on the concave portion, and the upper clamper 202e is pressed and supported by the coil spring 202f have. The upper mold clamper 202e protrudes downward from the lower surface of the upper mold cavity piece 202d, and an upper mold cavity 202g is formed. The release film F is adsorbed and held to cover the upper mold cavity recess 202g.

In the lower mold 203, the lower mold base 203a is supported by the movable platen 209. A lower die insert 203f is assembled to the lower die base 203a. A work holding portion 203g for holding the work W in a clamping face and a face work is formed in the lower die insert 203f.

The workpiece W (e.g., a substrate on which a semiconductor chip is mounted, a semiconductor wafer, or the like) is held by the workpiece holding portion 203g of the lower die 203 while the mold metal mold 204 is in the die- And a mold resin R (a liquid resin, a granular resin, a mouth resin (powder resin), a sheet resin, a tablet resin, etc.) is supplied. The mold resin R may be supplied to the work holding portion 203g after being supplied on the work W in advance. The upper mold cavity 202g of the upper mold 202 is covered with the release film F to be adsorbed and held.

The upper clamper 202e is moved to the work W (substrate) and the lower die insert 203f via the release film F as shown in Fig. 41B, when the mold closing operation is started by driving the ball screw mechanism 210, The coil spring 202f is compressed. Thus, the mold resin (R) is filled in the upper mold cavity (202g) with the closed space (reduced pressure space and closed space) formed in the mold metal mold (204).

When the mold metal mold 204 reaches the first mold clamping force and the ball screw mechanism 210 pressurizes the toggle link mechanism 214, the mold metal mold 204, as shown in Fig. 41C, The coil spring 202f of the upper type clamper 202e is in a compressed state because the lower plate type insert 203f and the upper type clamper 202e are in contact with each other and the pressing force against the movable platen 209 is strengthened, The resin pressure rises to become the final clamping pressure, and the mold resin R is kept at the predetermined resin pressure while the mold resin R is heated and cured.

The control unit 222 drives the ball screw mechanism 210 and the toggle link mechanism 214 in synchronism with each other when the mold closing operation is started and the ball screw mechanism 210 drives the movable platen 209 The workpiece W supplied to the mold metal mold 204 is clamped by the first type clamping force to mold the mold metal mold 204 and form a closed space in the mold metal mold 204. [ The toggle link mechanism 214 takes over the pressurized state by the ball screw mechanism 210 and the movable platen 209 is clamped by the toggle link mechanism 214 to the second type fastening force larger than the first type fastening force , And the mold resin (R) can be thermally cured by the final resin pressure.

Therefore, in the same manner as in the above-described mold configuration, the resin mold apparatus 201, which is compact and can be fastened at a low cost, while maintaining the parallelism and the type fastening speed of the mold die 204 in correspondence with the enlargement of the work W, Can be provided. In place of the toggle link mechanism 214, a hydraulic press mechanism may be provided. In this case as well, the mold closing can be performed with high precision while maintaining the parallelism of the movable platen 209 in the mold closing operation, and the final resin pressure can be made high, thereby improving the molding quality. In place of the toggle link mechanism 214, another power mechanism may be provided.

The movable platen 209 is driven by the above-described ball screw mechanism 210 to perform a mold opening / closing operation, thereby clamping the mold. In addition, the toggle link mechanism 214 described above, Only the piece 203b may be pressurized and driven. In this case, a through hole is formed in the lower die base 203a and the movable platen 209, and a pressing member for pressing the lower cavity piece 203b is passed through the through hole and is connected to the connecting portion 209a So that the lower cavity piece 203b can be separately driven. According to this, since the pressing force and the clamping force of the resin R by the lower cavity piece 203b can be individually controlled, the clamping force can be suppressed while arbitrarily increasing the resin pressure, It may be molded without lowering the resin pressure. Depending on the required pressing force, the driving state can also be switched by driving only by the ball screw mechanism 210 and by the ball screw mechanism 210 and the toggle link mechanism 214. Further, the lower mold cavity 203b can be raised singularly and protruded from the lower mold 203, thereby facilitating mold cleaning.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Various modifications are possible within the scope of the invention.

In the first embodiment, a case where a granular resin is used as the resin (R) has been described. The resin (R) may be a film-like resin, or a film-like resin having a different size may be laminated so as to have a mountain shape.

Specifically, molding using a workpiece W and a resin R as shown in Figs. 28 and 29 can be employed. As shown in these drawings, as the work W, a chip component 11 is flip chip mounted on a substrate 10 can be used. In this case, as the resin (R), a film-shaped resin having a center convex shape may be used, or a granular resin supplied with a convex center may be used. In this case, in the process of supplying the workpiece W and the resin R and then molding the same, as shown in Fig. 29, in the process of additional clamping after mold closing, the chip component 11 Is immersed in the resin (R) in order from the chip component (11) at the center when the resin (R) is immersed in the molten resin (R). At this time, the melted resin (R) flows from the center of the substrate (10) to the outer circumferential side. Therefore, when the chip component 11 is sealed with the flip-chip mounted workpiece W, the underfill between the chip component 11 and the substrate 10 is facilitated.

In the first embodiment, a plurality of troughs 123 are used in the resin supply unit 120 to simultaneously supply the same amount of resin R onto the release film F as the resin supply region (Mounted). The present invention is not limited thereto. Instead of the plurality of troughs 123, a dispenser having a multiple nozzle capable of supplying a resin having fluidity such as granular resin or liquid resin may be used. According to this, it is possible to prevent the supply time from being prolonged due to an increase in the resin supply amount (enlargement of the resin supply region). It is also possible to distribute the nozzles to the resin supply region, for example, so as to uniformly supply the resin by making the resin supply uneven.

In the first embodiment, a case has been described in which the lower mold cavity piece 34 is relatively moved with respect to the lower clamper 35 by expanding and contracting the elastic member 50 in accordance with the mold opening and closing of the mold clamp mechanism. The present invention is not limited to this, and a mechanism for varying the height of the lower clamper 35 driven separately from the clamping mechanism may be used.

As a variable mechanism of the cavity height, for example, a lower mold cavity piece 34 is connected to a drive source and is movably assembled to a lower mold base 46 of a mold die 30, and a lower mold clamper 35 is mounted on a lower mold base 46 And then assembled.

As a variable mechanism of the cavity height, a plate thickness adjusting block (taper block) having an interface with a tapered surface (tapered surface) is interposed between the lower die cavity piece 34 and the lower die base 46 to provide a wedge portion, One of the plate thickness adjusting blocks may be configured to be slidable by a drive source such as an air cylinder or a motor.

In the first embodiment described above, the case where the film loader 57 is connected to the suction portion 67 only from the holding surface 64 and sucked air is described (see FIG. 3). The present invention is not limited to this. The film loader 57a may be constructed so as to be air-suctionable in the recess 66, or may be configured to be pressurizable by filling the recess 66 with air. Specifically, the film loader 57a as shown in Figs. 30 to 32 can be used. 30 to 32, the upper die 31 (see Fig. 3) is omitted.

30, when the release film F on which the resin R is mounted is transported, the film loader 57a is provided with an air path 65a having the same function as the air path 65 shown in Fig. 3, Suction or pressurization is performed from the air path 65b connecting the suction / pressurizing portion 67b and the concave portion 66, which are different from the suction / pressurizing portion 67b. Concretely, by pressing the release film F by the weight of the resin (R) and the suction force (negative pressure) by the suction part (67a), the weight of the release film (F) Warpage can be prevented.

31 and 32, when the release film F is arranged in the cavity 33, air is supplied from the suction / pressurizing portion 67b The release film F may be folded by filling the air in the concave portion 66 and pressing it. The release film F is made to conform to the shape of the cavity 33 by suction from the portion corresponding to the corner portion of the cavity 33 so that the release film F is formed on the end face of the cavity piece 34 F can be pushed outwardly while pushing out the wrinkles of the wrinkles, thereby preventing occurrence of wrinkles more reliably. At this time, heated air can be used as the air to be filled in the concave portion 66, and generation of wrinkles can be prevented without lowering the mold temperature. Since the release film F is also heated, the release film F can be more reliably attached to the shape of the cavity 33. [

In the first embodiment, the film loader 57 has been described by way of example in which the release film F on which the resin R is mounted is disposed on the lower die 32. However, the present invention is not limited to this, It may be disposed in the upper die 31 as well. In this case, the mold metal mold 30 in the resin mold apparatus 100 has a configuration such that the lower mold 32 and the upper mold 31 are inverted upside down, and the lower mold (equivalent to the first mold in the present invention) And a top mold (corresponding to the second mold in the present invention) in which the cavity is formed are closed, and the work W is resin-molded by the resin filled in the cavity. As with the lower mold 32 in the first embodiment, the upper mold has a cavity piece constituting a bottom portion of the cavity recess, a clamper constituting a side portion of the cavity recess, and a cavity piece relatively moving the clumpper And a suction part for sucking and adsorbing the release film (F) disposed so as to cover the end face of the cavity piece and the end face of the clamper. The film loader carries the release film F in a flat state in the same manner as the film loader 57 in the first embodiment and also conveys the end face of the cavity piece and the end face of the clamper at the same height The release film F is placed on the end face of the cavity piece and the end face of the clamper while keeping the release film F in a flat state. According to the resin mold apparatus 100 as described above, even when the resin R is not carried into the press section 130 together with the resin R, the resin mold apparatus 100 can be arranged while preventing occurrence of wrinkles.

In the first embodiment, a case has been described in which the granular resin (R) is supplied to the release film (F) in the resin supply unit (120). The present invention is not limited thereto, and the resin supply unit 120 may supply the liquid resin R. In this case, after the resin supplying section 120 supplies the liquid resin R onto the work W, the robot mechanism section 180 may carry the work W into the press section 130. In addition, the resin supply unit 120 may supply the resin R in the form of a sheet. In this case, the robot mechanism unit 180 is configured so that the sheet-like resin R supplied by the resin supply unit 120 is overlapped with the release film F or the work W, It may be carried into the press section 130 only.

The workpiece W may be a plate-like member such as the wafer itself on which the chip component 11 or the bump 11A is not mounted, if there is a surface that needs to be protected. The surface of such a plate-shaped member may have a concave-convex shape or a flat surface.

Claims (14)

A resin mold apparatus for mold-closing a lower mold on which an upper mold and a cavity are formed and molds a work by a resin filled in the cavity,
The lower mold includes a lower cavity piece constituting a bottom portion of the cavity, a lower clamper constituting a side portion of the cavity, a loader capable of holding and carrying the film on which the resin is mounted, And an adsorption portion for adsorbing the film disposed so as to cover the end face of the lower clamper,
Wherein the lower cavity piece is configured to be movable relative to the lower clamper,
The loader is arranged such that the film is disposed on the lower mold in which the end face of the lower cavity piece and the end face of the lower clamper are held horizontally so that the resin is positioned on the lower cavity piece,
Wherein the adsorbing portion sucks and holds the film following the inner surface of the cavity, and supplies the resin to the cavity. The method according to claim 1,
Wherein the loader is connected to a holding surface for holding the film, a concave portion recessed from the holding surface, which is a avoiding portion of the resin mounted on the film, and a holding surface around the concave portion, And a hand portion having an air path to which the air is supplied. 3. The method of claim 2,
Wherein the loader includes a roll-shaped shutter portion capable of opening and closing the holding surface, and the film is supported and transported by the shutter portion in the closed state of the shutter portion, and the film is placed on the lower portion in the opened state of the shutter portion Wherein the resin mold apparatus comprises: 4. The method according to any one of claims 1 to 3,
Wherein the loader includes a heating unit and a cooling unit. The method according to claim 1,
An upper portion of the lower cavity piece is detachably installed,
An upper portion of the lower clamper is detachably installed,
An upper portion of the lower cavity piece and an upper portion of the lower clamper are connected by a connecting member,
Wherein the loader is arranged so as to cover the end face of the upper portion of the lower cavity piece and the upper face of the lower clamper in a state in which the upper end face of the lower cavity piece and the upper end face of the lower clamper are horizontal, And the resin is transferred. The method according to claim 1,
Shaped upper and lower plates,
Wherein the lower plate has a stepped portion extending in a circumferential direction concave from the surface of the upper plate side at the peripheral edge,
Wherein the upper plate and the upper plate are fitted to each other so that the film is sandwiched between the upper plate and the lower plate,
Wherein the lower clamper is formed with a stepped portion extending in the circumferential direction concave from the end face at the peripheral edge end and the inner plate portion of the lower plate is fitted to the stepped portion of the lower clamper, Resin mold device. The method according to claim 1,
An upper portion of the lower cavity piece is detachably installed,
Wherein an upper portion of the lower cavity piece is floated and supported so that the end face of the lower cavity piece and the end face of the lower clamper are horizontal when the mold is opened. 8. The method according to any one of claims 1 to 7,
Wherein the lower clamper is provided with a plurality of fins floatingly supported so as to protrude from an end face of the lower clamper,
Wherein the plurality of pins protrude from an end surface of the lower clamper to support the work and are received in the lower clamper when the work is clamped. A second mold having a first mold and a cavity recess formed therein is closed to mold the work with the resin filled in the cavity,
And the second type includes a cavity piece constituting a bottom portion of the cavity, a clamper constituting a side portion of the cavity concave portion, a movable portion relatively moving the cavity piece with respect to the clamper, And an adsorption portion for adsorbing a film disposed so as to cover an end face of the clamper,
The film is transported in a flat state and a loader for positioning the end face of the cavity piece and the end face of the clamper at the same height while placing the film in a flat state on the end face of the cavity piece and the end face of the clamper Wherein the resin mold apparatus comprises: 1. A resin mold method for mold-closing a lower mold on which an upper mold and a cavity are formed by using a resin mold apparatus, and resin-filled the resin in the cavity,
Wherein the lower mold comprises a lower cavity piece constituting a bottom of the cavity, a lower clamper constituting a side of the cavity, a loader capable of holding and carrying the film on which the resin is mounted, And an adsorption portion for adsorbing the film disposed so as to cover the end face of the lower clamper,
(a) disposing the film so that the resin is positioned on the lower cavity piece by the loader on the lower mold in which the end face of the lower cavity piece and the end face of the lower clamper are held horizontally,
(b) While the film is being sucked by the adsorbing portion, the lower cavity piece is relatively moved with respect to the lower clamper to form the cavity, thereby adsorbing and holding the film while following the inner surface of the cavity And supplying the resin to the cavity concave portion as it is. A resin mold apparatus having a clamp mechanism for opening and closing a mold die,
The clamp mechanism includes:
A movable platen for supporting at least one of the molds;
A stationary platen for supporting the other mold,
A first type opening / closing mechanism for closing the mold metal between the stationary platen and the movable platen;
A second type opening / closing mechanism that closes the second type clamping force to maintain the final resin pressure in cooperation with the movable platen to a second type clamping force in which the clamping force is stronger than the first type clamping force,
And a control unit for controlling opening and closing operations of the first and second mold opening and closing mechanisms,
Wherein when the mold closing operation is started, the control unit drives the first and second mold opening / closing mechanisms in synchronism, and the work supplied to the mold through the movable platen by the first type opening / And the second mold opening / closing mechanism takes over the pressurized state of the first type opening / closing mechanism and is clamped by the mold clamping force to the mold clamping force through the movable platen until the work is moved to the second mold clamping force, Is clamped by means of a clamping mechanism. 12. The method of claim 11,
Wherein the first type opening and closing mechanism is disposed at equal intervals along the outer peripheral edge of the movable platen and the second type opening and closing mechanism is disposed at a central portion of the movable platen. There is provided a resin mold apparatus including a clamping mechanism configured to be capable of opening and closing a mold die by lifting a movable platen supporting the other mold of the mold die with respect to a stationary platen supporting one of the molds of the mold die,
The clamp mechanism includes:
A toggle link mechanism connected to the center of the movable platen,
And three or more ball screw mechanisms arranged at regular intervals along the outer peripheral edge of the movable platen and connected to the movable platen at the arranged positions. A resin mold method for resin molding by opening and closing a mold metal by using a clamp mechanism including a movable platen supporting one of the molds and a stationary platen supporting the other mold,
A step of supplying a work and a resin to the mold die which has been opened,
Wherein when the work is clamped by the mold clamping force by the mold clamping force by the first type opening and closing mechanism by synchronizing the first type opening and closing mechanism and the second type opening and closing mechanism associated with the movable platen, A step of closing the mold,
Closing the first mold opening / closing mechanism by the second mold opening / closing mechanism to actuate the platen to clamp the mold mold to a second mold clamping force larger than the first mold clamping force;
And heating and curing the resin while maintaining the final resin pressure in which the mold die is clamped by the second mold clamping force.

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