JP6342566B1 - Component holding device and component joining system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an appropriate working state in a joining work with a simple configuration. An arrangement case in which an object to be joined holds a joined work to be joined to the joined body by a joining material, and the joined work is arranged in an internal space; and a cover that is joined to the arrangement case via a sealing member A connecting portion made elastically deformable or extendable to at least one of the arrangement case or the cover, a support portion connected to one end portion of the connecting portion, and the other end portion of the connecting portion connected to the connecting portion. A movable portion that is movable in the vertical direction with respect to the support portion in accordance with deformation or expansion / contraction is provided, and the internal space is formed as a sealed space in a state where the arrangement case and the cover are coupled. [Selection] Figure 2

Description

  The present invention relates to a technical field relating to a component holding device that holds a bonded workpiece in which a workpiece is bonded to a bonded body by a bonding material.

  As a method for bonding an object to be bonded such as a semiconductor element, for example, an electronic component to a bonded body, for example, a substrate, there is a bonding method using solder. The soldering method is that electronic components can be joined in a short time, the solder has high reliability in thermal distortion caused by temperature changes, and multiple electronic components are joined at once by reflow. This is advantageous in that it is possible.

  However, in the joining method using solder, it is difficult to join a plurality of electrode terminals of an electronic component at fine intervals, and the electrical conductivity and thermal conductivity of solder are lower than that of silver or the like. It has a drawback in that it is low.

  On the other hand, as a method for joining a joined body such as an electronic component to a joined body such as a substrate, there is a method by solid phase diffusion bonding in which bonding is performed by heating or pressurizing or applying ultrasonic vibration (for example, a patent) Reference 1).

  The method by solid phase diffusion bonding is a bonding method that utilizes the diffusion phenomenon of atoms that occur between metals (electrodes) that do not melt by heating or pressurization under certain conditions, and is generally several hundred degrees lower than the melting point of the metal. It is performed under temperature conditions, and it is possible to lower the temperature in the joining operation as compared with the joining method using solder.

  As a method by such solid phase diffusion bonding, for example, there is a method in which a metal paste is applied between an electrode terminal of an electronic component and an electrode of a substrate and the metal paste is sintered and bonded.

  The method by solid phase diffusion bonding has the advantage that it has good heat resistance and can ensure high electrical conductivity and thermal conductivity. Therefore, solid-phase diffusion bonding is particularly useful for high-intensity LEDs (Light) in addition to next-generation power semiconductors such as SiC (silicon carbide) and GaN (gallium nitride) that require good thermal and electrical characteristics. This is a bonding method that can be used in a wide range of fields such as connection of Emitting Diodes and bonding in LSI (Large Scale Integration).

  On the other hand, the solid phase diffusion bonding has a drawback that it requires a longer time than the soldering time in order to cause a high diffusion pressure and a sufficient diffusion reaction.

  In addition, as a method of bonding a bonded body such as an electronic component to a bonded body such as a substrate, there is a liquid phase diffusion method that breaks the surface film. The liquid phase diffusion method is a method in which a low melting point metal is melted and diffused using a metal paste containing a plurality of types of metals as a bonding material, and the remelting temperature is reduced to a low melting point metal and solder. It is possible to make it higher than the melting point of.

  When an oxide film is present on the surface of the bonding material, the bonded body, or the bonded body, it is difficult to bond the bonded body and the bonded body in solid phase diffusion bonding, but in the method using liquid phase diffusion, the bonding material Bonding is possible by breaking the surface coating of the film and generating a new surface. As a method of generating a new surface in the bonding material, there are a method of applying ultrasonic vibration and a method of breaking a film by deforming a metal by heating or pressurization.

  In liquid phase diffusion bonding, the low melting point metal contained in the bonding material is melted, the high melting point bonding material and the metal of the bonded body are rapidly diffused, and the high melting point bonding material and the bonded metal are bonded together. Join by rapidly diffusing to form an alloy (intermetallic). The resulting alloy, after being cooled and solidified, becomes a high melting point solder, which does not remelt at the temperature of the low melting point metal, and liquid phase diffusion bonding is performed by transient liquid phase (TLP) sintering. Some are called.

  Further, as a method by diffusion bonding, there is also a method in which pressure is applied in a state where the object to be bonded and the bonded body are sandwiched and put into a vacuum oven or the like and heated to perform bonding (see, for example, Patent Document 2).

JP 2010-118534 A JP 2014-179422 A

  By the way, in the joining method by soldering or diffusion as described above, it is necessary to heat and pressurize the joining portion (electrode terminal or electrode) or joining material of the joined body and the joined body. When this is performed, it is necessary that the object to be joined is held at an appropriate position with respect to the joined body. In addition, since it is desirable that the bonding of the object to be bonded to the bonded body is performed in a state where no oxide film exists on the surface of the bonding material, the bonded body, or the bonded body, vacuum or inert gas is used as an environment in which the bonding operation is performed Or in a reducing gas atmosphere.

  Thus, it is necessary to perform joining work by soldering or diffusion in a state where an appropriate position and an appropriate environment for the joined body are secured, and such a position and environment can be easily secured. It is desirable that

  Therefore, an object of the present invention is to overcome the above-described problems and realize an appropriate working state in the joining work with a simple configuration.

1stly, the components holding apparatus which concerns on this invention is a components holding apparatus which hold | maintains the joining workpiece | work to which a to-be-joined body is joined to a conjugate | zygote with a joining material, Comprising: The arrangement | positioning case where the said joining workpiece | work is arrange | positioned in internal space And a cover coupled to the arrangement case via a sealing member, and at least one of the arrangement case or the cover, a connecting portion that is elastically deformable or extendable, and one end of the connecting portion And a movable part that is connected to the other end of the connecting part and is movable in the vertical direction with respect to the supporting part in accordance with deformation or expansion / contraction of the connecting part. It said cover the internal space in the state in which is coupled is formed as a closed space and, the movable portion is formed of a material having a thermal conductivity, pressure head is pressed with a heater to the movable portion The pressure of the pressure head in the joint work via the movable portion is given by, heat of the heater to the joint work is shall be transmitted through the movable portion.

Thereby, in a state where the movable part is movable in the vertical direction, the joining case is arranged in the internal space formed as a sealed space by combining the arrangement case and the cover , and the movable part is in contact with the joined work. Heat can be transmitted to the bonded workpiece via the movable portion, and the bonded workpiece is pressurized and heated while the movable portion is in contact with the bonded workpiece.

  Secondly, in the above-described component holding device according to the present invention, it is preferable that the support portion, the movable portion, and the connecting portion are provided on the cover.

  Thereby, a joining workpiece | work is not moved at the time of a movement of a movable part.

  Thirdly, in the above-described component holding device according to the present invention, it is desirable that the joined body is pressed by the movable portion in a state where the arrangement case and the cover are coupled.

  Thereby, before a to-be-joined body is joined to a joined body, a to-be-joined body is displaced with respect to a joined body, and position shift does not arise.

  Fourthly, in the above-described component holding device according to the present invention, it is preferable that a bellows member formed of a metal material is used as the connecting portion.

  Thereby, a support part and a movable part are connected with a metal material.

Fifth , in the component holding device according to the present invention described above, the arrangement case is formed of a material having thermal conductivity, and the arrangement case has a heater in a state where the pressure head is pressed against the movable portion. It is desirable to be placed on a heating stage.

  Thereby, the joining work is heated by the pressure head and the heating stage.

Sixth , in the above-described component holding device according to the present invention, it is desirable that the internal space is evacuated.

  As a result, the joining work of the joined body to the joined body is performed in a state in which the internal space is evacuated, so that an oxide film is generated on the joined portion of the joined body, the joined portion of the joined body, and the surface of the joining material. It becomes possible to suppress.

Seventh , in the above-described component holding device according to the present invention, it is desirable that the internal space be filled with a gas having a reducing action.

  As a result, since the joining operation of the joined body to the joined body is performed in a state where the internal space is filled with the gas having a reducing action, the joining portion of the joined body, the joined portion of the joined body, and the surface of the joining material are generated. The oxide film can be removed.

Eighth , in the above-described component holding device according to the present invention, it is desirable that the internal space is filled with an inert gas.

  As a result, since the joining work to the joined body of the joined body is performed in a state where the inner space is filled with the inert gas, the joined portion of the joined body, the joined portion of the joined body, and the oxide film on the surface of the joining material Can be suppressed.

Ninth , a component bonding system according to the present invention includes a component holding device that holds a bonded workpiece in which a workpiece is bonded to a bonded body by a bonding material, and a heating and heating unit that heats and heats the component holding device. A component joining system including a heating and pressurizing device for performing pressure, wherein the component holding device is coupled to the placement case through a placement case in which the joining work is placed in an internal space and a sealing member. A connecting portion that is elastically deformable or stretchable to at least one of the arrangement case or the cover, a support portion to which one end portion of the connecting portion is connected, and the other end of the connecting portion. And a movable part that is movable in the vertical direction with respect to the support part in accordance with deformation or expansion / contraction of the connection part, and the internal space is in a state where the arrangement case and the cover are coupled. It is formed as a closed space, the one in which the pressure and heat in a state in which the bonding work has been pressed by the movable portion pressing head is moved by being pressed is performed.

  Thereby, in the component holding device, in a state where the movable portion can move in the vertical direction, the joining work is placed in the internal space formed as a sealed space by combining the placement case and the cover.

According to the component holding device and the component joining system of the present invention, in a state in which the movable part can move in the vertical direction, the placement case and the cover are combined and the joined work is placed in the internal space formed as a sealed space , Heat can be transferred to the bonded workpiece through the movable portion when the movable portion is in contact with the bonded workpiece, and the bonded workpiece is pressurized and heated while the movable portion is in contact with the bonded workpiece. An appropriate work state in the work can be realized with a simple configuration.

2 to 20 show a component holding device and a component joining system according to the present invention, and this drawing is an exploded perspective view of the component holding device. It is sectional drawing of the components holding apparatus shown in the state from which the arrangement | positioning case and the cover were isolate | separated. It is sectional drawing of the component holding apparatus shown in the state combined with the arrangement | positioning case. It is sectional drawing of the component holding device which shows the state by which the cover was couple | bonded with the arrangement | positioning case and the to-be-joined body was hold | suppressed by the cover. It is sectional drawing which shows the component holding device which concerns on a 1st modification in the state by which the cover was opened. It is sectional drawing which shows the component holding device which concerns on a 1st modification in the state by which the cover was closed. It is sectional drawing which shows the components holding apparatus which concerns on a 2nd modification. It is sectional drawing which shows the components holding apparatus which concerns on a 3rd modification. It is sectional drawing which shows the components holding apparatus which concerns on a 4th modification. It is sectional drawing which shows the components holding apparatus which concerns on a 5th modification. It is a perspective view which shows a joining system. It is an expansion perspective view which shows a part of heating-pressing apparatus in the state before mounting a component holding device. It is an expansion perspective view which shows a part of heating-pressing apparatus in the state in which the component holding device was mounted. It is a top view which shows the state before the operation | movement of a conveyance part is started. FIG. 15 is a plan view illustrating a state in which the conveying unit is operated and one of the component holding devices is moved forward, following FIG. 14. FIG. 16 is a plan view illustrating a state in the middle of rotation of the transport unit and the like following FIG. 15. FIG. 17 is a plan view illustrating a state where the transport unit and the like are rotated 180 degrees following FIG. 16. FIG. 18 is a plan view showing a state in which the other component holding device is moved rearward, following FIG. 17. FIG. 19 is a cross-sectional view illustrating a state in which the movable part is pressed by the pressure head and the bonded workpiece is pressed subsequent to FIG. 18. It is a perspective view which shows the example of another heating-pressing apparatus.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention component holding | maintenance apparatus and component joining system is demonstrated with reference to an accompanying drawing.

<Configuration of component holding device>
First, the structure of the component holding device 1 will be described (see FIGS. 1 to 4).

  The component holding device 1 includes an arrangement case 2, a cover 3, and a sealing member 4 (see FIGS. 1 and 2).

  The arrangement case 2 is formed in a shallow box shape opened upward by a metal material having high thermal conductivity, and includes a bottom wall portion 5 facing upward and a peripheral wall portion 6 projecting upward from an outer peripheral portion of the bottom wall portion 5. have.

  The bottom wall portion 5 has a bottom plate portion 5a positioned on the lower side and a lower tool 5b attached to the upper surface of the bottom plate portion 5a. The lower tool 5b is formed in a flat plate shape. The lower tool 5b may be detachable from the bottom plate portion 5a or may be formed integrally with the bottom plate portion 5a.

  The cover 3 includes a support portion 7 formed in a frame shape, a movable portion 8 formed in a flat plate shape facing in the vertical direction, and a connecting portion 9 that connects the support portion 7 and the movable portion 8.

  The movable portion 8 is made of a metal material having high thermal conductivity, and is smaller than the outer shape of the support portion 7 and larger than the inner shape of the support portion 7.

  The movable portion 8 has a base plate portion 8a positioned on the upper side and upper tools 8b, 8b,... Attached to the lower surface of the base plate portion 8a. The upper tools 8b, 8b,. Are attached to the base plate portion 8a. The upper tools 8b, 8b, ... are formed in a flat plate shape. The upper tools 8b, 8b,... May be detachable from the base plate portion 8a, or may be formed integrally with the base plate portion 8a.

  The connecting portion 9 is configured to be elastically deformable or extendable in the vertical direction. As the connection part 9, the bellows member formed of the metal material called a bellows is used, for example. The connecting portion 9 is formed in a frame shape as a whole, the upper end portion is coupled to the lower surface of the inner peripheral portion of the support portion 7, and the lower end portion is coupled to the upper surface of the outer peripheral portion of the base plate portion 8 a of the movable portion 8. Accordingly, the movable part 8 is movable in the vertical direction with respect to the support part 7 by the expansion and contraction of the connecting part 9.

  As described above, since the bellows member formed of a metal material is used as the connecting portion 9, the support portion 7 and the movable portion 8 are connected by the metal material, and the support portion 7 and the movable portion 8 are stably connected. Can be secured. Moreover, the high durability and heat resistance of the connection part 9 are securable by forming the connection part 9 with a metal material.

  The connecting portion 9 is not limited to a bellows member formed of a metal material as long as it is configured to be elastically deformable or expandable, and may be a bellows member formed of a rubber material or a resin material, such as rubber. An annular (frame-like) elastic member formed by

  The sealing member 4 is formed in an annular shape (frame shape), for example, with a rubber material, and is formed in substantially the same size as the peripheral wall portion 6 of the arrangement case 2. The sealing member 4 is attached to the lower surface of the support portion 7. The sealing member 4 may be attached to the upper surface of the peripheral wall portion 6. Further, the sealing member 4 may be formed of an elastic metal material having a hollow cross section.

  A communication pipe 10 is provided in the component holding device 1. For example, the communication pipe 10 is attached to the peripheral wall portion 6 of the arrangement case 2. A flow hole (not shown) communicated with the communication pipe 10 is formed in the peripheral wall 6, and the communication pipe 10 communicates with the internal space 2 a of the arrangement case 2 through the flow hole. The communication pipe 10 may be attached to the cover 3 and a flow hole may be formed in the cover 3. In this case, in a state where the cover 3 is coupled to the arrangement case 2, the communication pipe 10 is communicated with the internal space 2 a through the flow hole of the cover 3.

  A pinch cock 11 is connected to the communication pipe 10, and the communication pipe 10 is opened and closed by operating the pinch cock 11.

  The joining workpieces 100, 100,... Are arranged in the arrangement case 2 of the component holding device 1 configured as described above. .. Are held in the component holding device 1 by being placed in the internal space 2a of the placement case 2 and placed on the lower tool 5b. In addition, the number of the workpieces 100 arranged in the internal space 2a is arbitrary, and may be one or plural.

  The bonded workpiece 100 includes a bonded body 101 such as a substrate and bonded bodies 102, 102,... Such as electronic components, and before the bonded bodies 102, 102,. It is arranged in the internal space 2a in a state. The joined bodies 102, 102,... Are joined to the joined body 101 by a joining material (not shown) by a joining operation described later. Note that the number of objects to be bonded 102 bonded to the bonded body 101 is arbitrary, and may be one or more.

  The bonded body 101 is, for example, a substrate, a heat sink, or the like, and the bonded body 102 is, for example, an electronic component or the like. Specifically, for example, SiC (silicon that requires good thermal characteristics and electrical characteristics) is used. -Next-generation power semiconductors such as carbide) and GaN (gallium nitride). For example, solder or metal paste is used as the bonding material.

  In the bonded body 102, for example, an electrode terminal (bump) provided on the lower surface side is bonded to an electrode provided on the upper surface side of the bonded body 101 by a bonding material, and bonding is performed by soldering, solid phase diffusion, or liquid phase diffusion. By the method.

  The electrode terminal of the joined body 102 and the electrode of the joined body 101 are formed of, for example, copper or an alloy containing copper as a main component. The bonding material is solder or metal paste, but the solder is an alloy such as tin, lead, copper, silver, gold, zinc, antimony, nickel, and the metal paste is silver, copper, lead, gold, tin, platinum or Contains one or more metals such as nickel and has a certain fluidity. Accordingly, the electrode terminal of the bonded body 102, the electrode of the bonded body 101, and the bonding material may all generate an oxide film on the surface when exposed to oxygen, but there is a problem that the oxide film decreases the bonding property. is there.

  In the component holding device 1, the cover 3 is detachable from the arrangement case 2 (see FIGS. 2 and 3).

  The cover 3 is coupled to the arrangement case 2 via the sealing member 4, and when the cover 3 is coupled to the arrangement case 2, the coupling state of the cover 3 to the arrangement case 2 is maintained by a lock mechanism (not shown). In a state where the cover 3 is coupled to the arrangement case 2, the sealing member 4 is positioned between the peripheral wall portion 6 of the arrangement case 2 and the support portion 7 of the cover 3, and the lower surface of the support portion 7 is the sealing member 4. And the sealing member 4 is pressed against the upper surface of the peripheral wall 6 (see FIG. 3).

  Therefore, the sealing member 4 is positioned between the peripheral wall portion 6 and the support portion 7 in an elastically deformed state, and the space between the arrangement case 2 and the cover 3 is sealed by the sealing member 4. By sealing the space between the arrangement case 2 and the cover 3 with the sealing member 4, the internal space 2 a becomes a sealed space.

  At this time, the movable portion 8 of the cover 3 is positioned inside the peripheral wall portion 6, and the upper tools 8b, 8b,... Are positioned directly above the workpieces 100, 100,. In the movable part 8, the lower surfaces of the upper tools 8b, 8b,... Are separated upward from the upper surfaces of the joined bodies 102, 102,. When the movable part 8 is moved downward with respect to the support part 7, the connecting part 9 is extended, and the upper tools 8b, 8b,... Are pressed against the workpieces 102, 102,.

  In the state where the cover 3 is coupled to the arrangement case 2, the movable unit 8 has the lower surfaces of the upper tools 8 b, 8 b,... In contact with the upper surfaces of the bonded members 102, 102,. , 102,... May be pressed by the movable portion 8 (see FIG. 4). At this time, a downward pressing force is not applied from the movable portion 8 to the bonded bodies 102, 102,...

  In this state where the arrangement case 2 and the cover 3 are coupled, the joined bodies 102, 102,... Are pressed by the movable portion 8, thereby the joined bodies 102, 102,. .. Are bonded to the bonded body 101 before the bonded body 101 is bonded to the bonded body 101, and the positional shift is not caused by the bonding work 101, and the bonded bodies 102, 102,. A good bonding state with respect to the bonded body 101 can be ensured.

  In addition, when the flatness of the to-be-joined bodies 102, 102,... Is low, the to-be-joined bodies 102, 102,. May be inclined with respect to the bonded bodies 101, 101,..., Or high pressure may be partially applied to the bonded bodies 102, 102,.

  Therefore, if there is such a possibility, the movable portion 8 may be positioned away from the joined bodies 102, 102,... In a state where the cover 3 is coupled to the arrangement case 2. Good (see FIG. 3).

  In addition, a sheet (not shown) having high heat conductivity may be disposed between the upper tools 8b, 8b,. In this case, the upper tools 8b, 8b,... Are pressed from above onto the workpieces 102, 102,. In addition to heat transfer, the sheet desirably has heat resistance and elasticity (cushioning property).

  When the upper tools 8b, 8b,... Are pressed against the workpieces 102, 102,... Via the sheet, the flatness of the upper surfaces of the workpieces 102, 102,. , And the upper tools 8b, 8b,... And the joined bodies 102, 102,. Therefore, when heating and pressurization to be described later are performed on the bonded workpieces 100, 100,..., High heat conductivity can be secured and uniform pressure can be applied.

<Configuration of another component holding device>
Next, the configuration of a component holding device 1A according to a first modified example having a configuration different from that of the component holding device 1 will be described (see FIGS. 5 and 6).

  The component holding device 1 </ b> A shown below is different from the component holding device 1 described above only in that it is attached to and detached from the arrangement case by rotating the cover. Only the different parts will be described in detail, and the other parts will be denoted by the same reference numerals as the same parts in the component holding device 1 and the description thereof will be omitted.

  The component holding device 1 </ b> A includes an arrangement case 2 </ b> A, a cover 3, and a sealing member 4.

  The arrangement case 2A has a bottom wall portion 5 and a peripheral wall portion 6A. In the peripheral wall portion 6A, an inner peripheral portion is provided as a pressing portion 6a, and an outer peripheral portion is provided as a standing wall portion 6b. The holding portion 6a is lower in height than the standing wall portion 6b.

  One end of the cover 3 is supported by the standing wall 6b, and is supported rotatably by the arrangement case 2A with the one end serving as a fulcrum.

  The sealing member 4 is attached to the upper surface of the pressing portion 6a. The sealing member 4 may be attached to the lower surface of the support portion 7 in the cover 3.

  In the component holding device 1A, the cover 3 is coupled to the arrangement case 2A via the sealing member 4 by rotating in the direction of closing the internal space 2a with respect to the arrangement case 2A (see FIG. 6). In a state where the cover 3 is coupled to the arrangement case 2A, the coupling state of the cover 3 to the arrangement case 2A is maintained by a lock mechanism (not shown). In a state where the cover 3 is coupled to the arrangement case 2A, the sealing member 4 is positioned between the pressing portion 6a of the arrangement case 2A and the support portion 7 of the cover 3, and the lower surface of the support portion 7 is the sealing member 4 The sealing member 4 is pressed against the upper surface of the pressing portion 6a.

  Therefore, the sealing member 4 is positioned between the pressing portion 6a and the support portion 7 in an elastically deformed state, and the space between the arrangement case 2A and the cover 3 is sealed by the sealing member 4. By sealing the space between the arrangement case 2A and the cover 3 by the sealing member 4, the internal space 2a is made a sealed space.

  In the component holding device 1A, since the cover 3 is supported by the arrangement case 2A and the cover 3 is not separated from the arrangement case 2A, the cover 3 can be prevented from being lost.

  Subsequently, a configuration of a component holding device 1B according to a second modification example having a configuration different from that of the component holding device 1 will be described (see FIG. 7).

  The component holding device 1B shown below is different from the component holding device 1 in that the arrangement case is provided with a support portion, a movable portion, and a connecting portion. Only the different parts will be described in detail, and the other parts will be denoted by the same reference numerals as the same parts in the component holding device 1 and the description thereof will be omitted.

  The component holding device 1B includes an arrangement case 2B, a cover 3B, and a sealing member 4.

  The arrangement case 2B includes a support portion 7B formed in a frame shape, a movable portion 8B formed in a flat plate shape facing in the vertical direction, and a connecting portion 9 that connects the support portion 7B and the movable portion 8B. .

  The support portion 7B includes a bottom wall portion 7a formed in a flat frame shape and a peripheral wall portion 7b protruding upward from the outer peripheral portion of the bottom wall portion 7a.

  The movable portion 8B is smaller than the inner shape of the peripheral wall portion 7b and larger than the inner shape of the bottom wall portion 7a. The movable portion 8B has a base plate portion 8a positioned on the lower side and a lower tool 8b attached to the upper surface of the base plate portion 8a. The lower tool 8b is formed in a flat plate shape. The lower tool 8b may be detachable from the base plate portion 8a or may be formed integrally with the base plate portion 8a.

  The connecting portion 9 has an upper end portion coupled to the lower surface of the outer peripheral portion of the base plate portion 8a of the movable portion 8B, and a lower end portion coupled to the upper surface of the inner peripheral portion of the support portion 7B. Therefore, when the connecting portion 9 expands and contracts, the movable portion 8B is movable in the vertical direction with respect to the support portion 7B.

  The cover 3B has a flat plate-like top wall portion 3a positioned on the upper side and upper tools 3b, 3b,... Attached to the lower surface of the top wall portion 3a. The upper tools 3b, 3b, ... are formed in a flat plate shape. The upper tools 3b, 3b,... May be detachable from the top wall 3a, or may be formed integrally with the top wall 3a.

  The sealing member 4 is attached to the lower surface of the outer peripheral portion of the top wall portion 3a. In addition, the sealing member 4 may be attached to the upper surface of the surrounding wall part 7b.

  In the component holding device 1B, the cover 3B is detachable from the arrangement case 2B.

  The cover 3B is coupled to the arrangement case 2B via the sealing member 4, and when the cover 3B is coupled to the arrangement case 2B, the coupling state of the cover 3B to the arrangement case 2B is maintained by a lock mechanism (not shown). In the state in which the cover 3B is coupled to the arrangement case 2B, the sealing member 4 is positioned between the peripheral wall portion 7b of the support portion 7B and the top wall portion 3a of the cover 3B in the arrangement case 2B. The lower surface is pressed against the sealing member 4 from above and the sealing member 4 is pressed against the upper surface of the peripheral wall portion 7b.

  Therefore, the sealing member 4 is positioned between the top wall portion 3a and the peripheral wall portion 7b in an elastically deformed state, and the space between the arrangement case 2B and the cover 3B is sealed by the sealing member 4. By sealing the space between the arrangement case 2 </ b> B and the cover 3 </ b> B by the sealing member 4, the internal space 2 a is a sealed space.

  At this time, the upper tools 3b, 3b,... Are positioned directly above the joined workpieces 100, 100,. When the movable portion 8B is moved upward with respect to the support portion 7B, the connecting portion 9 is extended, and the joined bodies 102, 102,... Are pressed against the upper tools 3b, 3b,.

  Next, a configuration of a component holding device 1C according to a third modification having a configuration different from that of the component holding device 1 will be described (see FIG. 8).

  The component holding device 1 </ b> C shown below is different from the component holding device 1 in that the arrangement case is provided with a support portion, a movable portion, and a connecting portion. Only the different parts will be described in detail, and the other parts will be denoted by the same reference numerals as the same parts in the component holding device 1 and the description thereof will be omitted.

  The component holding device 1 </ b> C includes an arrangement case 2 </ b> C, a cover 3 </ b> C, and a sealing member 4.

  The arrangement case 2C includes a support portion 7C positioned on the lower side, a movable portion 8C positioned on the upper side of the support portion 7C and formed in a frame shape, and a connecting portion 9 that connects the support portion 7C and the movable portion 8C. Have.

  The support portion 7C has a base plate portion 7c positioned on the lower side and a lower tool 7d attached to the upper surface of the base plate portion 7c. The lower tool 7d is formed in a flat plate shape. The lower tool 7d may be detachable from the base plate portion 7c or may be formed integrally with the base plate portion 7c.

  The movable portion 8C has an outer shape substantially the same as the outer shape of the base plate portion 7c in the support portion 7C.

  The connecting portion 9 has an upper end portion coupled to the lower surface of the movable portion 8C and a lower end portion coupled to the upper surface of the outer peripheral portion of the base plate portion 7c in the support portion 7C. Therefore, when the connecting portion 9 expands and contracts, the movable portion 8C is movable in the vertical direction with respect to the support portion 7C.

  The cover 3C has a flat plate-like top wall portion 3a positioned on the upper side and upper tools 3b, 3b,... Attached to the lower surface of the top wall portion 3a. The upper tools 3b, 3b, ... are formed in a flat plate shape. The upper tools 3b, 3b,... May be detachable from the top wall 3a, or may be formed integrally with the top wall 3a.

  The sealing member 4 is attached to the lower surface of the outer peripheral portion of the top wall portion 3a. The sealing member 4 may be attached to the upper surface of the movable portion 8C.

  In the component holding device 1C, the cover 3C is detachable from the arrangement case 2C.

  The cover 3C is coupled to the arrangement case 2C via the sealing member 4, and when the cover 3C is coupled to the arrangement case 2C, the coupling state of the cover 3C to the arrangement case 2C is maintained by a lock mechanism (not shown). In a state where the cover 3C is coupled to the arrangement case 2C, the sealing member 4 is positioned between the movable portion 8C of the arrangement case 2C and the top wall 3a of the cover 3C, and the lower surface of the top wall 3a is sealed. The sealing member 4 is pressed against the upper surface of the movable portion 8C while being pressed against the member 4 from above.

  Therefore, the sealing member 4 is positioned between the top wall portion 3a and the movable portion 8C in an elastically deformed state, and the space between the arrangement case 2C and the cover 3C is sealed by the sealing member 4. By sealing the space between the arrangement case 2 </ b> C and the cover 3 </ b> C by the sealing member 4, the internal space 2 a is a sealed space.

  At this time, the upper tools 3b, 3b,... Are positioned directly above the joined workpieces 100, 100,. When the movable part 8C is moved downward relative to the support part 7C, the connecting part 9 is compressed, the cover 3C is moved downward together with the movable part 8C, and the upper tools 3b, 3b,. It is pressed from above onto the workpieces 102, 102,.

  In the above description, the component holding devices 1, 1A, and 1B in which the support portion, the movable portion, and the connection portion are provided on one of the placement case and the cover are shown as examples. A component holding device 1D according to a fourth modification having a configuration in which a support portion, a movable portion, and a connecting portion are provided may be used (see FIG. 9).

Component holding device 1D, the arrangement case 2D is the same configuration as the disposition case 2B of the component holding device 1B, a cover 3D is the same configuration as the cover 3 of the component holding device 1. Accordingly, the support case 7B, the movable part 8B, and the connecting part 9 are provided in the arrangement case 2D, and the support part 7, the movable part 8, and the connecting part 9 are provided in the cover 3D.

  In the component holding device 1D, the upper tools 8b, 8b,... Can be pressed against the workpieces 102, 102,... Even if either or both of the movable part 8B and the movable part 8 are moved. Thus, it is possible to improve the flexibility of workability in the joining work. In addition, when performing a joining operation by a heating and pressing apparatus described later, it is possible to perform the joining operation in various types of heating and pressing apparatuses having different structures, thereby improving versatility.

  In the component holding devices 1B, 1C, and 1D described above, the cover can be rotated with respect to the arrangement case and the internal space 2a can be opened and closed by the cover, similarly to the component holding device 1A.

  Next, a configuration of a component holding device 1E according to a fifth modified example having a configuration different from that of the component holding device 1 will be described (see FIG. 10).

  Since the component holding device 1E shown below is different from the above-described component holding device 1 in that the shape of the cover is different and the arrangement position of the connecting portion and the sealing member is different, the component holding device 1 Only different portions will be described in detail, and the other portions will be denoted by the same reference numerals as the same portions in the component holding device 1 and description thereof will be omitted.

  The component holding device 1E includes an arrangement case 2E, a cover 3E, and a sealing member 4.

  The arrangement case 2E has a bottom wall portion 5 and a peripheral wall portion 6E. The peripheral wall 6E is formed with an annular arrangement recess 6a that opens inward. The peripheral wall portion 6E also functions as a support portion.

  The cover 3E has a movable part 8E and a connecting part 9. In addition, the connection part 9 may be provided as a part of structure of the arrangement | positioning case 2E.

  The movable portion 8E includes a base plate portion 8a facing upward and downward, upper tools 8b, 8b attached to the lower surface of the base plate portion 8a, and a peripheral plate portion 8c protruding upward from the outer peripheral portion of the base plate portion 8a. And a frame-shaped plate portion 8d protruding outward from the upper end portion of the peripheral plate portion 8c.

  The connecting portion 9 has an upper end portion coupled to the lower surface of the frame-shaped plate portion 8d and a lower end portion coupled to the upper surface of the peripheral wall portion 6E in the arrangement case 2E. Therefore, when the connecting portion 9 expands and contracts, the movable portion 8E is movable in the vertical direction with respect to the arrangement case 2E.

  The sealing member 4 is disposed on the peripheral wall portion 6E in a state where the sealing member 4 is inserted into the disposing recess 6a except for a part. The sealing member 4 is in a state in which a portion on the inner peripheral side protrudes inward from the arrangement recess 6a.

  The cover 3E is positioned in a state in which a part of the outer peripheral surface of the peripheral plate portion 8c is opposed to a part of the inner peripheral surface of the peripheral wall portion 6E, and is coupled to the arrangement case 2E via the sealing member 4 so that the peripheral plate portion 8c is The sealing member 4 is slidable. In a state where the cover 3E is coupled to the arrangement case 2E, the sealing member 4 is pressed against the peripheral plate portion 8c while being elastically deformed, and the sealing member 4 seals a space between the arrangement case 2E and the cover 3E. Stopped. By sealing the space between the arrangement case 2E and the cover 3E by the sealing member 4, the internal space 2a is made a sealed space.

  At this time, the upper tools 8b, 8b,... Are positioned immediately above the workpieces 100, 100,. When the movable portion 8E is moved downward with respect to the arrangement case 2E, the connecting portion 9 is compressed, and the upper tools 8b, 8b,... Are pressed against the workpieces 102, 102,. When the movable portion 8E is moved relative to the arrangement case 2E, the peripheral plate portion 8c of the movable portion 8E is slid on the sealing member 4.

  In the above example, the cover 3E is provided with the movable portion 8E that is moved in the vertical direction. Conversely, the arrangement case 2E is provided as a movable portion and is moved in the vertical direction with respect to the cover 3E. It may be a configuration. Moreover, although the example which the recessed part 6a for arrangement | positioning by which the sealing member 4 is arrange | positioned was formed in the surrounding wall part 6E of the arrangement | positioning case 2E was shown above, conversely, the sealing member is provided in the surrounding plate part 8c of the cover 3E. The arrangement | positioning recessed part in which 4 is arrange | positioned may be formed.

<Configuration of heating and pressurizing device>
Next, the configuration of the heating and pressing apparatus will be described (see FIGS. 11 to 13).

  The heating and pressing apparatus 20 includes a base 21, a housing 22, a cradle 23, and a joining mechanism 24. The heating and pressurizing device 20 and the component holding device 1, the component holding device 1A, the component holding device 1B, the component holding device 1C, or the component holding device 1D described above constitute a joining system 200.

  On the base 21, support columns 25, 25,... A roof 26 is attached to the upper ends of the support columns 25, 25,.

The housing 22 is positioned on the base 21 and has a work space 22a opened forward. The support columns 25, 25,... And the roof 26 are disposed inside the housing 22.

  The cradle 23 is provided so as to protrude forward from the upper end of the base 21.

  The joining mechanism 24 includes a front base table 27, a rear base table 28, a mechanism case 29, a transport unit 30, and a pressure head 31.

  The front base table 27 is disposed above the receiving table 23 via mounting legs 32. The rear base stand 28 is disposed on the base 21 and is located in the work space 22a. A heating stage 33 having a heater is mounted on the rear base table 28.

  The mechanism case 29 is disposed on the receiving table 23 between the front base table 27 and the rear base table 28. A turntable 34 is rotatably supported on the mechanism case 29. The mechanism case 29 is provided with an intake pipe 29a to which an intake hose 35 is connected and an exhaust pipe 29b to which an exhaust hose 36 is connected. The turntable 34 is positioned closer to the front base stand 27 than the center of the front base stand 27 and the rear base stand 28.

  A drive mechanism and a control mechanism (not shown) are provided inside the mechanism case 29. The driving mechanism performs the conveying operation of the conveying unit 30 and the rotating operation of the turntable 34, and the control mechanism controls the flow of air and gas sucked from the intake pipe 29a and the flow control of air and gas discharged from the exhaust pipe 29b. Is done.

  The conveyance unit 30 includes a support frame 37 formed in a shape extending in the front-rear direction, guide shafts 38 and 38 attached to the support frame 37, guided bases 39 and 39 supported by the guide shafts 38 and 38, and a guided base 39, And holding pipes 40, 40,.

  The support frame 37 has a base surface portion 37a that is long in the front and rear directions and attachment surface portions 37b and 37b that protrude upward from both front and rear end portions of the base surface portion 37a. The support frame 37 is attached to the upper surface of the turntable 34 at the center in the front-rear direction of the base surface portion 37a.

  The guide shafts 38 and 38 are axially oriented in the front-rear direction and are spaced apart from each other on the left and right. Both ends of the guide shafts 38 and 38 in the axial direction are attached to the attachment surface portions 37b and 37b, respectively.

  The guided bases 39 and 39 are supported by the guide shafts 38 and 38 so as to be movable in the front-rear direction, and are spaced apart from each other in the front-rear direction. The guided bases 39 and 39 are individually moved in the front-rear direction by a drive mechanism.

  For example, three holding pipes 40 are respectively attached to the guided bases 39 and 39. The holding pipes 40, 40, 40 are provided so as to be spaced apart from each other on the left and right sides and protrude forward or backward from the guided base 39. Negative pressure air is supplied to the holding pipes 40, 40, 40, and the component holding device 1 is sucked and held by the holding pipes 40, 40, 40. The holding pipes 40, 40, 40 are moved in the front-rear direction as the guided base 39 moves.

  Since the support frame 37 is attached to the upper surface of the turntable 34, the transport unit 30 is rotated as the turntable 34 rotates.

  The pressure head 31 has a shaft portion 41 extending in the vertical direction and a head portion 42 connected to the lower end of the shaft portion 41, and the lower end portion of the head portion 42 is provided as a heating and pressure portion 42 a having a heater. . In the pressure head 31, the shaft portion 41 penetrates the roof 26 and the head portion 42 is positioned directly above the heating stage 33. A driving source 43 is connected to the upper end portion of the shaft portion 41. The pressure head 31 is raised and lowered by the driving force of the driving source 43.

  The component holding devices 1 and 1 are placed on the front base 27 and the heating stage 33, respectively. The component holding devices 1, 1 are sucked and held by holding pipes 40, 40,... While being placed on the front base table 27 and the heating stage 33, respectively.

  The component holding devices 1A, 1A, component holding devices 1B, 1B, component holding devices 1C, 1C or component holding devices 1D, 1D may be placed on the front base stand 27 and the heating stage 33, respectively.

<Operation and joining operation of heating and pressing device>
Next, the operation of the heating and pressing apparatus 20 and the joining operation performed in the heating and pressing apparatus 20 will be described (see FIGS. 13 to 19). Below, the operation | movement and joining operation | movement at the time of using the component holding device 1 are demonstrated as an example. However, in the joining operation, any of the component holding device 1A, the component holding device 1B, the component holding device 1C, or the component holding device 1D may be used instead of the component holding device 1 .

  The component holding devices 1 and 1 are mounted on the front base table 27 and the heating stage 33 of the heating and pressurizing device 20, respectively. Hereinafter, the component holding devices 1 and 1 are mounted on the front base table 27 before the start of the joining operation. The component holding device 1 to be used will be described as a component holding device 1X, and the component holding device 1 placed on the heating stage 33 will be described as a component holding device 1Y.

  In the joining operation, first, the component holding device 1X is placed on the front base 27, and the component holding device 1Y is placed on the heating stage 33 (see FIGS. 13 and 14). At this time, the position where the component holding device 1X is placed is the mounting position, and the position where the component holding device 1Y is placed is the heating and pressing position.

  In both the component holding device 1X and the component holding device 1Y, the internal spaces 2a and 2a are closed by the covers 3 and 3, and the internal spaces 2a and 2a are sealed. Joined workpieces 100, 100,... Are arranged in the internal space 2a of the component holding device 1X and the internal space 2a of the component holding device 1Y, respectively.

  One end of a tube 44 is connected to the communication pipe 10 of the component holding device 1X in the mounting position, and the other end of the tube 44 is connected to a mechanism case 29 of the heating and pressurizing device 20. Further, another tube 44 connected to the mechanism case 29 may also be connected to the communication pipe 10 of the component holding device 1Y in the heating and pressing position.

  Subsequently, the pinch cock 11 is operated to open the communication pipe 10. When the communication pipe 10 is opened, air is sucked from the internal space 2a through the tube 44 and the exhaust hose 36, and the internal space 2a of the component holding device 1X is evacuated.

  When the internal space 2a of the component holding device 1X is evacuated, the internal space 2a is filled with gas via the suction hose 35 and the tube 44. As the gas to be filled, a reducing gas or an inert gas is used. The gas to be filled may be a mixed gas of a reducing gas and an inert gas.

  As the reducing gas, for example, formic acid gas, hydrogen gas, or the like or a mixed gas thereof is used. As the inert gas, for example, argon gas, nitrogen gas, or the like, or a mixed gas thereof is used.

  The internal space 2a of the component holding device 1X may be held in a vacuum state without being filled with gas.

  Since the internal space 2a is evacuated in this manner, the joining operation of the joined body 102 to the joined body 101 is performed in a state where the internal space 2a is evacuated. Therefore, the electrode terminals of the joined body 102 and the joined body The generation of an oxide film on the surface of the electrode 101 and the bonding material can be suppressed, and a good bonding state of the bonded body 102 to the bonded body 101 can be ensured.

  Moreover, generation of voids (bubbles) in the bonding material can be prevented by evacuating the internal space 2a.

  Further, by filling the internal space 2a with a gas having a reducing action, the joining work of the joined body 102 to the joined body 101 is performed in a state where the internal space is filled with a gas having a reducing action. Therefore, it is possible to remove the oxide film generated on the surface of the electrode terminal of the bonded body 102, the electrode of the bonded body 101, and the bonding material, and ensure a better bonding state of the bonded body 102 to the bonded body 101. can do.

  Furthermore, by filling the internal space 2a with the inert gas, the bonding work of the bonded body 102 to the bonded body 101 is performed in a state where the internal space 2a is filled with the inert gas. Accordingly, it is possible to suppress the generation of oxide films on the electrode terminals of the bonded body 102, the electrodes of the bonded body 101, and the surface of the bonding material, and a better bonded state of the bonded body 102 to the bonded body 101. Can be secured.

  Subsequently, the pinch cock 11 is operated to close the communication pipe 10, and the gas filled in the internal space 2a is sealed. When the pinch cock 11 is operated and the gas is sealed in the internal space 2a, the tube 44 is removed from the communication pipe 10 of the component holding device 1X.

  Next, the rear guided base 39 is moved forward, and the component holding device 1Y is moved forward as the guided base 39 moves (see FIG. 15). When the guided base 39 and the component holding device 1Y are moved forward, the turntable 34 is rotated, and the conveyance unit 30, the component holding device 1X, and the component holding device 1Y are rotated as the turntable 34 rotates ( (See FIG. 16).

  The conveyance unit 30, the component holding device 1X, and the component holding device 1Y are rotated 180 degrees as the turntable 34 rotates, and the component holding device 1X is positioned behind the component holding device 1Y (see FIG. 17). In a state in which the turntable 34 is rotated 180 degrees and the component holding device 1X is positioned behind the component holding device 1Y, the component holding device 1X is positioned in front of the rear base table 28, and the component holding device 1Y is in the front base. Located on the table 27. Therefore, the component holding device 1Y is positioned at the mounting position.

  If the length of the tube 44 connected to the communication pipe 10 of the component holding device 1X is set to a length that does not come off from the communication tube 10 of the component holding device 1X when the turntable 34 rotates, the tube 44 is removed. Without removing from the communication pipe 10 of the component holding device 1X, the above-described rotation operation of the transport unit 30, the component holding device 1X, and the component holding device 1Y may be performed.

  Further, when the tube 44 is connected to the communication pipe 10 of the component holding device 1Y, the length of the tube 44 is such that it does not come off from the communication tube 10 of the component holding device 1Y when the turntable 34 rotates. If it is done, the above-described rotation operations of the transport unit 30, the component holding device 1X, and the component holding device 1Y may be performed without removing the tube 44 from the communication pipe 10 of the component holding device 1Y.

  Next, the rear guided base 39 is moved rearward, and the component holding device 1X is moved rearward along with the movement of the guided base 39 (see FIG. 18). Is brought into contact with the heating stage 33 and positioned at the heating and pressing position.

  In the heating and pressurizing position, the component holding device 1X is heated by the heating stage 33, and heat is transmitted from the heating stage 33 to the bonded workpieces 100, 100,... Via the bottom wall portion 5 of the arrangement case 2. The

  At the same time, the pressure head 31 is lowered, the movable portion 8 of the component holding device 1X is pressed downward by the head portion 42, the connecting portion 9 is extended, and the movable portion 8 is moved downward relative to the support portion 7. (See FIG. 19). When the movable part 8 is moved downward, the joined bodies 102, 102,... Are pressed by the upper tools 8b, 8b,. The to-be-joined bodies 102, 102,... Are pressed.

  At this time, the pressure holding head 31 heats the component holding device 1 </ b> X, and heat is transmitted from the heating and pressure unit 42 a of the head unit 42 to the bonded workpieces 100, 100,. Therefore, the bonded workpieces 100, 100,... Are heated by both the heating stage 33 and the pressure head 31 and are pressed by the pressure head 31.

  Are joined to the joined bodies 101, 101,... By the joining material.

  When the above-described component holding device 1X is heated and pressurized, air is sucked from the internal space 2a of the component holding device 1Y in the mounting position via the tube 44 and the exhaust hose 36, and the component holding device 1Y. The internal space 2a is evacuated. In addition, when the internal space 2a of the component holding device 1Y is evacuated, the internal space 2a is filled with gas via the suction hose 35 and the tube 44.

  At this time, the internal space 2a of the component holding device 1Y may not be filled with gas, and the vacuum state of the internal space 2a of the component holding device 1Y may be maintained.

  When the joining work 100, 100,... Arranged in the component holding device 1X is heated and pressurized and the joining operation is completed, the pressure head 31 is raised. When the pressure head 31 is raised, the pressure on the movable part 8 of the component holding device 1X by the head part 42 is released, the connecting part 9 is compressed, and the movable part 8 is moved upward with respect to the support part 7. . When the movable part 8 is moved upward, the pressurized state of the joined bodies 102, 102,... By the upper tools 8b, 8b,.

  Next, the rear guided base 39 is moved forward, and the component holding device 1X is moved forward as the guided base 39 is moved. When the guided base 39 and the component holding device 1X are moved forward, the turntable 34 is rotated, and the transport unit 30, the component holding device 1X, and the component holding device 1Y are rotated as the turntable 34 rotates.

  The conveyance unit 30, the component holding device 1X, and the component holding device 1Y are rotated 180 degrees with the rotation of the turntable 34, and the component holding device 1Y is positioned behind the component holding device 1X. In a state in which the turntable 34 is rotated 180 degrees and the component holding device 1X is positioned behind the component holding device 1Y, the component holding device 1Y is positioned in front of the rear base table 28, and the component holding device 1X is in the front base. Located on the table 27. Accordingly, the component holding device 1X is positioned at the mounting position.

  Next, the rear guided base 39 is moved rearward, the component holding device 1Y is moved rearward as the guided base 39 is moved, and the lower surface of the arrangement case 2 is moved to the heating stage 33 in the component holding device 1Y. It is in a contact state and is positioned at the heating and pressing position.

  In the component holding device 1X located at the mounting position, the joined workpieces 100, 100,..., In which the cover 3 is removed from the arrangement case 2 and the joining is completed from the internal space 2a, are taken out. .. Are placed in the internal space 2a of the component holding device 1X, the internal space 2a is closed again by the cover 3, and the internal space 2a is closed. .

  In the heating and pressurizing position, the component holding device 1Y is heated by the heating stage 33, and heat is transmitted from the heating stage 33 to the bonded workpieces 100, 100,... Via the bottom wall portion 5 of the arrangement case 2. The

  At the same time, the pressure head 31 is lowered, the movable portion 8 of the component holding device 1Y is pressed downward by the head portion 42, the connecting portion 9 is extended, and the movable portion 8 is moved downward relative to the support portion 7, Are pressed by the upper tools 8b, 8b,..., And the bonded bodies 102, 102,... Are pressed against the bonded bodies 101, 101,. Heating of the component holding device 1Y by the head 31 is performed.

  Are joined to the joined bodies 101, 101,... By the joining material.

  When the joining work 100, 100,... Arranged in the component holding device 1Y is heated and pressurized and the joining operation is completed, the pressure head 31 is raised. When the pressure head 31 is raised, the rear guided base 39 is moved forward, the component holding device 1Y is moved forward as the guided base 39 is moved, and then the component holding device 1X is heated again. The joining operation | work with respect to the new joining workpiece | work 100,100, ... located in the pressurization position and arrange | positioned at the component holding device 1X is performed.

  As described above, in the joining operation, the pressure of the pressure head 31 is applied to the workpieces 100, 100,... Via the movable portion 8 by pressing the pressure head 31 having a heater against the movable portion 8. Then, the heat of the heater is transmitted to the bonded workpieces 100, 100,.

  Therefore, since the bonded workpieces 100, 100,... Are pressurized and heated in a state where the movable portion 8 is in contact with the bonded workpieces 100, 100,. It is possible to ensure a good bonding state with respect to the bonded bodies 101, 101,.

  Further, the arrangement case 2 is formed of a material having thermal conductivity, and the arrangement case 2 is placed on the heating stage 33 having a heater in a state where the pressure head 31 is pressed against the movable portion 8.

  Therefore, since the joining workpieces 100, 100,... Are heated by the pressure head 31 through the movable portion 8 and also by the heating stage 33 through the arrangement case 2, the joining workpieces 100, 100,. The amount of heating with respect to increases, and the bonded bodies 102, 102,... Can be bonded to the bonded bodies 101, 101,.

  In addition, although the example to which the joining workpiece | work 100,100, ... is heated from the upper and lower sides by both the pressurization head 31 and the heating stage 33 was shown above, from one of the pressurization head 31 or the heating stage 33 was shown. The joining workpieces 100, 100,... May be heated.

  In the above, the example in which the component holding device 1 is used in the joining operation by the heating and pressing device 20 has been described. However, instead of the component holding device 1, the pressurizing head 31 moves downward to be bonded. A component holding device 1A, a component holding device 1C, or a component holding device 1D that can pressurize 102, 102,... May be used.

  Furthermore, instead of the component holding device 1, a component holding device 1B may be used. However, when the component holding device 1B is used, for example, the heating stage 33 can be moved up and down, and the workpiece 102, 102,... Can be pressurized by moving the heating stage 33 upward. Alternatively, the pressurizing head 31 can be moved up and down below the component holding device 1B, and the pressurization head 31 can be pressurized to press the bonded bodies 102, 102,... There is a need. In the case of such a configuration, the component holding device 1C or the component holding device 1D can be used.

  In addition, the example in which the work of evacuating the internal space 2a and the work of filling the internal space 2a with gas are performed at the mounting position, and the heating and pressurizing work is performed at the heating and pressing position. For example, it is possible to employ a configuration in which an operation of evacuating the internal space 2a is performed at the mounting position, and an operation of filling the internal space 2a with gas and a heating and pressurizing operation are performed at the heating and pressing position. In addition, for example, it is also possible to adopt a configuration in which an operation of evacuating the internal space 2a, an operation of filling the internal space 2a with a gas, and an operation of heating and pressing are performed at the heating and pressurizing position.

<Another configuration of the heating and pressing apparatus>
In the above, the heating and pressurizing apparatus 20 having the transport unit 30 is shown as an example, but for example, a heating and pressurizing apparatus 20A having no transporting unit 30 can be used instead of the heating and pressurizing apparatus 20 ( FIG. 20).

  In the heating and pressing apparatus 20 </ b> A, a base table 45 is disposed in a work space 22 a of the housing 22, and a heating stage 33 is attached on the base table 45. A pressurizing head 31 that can be raised and lowered is disposed above the heating stage 33.

  In the heating and pressurizing device 20A, the worker holds the component holding device 1 (component holding device 1A, 1B, 1C, 1D) on the heating stage 33 and performs a joining operation.

  The component holding devices 1, 1A, 1B, 1C, and 1D can be used for a heating and pressing device such as a heater having a sealed heating and pressing space. Such a heating and pressurizing apparatus such as a heater is not provided with the heating stage 33 or the pressurizing head 31, and the component holding devices 1, 1A, 1B, 1C and 1D are inserted in the heating and pressurizing space. The heating and pressurizing space is heated to a high temperature and a high pressure, and the bonded workpieces 100, 100,... Are heated, and the movable parts 8, 8B, 8C are moved by the pressure to apply pressure to the bonded workpieces 100, 100,. Is done.

<Summary>
As described above, in the component holding devices 1, 1A, 1B, 1C, and 1D, the arrangement cases 2, 2A, 2B, 2C, and 2D and the covers 3, 3B, 3C, and 3D are coupled to each other. The space 2a is formed as a sealed space.

  Accordingly, in the state where the movable parts 8, 8B, 8C are movable in the vertical direction, the arrangement cases 2, 2A, 2B, 2C, 2D and the covers 3, 3B, 3C, 3D are combined to form an enclosed space. Since the joining workpiece 100 is arranged in the space 2a, an appropriate working state in the joining work can be realized with a simple configuration.

  In addition, it is not necessary to attach the workpiece 100 to a large-sized bonding mechanism and bond the workpiece 102 to the bonded body 101. In particular, the workpiece 102 can be carried in a state where the workpiece 100 is disposed in the internal space 2a. In addition, the transportability of the bonded workpiece 100 can be improved, and the degree of freedom in handleability can be improved.

  Further, in the component holding devices 1, 1 </ b> A, 1 </ b> D, the support portion 7, the movable portion 8, and the connecting portion 9 are provided on the covers 3, 3 </ b> D.

  Therefore, since the joined workpieces 100, 100,... Are not moved when the movable part 8 is moved, the positional displacement of the joined workpieces 100, 100,. 100,... Can be secured with respect to the arrangement cases 2, 2A, 2D.

  Further, in the component holding devices 1, 1A, 1B, 1C, 1D, the movable parts 8, 8B, 8C are formed of a material having thermal conductivity, so that the movable parts 8, 8B, 8C are joined workpieces 100, 100. It is possible to transfer heat to the bonded workpieces 100, 100,... Via the movable parts 8, 8B, 8C in a state in contact with. Therefore, it is possible to ensure a good bonding state of the bonded bodies 102, 102,... To the bonded bodies 101, 101,.

DESCRIPTION OF SYMBOLS 1 ... Component holding apparatus 2 ... Arrangement case 2a ... Internal space 3 ... Cover 4 ... Sealing member 7 ... Supporting part 8 ... Movable part 9 ... Connection part 1A ... Component holding apparatus 2A ... Arrangement case 1B ... Component holding apparatus 2B ... Arrangement Case 3B ... Cover 7B ... Supporting part 8B ... Movable part 1C ... Component holding device 2C ... Arrangement case 3C ... Cover 7C ... Supporting part 8C ... Movable part 1D ... Component holding device 2D ... Arrangement case 3D ... Cover 20 ... Heating and pressing device DESCRIPTION OF SYMBOLS 31 ... Pressure head 33 ... Heating stage 100 ... Joining workpiece 101 ... Joined body 102 ... Joined body 200 ... Joining system 1X ... Component holding apparatus 1Y ... Component holding apparatus 20A ... Heating and pressing apparatus

Claims (9)

A component holding device for holding a bonded workpiece in which a workpiece is bonded to a bonded body by a bonding material,
An arrangement case in which the joining work is arranged in an internal space;
A cover coupled to the arrangement case via a sealing member,
At least one of the arrangement case or the cover is connected to an elastically deformable or extendable connecting portion, a support portion to which one end portion of the connecting portion is connected, and the other end portion of the connecting portion is connected to the connecting portion. A movable part that is movable in the vertical direction with respect to the support part along with deformation or expansion and contraction of the part is provided,
In the state where the arrangement case and the cover are combined, the internal space is formed as a sealed space ,
The movable part is formed of a material having thermal conductivity,
The pressure of the pressure head is applied to the bonded work through the movable portion by pressing a pressure head having a heater on the movable portion,
A component holding device in which heat of the heater is transmitted to the joining workpieces via the movable part . The component holding device according to claim 1, wherein the support portion, the movable portion, and the connecting portion are provided on the cover. The component holding device according to claim 2, wherein the joined body is pressed by the movable portion in a state where the arrangement case and the cover are coupled. The component holding device according to claim 1, wherein a bellows member formed of a metal material is used as the connecting portion. The arrangement case is formed of a material having thermal conductivity,
The arrangement case is placed on a heating stage having a heater in a state where the pressure head is pressed against the movable part.
The component holding device according to claim 1, claim 2, claim 3, or claim 4 . The internal space is evacuated
The component holding device according to claim 1, claim 2, claim 3, claim 4 or claim 5 . The internal space is filled with a gas having a reducing action.
The component holding device according to claim 1, claim 2, claim 3, claim 4 or claim 5 . The internal space is filled with an inert gas
The component holding device according to claim 1, claim 2, claim 3, claim 4 or claim 5 . Component bonding provided with a component holding device that holds a workpiece to be bonded to a bonded body by a bonding material, and a heating and pressing device that heats and pressurizes the component holding device with a pressure head A system,
The component holding device is
An arrangement case in which the joining work is arranged in an internal space;
A cover coupled to the arrangement case via a sealing member,
At least one of the arrangement case or the cover is connected to an elastically deformable or extendable connecting portion, a support portion to which one end portion of the connecting portion is connected, and the other end portion of the connecting portion is connected to the connecting portion. A movable part that is movable in the vertical direction with respect to the support part along with deformation or expansion and contraction of the part is provided,
In the state where the arrangement case and the cover are combined, the internal space is formed as a sealed space,
A component joining system in which pressure and heating are performed in a state where the joining workpiece is pressed by the movable part that is moved by pressing the pressure head.

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