KR20090081499A - Apparatus for molding a electronic device and method of molding a electronic device - Google Patents

Abstract

An electronic component molding apparatus and a molding method thereof are provided to fix a release film by using a holding unit in order to simplify a molding structure. An electronic component molding apparatus comprises a top mold(111), a feeding unit(130), a bottom mold(116) and a holding unit. An electronic component is arranged on the top mold. The feeding unit is arranged adjacent to the bottom mold. The feeding unit feeds a release film(210) to a cavity(117). The bottom mold faces toward the top mold. The bottom mold includes the cavity and a first vacuum sucking hole(118). The cavity serves as a molding space for molding the electronic component. The first vacuum sucking hole is connected to the cavity. The holding unit is arranged adjacent to the both sides of the bottom mold. The holding unit consists of a first gripper(151) and a second gripper(161).

Description

Electronic component molding apparatus and electronic component molding method {APPARATUS FOR MOLDING A ELECTRONIC DEVICE AND METHOD OF MOLDING A ELECTRONIC DEVICE}

The present invention relates to a molding method for an electronic component and an electronic component molding apparatus. More particularly, the present invention relates to an electronic component molding method for molding an electronic component with a resin in a cavity using a release film, and an electronic component apparatus for implementing the electronic component molding method.

Generally, resin sealing molding of a semiconductor chip mounted on a substrate is performed. In the said resin sealing molding, the electronic component molding apparatus provided with the metal mold | die which provides the resin sealing molding space of an electronic component, and a release film is used. Conventional electronic molding apparatus includes a release film supply unit for supplying a release film to the upper and lower molds while applying a constant tension to the mold and the release film consisting of the upper and lower molds. The lower mold is formed with a cavity filled with a resin. The electronic component is contained in a cavity filled with a resin so that the electronic component is resin molded. The release film is also disposed to cover the cavity inner surface. Therefore, after molding the electronic component using a resin, the release film can be easily released from the lower mold.

However, voids may occur in the resin when air remains in the cavity. In addition, when air remains in the cavity, the liquid resin may be prevented from flowing uniformly throughout the cavity. Accordingly, a conventional electronic component molding apparatus performs a vacuum molding process of molding an electronic component in a state in which a resin is filled in a cavity and vacuum-vented inside the cavity. However, when molding the electronic component in the vacuum evacuation state in the cavity, a phenomenon may be separated from the inner surface of the cavity of the release film. The release film separated from the cavity inner surface may cause a wire sweeping phenomenon that damages the wire formed on the electronic component.

Therefore, in order to prevent the release film from deviating from the inner surface of the cavity in the vacuum molding process, Korean Patent Publication No. 2006-0052812 (published date: May 19, 2006), as well as the upper and lower molds as well as the intermediate A method of fixing a release film covering side and bottom surfaces is disclosed. In Korean Patent Publication No. 2006-0052812 (published date: May 19, 2006), a release film is sandwiched between a lower mold and an intermediate mold, and the release film covers the cavity. Therefore, the phenomenon in which the release film adhered to the inside of the cavity is separated from the inside of the cavity during the vacuum molding process by evacuating the inside of the cavity may be suppressed.

However, as the intermediate mold interposed between the upper and lower molds is additionally arranged, the mold configuration of the electronic component molding apparatus becomes complicated. In addition, as the intermediate mold moves up and down to additionally require a process of fixing the release film, a driving time of the intermediate mold is required, and as a result, the working time of the overall electronic component molding apparatus increases.

Accordingly, the present invention has been made in view of such problems, and an object of the present invention is to provide an electronic component molding apparatus capable of fixing a release film and simplifying the structure of a mold.

Another object of the present invention is to provide an electronic component molding method capable of fixing a release film and at the same time reducing the process time.

In order to achieve the above object of the present invention, the electronic component molding apparatus according to an embodiment of the present invention, the supply unit is disposed adjacent to the upper mold, the lower mold on which the electronic component is disposed, and supplies a release film to the cavity A lower mold having a cavity opposite to the upper mold and having a cavity for forming a molding space for molding the electronic component with a resin, and a first vacuum suction port communicating with the cavity and for adsorbing the release film to the bottom surface of the cavity; A holding unit having a first gripper and a second gripper disposed adjacent to both sides of the lower mold and holding the release film covering the cavity. Here, each of the first and second grippers, a clamper for holding the release film by sliding on the upper surface of the body to be in contact with each other, the body is formed on the body and the second vacuum suction port is formed. It may include.

In one embodiment of the present invention, the supply unit is disposed adjacent to one side of the lower mold, the supply roller for supplying the release film to the cavity and disposed adjacent to the other side opposite to the one side, the release And a winding roller for winding a film from the cavity. Here, the first gripper may be disposed between the lower mold and the supply roller, and the second gripper may be disposed between the lower mold and the winding roller. The first gripper is disposed on one side of the lower mold, and holds the release film along a moving direction of the release film moving from the supply roller to the winding roller, and the second gripper faces the one side. The release film may be disposed on the other side and may hold the release film along a moving direction of the release film moving from the supply roller to the winding roller.

In order to achieve another object of the present invention, in the electronic component molding method according to an embodiment of the present invention, after placing the release film between the upper mold and the lower mold facing the upper mold and the cavity is formed, the release film is the lower mold Hold at an adjacent position of. Subsequently, the release film is vacuum-adsorbed to the bottom surface of the cavity, the resin is supplied into the cavity, and then the electronic component fixed to the upper mold is introduced into the cavity, thereby molding the electronic component using the resin. do. Here, in order to hold the release film, the suction release film may be clamped at a position adjacent to one side and the other side of the lower mold after suctioning the release film by vacuum suction.

In one embodiment of the present invention, after molding the electronic component, after injecting gas between the release film and the cavity, the release film may be released from the lower mold.

According to the electronic component molding apparatus and the electronic component molding method, the release film can be suppressed from the cavity during the molding process by holding the release film with the holding unit. In addition, the mold structure can be simplified by fixing the release film with a holding unit instead of the intermediate mold.

On the other hand, by omitting the intermediate type, the driving time required for driving the intermediate type can be saved, and the process efficiency of the overall molding process can be improved.

With reference to the accompanying drawings will be described in detail with respect to the electronic component molding method and electronic component molding apparatus according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a cross-sectional view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention.

Referring to FIG. 1, an electronic component molding apparatus according to an exemplary embodiment may include an upper mold 111, a supply unit 130, a lower mold 116, and a holding unit 160. The electronic component 205 according to the present invention includes a substrate 201 and a semiconductor chip 203 formed on the substrate 201. The substrate 201 includes a printed circuit board. The substrate 201 may have a circular or polygonal shape.

The mold structure 110 including the upper mold 111 and the lower mold 116 provides space for molding the electronic component 200.

The upper mold 111 is provided with an adsorption unit (not shown) that adsorbs the substrate 201 of the electronic component 205. The adsorption unit adsorbs the substrate 201 through, for example, vacuum adsorption. The upper mold 111 may be fixed. In addition, the upper mold 111 is provided with a vacuum exhaust port (not shown) for evacuating the inside of the cavity 117 when the upper and lower molds 111 and 116 are closed. The vacuum exhaust port is connected to the vacuum unit to evacuate the internal space consisting of the upper mold 111 and the lower mold 116 when the upper mold 116 is closed. In addition, when the upper mold 111 and the lower mold 116 are closed, a sealing member (not shown) may be additionally formed on the upper mold to isolate the space formed by the upper mold 111 and the lower mold 116 from the outside.

The lower mold 116 is disposed to face each other with the upper mold 111. The cavity 117 is formed in the center of the lower mold 116. The cavity 117 has a bottom surface and a side surface extending upward from the periphery of the bottom surface. The bottom and side surfaces of the cavity 117 provide a receiving space for receiving the resin.

In one embodiment of the present invention, the lower mold 116 is in communication with the cavity 117 and the first vacuum suction port 118 for vacuum adsorption of the release film 210 on the bottom surface and side of the cavity 117 is provided Is formed. The first vacuum suction port 118 is connected to the vacuum unit to suction the release film 210 through the first vacuum suction port 118 when the release film 210 is disposed in the cavity 117. In addition, after molding the electronic component 205 using resin in the cavity 117, the release film 210 may be separated from the cavity 117 by injecting air through the first vacuum suction port 118. Thus, the molded electronic component 205 can be separated from the cavity 117.

The supply unit 130 is disposed adjacent to the lower mold 116. The supply unit 130 supplies the release film 210 to the cavity 117. The supply unit 130 supplies the release film 210 to the cavity 117 to mold the electronic component 205 in the cavity 117 with a resin, and then the electronic component 205 molded in the cavity 117 is formed. The attached release film 210 can be easily released from the cavity 117.

In one embodiment of the present invention, the supply unit 130 is a supply roller 131 for supplying the release film 210 to the cavity 117 and the winding roller for collecting the release film 210 from the cavity 117 ( 136). The release film 210 moves from the feed roller 131 to the take-up roller 136 as shown in FIG. 1. Meanwhile, the supply roller 131 and the winding roller 136 may apply tension to or relax the release film 210 supplied in the cavity 117.

The holding unit 150 is disposed between the lower mold 116 and the supply unit 130. The holding unit 150 holds the release film 210 covering the cavity 117. That is, after the supply unit 130 supplies the release film 210 between the upper mold 111 and the lower mold 116, the holding unit 150 adheres the mold release film 210 to the upper surface of the lower mold 116. Then, when forming the inside of the cavity 117 in a vacuum state to mold the electronic component 205 into the resin in the cavity 117, the holding unit 150 holds the release film 210 so that the release film 210 is a lower mold. Departure from 116 can be suppressed.

In one embodiment of the present invention, the holding unit 150 is the first gripper 151 disposed to be adjacent to one side of the lower mold 116 and the second gripper 161 disposed to be adjacent to the other side of the lower mold 116. It may include. In other words, the first and second grippers 151 and 161 may be disposed along the moving direction of the release film 210. For example, the first gripper 151 is disposed between the lower mold 116 and the supply roller 131, and holds the release film. The second gripper 161 is disposed between the lower mold 116 and the winding roller 136 and holds the release film.

Meanwhile, each of the first and second grippers 151 and 161 is disposed on the body 153 and the body 153 on which the first vacuum suction holes 155 are formed, and the body 153 to be in contact with each other. It may include first and second clampers (157, 159) for sliding the upper surface of the clamping the release film 210.

2A and 2B are cross-sectional views illustrating an operation of holding the release film 210 using the holding unit 150 shown in FIG. 1.

2A and 2B, first and second clampers 157 and 159 are spaced apart from each other on an upper surface of the body 153 to form a receiving groove capable of partially accommodating a release film. In addition, the second vacuum suction port 155 is connected to a vacuum unit 170 capable of sucking or discharging air.

As the vacuum unit 170 sucks air through the second vacuum suction port 155, the release film 210 is adsorbed onto the sidewalls and the bottom surface of the receiving groove. Thereafter, the first and second clamper members 157 and 159 slide the upper surface of the body 153 to be in contact with each other toward the release film 210. Thus, the first and second clamper members 157 and 159 clamp the release film 210. As a result, the first and second gripper members 151 and 161 hold the release film 210 at one side and the other side of the lower mold 116. Meanwhile, after molding the electronic component 205 with resin in the cavity 117, the first and second clamper members 157 and 159 slide the upper surface of the body 153 with the release film 210 interposed therebetween. Spaced apart from each other. Thereafter, the gas is supplied through the second vacuum suction port 155 to separate the release film 210 from the receiving groove.

Thus, the mold structure of the electronic component molding apparatus may be simplified by eliminating the intermediate mold for fixing the release film 210 to the lower mold 116 separately from the upper mold 111 and the lower mold 116. In addition, the molding time according to the driving time of the intermediate type is suppressed to increase the molding process of the electronic component can have an improved production efficiency.

3A to 3C are cross-sectional views illustrating an electronic component molding apparatus according to another exemplary embodiment of the present invention. Except for the arrangement of the first and second grippers, the electronic component molding apparatus according to the present embodiment has substantially the same configuration as the electronic component molding apparatus described with reference to FIGS. 1 to 2B. Therefore, the same reference numerals are used for the same components, and detailed description of the same components will be omitted.

3A to 3B, an electronic component molding apparatus according to another exemplary embodiment of the present invention includes an upper mold 111, a supply unit 130, a lower mold 116, and a holding unit 150.

The holding unit 130 is disposed between the lower mold 116 and the supply unit 130. The holding unit 130 holds the release film 210 covering the cavity 117.

In one embodiment of the present invention, the holding unit 130 is the first gripper 151 disposed to be adjacent to one side of the lower mold 116 and the second gripper 161 disposed to be adjacent to the other side of the lower mold 116. It may include. In addition, the first gripper 151 and the second gripper 161 hold the release film 210 along the moving direction of the release film 210 moving from the feed roller 131 to the take-up roller 136. Therefore, the first and second grippers 151 and 161 may be disposed perpendicularly to the moving direction of the release film 210. That is, the first and second grippers 151 and 161 may hold the release film 210 independently of the driving of the supply roller 131 and the winding roller 136. Therefore, the driving method of the holding unit 130 can be simplified.

4 to 7 are cross-sectional views illustrating a method of molding an electronic component according to an embodiment of the present invention.

Referring to FIG. 4, the release film 210 is positioned between the upper mold 111 and the lower mold 116 while the upper mold 111 and the lower mold 116 are spaced apart from each other. In this case, the upper mold 111 may hold the substrate 201 on which the electronic component 203 is mounted. The release film 210 may be supplied through, for example, a supply unit 130 including a supply roller 131 and a winding roller 136 disposed on one side of the lower mold 116, respectively.

Subsequently, the release film 210 disposed between the upper mold 111 and the lower mold 116 is gripped at a position adjacent to one side and the other side of the lower mold 116. For example, a vacuum evacuation process and a clamping process may be sequentially performed to gipe the release film 210.

Referring again to FIGS. 2A and 2B, first and second clampers 157 and 159 are spaced apart from each other on an upper surface of the body 153 to form a receiving groove capable of partially accommodating the release film 210. do. In addition, the second vacuum suction port 155 is connected to a vacuum unit 170 capable of sucking or discharging air.

As the vacuum unit 170 sucks air through the second vacuum suction port 155, the release film 210 is adsorbed onto the sidewalls and the bottom surface of the receiving groove. Thereafter, the first and second clamper members 157 and 159 slide the upper surface of the body 153 to be in contact with each other toward the release film 210. Thus, the first and second clamper members 157 and 159 clamp the release film 210. As a result, the first and second gripper members 151 and 161 hold the release film 210 at one side and the other side of the lower mold 116.

Referring to FIG. 5, after releasing the release film 210, the release film 210 is adsorbed to the bottom surface of the cavity 117 of the lower mold 116. Therefore, the release film 210 is fixed along the bottom and side surfaces of the cavity 117. For example, the first vacuum suction hole 118 formed in the lower mold 116 and the vacuum unit connected to the first vacuum suction hole 118 are used to form the first vacuum suction hole 118 and the cavity 117. Air may be sucked into the cavity 117 to form a vacuum inside the cavity 117. As a result, the release film 210 is adsorbed to the side and bottom surface of the cavity 117.

Referring to FIG. 6, the release film 210 is adsorbed onto the inner surface of the cavity 117, and then resin is supplied to the cavity 117. In one embodiment of the present invention, the liquid resin may be directly supplied into the cavity 117. Alternatively, the powdered resin may be supplied into the cavity 117 and then melted into the liquid resin by melting the powdered resin. At this time, the upper mold 111 and the lower mold 116 may be maintained at a constant temperature to maintain the molten state of the resin.

Thereafter, after a predetermined time, the liquid resin is cured to form the electronic component 205 using the cured resin. For example, the electronic component 203 mounted on one surface of the substrate 201 may be molded of a cured resin. Alternatively, a plurality of electronic components mounted on both surfaces of the substrate 201 may be molded of a cured resin.

Referring to FIG. 7, the release film 210 is released from the cavity 117 by introducing air into the cavity 117 through the first vacuum suction port 118. Thus, the molded electronic component can be separated from the lower mold 116.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

According to such an electronic component molding apparatus and an electronic component molding method, it is possible to suppress release of the release film from the cavity during the molding process by holding the release film with the holding unit. In addition, the mold structure can be simplified by fixing the release film with a holding unit instead of the intermediate mold.

On the other hand, by omitting the intermediate type, the driving time required for driving the intermediate type can be saved, and the process efficiency of the overall molding process can be improved.

1 is a cross-sectional view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention.

2A and 2B are cross-sectional views illustrating an operation of holding a release film using the holding unit shown in FIG. 1.

3A to 3C are cross-sectional views illustrating an electronic component molding apparatus according to another exemplary embodiment of the present invention.

4 to 7 are cross-sectional views illustrating a method of molding an electronic component according to an embodiment of the present invention.

Claims (8)

An upper mold on which the electronic component is disposed; A supply unit disposed adjacent to the lower mold and supplying a release film to the cavity; A lower mold opposed to the upper mold and formed with a cavity for forming a molding space for molding the electronic component into a resin, and a first vacuum suction hole communicating with the cavity and for adsorbing the release film to the bottom surface of the cavity; And And a holding unit having a first gripper and a second gripper disposed adjacent to both sides of the lower mold and holding the release film covering the cavity. The method of claim 1, wherein each of the first and second grippers, A body in which a second vacuum suction port is formed; And And a clamper disposed on the body and holding the release film by sliding on an upper surface of the body so as to contact each other. The method of claim 1, wherein the supply unit, A supply roller disposed adjacent to one side of the lower mold and supplying the release film to the cavity; And It is disposed adjacent to the other side opposite to the one side, the electronic component molding apparatus comprising a winding roller for winding the release film from the cavity. 4. The apparatus of claim 3, wherein the first gripper is disposed between the lower mold and the supply roller, and the second gripper is disposed between the lower mold and the winding roller. The release gripper according to claim 3, wherein a first gripper is disposed at one side of the lower mold, and holds the release film along a moving direction of the release film moving from the supply roller to the winding roller, and a second gripper is disposed at the one side. It is disposed on the other side opposite, the electronic component molding apparatus characterized in that for holding the release film along the moving direction of the release film moving from the supply roller to the take-up roller. Positioning a release film between the upper mold and the lower mold opposite the upper mold and in which the cavity is formed; Holding the release film at an adjacent position of the lower mold; Vacuum adsorbing the release film on the bottom surface of the cavity Supplying a resin into the cavity; And And inserting the electronic component fixed to the upper mold into the cavity to mold the electronic component using the resin. The method of claim 6, wherein the holding of the release film comprises: Adsorbing the release film by vacuum suction; And And clamping the adsorbed release film at positions adjacent to one side and the other side of the lower mold. The method of claim 6, wherein after molding the electronic component: Injecting gas between the release film and the cavity; And And releasing the release film from the lower mold.

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