JP2021112864A5 - - Google Patents

Description

<Overall Configuration of Resin Molding Apparatus 1>
A configuration of a resin molding apparatus 1 of this embodiment will be described with reference to FIGS. A resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus 1 that performs resin molding by a compression molding method.

As shown in FIG. 1, the resin molding apparatus 1 of the embodiment includes a release film cutting module 10, a resin supply module 20, a resin molding module 30, and a transport module 40 from the right side of the figure. Each module is separately separated, but can be attached to and detached from adjacent modules and can be increased or decreased. For example, two or three resin molding modules 30 may be arranged between the resin supply module 20 and the transfer module 40 .

As shown in FIG. 1, the resin supply module 20 mainly includes a resin conveying mechanism 21, a film recovery mechanism 22, a resin discharge section 23, and a film suction table 24. As shown in FIG. The resin conveying mechanism 21 and the film collecting mechanism 22 are integrated and configured to move between the release film cutting module 10 and the resin molding module 30 described later. Also, the resin conveying mechanism 21 can convey the release film 12 supplied with the liquid resin 70 to the mold 31 . The resin ejection part 23 can supply the liquid resin 70 onto the release film 12 from a nozzle (not shown). The film adsorption table 24 can adsorb and hold the cut release film 12 . A chamber portion 25, which will be described later, is provided in the resin transport mechanism 21 (see FIG. 7). The resin molding apparatus 1 also includes a pressurizing unit 50 for pressurizing the inside of the chamber 60, which will be described later.

The resin molding module 30 mainly includes a mold 31 and a mold clamping mechanism 35, as shown in FIGS. The mold 31 has an upper mold 34 and a lower mold 32 facing the upper mold 34 . The lower die 32 is composed of a side surface member 32a forming a side surface of the cavity 33 and a bottom surface member 32b forming a bottom surface of the cavity 33. As shown in FIG. A concave cavity 33 in which the liquid resin 70 is accommodated is formed by the side member 32a and the bottom member 32b. The side member 32a and the bottom member 32b are provided with adsorption grooves 322a and 322b for adsorbing the release film 12 (see FIG. 8). The release film 12 supplied with the liquid resin 70 is conveyed to the mold 31 by the resin conveying mechanism 21 and placed on the cavity 33 of the lower mold 32 . In the resin molding module 30 , the molding die 31 is clamped by the mold clamping mechanism 35 to perform resin molding of the pre-molding substrate 5 on which the chip to be molded is mounted, thereby forming the molded substrate 6 . can. The object to be molded is not particularly limited to a rectangular substrate, and may be a wafer. For example, the size of the substrate exceeds 150 mm on one side, and specifically, sizes such as 320 mm, 300 mm, and 250 mm on one side are used. A wafer having a size of Φ300 or Φ200, for example, is used.

As shown in FIG. 1, the transfer module 40 mainly includes a substrate loader 41, a suction hand 42, a suction hand moving mechanism 43, a pre-molded substrate storage section 45, and a molded substrate storage section 46. there is The substrate loader 41 can hold the substrate and move between the resin molding module 30 and the transfer module 40 . The suction hand 42 is provided in a suction hand moving mechanism 43, and the suction hand moving mechanism 43 can move the suction hand 42 in the X, Y, and Z directions and rotate it in the θ direction. As for the rotation, the suction hand 42 can be rotated in the horizontal direction, or can be rotated in the vertical direction and reversed. The suction hand 42 can suck and hold the pre-molding substrate 5 stored in the pre-molding substrate storage section 45 and transport it to the substrate loader 41 by the suction hand moving mechanism 43 . Further, the suction hand 42 can suction-hold the shaped substrate 6 held by the substrate loader 41 and store it in the shaped substrate storage section 46 by the suction hand moving mechanism 43 .

<Method for manufacturing a resin molded product using the resin molding apparatus 1>
An example of a method for manufacturing a resin molded product of the present embodiment using the resin molding apparatus 1 of the present embodiment will be described with reference to FIGS. 1 to 9. FIG. First, as shown in FIG. 1, the suction hand 42 is inserted under the pre-molding substrate 5 on which a chip is mounted and which is housed in the pre-molding substrate housing portion 45. After the pre-molding substrate 5 is sucked, The pre-molding substrate 5 is taken out from the pre-substrate storage portion 45 . Here, the substrate is taken out from the pre-molding substrate housing portion 45 with the chip mounting side facing upward.

The film mounting table 13 holding the release film 12 by suction moves to the front of the resin conveying mechanism 21 . The resin conveying mechanism 21 moves above the film mounting table 13, receives the release film 12, conveys it to the film adsorption table 24 of the resin supply module 20, and, as shown in FIG. Let the film 12 be positioned. After receiving the release film 12 from the resin conveying mechanism 21, the film adsorption table 24 starts to adsorb the release film 12 in order from both ends (outside) toward the inside as shown in FIG. . By sucking from both ends in this way, it is possible to suppress wrinkles in the release film 12 . For example, after starting the suction of the suction hole 24a arranged at the end, the suction of the suction holes 24a inside thereof is started. As shown in FIG. 5, the liquid resin 70 is discharged onto the release film 12 from the resin discharge portion 23 with the release film 12 having the central portion lower than the outer peripheral portion (liquid resin discharge step). Since the upper surface of the film adsorption table 24 is formed so that the central portion is lower than the outer peripheral portion, the release film 12 and the liquid resin 70 can be held by pooling the low-viscosity liquid resin 70 in the central portion. can be done. Here, the “low-viscosity” liquid resin 70 means a resin with such a viscosity that the ejected shape cannot be maintained. Specifically, it refers to those having a viscosity of 20 Pa·s or less.

As shown in FIG. 2, after the mold release film 12 is sucked and held by the cavity 33, the molding die 31 to which the mold release film 12 has been transported is clamped to perform resin molding (resin molding step). Specifically, the mold clamping mechanism 35 raises the lower mold 32 . As a result, the upper mold 34 and the lower mold 32 are brought close to each other and clamped, and the chip attached to the lower surface of the pre-molding substrate 5 is immersed in the liquid resin 70 in the cavity 33 . By heating and hardening the liquid resin 70 in this state, the pre-molding substrate 5 can be resin-molded, and the molded substrate 6 with resin - molded chips can be manufactured. After resin molding , the mold clamping mechanism 35 lowers the lower mold 32 . As a result, the upper mold 34 and the lower mold 32 are separated from each other and opened.

With this configuration, the liquid resin 70 can be supplied so as to accumulate in the central portion of the release film 12 , and it is possible to prevent the low-viscosity liquid resin 70 from spilling out from the release film 12 . can.

As a result, the release film 12 supplied with the liquid resin 70 can be transported to the molding die 31, and the pre-molding substrate 5 can be resin-molded. In addition, by covering the upper surface of the release film (the surface to which the liquid resin is supplied) with the chamber portion 25, it is possible to prevent the liquid resin 70 from leaking out of the chamber portion 25 even if the liquid resin 70 has a low viscosity. can. Furthermore, by supplying gas into the chamber portion 25, the central portion of the release film 12 is made lower than the outer peripheral portion, and even if the liquid resin 70 moves on the release film 12 during transportation, the chamber portion 25 It is possible to prevent the liquid resin 70 from adhering to the clamper 26 .

As a result, the liquid resin 70 can be supplied so as to accumulate in the central portion of the release film 12 , and the liquid resin 70 can be prevented from spilling over the release film 12 .

In this embodiment, the film mounting table 13 and the film suction table 24 are provided.
The film mounting table 13 and the film suction table 24 may be shared, and only the film suction table 24 may be provided. In this case, the film suction table 24 can move in the X, Y, and Z directions, and can move between the release film cutting module 10 and the resin supply module 20 . The film suction table 24 on which the release film 12 is placed is moved to below the resin discharge portion of the resin supply module 20 , and in this state, the low-viscosity liquid resin 70 is discharged onto the release film 11 .

1 Resin molding equipment
5 Pre-Molding Substrate 6 Molded Substrate 10 Release Film Cutting Module 11 Rolled Release Film 12 Release Film 13 Film Placement Table 14 Film Gripper 20 Resin Supply Module 21 Resin Conveying Mechanism 22 Film Collecting Mechanism 23 Resin Discharge Portion 24 Film Adsorption Base 24a Suction hole 25 Chamber section 25a Hole 25b Seal member 31 Mold 32 Lower mold 32a Side member 32b Bottom member 322a Suction groove 322b Suction groove 33 Cavity 34 Upper mold 35 Mold clamping mechanism 40 Transfer module 41 Substrate loader 42 Movement of suction hand Mechanism 43 Suction Hand 45 Pre-Molding Substrate Storage Unit 46 Molded Substrate Storage Unit 50 Pressure Unit 60 Chamber 70 Liquid Resin

Claims (9)

a mold including an upper mold and a lower mold facing the upper mold;
a mold clamping mechanism for clamping the mold;
a film adsorption table for adsorbing a release film, the film adsorption table having an upper surface whose central portion is lower than its outer peripheral portion;
a resin ejection unit that ejects a liquid resin onto the release film;
a chamber part that constitutes an upper surface and a side surface of the chamber in which the release film is arranged on the lower surface;
A resin molding device comprising: 2. The resin molding apparatus according to claim 1, wherein said chamber section further has a hole for supplying gas into the chamber section. 3. The resin molding apparatus according to claim 1, further comprising a pressurizing section that supplies gas into said chamber section to pressurize the inside of said chamber section. 4. The resin molding apparatus according to any one of claims 1 to 3, wherein the film suction table is curved such that the upper surface of the suction table for sucking the release film is lowered from the outer peripheral portion toward the central portion. . The resin molding apparatus according to any one of claims 1 to 4, wherein the chamber section is provided in a resin conveying mechanism. 6. The resin molding apparatus according to claim 5, wherein said resin transport mechanism transports said release film supplied with said liquid resin to said mold. The resin molding apparatus according to any one of claims 1 to 6 , further comprising a clamper that clamps the release film between the lower surface of the end portion of the chamber portion. A resin conveying step of conveying the release film to a mold while supplying gas into a chamber portion that constitutes the upper surface and side surfaces of the chamber in which the release film supplied with the liquid resin is arranged on the lower surface;
A resin molding step of performing resin molding by clamping the mold to which the release film has been conveyed;
A method for manufacturing a resin molded product comprising: 9. The resin molding according to claim 8, further comprising a liquid resin discharging step of discharging the liquid resin in a state in which the central portion of the cut release film is lower than the outer peripheral portion before the resin conveying step. method of manufacturing the product.