JP6423399B2 - Resin molding method, film conveying apparatus, and resin molding apparatus - Google Patents

Description

  The present invention relates to a resin molding method, a film conveyance device, and a resin molding device.

  Japanese Patent Application Laid-Open No. 08-142105 (Patent Document 1) describes a technique in which a resin is filled in a cavity covered with a release film and molded.

JP 08-142105 A

  In the release film after resin molding, wrinkles due to elongation and unevenness are formed. If resin molding is performed in a state where there is a wrinkle on the release film, the wrinkle is transferred to a molded product, which causes a molding failure. For this reason, it is preferable that a resin-molded release film (unused part) is supplied for each resin molding operation. However, since the usage amount of the release film affects the production running cost of the molded product, there is a problem that the cost increases as the usage amount increases.

  An object of the present invention is to provide a technique capable of reducing the manufacturing running cost of a molded product. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

In the resin molding method according to one solution of the present invention, after the mold surface is covered with a roll-shaped release film supplied from a film conveying device provided on both sides of the mold and the mold is closed, the resin molding is performed. A mold step of opening the mold and releasing the molded product from the cavity a plurality of times, and when it is determined that the release film is unsuitable for use, after the mold is opened, the unused portion of the release film is transferred to the mold. A film supply step to supply, and at the time of the molding step, the release film is moved to a position close to the mold surface, and at the film supply step, the release film is moved away from the mold surface. The holding position of the release film in the film transport device is controlled so as to be moved. According to this, the shift | offset | difference of a release film can be prevented and the same part of a release film can be used in multiple times. Here, it is more preferable that the release film is moved by a guide roller that is wound around and can be moved back and forth in a direction orthogonal to the mold surface. According to this, the release film can be moved to a position close to the mold surface, or moved to a position away from the mold surface. In the film transport device, the release film is disposed between the unwinding shaft and the winding shaft by using an unwinding servo motor that rotates the unwinding shaft and a winding servo motor that rotates the winding shaft. The amount of the release film that is passed over and delivered from the unwinding shaft via the measure roll is measured by an encoder provided on the measure roll, and the unwinding servo motor is used to measure the amount of the release film that is fed to the measure roll. More preferably, the torque of the unwinding shaft is controlled, and after the molded product in the molding step is released, before the mold is closed, the winding shaft is fixed and the torque of the unwinding shaft is controlled. According to this, the shift | offset | difference by the movement of a release film can be prevented reliably.

  In the resin molding method according to the one solving means, in the molding step, resin molding is performed in a state where the release film is adsorbed to the mold surface, and the release film is adsorbed when releasing the molded product. It is more preferable to cancel. The release film can be smoothly peeled, the load on the release film can be reduced, and breakage can be prevented.

A resin molding method according to another solving means of the present invention is a resin molding method for molding a workpiece by supplying a release film and a resin to a mold, and cutting out the release film of a single sheet from a roll film It is supplied to the mold, to repeat the step of molding between the workpiece and the resin fed into the mold and supplying a resin to the release film in a state where the outer peripheral portion is held by the holder of the release film Later, the release film and the resin are supplied to the mold together with the holder, the release film held by the holder is used for molding a plurality of times, and each time the release film is used a plurality of times, It is characterized by re-tensioning the release film . Since the amount of sheet-fed film used in molding is reduced by using a sheet-fed film (release film) a plurality of times, the production running cost of the molded product can be reduced.

In addition , the sheet can be used a plurality of times while preventing generation of wrinkles.

Moreover , generation | occurrence | production of the malfunction by the extended sheet | seat film can be prevented.

  The film transport device according to one solution of the present invention is a film transport device including a transport jig for transporting a single-sheet release film whose outer peripheral portion is held by a holder, wherein the transport jig is the holding device. A holding part that holds the release film inside the tool, and a movable holding part that holds the holding tool and moves the holding tool in a direction opposite to the pressing direction of the pressing part. . According to this, generation | occurrence | production of the wrinkle of a sheet | seat film can be prevented.

  The film transport apparatus according to the one solution includes: a stage on which the holder is set; and a first movable part that is provided around the stage and moves the movable holding part of the transport jig. It is characterized by. According to this, generation | occurrence | production of the wrinkle of a sheet | seat film can be prevented in a conveyance state.

  In a resin molding apparatus comprising a film transport apparatus, a film transport apparatus, and a mold according to the one solution, the mold surface is provided around the mold and the mold surface is covered with the release film together with the transport jig. And a second movable part that moves the movable holding part of the conveying jig in a state where the movable jig is moved. According to this, generation | occurrence | production of the wrinkle of a sheet | seat film can be prevented in the state supplied to the inside of a metal mold | die.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. The manufacturing running cost of the molded product can be reduced.

It is a schematic block diagram of the initial state of the resin molding apparatus (upper mold | type cavity and compression molding type) which concerns on Embodiment 1 of this invention. It is a schematic block diagram of the state after a shaping | molding of the resin molding apparatus shown in FIG. It is a schematic flowchart of operation | movement of the resin molding apparatus shown in FIG. FIG. 4 is a schematic flowchart of a molding process shown in FIG. 3. It is explanatory drawing of the film adsorption | suction in the resin molding process following FIG. FIG. 6 is an explanatory diagram of molding subsequent to FIG. 5. It is explanatory drawing of the mold opening following FIG. It is explanatory drawing of the film peeling completion following FIG. It is a schematic explanatory drawing of the modification (lower mold cavity and compression molding type) of the resin molding apparatus which concerns on Embodiment 1 of this invention. It is a schematic explanatory drawing of the other modification (upper mold | type cavity transfer transfer type) of the resin molding apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing of the film drawer in the resin molding process which concerns on Embodiment 2 of this invention. It is explanatory drawing of the film cutting following FIG. It is explanatory drawing before the film holding | maintenance by the conveyance jig following FIG. It is explanatory drawing after the film holding | maintenance by the conveyance jig following FIG. It is explanatory drawing of film tension provision following FIG. It is explanatory drawing of the resin supply following FIG. It is explanatory drawing of film carrying in to the shaping die following FIG. It is explanatory drawing of the film set following FIG. It is explanatory drawing of the resin set following FIG. FIG. 20 is an explanatory diagram of retracting the conveyance jig following FIG. 19. It is explanatory drawing of the mold closing following FIG. FIG. 22 is an explanatory diagram of molding subsequent to FIG. 21. It is explanatory drawing of the mold opening following FIG. It is explanatory drawing of the film peeling completion following FIG. It is explanatory drawing of carrying-in jig conveyance to the shaping die following FIG. It is explanatory drawing of the film holding | maintenance by the conveyance jig following FIG. It is explanatory drawing of the film taking-out by the conveyance jig following FIG. It is explanatory drawing of conveyance jig carrying in to the stage following FIG. It is explanatory drawing of the conveyance jig set following FIG. It is explanatory drawing of the film tension reapplying following FIG. It is explanatory drawing of the resin supply following FIG.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding apparatus 10 according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 are schematic configuration diagrams (partially sectional views) of the resin molding apparatus 10 in an initial state and a state after molding, respectively. The resin molding apparatus 10 is a compression molding type that uses a long roll-shaped release film F (roll film), and resin molding (molding) using a resin R on a workpiece W (for example, a substrate on which components are mounted). Molding).

  The resin molding apparatus 10 includes a molding die 20 having a pair of an upper die 21 and a lower die 22 (one and the other die). The molding die 20 can be opened and closed by a known press mechanism, and the upper die 21 and the lower die 22 are brought into contact with and separated from each other. In the molding die 20, the upper die 21 includes a cavity C (cavity recess), and the cavity C is opened when the die is open, and the cavity C is closed when the die is closed. Further, the molding die 20 is heated by a known built-in heater and performs resin molding by applying heat to the resin R supplied to or filled in the cavity C. In the molding die 20, the release film F is supplied to the die surface 21 a of the upper die 21, and the workpiece W is supplied to the die surface 22 a of the lower die 22.

  The upper die 21 includes a cavity piece 23, a clamper 24, and a base 25, and these die blocks are assembled. A through-hole is formed in the clamper 24 in the thickness direction. With the cavity piece 23 inserted into the through hole, the cavity piece 23 is fixed and supported on the base 25. Thereby, in the upper mold | type 21, the cavity C is comprised as an area | region enclosed by the lower surface of the cavity piece 23, and the internal peripheral surface of the clamper 24. FIG. The molding die 20 includes an elastic member 26 (for example, a spring) provided between the clamper 24 and the base 25. The clamper 24 is assembled to the base 25 via the elastic member 26, and is configured to be movable back and forth in the mold opening / closing direction.

  Further, the molding die 20 includes a seal member 27 (for example, an O-ring) provided between the inner peripheral surface of the clamper 24 and the outer peripheral surface of the cavity piece 23. The molding die 20 includes air passages 28 and 29 provided in the clamper 24 so as to pass through the outside and inside (including the cavity C) of the molding die 20. A suction device (for example, a vacuum pump) (not shown) is connected to the outside of the mold of the air passages 28 and 29. Thereby, when covering the metal mold | die surface 21a of the upper mold | type 21 with the release film F, the release film F can be adsorb | sucked via the air path 28 (inner peripheral side) and the air path 29 (outer peripheral side).

  Further, the molding die 20 includes a seal member 30 (for example, an O-ring) provided on the die surface 22a of the lower die 22. In addition, the molding die 20 includes an air passage 31 provided in the lower die 22 so as to pass through the outside and inside of the molding die 20. A suction device (for example, a vacuum pump) (not shown) is connected to the outside of the mold of the air path 31. As a result, in the mold closed state, the inside of the mold that is sealed by the sealing member 30 being crushed between the upper mold 21 and the lower mold 22 is sucked from the air passage 31 to be in a reduced pressure (vacuum) state. be able to.

  The molding die 20 includes an air passage 32 provided in the lower die 22 so as to pass through the outside of the molding die 20 and the die surface 22a. A suction device (for example, a vacuum pump) (not shown) is connected to the outside of the mold of the air path 32. Thereby, when the work W is set (supplied) on the mold surface 22 a of the lower mold 22, the work W can be sucked through the air path 32.

  The resin molding apparatus 10 includes a film loader hand 40 (film transport apparatus) that is provided on both sides of the mold 20 and that transports (supply) the roll-shaped release film F into the mold. The film loader hand 40 is controlled by a control unit 41 provided in the resin molding apparatus 10. The control unit 41 includes a CPU and a memory such as a ROM and a RAM, and executes a control operation by the CPU based on a control program recorded in the memory, thereby controlling the entire resin molding apparatus 10 including the film loader hand 40. .

  In the present embodiment, the release film F is easily peeled off from the molding die 20 after resin molding, and is made of a film material having heat resistance, flexibility, and extensibility. As the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.

  The film loader hand 40 includes an unwinding unit 50 and a winding unit 60, and conveys the release film F from the unwinding unit 50 to the winding unit 60. At this time, the release film F is supplied to the molding die 20 disposed between the unwinding unit 50 and the winding unit 60. That is, as shown in FIG. 1 and FIG. 2, an unused release film F fed from the unwinding section 50 is supplied to the opened mold 20, and the used release film F is passed through the mold 20. Is wound up by the winding unit 60. In addition, in the winding-up part 60 shown in FIG. 1, the state (state before use) in which the release film F is not wound up is shown. In the winding part 60 shown in FIG. 2, the release film F wound up in a state having wrinkles such as irregularities formed at the time of molding is shown.

  The unwinding unit 50 includes an unwinding shaft 51 from which the release film F is unwound, a measure roll 52 that measures the amount (transfer amount) of the release film F, and a guide roller 53 that guides the release film F. The winding unit 60 includes a winding shaft 61 on which the release film F is wound up, a roll 62 that feeds the release film F, and a guide roller 63 that guides the release film F. In the film loader hand 40, an unwinding shaft 51, a measure roll 52, a guide roller 53, a guide roller 63, a roll 62, and a winding shaft 61 are provided in order from upstream to downstream of transporting the release film F. The release film F is stretched between the winding shaft 61. In the initial state shown in FIG. 1, the unused release film F is attached to the unwinding shaft 51, and the tip of the release film F is attached to the winding shaft 61.

  The film loader hand 40 includes an unwinding servo motor 54 that is provided on the unwinding shaft 51 and rotates the unwinding shaft 51, and an encoder 55 that is disposed on the measure roll 52. Data transmission / reception is performed between the unwinding servo motor 54 and the control unit 41. The encoder 55 is used to measure the delivery amount (rotation speed) of the release film F fed from the unwinding shaft 51 via the major roll 52. Data is transmitted from the encoder 55 to the control unit 41. Thereby, in the film loader hand 40, the conveyance state of the release film F can be controlled under the control of the control unit 41. As the encoder 55, a servo motor similar to the unwinding servo motor 54 may be used, and an encoder incorporated therein may be used.

  The film loader hand 40 includes a winding servo motor 64 that is provided on the winding shaft 61 and rotates the winding shaft 61. Data is transmitted and received between the winding servo motor 64 and the control unit 41. In the film loader hand 40, the torque of the winding shaft 61 is controlled by the winding servo motor 64. In addition, although the conveyance state of the release film F is controlled by the control unit 41, when tension is applied to the release film F, the unwinding shaft 51 is reversely rotated with the winding shaft 61 stopped (fixed).

  The delivery amount of the release film F is obtained from the diameter of the major roll 52 and the rotation speed of the major roll 52. In the film loader hand 40, the torque of the unwinding shaft 51 is controlled by the unwinding servomotor 54 (control unit 41) based on the feed amount measured by the encoder 55. For example, even if the same force (current value) is applied to the unwinding shaft 51 and rotated, the torque for applying tension to the release film F differs depending on the diameter of the release film F. Therefore, the unwinding servo motor 54 (control unit 41) Controlled by.

  The diameter of the release film F on the unwinding shaft 51 at a predetermined operation time is calculated based on, for example, the outer diameter of the unused release film F, the total amount of the released release film F, and the thickness of the release film F. Is possible. Specifically, it can be obtained by subtracting the thickness of the release film F that has already been sent out from the outer diameter of the unused release film F in the initial state. Here, the thickness of the release film F that has already been sent out is obtained from the total amount (distance) of the released release film F and the thickness of the release film F. Note that the calculation of each value exemplified in the present embodiment does not necessarily have to be directly calculated. For this reason, for example, it may be incorporated as a calculation formula in the process of control, or the idea may be substantially used in the process of individual control.

  Further, as a method of calculating the diameter of the unwinding shaft 51 including the release film F, the rotation amount of the unwinding shaft 51 including the release film F when the predetermined amount of release film F is fed and the rotation of the major roll 52 are used. It is also possible to calculate by the ratio with the quantity. In this case, the outer diameter of the unwinding shaft 51 including the release film F is calculated as the product of the reciprocal of this rotation amount ratio and the outer diameter (fixed value) of the measure roll 52. The torque is controlled with reference to the size of the outer diameter of the unwinding shaft 51 (including the release film F) obtained by any method including the methods exemplified in these.

  The film loader hand 40 includes guide rollers 53 and 63 for guiding the release film F, and advance / retreat mechanisms 56 and 66 (for example, cylinders) to which these are attached and whose operation is controlled by the control unit 41. The guide roller 53 is provided in the vicinity of the upper mold 21 on the film conveyance upstream side (unwinding side), and the release film F is wound around the guide roller 53. On the other hand, the guide roller 63 is provided in the vicinity of the upper die 21 on the film conveyance downstream side (winding side), and the release film F is wound around. The guide rollers 53 and 63 are configured to be movable back and forth in the direction (vertical direction in the figure) perpendicular to the mold surface 21a of the upper mold 21 by the advance / retreat mechanisms 56 and 66.

  Thereby, the advance / retreat mechanisms 56, 66 can move the release film F to a position away from the mold surface 21a by lowering the guide rollers 53, 63 in the film supply process. On the other hand, the advance / retreat mechanisms 56 and 66 can raise the guide rollers 53 and 63 in the molding process to move the release film F to a position close to the mold surface 21a. That is, the vertical position control of the release film F guided by the guide rollers 53 and 63 is performed by operating the advance / retreat mechanisms 56 and 66 in conjunction with each other. In this way, the resin molding apparatus 10 controls the holding position of the release film F in the film loader hand 40.

  Next, a resin molding method (operation method) using the resin molding apparatus 10 according to the present embodiment will be described with reference to the drawings. FIG. 3 is a schematic flowchart of the resin molding apparatus 10, and FIG. 4 is a schematic flowchart of the molding process. 5-8 is explanatory drawing of a resin molding process.

  In the resin molding apparatus 10, a molding process for molding a part of the workpiece W is performed as a molding process (step S100). Prior to this, as shown in FIG. 1, the guide rollers 53 and 63 are lowered, and the release film F guided by these is moved to a position away from the mold surface 21a. Then, using the unwinding servo motor 54 and the winding servo motor 64, a molding die 20 in which an unused portion of the release film F that is stretched between the unwinding shaft 51 and the winding shaft 61 is opened. It is transported and supplied inside

  In the molding process, as shown in FIG. 1, the work W is set on the mold surface 22a of the lower mold 22 in a state where the molding mold 20 is opened (step S110). The workpiece W is sucked and held on the mold surface 22 a by suction from the air path 32. If a resin R (for example, liquid resin, granule resin, etc.) is set on the workpiece W in advance, the resin R is also set (supplied) inside the molding die 20 together with the workpiece W.

  Subsequently, as shown in FIG. 5, the release film F is attracted to the mold surface 21a of the upper mold 21 (step S120). Here, the guide rollers 53 and 63 are raised, and the release film F is moved to a position close to the mold surface 21a. At this time, the release film F is sucked and held along the mold surface 21 a including the inner surface of the cavity C by suction from the air paths 28 and 29. That is, the mold surface 21 a including the inner surface of the cavity C is covered with the release film F.

  Subsequently, the mold 20 is closed (step S130). Here, the upper die 21 and the lower die 22 are brought close to each other, and the seal member 30 on the die surface 22a of the lower die 22 is brought into contact (seal touch) with the die surface 21a of the upper die 21. Prior to this, by suction from the air passage 31, the inside of the molding die 20 is sealed, and at the same time, pressure reduction is started. Furthermore, the work W is clamped by the upper mold 21 and the lower mold 22 by bringing the upper mold 21 and the lower mold 22 closer to each other. As a result, the opening of the cavity C is closed by the workpiece W, and the component of the workpiece W and the resin R are accommodated in the cavity C.

  Subsequently, as shown in FIG. 6, molding is performed (step S140). Here, the upper die 21 and the lower die 22 are brought closer to each other and the elastic member 26 is pressed and contracted, and the resin R in the cavity C is filled and compressed in a state where the release film F is adsorbed to the die surface 21a. Then, the resin R is cured by heating for a predetermined time. Thereby, the component of the workpiece W is molded with the resin R (resin molding part).

  Subsequently, as shown in FIG. 7, when the workpiece W (molded product) is released, the release film F is released from the suction (step S150), and the mold is opened (step S160). Here, the suction from the air passages 28 and 29 is stopped, the release film F is released, and the upper die 21 and the lower die 22 are moved away. By controlling the adsorption state as described above, the release film F can be smoothly peeled, the load on the release film F can be reduced, and damage can be prevented. Further, by keeping the guide rollers 53 and 63 raised, the release film F can be brought into a state of being close to the mold surface 21a.

  Subsequently, as shown in FIG. 8, the release of the release film F from the workpiece W is completed by further moving the upper mold 21 and the lower mold 22 away from each other. By covering the mold surface 21a including the inner surface of the cavity C with the release film F during resin molding, it is possible to prevent the resin R from contacting the mold surface 21a and promote mold release from the cavity C. it can. Further, since the guide rollers 53 and 63 are kept raised, the release film F peeled off from the work W can be brought into a state of being close to the mold surface 21a. Thereafter, the suction from the air path 32 is stopped, the suction of the workpiece W is released, and the workpiece W is carried out of the mold by a workpiece transfer device (unloader) (not shown).

  After the molding process (step S100) is thus completed, the control unit 41 determines whether or not the release film F can be reused (step S200). The criteria for determining the reuse of the release film F can be arbitrarily set. For example, it can be determined by whether or not the reuse of the release film F has reached a predetermined number of times. Specifically, if the release film F is only used in one molding process, it is determined that it can be reused, and the second molding process is performed. In addition, as a method for determining the reuse of the release film F, the surface state of the release film F is imaged, and after image processing, the shape of the unevenness (the amount and depth of wrinkles) is calculated, or a displacement meter (for example, Measurement with a laser displacement meter), and the suitability of reuse can be determined based on the measured value. In addition, when the elongation of the release film F increases according to the number of times the mold process is used, it is possible to determine whether the reuse is appropriate according to the amount of elongation of the release film F. In this case, the suitability of reuse can be determined according to the magnitude of the tension applied to correct the elongation of the release film F, the amount of winding, and the like.

  When the release film F can be reused, the above-described operation of covering the mold surface 21a with the release film F, closing the mold and performing resin molding, then opening the mold and releasing the molded product is repeated. . In this case, the release film F after the mold release is in a state where wrinkles generated by adsorbing to the unevenness such as the cavity C remain. Therefore, in the present embodiment, the guide rollers 53 and 63 are kept raised so that the release film F is in contact with the mold surface 21a during repeated use of the release film F. Thereby, since the metal mold | die surface 21a and the release film F are contacting, these can be made relatively difficult to shift | deviate.

  In this case, for example, when a deviation between the mold surface 21a and the release film F occurs in a plurality of moldings, the release film F in which irregularities according to the shape of the cavity C are formed becomes the cavity C on the mold surface 21a. There is a possibility that it will be arranged at a position deviated from the position and cause a problem. Specifically, the release film F that is not flat cannot be properly clamped, and the resin R may leak. It is also conceivable that the unevenness of the release film F is transferred at the molding portion molded with the resin R, resulting in molding failure.

  FIG. 7 shows a state in which the release rollers F are in contact with the end of the mold surface 21a while the guide rollers 53 and 63 are kept raised even when the mold is opened. If the guide rollers 53 and 63 are lowered to separate the entire release film F from the mold surface 21a, a deviation occurs when the release film F is reused in the next molding step. For this reason, while using the release film F a plurality of times, it is possible to prevent the release film F from being shifted by maintaining the state where the guide rollers 53 and 63 are raised.

  In addition, the winding shaft 61 is fixed (stopped) by the winding servo motor 64 before the release film F is adsorbed after the workpiece W (molded product) is released during a plurality of uses of the release film F. Further, the unwinding servo motor 54 controls the unwinding shaft 51 with a predetermined torque to apply a predetermined tension to the release film F. Here, in the application of the predetermined tension, the torque control can be accurately performed by performing the torque control using the outer diameter of the unwinding shaft 51 including the release film F.

  For example, if torque control using the outer diameter of the used release film F in the winding shaft 61 is to be performed, the used release film F is wound in a wrinkled state formed during molding. . For this reason, it is difficult to accurately calculate the outer shape of the winding shaft 61 that has wound the used release film F, and it is difficult to appropriately transmit the force applied to the winding shaft 61. Because. On the other hand, the diameter of the unused release film F on the unwinding shaft 51 can be accurately grasped by the feeding amount and the thickness of the release film F, and the force applied to the unwinding shaft 51 can be further determined. The release film F can be appropriately transmitted. For this reason, torque control can be performed accurately and a predetermined tension can be appropriately applied to the release film F. Therefore, for example, when the tension becomes excessive or excessive, the position does not shift, and the shift due to the movement of the release film F can be reliably prevented. Note that when the positional deviation of the release film F is not likely to be a problem, the torque of the winding shaft 61 may be controlled by the winding servo motor 64 when applying tension to the release film F. Further, the torque may be controlled by both the unwinding shaft 51 and the winding shaft 61.

  On the other hand, if the mold process is repeated and the release film F has been used a predetermined number of times in the determination in step S200, it is determined that the reuse is inappropriate. In this case, the mold process is resumed after the unused part of the release film F is supplied after the mold is opened by the film supply process (steps S300, S400, S500).

  In order to supply the unused part of the release film F, first, the release film F is moved to the feeding position (step S300). Specifically, in a state where the mold is opened, the guide rollers 53 and 63 are lowered by the advancing / retreating mechanisms 56 and 66, and the release film F guided thereby is moved to a feeding position separated from the mold surface 21a.

  Next, the release film F is sent out (step S400), and the release film F is moved to the suction position (step S500). Specifically, the take-up servo motor 64 rotates the take-up shaft 61 to wind the release film F around the take-up shaft 61, and the unwind servo motor 54 rotates the unwind shaft 51 to remove the release film F. Send it out. At this time, since the feed amount is measured by the encoder 55, the unused portion of the release film F can be moved to the suction position facing the cavity C. After the unused part of the release film F is supplied, the molding process is resumed.

  Thus, since the usage-amount of the release film F in a molding process reduces by using the release film F in multiple times, the manufacture running cost of the workpiece | work W (molded article) can be reduced. Further, while the release film F is used a plurality of times, the release film F is held at a position in contact with the mold surface 21a without lowering the guide rollers 53 and 63, so that the release film F is prevented from being displaced. can do. However, if the mold is opened by releasing the mold while the release film F is adsorbed without lowering the guide rollers 53 and 63, a load is applied to the release film F. Therefore, by releasing the adsorption of the release film F at the time of mold release, the release film F can be peeled smoothly, the load can be reduced, and the release film F can be prevented from being damaged. Furthermore, after releasing the molded product and before adsorbing the release film F, the winding shaft 61 is fixed, and the unwinding shaft 51 is controlled with a predetermined torque, so that the release film F is prevented from being misaligned. be able to.

  Moreover, the effect which uses the release film F in this invention in multiple times becomes so high that the surface of a metal mold | die becomes large. In the present embodiment, a case where a so-called substrate is applied as the workpiece W has been described. However, a WLP (Wafer Level Package) using a circular workpiece such as a large wafer or a carrier having a board surface of 8 inches or 12 inches having a larger surface than a general substrate. In addition, by applying to large panel molding (LPM) that uses large panels with a side length exceeding 300mm as a workpiece, the effect of reducing the amount of release film F used is significant, and manufacturing running costs are reduced. Increases effectiveness.

  As described above, in the present embodiment, as illustrated in FIG. 1 and the like, the case of the resin molding apparatus 10 in which the cavity C is provided in the upper mold 21 has been described. Not limited to this, as shown in FIG. 9, the structure is turned upside down, and a cavity C is provided in the lower mold 22, and the present invention is also applied to a resin molding apparatus 10 </ b> A for supplying (sucking and holding) a release film F thereto. Can do. In the resin molding apparatus 10A shown in the figure with respect to the resin molding apparatus 10 described above, the work W is adsorbed and held on the upper mold 21 in a state where the mold is opened, and the resin R is supplied into the cavity C of the lower mold 22. Resin molding. In the resin molding apparatus 10A, other molding process steps (FIG. 3, FIG. 4 and the like) are performed in the same manner, and thus have the same effects as the resin molding apparatus 10.

  Moreover, in the above-described embodiment, as shown in FIG. 1 and the like, the case of the compression molding type resin molding apparatus 10 has been described. The present invention is not limited to this, and the present invention can also be applied to a transfer molding type resin molding apparatus 10B including a pot 70, a plunger 71, a cull 72, and a runner gate 73 as shown in FIG. In the resin molding apparatus 10 </ b> B, the resin R is supplied into the pot 70 in a state where the mold is opened, and the workpiece W is adsorbed and held on the mold surface 22 a (set part) of the lower mold 22. In the resin molding apparatus 10B, the release film F is supplied and held by suction so as to cover the mold surface 21a of the upper mold 21 including the cavity C, the cull 72, and the runner gate 73 in a state where the mold is opened. In the resin molding apparatus 10 </ b> B, the resin R is pressed by the plunger 71 in the pot 70 while the mold is closed, and the resin R is supplied to the cavity C through the cull 72 and the runner gate 73 to be molded. In the resin molding apparatus 10B, other molding process steps (FIG. 3, FIG. 4 and the like) are performed in the same manner, and thus have the same effects as the resin molding apparatus 10.

(Embodiment 2)
A resin molding method (operation method) using a resin molding apparatus 10 </ b> C provided with a film transport apparatus 80 according to Embodiment 2 of the present invention will be described with reference to the drawings. 11 to 31 are explanatory diagrams of the resin molding process. In the first embodiment, the case where a roll film is directly used as the release film F has been described. However, in the present embodiment, for example, a single wafer prepared by cutting out a long film from a roll film into a circular shape, a rectangular shape, or the like. The case where a film is used for resin molding a plurality of times will be described.

  As shown in FIG. 11, the film transport apparatus 80 includes a stage 81, a pair of rings 82 (holders), a roll-like release film F, and a drawer device (not shown). Here, one ring 82 is set on the stage 81, and the release film F is pulled out by the pulling device so as to pass above. The drawn-out release film F is pressed by the other ring 82 and sandwiched by one and the other ring 82 (FIG. 12). As this ring 82, for example, the outer peripheral region of the single-sheet release film F is arranged so that the release film F can be sandwiched and held by being overlapped on the outer periphery of the single-sheet release film F prepared by cutting. It is configured in an annular shape such as a surrounding annular shape or a rectangular annular shape.

  Specifically, as shown in FIG. 13, which is a view seen from the front direction orthogonal to the side direction from which the release film F shown in FIG. 12 is drawn, a side parallel to the release direction of the release film F (release film F It is preferable that the upper and lower rings 82 are connected to each other on the edge side) of the belt. In other words, the ring 82 is preferably configured to be larger than the width of the release film F so that the rings 82 can be connected to each other at a position where the release film F is not sandwiched. For this reason, the size of the ring 82 with respect to the release film F is smaller than the single-wafer release film F in the drawing direction of the release film F, and larger than the single-wafer release film F in the direction perpendicular to this direction. be able to. According to such a configuration, the ring 82 can be cut in a state where the release film F is sandwiched and held.

  Subsequently, as shown in FIG. 12, the release film F is cut outside the ring 82 by the cutting tool 83 provided in the film transport apparatus 80. When cutting the release film F, the ring 82 can also be sucked and held on the stage 81. The released release film F becomes a single sheet (single-sheet film). The ring 82 holds the outer periphery of the release film F so that tension is applied to the release film F. In addition, as a holding tool which hold | maintains the outer peripheral part of the release film F, it is not restricted to using the ring 82. FIG. For example, it is possible to use a plurality of clips that hold the outer peripheral portion of the release film F partially. As an example, when a rectangular release film F is used, one or a plurality of clip-shaped holders that sandwich each of the four sides from above and below can be provided on each of the four sides.

  Subsequently, as shown in FIG. 13, the conveyance jig 84 provided in the film conveyance device 80 is moved to above the stage 81 in order to hold the release film F via the ring 82. Subsequently, as shown in FIG. 14, the ring 82 (release film F) is held by the lowered conveying jig 84 (FIG. 14). The conveyance jig 84 includes a pressing portion 85 that presses the release film F on the inner side of the ring 82, and is configured in a frame shape with a central portion passing therethrough. Further, the conveying jig 84 includes a movable holding portion 86 that holds the ring 82 and moves the ring 82 in a direction (upward) opposite to a pressing direction of the pressing portion 85 (downward in the drawing). For example, the movable holding portion 86 is configured such that a claw portion 86a (chuck portion) that holds the ring 82 with the ring 82 therebetween is moved by a ratchet mechanism. This ratchet mechanism is a mechanism that can be held at an arbitrary height by being configured to be rotatable in only one direction within a certain angle range.

  Subsequently, as shown in FIG. 15, tension is applied to the release film F held by the ring 82. For example, the movable holding portion 86 is moved by a cylinder 90 (first movable portion) provided in the film transport device 80. The cylinder 90 is provided around the stage 81 so as to be movable up and down. By pushing up the claw portion 86a holding the ring 82 by the cylinder 90, the outer peripheral portion of the release film F held by the ring 82 is pushed upward. At this time, since the outer peripheral portion of the release film F is pulled while the central portion of the release film F is being pressed by the pressing portion 85 of the conveying jig 84, tension is applied to the release film F. Further, according to the ratchet mechanism provided in the movable holding portion 86, even when the release film F is pressed by the pressing portion 85, the movement of the claw portion 86a is limited to be only in the upward direction (one direction), and the release film F Can be tensioned.

Then, as shown in FIG. 16, resin R (for example, liquid resin, granule resin, etc.) is supplied onto the release film F to which tension is applied. Since the central part of the conveyance jig 84 penetrates, the resin R can be supplied onto the release film F from here. At this time, since the tension is applied to the release film F, the release film F is weighted by the resin R.
Can be prevented from being bent and the resin R approaching the center of the release film F.

  Subsequently, as shown in FIG. 17, the release film F is carried into a molding die 20 provided in the resin molding apparatus 10 </ b> C. Specifically, the mold is released together with the ring 82 in a state where tension is applied to the release film F by the conveying jig 84 inside the mold 20 that has been opened (the upper mold 21 and the lower mold 22 are separated). Load film F. In the molding die 20 of the resin molding apparatus 10C, the cavity C is provided in the lower die 22 as in FIG. As will be described later, the mold surface 22 a of the lower mold 22 including the inner surface of the cavity C is covered with the release film F. The workpiece W is attracted and held on the mold surface 21 a of the upper mold 21 through the air path 32.

  Incidentally, as shown in FIG. 18, the resin molding apparatus 10 </ b> C includes a cylinder 91 (second movable portion) that is provided around the molding die 20 and moves the movable holding portion 86 of the transport jig 84. The cylinder 91 is provided to be movable up and down around the lower mold 22 of the molding die 20, and can push up the claw portion 86 a that holds the ring 82 in the same manner as the cylinder 90. With such a resin molding apparatus 10C, the release film F is set on the mold surface 22a of the lower mold 22 (the upper surface of the clamper 24). Specifically, the movable holding portion 86 of the conveying jig 84 is moved by the cylinder 91 to apply tension to the release film F. In this case, if an appropriate tension is not applied, the release film F is heated by the heater of the lower mold 22 to be stretched and loosened, and the resin R is biased. On the other hand, by appropriately applying tension to the release film F by the operation of the cylinder 91, such a problem can be prevented from occurring. Next, the release film F is pressed against the mold surface 22 a by the pressing portion 85 of the conveying jig 84.

  Subsequently, as shown in FIG. 19 (the upper mold 21 is not shown), the release film F is adsorbed so as to cover the mold surface 22a including the inner surface of the cavity C through the air paths 28 and 29. At this time, the release film F is sucked along the mold surface 22a, and the release film F is set along the inner surface of the cavity C on the mold surface 22a. Further, since the resin R is set on the release film F, the resin R is set in the cavity C as it is.

  By the way, the lower mold 22 of the resin molding apparatus 10C is provided on the mold surface 22a of the lower mold 22 (the upper surface of the clamper 24), and includes a pocket 92 (recessed portion) for installing a ring 82 as a holder. The structure for installing the ring 82 as the holder is not necessarily provided on the lower mold 22, and a dedicated member can be provided on the outer periphery of the molding die 20.

  The lower mold 22 includes a mechanism for locking the ring 82. For example, a mechanism for locking the ring 82 is provided as an air passage 93 provided in the clamper 24 so as to pass through the outside and inside of the molding die 20. A suction device (for example, a vacuum pump) (not shown) is connected to the outside of the mold of the air passage 93. For this reason, when the release film F is sucked, the ring 82 that holds the outer peripheral portion of the release film F is stored in the pocket 92 and sucked through the air passage 93 so that it is sucked (held). At this time, the ring 82 is released by releasing the holding of the movable holding portion 86 of the conveying jig 84. Thus, by carrying in so that the ring 82 holding the release film F remains in the molding die 20, the release film F can be set at an accurate position. As will be described later, after the resin molding, the tension is reapplied on the stage 81 and the release film F is set on the molding die 20 again. The film F can be used multiple times for resin molding.

  In addition, as a mechanism for locking the ring 82 as a holder to the molding die 20, not only the above-described suction mechanism but also other mechanisms can be employed. For example, other locking mechanisms such as an engaging structure such as a swinging claw-like member or a keyway engaging structure can be used.

  Subsequently, as shown in FIG. 20, the conveyance jig 84 is retracted. At this time, since the ring 82 is released from the movable holding portion 86 of the conveying jig 84, the release film F remains sucked and held on the mold surface 22 a of the lower mold 22.

  Subsequently, as shown in FIG. 21, the upper die 21 and the lower die 22 are brought close to each other and the molding die 20 is closed. By the way, the upper mold 21 of the resin molding apparatus 10 </ b> C includes an escape portion 94 (recessed portion) provided on the mold surface 21 a. When the mold is closed, the ring 82 is accommodated by the escape portion 94 in the upper mold 21.

  Subsequently, as shown in FIG. 22, molding is performed. Here, the elastic member 26 is further compressed by bringing the upper mold 21 and the lower mold 22 closer to each other, and after the resin R in the cavity C is compressed, the resin R is cured by heating for a predetermined time. Thereby, the workpiece W is molded with the resin R.

  Subsequently, as shown in FIG. 23, the upper mold 21 and the lower mold 22 are moved away from each other, the mold 20 is opened, and the workpiece W (molded product) is released from the cavity C. At this time, the release of the release film F is released while the adsorption of the ring 82 is maintained. In this case, the release film F can be smoothly peeled from the molded product without providing the film loader hand 40 (specifically, the unwinding shaft 51 and the winding shaft 61) as shown in FIG. Specifically, since the lower mold 22 on the opposite side of the upper mold 21 that holds the workpiece W is held on the outer periphery of the release film F, the release film is formed on the outer periphery of the lower mold 22 like the film loader hand 40. F can be pulled, and the release film F can be peeled off from the molded product as shown in FIG. As described above, it is possible to prevent the release film F from being released while the release film F is attached to the molded product, and to facilitate the peeling of the release film F, while having a simple configuration.

  Subsequently, as shown in FIG. 24, the release of the release film F from the workpiece W is completed by further moving the upper mold 21 and the lower mold 22 away from each other. By covering the mold surface 22a including the inner surface of the cavity C with the release film F, it is possible to prevent the resin R from contacting the mold surface 22a and promote the release from the cavity C. However, the release film F peeled off from the workpiece W is stretched and becomes wrinkled.

  Subsequently, as shown in FIG. 25, a conveying jig 84 is carried into the mold 20 that has been opened. Subsequently, as shown in FIG. 26 (the upper die 21 is not shown), the ring 82 (release film F) is held by the lowered conveying jig 84. Subsequently, as shown in FIG. 27 (the upper die 21 is not shown), the release film F used together with the ring 82 is taken out from the molding die 20 opened by the conveying jig 84. In this embodiment, since the ring 82 for holding the release film F is left in the molding die 20 during resin molding, the ring 82 can be held and taken out by the conveying jig 84 after resin molding. For example, when it is assumed that the ring 82 that holds the release film F is not used, it is difficult to hold the release film F at the position where it was originally held in the heated and deformed release film F. However, since the release film F is held by the ring 82, the same position can be reliably held and conveyed regardless of the deformation of the release film F.

  Subsequently, the conveyance jig 84 carried out of the molding die 20 is carried over the stage 81 as shown in FIG. Subsequently, as shown in FIG. 29, the transport jig 84 is lowered to the stage 81 side, and the release film F used together with the ring 82 is set on the stage 81.

  Subsequently, as shown in FIG. 30, tension is applied again to the used release film F. Specifically, the release film F is pulled more strongly than a tension is applied to the release film F described with reference to FIG. That is, the claw part 86a holding the ring 82 is pushed up to a higher position by the cylinder 90, and the outer peripheral part of the release film F held by the ring 82 is pushed up to a higher position. As a result, the release film F is stretched more strongly with respect to the release film F that has been stretched by being heated and pressed in the molding die 20 having the projections and depressions, for example, a tension similar to the state shown in FIG. 15 is applied. F can be given.

  Subsequently, as shown in FIG. 31, a resin R (for example, a liquid resin, a granular resin, or the like) is supplied onto the release film F to which tension has been reapplied. At this time, even if the release film F has already been used for one or more moldings, the tension is appropriately applied. Therefore, the resin R is prevented from loosening when the resin R is supplied. It can prevent approaching to the center of F. Thereafter, using the used release film F, the steps described with reference to FIGS. 17 to 31 are sequentially repeated until a predetermined number of times are reached. In this process, since the release film F held by the ring 82 (holding tool) is used in the film setting process shown in FIGS. 17 to 18, the release film F is prevented from being displaced. Can be molded multiple times in the same part. According to this, generation | occurrence | production of the shaping | molding defect as mentioned above can be prevented.

  Subsequently, after repeating the above steps until the predetermined number of times in order, the release film F after use is discarded, and the steps including the step of preparing the release film F shown in FIG. F can be used for multiple moldings. As described above, the present embodiment using the single-sheet release film F can also be used for a plurality of molding operations, and the production running cost of the workpiece W (molded product) can be reduced.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the embodiment, the case where the release film is used a plurality of times has been described. The present invention is not limited to this, and the present invention can also be applied to the case where an unused portion of release film having no wrinkles is supplied for each resin molding operation.

  In addition, it is good also as a resin molding apparatus which can be shape | molded in multiple times using the sheet | seat release film F, without using a holder like a pair of rings 82. FIG. In this case, for example, a resin molding apparatus that molds the workpiece W by supplying the release film F and the resin R to the molding die 20 prepares a single-sheet release film F according to the shape of the molding die 20. A preparation unit, a film supply unit that supplies the prepared single-sheet release film F to the molding die 20, and a molding die 20 are molded a plurality of times using the single-layer release film F that is provided with the molding die 20. It can also be set as a structure provided with a press part.

  In this case, as a device (film preparation unit) for preparing a single-sheet release film F, as shown in FIG. 12, the structure is drawn from a roll film around which a long release film F is wound, and is cut out by a cutting tool 83. It can be. Note that the single-sheet release film F does not necessarily need to be prepared by cutting out, for example, when it is not necessary to cut out, as in the case where a plurality of single-sheet release films F can be stacked and supplied.

  Moreover, as a film supply part which supplies the sheet-like release film F prepared in this way to the molding die 20, the outer periphery of the sheet-like release film F is hold | maintained with the conveyance jig 84 as shown in FIG. The configuration for holding the outer periphery of the release film F may be a configuration in which the outer periphery of the release film F is sandwiched from the outside, or a configuration in which the upper surface of the release film F is adsorbed. It can be set as the structure which can hold | maintain and convey the conveyance jig 84 of such a structure with an inloader. In this case, the single-sheet release film F prepared by the film preparation unit is conveyed and supplied to the press unit including the molding die 20 by the film supply unit constituted by the conveyance jig 84 and the inloader.

  The single-sheet release film F may be loaded with the resin R, and the single-sheet release film F may be carried into the molding die 20 of the press section. Alternatively, only the single-sheet release film F may be carried into the molding die 20 of the press section without mounting the resin R. In this case, it is necessary to carry the resin R into the molding die 20 every time molding is performed a plurality of times using a single sheet of release film F.

  On the other hand, in the press section, for example, a molding die 20 as shown in FIG. 17 is provided, and molding is performed by opening and closing a pair of platens provided with an upper die 21 and a lower die 22. In this case, depending on whether one of the above-described methods for carrying out the resin R is applied, the resin R is applied after the single-sheet release film F is set on either the upper mold 21 or the lower mold 22. The resin R may be supplied sequentially, or the resin R may be mounted on the single-sheet release film F outside the press unit and carried in every molding. Then, the resin R and the workpiece W are supplied, and the molding is performed by closing the molding die 20.

  According to such a configuration, molding can be performed a plurality of times using the single-sheet release film F without using a holder such as the pair of rings 82. Thereby, for example, although the effect by using a holder in the embodiment mentioned above cannot be produced, management of a holder becomes unnecessary and the composition can be simplified. Moreover, when the wrinkle of the release film F has no problem in molding, it can be efficiently molded with a simple configuration.

20 Molding die 21a Mold surface 40 Film loader hand 51 Unwinding shaft 53 Guide roller 61 Winding shaft C Cavity F Release film W Workpiece

Claims (7)

Cover the mold surface with the roll-shaped release film supplied from the film transport device provided on both sides of the mold, close the mold and perform resin molding, then open the mold and release the molded product from the cavity A mold process for performing the process multiple times;
When it is determined that the release film is unsuitable for use, it has a film supply step of supplying an unused portion of the release film to the mold after opening the mold,
In the film conveying apparatus, the release film is moved to a position close to the mold surface during the molding step, and the release film is moved to a position separated from the mold surface in the film supply step. Controlling the holding position of the release film,
A resin molding method characterized in that the release film is moved and moved by a guide roller that can be moved back and forth in a direction perpendicular to the mold surface. Cover the mold surface with the roll-shaped release film supplied from the film transport device provided on both sides of the mold, close the mold and perform resin molding, then open the mold and release the molded product from the cavity A mold process for performing the process multiple times;
When it is determined that the release film is unsuitable for use, it has a film supply step of supplying an unused portion of the release film to the mold after opening the mold,
In the film conveying apparatus, the release film is moved to a position close to the mold surface during the molding step, and the release film is moved to a position separated from the mold surface in the film supply step. Controlling the holding position of the release film,
In the film conveying apparatus, the release film is stretched between the unwinding shaft and the winding shaft by using an unwinding servo motor for rotating the unwinding shaft and a winding servo motor for rotating the winding shaft. And
The delivery amount of the release film fed from the unwinding shaft through the measure roll is measured by an encoder provided in the measure roll, and the unwinding servo motor is used to measure the unwinding shaft based on the feed amount. Torque is controlled,
A resin molding method characterized by controlling the torque of the unwinding shaft by fixing the winding shaft after releasing the molded product in the molding step and before closing the mold. In the resin molding method according to claim 1 or 2,
In the molding step, resin molding is performed in a state where the release film is adsorbed to the mold surface, and the release film is released from the adsorption when the molded product is released. A resin molding method in which a release film and a resin are supplied to a mold to mold a workpiece,
Cut the release film from the roll sheet and supply it to the mold,
Repeating the molding process with the work and the resin supplied to the mold,
After supplying resin to the release film with the outer periphery of the release film held by a holder, the release film and the resin are supplied to the mold together with the holder,
Using the release film held by the holder for multiple moldings,
A resin molding method characterized by re-tensioning the release film every time the release film is used a plurality of times. A film transport device comprising a transport jig for transporting a single-sheet release film whose outer peripheral portion is held by a holder,
The transfer jig is
A pressing part for pressing the release film inside the holder;
A movable holding part that holds the holding tool and moves the holding tool in a direction opposite to the pressing direction of the pressing part;
A film conveying apparatus comprising: In the film conveyance apparatus of Claim 5 ,
A stage on which the holder is set;
A first movable part that is provided around the stage and moves the movable holding part of the transfer jig;
A film conveying apparatus comprising: In the resin molding apparatus provided with the film conveyance apparatus of Claim 5 or 6, and a metal mold | die,
A second movable part is provided around the mold and moves the movable holding part of the conveyance jig in a state where the mold surface is covered with the release film together with the conveyance jig. Resin molding equipment.

Images