TWI747649B - Resin molding method - Google Patents

Abstract

To provide a technology that can reduce the manufacturing and operating costs of molded products.

A resin molding method is provided with a structure of repeatedly cutting a single release film F from a film roll and supplying it to a mold 20, and molding the workpiece and resin supplied to the mold 20. The release film F After supplying the resin to the release film F in the state held by the holder 82, the release film F and the resin R together with the holder 82 are supplied to the mold 20, and the release film F held by the holder 82 It is used for multiple times of molding, and the release film F is re-applied with tension every time the release film F is used for multiple times.

Description

Resin molding method

The invention relates to a resin molding method and a resin molding device.

Japanese Patent Application Laid-Open No. 08-142105 (Patent Document 1) describes a technique in which resin is filled in a mold cavity covered with a release film to perform resin molding.

[Prior Technical Literature] [Patent Literature]

Patent Document 1 Japanese Patent Application Publication No. 08-142105

The release film after resin molding is formed with wrinkles due to stretching or unevenness. When resin molding is performed in a state where the release film has wrinkles, the wrinkles will be transferred to the molded product and cause poor molding. Therefore, it is preferable to supply a wrinkle-free release film (unused part) for each resin molding operation to perform resin molding. However, because the amount of release film used affects the manufacturing and operating costs of the molded product, there is a problem that the increase in the amount of use leads to higher costs.

An object of the present invention is to provide a technique capable of reducing the manufacturing and operating costs of molded products. In addition, one object, other objects, and novel features of the present invention should be clear from the description of this specification and the attached drawings.

The resin molding method of one solution of the present invention is characterized in that it comprises repeatedly cutting the release film from a film roll into a single piece and supplying it to the mold, and molding the workpiece and the resin supplied to the mold. The structure of the molding process is to supply resin to the release film while holding the outer peripheral portion of the release film with a holder, and then supply the release film and the resin together with the holder to the mold, and The release film held by the holder is used for multiple times of molding, and every time the release film is used multiple times, the release film is re-applied with tension. Accordingly, by using the single film (release film) multiple times, the amount of the single film used in the molding process can be reduced, so that the manufacturing operation cost of the molded product can be reduced. In addition, the single film can be prevented from being wrinkled and can be used for multiple times. Furthermore, it is possible to prevent the occurrence of defects due to the elongated single-piece film.

The resin molding apparatus, which is one of the solutions of the present invention, is characterized by having: a film conveying device provided with a conveying jig for conveying a single release film held by the outer peripheral portion by the holder, and the conveying jig is provided with: A pressing part that presses the release film located inside the holder; a movable holding part that holds the holder and moves the holder in a direction opposite to the pressing direction of the pressing part; and a mold. According to this, the single film can be prevented from wrinkling.

A brief description of the effects that can be obtained by a representative of the inventions disclosed in this case is as follows. The manufacturing and operating costs of molded products can be reduced.

In the following embodiments of the present invention, although necessary, the description will be divided into plural parts, etc., but in principle, they are not irrelevant to each other, and one is part or all of the other. The relationship between the modification, details, etc. Therefore, in all the drawings, the same reference numerals are given to members having the same function, and repeated descriptions thereof are omitted. In addition, the number of constituent elements (including number, numerical value, amount, range, etc.) is not limited by the specific number, and may be specific unless it is specifically stated or is clearly limited to a specific number in principle. Number above or below. In addition, when referring to the shape of a constituent element and the like, except for the case where it is specifically stated and the case that is not considered to be the case in principle, etc., it is assumed to include those that are substantially similar to or similar to the shape and the like.

(Embodiment 1) The resin molding apparatus 10 according to the first embodiment of the present invention will be described with reference to the drawings. 1 and 2 are schematic configuration diagrams (partial cross-sectional views) of the initial state and post-molding state of the resin molding apparatus 10, respectively. The resin molding apparatus 10 is a compression molding type using a long roll-shaped release film F (film roll), and resin R is used for resin molding (molding) of a workpiece W (for example, a substrate on which parts are mounted).

The resin molding apparatus 10 includes a molding die 20 having a pair of upper mold 21 and lower mold 22 (one mold and the other mold). The forming mold 20 is capable of opening and closing the mold using a known press mechanism, so that the upper mold 21 and the lower mold 22 are moved in contact or separated. In addition, in the forming mold 20, the upper mold 21 is provided with a cavity C (cavity recess), the cavity C is opened in the mold opened state, and the cavity C is closed in the mold closed state. In addition, the molding die 20 is heated by a well-known built-in heater, and resin molding is performed by applying heat to the resin R supplied or filled in the cavity C. In addition, the mold surface 21a of the upper mold 21 of the forming mold 20 is supplied with the release film F, and the mold surface 22a of the lower mold 22 is supplied with the workpiece W.

The upper mold 21 is composed of a cavity 23, a clamping member 24, and a base 25, and these mold blocks are assembled. A through hole is formed in the thickness direction of the holder 24. In the state where the cavity piece 23 is inserted into the through hole, the cavity piece 23 is fixed and supported by the base 25. Thereby, as for the upper mold 21, the cavity C is constituted by the area surrounded by the lower surface of the cavity member 23 and the inner peripheral surface of the clamping member 24. In addition, the forming mold 20 includes an elastic member 26 (for example, a spring) provided between the holder 24 and the base 25. The clamper 24 is assembled to the base 25 via the elastic member 26 and is configured to be movable forward and backward in the mold opening and closing direction.

In addition, the forming mold 20 includes a sealing member 27 (for example, an O ring) provided between the inner peripheral surface of the holder 24 and the outer peripheral surface of the cavity member 23. In addition, the forming mold 20 is provided with air paths 28 and 29 provided in the holder 24 so that the outside and the inside (including the cavity C) of the forming mold 20 can communicate with each other. An unillustrated suction device (for example, a vacuum pump) is connected to the air paths 28 and 29 on the outside of the mold. Thereby, when the mold surface 21a of the upper mold 21 is covered with the release film F, the release film F can be sucked through the air path 28 (inner peripheral side) and the air path 29 (outer peripheral side).

In addition, the forming mold 20 includes a sealing member 30 (for example, an O ring) provided on the mold surface 22 a of the lower mold 22. In addition, the forming mold 20 includes an air path 31 provided in the lower mold 22 such that the outside and the inside of the forming mold 20 communicate with each other. An unillustrated suction device (for example, a vacuum pump) is connected to the outside of the mold of the air path 31. Thereby, in the closed mold state, by sucking air from the air path 31 into the mold sealed by crushing the sealing member 30 between the upper mold 21 and the lower mold 22, it can be set to a reduced pressure (vacuum) state. .

In addition, the forming mold 20 includes an air path 32 provided in the lower mold 22 such that the outside of the forming mold 20 and the mold surface 22a can communicate with each other. An unillustrated suction device (for example, a vacuum pump) is connected to the outside of the mold of the air path 32. Thereby, when the workpiece W is placed (supplied) on the mold surface 22 a of the lower mold 22, the workpiece W can be sucked through the air path 32.

In addition, the resin molding apparatus 10 includes a film loading arm 40 (film conveying device) that is installed on both sides of the molding die 20 and conveys (supplies) the roll-shaped release film F to the inside of the die. The film loading arm 40 is controlled by the control unit 41 included in the resin molding apparatus 10. The control unit 41 is equipped with memory such as CPU, ROM, RAM, etc., and executes control actions by the CPU according to the control program recorded in the memory to control the entire resin molding apparatus 10 including the film loading arm 40.

In this embodiment, the release film F is one that is easily peeled from the molding die 20 after resin molding, and is composed of a film material having heat resistance, flexibility, and stretchability. As the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. are suitably used.

In addition, the film loading arm 40 includes an unwinding section 50 and a winding section 60, and conveys the release film F from the unwinding section 50 to the winding section 60. At this time, the release film F is supplied to the forming die 20 arranged between the unwinding part 50 and the winding part 60. That is, as shown in FIGS. 1 and 2, the unused release film F sent out from the unwinding part 50 is supplied to the opened mold 20, and the used release film F passes through the mold 20 in The winding part 60 is wound up. In addition, in the winding part 60 shown in FIG. 1, the state where the release film F was not wound up (the state before use) is shown. The winding part 60 shown in FIG. 2 shows the release film F wound up in a state having wrinkles such as concavities and convexities formed during molding.

The unwinding part 50 is provided with: the unwinding shaft 51 which winds the release film F; the measuring roller 52 which detects the delivery amount (transfer amount) of the release film F; and the guide roller 53 which guides the release film F. In addition, the winding section 60 includes a winding shaft 61 that winds the release film F, a feed roller 62 that conveys the release film F, and a guide roller 63 that guides the release film F. In the film loading arm 40, the unwinding shaft 51, the measuring roller 52, the guide roller 53, the guide roller 63, the feed roller 62, and the take-up shaft 61 are arranged in the order from the upstream to the downstream of the release film F. A release film F is erected between the output shaft 51 and the take-up shaft 61. In the initial state shown in FIG. 1, the unused release film F is attached to the unwinding shaft 51, and the tip of the release film F is attached to the winding shaft 61.

In addition, the film loading arm 40 includes: an unwinding servo motor 54 provided on the unwinding shaft 51 to rotate the unwinding shaft 51; and an encoder 55 provided on the measuring roller 52. Data is sent and received between the unwinding servo motor 54 and the control unit 41. In addition, the encoder 55 is used to measure the amount (the number of revolutions) of the release film F sent from the unwinding shaft 51 via the measuring roller 52. The data is sent from the encoder 55 to the control unit 41. Thereby, in the film loading arm 40, the conveying state of the release film F can be controlled under the control of the control unit 41. In addition, the encoder 55 uses the same servo motor as the unwinding servo motor 54, and an encoder built into it can also be used.

In addition, the film loading arm 40 includes a winding servo motor 64 provided on the winding shaft 61 to rotate the winding shaft 61. Data is transmitted and received between the winding servo motor 64 and the control unit 41. Furthermore, in the film loading arm 40, the torque of the winding shaft 61 is controlled by the winding servo motor 64. In addition, although the conveying state of the release film F is controlled by the control part 41, when tension is applied to the release film F, the unwinding shaft 51 is reversely rotated in the state which stopped (fixed) the take-up shaft 61. As shown in FIG.

The feeding amount of the release film F can be obtained from the diameter of the measuring roller 52 and the number of rotations of the measuring roller 52. In addition, in the film loading arm 40, the unwinding servo motor 54 (control section 41) controls the torque of the unwinding shaft 51 based on the feeding amount measured by the encoder 55. For example, even if the same force (current value) is applied to the unwinding shaft 51 to rotate it, since the torque for applying tension to the release film F varies depending on the diameter of the release film F, the unwinding servo motor 54 ( Controlled by the control unit 41).

The diameter of the release film F in the unwinding shaft 51 at a predetermined time of operation can be based on, for example, the outer diameter of the unused release film F and the total amount of the released release film F and the thickness of the release film F To figure it out. Specifically, it can be obtained by subtracting the delivered amount of the thickness of the release film F from the outer diameter of the unused release film F in the initial state. Here, the thickness of the released release film F is calculated from the total amount (distance) of the released release film F and the thickness of the release film F. In addition, it is not necessary to directly calculate the calculation of each value exemplified in this embodiment. Therefore, for example, as long as it is incorporated as a calculation formula in the control process, or the idea is actually used in the individual control process.

In addition, as a method of calculating the diameter of the unwinding shaft 51 containing the release film F, the rotation amount of the unwinding shaft 51 including the release film F and the amount of The ratio of the amount of rotation of the roller 52 is measured and calculated. In this case, the product of the reciprocal of the ratio of the rotation amount and the outer diameter (fixed value) of the measuring roller 52 is used to calculate the outer diameter of the unwinding shaft 51 including the release film F. The torque is controlled by referring to the size of the outer diameter of the unwinding shaft 51 (including the release film F) obtained by any method including these exemplified methods.

In addition, the film loading arm 40 includes guide rollers 53 and 63 for guiding the release film F; The guide roller 53 is provided in the vicinity of the upper mold 21 on the upstream side of the film conveyance (unwinding side), and the release film F is wound around it. On the other hand, the guide roller 63 is provided in the vicinity of the upper mold 21 on the downstream side (winding side) of the film conveyance, and the release film F is wound around it. The guide rollers 53 and 63 are configured to be able to advance and retreat in the direction orthogonal to the mold surface 21 a of the upper mold 21 (the vertical direction in the same figure) by the advance and retreat mechanisms 56 and 66.

Thereby, the advancing and retreating mechanisms 56 and 66 lower the guide rollers 53, 63 during the film supply process, and can move the release film F to a position separated from the mold surface 21a. On the other hand, the advance and retreat mechanisms 56 and 66 can raise the guide rollers 53, 63 during the molding process to move the release film F to a position close to the mold surface 21a. That is, the vertical position control of the release film F guided by the guide rollers 53, 63 is performed by operating the advance and retreat mechanisms 56, 66 in conjunction. In this way, the holding position of the release film F in the film loading arm 40 is controlled in the resin molding apparatus 10.

Next, the resin molding method (operation method) using the resin molding apparatus 10 of this embodiment will be described with reference to the drawings. FIG. 3 is a schematic flowchart of the resin molding apparatus 10, and FIG. 4 is a schematic flowchart of the molding process. 5 to 8 are explanatory diagrams of the resin molding process.

In the resin molding apparatus 10, the molding process is a molding process for molding the parts of the workpiece W (step S100). Prior to this, as shown in FIG. 1, the guide rollers 53, 63 are lowered, and the release film F guided by these is moved to a position separated from the mold surface 21a in advance. Next, using the unwinding servo motor 54 and the winding servo motor 64, the unused part of the release film F erected between the unwinding shaft 51 and the winding shaft 61 is transported to the inside of the opened forming mold 20 in advance. supply.

In the molding process, as shown in FIG. 1, in a state where the forming mold 20 is opened, the workpiece W is set on the mold surface 22a of the lower mold 22 (step S110). The workpiece W is sucked and held on the mold surface 22a by suction from the air path 32. If resin R (for example, liquid resin, pelletized resin, etc.) is placed on the workpiece W in advance, the resin R is also placed (supplied) inside the molding die 20 together with the workpiece W.

Next, as shown in FIG. 5, the release film F is attracted to the mold surface 21a of the upper mold 21 (step S120). Here, the guide rollers 53 and 63 are raised, and the release film F is moved to a position close to the mold surface 21a in advance. At this time, the release film F is sucked and held along the mold surface 21a including the inner surface of the cavity C by suction from the air paths 28 and 29. That is, the mold surface 21a including the inner surface of the cavity C is covered with the release film F.

Next, mold closing of the forming mold 20 is performed (step S130). Here, the upper mold 21 and the lower mold 22 are gradually approached, and the sealing member 30 positioned on the mold surface 22a of the lower mold 22 is brought into contact with the mold surface 21a of the upper mold 21 (seal contact). Prior to this, by suction from the air path 31 in advance, the inside of the forming mold 20 was sealed, and the pressure reduction was started at the same time. Furthermore, by gradually approaching the upper mold 21 and the lower mold 22, the workpiece W is clamped by the upper mold 21 and the lower mold 22. Thereby, the opening of the cavity C is closed by the workpiece W, and the parts of the workpiece W and the resin R are accommodated in the cavity C.

Next, as shown in FIG. 6, molding is performed (step S140). Here, the upper mold 21 and the lower mold 22 are brought closer to gradually compress the elastic member 26, the release film F is adsorbed on the mold surface 21a, and the resin R in the cavity C is filled and compressed, and then heated Time allows the resin R to harden. Thereby, the parts of the work W are molded by the resin R (resin molded part).

Next, as shown in FIG. 7, when the workpiece W (molded product) is released from the mold, the adsorption of the release film F is released (step S150), and the mold is opened (step S160). Here, the suction from the air paths 28 and 29 is stopped, the suction of the release film F is released, and the upper mold 21 and the lower mold 22 are gradually separated. By controlling the adsorption state of this kind, the release film F is smoothly separated, the burden on the release film F is reduced, and damage can be prevented. In addition, by keeping the guide rollers 53 and 63 raised in advance, it is possible to set the release film F and the mold surface 21a close to each other.

Next, as shown in FIG. 8, by further separating the upper mold 21 and the lower mold 22, the release film F from the workpiece W is peeled off. By covering the mold surface 21a containing the inner surface of the cavity C with the release film F in advance during resin molding, it is possible to prevent the resin R from contacting the mold surface 21a and promote mold release from the cavity C. In addition, since the guide rollers 53 and 63 are kept rising, it can be set in a state where the release film F peeled from the workpiece W is close to the mold surface 21a. After that, the suction from the air path 32 is stopped to release the suction of the workpiece W, and the workpiece W is carried out of the mold by a workpiece conveying device (unloader) not shown.

In this way, after the molding process (step S100) is completed, the control unit 41 determines whether the release film F can be reused (step S200). The criteria for judging the reuse of the release film F can be arbitrarily set. For example, it can be performed based on whether the reuse of the release film F has reached a predetermined number of times. Specifically, if the release film F is used for only one molding process, it is judged that it can be reused and the second molding process is performed. In addition, as a method of judging the reuse of the release film F, the surface condition of the release film F can also be photographed, and after image processing, the shape of the unevenness (amount or depth of wrinkles), etc., can be calculated as a displacement meter (e.g. Laser displacement meter) to determine whether it is suitable for reuse based on the value. In addition, when the extension of the release film F increases in response to the number of uses in the molding process, it can also be determined whether it is suitable for reuse in accordance with the extension of the release film F. In this case, it is also possible to determine whether it is suitable for reuse in accordance with the amount of tension added to correct the stretching of the release film F or the amount of winding.

When the release film F is reusable, the following actions are repeated: the mold surface 21a is covered with the release film F as it is, and after the mold is closed and resin molding is performed, the mold is opened to release the molded product. In this case, wrinkles caused by the release film F after the release from being adsorbed to the unevenness of the cavity C and the like remain in the release film F. Therefore, in this embodiment, during the repeated use of the release film F, the guide rollers 53 and 63 are kept raised in advance so that the release film F will contact the mold surface 21a. Thereby, the mold surface 21a is in contact with the release film F, so that it can be made relatively difficult to deviate.

In this case, for example, when the mold surface 21a deviates from the release film F during multiple times of molding, the release film F formed with unevenness that conforms to the shape of the mold cavity C is arranged in the mold surface 21a to deviate from the cavity. The position of C may cause trouble. Specifically, because the uneven release film F cannot be clamped properly, the resin R may leak. It is also conceivable that the unevenness of the release film F is transferred in the molded part molded with the resin R, and the molding is defective.

FIG. 7 shows a state where the release film F is in contact with the end of the mold surface 21a even if the guide rollers 53 and 63 are kept rising even when the mold is opened. If the guide rollers 53 and 63 are lowered and the release film F as a whole is separated from the mold surface 21a, deviation will occur when the release film F is reused in the next molding process. Therefore, while the release film F is used multiple times, by maintaining the state where the guide rollers 53 and 63 are raised, the release film F can be prevented from deviating.

In addition, while the release film F is used multiple times, after the workpiece W (molded product) is demolded and before the release film F is sucked, the winding shaft 61 is fixed (stopped) by the winding servo motor 64. In addition, the unwinding shaft 51 is controlled by the unwinding servo motor 54 with a predetermined torque, and a predetermined tension is applied to the release film F. Here, regarding the application of a predetermined tension, by performing torque control using the outer diameter of the unwinding shaft 51 containing the release film F, the torque control can be accurately performed.

For example, when it is assumed that torque control using the outer diameter of the used release film F in the take-up shaft 61 is to be performed, the used release film F is due to the wrinkles formed during forming. It is wound in the state. Therefore, it is difficult to accurately calculate the outer shape of the winding shaft 61 after winding the used release film F, and it is difficult to appropriately transmit the force added to the winding shaft 61. Conversely, the diameter of the unused release film F in the unwinding shaft 51 can be accurately grasped by the feeding amount and the thickness of the release film F. Furthermore, the force applied to the unwinding shaft 51 can be appropriately determined. The ground is conveyed to the release film F. Therefore, torque control can be performed accurately, and a predetermined tension can be appropriately applied to the release film F. Therefore, there will be no positional deviation due to, for example, excessive tension or excessively small tension, and the deviation due to the movement of the release film F can be reliably prevented. In addition, when tension is applied to the release film F when the positional deviation of the release film F is unlikely to cause problems, the winding servo motor 64 may also be used to control the torque of the winding shaft 61. In addition, the torque may be controlled by both the winding shaft 51 and the winding shaft 61.

On the other hand, in the judgment of step S200, the molding process is repeated, and if the release film F has been used a predetermined number of times, it is judged that it is not suitable for reuse. In this case, after the mold is opened in the film supply process (steps S300, S400, and S500) and the release film F of the unused portion is supplied, the molding process is restarted.

When supplying the unused part of the release film F, first, the release film F is moved to the feeding position (step S300). Specifically, in the mold opened state, the guide rollers 53, 63 are lowered by the advance and retreat mechanisms 56, 66, and the release film F guided by these is moved to a feeding position separated from the mold surface 21a.

Next, the release film F is fed (step S400), and the release film F is moved to the suction position (step S500). Specifically, the take-up shaft 61 is rotated by the take-up servo motor 64 to wind the release film F on the take-up shaft 61, and the take-up servo motor 54 is used to rotate the take-up shaft 51 to send out the release film F. At this time, since the delivery amount is measured by the encoder 55, the release film F of the unused part can be moved to the suction position facing the cavity C. After the unused part of the release film F is supplied, the molding process is restarted.

In this way, by using the release film F several times, the amount of the release film F used in the molding process is reduced, so that the manufacturing operation cost of the workpiece W (molded product) can be reduced. In addition, during the multiple use of the release film F, the release film F is held at a position where the release film F contacts the mold surface 21a without lowering the guide rollers 53, 63, so that the release film F can be prevented from deviating. However, when the mold is opened without lowering the guide rolls 53 and 63 and the release film F is maintained adsorbed, and the molded product is about to be released from the mold, a burden is applied to the release film F. Therefore, by releasing the adsorption of the release film F during mold release, the release film F can be peeled off smoothly, reducing the burden and preventing the release film F from breaking. Furthermore, after the molded product is demolded and before the release film F is adsorbed, the take-up shaft 61 is set to be fixed, and the take-up shaft 51 is controlled with a predetermined torque, which can reliably prevent the release film F from deviating. .

In addition, in the present invention, the effect of using the release film F multiple times is that the larger the surface of the mold, the higher the effect. In this embodiment, the case where a so-called substrate is used as the workpiece W has been described, and it is applicable to round workpieces such as large-sized wafers or carriers such as 8 inches or 12 inches whose disk surface is larger than a general substrate. WLP (Wafer Level Package; Wafer Level Package) or LPM (Large Panel Molding; Large Panel Molding) that uses a large panel with a side length of more than 300mm as a workpiece, etc., to reduce the amount of release film F used The effect is large, and the effect of reducing manufacturing and operating costs becomes high.

As described above, in the present embodiment, as shown in FIG. 1 and the like, the resin molding apparatus 10 in which the cavity C is provided in the upper mold 21 has been described. However, it is not limited to this, and it can also be applied to the resin molding apparatus 10A in the case where the structure is turned upside down, the cavity C is provided in the lower mold 22, and the release film F is supplied (suction and held) to the resin molding apparatus 10A as shown in FIG. With respect to the aforementioned resin molding apparatus 10, in the resin molding apparatus 10A shown in the same figure, the workpiece W is sucked and held in the upper mold 21 with the mold opened, and the resin R is supplied into the cavity C of the lower mold 22 Instead, resin molding is performed. In the resin molding apparatus 10A, since other molding processing steps (FIG. 3, FIG. 4, etc.) are performed in the same manner, it has the same functions and effects as the resin molding apparatus 10.

Moreover, in the above-mentioned embodiment, as shown in FIG. 1 etc., the case of the resin molding apparatus 10 of a compression molding type was demonstrated. But not limited to this, the present invention can also be applied to a transfer moulding type (transfer moulding) equipped with a barrel 70, a plunger 71, a runner 72, and a runner gate 73 as shown in FIG. The resin molding device 10B. In the resin molding apparatus 10B, the resin R is supplied into the cylinder 70 in the opened state, and the workpiece W is sucked and held on the mold surface 22a (set portion) of the lower mold 22. In addition, in the resin molding apparatus 10B, the mold surface 21a of the upper mold 21 including the cavity C, the runner 72 and the runner gate 73 is supplied and adsorbed and held by the mold surface 21a of the upper mold 21 in the mold opened state. . Then, in the resin molding apparatus 10B, the resin R is pressed by the plunger 71 in the cylinder 70 in the closed state, and is supplied to the cavity C through the runner 72 and the runner gate 73 to perform resin molding. In the resin molding apparatus 10B, since other molding processing steps (FIG. 3, FIG. 4, etc.) are performed in the same manner, it has the same effect as the resin molding apparatus 10.

(Embodiment 2) The resin molding method (operation method) using the resin molding apparatus 10C equipped with the film conveying device 80 of the second embodiment of the present invention will be described with reference to the drawings. 11 to 31 are explanatory diagrams of the resin molding process. In the foregoing embodiment 1, the case where the film roll is directly used as the release film F is described, but in this embodiment, the film is prepared for cutting a long film from a wound film roll into, for example, a round shape or a rectangular shape. The case where a single film is used multiple times in resin molding will be described.

As shown in FIG. 11, the film conveyance device 80 is equipped with: a work table 81; a pair of rings 82 (holder); a roll-shaped release film F; and a drawing device (not shown). Here, one of the rings 82 is placed on the work table 81, and the release film F is drawn out by a drawing device so as to pass above it. In such a way that the drawn release film F is held by the other ring 82, one of the rings and the other ring 82 are clamped (FIG. 12). As this ring 82, for example, the outer periphery of the single release film F prepared by cutting is overlapped so that the release film F can be sandwiched and held, and is configured to surround the outer periphery of the single release film F A ring shape such as a circular ring shape or a rectangular ring shape such as a region.

Specifically, as seen from the front direction orthogonal to the side direction of the release film F shown in FIG. 12, that is, as shown in FIG. 13, it is preferable that the release film F is parallel to the withdrawing direction. On the side (the side on the side of the edge of the release film F), the upper and lower rings 82 are configured to be connectable and fixable to each other. In other words, the ring 82 is configured to be larger than the width of the release film F so as to be configured to be able to connect the rings 82 to each other in a position where the release film F is not sandwiched. Therefore, the size of the ring 82 relative to the release film F can be set to be smaller than the single release film F in the drawing direction of the release film F, and larger than the single release film F in the straight direction in this direction . According to this structure, the release film F can be cut while the ring 82 clamps and holds the release film F.

Next, as shown in FIG. 12, the release film F is cut outside the ring 82 by the cutting tool 83 included in the film transport device 80. When the release film F is cut, the ring 82 can be sucked and held on the work table 81. The cut release film F becomes a single sheet (single sheet film). The ring 82 holds the outer peripheral part of the release film F in such a way that the release film F is given tension. In addition, as a holder for holding the outer peripheral portion of the release film F, the use of the ring 82 is not limited. For example, a plurality of clips that partially sandwich and hold the outer peripheral portion of the release film F can also be used. As an example, when a rectangular release film F is used, one or a plurality of clip-shaped holders are provided on each of the four sides to sandwich the four sides from the top and bottom.

Next, as shown in FIG. 13, in order to hold the release film F through the ring 82, the transfer jig 84 included in the film transfer device 80 is moved above the work table 81. Next, as shown in FIG. 14, the ring 82 (release film F) is held with the lowered transport jig 84 (FIG. 14). The conveyance jig 84 is provided with the pressing part 85 which presses the release film F located inside the ring 82, and is comprised in the frame shape which penetrates the center part. In addition, the transport jig 84 includes a movable holding portion 86 that holds the ring 82 and moves the ring 82 in a direction (upward direction) opposite to the pressing direction (downward direction in the figure) of the pressing portion 85. For example, the movable holding part 86 is comprised so that the claw part 86a (chuck part) which clamps and holds the ring 82 is moved by a ratchet mechanism. This ratchet mechanism is a mechanism that can be held at an arbitrary height by being configured to be rotatable in only one direction within a certain angle range.

Next, as shown in FIG. 15, tension is applied to the release film F held by the ring 82. For example, the movable holding portion 86 is movable by the cylinder 90 (first movable portion) included in the film transport device 80. The cylinder 90 is set to be able to move up and down around the work table 81. Since the claw portion 86a of the holding ring 82 is pushed up by the cylinder 90, the outer peripheral portion of the release film F held by the ring 82 is pushed up. At this time, since the outer peripheral portion of the release film F is stretched in a state where the center portion of the release film F is pressed by the pressing portion 85 of the transport jig 84, the release film F is given tension. In addition, according to the ratchet mechanism of the movable holding portion 86, even if the pressing portion 85 presses the release film F, the movement of the claw portion 86a can be restricted to only the upward direction (one direction), and the release film F can be provided tension.

Next, as shown in FIG. 16, resin R (for example, liquid resin, pellet resin, etc.) is supplied to the release film F to which tension has been applied. Since the center part of the transfer jig 84 penetrates, the resin R can be supplied to the release film F by this. At this time, since the release film F is given tension, it is possible to prevent the release film F from being deflected due to the weight of the resin R and the resin R deviates to the center of the release film F.

Next, as shown in FIG. 17, the release film F is carried into the inside of the molding die 20 included in the resin molding apparatus 10C. Specifically, the release film F and the ring 82 are carried into the opened mold 20 (the upper mold 21 and the lower mold 22 are separated) by the transfer jig 84 with the release film F being tensioned. The molding die 20 of the resin molding apparatus 10C is provided with a cavity C in the lower die 22 as in FIG. 9. As will be described later, the mold surface 22a of the lower mold 22 containing the inner surface of the cavity C is covered by the release film F. In addition, the workpiece W is sucked and held on the mold surface 21 a of the upper mold 21 through the air path 32.

As shown in FIG. 18, the resin molding apparatus 10C is provided with the cylinder 91 (2nd movable part) which is provided in the periphery of the molding die 20, and makes the movable holding part 86 of the conveyance jig 84 movable. The cylinder 91 is arranged to be able to move up and down around the lower mold 22 of the forming mold 20, and like the cylinder 90, the claw portion 86a of the holding ring 82 can be pushed up. Using this type of resin molding apparatus 10C, the release film F is set on the mold surface 22a of the lower mold 22 (the upper surface of the clamp 24). Specifically, the movable holding portion 86 of the transport jig 84 is made movable by the cylinder 91 and the release film F is applied with tension. In this case, when an appropriate tension is not applied, the release film F is stretched due to being heated by the heater of the lower mold 22 and slack, causing the resin R to deviate. Conversely, by appropriately applying tension to the release film F by the action of the cylinder 91, this problem can be prevented from occurring. Next, the release film F is pushed toward the mold surface 22a by the pressing portion 85 of the transport jig 84.

Next, as shown in FIG. 19 (the upper mold 21 is not shown), the release film F is sucked so as to cover the mold surface 22a including the inner surface of the cavity C through the air passages 28 and 29. At this time, the release film F is adsorbed in accordance with the mold surface 22a, and the release film F is arranged along the inner surface of the cavity C in the mold surface 22a. In addition, since the resin R is placed on the release film F, the resin R is placed in the cavity C in this manner.

The lower mold 22 of the resin molding apparatus 10C is provided with a mold surface 22a (upper surface of the clamp 24) provided on the lower mold 22 to provide a pocket 92 (recessed portion) belonging to the ring 82 of the holder. As a structure for installing the ring 82 belonging to this holder, it is not necessary to provide it on the lower mold 22, and a dedicated member may be provided on the outer periphery of the forming mold 20.

In addition, the lower mold 22 has a mechanism for locking the ring 82. For example, as an air path 93 provided in the holder 24 so as to pass through the outside and inside of the molding die 20, a mechanism for locking the ring 82 is provided. An unillustrated suction device (for example, a vacuum pump) is connected to the air path 93 on the outside of the mold. Therefore, when the release film F is sucked, the ring 82 holding the outer peripheral portion of the release film F is accommodated in the bag portion 92 and is sucked through the air path 93, so it is sucked (held). At this time, by releasing the holding of the movable holding portion 86 of the transport jig 84, the ring 82 is released. In this way, by carrying in the ring 82 holding the release film F so as to remain in the forming mold 20, the release film F can be placed in the correct position. As will be described later, after the resin is formed, tension is applied to the work table 81 again and the release film F is placed on the forming die 20 again. Since the alignment can be performed in this way, deviation can be prevented and the release film F can be molded in the resin multiple times use.

In addition, as a mechanism for locking the ring 82 belonging to the holder to the forming die 20, not only the above-mentioned suction mechanism, but other mechanisms can also be adopted. For example, it is also possible to use another locking mechanism such as an engaging structure such as a rocking claw-shaped member or a keyway engaging structure.

Next, as shown in FIG. 20, the transport jig 84 is evacuated. At this time, because the ring 82 is released from the movable holding portion 86 of the transport jig 84, the release film F is maintained sucked and held on the mold surface 22a of the lower mold 22.

Next, as shown in FIG. 21, the upper mold 21 and the lower mold 22 are brought close, and the forming mold 20 is closed. The upper mold 21 of the resin molding apparatus 10C includes an escape portion 94 (recessed portion) provided on the mold surface 21a. When the mold is closed, the ring 82 is accommodated in the upper mold 21 by the escape portion 94.

Next, as shown in Fig. 22, molding is performed. Here, the upper mold 21 and the lower mold 22 are further approached and the elastic member 26 is pressed to shrink it. After the resin R in the cavity C is compressed, the resin R is heated for a predetermined period of time to harden it. Thereby, the workpiece W is molded by the resin R.

Next, as shown in FIG. 23, the upper mold 21 and the lower mold 22 are separated, the forming mold 20 is opened, and the workpiece W (molded product) is released from the cavity C. At this time, the adsorption of the release film F is released while the adsorption of the ring 82 is maintained. In this case, even if the film loading arm 40 shown in FIG. 1 (specifically, the unwinding shaft 51 and the winding shaft 61) is not installed, the release film F can be smoothly peeled off from the molded product. Specifically, the lower mold 22 on the opposite side of the upper mold 21 holding the workpiece W is held by the outer periphery of the release film F, so the release film F can be drawn on the outer periphery of the lower mold 22 like the film loading arm 40. The release film F can be peeled off from the molded product as shown in Fig. 7. In this way, despite the simple structure, the release film F can be prevented from being released from the mold while being attached to the molded product, and the release film F can be peeled off smoothly.

Next, as shown in FIG. 24, by further separating the upper mold 21 and the lower mold 22, the release film F is peeled from the workpiece W. By covering the mold surface 22a containing the inner surface of the cavity C with the release film F, it is possible to prevent the resin R from contacting the mold surface 22a and promote the release from the cavity C. However, the release film F peeled from the workpiece W is stretched and becomes a wrinkled state.

Next, as shown in FIG. 25, the transport jig 84 is carried into the inside of the mold 20 with the mold opened. Next, as shown in FIG. 26 (the upper mold 21 system is not shown), the ring 82 (release film F) is held by the lowered transport jig 84. Next, as shown in FIG. 27 (the upper mold 21 is not shown), the release film F used with the ring 82 is taken out from the opened mold 20 by the transport jig 84. In this embodiment, since the ring 82 holding the release film F during resin molding is left in the molding die 20, the ring 82 can be held and taken out by the transport jig 84 after the resin molding. For example, assuming that the configuration of the ring 82 holding the release film F is not used, it is difficult to restore the original holding position in the release film F that has been deformed by heating. However, since the release film F is held by the ring 82, the release film F can be conveyed at the same position without regard to the deformation of the release film F.

Next, as shown in FIG. 28, the transfer jig 84 carried out from the forming mold 20 is carried in above the work table 81. Next, as shown in FIG. 29, the transfer jig 84 is lowered toward the work table 81 side, and the release film F used with the ring 82 is placed on the work table 81.

Next, as shown in FIG. 30, tension is reapplied to the used release film F. Specifically, the release film F is pulled stronger than applying tension to the release film F described with reference to FIG. 15. That is, the claw portion 86a of the holding ring 82 is pushed up to a higher position by the cylinder 90, and the outer peripheral portion of the release film F held by the ring 82 is pushed up to a higher position. Thereby, by further stretching the release film F that is stretched by heating and pressing in the molding die 20 having unevenness, for example, the same tension as the state shown in FIG. 15 can be applied to the release film F. Film F.

Next, as shown in FIG. 31, resin R (for example, liquid resin, pellet resin, etc.) is supplied to the release film F to which tension has been re-applied. At this time, even the release film F that has been used for more than one molding molding is still properly tensioned, so it can prevent slack when the resin R is supplied, and prevent the resin R from deviating to the release film F center of. After that, using the used release film F, the steps described with reference to FIGS. 17 to 31 are repeated sequentially for a predetermined number of times. Regarding this process, since the release film F held by the ring 82 (holder) is used throughout the film placement process shown in FIGS. 17 to 18, the release film F is prevented from deviating, and the release film F can be used The same part is molded several times. Accordingly, it is possible to prevent the occurrence of molding problems as described above.

Next, after repeating the above steps sequentially for a predetermined number of times, the used release film F is discarded, and the release film F can be removed by repeating the steps including preparing the release film F shown in FIG. 11 and later. The film F is used for multiple times of molding. As explained above, in this embodiment using a single release film F, it can also be used for multiple times of molding, and the manufacturing operation cost of the workpiece W (molded product) can be reduced.

As mentioned above, the present invention has been specifically described based on the embodiments, but the present invention is not limited to the above-mentioned embodiments, and of course various changes can be made without departing from the scope of the gist.

In the foregoing embodiment, the case where the release film is used multiple times has been described. However, it is not limited to this, and it can also be applied to the case where a release film of an unused portion without wrinkles is supplied per resin molding operation.

In addition, it is also possible to make a resin molding device that does not use a holder such as a pair of rings 82, but uses a single release film F that can be molded in multiple times. In this case, for example, the resin molding apparatus that supplies the release film F and the resin R to the molding die 20 to mold the workpiece W may also be configured to have a configuration in which a single piece of release is prepared in accordance with the shape of the molding die 20 The film preparation section of the molded film F; the film supply section that supplies the prepared single release film F to the forming die 20; and the molding die 20 is provided and the supplied single release film F is used for multiple molds Formed press section.

In this case, as a device (film preparation section) for preparing a single release film F, as shown in FIG. 12, a long release film F can be drawn out from the wound film roll and cut by a cutting tool 83 Out of the composition. In addition, the single release film F can be supplied in multiple layers in the same shape as the single release film F, and it is not necessary to prepare for cutting out when it is not necessary to cut it out.

In addition, as a film supply unit that supplies the single release film F prepared in this way to the forming die 20, the outer periphery of the single release film F is held by a transfer jig 84 as shown in FIG. 13. As the structure for holding the outer periphery of the release film F, the outer periphery of the release film F may be sandwiched from the outside, or the upper surface of the release film F may be adsorbed. The transfer jig 84 having such a structure can be held and transported by a loader (IN-LOADER). In this case, the single release film F prepared in the film preparation section is transported and supplied to the press section provided with the forming die 20 by a film supply section composed of a transport jig 84 or a loader.

It is also possible to mount the resin R on the single release film F and carry the single release film F into the molding die 20 of the press section. In addition, it is also possible to carry only the single release film F to the molding die 20 of the press section without the resin R being mounted. In this case, it is necessary to carry the resin R into the molding die 20 by using a single release film F of one sheet at a time to perform molding multiple times.

On the one hand, the press section is provided with a molding die 20 such as shown in FIG. 17, and a pair of platens provided with an upper die 21 and a lower die 22 are opened and closed to perform molding. In this case, it is also possible to apply any one of the above-mentioned loading methods of resin R, and after a single release film F is placed on any one of the upper mold 21 and the lower mold 22 in order To supply the resin R, it is also possible to mount the resin R on a single release film F outside the press section, and then carry it in according to each mold. Then, molding is performed by supplying the resin R and the workpiece W and closing the molding die 20.

According to this structure, a single release film F can be used for molding multiple times without using a holder such as a pair of rings 82. Thereby, for example, although the effect produced by using the holder in the above-mentioned embodiment cannot be obtained, it becomes unnecessary to manage a holder, and the structure can be simplified. In addition, when the wrinkles of the release film F do not cause problems in molding, efficient molding can be performed with a simple configuration.

10: Resin molding device 20: Forming mold 21: upper die 22: Lower die 21a, 22a: mold surface 23: Mould parts 24: Clamping parts 25: Pedestal 26: Elastic member 27: Sealing member 28, 29: air path 30: Sealing member 31: Air Path 32: Air path 40: Film loading arm 41: Control Department 50: Roll out part 51: Roll out the reel 52: Measuring roller 53,63: guide roller 54: Roll out servo motor 55: encoder 56,66: advance and retreat mechanism 60: Coiling section 61: take-up shaft 62: Feed roller 64: Take-up servo motor C: Mould cavity F: Release film R: Resin W: Workpiece

Fig. 1 is a schematic configuration diagram of an initial state of a resin molding apparatus (upper mold cavity, compression molding type) according to Embodiment 1 of the present invention. Fig. 2 is a schematic configuration diagram of the state after molding of the resin molding apparatus shown in Fig. 1. Fig. 3 is a schematic flow chart of the operation of the resin molding apparatus shown in Fig. 1. Fig. 4 is a schematic flow chart of the molding process shown in Fig. 3. Fig. 5 is an explanatory diagram of film adsorption in the resin molding process following Fig. 1; Fig. 6 is an explanatory diagram of molding after Fig. 5; Fig. 7 is an explanatory diagram of mold opening following Fig. 6. FIG. 8 is an explanatory diagram of the completion of film peeling after FIG. 7 is continued. Fig. 9 is a schematic explanatory view of a modification (lower mold cavity, compression molding type) of the resin molding apparatus according to the first embodiment of the present invention. Fig. 10 is a schematic explanatory view of another modification (upper mold cavity, transfer mold type) of the resin molding apparatus according to the first embodiment of the present invention. Fig. 11 is an explanatory diagram of film extraction in the resin molding step of the second embodiment of the present invention. Fig. 12 is an explanatory diagram of film cutting following Fig. 11. Fig. 13 is an explanatory diagram after Fig. 12 before film holding by means of a transport jig. Fig. 14 is an explanatory diagram after Fig. 13 is continued after the film is held by a transport jig. Fig. 15 is an explanatory diagram of film tension application following Fig. 14. Fig. 16 is an explanatory diagram of resin supply following Fig. 15. Fig. 17 is an explanatory diagram of loading the film into the forming die following Fig. 16. Fig. 18 is an explanatory diagram of film placement following Fig. 17. Fig. 19 is an explanatory diagram of the resin placement following Fig. 18. Fig. 20 is an explanatory diagram of the evacuation of the transport jig following Fig. 19; FIG. 21 is an explanatory diagram of mold closing following FIG. 20. Fig. 22 is an explanatory diagram of molding after Fig. 21; Figure 23 is an explanatory diagram of mold opening following Figure 22. FIG. 24 is an explanatory diagram of the completion of film peeling after FIG. 23 is continued. Fig. 25 is an explanatory diagram of the transfer of the jig into the forming mold after continuation of Fig. 24. Fig. 26 is an explanatory diagram of film holding by means of a transport jig following Fig. 25; Fig. 27 is an explanatory diagram of film removal by transporting a jig following Fig. 26; Fig. 28 is an explanatory diagram of loading and transporting the jig to the work stage after continuation of Fig. 27. Fig. 29 is an explanatory diagram of the placement of the transport jig after Fig. 28 is continued. Fig. 30 is an explanatory diagram of re-applying film tension after Fig. 29 is continued. Fig. 31 is an explanatory diagram of resin supply following Fig. 30;

10C: Resin molding device

20: Forming mold

21: upper die

22: Lower die

21a, 22a: mold surface

23: Mould parts

24: Clamping parts

25: Pedestal

26: Elastic member

27: Sealing member

28, 29: air path

32: Air path

80: Film conveying device

82: Ring

84: Transport fixture

85: pressing part

86: Movable holding part

86a: Claw part (chuck part)

91: Cylinder

92: pocket part (depressed part)

93: Air Path

94: escape part (depressed part)

C: Mould cavity

F: Release film

R: Resin

W: Workpiece

Claims (1)

A resin molding method that supplies a release film and resin to a mold to mold a workpiece. The method is characterized by repeatedly cutting the release film from a film roll into a single piece and supplying the release film to the mold and then supplying it to the mold. The composition of the process of molding the workpiece and the resin of the mold, after supplying the resin to the release film while holding the outer peripheral part of the release film with a holder, the release film and the The resin is supplied to the mold together with the holder, and the release film held by the holder is used for multiple times of molding. Each time the release film is used multiple times, the release film is re-tensioned.

Images