JP5934156B2 - Substrate transport and supply method and substrate transport and supply apparatus - Google Patents

Substrate transport and supply method and substrate transport and supply apparatus Download PDF

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JP5934156B2
JP5934156B2 JP2013170610A JP2013170610A JP5934156B2 JP 5934156 B2 JP5934156 B2 JP 5934156B2 JP 2013170610 A JP2013170610 A JP 2013170610A JP 2013170610 A JP2013170610 A JP 2013170610A JP 5934156 B2 JP5934156 B2 JP 5934156B2
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substrate
upper mold
mold surface
resin sealing
housing recess
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JP2015041640A (en
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直毅 高田
直毅 高田
中村　守
守 中村
敬太 水間
敬太 水間
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Towa Corp
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Priority to KR1020140072010A priority patent/KR101537479B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Description

本発明は、電子部品を装着した基板を圧縮樹脂封止装置における成形型部の所定位置に搬送供給するための基板搬送供給方法及び装置に関し、特に、基板を圧縮樹脂封止用の上型面に供給して保持させる場合において、この基板を上型面に効率良く且つ確実に保持させることができるように改善した基板の搬送供給方法とこの方法を実施するための基板の搬送供給装置の改良に関する。   The present invention relates to a substrate transport and supply method and apparatus for transporting and supplying a substrate on which an electronic component is mounted to a predetermined position of a mold part in a compression resin sealing device, and in particular, an upper mold surface for compressing resin sealing. In the case where the substrate is supplied and held, the substrate transport and supply method improved so that the substrate can be efficiently and reliably held on the upper mold surface, and the substrate transport and supply apparatus for carrying out the method is improved. About.

基板の搬送手段としては、例えば、搬送プレートの上面に基板を係止した状態で移動させるものや、吸着プレートの上面に基板を吸着した状態で移動させるもの等が知られている（例えば、特許文献１参照）。
このような搬送プレート等を用いて、表面（上面）に複数（多数）の電子部品（半導体素子等）を装着させた基板を搬送する場合は、該基板上の電子部品と該搬送プレート等の上面とが接触しないように、基板の表面を上向きにして、即ち、基板の裏面（底面）を該搬送プレート等の上面に接合させた状態で載置するのが通例である。 As the substrate transfer means, for example, one that moves while the substrate is locked on the upper surface of the transfer plate, one that moves while the substrate is attracted to the upper surface of the suction plate, etc. are known (for example, patents) Reference 1).
When transporting a substrate having a plurality of (many) electronic components (semiconductor elements, etc.) mounted on the surface (upper surface) using such a transport plate, the electronic components on the substrate and the transport plate, etc. In general, the substrate is placed with the surface of the substrate facing upward, that is, with the back surface (bottom surface) of the substrate bonded to the upper surface of the transport plate or the like so as not to contact the upper surface.

ところで、基板を圧縮樹脂封止装置における上型面に供給して保持させると共に、その基板上の電子部品を下型キャビティ内の溶融樹脂材料中に浸漬し且つこの樹脂を圧縮して成形する圧縮樹脂封止成形を行う場合は、上記したような搬送プレート等をそのまま応用することができない。
即ち、基板上の電子部品を圧縮樹脂封止手段を用いて封止成形する場合は、図10に略図示するように、圧縮樹脂封止装置Ａの上型１に設けた基板吸着機構２を介して、上型１の型面１aに基板Ｗの裏面側を吸着させ且つ基板Ｗに装着した電子部品３が下向き（下側）となるように保持させている。
従って、基板Ｗの搬送プレート４は、基板Ｗに装着した電子部品３を下向きにした状態で載置しなければならない。
このため、この基板搬送プレート４には、電子部品３を装着した基板Ｗの表面における周辺部位と接合して係止することができる係止部４aと、電子部品３が基板搬送プレート４側に接触しない状態で収容することができる収容凹部４ｂとが設けられている。
なお、電子部品３の樹脂封止成形は、上型１と下型５とを型締めして基板Ｗ上の電子部品３を下型５に設けた下型キャビティ５ａ内の溶融樹脂材料６中に浸漬すると共に、この溶融樹脂材料６を押圧部材５ｂにて圧縮することにより、電子部品３を樹脂封止するようにしている。 By the way, the substrate is supplied and held on the upper mold surface in the compression resin sealing device, and the electronic component on the board is immersed in the molten resin material in the lower mold cavity and the resin is compressed and molded. When resin sealing molding is performed, the above-described transport plate or the like cannot be applied as it is.
That is, when the electronic component on the substrate is sealed using the compression resin sealing means, the substrate suction mechanism 2 provided on the upper mold 1 of the compression resin sealing device A is provided as schematically shown in FIG. Thus, the back surface side of the substrate W is attracted to the mold surface 1a of the upper mold 1, and the electronic component 3 mounted on the substrate W is held downward (downward).
Therefore, the transport plate 4 of the substrate W must be placed with the electronic component 3 mounted on the substrate W facing down.
For this reason, the board transport plate 4 has a latching portion 4a that can be joined and latched with a peripheral portion on the surface of the substrate W on which the electronic component 3 is mounted, and the electronic component 3 on the board transport plate 4 side. An accommodation recess 4b that can be accommodated without contact is provided.
The resin sealing molding of the electronic component 3 is performed in the molten resin material 6 in the lower mold cavity 5 a in which the upper mold 1 and the lower mold 5 are clamped and the electronic component 3 on the substrate W is provided in the lower mold 5. In addition, the molten resin material 6 is compressed by the pressing member 5b and the electronic component 3 is resin-sealed.

基板Ｗは、上記したように、基板吸着機構２を介して上型１の型面１aに吸着保持させることができる。
しかしながら、基板搬送プレート４上に載置した基板Ｗはその周辺部位が係止部４ａの上面に係止されていること、また、基板Ｗの厚みは薄いこと、更に、基板Ｗの表面に装着された複数の電子部品３は下向きに支持されていることから、図10(2) に矢印にて示すように、基板Ｗの中央部が自重にて垂下し易い状態にある。
そして、このように下方へ弯曲した基板の変形状態においては、上型面１aに対して基板Ｗを確実に吸着保持させることができず、若しくは、その吸着保持効率が悪くなると云った問題がある。
また、基板Ｗの中央部が自重にて垂下し易い傾向は、近時における基板の大形化において特に顕著となっている。
また、基板Ｗ自体に反り等が発生しているような場合においては、その吸着保持効率を更に低下させる一因となっている。 As described above, the substrate W can be sucked and held on the mold surface 1a of the upper mold 1 via the substrate suction mechanism 2.
However, the substrate W placed on the substrate transport plate 4 has its peripheral portion locked to the upper surface of the locking portion 4a, the substrate W is thin, and is mounted on the surface of the substrate W. Since the plurality of electronic components 3 are supported downward, the central portion of the substrate W is likely to hang down by its own weight as indicated by an arrow in FIG.
In such a deformed state of the substrate bent downward, there is a problem that the substrate W cannot be reliably sucked and held on the upper mold surface 1a, or the suction and holding efficiency is deteriorated. .
Further, the tendency of the central portion of the substrate W to easily hang down due to its own weight is particularly noticeable in the recent increase in size of the substrate.
Further, in the case where the substrate W itself is warped or the like, this is one factor for further reducing the suction holding efficiency.

特開平０１−１１９１００号公報（第１頁の右下欄の第４〜９行目、第２図、第４〜５図）JP-A-01-119100 (4th to 9th lines in the lower right column on the first page, FIGS. 2 and 4 to 5)

本発明は、基板の搬送供給装置（基板搬送プレート部）上に載置した基板の中央部が垂下して弯曲状に変形した状態にあるときや基板に反り等が発生している場合においても、該基板を圧縮樹脂封止装置における上型面に効率良く且つ確実に吸着保持させることができる基板の搬送供給方法とこの方法を実施するための基板の搬送供給装置を提供することを目的とする。   The present invention can be applied to the case where the central portion of the substrate placed on the substrate transport and supply device (substrate transport plate portion) hangs down and is deformed into a curved shape, or even when the substrate is warped. An object of the present invention is to provide a substrate transport and supply method capable of efficiently and surely adsorbing and holding the substrate on the upper mold surface of the compression resin sealing device, and a substrate transport and supply device for carrying out this method. To do.

上記した目的を達成するための本発明に係る基板の搬送供給方法は、表面に複数の電子部品30を装着させた基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に搬送すると共に、電子部品30を装着した基板Ｗの表面側を下向きとし且つその反対側となる基板Ｗの裏面側を圧縮樹脂封止装置Ａにおける上型面10ａに吸着させ且つ保持させるための基板の搬送供給方法であって、
基板Ｗ表面の周辺部位と接合し且つ基板表面の周辺部位を所定の位置に係止するための係止部41ａと、基板Ｗ表面の電子部品30の全体を係止部41ａと接触しない状態で収容するための収容凹部41ｂとを備えた基板の搬送供給装置40の準備工程と、
基板Ｗ表面の周辺部位を基板の搬送供給装置40の係止部41ａに接合して係止し、且つ、基板Ｗ表面の電子部品30を基板搬送プレート部41の収容凹部41ｂに収容する基板の搬送供給装置40上への基板載置工程と、
基板載置工程を経た基板の搬送供給装置40を圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に搬送する基板の搬送供給装置40の前進工程と、
基板の搬送供給装置40の前進工程を経た基板の搬送供給装置40を相対的に上動させて基板Ｗの裏面側を圧縮樹脂封止装置Ａにおける上型面10ａの所定の位置に係合させる上型面10ａへの基板位置決工程と、
上型面10ａへの基板位置決工程を経た基板Ｗの裏面側を圧縮樹脂封止装置Ａにおける上型面10ａに接合させる上型面への基板接合工程と、
基板接合工程時に、基板Ｗの表面側に圧縮エア43ａを供給して基板Ｗの変形姿勢を矯正する基板姿勢矯正工程と、
基板姿勢矯正工程時に、及び／又は、基板姿勢矯正工程を経た後に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに吸着させる上型面への基板吸着工程と、
上型面への基板吸着工程時に、及び／又は、上型面への基板吸着工程を経た後に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに保持させる上型面への基板保持工程と、
上型面10ａへの基板保持工程を経た後に、基板の搬送供給装置40を相対的に下動させると共に、これを圧縮樹脂封止装置Ａの外部へ後退させる基板の搬送供給装置40の後退工程と、を含むことを特徴とする。 The substrate transport and supply method according to the present invention for achieving the above object transports a substrate W having a plurality of electronic components 30 mounted on the surface thereof to a position below the upper mold surface 10a in the compression resin sealing device A. At the same time, the substrate is transported so that the front surface side of the substrate W on which the electronic component 30 is mounted faces downward and the back surface side of the substrate W on the opposite side is attracted to and held by the upper mold surface 10a in the compression resin sealing device A. A supply method,
A locking portion 41a for joining the peripheral portion of the substrate W surface and locking the peripheral portion of the substrate surface at a predetermined position, and the entire electronic component 30 on the surface of the substrate W not in contact with the locking portion 41a. A preparation step of the substrate transport and supply device 40 provided with a housing recess 41b for housing;
A peripheral portion of the surface of the substrate W is joined and locked to the locking portion 41a of the substrate transport and supply device 40, and the electronic component 30 on the surface of the substrate W is received in the receiving recess 41b of the substrate transfer plate portion 41. A substrate mounting step on the transport supply device 40;
A forward process of the substrate transport and supply device 40 for transporting the substrate transport and supply device 40 that has undergone the substrate mounting process to a position below the upper mold surface 10a in the compression resin sealing device A;
The substrate transport and supply device 40 that has undergone the advancement process of the substrate transport and supply device 40 is relatively moved upward to engage the back side of the substrate W with a predetermined position of the upper mold surface 10a in the compressed resin sealing device A. A substrate positioning step on the upper mold surface 10a;
A substrate bonding step to the upper mold surface for bonding the back surface side of the substrate W that has undergone the substrate positioning process to the upper mold surface 10a to the upper mold surface 10a in the compression resin sealing device A;
A substrate posture correcting step of correcting the deformed posture of the substrate W by supplying compressed air 43a to the surface side of the substrate W during the substrate bonding step;
A substrate adsorption step to the upper mold surface that adsorbs the substrate W to the upper mold surface 10a in the compressed resin sealing apparatus A during the substrate posture correction process and / or after the substrate posture correction process;
Holding the substrate on the upper mold surface that holds the substrate W on the upper mold surface 10a in the compressed resin sealing apparatus A during the substrate adsorption process on the upper mold surface and / or after the substrate adsorption process on the upper mold surface. Process,
After the substrate holding process on the upper mold surface 10a, the substrate transport and supply device 40 is moved down relatively, and the substrate transport and supply device 40 is retracted outside the compressed resin sealing device A. It is characterized by including these.

また、本発明に係る基板の搬送供給方法は、基板姿勢矯正工程が基板搬送プレート部41における収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを収容凹部41ｂ内に供給することにより行うことを特徴とする。   In the substrate transport and supply method according to the present invention, the substrate posture correcting step supplies the compressed air 43a into the housing recess 41b from the plurality of compressed air supply holes 41c provided in the bottom surface of the housing recess 41b in the substrate transport plate portion 41. It is characterized by performing by doing.

また、本発明に係る基板の搬送供給方法は、基板姿勢矯正工程が基板Ｗと基板の搬送供給装置の係止部41ａとの両者にて密閉状の収容凹部41ｂを構成すると共に、収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを密閉状の収容凹部41ｂ内に供給することにより行うことを特徴とする。   Further, in the substrate transport and supply method according to the present invention, the substrate posture correcting step forms a sealed housing recess 41b in both the substrate W and the locking portion 41a of the substrate transport and supply device, and the housing recess 41b. This is characterized by supplying compressed air 43a from a plurality of compressed air supply holes 41c provided on the bottom surface of the inside of the housing into a sealed housing recess 41b.

また、本発明に係る基板の搬送供給方法は、基板姿勢矯正工程が基板Ｗと基板の搬送供給装置の係止部41ａとの両者にて密閉状の収容凹部41ｂを構成すると共に、収容凹部41ｂの底面に設けた流体圧力緩和手段56を介して圧縮エア43ａを密閉状の収容凹部41ｂ内に供給することにより行うことを特徴とする。   Further, in the substrate transport and supply method according to the present invention, the substrate posture correcting step forms a sealed housing recess 41b in both the substrate W and the locking portion 41a of the substrate transport and supply device, and the housing recess 41b. The compressed air 43a is supplied into the sealed housing recess 41b through the fluid pressure relaxing means 56 provided on the bottom surface of the housing.

上記した目的を達成するための本発明に係る基板の搬送供給装置は、表面に複数の電子部品30を装着させた基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に搬送すると共に、電子部品30を装着した基板Ｗの表面側を下向きとし且つその反対側となる基板Ｗの裏面側を圧縮樹脂封止装置Ａにおける上型面10ａに吸着させ且つ保持させるための基板の搬送供給装置であって、
基板Ｗを載置する基板搬送プレート部41と、
基板搬送プレート部41を圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に対して前進及び後退可能に配置するための進退往復動機構42とを備えており、
また、基板搬送プレート部41には、基板Ｗ表面の周辺部位と接合し且つ基板Ｗ表面の周辺部位を所定の位置に係止するための係止部41ａと、基板Ｗ表面の電子部品30の全体を係止部41ａと接触しない状態で収容するための収容凹部41ｂとを設け、
更に、基板搬送プレート部41における収容凹部41ｂの底面に複数の圧縮エア供給孔41ｃを配設し且つ圧縮エア供給孔41ｃと圧縮エア供給機構側とを連通接続させた基板の変形姿勢矯正手段43を配置して構成したことを特徴とする。 In order to achieve the above object, a substrate transport and supply device according to the present invention transports a substrate W having a plurality of electronic components 30 mounted on the surface thereof to a position below the upper mold surface 10a in the compression resin sealing device A. At the same time, the substrate is transported so that the front surface side of the substrate W on which the electronic component 30 is mounted faces downward and the back surface side of the substrate W on the opposite side is attracted to and held by the upper mold surface 10a in the compression resin sealing device A. A feeding device,
A substrate transport plate portion 41 for placing the substrate W;
An advancing and reciprocating mechanism 42 for disposing the substrate transport plate portion 41 so as to be able to advance and retract with respect to a position below the upper mold surface 10a in the compressed resin sealing device A;
Further, the substrate transport plate portion 41 includes an engaging portion 41a for joining the peripheral portion on the surface of the substrate W and locking the peripheral portion on the surface of the substrate W at a predetermined position, and an electronic component 30 on the surface of the substrate W. An accommodation recess 41b for accommodating the whole without being in contact with the locking portion 41a;
Further, a substrate deformation posture correcting means 43 in which a plurality of compressed air supply holes 41c are provided on the bottom surface of the accommodating recess 41b in the substrate transport plate portion 41 and the compressed air supply holes 41c and the compressed air supply mechanism side are connected in communication. It is characterized by being arranged.

また、本発明に係る基板の搬送供給装置は、基板の変形姿勢矯正手段43が、基板Ｗと基板搬送プレート部41の係止部41ａとの両者にて密閉状の収容凹部41ｂを構成すると共に、収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを密閉状の収容凹部41ｂ内に供給するように形成して構成したことを特徴とする。   In the substrate transport and supply apparatus according to the present invention, the substrate deformation posture correcting means 43 forms a sealed housing recess 41b with both the substrate W and the locking portion 41a of the substrate transport plate portion 41. The compressed air 43a is formed so as to be supplied from a plurality of compressed air supply holes 41c provided in the bottom surface of the housing recess 41b into the sealed housing recess 41b.

また、本発明に係る基板の搬送供給装置は、基板の変形姿勢矯正手段43が、基板Ｗと基板搬送プレート部41の係止部41ａとの両者にて密閉状の収容凹部41ｂを構成すると共に、収容凹部41ｂの底面に設けた流体圧力緩和機構56を介して圧縮エア43ａを密閉状の収容凹部41ｂ内に供給するように形成して構成したことを特徴とする。   In the substrate transport and supply apparatus according to the present invention, the substrate deformation posture correcting means 43 forms a sealed housing recess 41b with both the substrate W and the locking portion 41a of the substrate transport plate portion 41. The compressed air 43a is formed so as to be supplied into the sealed housing recess 41b via a fluid pressure relaxation mechanism 56 provided on the bottom surface of the housing recess 41b.

本発明によれば、基板の搬送供給装置（基板搬送プレート部）上に載置した基板Ｗの中央部が自重により垂下して弯曲状に変形した状態にあるときや基板Ｗに反りが発生している場合においても、該基板Ｗを圧縮樹脂封止装置Ａにおける上型の型面に効率良く且つ確実に吸着保持させることができる。
また、本発明によれば、基板Ｗの中央部が垂下し易い傾向にある近時の大形基板を搬送供給する場合において特に顕著な効果を得ることができる。 According to the present invention, the substrate W is warped when the central portion of the substrate W placed on the substrate transport and supply device (substrate transport plate portion) is suspended by its own weight and deformed into a curved shape. Even in this case, the substrate W can be efficiently and surely adsorbed and held on the upper mold surface of the compression resin sealing apparatus A.
Further, according to the present invention, a particularly remarkable effect can be obtained in the case of transporting and supplying a recent large-sized substrate in which the central portion of the substrate W tends to hang down.

本発明に係る基板の搬送供給装置の要部を概略的に示す一部切欠縦断面図であり、該搬送供給装置を圧縮樹脂封止装置における上型面の下方位置に移動させた前進工程時の状態を示している。FIG. 4 is a partially cutaway longitudinal sectional view schematically showing a main part of the substrate transport and supply device according to the present invention, and during the forward process in which the transport and supply device is moved to a position below the upper mold surface in the compression resin sealing device. Shows the state. 図１に対応する基板の搬送供給装置の概略平面図である。It is a schematic plan view of the board | substrate conveyance supply apparatus corresponding to FIG. 図１に対応する基板の搬送供給装置の縦断面図であり、図３(1) は該搬送供給装置の要部を示す縦断面図、図３(2) はその要部の拡大縦断面図である。FIGS. 3A and 3B are longitudinal sectional views of a substrate feeding / supplying device corresponding to FIG. 1, FIG. 3A is a longitudinal sectional view showing a main part of the feeding / supplying device, and FIG. It is. 圧縮樹脂封止装置の上型面に対する基板装着作用説明図であり、図４(1) は基板の搬送供給装置の前進工程時の状態を示しており、図４(2) はその要部拡大図である。FIG. 4 (1) shows the state of the substrate transfer and supply device during the forward process, and FIG. 4 (2) is an enlarged view of the main part. FIG. 圧縮樹脂封止装置の上型面に対する基板装着作用説明図であり、図５(1) は上型面への基板接合工程時の状態を示しており、図５(2) はその要部拡大図である。FIG. 5 (1) shows the state of the substrate bonding process to the upper mold surface, and FIG. 5 (2) is an enlarged view of the main part. FIG. 圧縮樹脂封止装置の上型面に対する基板装着作用説明図であり、図６(1) は上型面への基板保持工程時の状態を示しており、図６(2) はその要部拡大図である。FIG. 6 (1) shows the state of the substrate holding process on the upper mold surface, and FIG. 6 (2) is an enlarged view of the main part. FIG. 本発明に係る他の基板の搬送供給装置の概略平面図である。It is a schematic plan view of the conveyance supply apparatus of the other board | substrate which concerns on this invention. 本発明に係る更に他の基板の搬送供給装置の概略平面図である。It is a schematic top view of the conveyance supply apparatus of the further another board | substrate which concerns on this invention. 図８に対応する基板の搬送供給装置の縦断面図であり、図９(1) は該搬送供給装置の要部を示す縦断面図、図９(2) はその要部の拡大縦断面図である。FIGS. 9A and 9B are longitudinal sectional views of the substrate feeding and supplying apparatus corresponding to FIG. 8. FIG. 9A is a longitudinal sectional view showing an essential part of the conveying and feeding apparatus, and FIG. It is. 従来の基板の搬送供給方法を用いて圧縮樹脂封止装置における上型面に基板を装着する場合の説明図であって、図10(1) は該搬送供給装置を圧縮樹脂封止装置における上型面の下方位置に移動させた状態を示す縦断面図、図10(2) はその上型面に基板を装着した状態を示す要部の拡大縦断面図である。FIG. 10 (1) is an explanatory view when a substrate is mounted on an upper mold surface in a compression resin sealing device using a conventional substrate transfer and supply method, and FIG. FIG. 10 (2) is an enlarged longitudinal sectional view of the main part showing a state where the substrate is mounted on the upper mold surface.

以下、本発明を、図１乃至図６に示す第一実施例図に基づいて説明する。   Hereinafter, the present invention will be described based on the first embodiment shown in FIGS.

図１は基板の搬送供給装置40を圧縮樹脂封止装置Ａにおける上型10（上型面10ａ）の下方位置に移動させた状態を示しており、また、図２及び図３は基板の搬送供給装置40の要部を示しており、また、図４乃至図６は基板Ｗを圧縮樹脂封止装置Ａの上型面10ａへ装着させる場合について示している。   FIG. 1 shows a state in which the substrate transport and supply device 40 is moved to a position below the upper mold 10 (upper mold surface 10a) in the compression resin sealing device A, and FIGS. 2 and 3 illustrate the substrate transport. FIG. 4 to FIG. 6 show the case where the substrate W is mounted on the upper mold surface 10a of the compression resin sealing device A. FIG.

まず、圧縮樹脂封止装置Ａの概要について説明する。
圧縮樹脂封止装置Ａには、通常の場合、固定上型10と、その上型面10ａの下方位置において上下動可能に配置した可動下型50とが備えられている（図１参照）。
また、上型10には基板Ｗを吸引作用にて上型面10ａに吸着させる基板吸着機構20と、上型面10ａに吸着させた基板Ｗを保持させる基板保持機構70とを備えている。 First, the outline | summary of the compression resin sealing apparatus A is demonstrated.
The compression resin sealing device A is normally provided with a fixed upper mold 10 and a movable lower mold 50 arranged so as to be vertically movable at a position below the upper mold surface 10a (see FIG. 1).
Further, the upper mold 10 is provided with a substrate adsorption mechanism 20 that adsorbs the substrate W to the upper mold surface 10a by suction and a substrate holding mechanism 70 that holds the substrate W adsorbed on the upper mold surface 10a.

また、上記した基板吸着機構20は、上型面10ａに開口した複数の吸気孔20ａと、この複数の吸気孔20ａと減圧機構（図示なし）側とを連通接続させて構成している。
従って、上型面10ａに接合させた基板Ｗは、複数の吸気孔20ａに生じる減圧機構からの吸引作用（真空引作用）によって該上型面10ａに吸着させることができるように設けられている。 The substrate suction mechanism 20 is configured by connecting a plurality of intake holes 20a opened in the upper mold surface 10a, and the plurality of intake holes 20a and the pressure reducing mechanism (not shown) side.
Accordingly, the substrate W bonded to the upper mold surface 10a is provided so that it can be adsorbed to the upper mold surface 10a by a suction action (vacuum drawing action) from the pressure reducing mechanism generated in the plurality of intake holes 20a. .

また、下型50には樹脂材料を供給する下型キャビティ50ａと、この下型キャビティ50ａ内にて加熱溶融化した樹脂材料60を圧縮するための押圧部材50ｂとが設けられている。
また、上型面10ａに対する基板Ｗの装着は、後述する手順によって、電子部品30を装着していない基板Ｗの裏面側を上型面10ａに吸着させ且つ保持させることにより行われる。
従って、このとき、上型面10ａに吸着させた基板Ｗ上の電子部品30は下向きに保持されることになる。
なお、基板Ｗの表面には複数（多数）の電子部品が装着されているが、図ではこれを簡略化して示している。 The lower mold 50 is provided with a lower mold cavity 50a for supplying a resin material and a pressing member 50b for compressing the resin material 60 heated and melted in the lower mold cavity 50a.
Further, the mounting of the substrate W on the upper mold surface 10a is performed by adsorbing and holding the back surface side of the substrate W on which the electronic component 30 is not mounted on the upper mold surface 10a according to a procedure described later.
Therefore, at this time, the electronic component 30 on the substrate W attracted to the upper mold surface 10a is held downward.
Note that a plurality (many) of electronic components are mounted on the surface of the substrate W, but these are shown in a simplified manner in the drawing.

また、上記圧縮樹脂封止装置Ａを用いて基板Ｗ上の電子部品30を樹脂封止するには、基板の搬送供給装置40を圧縮樹脂封止装置Ａの外部へ移動させた後に、上型10と下型50とを型締めして基板Ｗ上の電子部品30を下型50に設けた下型キャビティ50ａ内の溶融樹脂材料60中に浸漬すると共に、この溶融樹脂材料60を押圧部材50ｂにより所定の樹脂圧にて圧縮成形することによって行われる。   In order to resin-encapsulate the electronic component 30 on the substrate W using the compression resin sealing apparatus A, the upper mold is moved after the substrate transport and supply apparatus 40 is moved to the outside of the compression resin sealing apparatus A. 10 and the lower mold 50 are clamped so that the electronic component 30 on the substrate W is immersed in the molten resin material 60 in the lower mold cavity 50a provided in the lower mold 50, and the molten resin material 60 is pressed into the pressing member 50b. Is performed by compression molding at a predetermined resin pressure.

なお、基板Ｗ上の電子部品30は下型キャビティ50ａの形状に対応する樹脂成形体内に一括して樹脂封止される。
そして、一括して樹脂封止された各電子部品は、後工程となる切断加工工程において、個々の電子部品毎に切断分離されて製品となる。 The electronic components 30 on the substrate W are collectively resin-sealed in a resin molded body corresponding to the shape of the lower mold cavity 50a.
Then, the electronic components collectively sealed with the resin are cut and separated into individual electronic components in a subsequent cutting process, which becomes a product.

次に、基板の搬送供給装置40について説明する。
基板の搬送供給装置40は、基板Ｗを載置する基板搬送プレート部41と、
基板搬送プレート部41を圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に対して前進及び後退可能に配置するための進退往復動機構42とを備えている。
また、基板搬送プレート部41には、基板Ｗ表面の周辺部位と接合し且つ該基板Ｗ表面の周辺部位を所定の位置に係止するための係止部41ａと、該基板Ｗ表面の電子部品30を係止部41ａと接触しない状態で収容するための収容凹部41ｂとが設けられている。
更に、基板搬送プレート部41における収容凹部41ｂの底面に複数の圧縮エア供給孔41ｃを配設し且つ該圧縮エア供給孔41ｃと圧縮エア供給機構（図示なし）側とを連通接続させた基板の変形姿勢矯正手段43を配置して構成されている。 Next, the substrate transport / supply apparatus 40 will be described.
The substrate transport and supply device 40 includes a substrate transport plate unit 41 on which the substrate W is placed,
A back and forth reciprocating mechanism 42 is provided for disposing the substrate transport plate portion 41 so as to be capable of moving forward and backward with respect to a position below the upper mold surface 10a in the compressed resin sealing device A.
In addition, the substrate transport plate portion 41 includes an engaging portion 41a for joining the peripheral portion on the surface of the substrate W and locking the peripheral portion on the surface of the substrate W at a predetermined position, and an electronic component on the surface of the substrate W. An accommodation recess 41b is provided for accommodating 30 in a state where it is not in contact with the locking portion 41a.
Furthermore, a plurality of compressed air supply holes 41c are provided on the bottom surface of the housing recess 41b in the substrate transport plate portion 41, and the compressed air supply holes 41c and the compressed air supply mechanism (not shown) side are connected in communication. The deformed posture correcting means 43 is arranged.

次に、圧縮樹脂封止装置Ａと基板の搬送供給装置40との両者間において協働するように関係付けて配置される基板保持機構70について説明する。
即ち、この基板保持機構70は、上型10の両端部等の適当な個所に設けた少なくとも一対の基板保持爪71と、該各基板保持爪71の配設位置及び配設数に対応する基板の搬送供給装置40における基台44上の各位置に立設させた該各基板保持爪71の操作用ピン72とから構成されている。
また、上記した基板保持爪71は上型10に固設した支持軸73に回動自在の状態で枢着されている。
また、この基板保持爪71の基端部71ａには弾性部材71ｂの弾性にて下方へ付勢した押動ピン71ｃによる弾性押圧力が加えられている。
更に、基板保持爪71の基端部71ａに押動ピン71ｃの弾性押圧力が加えられているとき、その先端部71ｄは上記支持軸73を中心として回動すると共に、該先端部71ｄを上型面10ａの下面位置にまで突出させることができるように設けられている（図４参照）。 Next, a description will be given of the substrate holding mechanism 70 that is disposed so as to cooperate between the compressed resin sealing device A and the substrate transport and supply device 40.
That is, the substrate holding mechanism 70 includes at least a pair of substrate holding claws 71 provided at appropriate positions such as both ends of the upper mold 10, and substrates corresponding to the arrangement positions and the number of arrangements of the substrate holding claws 71. And the operation pins 72 of the respective substrate holding claws 71 which are erected at respective positions on the base 44 in the transport and supply device 40 of the present invention.
The substrate holding claw 71 is pivotally attached to a support shaft 73 fixed to the upper mold 10 so as to be rotatable.
Further, the base end portion 71a of the substrate holding claw 71 is applied with an elastic pressing force by the pressing pin 71c biased downward by the elasticity of the elastic member 71b.
Further, when the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw 71, the tip end portion 71d rotates about the support shaft 73, and the tip end portion 71d is moved upward. It is provided so that it can protrude to the lower surface position of the mold surface 10a (see FIG. 4).

また、基板保持爪71の操作用ピン72は、上記した基板保持爪71の基端部71ａの位置と対応する基台44上の位置に立設されている。
そして、後述するように、基板の搬送供給装置40が上型面10ａの下面位置へ移動する前進移動時及びこの位置から外部へ退避する後退移動時と、基板Ｗを上型面10ａに接合させる上動時及びこの位置からの下動時において、該基板の搬送供給装置40と同じ方向へ同時に移動するように設けられている。 The operation pin 72 of the substrate holding claw 71 is erected at a position on the base 44 corresponding to the position of the base end portion 71a of the substrate holding claw 71 described above.
Then, as will be described later, the substrate W is bonded to the upper mold surface 10a during the forward movement when the substrate transport and supply device 40 moves to the lower surface position of the upper mold surface 10a and when the substrate moves backward from the position to the outside. The substrate is provided so as to move simultaneously in the same direction as the substrate transport and supply device 40 during the upward movement and the downward movement from this position.

なお、上記したように、基板保持爪71の基端部71ａに押動ピン71ｃの弾性押圧力が加えられているとき、その先端部71ｄは、図４に示すように、上記支持軸73を中心として回動すると共に、該先端部71ｄを上型面10ａの下面位置にまで突出させることができるように設けられている。
逆に、図５に示すように、基板保持爪71の操作用ピン72と基板搬送プレート部41上の基板Ｗとが同時に上動した場合、該操作用ピン72の上端部が基板保持爪71の基端部71ａを押し上げてその先端部71ｄが上記支持軸73を中心として回動し該先端部71ｄを上型面10ａの外方へ退避させることができるように設けられている。
そして、基板搬送プレート部41上における基板Ｗの上動は、該先端部71ｄを上型面10ａの外方へ退避させた後に行われるように関係付けられており、従って、基板保持爪71の先端部71ｄが基板搬送プレート部41上における基板Ｗの上動作用を阻害しないように設けられている。 As described above, when the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw 71, the distal end portion 71d has the support shaft 73 attached thereto as shown in FIG. While rotating around the center, the tip 71d is provided so as to protrude to the position of the lower surface of the upper mold surface 10a.
Conversely, as shown in FIG. 5, when the operation pin 72 of the substrate holding claw 71 and the substrate W on the substrate transport plate portion 41 are moved up simultaneously, the upper end portion of the operation pin 72 is moved to the substrate holding claw 71. The base end portion 71a is pushed up so that the tip end portion 71d rotates about the support shaft 73 so that the tip end portion 71d can be retracted to the outside of the upper mold surface 10a.
The upward movement of the substrate W on the substrate transport plate portion 41 is related to be performed after the front end portion 71d is retracted to the outside of the upper mold surface 10a. The tip 71d is provided so as not to hinder the upward movement of the substrate W on the substrate transport plate portion 41.

また、上記した上型10の上型面10ａには、基板Ｗを該上型面10ａの所定位置に案内するための位置決ピン10ｂが突設されている（図１参照）。
また、該位置決ピン10ｂの突設位置と対応する上記搬送供給装置40の係止部41ａの位置には、該位置決ピン10ｂ用の逃げ穴41ｄが設けられている（図２参照）。
なお、上型面10ａの位置決ピン10ｂと係止部41ａの逃げ穴41ｄとの配設位置及び配設数は必要に応じて適宜に選択して構成することができる。 Further, a positioning pin 10b for guiding the substrate W to a predetermined position on the upper mold surface 10a is projected from the upper mold surface 10a of the upper mold 10 (see FIG. 1).
Further, a clearance hole 41d for the positioning pin 10b is provided at the position of the locking portion 41a of the transport and supply device 40 corresponding to the protruding position of the positioning pin 10b (see FIG. 2).
The position and number of the positioning pins 10b on the upper mold surface 10a and the clearance holes 41d in the locking portions 41a can be appropriately selected as necessary.

また、上記した基板搬送プレート部41における係止部41ａの側面位置には、基板保持爪の先端部71ｄの回動作用を阻害しないための逃げ溝41ｅが設けられている。更に、この逃げ溝41ｅは、上記基台44における操作用ピン72の立設位置と対応する係止部41ａの側面位置に設けられている（図２参照）。   Further, an escape groove 41e is provided at a side surface position of the locking portion 41a in the substrate transport plate portion 41 to prevent the rotation action of the tip end portion 71d of the substrate holding claw. Further, the escape groove 41e is provided at a side surface position of the locking portion 41a corresponding to the standing position of the operation pin 72 in the base 44 (see FIG. 2).

また、上記した基板搬送プレート部41における係止部41ａの両端部には、基板Ｗを該係止部41ａの所定位置に係止させるための位置決ピン41ｆが設けられている（図３参照）。
この位置決ピン41ｆによる基板Ｗの係止時においては、該位置決ピン41ｆの上端部が基板Ｗの係合用ピン孔31を通して該基板Ｗの厚み（高さ）よりも上方へ突出されている。
しかしながら、この位置決ピン41ｆは、図３(1) に略図示するように、弾性部材55の弾性に抗して下方へ押し込むように退避させることができるように設けられている。
このため、上型面10ａに対する基板Ｗの接合時においては、該上型面10ａに当接した位置決ピン41ｆが下方へ退避するので、該上型面10ａと基板Ｗとの接合作用を阻害することはない。
なお、係止部41ａにおける位置決ピン41ｆと基板Ｗの係合用ピン孔31との配設位置及び配設数は必要に応じて適宜に選択して構成することができる。 Positioning pins 41f for locking the substrate W at predetermined positions of the locking portion 41a are provided at both ends of the locking portion 41a in the substrate transport plate portion 41 (see FIG. 3). ).
When the substrate W is locked by the positioning pin 41f, the upper end portion of the positioning pin 41f protrudes above the thickness (height) of the substrate W through the engagement pin hole 31 of the substrate W. .
However, the positioning pin 41f is provided so as to be retracted so as to be pushed downward against the elasticity of the elastic member 55, as schematically shown in FIG.
For this reason, when the substrate W is bonded to the upper mold surface 10a, the positioning pins 41f in contact with the upper mold surface 10a are retracted downward, so that the bonding action between the upper mold surface 10a and the substrate W is hindered. Never do.
The positions and number of the positioning pins 41f and the engagement pin holes 31 of the substrate W in the locking portion 41a can be appropriately selected and configured as necessary.

以下、基板の搬送供給装置40を用いて基板Ｗを圧縮樹脂封止装置Ａの固定上型10に搬送供給する場合、即ち、電子部品30を装着していない基板Ｗの裏面を上型面10ａに吸着させ且つ保持させる場合について説明する。   Hereinafter, when the substrate W is transported and supplied to the fixed upper mold 10 of the compression resin sealing apparatus A using the substrate transport and supply device 40, that is, the back surface of the substrate W on which the electronic component 30 is not mounted is the upper mold surface 10a. The case of adsorbing and holding on the substrate will be described.

まず、基板の搬送供給装置40の準備工程を行う。
そして、図３(1) に示すように、基板Ｗ表面の周辺部位を基板搬送プレート部41（基板の搬送供給装置40）における係止部41ａに接合して係止し、且つ、基板Ｗ表面の電子部品30を基板搬送プレート部41の収容凹部41ｂに収容する基板の搬送供給装置40上への基板載置工程を行う。
このとき、基板Ｗは、上記係止部41ａの位置決ピン41ｆを介して該係止部41ａの所定位置に係止させることができる（図２参照）。
また、上記した基板Ｗは、基板Ｗ表面の周辺部位を基板搬送プレート部41の係止部41ａに接合して係止させることができる大きさの矩形状基板を示している。
従って、該基板Ｗを係止部41ａに接合して係止させたとき、上記した基板保持爪先端部71ｄ用の逃げ溝41ｅの上部にも該基板Ｗの一部が載置された状態となる（図３参照）。 First, a preparation process for the substrate transport and supply apparatus 40 is performed.
Then, as shown in FIG. 3 (1), the peripheral portion of the surface of the substrate W is joined and locked to the locking portion 41a in the substrate transfer plate portion 41 (substrate transfer supply device 40), and the surface of the substrate W is The substrate placement process is performed on the substrate feeding / supplying device 40 for housing the electronic component 30 in the housing recess 41b of the substrate transporting plate portion 41.
At this time, the substrate W can be locked at a predetermined position of the locking portion 41a via the positioning pin 41f of the locking portion 41a (see FIG. 2).
Further, the substrate W described above is a rectangular substrate having a size capable of joining and locking the peripheral portion of the surface of the substrate W to the locking portion 41a of the substrate transport plate portion 41.
Therefore, when the substrate W is joined and locked to the locking portion 41a, a portion of the substrate W is also placed on the escape groove 41e for the substrate holding claw tip 71d. (See FIG. 3).

次に、基板の搬送供給装置40を圧縮樹脂封止装置Ａにおける上型面10ａの下方位置に搬送する基板の搬送供給装置40の前進工程を行う（図１及び図４参照）。   Next, the substrate transport / supply device 40 for transporting the substrate transport / supply device 40 to a position below the upper mold surface 10a in the compressed resin sealing device A is performed (see FIGS. 1 and 4).

次に、基板の搬送供給装置40を上動させて基板Ｗの裏面、即ち、電子部品30を装着していない基板Ｗの裏面側（図では上側）を圧縮樹脂封止装置Ａにおける上型面10ａの所定の位置に係合させる上型面10ａへの基板位置決工程を行う。
続いて、上型面10ａの所定位置に位置決めした基板Ｗの裏面側を該上型面10ａに接合させる上型面への基板接合工程を行う（図５参照）。
上記した基板位置決工程及び基板接合工程は、図４及び図５に示すように、基板の搬送供給装置40を圧縮樹脂封止装置Ａにおける上型面10ａに向かって上動させることによって行うことができる。
即ち、基板保持爪71の基端部71ａに押動ピン71ｃの弾性押圧力のみが加えられているときはその先端部71ｄは、図４に示すように、上型面10ａの下面位置にまで突出するように回動している。しかしながら、図５に示すように、基板保持爪71の操作用ピン72の上端部が基板保持爪71の基端部71ａを押し上げてその先端部71ｄを回動すると共に、上型面10ａの外方へ退避させることによって、基板搬送プレート部41上における基板Ｗの上動作用をスムーズに行うことができる。 Next, the substrate transport and supply device 40 is moved up so that the back surface of the substrate W, that is, the back surface side (the upper side in the figure) of the substrate W not mounted with the electronic component 30 is the upper mold surface in the compression resin sealing device A. A substrate positioning step for the upper mold surface 10a to be engaged with a predetermined position of 10a is performed.
Subsequently, a substrate bonding step to the upper mold surface is performed in which the back surface side of the substrate W positioned at a predetermined position on the upper mold surface 10a is bonded to the upper mold surface 10a (see FIG. 5).
The substrate positioning step and the substrate bonding step described above are performed by moving the substrate transport and supply device 40 upward toward the upper mold surface 10a in the compressed resin sealing device A, as shown in FIGS. Can do.
That is, when only the elastic pressing force of the pressing pin 71c is applied to the base end portion 71a of the substrate holding claw 71, the tip end portion 71d reaches the lower surface position of the upper mold surface 10a as shown in FIG. It is pivoting to project. However, as shown in FIG. 5, the upper end portion of the operation pin 72 of the substrate holding claw 71 pushes up the base end portion 71a of the substrate holding claw 71 to rotate the distal end portion 71d, and the outside of the upper mold surface 10a. By retreating the substrate, the upward movement of the substrate W on the substrate transport plate portion 41 can be performed smoothly.

また、上記した基板Ｗの裏面側を上型面10ａの所定位置に接合させる際に、図３(2) に示すように、電子部品30を装着した基板Ｗの表面側に圧縮エア43ａを供給して基板Ｗの変形姿勢を矯正する基板姿勢矯正工程を行う。
このとき、基板搬送プレート部41上に載置した基板Ｗはその周辺部位が係止部41ａの上面に係止されていること、また、基板Ｗの厚みは薄いこと、更に、基板Ｗの表面に装着された複数の電子部品30は下向きとなるため、同図に示すように、基板Ｗの中央部は自重によって垂下した状態となる。
しかしながら、基板Ｗの表面側に圧縮エア43ａを供給して基板Ｗの中央部を押し上げることにより、上記した基板Ｗの垂下姿勢を、同図に一点鎖線にて示す略水平状の姿勢位置にまでに修正する該基板Ｗの姿勢矯正工程を行うことができる。
なお、上記した圧縮エア43ａの供給態様については、基板Ｗの垂下姿勢の度合いに対応して適宜に選択して実施することができる。 Further, when the back surface side of the substrate W is joined to a predetermined position of the upper mold surface 10a, compressed air 43a is supplied to the front surface side of the substrate W on which the electronic component 30 is mounted, as shown in FIG. Then, a substrate posture correcting process for correcting the deformed posture of the substrate W is performed.
At this time, the peripheral portion of the substrate W placed on the substrate transport plate portion 41 is locked to the upper surface of the locking portion 41a, the thickness of the substrate W is thin, and the surface of the substrate W Since the plurality of electronic components 30 mounted on the board face downward, the central portion of the substrate W is suspended by its own weight as shown in FIG.
However, by supplying the compressed air 43a to the front surface side of the substrate W and pushing up the central portion of the substrate W, the hanging posture of the substrate W is changed to a substantially horizontal posture position shown by a one-dot chain line in FIG. The posture correction process of the substrate W to be corrected to can be performed.
The above-described supply mode of the compressed air 43a can be selected and implemented as appropriate according to the degree of the hanging posture of the substrate W.

また、上記した基板Ｗの表面側に圧縮エア43ａを供給して基板Ｗの変形姿勢を矯正する際に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに吸着させる上型面への基板吸着工程を行う（図５参照）。
即ち、この基板吸着工程は、上型面10ａに接合させた基板Ｗを複数の吸気孔20ａに生じる減圧機構からの吸引作用によって該上型面10ａに吸着させることができる。 Further, when the compressed air 43a is supplied to the surface side of the substrate W to correct the deformation posture of the substrate W, the upper surface of the substrate W is attracted to the upper mold surface 10a of the compressed resin sealing apparatus A. A substrate adsorption process is performed (see FIG. 5).
That is, in this substrate adsorption step, the substrate W bonded to the upper mold surface 10a can be adsorbed to the upper mold surface 10a by the suction action from the decompression mechanism generated in the plurality of intake holes 20a.

或は、上記した基板Ｗの表面側に圧縮エア43ａを供給して基板Ｗの変形姿勢を矯正した後に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに吸着させる上型面への基板吸着工程を行う（図５参照）。
即ち、この基板吸着工程は、上記したと同様に、上型面10ａに接合させた基板Ｗを複数の吸気孔20ａに生じる減圧機構からの吸引作用によって該上型面10ａに吸着させることができる。 Alternatively, the compressed air 43a is supplied to the surface side of the substrate W to correct the deformation posture of the substrate W, and then the substrate W is attached to the upper mold surface 10a in the compressed resin sealing apparatus A. A substrate adsorption process is performed (see FIG. 5).
That is, in the substrate adsorption step, the substrate W bonded to the upper mold surface 10a can be adsorbed to the upper mold surface 10a by the suction action from the decompression mechanism generated in the plurality of intake holes 20a, as described above. .

また、上記した上型面10ａに基板Ｗを吸着させる際に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに保持させる上型面への基板保持工程を行う（図６参照）。
即ち、上型面10ａに基板Ｗを吸着させながら、該基板Ｗを上型面10ａへ保持させる上型面への基板保持工程を行うことができる。
この上型面への基板保持工程は、基板の搬送供給装置40を下動させて、基板保持爪71の操作用ピン72の上端部と基板保持爪71の基端部71ａとの係合状態を解除すればよい。
この操作用ピン72の上端部と基板保持爪の基端部71ａとの係合状態を解除すると、基板保持爪の基端部71ａには押動ピン71ｃの弾性押圧力が加えられてその先端部71ｄは、図６に示すように、上型面10ａの下面位置にまで突出するように回動する。
このとき、基板搬送プレート部41における係止部41ａの側面位置には、基板保持爪の先端部71ｄの回動作用を阻害しないための逃げ溝41ｅが設けられているので、基板保持爪の先端部71ｄは、該逃げ溝41ｅを通して回動し且つ該係止部41ａ（該逃げ溝41ｅ）の上面に位置する基板Ｗの表面側（電子部品30の装着面側）に接合すると共に、当該部位を下方から保持するように係合する。 Further, when the substrate W is attracted to the upper mold surface 10a, a substrate holding process is performed on the upper mold surface for holding the substrate W on the upper mold surface 10a in the compression resin sealing apparatus A (see FIG. 6).
That is, it is possible to perform a substrate holding step on the upper mold surface that holds the substrate W on the upper mold surface 10a while adsorbing the substrate W to the upper mold surface 10a.
In the substrate holding process on the upper mold surface, the substrate transport and supply device 40 is moved downward to engage the upper end portion of the operation pin 72 of the substrate holding claw 71 and the base end portion 71a of the substrate holding claw 71. Can be canceled.
When the engagement state between the upper end portion of the operation pin 72 and the base end portion 71a of the substrate holding claw is released, the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw, and its distal end. As shown in FIG. 6, the portion 71d rotates so as to protrude to the lower surface position of the upper mold surface 10a.
At this time, a clearance groove 41e is provided at the side surface position of the locking portion 41a in the substrate transport plate portion 41 so as not to hinder the rotating action of the tip end portion 71d of the substrate holding claw. The portion 71d is rotated through the clearance groove 41e and joined to the surface side of the substrate W (the mounting surface side of the electronic component 30) positioned on the upper surface of the locking portion 41a (the clearance groove 41e). Are engaged from below.

或は、上記した上型面10ａに基板Ｗを吸着させた後に、基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに保持させる上型面への基板保持工程を行う（図６参照）。
即ち、上型面10ａに基板Ｗを吸着させた後に、該基板Ｗを上型面10ａへ保持させる上型面への基板保持工程を行うことができる。
この上型面への基板保持工程は、上記したと同様に、基板の搬送供給装置40を下動させて、基板保持爪71の操作用ピン72の上端部と基板保持爪71の基端部71ａとの係合状態を解除することによって行うことができる。 Or after adsorb | sucking the board | substrate W to the above-mentioned upper mold | type surface 10a, the board | substrate holding process to the upper mold | type surface which hold | maintains the board | substrate W in the upper mold | type surface 10a in the compression resin sealing apparatus A is performed (refer FIG. 6). .
That is, after the substrate W is attracted to the upper mold surface 10a, a substrate holding process on the upper mold surface for holding the substrate W on the upper mold surface 10a can be performed.
In the same manner as described above, the substrate holding process on the upper mold surface is performed by moving the substrate transport and supply device 40 downward, so that the upper end portion of the operation pin 72 of the substrate holding claw 71 and the base end portion of the substrate holding claw 71 This can be done by releasing the engaged state with 71a.

次に、基板の搬送供給装置40を下動させると共に、これを圧縮樹脂封止装置Ａの外部へ後退させる基板の搬送供給装置40の後退工程を行う。   Next, the substrate transport / supply device 40 is moved downward and the substrate transport / supply device 40 is moved backward to the outside of the compressed resin sealing device A.

上記した実施例においては、基板搬送プレート部41（基板の搬送供給装置）上に載置した基板Ｗの中央部が自重により垂下して弯曲状に変形した状態にあるときや基板Ｗ自体に反りが発生している場合においても、該基板Ｗの姿勢を水平状に矯正することによって、該基板Ｗを圧縮樹脂封止装置Ａにおける上型面10ａに効率良く且つ確実に吸着させ且つ保持させることができる。
また、基板Ｗの中央部が垂下し易い傾向にある近時の大形基板を搬送供給する場合において特に顕著な効果を得ることができる。 In the above-described embodiments, the central portion of the substrate W placed on the substrate transport plate portion 41 (substrate transport and supply device) is suspended by its own weight and deformed into a curved shape, or warps the substrate W itself. Even when this occurs, the substrate W can be efficiently and reliably adsorbed and held on the upper mold surface 10a of the compressed resin sealing device A by correcting the posture of the substrate W to be horizontal. Can do.
In addition, a remarkable effect can be obtained particularly in the case of transporting and supplying a recent large-sized substrate in which the central portion of the substrate W tends to hang down.

次に、図７に示す第二実施例図に基づいて説明する。   Next, a description will be given based on the second embodiment shown in FIG.

前第一実施例は、基板搬送プレート部41における係止部41ａの一部を切り欠いて該係止部41ａの上面が連続しないように構成した場合を示しているが、この実施例では、該係止部41ａの上面を連続させて構成した点で相違する。
なお、本実施例において前実施例と実質的に同じ構成については前実施例について説明した事項と同様である。従って、説明の重複を避けるため、両者に共通する構成については同じ符号を付している。 The previous first embodiment shows a case in which a part of the locking portion 41a in the substrate transport plate portion 41 is cut out so that the upper surface of the locking portion 41a is not continuous. In this embodiment, The difference is that the upper surface of the locking portion 41a is configured to be continuous.
In the present embodiment, the configuration substantially the same as that of the previous embodiment is the same as that described for the previous embodiment. Therefore, in order to avoid duplication of description, the same reference numerals are given to configurations common to both.

即ち、前第一実施例においては、一部を切り欠いて構成した係止部41ａの上面に基板Ｗを係止させているため、電子部品30の収容凹部41ｂの一部は解放された状態となる。
しかしながら、図７に示すように、本実施例においては、係止部41ａの上面が連続するように設けることにより、所謂、有底箱型容器の形状に構成したものである。
更に、連続した係止部41ａの上面に基板Ｗを係止させると、その収容凹部41ｂは連続した係止部41ａと基板Ｗとの両者にて密閉状に構成される。
従って、この実施例における基板の変形姿勢矯正手段は、上記したような密閉状収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを供給するように形成して構成されている。 That is, in the previous first embodiment, since the substrate W is locked on the upper surface of the locking portion 41a formed by cutting out a part, a part of the housing recess 41b of the electronic component 30 is released. It becomes.
However, as shown in FIG. 7, in the present embodiment, a so-called bottomed box-shaped container is formed by providing the upper surface of the locking portion 41a to be continuous.
Further, when the substrate W is locked to the upper surface of the continuous locking portion 41a, the accommodation recess 41b is configured to be hermetically sealed by both the continuous locking portion 41a and the substrate W.
Accordingly, the substrate deformation posture correcting means in this embodiment is formed and configured to supply the compressed air 43a from the plurality of compressed air supply holes 41c provided on the bottom surface of the sealed housing recess 41b as described above. Yes.

この実施例においては、密閉状収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを供給することにより、該密閉状収容凹部41ｂの内圧を高めることができる。このとき、該密閉状収容凹部41ｂ内に収容された基板Ｗには、その中央部を緩やかに（スローモーションで）押し上げるような姿勢矯正力が加えられることになる。
従って、これによって、基板Ｗの垂下姿勢を略水平位置にまで修正する該基板Ｗの姿勢矯正工程を行うことができる。
なお、上記した圧縮エア43ａの供給態様については、基板Ｗの垂下姿勢の度合いに対応して適宜に選択して実施することができる。 In this embodiment, by supplying the compressed air 43a from the plurality of compressed air supply holes 41c provided on the bottom surface of the sealed housing recess 41b, the internal pressure of the sealed housing recess 41b can be increased. At this time, a posture correcting force is applied to the substrate W accommodated in the sealed accommodating recess 41b so as to gently push up the central portion (in slow motion).
Therefore, this makes it possible to perform a posture correction process of the substrate W that corrects the hanging posture of the substrate W to a substantially horizontal position.
The above-described supply mode of the compressed air 43a can be selected and implemented as appropriate according to the degree of the hanging posture of the substrate W.

また、上記した収容凹部41ｂは密閉状に構成されているから、前第一実施例のものと較べて、密閉状収容凹部41ｂ内に圧縮エア43ａを供給して該密閉状収容凹部41ｂの内圧を高める作用は、より簡易に行うことができる。
従って、前第一実施例のものに較べて、基板Ｗの姿勢矯正工程を、より効率良く行うことができる点で有利である。 Further, since the above-described housing recess 41b is configured in a sealed state, compared with the previous first embodiment, the compressed air 43a is supplied into the sealed housing recess 41b and the internal pressure of the sealed housing recess 41b is increased. The effect of increasing the value can be performed more easily.
Therefore, it is advantageous in that the posture correction process of the substrate W can be performed more efficiently than in the previous first embodiment.

次に、図８及び図９に示す第三実施例図に基づいて説明する。   Next, description will be made based on the third embodiment shown in FIGS.

前各実施例における基板の変形姿勢矯正手段は、収容凹部41ｂの底面に設けた複数の圧縮エア供給孔41ｃから圧縮エア43ａを供給するように構成した場合を示しているが、この実施例では、係止部41ａの上面を連続させて密閉状の収容凹部41ｂを構成すると共に、該密閉状収容凹部41ｂの底面に設けた流体圧力緩和機構56を介して圧縮エア43ａを供給するように形成して構成した点で相違する。
なお、本実施例において前各実施例と実質的に同じ構成については前各実施例について説明した事項と同様である。従って、説明の重複を避けるため、共通する構成については同じ符号を付している。 The substrate deformation posture correcting means in each of the previous embodiments shows a case where the compressed air 43a is supplied from a plurality of compressed air supply holes 41c provided on the bottom surface of the housing recess 41b. The upper surface of the locking portion 41a is continuous to form a sealed housing recess 41b, and the compressed air 43a is supplied via a fluid pressure relaxation mechanism 56 provided on the bottom surface of the sealed housing recess 41b. It differs in that it is configured.
In the present embodiment, the configuration substantially the same as that of each of the previous embodiments is the same as that described for each of the previous embodiments. Therefore, in order to avoid duplication of description, the same code | symbol is attached | subjected about the common structure.

即ち、図８及び図９に示すように、この実施例においては、係止部41ａの上面が連続するように設けて有底箱型容器の形状に構成している。
そして、連続した係止部41ａの上面に基板Ｗを係止させると、その収容凹部41ｂは連続した係止部41ａと基板Ｗとの両者にて密閉状に構成される。
更に、この実施例における基板の変形姿勢矯正手段43は、上記した密閉状収容凹部41ｂの底面に設けた流体圧力緩和機構56を介して圧縮エア43ａを供給するように形成して構成されている。
なお、上記した流体圧力緩和機構56としては、図例に示すように、密閉状収容凹部41ｂの底面に、所謂、バッフルプレートを採用することができる。
従って、この実施例における基板の変形姿勢矯正手段43は、上記密閉状収容凹部41ｂの底面に設けた流体圧力緩和機構（バッフルプレート）56における圧縮エア供給溝56ａから圧縮エア43ａを供給するように形成して構成されている。
このとき、該密閉状収容凹部41ｂ内に収容された基板Ｗには、その中央部を緩やかに押し上げるような姿勢矯正力が加えられることになるため、基板Ｗの垂下姿勢を略水平位置にまで修正する該基板Ｗの姿勢矯正工程を行うことができる。
また、上記した圧縮エア43ａの供給態様については、基板Ｗの垂下姿勢の度合いに対応して適宜に選択して実施することができる。 That is, as shown in FIGS. 8 and 9, in this embodiment, the upper surface of the locking portion 41a is provided so as to be continuous, and is configured in the shape of a bottomed box-type container.
And when the board | substrate W is latched on the upper surface of the continuous latching | locking part 41a, the accommodation recessed part 41b is comprised by both the continuous latching | locking part 41a and the board | substrate W in the sealing form.
Further, the substrate deformation posture correcting means 43 in this embodiment is formed so as to supply the compressed air 43a via the fluid pressure relaxation mechanism 56 provided on the bottom surface of the above-described sealed housing recess 41b. .
As the fluid pressure relaxation mechanism 56 described above, as shown in the figure, a so-called baffle plate can be employed on the bottom surface of the sealed housing recess 41b.
Accordingly, the substrate deformation posture correcting means 43 in this embodiment supplies the compressed air 43a from the compressed air supply groove 56a in the fluid pressure relaxation mechanism (baffle plate) 56 provided on the bottom surface of the sealed housing recess 41b. Formed and configured.
At this time, since the posture correcting force that gently pushes up the central portion is applied to the substrate W accommodated in the hermetic accommodating recess 41b, the hanging posture of the substrate W is brought to a substantially horizontal position. The posture correction process of the substrate W to be corrected can be performed.
Further, the above-described supply mode of the compressed air 43a can be appropriately selected and implemented in accordance with the degree of the hanging posture of the substrate W.

この実施例においては、密閉状収容凹部41ｂの底面に設けた流体圧力緩和機構56における圧縮エア供給溝56ａから圧縮エア43ａを供給して該密閉状収容凹部41ｂ内の内圧を高めることができる。その結果、基板Ｗの中央部を押し上げてその垂下姿勢を略水平位置にまで修正する該基板Ｗの姿勢矯正工程を行うことができる。
このとき、密閉状収容凹部41ｂ内に導入される圧縮エア43ａは流体圧力緩和機構56を介してその流体圧力が緩和されると共に、該圧縮エア43ａが直接的に電子部品30に向かって吹き付けられるのを防止することができる。
従って、上記した電子部品30に、例えば、電気接続用の細いワイヤが取り付けられているような場合に、該ワイヤに圧縮エア43ａが直接的に吹き付けられて該ワイヤを変形させたり或はこれを断線させる等の弊害を未然に防止することができる。 In this embodiment, the compressed air 43a can be supplied from the compressed air supply groove 56a in the fluid pressure relaxation mechanism 56 provided on the bottom surface of the sealed housing recess 41b to increase the internal pressure in the sealed housing recess 41b. As a result, it is possible to perform the posture correction process of the substrate W that pushes up the central portion of the substrate W and corrects the hanging posture to a substantially horizontal position.
At this time, the compressed air 43a introduced into the sealed housing recess 41b is relaxed through the fluid pressure relaxation mechanism 56, and the compressed air 43a is blown directly toward the electronic component 30. Can be prevented.
Therefore, for example, when a thin wire for electrical connection is attached to the electronic component 30 described above, the compressed air 43a is blown directly on the wire to deform the wire or It is possible to prevent problems such as disconnection.

また、上記した収容凹部41ｂは密閉状に構成されているから、前各実施例のものと較べて、密閉状収容凹部41ｂ内に圧縮エア43ａを供給して該密閉状収容凹部41ｂの内圧を高める作用は、より簡易に且つ確実に行うことができる。
従って、前各実施例のものに較べて、基板Ｗの姿勢矯正工程を、より効率良く行うことができる。 In addition, since the above-described housing recess 41b is configured in a hermetically sealed manner, the compressed air 43a is supplied into the sealed housing recess 41b to reduce the internal pressure of the sealed housing recess 41b as compared with the previous embodiments. The enhancing action can be performed more easily and reliably.
Therefore, the posture correction process of the substrate W can be performed more efficiently than in the previous embodiments.

本発明は、前述した各実施例のものに限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意に且つ適宜に変更・選択して採用することができる。   The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention. .

Ａ 圧縮樹脂封止装置
Ｗ 基板
10 上型
10ａ 上型面
10ｂ 位置決ピン
20 基板吸着機構
20ａ 吸気孔
30 電子部品
31 ピン孔
40 基板の搬送供給装置
41 基板搬送プレート部
41ａ 係止部
41ｂ 収容凹部
41ｃ 圧縮エア供給孔
41ｄ 逃げ穴
41ｅ 逃げ溝
41ｆ 位置決ピン
42 進退往復動機構
43 基板の変形姿勢矯正手段
43ａ 圧縮エア
44 基台
50 下型
50ａ 下型キャビティ
50ｂ 押圧部材
55 弾性部材
56 流体圧力緩和手段
56ａ 圧縮エア供給溝
60 溶融樹脂材料
70 基板保持機構
71 基板保持爪
71ａ 基端部
71ｂ 弾性部材
71ｃ 押動ピン
71ｄ 先端部
72 操作用ピン
73 支持軸 A Compression resin sealing device W Substrate
10 Upper mold
10a Upper mold surface
10b Positioning pin
20 Substrate adsorption mechanism
20a Air intake hole
30 electronic components
31 pin hole
40 Substrate transport and supply equipment
41 Board transfer plate
41a Locking part
41b recess
41c Compressed air supply hole
41d escape hole
41e Escape groove
41f Positioning pin
42 Reciprocating mechanism
43 Deformation posture correction means
43a Compressed air
44 base
50 Lower mold
50a Lower mold cavity
50b Pressing member
55 Elastic member
56 Fluid pressure relief means
56a Compressed air supply groove
60 Molten resin material
70 Board holding mechanism
71 Substrate holding claw
71a Base end
71b Elastic member
71c Push pin
71d Tip
72 Operation pin
73 Support shaft

Claims (7)

表面に複数の電子部品を装着させた基板を圧縮樹脂封止装置における上型面の下方位置に搬送すると共に、電子部品を装着した前記基板の表面側を下向きとし且つその反対側となる基板の裏面側を前記圧縮樹脂封止装置における上型面に吸着させ且つ保持させるための基板の搬送供給方法であって、
前記基板表面の周辺部位と接合し且つ前記基板表面の周辺部位を所定の位置に係止するための係止部と、前記基板表面の電子部品の全体を前記係止部と接触しない状態で収容するための収容凹部とを備えた基板の搬送供給装置の準備工程と、
前記基板表面の周辺部位を前記基板の搬送供給装置の係止部に接合して係止し、且つ、前記基板表面の電子部品を前記基板搬送プレート部の収容凹部に収容する基板の搬送供給装置上への基板載置工程と、
前記基板載置工程を経た基板の搬送供給装置を前記圧縮樹脂封止装置における上型面の下方位置に搬送する基板の搬送供給装置の前進工程と、
前記基板の搬送供給装置の前進工程を経た基板の搬送供給装置を前記圧縮樹脂封止装置における上型面に向かって相対的に上動させて前記基板の裏面側を前記圧縮樹脂封止装置における上型面の所定の位置に係合させる上型面への基板位置決工程と、
前記基板の搬送供給装置を、さらに前記圧縮樹脂封止装置における上型面に向かって相対的に上動させることで、前記係止部が前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に向かって押し上げて、前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に接合させる上型面への基板接合工程と、
前記係止部が前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に向かって押し上げて、前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に接合させことで、前記基板の周辺部位を前記圧縮樹脂封止装置における上型面と係止部とによって挟持させる工程と、
前記収容凹部内に圧縮エアを供給することで、前記収容凹部内における内圧を高める工程と、
前記収容凹部内における内圧を高めることで、前記基板の中央部における垂下した変形姿勢が上型面側に押し上げられて矯正される基板姿勢矯正工程と、
前記基板姿勢矯正工程時に、及び／又は、前記基板姿勢矯正工程を経た後に、基板を圧縮樹脂封止装置における上型面に吸着させる上型面への基板吸着工程と、
前記上型面への基板吸着工程時に、及び／又は、前記上型面への基板吸着工程を経た後に、基板を圧縮樹脂封止装置における上型面に保持させる上型面への基板保持工程と、
前記上型面への基板保持工程を経た後に、前記基板の搬送供給装置を相対的に下動させると共に、これを前記圧縮樹脂封止装置の外部へ後退させる基板の搬送供給装置の後退工程と、を含むことを特徴とする基板の搬送供給方法。 A substrate having a plurality of electronic components mounted on the surface thereof is transported to a position below the upper mold surface in the compression resin sealing device, and the surface of the substrate on which the electronic components are mounted is directed downward and the substrate on the opposite side. A method for transporting and supplying a substrate for adsorbing and holding a rear surface side to an upper mold surface in the compressed resin sealing device,
A locking portion for joining the peripheral portion of the substrate surface and locking the peripheral portion of the substrate surface at a predetermined position, and the entire electronic component on the substrate surface are accommodated without contacting the locking portion. A preparation process of a substrate transport and supply device including an accommodation recess for performing,
A substrate transport and supply device that joins and locks a peripheral portion of the substrate surface to a locking portion of the substrate transport and supply device, and stores electronic components on the substrate surface in a storage recess of the substrate transport plate portion A substrate mounting process on the top,
A forward step of a substrate transport and supply device that transports the substrate transport and supply device that has undergone the substrate placement step to a position below the upper mold surface in the compressed resin sealing device;
The substrate transport and supply device that has undergone the advancement process of the substrate transport and supply device is moved up relatively toward the upper mold surface of the compressed resin sealing device, and the back surface side of the substrate is moved toward the compressed resin sealing device. A substrate positioning step to the upper mold surface to be engaged with a predetermined position of the upper mold surface;
By further moving the transport and supply device of the substrate relatively toward the upper mold surface in the compressed resin sealing device, the locking portion seals the peripheral portion on the back side of the substrate with the compressed resin sealing. A substrate bonding step to the upper mold surface that pushes up toward the upper mold surface in the apparatus and bonds the peripheral portion on the back surface side of the substrate to the upper mold surface in the compressed resin sealing device ;
The engaging portion pushes up the peripheral portion on the back surface side of the substrate toward the upper mold surface in the compression resin sealing device, and the peripheral portion on the back surface side of the substrate becomes the upper mold surface in the compression resin sealing device. The step of sandwiching the peripheral portion of the substrate by the upper mold surface and the locking portion in the compression resin sealing device by bonding,
Increasing the internal pressure in the housing recess by supplying compressed air into the housing recess;
A substrate posture correction step in which the hanging posture at the center portion of the substrate is pushed up to the upper mold surface side and corrected by increasing the internal pressure in the housing recess ,
A substrate adsorption step to the upper mold surface that adsorbs the substrate to the upper mold surface in the compression resin sealing device at the time of the substrate posture correction process and / or after the substrate posture correction process;
The substrate holding step on the upper mold surface that holds the substrate on the upper mold surface in the compression resin sealing device during and / or after the substrate adsorption process on the upper mold surface. When,
After the substrate holding process on the upper mold surface , the substrate transport and supply device is relatively moved downward, and the substrate transport and supply device is retracted to the outside of the compressed resin sealing device. The board | substrate conveyance supply method characterized by including these. 前記した内圧を高める工程が、前記基板搬送プレート部における収容凹部の底面に設けた複数の圧縮エア供給孔から圧縮エアを前記収容凹部内に供給することにより行うことを特徴とする請求項１に記載の基板の搬送供給方法。 The step of increasing the internal pressure is performed by supplying compressed air into the housing recess from a plurality of compressed air supply holes provided on the bottom surface of the housing recess in the substrate transport plate portion. A method for conveying and supplying a substrate according to the description. 前記した内圧を高める工程が、前記基板と前記基板の搬送供給装置の係止部との両者にて密閉状の収容凹部を構成すると共に、前記収容凹部の底面に設けた複数の圧縮エア供給孔から圧縮エアを前記密閉状の収容凹部内に供給することにより行うことを特徴とする請求項１に記載の基板の搬送供給方法。 The step of increasing the internal pressure constitutes a sealed housing recess in both the substrate and the locking portion of the substrate transport and supply device, and a plurality of compressed air supply holes provided in the bottom surface of the housing recess The method for transporting and supplying a substrate according to claim 1, wherein the compressed air is supplied into the hermetically-sealed housing recess. 前記した内圧を高める工程が、前記基板と前記基板の搬送供給装置の係止部との両者にて密閉状の収容凹部を構成すると共に、前記収容凹部の底面に設けた流体圧力緩和手段を介して圧縮エアを前記密閉状の収容凹部内に供給することにより行うことを特徴とする請求項１に記載の基板の搬送供給方法。 In the step of increasing the internal pressure, a sealed housing recess is formed by both the substrate and the locking portion of the transport and supply device for the substrate, and a fluid pressure relaxing means provided on the bottom surface of the housing recess is used. The method for transporting and supplying a substrate according to claim 1, wherein the compressed air is supplied into the sealed housing recess. 表面に複数の電子部品を装着させた基板を圧縮樹脂封止装置における上型面の下方位置に搬送すると共に、電子部品を装着した前記基板の表面側を下向きとし且つその反対側となる基板の裏面側を前記圧縮樹脂封止装置における上型面に吸着させ且つ保持させるための基板の搬送供給装置であって、
前記基板を載置する基板搬送プレート部と、
前記基板搬送プレート部を前記圧縮樹脂封止装置における上型面の下方位置に対して前進及び後退可能に配置するための進退往復動機構とを備えており、
また、前記基板搬送プレート部には、前記基板表面の周辺部位と接合し且つ前記基板表面の周辺部位を所定の位置に係止するための係止部と、前記基板表面の電子部品の全体を前記係止部と接触しない状態で収容するための収容凹部とを設け、
更に、前記基板搬送プレート部における収容凹部の底面に複数の圧縮エア供給孔を配設し且つ前記圧縮エア供給孔と圧縮エア供給機構側とを連通接続させた前記基板の変形姿勢矯正手段を配置して構成し、
前記基板の搬送供給装置を、前記圧縮樹脂封止装置における上型面に向かって相対的に上動させることで、前記係止部が前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に向かって押し上げて、前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に接合させ、
前記係止部が前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に向かって押し上げて、前記基板の裏面側の周辺部位を前記圧縮樹脂封止装置における上型面に接合させることで、前記基板の周辺部位を前記圧縮樹脂封止装置における上型面と係止部とによって挟持させ、
前記収容凹部内に圧縮エアを供給することで、前記収容凹部内における内圧を高め、
前記収容凹部内における内圧を高めることで、前記基板の中央部における垂下した変形姿勢が上型面側に押し上げられて矯正され、
前記基板の中央部における垂下した変形姿勢が矯正されることで、前記基板の裏面側の中央部が前記圧縮樹脂封止装置における上型面に吸着される
ことを特徴とする基板の搬送供給装置。 A substrate having a plurality of electronic components mounted on the surface thereof is transported to a position below the upper mold surface in the compression resin sealing device, and the surface of the substrate on which the electronic components are mounted is directed downward and the substrate on the opposite side. A substrate transport and supply device for adsorbing and holding the back side to the upper mold surface in the compressed resin sealing device,
A substrate transport plate portion for placing the substrate;
An advancing and reciprocating mechanism for disposing the substrate transport plate portion so as to be capable of moving forward and backward with respect to a position below the upper mold surface in the compressed resin sealing device;
The substrate transport plate portion includes a locking portion for joining the peripheral portion of the substrate surface and locking the peripheral portion of the substrate surface at a predetermined position, and the entire electronic components on the substrate surface. An accommodation recess for accommodating in a state of not contacting the locking portion;
In addition, a plurality of compressed air supply holes are provided on the bottom surface of the housing recess in the substrate transport plate section, and the substrate deformation posture correcting means is provided in which the compressed air supply holes and the compressed air supply mechanism are connected in communication. to configure,
The substrate feeding and supplying device is relatively moved upward toward the upper mold surface of the compressed resin sealing device, so that the locking portion moves the peripheral portion on the back side of the substrate to the compressed resin sealing device. And pushed up toward the upper mold surface in order to join the peripheral part of the back side of the substrate to the upper mold surface in the compression resin sealing device,
The engaging portion pushes up the peripheral portion on the back surface side of the substrate toward the upper mold surface in the compression resin sealing device, and the peripheral portion on the back surface side of the substrate becomes the upper mold surface in the compression resin sealing device. By bonding, the peripheral portion of the substrate is sandwiched between the upper mold surface and the locking portion in the compression resin sealing device,
By supplying compressed air into the housing recess, the internal pressure in the housing recess is increased,
By increasing the internal pressure in the housing recess, the hanging deformation posture in the central portion of the substrate is pushed up to the upper mold surface side and corrected,
The substrate, wherein the central portion of the back surface side of the substrate is adsorbed to the upper mold surface of the compression resin sealing device by correcting the hanging deformation posture in the center portion of the substrate. Conveyor supply device. 前記した基板の変形姿勢矯正手段が、前記基板と前記基板搬送プレート部の係止部との両者にて密閉状の収容凹部を構成すると共に、前記収容凹部の底面に設けた複数の圧縮エア供給孔から圧縮エアを前記密閉状の収容凹部内に供給するように形成して構成したことを特徴とする請求項５に記載の基板の搬送供給装置。   The substrate deformation posture correcting means constitutes a sealed housing recess in both the substrate and the locking portion of the substrate transport plate portion, and a plurality of compressed air supplies provided on the bottom surface of the housing recess 6. The substrate transport and supply device according to claim 5, wherein compressed air is supplied from the hole into the sealed housing recess. 前記した基板の変形姿勢矯正手段が、前記基板と前記基板搬送プレート部の係止部との両者にて密閉状の収容凹部を構成すると共に、前記収容凹部の底面に設けた流体圧力緩和機構を介して圧縮エアを前記密閉状の収容凹部内に供給するように形成して構成したことを特徴とする請求項５に記載の基板の搬送供給装置。   The above-mentioned substrate deformation posture correcting means constitutes a sealed housing recess in both the substrate and the locking portion of the substrate transport plate portion, and a fluid pressure relaxation mechanism provided on the bottom surface of the housing recess. 6. The substrate transport and supply device according to claim 5, wherein the substrate is formed so as to supply compressed air into the sealed housing recess.
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KR20180133933A (en) * 2016-05-06 2018-12-17 어플라이드 머티어리얼스, 인코포레이티드 SYSTEMS, APPARATUS AND METHODS FOR IMPROVED SUBSTRATE HANDLING ASSEMBLY
JP7164289B2 (en) * 2016-09-05 2022-11-01 東京エレクトロン株式会社 Position-Specific Tuning of Bow-Controlling Stress to Control Overlay During Semiconductor Processing
JP6423399B2 (en) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 Resin molding method, film conveying apparatus, and resin molding apparatus
CN106672619A (en) * 2017-02-15 2017-05-17 苏州迈瑞微电子有限公司 Molding compound transfer equipment and method
WO2018163284A1 (en) * 2017-03-07 2018-09-13 ヤマハ発動機株式会社 Component mounting device and method for holding substrate
JP6804410B2 (en) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 Conveying mechanism, resin molding device, method of delivering the object to be molded to the molding mold, and method of manufacturing the resin molded product
JP7034700B2 (en) * 2017-12-21 2022-03-14 Ｔｏｗａ株式会社 Conveyor device, resin molding device and resin molded product manufacturing method
JP7102238B2 (en) * 2018-06-08 2022-07-19 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
KR102226154B1 (en) * 2019-07-01 2021-03-10 주식회사 휴템 Substrates bonding apparatus
JP7203778B2 (en) * 2020-01-21 2023-01-13 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
CN113816144A (en) * 2021-08-23 2021-12-21 甘肃旭盛显示科技有限公司 Glass substrate fetching device and glass substrate production line
CN114420623B (en) * 2022-03-31 2022-06-07 三河建华高科有限责任公司 Manipulator structure suitable for warpage wafer is got and is put

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3214788B2 (en) * 1994-11-21 2001-10-02 アピックヤマダ株式会社 Resin molding device and resin molding method
JPH09266242A (en) * 1996-03-27 1997-10-07 Kuroda Precision Ind Ltd Sucking chuck device
JP2002043400A (en) * 2000-07-24 2002-02-08 Hiroshi Akashi Rotation supporting device
JP4519398B2 (en) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 Resin sealing method and semiconductor device manufacturing method
TWI327128B (en) * 2003-07-08 2010-07-11 Daifuku Kk Plate-shaped work piece transporting apparatus
JP4150041B2 (en) * 2005-12-26 2008-09-17 富士通株式会社 Bonded board manufacturing equipment
JP4836661B2 (en) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold for resin sealing molding
JP5038783B2 (en) * 2007-06-06 2012-10-03 住友重機械工業株式会社 Film supply mechanism
JP4551931B2 (en) * 2008-01-08 2010-09-29 住友重機械工業株式会社 Resin sealing method
JP5156579B2 (en) * 2008-10-31 2013-03-06 Ｔｏｗａ株式会社 Board loading / unloading device
WO2013076874A1 (en) * 2011-11-25 2013-05-30 信越エンジニアリング株式会社 Wafer transport apparatus and wafer assembly line

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