TWI552652B - A substrate feeding method and a substrate feeding and feeding device - Google Patents

Description

Substrate transfer supply method and substrate transfer supply device

The present invention relates to a substrate transfer supply method and apparatus for transporting a substrate on which an electronic component is mounted to a predetermined position of a molding die portion of a compression resin sealing device, and more particularly to a method for supplying a substrate to a compression resin package. In the case where the upper mold surface is held, the substrate transfer supply method and the substrate transfer supply device for carrying out the method are improved in order to effectively and reliably hold the substrate on the upper mold surface.

For example, it is known (for example, refer to Patent Document 1) that a mechanism that moves in a state where the substrate is locked on the upper surface of the substrate conveyance plate portion or a state in which the substrate is adsorbed on the upper surface of the adsorption plate is known. Institutions, etc. When a substrate having a plurality of (many) electronic components (semiconductor elements or the like) is mounted on the surface (upper surface) by using such a substrate transfer plate portion or the like, the electronic component on the substrate and the substrate transfer plate portion are placed. The upper surface of the substrate is not in contact with each other, and is usually placed with the surface of the substrate facing upward, that is, the back surface (bottom surface) of the substrate is joined to the upper surface of the substrate transfer plate portion or the like.

On the other hand, while the substrate is supplied to the upper mold surface of the compression resin packaging device and held, the electronic component on the substrate is immersed in the molten resin material in the lower cavity, and the compression resin is formed by compressing the resin. In the case of package molding, the substrate transfer plate portion or the like as described above cannot be directly used. That is, in the case where the electronic component on the substrate is packaged and molded using a compression resin packaging mechanism, as shown in the schematic view of FIG. 10, the transmission is provided in a compression resin package. The substrate suction mechanism 2 on the upper mold 1 of the apparatus A causes the back surface side of the substrate W to be attracted to the mold surface 1a of the upper mold 1, and the electronic component 3 mounted on the substrate W to be held downward (lower side). Therefore, it is necessary to download the substrate transfer plate portion 4 in a state where the electronic component 3 mounted on the substrate W is directed downward. For this reason, the substrate transfer plate portion 4 is provided with a locking portion 4a that can be engaged with the peripheral portion of the surface of the substrate W on which the electronic component 3 is mounted, and can be locked with the electronic component 3 and the substrate transfer plate portion 4 side. The state accommodates the housing recess 4b of the electronic component 3. Further, the resin package molding of the electronic component 3 is to mold the upper mold 1 and the lower mold 5 so that the electronic component 3 on the substrate W is immersed in the molten resin material 6 provided in the lower mold cavity 5a provided on the lower mold 5. And the molten resin material 6 is compressed by the pressing member 5b, and the electronic component 3 is resin-sealed.

As described above, the substrate W can be adsorbed and held by the substrate adsorption mechanism 2 on the mold surface 1a of the upper mold 1. However, the peripheral portion of the surface of the substrate W placed on the substrate transfer plate portion 4 is locked to the upper surface of the locking portion 4a; the thickness of the substrate W is thin; and a plurality of electronic components 3 mounted on the surface of the substrate W Since it is supported downward, as shown by the arrow in (2) of FIG. 10, the center portion of the substrate W is in a state of being easily sagged due to its own weight. Further, in the deformed state of the substrate which is bent downward as described above, there is a problem in that the upper mold surface 1a cannot be reliably adsorbed and the substrate W is held, or the adsorption holding efficiency is deteriorated. In addition, the tendency of the center portion of the substrate W to sag easily due to its own weight is particularly remarkable in recent enlargement of the substrate. Further, when the substrate W itself is bent or the like, it is one of the causes for further reducing the adsorption holding efficiency.

Patent Document 1: Japanese Laid-Open Patent Publication No. 01-119100 (page 1 of the lower right column, line 4 to line 9, line 2, picture 4 to 5)

An object of the present invention is to provide a substrate transport supply device (base) When the central portion of the substrate on the plate transporting plate portion is deformed in a state of being drooped and curved, or when the substrate is bent or the like, the substrate can be efficiently and surely adsorbed and held in the compression resin sealing device. The substrate transfer supply method of the upper mold surface and the substrate transfer supply device for carrying out the method.

In the substrate transfer and supply method of the present invention, the substrate W having a plurality of electronic components 30 mounted on the surface thereof is transported to a position below the upper mold surface 10a of the compression resin sealing device A, and the aforementioned substrate W is placed. A substrate transfer and supply method in which the back surface of the substrate W is adsorbed to the upper mold surface 10a and held thereon, and includes a preparation step of the substrate conveyance supply device 40, and is provided with a locking portion 41a and a housing recess 41b. In the substrate transporting and supplying device 40, the locking portion 41a is joined to the peripheral portion of the surface of the substrate W, and the peripheral portion of the surface is locked at a predetermined position, and the receiving recess 41b is for all the electronic components 30 and the card. The substrate 41 is placed in a state in which the stopper portion 41a is not in contact with each other, and the substrate mounting step is such that the peripheral portion of the substrate W is joined to the locking portion 41a of the substrate transporting and supplying device 40, and the electronic component 30 is housed in the substrate. The storage recess 41b of the substrate transport supply device 40; the advancement step of the substrate transport supply device 40 passes through the substrate The substrate transfer and supply device 40 in the placing step is transported to a position below the upper mold surface 10a, and the substrate positioning step is such that the substrate transport supply device 40 that has passed through the advancement step of the substrate transport and supply device 40 is opposed to the compressed resin package device. A is relatively moved upward so that the back surface of the substrate W is engaged with a predetermined position of the upper mold surface 10a, and the substrate bonding step is performed by bonding the back surface of the substrate W past the substrate positioning step to the upper mold surface 10a. a substrate posture correcting step of supplying compressed air 43a to the surface of the substrate W to correct a deformation posture of the substrate W during the substrate bonding step; The substrate W is adsorbed to the upper mold surface 10a in any one or two of the substrate posture correcting step and the substrate posture correcting step; the substrate holding step is performed on the substrate Holding the substrate W on the upper mold surface 10a in any one or two of the steps of the substrate and the substrate adsorption step; and the step of retracting the substrate transport supply device 40, after the substrate holding step After that, the substrate transfer and supply device 40 is relatively moved downward with respect to the compressed resin package device A, and the substrate transfer supply device 40 is moved backward to the outside of the compressed resin package device A.

In the substrate conveyance and supply method of the present invention, the substrate posture correction step is performed by supplying compression to the accommodation recessed portion 41b from a plurality of compressed air supply holes 41c provided on the bottom surface of the accommodation recessed portion 41b of the substrate conveyance supply device 40. The air 43a is used to perform posture correction of the aforementioned substrate.

In the substrate conveyance and supply method of the present invention, the substrate posture correction step is configured to form the sealed concave portion 41b in a sealed shape by using the substrate W and the locking portion 41a of the substrate conveyance supply device, and The compressed air 43a is supplied to the accommodation recessed portion 41b from a plurality of compressed air supply holes 41c provided on the bottom surface of the accommodation recessed portion 41b, thereby correcting the posture of the substrate.

In the substrate conveyance and supply method of the present invention, the substrate posture correction step is configured to form the sealed concave portion 41b in a sealed shape by using the substrate W and the locking portion 41a of the substrate conveyance supply device, and The compressed air 43a is supplied to the accommodation recessed portion 41b through the fluid pressure relieving mechanism 56 provided on the bottom surface of the accommodation recessed portion 41b, thereby correcting the posture of the substrate.

The substrate transfer supply device of the present invention for achieving the above object, the surface is The substrate W on which the plurality of electronic components 30 are mounted is transported to a position below the upper mold surface 10a of the compression-molding resin package A, and the surface of the substrate W faces downward and the back surface of the substrate W is attracted to the upper mold surface. In the substrate transfer and supply device of the 10a, the substrate transfer plate portion 41 is provided to mount the substrate W, and the advance/retract reciprocating mechanism 42 is configured to be capable of disposing the substrate transfer plate portion 41 with respect to the upper mold surface. And a substrate deformation posture correcting mechanism 43 having a locking portion 41a that is engaged with a peripheral portion of the surface of the substrate W and that is locked at a predetermined position around the surface of the substrate W. And the housing recessed portion 41b is provided in a state in which all of the electronic component 30 are not in contact with the locking portion 41a, and the substrate deformation posture correcting mechanism includes a compressed air supply hole 41c and is provided on the bottom surface of the housing recess 41b. A plurality of compressors are provided, and a compressed air supply mechanism is connected to the compressed air hole 41c.

In the substrate conveyance and supply device of the present invention, the substrate posture correcting mechanism 43 forms the sealed recessed portion 41b in a sealed shape by the substrate W and the locking portion 41a of the substrate transporting plate portion 41, and The compressed air supply hole 41c supplies compressed air 43a to the accommodation recessed portion 41b.

In the substrate conveyance and supply device of the present invention, the substrate posture correction mechanism 43 includes the storage recess portion 41b having a sealed shape by the substrate W and the locking portion 41a of the substrate conveyance plate portion 41. The compressed air 43a is supplied to the accommodation recess 41b through the fluid pressure relieving mechanism 56 provided on the bottom surface of the accommodation recess 41b.

According to the present invention, even when the central portion of the substrate W placed on the substrate transport supply device (substrate transfer plate portion) is in a state of being sagged and bent in a curved shape due to its own weight, or when the substrate W is bent, The substrate W is effectively and surely adsorbed and held at a pressure The molding surface of the upper mold in the resin packaging device A. Further, according to the present invention, it is possible to obtain a particularly remarkable effect in the case where a large-sized substrate having a tendency to sag tends to sag in the center portion of the conveyance substrate W is conveyed.

A‧‧‧Compressed resin packaging device

W‧‧‧Substrate

10‧‧‧上模

10a‧‧‧Upper face

10b‧‧‧Locating pin

20‧‧‧Substrate adsorption mechanism

20a‧‧‧ suction holes

30‧‧‧Electronic parts

31‧‧‧ pinhole

40‧‧‧Substrate transport supply device

41‧‧‧Substrate transfer board

41a‧‧‧Clock

41b‧‧‧ containment recess

41c‧‧‧Compressed air supply hole

41d‧‧‧ clearance hole

41e‧‧‧ clearance slot

41f‧‧‧Locating pin

42‧‧‧Advance and retreat reciprocating mechanism

43‧‧‧Substrate deformation posture correction mechanism

43a‧‧‧Compressed air

44‧‧‧Base

50‧‧‧Down

50a‧‧‧ lower cavity

50b‧‧‧ Pressing member

55‧‧‧Flexible components

56‧‧‧ Fluid Pressure Mitigation Mechanism

56a‧‧‧Compressed air supply tank

60‧‧‧ molten resin material

70‧‧‧Substrate retention mechanism

71‧‧‧Substrate retention claw

71a‧‧‧ base end

71b‧‧‧Flexible components

71c‧‧‧Promoting sales

71d‧‧‧ front end

72‧‧‧Operational sales

73‧‧‧Support shaft

1 is a partially cutaway longitudinal cross-sectional view showing a main portion of a substrate transport and supply device according to the present invention, and shows a state in which the transport supply device is moved to a lower position of a lower surface of the upper mold surface of the compression resin sealing device. .

Fig. 2 is a schematic plan view of a substrate transport and supply device corresponding to Fig. 1;

Fig. 3 is a vertical cross-sectional view of the substrate transporting and supplying apparatus corresponding to Fig. 1, and Fig. 3 (1) is a vertical cross-sectional view showing a main portion of the transporting and supplying apparatus, and Fig. 3 (2) is an enlarged longitudinal sectional view of the main portion.

4 is an explanatory view of a substrate mounting operation of the upper mold surface of the compression resin sealing device, and FIG. 4 (1) shows a state in the forward step of the substrate conveyance supply device, and FIG. 4 (2) is an enlarged view of the main portion.

Fig. 5 is an explanatory view of a substrate mounting operation of the upper mold surface of the compression resin sealing device, Fig. 5 (1) shows a state in the substrate bonding step of the upper mold surface, and Fig. 5 (2) is an enlarged view of the main portion.

Fig. 6 is an explanatory view of a substrate mounting operation of the upper mold surface of the compression resin sealing device, Fig. 6 (1) shows a state in the substrate holding step of the upper mold surface, and Fig. 6 (2) is an enlarged view of the main portion.

Fig. 7 is a schematic plan view showing another substrate transfer and supply device of the present invention.

Fig. 8 is a schematic plan view showing still another substrate transfer and supply device of the present invention.

Fig. 9 is a longitudinal sectional view of the substrate transporting and supplying device corresponding to Fig. 8, and Fig. 9(1) is a view A longitudinal cross-sectional view of a main portion of the conveyance and supply device, and Fig. 9 (2) is an enlarged longitudinal sectional view of the main portion.

Fig. 10 is an explanatory view showing a state in which a substrate is mounted on an upper mold surface of a compression resin encapsulating apparatus by a conventional substrate transport and supply method, and Fig. 10 (1) shows an upper mold for moving the transport supply device into a compression resin encapsulating device. FIG. 10(2) is an enlarged longitudinal cross-sectional view showing a main part of a state in which a substrate is mounted on the upper mold surface.

Hereinafter, the present invention will be described based on the respective embodiments shown in Figs. 1 to 9 .

(First embodiment)

FIG. 1 shows a state in which the substrate conveyance and supply device 40 of the first embodiment is moved to a position below the upper mold 10 (upper mold surface 10a) in the compression resin sealing device A, and FIGS. 2 and 3 show the substrate conveyance supply device. The main portion of 40, and FIG. 4 to FIG. 6 show a case where the substrate W is attached to the upper mold surface 10a of the compression-molding resin package A.

First, the outline of the compression-molding resin package A will be described. In general, the compression-molding resin package A includes a movable lower mold 50 (see FIG. 1) in which the upper mold 10 is fixed and a position below the upper mold surface 10a that can be moved up and down. Further, the upper mold 10 includes a substrate adsorption mechanism 20 that adsorbs the substrate W to the upper mold surface 10a by suction, and a substrate holding mechanism 70 that holds the substrate W adsorbed to the upper mold surface 10a.

Further, the substrate suction mechanism 20 described above is configured by a plurality of intake holes 20a opened in the upper die surface 10a and a plurality of intake holes 20a communicating with the pressure reducing mechanism (not shown) side. Therefore, it is provided that the substrate W joined to the upper die face 10a can be adsorbed to the upper die face by the suction action (vacuum action) from the pressure reducing mechanism generated in the plurality of suction holes 20a. 10a.

Further, the lower mold 50 is provided with a lower mold cavity 50a for supplying a resin material and a pressing member 50b for compressing the resin material 60 which is heated and melted in the lower mold cavity 50a. In addition, the substrate W of the upper mold surface 10a is attached by holding the back surface of the substrate W to which the electronic component 30 is not mounted to the upper mold surface 10a and holding it in accordance with the procedure described later. Therefore, at this time, the electronic component 30 adhering to the substrate W of the upper mold face 10a is kept downward. Further, although a plurality of (majority) electronic components are mounted on the surface of the substrate W, they are simply shown in the drawing.

Further, in order to resin-package the electronic component 30 on the substrate W using the compression-molding resin package A, the following operation is performed. First, the substrate conveyance supply device 40 is moved to the outside of the compression resin package device A. Thereafter, the upper mold 10 and the lower mold 50 are clamped so that the electronic component 30 on the substrate W is immersed in the molten resin material 60 provided in the lower mold cavity 50a on the lower mold 50, and is prescribed by the pressing member 50b. The molten resin material 60 is compression molded by resin pressure. The resin package of the electronic component 30 is performed by the above operation.

Further, the electronic component 30 on the substrate W is collectively resin-sealed in a resin molded body corresponding to the shape of the lower cavity 50a. Further, each of the electronic components 30 that are collectively resin-sealed is cut and separated for each electronic component in the cutting process step of the subsequent step to become a product.

Next, the substrate conveyance supply device 40 will be described. The substrate transporting and supplying device 40 includes the substrate transporting plate portion 41 on which the substrate W is placed, and the forward and backward reciprocating motion for arranging the substrate transporting plate portion 41 so as to be able to advance and retreat with respect to the lower position of the upper mold surface 10a of the compressed resin packaging device A. Agency 42. Further, the substrate transfer plate portion 41 is provided with a locking portion 41a that is joined to a peripheral portion of the substrate W and that locks a peripheral portion of the surface of the substrate W at a predetermined position, and an electronic component 30 that is to be located on the surface of the substrate. In a state in which the locking portion 41a is not in contact with The accommodation recess 41b accommodated in the row. Further, a plurality of compressed air supply holes 41c are disposed on the bottom surface of the housing recess 41b in the substrate transporting plate portion 41. Further, the compressed air supply hole 41c and a compressed air supply mechanism (not shown) that is connected to the compressed air supply hole 41c constitute a substrate deformation posture correcting mechanism 43.

Next, a substrate holding mechanism 70 that is disposed in association with each other between the two devices of the compression resin sealing device A and the substrate transfer supply device 40 will be described. In other words, the substrate holding mechanism 70 is composed of at least a pair of substrate holding claws 71 provided at appropriate portions such as both end portions of the upper mold 10 and an operation pin 72 of each of the substrate holding claws 71, and the operation pin 72 is Each position on the base 44 in the substrate transport supply device 40 corresponding to the arrangement position and the number of the substrate holding claws 71 is erected. Further, the above-described substrate holding claws 71 are pivotally attached to the support shaft 73 fixedly provided on the upper mold 10 in a rotatable state. Further, an elastic pressing force caused by the push pin 71c biased downward by the elasticity of the elastic member 71b is applied to the base end portion 71a of the substrate holding claw 71. Further, when the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw 71, the front end portion 71d is rotated about the support shaft 73, and the front end portion 71d can be protruded to the upper mold. The lower surface position of the surface 10a (refer to Fig. 4).

Further, the operation pin 72 of the substrate holding claw 71 is erected at a position on the base 44 corresponding to the position of the base end portion 71a of the above-described substrate holding claw 71. Further, as will be described later, the forward movement of the substrate conveyance/feeding device 40 at the lower surface position of the upper mold surface 10a and the backward movement when retracted from the position to the outside are performed, and the upward movement of the substrate W and the upper mold surface 10a is performed. When moving and moving downward from this position, the substrate transport supply device 40 moves in the same direction at the same time.

Further, as described above, when the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw 71, as shown in FIG. 4, the front end portion 71d is rotated about the support shaft 73, and The front end portion 71d is caused to protrude to the lower surface position of the upper mold surface 10a. In contrast, as shown in FIG. 5, when the operation pin 72 of the substrate holding claw 71 and the substrate W on the substrate conveying plate portion 41 are simultaneously moved upward, the upper end portion of the operation pin 72 pushes up the substrate holding claw 71 upward. The proximal end portion 71a is rotated about the distal end portion 71d around the support shaft 73, so that the distal end portion 71d can be retracted outward of the upper mold surface 10a. Further, the upward movement of the substrate W on the substrate transfer plate portion 41 is performed after the front end portion 71d is retracted from the outer surface of the upper mold surface 10a. Therefore, the front end portion 71d of the substrate holding claw 71 is not hindered from the substrate transfer. The upward movement of the substrate W on the plate portion 41.

Further, a positioning pin 10b (see FIG. 1) for guiding the substrate W to a predetermined position of the upper mold surface 10a is protruded from the upper mold surface 10a of the upper mold 10 described above. In addition, a clearance hole 41d (see FIG. 2) for the positioning pin 10b is provided at a position of the locking portion 41a of the conveyance supply device 40 corresponding to the protruding installation position of the positioning pin 10b. In addition, the arrangement position and the number of arrangement of the positioning pin 10b of the upper die surface 10a and the clearance hole 41d of the locking portion 41a can be appropriately selected as needed.

In addition, a clearance groove 41e that does not interfere with the rotation of the distal end portion 71d of the substrate holding claw is provided at the side surface position of the locking portion 41a in the above-described substrate conveying plate portion 41. Further, the clearance groove 41e is provided at a side surface position of the locking portion 41a corresponding to the standing position of the operation pin 72 in the base 44 (see FIG. 2).

Further, at both end portions of the locking portion 41a of the above-described substrate conveying plate portion 41, a positioning pin 41f (see FIG. 3) for locking the substrate W to a predetermined position of the locking portion 41a is provided. When the substrate W is locked by the positioning pin 41f, the upper end portion of the positioning pin 41f is transmitted through the engaging pin hole 31 of the substrate W and protrudes upward from the thickness (height) of the substrate W. However, as shown in the schematic view of Fig. 3 (1), the positioning pin 41f can be retracted so as to be pressed downward against the elasticity of the elastic member 55. Therefore, when the substrate W is bonded to the upper mold surface 10a, the positioning pin 41f that abuts against the upper mold surface 10a is retracted downward, so that the bonding action between the upper mold surface 10a and the substrate W is not hindered. In addition, the arrangement position and the arrangement number of the positioning pin 41f in the locking portion 41a and the engagement pin hole 31 of the substrate W can be appropriately selected as needed.

In the case where the substrate W is transported and supplied to the fixed upper mold 10 of the compressed resin packaging device A by the substrate transport and supply device 40, that is, the back surface of the substrate W on which the electronic component 30 is not mounted is adsorbed to the upper mold surface 10a and held. The situation is explained.

First, a preparation step of the substrate transfer supply device 40 is performed. In addition, as shown in (1) of FIG. 3, the peripheral portion of the substrate W is joined to the locking portion 41a of the substrate transfer and supply device 40 (specifically, the substrate transfer plate portion 41), and is locked. The electronic component 30 located on the surface of the substrate W is placed in the substrate mounting step in the housing recess 41b of the substrate transfer plate portion 41. At this time, the substrate W can be locked to a predetermined position of the locking portion 41a by the positioning pin 41f of the locking portion 41a (see FIG. 2). In addition, the substrate W described above is a rectangular substrate having a size that allows the peripheral portion of the surface to be bonded to the locking portion 41a of the substrate transfer plate portion 41 and locked. Therefore, when the substrate W and the locking portion 41a are joined and locked, a part of the substrate W is placed on the upper portion of the gap portion 41e for the substrate holding claw tip end portion 71d (see FIG. 3). .

Next, a step of advancing the substrate transfer supply device 40 that transports the substrate transfer/feed device 40 to the lower position of the upper mold surface 10a of the compressed resin package device A (refer to Figure 1 and Figure 4).

Then, the substrate transfer/feed device 40 is moved upward to engage the back surface of the substrate W (the upper side in the drawing, the electronic component 30 is not mounted here) at a predetermined position of the upper mold surface 10a of the compression resin sealing device A. The substrate positioning step. Next, a substrate bonding step of bonding the back surface of the substrate W positioned at a predetermined position of the upper mold surface 10a to the upper mold surface 10a is performed (see FIG. 5). As shown in FIGS. 4 and 5, the above-described substrate positioning step and substrate bonding step can be performed by moving the substrate conveyance/feeding device 40 upward toward the upper mold surface 10a of the compression resin sealing device A. That is, when only the elastic pressing force of the push pin 71c is applied to the base end portion 71a of the substrate holding claw 71, as shown in Fig. 4, the front end portion 71d thereof is rotated to protrude to the lower surface position of the upper die face 10a. At this time, as shown in FIG. 5, the upper end portion of the operation pin 72 of the substrate holding claw 71 pushes up the base end portion 71a of the substrate holding claw 71 to rotate the front end portion 71d while retracting the outer side of the upper mold surface 10a. Thereby, the upward movement of the substrate W on the substrate transfer plate portion 41 can be smoothly performed.

When the back surface of the substrate W described above is joined to a predetermined position of the upper mold surface 10a, as shown in Fig. 3 (2), compressed air 43a is supplied to the surface of the substrate W on which the electronic component 30 is mounted to correct the substrate W. The substrate posture correcting step of the deformed posture. At this time, the peripheral portion of the surface of the substrate W placed on the substrate transfer plate portion 41a is locked to the upper surface of the locking portion 41a, and the thickness of the substrate W is thin, and further, the surface of the substrate W is attached. Since the plurality of electronic components 30 are facing downward, as shown in the figure, the central portion of the substrate W is in a state of sagging due to its own weight. However, by supplying the compressed air 43a to the surface of the substrate W and pushing up the center portion of the substrate, it is possible to correct the sagging posture of the substrate W described above to a slightly horizontal posture indicated by a dotted line in the same figure. The substrate posture correction step of the position. Furthermore, The above-described supply mode of the compressed air 43a can be appropriately selected and implemented in accordance with the degree of the hanging posture of the substrate W.

When the compressed air 43a is supplied to the surface of the substrate W to correct the deformation posture of the substrate W, a substrate adsorption step (see FIG. 5) for adsorbing the substrate W to the upper mold surface 10a of the compression resin sealing device A is performed. That is, the substrate adsorption step can adsorb the substrate W bonded to the upper mold surface 10a to the upper mold surface 10a by the suction action from the pressure reducing mechanism generated in the plurality of suction holes 20a.

Alternatively, after the compressed air 43a is supplied to the surface side of the substrate W to correct the deformation posture of the substrate W, a substrate adsorption step (see FIG. 5) for adsorbing the substrate W to the upper mold surface 10a of the compression resin sealing device A is performed. That is, in the same manner as described above, the substrate adsorption step can adsorb the substrate W bonded to the upper mold surface 10a to the upper mold surface 10a by the suction action from the pressure reducing mechanism generated in the plurality of suction holes 20a.

When the substrate W is adsorbed onto the upper mold surface 10a described above, a substrate holding step (see FIG. 6) for holding the substrate W on the upper mold surface 10a of the compression resin sealing device A is performed. In other words, the substrate W can be held on the upper mold surface 10a while the substrate W is adsorbed onto the upper mold surface 10a. In the substrate holding step, the substrate conveyance/feeding device 40 is moved downward, and the engagement state between the upper end portion of the operation pin 72 of the substrate holding claw 71 and the base end portion 71a of the substrate holding claw 71 can be released. When the engagement between the upper end portion of the operation pin 72 and the base end portion 71a of the substrate holding claw 71 is released, the elastic pressing force of the push pin 71c is applied to the proximal end portion 71a of the substrate holding claw to the front end portion thereof. 71d is rotated as shown in Fig. 6 until it protrudes to the lower surface position of the upper die face 10a. At this time, the side surface position of the locking portion 41a in the substrate conveying plate portion 41 is provided so as not to hinder the rotation of the front end portion 71d of the substrate holding claw. The slit 41e is rotated by the gap groove 41e and joined to the surface of the substrate W (the mounting surface of the electronic component 30) on the upper surface of the locking portion 41a (the clearance groove 41e). And it is engaged in such a manner as to hold the portion from the lower position.

Alternatively, after the substrate W is adsorbed onto the upper mold surface 10a, a substrate holding step of holding the substrate W on the upper mold surface 10a of the compression resin sealing device A is performed (see FIG. 6). That is, after the substrate W is adsorbed onto the upper mold surface 10a described above, the substrate holding step of holding the substrate W on the upper mold surface 10a can be performed. In the same manner as described above, the substrate transfer/feed device 40 can be moved downward to release the engagement between the upper end portion of the operation pin 72 of the substrate holding claw 71 and the base end portion 71a of the substrate holding claw 71. Substrate retention step.

Next, a step of retreating the substrate transport supply device 40 that moves the substrate transport/feed device 40 downward and retracts the substrate transport supply device 40 to the outside of the compressed resin package device A is performed.

In the above-described first embodiment, even when the central portion of the substrate W placed on the substrate transporting plate portion 41 of the substrate transport and supply device 40 is in a state of being sagged and bent in a curved shape due to its own weight, or the substrate W itself is generated. In the case of the bending, the posture of the substrate W can be corrected to be horizontal, and the substrate W can be efficiently and surely adsorbed to and held by the upper mold surface 10a of the compression-molding resin package A. In addition, in the case where the center portion of the transport substrate W has a recent large-sized substrate which tends to sag, a particularly remarkable effect can be obtained.

Hereinafter, a second embodiment will be described based on Fig. 7 .

(Second embodiment)

In the above-described first embodiment, the portion of the locking portion 41a in the substrate conveying plate portion 41 is cut and the upper surface of the locking portion 41a is configured to be discontinuous. However, in the second embodiment, The difference between the first embodiment is that the upper surface of the locking portion 41a is continuously formed. In the second embodiment, substantially the same configuration as that of the first embodiment is the same as the matter described in the first embodiment. Therefore, in order to avoid redundancy, the same reference numerals are used for the configurations common to both.

In other words, in the first embodiment, the substrate W is locked to the upper surface of the locking portion 41a formed by the cutting portion, and thus the portion of the housing recess 41b of the electronic component 30 is opened. However, as shown in FIG. 7, in the second embodiment, by arranging the upper surface of the locking portion 41a to be continuous, the housing recess 41b is configured in the shape of a so-called bottomed box type container. When the substrate W is locked to the upper surface of the continuous locking portion 41a, the housing recess 41b is formed in a sealed shape by both the continuous locking portion 41a and the substrate W. Therefore, the substrate deformation posture correcting mechanism 43 in this embodiment is configured to supply the compressed air 43a from a plurality of compressed air supply holes 41c provided on the bottom surface of the seal-like accommodation recess 41b as described above.

In the second embodiment, the compressed air 43a is supplied from a plurality of compressed air supply holes 41c provided on the bottom surface of the seal-like accommodation recess 41b, whereby the internal pressure of the seal-like accommodation recess 41b can be increased. At this time, the posture correction pressure that pushes the center portion thereof slowly (slowly) is applied to the substrate W accommodated in the seal-like accommodation recess 41b. Thereby, the substrate posture correcting step of correcting the hanging posture of the substrate W to a slightly horizontal position can be performed. In addition, the supply form of the compressed air 43a described above can be appropriately selected and implemented in accordance with the degree of the hanging posture of the substrate W.

Further, in the second embodiment, since the housing recessed portion 41b is formed in a sealed shape, the compressed air 43a can be supplied to the sealed housing recessed portion 41b more easily and surely than the housing recessed portion of the first embodiment. And the internal pressure of the seal-like accommodation recess 41b is increased. use. Therefore, compared with the housing recess of the first embodiment, there is an advantage in that the substrate posture correcting step can be performed more efficiently.

Hereinafter, a third embodiment will be described based on Figs. 8 and 9 .

(Third embodiment)

The substrate deformation posture correcting mechanism in the first and second embodiments is configured to supply compressed air 43a from a plurality of compressed air supply holes 41c provided on the bottom surface of the housing recess, but the third embodiment and the first and second embodiments The difference is that the upper surface of the locking portion 41a is continuous to form a sealed receiving recess 41b, and the compressed air 43 is supplied by the fluid pressure relieving mechanism 56 provided on the bottom surface of the sealed receiving recess 41b. Further, in the third embodiment, substantially the same configurations as those of the first and second embodiments are the same as those described in the first and second embodiments. Therefore, in order to avoid redundant description, the same symbol is used for the common configuration.

That is, as shown in FIG. 8 and FIG. 9, in the third embodiment, the upper surface of the locking portion 41a is provided continuously, and the housing recess 41b is configured to have a shape of a bottomed box type container. When the substrate W is locked to the upper surface of the continuous locking portion 41a, the housing recess 41b is formed in a sealed shape by both the continuous locking portion 41a and the substrate W. Therefore, the substrate deformation posture correcting mechanism 43 in this embodiment is configured to supply the compressed air 43a through the fluid pressure relieving mechanism 56 provided on the bottom surface of the above-described sealed storage recess 41b. Further, as the fluid pressure relieving mechanism 56 described above, as shown in the example, a so-called spoiler can be used on the bottom surface of the seal-shaped accommodation recess 41b. Therefore, the substrate deformation posture correcting mechanism 43 in this embodiment is configured to supply the compressed air 43a from the compressed air supply groove 56a provided in the fluid pressure relieving mechanism (the baffle plate) 56 provided on the bottom surface of the seal-like accommodation recess 41b. . At this time, the substrate W accommodated in the seal-like housing recess 41b is biased to push the center portion thereof slowly upward. Corrective force. Thereby, the substrate posture correcting step of correcting the hanging posture of the substrate W to a slightly horizontal position can be performed. In addition, the manner of supplying the compressed air 43a described above can be appropriately selected and implemented in accordance with the degree of the hanging posture of the substrate W.

In the third embodiment, the compressed air 43a is supplied from the compressed air supply groove 56a of the fluid pressure relieving mechanism 56 provided on the bottom surface of the seal-shaped accommodation recess 41b, and the internal pressure in the seal-like accommodation recess 41b can be increased. As a result, it is possible to perform a substrate posture correcting step of pushing the central portion of the substrate W upward and correcting the sagging posture to a slightly horizontal position. At this time, the compressed air 43a introduced into the sealed accommodation recess 41b is relieved of the fluid pressure by the pressure relieving mechanism 56, and the phenomenon that the compressed air 43a is directly ejected toward the electronic component 30 is prevented. Thereby, the following disadvantages can be prevented. In other words, for example, in the electronic component 30 having the configuration in which the thin wires for electrical wiring are mounted, if the compressed air 43a is directly ejected to the wires, there is a possibility that the wires are deformed or the wires are broken. In this regard, in the third embodiment, since the fluid pressure of the compressed air 43a can be alleviated, such a drawback can be prevented.

Further, in the third embodiment, since the housing recessed portion 41b is formed in a sealed shape, the compressed air 43a can be supplied to the sealed housing recessed portion 41b more easily and surely than the housing recessed portion of the first embodiment. The effect of the internal pressure of the seal-like accommodation recess 41b is increased. Therefore, the substrate posture correcting step can be performed more efficiently than the housing recessed portion of the first embodiment.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately changed and selected as needed without departing from the scope of the invention.

A‧‧‧Compressed resin packaging device

W‧‧‧Substrate

10‧‧‧上模

10a‧‧‧Upper face

10b‧‧‧Locating pin

20‧‧‧Substrate adsorption mechanism

20a‧‧‧ suction holes

30‧‧‧Electronic parts

40‧‧‧Substrate transport supply device

41‧‧‧Substrate transfer board

41a‧‧‧Clock

41b‧‧‧ containment recess

41c‧‧‧Compressed air supply hole

41e‧‧‧ clearance slot

41f‧‧‧Locating pin

42‧‧‧Advance and retreat reciprocating mechanism

43‧‧‧Substrate deformation posture correction mechanism

44‧‧‧Base

50‧‧‧Down

50a‧‧‧ lower cavity

50b‧‧‧ Pressing member

60‧‧‧ molten resin material

70‧‧‧Substrate retention mechanism

71‧‧‧Substrate retention claw

71a‧‧‧ base end

71b‧‧‧Flexible components

71c‧‧‧Promoting sales

71d‧‧‧ front end

72‧‧‧Operational sales

73‧‧‧Support shaft

Claims (7)

A substrate transfer and supply method is a method in which a substrate having a plurality of electronic components mounted on a surface thereof is transported to a lower position of an upper mold surface of a compression resin sealing device, and the surface of the substrate is faced downward and the back surface of the substrate is adsorbed to the foregoing The substrate transfer and supply method is characterized in that the substrate transfer and supply device prepares a substrate transfer and supply device including a locking portion and a housing recess, and the locking portion is bonded to a peripheral portion of the substrate. And sealing the peripheral portion of the surface at a predetermined position, wherein the housing recess is configured to receive all of the electronic components in a state of not contacting the locking portion, and the substrate mounting step of the surface peripheral portion of the substrate The locking portion of the substrate transporting and supplying device is joined and locked, and the electronic component is housed in the housing recess of the substrate transporting device, and the substrate transporting device advances the substrate transporting through the substrate placing step The supply device is transported to a position below the upper mold surface; The board positioning step moves the substrate transporting and supplying device that has passed through the step of advancing the substrate transporting device upward with respect to the compressed resin sealing device so that the back surface of the substrate is engaged with a predetermined position of the upper mold surface; a substrate bonding step of bonding the back surface of the substrate passing through the substrate positioning step to the upper mold surface; and a substrate posture correcting step of supplying compressed air to the surface of the substrate to deform the substrate during the substrate bonding step Posture correction; substrate adsorption step, during the aforementioned substrate posture correction step and after the aforementioned substrate posture correction In any one or both of the two steps, the substrate is adsorbed to the upper mold surface; the substrate holding step is performed during the substrate adsorption step and after the substrate adsorption step, or In the two periods, the substrate is held by the upper mold surface; and the step of retracting the substrate transfer and supply device moves the substrate transfer supply device relatively downward with respect to the compressed resin package device after the substrate holding step And the substrate transfer supply device is moved backward to the outside of the compressed resin package device. The substrate conveyance and supply method according to the first aspect of the invention, wherein the substrate posture correction step supplies compression to the housing recess by a plurality of compressed air supply holes provided in a bottom surface of the housing recess provided in the substrate conveyance supply device. Air is used to perform posture correction of the aforementioned substrate. The substrate transfer and supply method according to the first aspect of the invention, wherein the substrate posture correction step is configured to form the sealed concave portion in a sealed shape by using both the substrate and the locking portion of the substrate transfer supply device. The plurality of compressed air supply holes provided on the bottom surface of the housing recess are supplied with compressed air to the housing recess to correct the posture of the substrate. The substrate conveyance and supply method according to the first aspect of the invention, wherein the substrate posture correction step is configured to form a sealed concave portion by using both the substrate and the locking portion of the substrate transfer supply device, and is transparent The fluid pressure relieving mechanism provided on the bottom surface of the housing recess is supplied with compressed air to the housing recess to correct the posture of the substrate. A substrate transfer and supply device for transporting a substrate on which a plurality of electronic components are mounted on a surface of a lower surface of a compression resin sealing device, and a substrate transfer and supply device in which the surface of the substrate faces downward and the back surface of the substrate is adsorbed to the upper mold surface, and includes a substrate transfer plate portion on which the substrate is placed, and a reciprocating mechanism for transporting the substrate The plate portion is disposed to be movable forward and backward with respect to a lower position of the upper mold surface; and the substrate deformation posture correcting mechanism has a locking portion that is joined to a surface peripheral portion of the substrate and has a surface periphery The portion is locked at a predetermined position; and the housing recess is configured to accommodate all of the electronic components in a state of not contacting the locking portion, and the substrate deformation posture correcting mechanism includes a compressed air supply hole on a bottom surface of the housing recess And a plurality of compressed air supply means connected to the compressed air supply hole, wherein the substrate transfer and supply device advances to a position below the upper mold surface, and the back surface of the substrate is engaged with the upper mold surface Fixing the deformed posture of the substrate by the aforementioned deformation posture correcting means at a predetermined position, The state after the substrate is adsorbed on the corrected upper mold surface so that the substrate transfer apparatus supplying compressed outer resin package back to the apparatus. The substrate transfer and supply device according to claim 5, wherein the substrate deformation posture correcting mechanism is formed by the substrate and the substrate transfer plate portion Both of the locking portions constitute the storage recessed portion that is sealed, and compressed air is supplied from the compressed air supply hole to the housing recess. The substrate transfer and supply device according to the fifth aspect of the invention, wherein the substrate deformation posture correcting mechanism forms a sealed recessed portion by both the substrate and the locking portion of the substrate transporting plate portion, and transmits The fluid pressure relieving mechanism provided on the bottom surface of the housing recess is supplied with compressed air to the housing recess.