CN110634790A - Pressing plate device for chip packaging - Google Patents
Pressing plate device for chip packaging Download PDFInfo
- Publication number
- CN110634790A CN110634790A CN201910746818.0A CN201910746818A CN110634790A CN 110634790 A CN110634790 A CN 110634790A CN 201910746818 A CN201910746818 A CN 201910746818A CN 110634790 A CN110634790 A CN 110634790A
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- China
- Prior art keywords
- chip
- connecting rod
- bottom plate
- pressing
- chip packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a pressure plate device for chip packaging, which comprises a bottom plate and connecting rod mechanisms positioned on two sides of the upper part of the bottom plate, wherein the bottom of each connecting rod mechanism is connected with a supporting lug and is connected with a floor through the supporting lug, a chip is arranged between the two supporting lugs on the bottom plate, and the inner side end of each connecting rod mechanism is connected with a pressing assembly and acts on the pressing assembly to press and fix the chip. According to the invention, the pressing components of the connecting rod mechanism are matched to press and fix the chip, and the connecting rod mechanism can realize self-locking, so that the chip can be firmly pressed, the whole fixing process is convenient and quick for personnel to operate, the chip packaging efficiency can be greatly improved, the pressing components on the pressing plate device can be adjusted up and down, the supporting lugs can slide on the bottom plate, the distance between the two supporting lugs is changed, and therefore, the pressing plate device can be suitable for packaging chips with different sizes, and the application range of the pressing plate device is improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a pressing plate device for chip packaging.
Background
Packaging a chip refers to connecting circuit pins on a silicon chip to external joints by wires so as to facilitate connection of other devices. The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the connection points on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, thereby realizing the connection of the internal chip and an external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. On the other hand, the packaged chip is more convenient to mount and transport. The performance of the chip and the design and manufacture of a PCB (printed circuit board) connected with the chip are directly affected by the quality of the packaging technology, so that the chip is very important, the chip is placed on a substrate to be processed by different processes in the packaging process, and needs to be fixed to prevent the chip from deviating in the processing process to affect the quality of the chip, and therefore a special pressure plate device for chip packaging needs to be provided.
Disclosure of Invention
The present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, one object of the present invention is to provide a pressure plate device for chip packaging, which employs a link mechanism and a plurality of pressing assemblies to cooperate with each other to press and fix a chip, wherein the whole fixing process is convenient and fast for personnel to operate, and can greatly improve the chip packaging efficiency.
The invention provides a pressing plate device for chip packaging, which comprises a bottom plate and connecting rod mechanisms positioned on two sides of the upper part of the bottom plate, wherein the bottom of each connecting rod mechanism is connected with a supporting lug and is connected with a floor through the supporting lug, a chip is arranged between the two supporting lugs on the bottom plate, and the inner side end of each connecting rod mechanism is connected with a pressing assembly and acts on the pressing assembly to press and fix the chip.
Preferably, the pressing assembly comprises a stud, the upper portion of the stud is connected with a limiting column, the lower portion of the stud is connected with a pressing plate, and the diameters of the limiting column and the pressing plate are both larger than the outer diameter of the stud.
Preferably, the lower terminal surface of clamp plate is provided with circular cushion, adopts circular cushion and chip contact, avoids the clamp plate to cause the damage to the chip.
Preferably, a strip-shaped groove is formed in the stud along the axial direction of the stud, scale marks are etched in the strip-shaped groove, the scale marks are convenient to adjust the height of the pressing assembly and refer to the height of the pressing assembly, and the two pressing assemblies are guaranteed to be consistent in adjusting height.
Preferably, link mechanism includes right angle pole, depression bar and connecting rod, the corner of right angle pole is articulated through the tip of hinge with the depression bar, and the one end of right angle pole is articulated with supporting convex block, the other end with set up with the screw hole of double-screw bolt looks adaptation, the double-screw bolt passes through screw hole and right angle pole threaded connection, one side that is close to right angle pole on the depression bar has a bellying, and the bellying of depression bar is articulated with the one end of connecting rod, the other end of connecting rod is articulated with supporting convex block, and it is fixed to directly press down the depression bar through above-mentioned link mechanism personnel and can realize pressing of chip, easy operation to the time is short, and link mechanism can realize the auto-lock simultaneously.
Preferably, the middle part of the bottom plate is provided with a plurality of grooves, bonding rubber blocks are arranged in the grooves, and the bottoms of the chips are connected with the bottom plate through the bonding rubber blocks.
Preferably, the supporting projection is movably connected with the bottom plate.
Preferably, the bottom plate is provided with a sliding groove at a position corresponding to the supporting bump, the supporting bump is connected with the bottom plate in a sliding fit manner through the sliding groove, and the distance between the supporting bumps is adjusted to enable the pressing plate device to fix chips with different widths.
According to the invention, the pressing components of the connecting rod mechanism are matched to press and fix the chip, a person directly presses the pressing rod down during pressing, the connecting rod rotates anticlockwise and drives the pressing rod to move leftwards, the pressing rod pushes the right-angle rod to rotate anticlockwise by taking the bottom end of the right-angle rod as a center until the pressing plate of the pressing component is contacted with the chip, the short edges of the connecting rod and the pressing rod are collinear at the moment, the connecting rod mechanism realizes self-locking, so that the chip can be pressed firmly, the operation of the person is convenient and quick during the whole fixing process, the chip packaging efficiency can be greatly improved, the pressing components on the pressing plate device can be adjusted up and down, the supporting lugs can slide on the bottom plate, the distance between the two supporting lugs is changed, the pressing plate device can be suitable for packaging chips with different sizes, and.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of an overall structure of a platen apparatus for chip packaging according to the present invention;
FIG. 2 is a schematic structural diagram of a pressing plate device link mechanism for chip packaging according to the present invention;
FIG. 3 is a schematic structural diagram of a pressing assembly of the platen device for chip packaging according to the present invention;
fig. 4 is a schematic structural diagram of a right-angle rod of a platen device for chip packaging according to the present invention.
In the figure: 1. a base plate; 2. a chip; 3. bonding the rubber block; 4. supporting the projection; 5. a link mechanism; 51. a right-angle rod; 52. a hinge; 53. a pressure lever; 54. a connecting rod; 6. a pressing assembly; 61. a limiting column; 62. a stud; 63. a strip-shaped groove; 64. pressing a plate; 7. a circular cushion; 8. a threaded bore.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-4, a pressure plate device for chip packaging comprises a bottom plate 1 and link mechanisms 5 located on two sides of the upper portion of the bottom plate 1, wherein the bottom of each link mechanism 5 is connected with a supporting bump 4 and is connected with a floor 1 through the supporting bump 4, a chip 2 is arranged on the bottom plate 1 and located between the two supporting bumps 4, the inner side end of each link mechanism 5 is connected with a pressing assembly 6 and acts on the pressing assembly 6 to press and fix the chip 2, and in the invention, the pressing assembly 6 is driven to rotate through the swinging of the link mechanisms 5 and enables the pressing assembly 6 to exert acting force on the chip 2 in the vertical direction to fix the chip 2, so that the subsequent packaging operation of;
as shown in fig. 4, the pressing assembly 6 in this embodiment includes a stud 62, the upper portion of the stud 62 is connected with a limiting column 61, the lower portion of the stud 62 is connected with a pressing plate 64, the diameters of the limiting column 61 and the pressing plate 64 are both greater than the outer diameter of the stud 62, the pressing assembly 6 is in threaded connection with the link mechanism 5, and the height between the pressing assembly 6 and the bottom plate 1 can be adjusted by rotating the stud 62, so that the pressing assembly 6 can be applied to chips 2 with different thicknesses, thereby effectively improving the application range of the pressing plate device, and in order to prevent the pressing assembly 6 from slipping off from the link mechanism 5, the diameters of the limiting column 61 and the pressing plate 64 are both set to be greater than the;
because the chip 2 is small in size and easy to damage, in order to protect the chip 2 from being crushed, the lower end surface of the pressure plate 64 is provided with the circular soft cushion 7, and the circular soft cushion 7 plays a role in protecting the chip 2;
in order to ensure that the pressing components 6 on the two sides move synchronously and the two ends of the chip 2 are stressed uniformly, a long-strip-shaped groove 63 is formed in the stud 62 along the axial direction of the stud, scale marks are etched in the long-strip-shaped groove 63, and when a person adjusts the distance between the pressing components 6 and the bottom plate 1, the height of the two pressing components 6 can be adjusted to be consistent by referring to the scale marks in the long-strip-shaped groove 63;
as shown in fig. 2, the link mechanism 5 in this embodiment includes a right-angle rod 51, a pressing rod 53 and a connecting rod 54, a corner of the right-angle rod 51 is hinged to an end of the pressing rod 53 through a hinge 52, one end of the right-angle rod 51 is hinged to the supporting boss 4, the other end of the right-angle rod 51 is provided with a threaded hole 8 matched with the stud 62, the stud 62 is in threaded connection with the right-angle rod 51 through the threaded hole 8, one side of the pressing rod 53, which is close to the right-angle rod 51, is provided with a protruding portion, the protruding portion of the pressing rod 53 is hinged to one end of the connecting rod;
in order to fix the chip 2 on the bottom plate 1, a plurality of grooves are formed in the middle of the bottom plate 1, adhesive blocks are arranged in the grooves, and the bottom of the chip 2 is connected with the bottom plate 1 through the adhesive blocks, so that the chip is prevented from moving in the packaging process;
in order to enable the pressure plate device to be suitable for chips 2 with different widths, the supporting lug 4 and the bottom plate 1 are movably connected; specifically, the position department that corresponds support lug 4 on the bottom plate 1 has seted up the spout, and support lug 4 is connected with 1 sliding fit of bottom plate through this spout, and the personnel adjust two distances between support lug 4 according to the width size of chip 2, directly promote during the regulation support lug 4 slide in the spout can, through setting up support lug 4 and bottom plate 1 into sliding connection, the effectual functionality that promotes this presser device.
When in work, the chip 2 is placed in the middle of the bottom plate 1, the chip 2 is firmly bonded through the bonding rubber block in the groove, then the height of the pressing component 6 and the distance between the supporting bumps 4 are adjusted to be proper positions according to the volume of the chip 2, when the height of the pressing component 6 is adjusted, the stud 62 is directly rotated, the stud 62 is in threaded connection with the right-angle rod 51 to realize height adjustment, the height of the two pressing assemblies 6 is consistent by referring to the scale marks on the stud 62 during adjustment, after the position of the pressure plate device is adjusted, a person manually presses the pressure rod 53, the connecting rod 54 rotates anticlockwise and drives the pressure rod 53 to move leftwards, the pressure rod 53 pushes the right-angle rod 51, the right-angle rod 51 rotates anticlockwise by taking the bottom end of the right-angle rod as a center until the pressure plate 64 of the pressing assembly 6 contacts with the chip 2, the short edges of the connecting rod 54 and the pressure rod 53 are collinear at the moment, the connecting rod mechanisms 5 realize self-locking, and the chip 2 is pressed firmly by the matching of the two connecting rod mechanisms 5.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (8)
1. The pressure plate device for chip packaging is characterized in that: the connecting rod mechanism comprises a bottom plate and connecting rod mechanisms located on two sides of the upper portion of the bottom plate, wherein the bottom of each connecting rod mechanism is connected with a supporting lug and is connected with the floor through the supporting lug, a chip is arranged between the two supporting lugs on the bottom plate, and the inner side end of each connecting rod mechanism is connected with a pressing assembly and acts on the pressing assembly to press and fix the chip.
2. The platen device for chip packaging according to claim 1, wherein: the pressing assembly comprises a stud, the upper portion of the stud is connected with a limiting column, the lower portion of the stud is connected with a pressing plate, and the diameters of the limiting column and the pressing plate are larger than the outer diameter of the stud.
3. The platen device for chip packaging according to claim 2, wherein: the lower end face of the pressing plate is provided with a round soft pad.
4. The platen device for chip packaging according to claim 2, wherein: a strip-shaped groove is formed in the stud along the axial direction of the stud, and scale marks are etched in the strip-shaped groove.
5. The platen device for chip packaging according to claim 4, wherein: link mechanism includes right angle pole, depression bar and connecting rod, the corner of right angle pole is articulated through the tip of hinge with the depression bar, and the one end of right angle pole is articulated with supporting convex block, the other end with set up the screw hole with double-screw bolt looks adaptation, the double-screw bolt passes through screw hole and right angle pole threaded connection, one side that is close to right angle pole on the depression bar has a bellying, and the bellying of depression bar is articulated with the one end of connecting rod, the other end and the supporting convex block of connecting rod are articulated.
6. The platen device for chip packaging according to claim 1, wherein: the bottom plate middle part is equipped with a plurality of recesses, all is equipped with the bonding and glues the piece in a plurality of recesses, the bottom of chip is glued the piece through bonding and is connected with the bottom plate.
7. The platen device for chip packaging according to claim 1, wherein: the supporting convex block is movably connected with the bottom plate.
8. The platen device for chip packaging according to claim 7, wherein: the bottom plate is provided with a sliding groove corresponding to the position of the supporting lug, and the supporting lug is connected with the bottom plate in a sliding fit manner through the sliding groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746818.0A CN110634790A (en) | 2019-08-14 | 2019-08-14 | Pressing plate device for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746818.0A CN110634790A (en) | 2019-08-14 | 2019-08-14 | Pressing plate device for chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110634790A true CN110634790A (en) | 2019-12-31 |
Family
ID=68970402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910746818.0A Withdrawn CN110634790A (en) | 2019-08-14 | 2019-08-14 | Pressing plate device for chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110634790A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111941270A (en) * | 2020-08-19 | 2020-11-17 | 许同 | Chip discharge mechanism is used in semiconductor chip production |
-
2019
- 2019-08-14 CN CN201910746818.0A patent/CN110634790A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111941270A (en) * | 2020-08-19 | 2020-11-17 | 许同 | Chip discharge mechanism is used in semiconductor chip production |
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Application publication date: 20191231 |