KR100370847B1 - Lamination device and method of wafer and circuit tape for manufacturing semiconductor package - Google Patents

Abstract

The present invention relates to a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package, and a method thereof. First, a circuit tape having a circuit film attached on a wafer on which a plurality of semiconductor chips are formed is closely adhered to an accurate reference position. Second, the circuit tape attached to the circuit film on the wafer to be adhered so as to be in close contact with the exact reference position is configured so that the heat transfer to prevent the defect caused by the thermal deformation to the maximum, Third, regarding a wafer and circuit tape lamination method for manufacturing a semiconductor package that can be adhered to the circuit tape is attached to the circuit tape attached to the exact reference position completely on the wafer on which a plurality of semiconductor chips are formed will be.

Description

Lamination device and method for wafer and circuit tape for semiconductor package manufacturing

The present invention relates to a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package and a method thereof, and more particularly to attaching a circuit tape having a circuit film adhered to a precise position on a wafer on which a plurality of semiconductor chips are formed. The present invention relates to a lamination apparatus for a wafer and a circuit tape for manufacturing a semiconductor package that can be fabricated, and a method thereof.

In general, as semiconductor packages are being miniaturized in electronic products such as electronic products, communication devices, computers, etc., the size of semiconductor packages is miniaturized without degrading the function, and the thin and small size of the semiconductor package is realized. It is a new type of semiconductor package.

The size of the semiconductor package is the same size as that of the semiconductor chip, and in the manufacturing method thereof, a circuit film having a circuit pattern formed on a wafer on which a plurality of semiconductor chips are formed is interposed with an elastoma tape. After the direct bonding, the wire bonding, solder ball fusion and molding on the wafer is finished in the last step to cut the wafer with each semiconductor chip to manufacture an independent semiconductor package.

In manufacturing such a semiconductor package, a very important process is to attach a circuit tape bonded circuit board to an accurate reference position on a wafer.

However, conventionally, since there was no separate equipment for completely contacting the circuit tape bonded to the circuit tape and the wafer at the time of the process, many difficulties were involved in attaching the circuit tape adhered to the circuit tape and the wafer to each other.

In addition, all general semiconductor package manufacturing equipment is very precise equipment, most of which is made of metal.

However, when the circuit tape and the wafer are attached to each other, the process is performed at a high temperature, so that the heat transfer should be made in consideration of the deformation caused by heat at the time of manufacturing the equipment.

In other words, when heat is transferred to a sophisticated equipment, the thermal expansion caused by this heat causes various defects due to the dimensional change of parts, and decreases the precision of manufacturing equipment. .

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and to manufacture a semiconductor package capable of attaching a circuit tape with a circuit film adhered to a precise reference position completely on a wafer on which a plurality of semiconductor chips are formed. To provide a lamination device for wafer and circuit tape for.

Another object of the present invention is to configure the circuit tape attached to the circuit tape on the wafer to be adhered to the exact reference position to be in close contact with the heat transfer to prevent the defect due to thermal deformation to the maximum, the defect caused by thermal deformation To provide a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package that can be prevented.

It is still another object of the present invention to provide a wafer and circuit tape lamination method for manufacturing a semiconductor package that can attach a circuit tape having a circuit film adhered to a precise reference position on a wafer on which a plurality of semiconductor chips are formed. .

1 is a front view showing a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention

Figure 2 is a front view showing the configuration of the tape adhesive portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

Figure 3 is a side view showing the configuration of the tape adhesive portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

Figure 4 is an enlarged perspective view of the main portion showing a configuration for the thermal cut-off of the tape adhesive portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

Figure 5 is a front view showing the configuration of the punching bush portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

6 is a plan view showing a die of a punching bush portion in a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention.

Figure 7 is a perspective view showing the configuration of the punching portion of the punching tool portion in the lamination device of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

8 is a cross-sectional view illustrating a configuration of a vacuum tool structure of a punching bush portion in a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention.

Figure 9 is a front view showing the configuration of the wafer attachment portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

Figure 10 is a side view showing the configuration of the wafer attachment portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

11 is an enlarged view showing an operating state of a wafer attaching part in a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention.

12 is an enlarged view of a portion “A” of FIG. 11;

Figure 13 is a front view showing the configuration of the pressing portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

14 is a plan view showing the installation state of the first, second, third gear for operating the pressing plate of the pressing press unit in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention.

Figure 15a is a plan view showing the configuration of the connection member for the thermal cut-off of the press portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

Figure 15b is a cross-sectional view showing the configuration of the connection member for the thermal cut-off of the press portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention.

Figure 16 is a front view showing the configuration of the cutting portion in the lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package according to the present invention

17 is a plan view illustrating a mounting die of a cutting unit in a lamination apparatus of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention.

18 is a perspective view showing the attachment state of the wafer and the circuit tape for manufacturing a semiconductor package according to the present invention

19 is an enlarged cross-sectional view showing a structure of an elastoma tape bonded to a circuit film for manufacturing a semiconductor package according to the present invention.

20 is a block diagram illustrating a lamination method of a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention.

-Explanation of symbols for the main parts of the drawing-

10-Tapered Adhesive 20-Punching Press

30-wafer attachment part 40-pressurization press part

50-cutting

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The lamination device of the wafer and the circuit tape for manufacturing a semiconductor package according to the present invention is to form a circuit tape (T) by adhering the circuit film 70 and the elastomer tape 60 on which a circuit pattern is formed. In order to bond the tape adhesive part 10, the bond finger of the circuit tape T formed by the said tape adhesive part 10, and the input / output pad of the semiconductor chip formed in many on the said wafer W with the wire, A punching press portion 20 for cutting the wire bonding region of the circuit tape T with the punch 21 and the die 23, a circuit tape T from which the wire bonding region is removed from the punching press portion 20; The wafer attaching portion 30 for aligning and attaching the wafers W formed with a plurality of semiconductor chips at an accurate reference position, and the circuit tape T and the wafer W attached at the wafer attaching portion 30 described above are completely removed. Pressurized press to press tightly When the circuit tape T and the wafer W are completely brought into close contact with the part 40 and the pressure press part 40, the unnecessary circuit tape T protruding to the outside of the wafer W is removed. It consists of a cutting unit 50 to remove.

The tape adhesive part 10 is provided with an input guide plate 11 on one side and an output guide plate 12 on the other side, between the input guide plate 11 and the output guide plate 12. The drive roller 14 and the pressure roller 15 is installed to be bonded to each other to rotate, the surface of the drive roller 14 is installed so that the heater 16 is in contact with, the drive roller 14 and the pressure roller The supply roller 17 is installed to be located in front of the 15 to advance the circuit film 70 and the elastoma tape 60 to the driving roller 14 and the pressure roller 15, An auxiliary roller 18 and an upper guide plate 13 are provided at the upper part of the feed roller 17.

Here, the drive roller 14 is driven by the motor 14a, and fine on the upper portion of the pressure roller 15 so as to adjust the distance between the drive roller 14 and the pressure roller 15. The adjusting tool 19 is provided.

In addition, the driving roller 14 is always maintained at a high temperature of more than 90 ° surface temperature by the heater 16, the high temperature is installed spaced apart from each other so that the heat is not transferred to other parts, the drive roller ( The coupling of the connecting shaft 151 coupled to rotate 14 forms a plurality of protruding jaws 152 on the side end surface of the connecting shaft 151 so as to reduce the adhesion area to the maximum, and the protruding jaws 152 The groove 142 to be fitted is formed and coupled to the support shaft 141 supporting the driving roller 14, while the connection shaft 151 has a space 153 to reduce heat transfer to the maximum. And a cutout 154 is formed, and an annular groove 155 is formed at an outer circumference thereof to reduce the contact area with the bearing 156 coupled to the connecting shaft 151.

The punching press unit 20 is a vacuum tool in which a plurality of vacuum holes 25a are formed to suction and fix the circuit tape T to which the circuit film 70 and the elastoma tape 60 are bonded. A die 23 is provided, and a die 23 is formed on which the vacuum tool 25 is seated and fixed, and a punch for cutting the wire bonding area of the circuit tape T fixed to the vacuum tool 25 ( 21 is provided at the top, and a drive unit 22 for operating the punch 21 is provided.

Here, the vacuum tool 25 has a long hole (25b) is formed so that the punch 21 is operated between the vacuum hole (25a), the shape of the vacuum tool 25 is formed in a square shape Four fastening portions 24 bent at right angles to a portion where each corner portion of the vacuum tool 25 is positioned on the upper surface of the die 23 so that the vacuum tool 25 is seated and fixed to the die 23. Is formed and the vacuum tool 25 is fixed to the engaging portion 24.

The wafer attachment part 30 is provided with the vacuum tool fixture 31 which fixes the vacuum tool 25 which adsorbs and fixes the circuit tape T on the upper part, and this vacuum tool fixture 31 is installed up and down. A wafer adsorption die 33 is installed on the sliding shank means 32, and a lower portion of the vacuum tool fixture 31 is provided with a wafer adsorption die 33 for adsorbing and fixing the wafer W. And the position adjusting means 34 capable of moving the position in the Y-axis direction and θ angle to adjust the position in the X, Y-axis direction and θ angle, and the above-described vacuum tool fixture 31 and wafer adsorption die. A camera 35 for scanning and comparing the reference positions of the circuit tape T and the wafer W is provided between the 33 and the camera 35 is a camera moving means 36 which slides back and forth. It is installed in).

Here, a plurality of adsorption holes 331 are formed in the wafer adsorption die 33 to adsorb and fix the wafer W. As shown in FIG.

In addition, when bonding the circuit tape (T) and the wafer (W), the above-described vessel to completely discharge the air located between the circuit tape (T) and the wafer (W) to bond them in a vacuum state The bottom surface of the tool tool 25 is formed with a curved surface protruding downward from the center thereof, and a plurality of air discharge holes 332 are formed at the outer circumference of the wafer suction die 33, and a rubber ring is formed on the outside thereof. 333) is installed. In addition, an adsorption pump 334 is installed outside the air discharge hole 332, and the adsorption pump 334 is provided to the limit switch 335 installed to operate when the vacuum tool fixture 31 is lowered. It is operated by

The wafer adsorption die 33 is provided with a buffer port 37 so as to absorb the impact when the wafer adsorption die 33 contacts the wafer adsorption die 33 by the lowering of the vacuum tool fixing tool 31.

The camera 35 is provided with a low magnification camera and a high magnification camera, respectively, and the low magnification camera and the high magnification camera are provided with lenses, respectively, on the upper and lower sides so as to scan both the upper and lower directions.

The position adjusting means 34 includes an X-axis movement micrometer 34a capable of moving the wafer adsorption die 33 in the X-axis direction, and a wafer adsorption die 33 capable of moving the wafer adsorption die 33 in the Y-axis direction. The Y-axis moving micrometer 34b and the θ angle adjusting micrometer 34c capable of rotating the wafer suction die 33 at a predetermined angle are provided, respectively.

In the pressure press unit 40, a die 41 capable of mounting the circuit tape T on which the wafers W are attached is provided on the lower fixing stand 42, and the die 41 is seated on the die 41. A pressure plate 43 for pressing the circuit tape T on which the wafer W is attached is positioned to move up and down in the upper portion of the die 41, and the pressure plate 43 is disposed below the ram 44. Is fixed to the ram 44, and the first, second, and third gears 45a, 45b, 45c are installed and lifted up and down. At this time, the first, second and third gears 45a, 45b and 45c are installed to operate by the rotation of the handle 46.

The die 41 is provided with a shock absorbing port 47 provided with a spring so as to retain some tension force from the upper side to the lower side at the moment of pressurizing the pressing plate 43.

In addition, a heater cartridge 41a is built into the die 41 to preheat the die 41 to a predetermined temperature, so that the high temperature does not transfer heat to other parts. The fixing member is fixed to the lower stand 42 via the connecting member 48 as a medium.

The connecting member 48 is coupled to form a plurality of protruding jaw 48a on the upper surface in order to reduce the contact area with the die 41, the plurality of holes 48b on the outer peripheral surface of the connecting member 48 Is formed.

The cutting part 50 is provided with a seating die 51 in which a circuit tape T having a wafer W attached thereto is sucked and fixed by backing, and a fixing table for fixing the seating die 51 is provided. 52 is installed, the upper support 54 is installed in the upper portion of the seating die 51, the upper support 54 is provided with a rotating shaft 56 to be rotated by the handle 55, The cutting tool 57 is installed below the rotary shaft 56. In addition, the lifting cylinder 53 is installed at one side of the upper support 54 to raise and lower the upper support 54, the rotating shaft 56 and the cutting tool 57.

In the method of laminating a wafer and a circuit tape for manufacturing a semiconductor package according to the present invention, the step (S1) of providing a wafer (W) having a plurality of semiconductor chips, the circuit film 70 is formed a circuit pattern Providing the step (S2), and the adhesive material 61 is formed, the upper and lower films 62, 63 are attached to the upper and lower surfaces to protect the adhesive material 61, respectively, the elastoma tape Providing (60) (S3), and removing the upper film 62 of the above-mentioned elastoma tape 60 to expose the adhesive material 61, to the exposed adhesive material 61 Bonding the circuit film 70 to form a circuit tape T (S4), a plurality of bond chips of the circuit tape T, and a plurality of semiconductor chips formed on the wafer W; Removing the wire bonding region of the circuit tape T to bond the input / output pad to the wire (S5). In addition, by removing the lower film 63 of the adhesive tape 60 attached to the circuit tape T from which the wire bonding region is removed, the adhesive material 61 is exposed, and the exposed adhesive material ( Step (S6) to align and attach the wafer (W) to the correct reference position at 61), and pressurize and heat the state where the circuit tape (T) and the wafer (W) are attached to the correct reference position. When the circuit tape T and the wafer W are brought into close contact with each other (S7), and the circuit tape T and the wafer W are brought into close contact with each other, the wafer W It includes a step (S8) of removing the unnecessary portion of the circuit tape (T) protruding outward.

The step (S4) of forming the circuit tape T by adhering the circuit film 70 and the above-mentioned elastomeric tape 60 is performed by thermocompression bonding while maintaining a high temperature of 90 ° or more.

In the step S5 of removing the wire bonding region from the circuit tape T, a punching press provided with a pair of punches 21 and a die 23 is used.

In addition, when removing the wire bonding area | region to the circuit tape T with the said punching press, it works by the vacuum tool 25 in the state which adsorbed and fixed the said circuit tape T.

In the step S6 of attaching the circuit tape T and the wafer W, the circuit tape T and the wafer W are simultaneously scanned and compared by using the camera 35 and monitored.

Here, the camera 35 has a low magnification camera and a high magnification camera, respectively, and the low magnification camera and the high magnification camera scan both upper and lower directions.

In the step S7 of closely contacting the circuit tape T and the wafer W, the circuit tape T and the wafer W are heated at an appropriate temperature and pressure according to characteristics of the wafer, the adhesive, the circuit tape, and the like. Pressurize. That is, the circuit tape T and the wafer W are heated and pressurized in a state where a predetermined high temperature and a predetermined pressure are maintained.

In addition, in step S7 of closely contacting the circuit tape T and the wafer W, a pressure indicator (not shown) is installed to measure the pressure to be pressurized.

The operation of the present invention configured as described above, if the first place the alignment film 60 and the circuit film 70 to remove the upper film 62 on the input guide plate 11 of the tape adhesive portion 10, the position, supply The roller 17 is rotated so that the above-described electric tape 60 and the circuit film 70 pass between the driving roller 14 and the pressure roller 15 and are thermally compressed. The plate 12 is discharged. At this time, the elastoma tape 60 and the circuit film 70 is prevented from being pushed by the auxiliary roller 18 and the upper guide plate 13 provided on the upper surface.

In addition, the heater 16 is provided on the surface of the drive roller 14 so that the surface of the drive roller 14 is maintained at a high temperature of 90 ° or more by the heater 16. It is thermocompressed.

The heat generated by the heater 16 is transmitted only to the surface of the driving roller 14 and is not transmitted to other components, thereby maintaining the precision of the equipment. That is, the connecting shaft 151 which transmits the rotational force of the motor 14a to rotate the driving roller 14 is coupled to the support shaft 141 by the recess 142 and the protruding jaw 152. By reducing the heat transfer path by the space portion 153 and the cutout portion 154 formed on the connecting shaft 151, the high temperature generated by the heater 16 is suppressed to be transmitted to other parts as much as possible.

As described above, the thermally compressed circuit tape T removes the wire bonding region from the punching press unit 20. In order to remove the wire bonding region, the vacuum tape T is suction-fixed by the circuit tape T. The wire bonding area is removed by the punch 21 which is operated by the driving unit 22 while the 25 is seated and fixed to the die 23.

As described above, the circuit tape T from which the wire bonding region has been removed has a vacuum tool fixture 31 provided on the wafer attachment portion 30 while maintaining the state of being fixed to the vacuum tool 25. Is fixed to. In addition, the wafer W attached to the circuit tape T is fixed to the wafer adsorption die 33 provided under the wafer attachment portion 30.

In this state, the camera 35 is slid so as to be positioned between the circuit tape T and the wafer W by the camera moving means 36 to simultaneously scan and compare the circuit tape T and the wafer W. To monitor it.

In this case, the camera 35 may scan both upper and lower directions. In addition, the camera 35 is provided with a low magnification camera 35 and a high magnification camera 35, respectively, thereby accurately scanning and monitoring without any error.

Thus, while checking the monitoring by the camera 35, the operator makes the correct setting while moving the wafer suction die 33 in the X, Y direction and the θ angle. That is, the wafer adsorption die 33 is moved by adjusting the X-axis movement micrometer 34a and the Y-axis movement micrometer 34b, and at the same time, the angle-adjusting micrometer 34c is adjusted. The wafer W and the circuit tape T are accurately set by adjusting the angle of the suction die 33.

In this state, the vacuum tool fixing tool 31 which adsorbs and fixes the circuit tape T is lowered to bond the wafer W and the circuit tape T to each other. At this time, the voids due to the adhesion are prevented by adhering while the air present between the circuit tape T and the wafer W is completely discharged.

Thus, the thing which can be adhere | attached while discharging the air which exists between the said circuit tape T and the wafer W completely, operates the limit switch 335 while the said vacuum tool fixture 31 falls. The operation of the limit switch 335 is activated at the moment when the circuit tape T adsorbed on the vacuum tool 25 comes into contact with the wafer W seated on the wafer adsorption die 33 described above. The suction pump 334 is operated by the operation 335 to discharge air to the air discharge hole 332.

At this time, the bottom surface of the vacuum tool 25 has its center portion protruding in a curved shape, that is, the bottom center of the vacuum tool 25 has a wafer first due to the height difference of t shown in FIG. The circuit described above is completely sealed between the circuit tape T and the wafer W by a rubber ring 333 which is in contact with the center portion of W) and located outside the air discharge hole 332. The air between the tape T and the wafer W is completely discharged through the air discharge hole 332, and in this state, the vacuum is removed from the vacuum tool 25 so as to remove the circuit tape T. ) And the wafer W are bonded together.

When the circuit tape T and the wafer W are attached as described above, the circuit tape T and the wafer W are seated on the die 41 of the pressure press part 40, and the pressure plate 43 is lowered from the upper portion of the circuit tape T. And the wafer W are completely in contact with each other.

At this time, the heater 41 (a) is built in the die (41) to maintain the die (41) in a high temperature state, thereby making it possible to achieve a more secure contact, and the heat generated by the heater cartridge (41a) Is not transmitted to the lower stand 42 by the connecting member 48 connecting the die 41. That is, the connecting member 48 is formed with a plurality of protruding jaws 48a on the upper surface in order to reduce the contact area with the die 41, and a plurality of holes 48b on the outer peripheral surface of the connecting member 48. ) Is formed, the heat transfer to the lower fixture 42 is blocked.

In addition, the pressure plate 43 for pressing the circuit tape T and the wafer W seated on the die 41 has a small force by the first, second and third gears 45a, 45b and 45c. You can get great power.

When the wafer W having the circuit tape T attached thereto is completely in contact with the press portion 40, the unnecessary portion of the circuit tape T protruding to the outside of the wafer W may be cut. Remove from).

The operation of the cutting unit 50 lowers the lifting cylinder 53 while the wafer W having the circuit tape T attached thereto is sucked and fixed in the seating die 51 by the cutting tool 57. The wafer W and the circuit tape T attached to the wafer W are positioned at a position to be removed.

In this state, the handle 55 is rotated to cut an unnecessary portion of the circuit tape T protruding outward from the wafer W. At this time, the shape of the wafer (W) is formed in a circular shape, the cutting tool 57 can remove the circuit tape (T) along the shape of the wafer (W).

As described above, according to the present invention, a circuit tape having a circuit film attached on the wafer can be adhered to the exact reference position so as to closely adhere the wafer and the circuit tape for semiconductor package manufacturing, and thermal deformation is applied to such an apparatus. It is configured to prevent heat transfer so as to prevent the defect by the maximum, there is an effect that can prevent the defect due to thermal deformation.

Claims (13)

An input guide plate is installed at one side and an output guide plate is installed at the other side to bond the circuit film having the circuit pattern formed thereon with the elastomer tape having the adhesive material formed thereon to form a circuit tape. The driving roller and the pressure roller are installed to be bonded to each other and rotated between the output guide plate and the output roller, and the surface of the driving roller is installed to be in contact with the heater, and the supply roller is installed to be located in front of the driving roller and the pressure roller. The circuit film and the elastoma tape are advanced to the driving roller and the pressure roller, while the upper part of the supply roller is provided with a tape adhesive part provided with an auxiliary roller and an upper guide plate, A punching press portion for cutting the wire bonding region of the circuit tape with a punch and a die in order to bond the bond finger of the circuit tape formed on the tape adhesive portion and the input / output pad of the semiconductor chip formed on the wafer with a wire; A wafer attaching portion for aligning and attaching a circuit tape from which the wire bonding region has been removed from the punching press portion and a wafer on which a plurality of semiconductor chips are formed at an accurate reference position; A pressurized press part for pressurizing the circuit tape attached to the wafer attaching part and the wafer to be in close contact with the wafer attaching part; When the circuit tape and the wafer in close contact with the pressurized press portion, the cutting portion for removing the unnecessary circuit tape protruding to the outside of the wafer, Lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package comprising a. The method of claim 1, The punching press unit is provided with a batter formed with a plurality of batter holes so as to adsorptively fix the circuit tape to which the circuit film and the elastoma tape are bonded by a batter, and a die is seated and fixed. And a punch for cutting the wire bonding area of the circuit tape fixed to the battery frame, and a drive unit for operating the punch, the wafer and circuit tape lamination apparatus for manufacturing a semiconductor package. The method of claim 2, The vacuum tool is formed in a quadrangular shape, and four locking portions bent at right angles are formed on the upper surface of the die so that the vacuum tool is seated and fixed to the die. A lamination apparatus for a wafer and a circuit tape for manufacturing a semiconductor package, wherein the tool is fixed to the engaging portion. The method of claim 1, The wafer attachment part is provided with a top and bottom fixing fixture for fixing a vacuum tool on which the circuit tape is sucked and fixed, and the vacuum tool fixing fixture is installed on a movable tool which slides up and down, and the lower part of the above-mentioned battery tool fixing fixture. The wafer adsorption die is installed in the wafer adsorption die for adsorbing and fixing the wafer, and the wafer adsorption die is installed in the position adjusting means which can move the position in the X, Y axis direction and θ angle. A camera for scanning and comparing the circuit tape and the reference position of the wafer is provided between the adsorption section and the adsorption die, and the camera is installed in the camera moving means sliding back and forth. Lamination device for wafer and circuit tape for semiconductor package manufacturing. The method of claim 1, The press portion is provided with a die for mounting the circuit tape on which the wafer is attached to the lower stand, and a pressure plate for pressing the circuit tape with the wafer seated on the die is located on the upper portion of the die. Lamination apparatus of the wafer and circuit tape for the semiconductor package manufacturing, characterized in that the lifting plate is installed, the pressure plate is fixed to the lower portion of the ram, the ram is installed, the first, second, third gears . The method of claim 1, The cutting part is provided with a seating die in which a circuit tape on which a wafer is attached is sucked and fixed by backing, and a fixing stand for fixing the seating die is installed, and an upper support is provided above the seating die. A rotating shaft is installed on the upper support so as to be rotated by a handle, and a cutting tool is installed below the rotating shaft, while a lifting cylinder is installed on one side of the upper support to support the upper support, the rotating shaft, and the cutting tool. Lamination apparatus of the wafer and circuit tape for manufacturing a semiconductor package, characterized in that the lifting and lowering. Providing a wafer on which a plurality of semiconductor chips are formed; Providing a circuit film having a circuit pattern formed thereon; Forming an adhesive material, and providing an elastomeric tape having upper and lower films attached to the upper and lower surfaces to protect the adhesive material, respectively; Removing the upper film of the elastoma tape to expose the adhesive material, and adhering the circuit film to the exposed adhesive material to form a circuit tape; Removing the wire bonding region of the circuit tape to bond the bond fingers of the circuit tape and the input / output pads of a semiconductor chip formed on the wafer with a wire; Removing the lower film of the elastoma tape attached to the circuit tape from which the wire bonding region is removed to expose the adhesive material, and attaching the wafer to the exposed adhesive material in alignment with the correct reference position. Wow, Pressurizing and heating the state in which the circuit tape and the wafer are attached to the correct reference position to completely adhere the circuit tape to the wafer; When the circuit tape and the wafer are in close contact with each other, removing unnecessary portions of the circuit tape protruding outward from the wafer, Lamination method of the wafer and the circuit tape for manufacturing a semiconductor package comprising a. The method of claim 7, wherein Forming the circuit tape by adhering the circuit film and the above-mentioned elastoma tape, the wafer and the circuit tape for manufacturing a semiconductor package, characterized in that the adhesive bonding by thermocompression while maintaining a high temperature of more than 90 ° Lamination method. The method of claim 7, wherein Removing the wire bonding region from the circuit tape, lamination method of the wafer and circuit tape for manufacturing a semiconductor package, characterized in that using a punching press provided with a pair of punch and die. The method of claim 7, wherein A method of laminating a wafer and a circuit tape for manufacturing a semiconductor package according to claim 1, wherein the punching press removes the wire bonding region from the circuit tape. The method of claim 7, wherein The step of attaching the circuit tape and the wafer, by using a camera to simultaneously scan and compare the circuit tape and the wafer, the wafer and circuit tape lamination method for manufacturing a semiconductor package, characterized in that for monitoring. The method of claim 11, The camera is provided with a low magnification camera and a high magnification camera, respectively, the low magnification camera and the high magnification camera is a wafer and circuit tape lamination method for manufacturing a semiconductor package, characterized in that to scan both the upper and lower directions. The method of claim 1, In the step of closely contacting the circuit tape and the wafer, the pressure indicator is installed by measuring the pressure to install a pressure indicator for the wafer and circuit tape lamination method for manufacturing a semiconductor package.