KR20020061228A - Fabrication method of semiconductor package and lamination apparatus of tape - Google Patents

Abstract

PURPOSE: A method for manufacturing a semiconductor package and a device for laminating a tape are provided to automate the processes for the lamination of a tape having a heat spreader and a circuit pattern, to improve productivity, and to reduce the percent defective. CONSTITUTION: The device(10) includes the first transfer unit(20) to intermittently transfer a strip attached with a heat spreader, a tape supply unit installed on the first transfer unit to supply a tape parallel to the strip, a punching unit(50) to temporarily bond the punched unit tape to the strip transferred by the first transfer unit, a directional change unit(70) to reversely supply the strip to the second conveyor, plural lamination units(90) installed near the second conveyor to laminate the tape temporarily bonded to the strip, a strip distribution unit(120) installed between the second transfer unit and the lamination units to distribute strip to respective lamination units, and a strip discharge unit(140) installed near the lamination units to discharge the laminated strip.

Description

Fabrication method of semiconductor package and lamination apparatus of tape

The present invention relates to a method for manufacturing a semiconductor package, and more particularly, to a method for manufacturing a semiconductor package for laminating a tape and a heat spreader having a predetermined pattern formed on a strip, and a lamination apparatus for a tape.

In general, a tape ball grid array (TBGA) semiconductor package is a one-piece type in which a tape on which a circuit pattern is formed is directly attached to a heat sink for dissipating heat, and a stiffener for supporting the area. And a two-piece type attached to a plurality of frames made of a heat sink.

The TV A semiconductor package is fixed to one side of a stiffener or a heat sink and a circuit pattern of a semiconductor chip and a circuit tape is electrically connected by wire bonding through a cavity formed in the heat sink or the stiffener, and a solder ball land part connected to the circuit pattern. The solder ball is attached to the terminal of the external board.

In order to manufacture such a TV package, a strip having an index hole formed at an edge thereof and a tape having a circuit pattern formed thereon are separately manufactured and then laminated. Then, the semiconductor chip is mounted and wire bonded with the circuit pattern. The solder ball is attached to the solder ball land portion electrically connected to the circuit pattern, and the remaining part is molded with a molding material to complete the semiconductor package. When the semiconductor package is completed as described above, the semiconductor package is cut into individual semiconductor packages using cutting means.

As all the processes for manufacturing the TV package of the above-mentioned TV are not automated, productivity cannot be improved. In particular, the process of forming a through hole in a strip of a predetermined length or attaching a tape having a heat spreader and a circuit pattern was one of the processes that hindered automation.

An object of the present invention is to provide a method of manufacturing a semiconductor package that enables automation of processes according to lamination of a tape on which a heat spreader and a circuit pattern are formed.

Another object of the present invention is to provide a semiconductor package manufacturing apparatus that can reduce the labor and productivity of the work due to the lamination of the tape with a circuit pattern formed on the strip with a heat spreader, and can reduce the amount of defective products Has its purpose.

1 is an exploded perspective view of a strip to which a heat spreader and a unit tape are attached;

2 is a view schematically showing a method of manufacturing a semiconductor package according to the present invention;

3 is a plan view of the tape lamination apparatus according to the present invention,

4 is a side view of the tape lamination apparatus according to the present invention;

5 is a front view of the first transport means,

6 is a perspective view showing an installation state of a tape supply means, a die and a punch;

7 is a perspective view of the tape supply means,

8 is a front view showing the punching means,

9 is a side view showing the punching means;

10 is a perspective view of the direction switching means,

11 is a plan view of the rectangular switching means;

12 is a front view of the lamination means,

13 is a partial ablation front view of the lamination means,

14 is a side view of the lamination means,

15 is a front view of the dispensing means,

In order to achieve the above object, the method of manufacturing a semiconductor package of the present invention includes a first step of supplying a strip from a magazine,

A second step of attaching the adhesive tape to which the cover tape is not attached while moving the supplied strip;

A third step of punching the strip on which the tape is attached, at a predetermined interval; a fourth step of removing the cover tape attached to the upper surface of the adhesive tape while moving the punched strip; and a strip from which the cover tape is separated. A fifth step of temporarily attaching the heat spreader to the adhesive tape of

A sixth step of pressing and laminating the temporarily bonded heat spreader; moving the strip on which the lamination of the heat spreader is completed; And a seventh step of contacting and an eighth step of laminating while heating the tape welded to the strip.

In the present invention, in the second step, and further comprising a cutting fixing for cutting the attached tape, in the sixth and eighth step, the height of the left and right when the heat spreader and the tape is attached to the strip is variable This is accomplished by pressing the heat spreader or tape against the strip using a cautious watch roller.

Semiconductor package manufacturing apparatus for achieving the above object

First transfer means for intermittently transferring the strip to which the heat spreader is attached; Tape supply means installed on an upper portion of the first conveying means to supply a tape in a direction parallel to a conveying direction of the strip; Punching means for punching the tape supplied by the tape supply means to be in contact with the strip conveyed by the first transfer means; Direction switching means for picking up a strip to which the tape is welded and being transferred and switching the direction to a conveying conveyor; A plurality of lamination means installed adjacent to the conveying conveyor and laminating the tape welded to the strip; Strip distribution means disposed between the conveying conveyor and the lamination means for distributing strips to the lamination means; It is characterized in that it comprises a strip discharge means is installed adjacent to the lamination means for discharging the strip is completed lamination of the tape.

Hereinafter, a method of manufacturing a semiconductor package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1 and FIG. 2, the method for attaching the heat spreader 202 to the rear surface of the strip 200 and laminating the unit tape 201 having the circuit pattern formed on the upper surface thereof is a strip stacked in a magazine. The first step of removing the interlayer interposed on the strips stacked on the magazine and supplying the strip, and the second step of attaching the adhesive tape attached to the cover tape on the upper surface while the supplied strip at a constant speed. Separating the cover tape attached to the lower surface of the adhesive tape in the second step and the cutting step for cutting the adhesive tape continuously supplied from the supply reel because the strip has a predetermined length. At this time, of course, the cover tape attached to the upper surface of the adhesive tape should not be separated.

The punching step of punching through holes for bonding the wires for semiconductor bonding and wire bonding to the strips to which the tape is attached is completed in a third step, and removing the cover tape attached to the upper surface of the adhesive tape while moving the strips where the punching is completed. It includes a fourth step. In the fourth step, the cover tape is preferably separated by injecting high pressure air into the strip while the strip is moved.

The fifth step of temporarily attaching the heat spreader to the adhesive tape while transferring the strip from which the cover tape has been separated, and the sixth step of pressing and laminating the temporarily attached heat spreader are performed. In the sixth step, the pressurization of the heat screed is made by a pressure roller rotatably installed to apply a uniform pressure, and may be heated so that the strip or heat spreader is not deformed in order to improve adhesion. have.

Performing a seventh step of moving the strip on which the lamination of the heat spreader is completed and punching while intermittently supplying a tape having a circuit pattern formed thereon and a portion corresponding to the through hole of the strip being punched, thereby adhering a unit tape to the strip; do. When the temporary welding of the unit tape is completed as described above, an eighth step of laminating stepwise by heating and pressing is performed. In an eighth step, the lamination of the unit tape includes a first lamination step of pressing at room temperature and a second lamination step of laminating at a heating temperature of at least two steps.

Laminating the heat spreader and the unit tape formed on the circuit pattern on the strip using the method as described above can improve the productivity since the heat spreader and the unit tape, which are bottlenecks in the semiconductor chip manufacturing process, can be continuously attached. It can be, and has the advantage that can significantly reduce the failure rate caused by the attachment of the unit tape and the heat spreader.

3 and 4 illustrate an embodiment of the tape lamination apparatus of the semiconductor package for attaching the unit tapes 301 to the strip 200 to which the heat spreader is attached during the process of attaching the heat spreader and the tape to the strip.

Referring to the drawings, the tape lamination apparatus 10 of the semiconductor package is installed on the first transfer means 20 and the upper portion of the first transfer means 20 for intermittently transferring the strip 200 to which the heat spreader is attached. Strips for feeding the tape in a direction parallel to the conveying direction of the strip, and a strip for conveying the punched unit tape of the tape supplied by the tape supply means by the first transfer means 20 ( A punching means 50 which is in contact with 200 and a direction shifting means 70 which picks up the strip conveyed by being welded to the unit tape and turns it to a second conveyor 12 and supplies the second conveyor 12. And a plurality of lamination means (90) for adjoining the strip and the tape adhering to the strip, and between the second conveying means and the lamination means. Is installed to be close to the strip and dispensing means 120, the lamination means for distributing to the end strip comprises a discharge means 140 for discharging the strip, laminating of the tape unit has been completed.

The tape lamination apparatus of the semiconductor package according to the present invention configured as described above will be described in detail with reference to the accompanying drawings for each part.

First, the first transfer means 20 is to transfer the strips stacked in a state in which the interleaved in the magazine is supplied from a supply means (not shown), as shown in Figure 5 the pneumatic actuator as a frame 21 A first rail 23 is lifted by the cylinder 22 and a long hole 23a is formed along the edge. Both side edges of the first rail are provided with guide rollers 24 or guide jaws for guiding the strip in the longitudinal direction. The first rail 23 is supported by the guiders 25 installed in the frame so that the first rail 23 can be leveled when lifting by the pneumatic cylinder 22. The first rail 23 has a first transport pin 31 that protrudes when the first rail 23 descends and has a first transport pin 31 that protrudes from the hole 23a formed at the edge of the strip. The strip transfer means 30 and the second strip transfer means 37 for initially supplying the strip supplied from the magazine to the first rail 23.

The first strip transfer means 30 is moved forward and backward along the first guide rail 32 installed in the frame 21 and coupled to the ball screw 33, and the first transfer member. And a plate 35 having a first feed pin of the strip 200 moved along the first rail 23 when the first rail 23 moves up and down, and the ball screw 33 is rotated forward and backward. The motor 33a is included. Here, at least one first transfer pin is provided, and the transfer of the first transfer member 24 is not limited by the ball screw and the motor, and moves the plate 35 along the first rail 23. Any structure that can be reversed can be used.

The second strip conveying means 37 is provided with a cylinder 37a installed on the plate 25 positioned below the first rail 23 and a rod of the cylinder 37a. And a pusher 37b moved along. The second strip transfer means 37 may be installed separately without being installed on the plate 25.

The tape supply means 40 is installed between the die and the punch of the punching means to be described later and ascends upon movement. An embodiment is illustrated in FIGS. 6 to 7.

As shown in the figure, a pair of sprocket wheels 41 and 42 are installed at predetermined intervals on the upper part of the first rail 23 and from the upper surface of the first rail 23 supporting the sprocket wheels 41 and 42. The support member 43 is installed in the off position, and the pressure roller 44 is rotatably installed on the support member 43 is in close contact with the sprocket wheel 41 on one side. The sprocket wheels 41 and 42 are formed on the outer circumferential surface thereof so as to be spaced apart from each other by the teeth 41a. The sprocket wheel 41 of one side is rotated by a motor 45.

On the other hand, the lower surface of the support member 43 is provided with a cylinder 46 for elevating the support member 43 and a guider 47 for guiding it when the support member 42 is elevated.

The punching means 50 punches the tape supplied by the tape supply means 40 and causes the unit tape 301 obtained by punching the tape to be brought into contact with the strip 200 supplied along the first rail 23. 6, 8 and 9 show one example thereof.

As shown, a bolster 51 positioned above the first rail 23 and positioned between both sprocket wheels 41 and 42 of the tape supply means, and a die 52 installed in the bolster 51. ). At this time, the die 52 is located on the lower surface of the tape 300 supplied by both sprocket wheels 41 and 42 and is spaced apart from the first rail 23 by a predetermined distance. The plate 54 supported by the plurality of guide rods 53 installed on the bolster 51 and the punch 55 supported by the support rod in the lower portion of the plate 54 are disposed on the upper portion of the bolster 51. An excitation punch unit 56, a pressing member 57 penetrating the pincher unit 56 and the die 52, and a cylinder 58 mounted on the plate 54 to elevate the pressing member 57; It includes. The plate 54 is elevated by a separate known press device (not shown). In addition, the pressurizing member 57 is provided with an adsorbing means 60 for adsorbing the punched unit tape 130, which is an adsorbing hole 61 formed in the pressurizing member 57. The ball is not shown in the figure but is connected to a separate vacuum pressure supply means (not shown).

At the exit side of the first rail 23, a first transfer conveyor 12 is further provided to continuously transfer the strip 200 to which the unit tape 310 is welded, and the second transfer conveyor 13 at a predetermined angle. ) Is installed.

The redirection means 70 transfers the strip 110 to which the unit tape 310 conveyed by the first conveying conveyor 12 is welded to the second conveying conveyor 13. 10 and FIG. 11.

As shown in the drawing, the direction switching means 70 includes a movable frame 71 which is lifted and lifted by a cylinder 75 installed in the frame, and a transfer plate which is moved forward and backward in the longitudinal direction of the second transfer conveyor 13 to the movable frame ( 72, a cylinder (73) installed on the movable frame (71) for advancing and moving the transfer plate (72), and an actuator installed perpendicular to the transfer plate (72) and rotating at a predetermined angle (about 90 degrees). 74 and a gripping means 80 provided on the rotating shaft of the actuator 74 to grip both edges of the strip 200 to which the unit tape 310 is welded. The movable frame 71 is further provided with a stopper 76 for limiting the reciprocating stroke distance of the transfer plate 72. The actuator may have a rack and pinion structure.

The holding means 80 grips both sides of the strip 200 to which the unit tape 310 is welded. As shown in FIGS. 10 and 11, the rotation plate 81 is installed on the rotation shaft of the actuator 74. And a fixed plate 82 provided on the lower surface of the pivot plate 81 and a pair of jaws 83 and 84 slidably installed in opposite directions on both sides of the fixed plate 82. The upper jaws 83 and 84 are connected to the rods of at least one cylinder 85 installed on the fixing plate 82, and springs 86 are installed at both ends of the jaws 83 and 84, respectively. Thus, the jaws 83 and 84 are elastically biased in mutually opposite directions. The gripping means 80 is not limited to the above-described embodiment, and may be any structure as long as the gripping means 80 can be grasped for transfer of the strip without breaking the unit tape immersed in the strip 200.

The lamination means 90 is a multi-stage lamination of the unit tape 310 welded to the strip 200, an embodiment of which is shown in Figures 12 to 14.

As shown, the lamination means 90 is composed of first, second and third lamination means 91, 92 and 93 which are installed inline and are gradually heated to a high temperature.

Since the first, second and third lamination means 91, 92 and 93 have the same structure, the first lamination means will be described in detail.

The first lamination means 91 may include a support frame 101, a second rail 102 installed on an upper portion of the support frame 101, and elevated by an elevating cylinder 104, and the support frame 101. Heating heater 103 positioned between the upper surface of the second rail and the second rail 102, and pressurizing means installed to be adjacent to the first rail to convey the strip 200 along the second rail and laminating the unit tape ( 110). The second rail 102 is guided by the plurality of guiders 105 so as not to be shaken during the lifting by the lifting cylinder 104.

The pressurizing means 110 is a lamination of the heater heated by the heating heater 103, is transported along the guide rail 111 installed on the side of the support frame 101 and the ball screw 112 is combined And a transfer member 113 and a motor 114 for forward and reverse rotation of the ball screw 112. The second conveying member 113 is provided with a pressure plate 116 which is lifted by the cylinder 115, the pressure plate is the index hole 201 of the strip 200 is located in the second rail (102) and The cylinder 118 for elevating the second transfer pin 117 to be coupled is installed vertically. And a pressure roller unit 119 for laminating a tape on the strip is installed on the lower surface of the pressure plate 116.

The pressure roller unit 119 installed on the lower surface of the pressure plate 116 may include a first support member 119a installed on the pressure plate 116 so as to be rotatable in the longitudinal direction of the second rail 102 and the first support. A second support member 119b rotatably supported in the direction perpendicular to the second rail 102 in the member 119a, and a support shaft 119c in the direction perpendicular to the second rail in the second support member 119b. It includes a pressure roller (119d) fixed at both ends of the).

The distributing means 120 transfers the strips transferred to the second conveying conveyor 13 by the direction changing means to the first, second and third lamination means, respectively.

As shown, an arm 121 is disposed across the lamination means and is installed at an upper portion of the inlet side thereof, a slider 122 slidably mounted along the arm 121, and a slider 121 installed on the arm 121. And a reciprocating transfer means 123 for reciprocating the 122. The reciprocating conveying means 123 is supported by the arm and screwed with the slider screw 123a, and a motor (123b) is installed on the arm 121 for forward and reverse rotation of the ball screw 123a Include. The slider 122 is provided with an elevating member 124 which is slid up and down in the vertical direction, and the elevating member is provided with gripping means 125 for gripping the strip. The gripping means 123 is the same as the gripping means of the above-mentioned direction switching means will not be described again.

As shown in FIG. 3, the discharge means has the same configuration as that of the distribution means, but is provided on the lifting member, and has a configuration in which a gripping means for gripping a strip is provided with a suction pad for vacuum adsorption.

In the tape lamination apparatus of the semiconductor ?? base configured as described above, it is preferable that each cylinder and the actuator use a pneumatic cylinder and a pneumatic motor using pneumatic pressure.

Hereinafter, the operation of the tape lamination apparatus of the semiconductor package according to the present invention and the semiconductor manufacturing method through this action will be described in more detail.

First, in order to laminate the unit tape on the strip to which the tape heater spreader is bonded, first, the strip 200 is picked up from the stacked magazine by using a strip supply means (not shown) and placed on the first rail 23. .

In this way, the cylinder 37a of the second strip transfer means 37 is operated to transfer the strip 200 to the first rail by a predetermined distance by the pusher 37b installed on the rod thereof. When the supply of the strip 200 is completed as described above, the cylinder 22 of the first strip transfer means 30 is operated to lower the first rail 23. When the first rail 23 descends, the first transport pin 31 installed on the plate 35 ascends through the long hole 23a installed at the edge of the first rail 23, and then the first rail 23. It is coupled with the index hole 201 of the strip transferred to the top of the. In this state, the motor 33a of the first strip transfer means 30 is operated to transfer the transfer member 34 along the guide rail 32 by rotating the ball screw 33. Therefore, the first transfer pin 31 is moved along the long hole to the lower portion of the bolster of the punching means strip 200.

As described above, when the strip 200 is moved below the punching means, the cylinder 22 of the first transfer means 20 is operated to raise the first rail 23. In this way, the first transfer pin 31 is lowered and separated from the index hole 201 of the strip 200 moved along the first rail 23, and the fixing pin ( The index hole 201 installed in 51a is coupled to fix the position of the strip 200. At this time, the tape 300 is located between the die 52 of the punching means and the punch 55.

When the fixing of the strip 20 is completed as described above, the press unit (not shown) is operated so that the punch 55 is lowered to punch the formed tape of the circuit pattern. As described above, the unit tape 310 in which the tape is punched by the lowering of the punch is adsorbed by the suction hole 61 of the pressing member 57 penetrating the punch 55 and the die 52. In this state, the pressing member 57 is lowered by the cylinder 58 so as to contact one side with the strip 200 installed on the lower surface of the die 52.

As described above, when the temporary welding of one unit tape 310 is completed, the first rail 23 is lowered by the operation of the cylinder 22 of the first transfer means 20 so that the index hole 201 of the strip is closed. It is separated from the fixing pin 51a and coupled to the first transfer pin 31 installed on the plate 35. Then, as the motor 33a is rotated, the first transfer member 34 is moved by the ball screw 33 to transfer the strip 200 to a predetermined pitch. In this state, as described above, the first rail 23 is lifted up and fixed to the lower surface of the die 52.

As such, the tape feeding means 40 moves the tape one pitch while the strip 200 is moved one pitch. In the transfer of the tape 300, the cylinder 46 is first operated to raise the support member 43 by a predetermined height to separate the tape 300 from the die 52. When the motor 45 is rotated by a predetermined angle, the sprocket wheel 42 is rotated so that the tape joined to the edge thereof is moved one pitch. Thus, the tape 300 is moved without indirectly to the die 52 and the punch 55. When the movement of the tape 300 is completed, the support member 43 is lowered by the cylinder 46.

As described above, when the tape 300 and the strip 200 move by one pitch, the tape is punched by the operation as described above to be brought into contact with the strip.

As described above, when the temporary welding of the unit tape 310 to the strip 200 is completed, the strip is transferred from the first rail 23 to the first transfer conveyor 12 by the first transfer means 20. The strip 200 in which the unit tape 310 conveyed by the first conveying conveyor is welded is transferred to the second conveying conveyor 13 by the direction changing means 70, which explains the operation of the direction changing means 70. Is as follows.

When the strip 200 is transferred to the second conveying conveyor 13, the cylinder 75 of the direction switching means 70 is operated to raise the movable frame 71 and at the same time rotate the rotating plate by the actuator 74 ( 81 is rotated to position the gripping means 80 on the second transfer conveyor 12. In this state, the movable frame 71 is lowered by the cylinder 74 and at the same time, the cylinder 85 installed on the fixing plate 82 of the gripping means 80 is operated so that the jaws 83 and 84 are opposed to each other. Spread in the direction. This places the strip 20 between the jaws 83 and 84. In this state, when the external force applied to the jaws 83 and 84 by the cylinder 85 is removed, the jaws 83 and 84 are lifted up by the springs installed at the ends of the jaws 83 and 84 and the stream ( 20) both sides of the gripping.

When the gripping of the strip 20 is completed as described above, the movable frame 71 is raised by the cylinder 75, and the rotation plate 81 is rotated by the actuator 74 to hold the gripping means ( 80) is positioned above the second transfer conveyor (13). Then, the strip is placed on the second conveying conveyor 13 in the reverse order to the holding of the strip. At this time, the transfer plate 72 may be moved forward and backward by the cylinder 73 installed on the movable plate 71 to set a position with respect to the first and second transfer conveyors.

As described above, the strip 200 transferred to the second conveying conveyor 13 is conveyed by the second conveying conveyor 13 and then distributed to each lamination means by the distributing means 120. That is, the slider transported by the ball screw 123a rotated by the motor 123b after holding the strip 120 as described above by the holding means installed on the elevating member 124 of the distribution means 120. By 122, it is fed to the top of each lamination means to supply the gripped strip.

The strip 200 supplied to each lamination means is first laminated by the first lamination means and then laminated at a temperature heated by the second and third lamination means.

First, when the strip 200 is positioned above the second rail 102 by the distributing means, the second conveying member 113 of the pressing means 110 is rotated by the motor by the ball screw 112. The unit tape is moved to be positioned above the welded strip 200, and in this state, a cylinder 118 vertically installed on the pressing plate 116 of the joining means 110 is operated to install a second rod on the rod. The transfer pin 117 is lowered and coupled to the index hole 201 of the strip 200. In this state, the second transfer member 113 is transferred to transfer the strip 200 to a predetermined position.

When the transfer of the strip 200 is completed as described above, the cylinder 118 installed on the pressure plate 117 is operated to raise the second transfer pin 117. In this state, the second conveying member 113 is repositioned by the motor 114 and the ball screw 112, and the cylinder 115 installed in the second conveying member 113 is operated to press the plate 116. Will descend. The pressure plate 116 is lowered and the second rail 102 is lowered to heat the second rail 102 and the strip by the heating heater 103. The heating by the heating heater 103 may be selectively performed in the process of laminating the continuous unit tape by the first, second and third lamination means.

In this state, when the second conveying member 113 is transferred by the motor 114 and the ball screw 112, the unit tape is formed on the upper surface of the strip by the pressing roller unit 119 installed on the lower surface of the pressing plate 116. Lamination by pressing the 310. Here, since the pressure roller is rotatably supported in the X and Y directions by the first and third support members 119a and 119b, it is possible to pressurize a uniform pressure on the unit tape 310 against the strip.

In such an operation, the strip passing through the first, second and third lamination means is discharged by the discharge means and stacked in a magazine (not shown).

As described above, the method for manufacturing a semiconductor package and the tape lamination apparatus of the present invention continuously attach a heat spreader to the back of the strip and perform a series of operations of laminating the unit tapes obtained by punching the tape onto the strip and then laminating the strip. Since it can be performed automatically, there is an advantage that can reduce the labor and thereby improve the productivity.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (20)

A first step of supplying the strips from the magazine, a second step of attaching the adhesive tape to which the cover tape is not attached while moving the supplied strips, and a third step of punching the strips to which the tape is attached at predetermined intervals; A fourth step of removing the cover tape attached to the upper surface of the adhesive tape while moving the punched strip; and a fifth step of temporarily attaching the heat spreader to the adhesive tape of the strip from which the cover tape is separated. A sixth step of pressurizing and laminating the heated heat spreader, a seventh step of moving the strip on which the lamination of the heat spreader is completed, and punching a tape having a circuit pattern to contact the strip, and heating the tape welded to the strip. While the semiconductor package is characterized in that it comprises an eighth step of laminating Method. The method of claim 1, In the second step, the manufacturing method of the semiconductor package, characterized in that it further comprises a cutting step of cutting the attached tape, The method of claim 1, In the sixth and eighth steps, the semiconductor packer is pressed against the strip by using a careful roller that is carefully adjusted by adjusting the height of the left and right sides when the heat spreader and the tape are attached to the strip. Method of making paper. First transfer means for intermittently transferring the strip to which the heat spreader is attached; Tape supply means installed on an upper portion of the first conveying means to supply a tape in a direction parallel to a conveying direction of the strip; Punching means for punching the tape supplied by the tape supply means to be in contact with the strip conveyed by the first transfer means; Direction switching means for picking up a strip to which the tape is welded and being transferred and switching the direction to a conveying conveyor; A plurality of lamination means installed adjacent to the conveying conveyor and laminating the tape welded to the strip; Strip distributing means disposed between the conveying conveyor and the lamination means for distributing strips to the lamination means; Tape lamination apparatus of the semiconductor package, characterized in that it is installed adjacent to the lamination means comprises a strip discharge means for discharging the strip is completed lamination of the tape. The method of claim 4, wherein The first conveying means is a first rail lifted by a cylinder in the frame and has a long hole along the edge, the first rail and a first transport pin coupled with the index hole formed at the edge of the strip protruding into the long hole And a first strip conveying means provided in the frame and a second strip conveying means installed in the frame to supply the strip to the first rail. The method of claim 5, The first strip transfer means is moved forward and backward along the first rail installed in the frame and coupled to the ball screw, and is installed on the first transfer member and moves along the first rail when the first rail is lifted. And a first transfer pin coupled to the index hole of the strip, and a motor for forward and reverse rotation of the ball screw. The method of claim 5, The second strip conveying means includes a cylinder installed on the inlet-side first conveying member of the first rail, and a fuser installed on the rod of the cylinder and conveyed along the long hole. Device. The method of claim 4, wherein The tape supply means includes a pair of one sprocket wheels installed at predetermined intervals on an upper portion of the first rail, a support member supporting the sprocket wheel and positioned at a position deviated from an upper surface of the first rail, and rotatable to the support member. It is installed so as to be in close contact with the sprocket wheel of one side, the cylinder is installed on the frame to lift the support member, and a pneumatic motor for rotating the sprocket wheel of at least one of the sprocket wheel, characterized in that it comprises a Tape lamination device for semiconductor package. The method of claim 4, wherein The punching means is located on top of the first rail and located between both sprockets of the tape supply means, a plate installed on the bolster and supported by a plurality of guide rods installed on the bolster, A punch unit having a punch provided in the lower portion of the plate, a press member penetrating the pinch unit and the die, a cylinder installed on the plate to lift the press member, and a unit tape installed at the press member and punched out. Adsorption means for adsorbing, and the tape lamination apparatus of a semiconductor package, characterized in that it comprises a press unit for lifting the plate. The method of claim 9, And said adsorption means comprises at least one adsorption hole formed at a lower surface of said pressing member and a vacuum pressure supply means communicating with said adsorption hole. The method of claim 4, wherein The tape lamination apparatus of the semiconductor package, characterized in that it further comprises a first conveying conveyor which is continuous with the first rail for conveying the strip of the tape is welded. The method according to claim 4 and 11, The direction switching means includes a movable frame installed adjacent to the first conveying conveyor and the second conveying conveyor, a transfer plate forward and backward in the longitudinal direction of the second conveying conveyor to the movable frame, and a conveying plate installed on the movable frame. A cylinder for moving forward and backward, an actuator installed on the transfer plate, a gripping means mounted on a rotating shaft of the actuator and gripping both edges of the strip to which the tape is welded, and a lower portion of the movable frame to move the movable frame. Tape lamination apparatus of a semiconductor package, characterized by including a cylinder for lifting. The method of claim 12, The gripping means includes a rotating plate installed on a rotating shaft of the actuator, a fixed plate provided on the lower surface of the rotating plate, a pair of jaws slidably installed in opposite directions on both sides of the fixed plate, and a jaw installed on the fixed plate. And at least one cylinder for opening, and at least one spring mounted at both ends of the jaw to tighten the jaw. The method of claim 5, The lamination means is a tape lamination apparatus of a semiconductor package, characterized in that the first, second, and third lamination means is installed inline form and gradually heated to a high temperature lamination. The method of claim 14, The first, second, and third lamination means may include a support frame, a second rail mounted on an upper portion of the support frame, and lifted by an elevating cylinder, and a heating heater positioned between an upper surface of the support frame and a second rail. And pressurizing means installed to be adjacent to the second rail to transfer the stiff along the second rail and to laminate the tape. The method of claim 15, The pressing means is moved along a guide rail installed on the side of the support frame and is coupled by a second transfer member coupled to a ball screw, a motor for forward and reverse rotation of the ball screw, and a lift cylinder installed on the second transfer member. A cylinder for elevating a lifting plate, a cylinder for elevating a second transfer pin which is installed on the pressing plate and coupled to an inlet hole of a strip located on a second rail, and installed on the pressure plate to laminate tape on the strip. Tape lamination apparatus of a semiconductor package comprising a pressure roller unit. The method of claim 16, The pressure roller unit may include a first support member rotatably installed on the pressure plate in the longitudinal direction of the second rail, a second support member rotatably supported on the first support member in a direction perpendicular to the second rail; And a pressure roller having both ends of the support shaft fixed to the second support member in a direction perpendicular to the second rail. The method of claim 4, wherein The dispensing means includes an arm installed at an upper side of the inlet side thereof to be perpendicular to the second rail, a slider slidably mounted along the arm, a reciprocating feed means installed at the arm to reciprocate the slider, A tape lamination apparatus for a semiconductor package, comprising: a lifting member mounted on the slider so as to be lifted and lowered; and a strip gripping means mounted on the lifting member. The method of claim 18, The gripping means includes a rotating plate installed on a rotating shaft of the actuator, a fixed plate provided on the lower surface of the rotating plate, a pair of jaws slidably installed in opposite directions on both sides of the fixed plate, and a jaw installed on the fixed plate. And at least one cylinder for opening, and at least one spring mounted at both ends of the jaw to tighten the jaw. The method of claim 4, wherein Tape lamination apparatus of the semiconductor package, characterized in that the side adjacent to the discharge means further comprises a magazine unit for stacking the strip discharged by the discharge means.