KR100369392B1 - Wafer and Circuit Tape Pressurization Unit for Semiconductor Package Manufacturing - Google Patents
Wafer and Circuit Tape Pressurization Unit for Semiconductor Package Manufacturing Download PDFInfo
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- KR100369392B1 KR100369392B1 KR10-1998-0035610A KR19980035610A KR100369392B1 KR 100369392 B1 KR100369392 B1 KR 100369392B1 KR 19980035610 A KR19980035610 A KR 19980035610A KR 100369392 B1 KR100369392 B1 KR 100369392B1
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- die
- wafer
- circuit tape
- semiconductor package
- circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
본 발명은 웨이퍼상에 회로필름이 부착된 써킷테이프를 부착시킨 후, 이를 가열 가압하여 완전하게 부착시킬 있도록 된 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치에 관한 것으로, 그 구성은 회로필름이 접착된 써킷테이프와 웨이퍼가 부착된 소재를 상면에 안착시키는 다이와, 상기한 다이의 내부에 내장되어 상기 다이를 일정 온도로 예열하는 예열수단과, 상기한 다이를 고정하는 하부고정대와, 상기한 다이의 상면에 안착된 소재를 가압하는 가압판과, 상기한 가압판을 승하강시키는 승하강수단을 포함하여 이루어진 것이다.The present invention relates to a wafer and a circuit tape heating and pressing apparatus for manufacturing a semiconductor package, which is to attach the circuit tape with a circuit film on the wafer, and then pressurizes the circuit tape to be completely attached. A die for seating the bonded circuit tape and the wafer-attached material on the upper surface, a preheating means embedded in the die to preheat the die to a predetermined temperature, a lower stand for fixing the die, and the die It includes a pressing plate for pressing the material seated on the upper surface of the elevating means for raising and lowering the pressure plate.
Description
본 발명은 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치에 관한 것으로, 더욱 상세하게는 다수의 반도체칩이 형성된 웨이퍼상에 회로필름이 부착된 써킷테이프를 부착시킨 후, 이를 가열 가압하여 완전하게 부착시킬 있도록된 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치에 관한 것이다.The present invention relates to a wafer and circuit tape heating pressurization apparatus for manufacturing a semiconductor package, and more particularly, by attaching a circuit tape with a circuit film on a wafer on which a plurality of semiconductor chips are formed, and then heating and pressurizing the circuit tape. The present invention relates to a wafer and circuit tape heating and pressing apparatus for manufacturing a semiconductor package to be attached.
일반적으로 반도체 패키지는 전자 제품, 통신 기기, 컴퓨터등 반도체패키지가 실장되는 전자 제품들이 소형화되어 가고 있는 추세에 따라 반도체패키지의 크기를 기능의 저하없이 소형화시키고, 고다핀을 구현하면서 경박단소화 하고자 하는 새로운 형태의 반도체패키지이다.In general, as semiconductor packages are being miniaturized in electronic products such as electronic products, communication devices, computers, etc., the size of semiconductor packages is miniaturized without degrading the function, and the thin and small size of the semiconductor package is realized. It is a new type of semiconductor package.
이러한 반도체패키지의 크기는 반도체칩의 크기와 동일한 크기로 형성됨은 물론, 그 제조 방법에 있어서는 다수의 반도체칩이 형성되어 있는 웨이퍼상에 회로패턴이 형성되어 있는 회로필름을 일레스토마테이프를 개재하여 직접 접착시킨 채, 웨이퍼상에서 와이어본딩, 솔더볼 융착 및 몰딩을 마친 후 마지막 단계에서 상기 웨이퍼를 각각의 반도체칩으로 절단하여 독립된 반도체 패키지를 제조하고 있다.The size of the semiconductor package is the same size as that of the semiconductor chip, and in the manufacturing method thereof, a circuit film having a circuit pattern formed on a wafer on which a plurality of semiconductor chips are formed is interposed with an elastoma tape. After the direct bonding, the wire bonding, solder ball fusion and molding on the wafer is finished in the last step to cut the wafer with each semiconductor chip to manufacture an independent semiconductor package.
이러한 반도체 패키지를 제조하는데 있어서, 매우 중요한 공정중의 하나가 바로 회로필름이 부착된 써킷테이프를 웨이퍼상에 정확한 기준 위치에 접착시킨 후, 이를 완전히 밀착되도록 부착시키는 공정이다.In manufacturing such a semiconductor package, one of the very important processes is to attach a circuit tape to which a circuit film is attached at an accurate reference position on a wafer, and then attach the circuit tape to be in close contact with each other.
그러나, 종래에는 상기 공정시에 회로필름이 접착된 써킷테이프와 웨이퍼를 완전히 밀착시키기 위한 별도의 장비가 없었음으로, 회로필름이 접착된 써킷테이프와 웨이퍼가 서로 떨어지는 형상이 자주 발생되는 문제점이 있었다.However, in the prior art, since there was no separate equipment for completely contacting the circuit tape adhered to the circuit tape and the wafer during the process, the circuit tape adhered to the circuit tape and the wafer often had a problem in which the shapes fell apart from each other. .
또한, 상기한 써킷테이프와 웨이퍼를 완전히 밀착시킬 때에는 고온하에서 공정이 이루어진다. 그러나, 일반적인 모든 반도체패키지 제조장비는 매우 정밀한 장비로써, 이러한 장비의 대부분이 금속으로 이루어져 있다.In addition, when the circuit tape and the wafer are completely brought into close contact with each other, the process is performed at a high temperature. However, all general semiconductor package manufacturing equipment is very precise equipment, and most of these equipments are made of metal.
따라서, 정교하게 이루어져 있는 가열 가압장치에 고온이 전달되게 되면, 열팽창에 의한 치수변화로 여러 가지 불량을 일으킬 수 있으며, 즉 제조장비의 정밀도를 떨어뜨리고, 특히 작업자의 안전에도 상당한 위험 요소가 내포되어 있었다.Therefore, if the high temperature is transmitted to the elaborate heating and pressing device, various defects may be caused by the dimensional change due to thermal expansion, that is, the precision of the manufacturing equipment is reduced, and in particular, a significant risk factor is included in the safety of the operator. there was.
본 발명의 목적은, 상기와 같은 문제점을 해결하기 위하여 발명된 것으로서, 다수의 반도체칩이 형성된 웨이퍼상에 회로필름이 부착된 써킷테이프를 정확한 기준위치에 접착시킨 후, 이를 완전히 밀착시킴으로써, 불량을 방지할 수 있도록 된 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치를 제공함에 있다.An object of the present invention is to solve the above problems, the circuit tape is attached to the circuit tape attached to the correct reference position on the wafer on which a plurality of semiconductor chips are formed, and then completely adhered to the defects, The present invention provides a wafer and circuit tape heating and pressing device for manufacturing a semiconductor package that can be prevented.
본 발명의 다른 목적은, 웨이퍼상에 회로필름이 부착된 써킷테이프를 정확한 기준위치에 접착시킨 후, 이를 완전히 밀착시킬 때, 장치에 열변형에 의한 불량을 최대한 방지하도록 열전달이 되지 않도록 장치를 제작함으로써, 열변형에 의한 불량을 방지할 수 있도록 된 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치를 제공함에 있다.Another object of the present invention is to fabricate a device to prevent heat transfer so as to prevent defects due to thermal deformation to the device when the circuit tape having a circuit film attached on the wafer is adhered to an accurate reference position and then completely adhered thereto. Accordingly, the present invention provides a wafer and circuit tape heating and pressurizing apparatus for manufacturing a semiconductor package capable of preventing defects due to thermal deformation.
도 1은 본 발명에 따른 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치의 구성도1 is a block diagram of a wafer and circuit tape heating and pressing apparatus for manufacturing a semiconductor package according to the present invention
도 2는 본 발명에 따른 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치의 승하강수단을 나타낸 평면도Figure 2 is a plan view showing the lifting means of the wafer and circuit tape heating and pressing apparatus for manufacturing a semiconductor package according to the present invention
도 3a와 도 3b는 본 발명에 따른 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치의 연결부재를 나타낸 확대 단면도3A and 3B are enlarged cross-sectional views illustrating a connecting member of a wafer and a circuit tape heating and pressing device for manufacturing a semiconductor package according to the present invention.
- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-
1 - 다이 2 - 예열수단1-die 2-preheating means
3 - 하부고정대 4 - 가압판3-lower arm 4-platen
5 - 승하강수단 6 - 연결부재5-Lifting means 6-Connecting member
이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 발명에 따른 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치의 구성은, 회로필름이 접착된 써킷테이프와 웨이퍼가 부착된 소재를 상면에 안착시키는 다이(1)와, 상기한 다이(1)의 내부에 내장되어 상기 다이(1)를 일정 온도로 예열하는 예열수단(2)과, 상기한 다이(1)를 고정하는 하부고정대(3)와, 상기한 다이(1)의 상면에 안착된 소재를 가압하는 가압판(4)과, 상기한 가압판(4)을 승하강시키는 승하강수단(5)으로 이루어진다.The structure of the wafer and circuit tape heating and pressurizing apparatus for manufacturing a semiconductor package according to the present invention includes a die (1) for seating a circuit tape bonded to a circuit film and a material to which a wafer is attached to an upper surface thereof, and the die (1) described above. A preheating means 2 for preheating the die 1 to a predetermined temperature, a lower stand 3 for fixing the die 1, and a seated upper surface of the die 1. It consists of the pressurizing plate 4 which pressurizes a raw material, and the elevating means 5 which raises and lowers the said pressurizing plate 4.
여기서, 상기한 예열수단(2)은 링 형상의 히터카트리지가 복수개 내장되고, 상기한 다이(1)는 상부에서 가압판(4)으로 소재를 가압하는 순간에 하부로 약간의 텐션력을 보유하도록 스프링이 구비된 완충구(7)가 설치된다.Here, the preheating means 2 has a plurality of ring-shaped heater cartridges are built in, and the die 1 has a spring so as to retain a slight tension downwards at the moment of pressing the material from the top to the pressure plate 4. This provided buffer 7 is provided.
또한, 상기한 승하강수단(5)은, 상부에 손잡이(51')가 구비된 핸들(51)과, 상기한 핸들(51)의 회전에 의해 회전되도록 설치된 구동기어(52)와, 상기한 구동기어(52)에 맞물려 회전하도록 설치된 감속기어(53)와, 상기한 감속기어(53)에 맞물려 회전하고, 중심부에는 암나사가 형성되어 있는 종동기어(54)와, 상기한 종동기어(54)의 암나사에 결합되도록 외주연에 볼스크류가 형성되고, 하부에는 가압판(4)이 고정된 램(55)으로 이루어진다.In addition, the elevating means (5), the handle 51 having a handle (51 ') at the top, the drive gear (52) installed so as to be rotated by the rotation of the handle 51, and the A reduction gear 53 provided to rotate in engagement with the drive gear 52, a driven gear 54 that rotates in engagement with the reduction gear 53, and has a female thread in the center thereof, and the driven gear 54 described above. The ball screw is formed on the outer circumference to be coupled to the female screw of the lower portion, the lower plate is made of a ram 55 is fixed to the pressing plate (4).
상기에 있어서, 구동기어(52)와 감속기어(53) 및 종동기어(54)의 기어비는 적은 힘으로 큼 힘을 얻을 수 있도록, 구동기어(52)는 아주 작고, 종동기어(54)는 매우 크다.In the above, the gear ratio of the drive gear 52, the reduction gear 53, and the driven gear 54 is very small, so that the drive gear 52 is very small, so that the driven gear 54 is very small Big.
상기에 있어서, 예열수단(2)에 의해 예열되는 다이(1)의 열이 하부고정대(3)로 전달되지 않도록 하기 위하여 연결부재(6)를 설치한다. 이 연결부재(6)는 상면에 복수개의 돌출턱(6a)을 형성하여 다이(1)의 하부에 결합시킴으로써, 상기한 연결부재(6)와 다이(1)의 접촉면적을 최소화할 수 있다.In the above, the connecting member 6 is provided so that the heat of the die 1 preheated by the preheating means 2 is not transmitted to the lower fixing stand 3. The connecting member 6 is formed on the upper surface by forming a plurality of protruding jaws 6a to be coupled to the lower part of the die 1, thereby minimizing the contact area between the connecting member 6 and the die 1.
또한, 상기한 연결부재(6)의 외주면상에는 복수개의 구멍(6b)을 형성함으로써, 상기한 다이(1)와 접촉되는 돌출턱(6a)에 의해 전달된 미세한 열이 상기한 하부고정대(3)로 전달되는 것을 억제한다. 즉, 연결부재(6)를 통해 전달되는 열을 상기한 연결부재(6)에서 모두 방열시킴으로써, 하부고정대(3)로는 열이 전달되지 않아 장비의 정밀도를 유지할 수 있다.Further, by forming a plurality of holes 6b on the outer circumferential surface of the connecting member 6, the lower column 3 is formed by the minute heat transferred by the protruding jaw 6a in contact with the die 1. Suppress delivery to That is, by heat dissipating all the heat transmitted through the connecting member 6 in the connecting member 6, the heat is not transmitted to the lower fixing stand 3 can maintain the precision of the equipment.
이와 같은 장치의 작동은, 먼저 회로필름이 접착된 써킷테이프와 웨이퍼가 와 부착된 소재를 다이(1)의 상면에 안착시킨 상태에서, 손잡이(51')를 회전시켜 핸들(51)을 돌리면, 구동기어(52)가 회전되고, 이 구동기어(52)의 회전에 의해 맞물려서 감속기어(53)와 종동기어(54)가 회전된다.The operation of such a device is performed by first rotating the handle 51 by rotating the handle 51 'while the circuit tape to which the circuit film is attached and the material to which the wafer is attached to the upper surface of the die 1 are rotated. The drive gear 52 rotates, and the reduction gear 53 and the driven gear 54 rotate by being engaged by the rotation of the drive gear 52.
이와 같이 종동기어(54)가 회전되면, 상기한 종동기어(54)의 중심에 볼스크류로 결합된 상기한 램(55)은 하강하게 된다. 따라서, 상기한 램(55)의 하부에 고정되어 있는 가압판(4)은 상기한 다이(1)에 접촉되면서 상기한 다이(1)의 상면에 안착된 소재를 가압한다.When the driven gear 54 is rotated as described above, the ram 55 coupled to the center of the driven gear 54 by a ball screw is lowered. Accordingly, the pressure plate 4 fixed to the lower portion of the ram 55 presses the material seated on the upper surface of the die 1 while contacting the die 1.
이때, 상기한 다이(1)는 예열수단(2)에 의해 가열된 상태로 항상 고온상태를 유지하고 있음으로써, 상기한 가압판(4)으로 소재를 가압시 회로필름이 접착된 써킷테이프와 웨이퍼를 완전히 밀착시킬 수 있다. 즉, 상기한 가압판(4)에 의해 가압되는 소재(웨이퍼와 써킷테이프)는 가열 가압된다.At this time, the die 1 is always maintained at a high temperature while being heated by the preheating means 2, so that the circuit tape and the wafer to which the circuit film is adhered when the material is pressed by the pressure plate 4 are used. It can be completely adhered to. That is, the raw material (wafer and circuit tape) pressurized by the said press plate 4 is heated and pressurized.
이와 같이 상기한 다이(1)를 예열하여 고온의 상태를 유지하는 것은, 상기한 써킷테이프의 접착물질을 어느 정도의 용융시킨 상태로 접착하여야만 완전히 밀착된 상태를 접착되기 때문이다.The pre-heating of the die 1 as described above maintains a high temperature state because the adhesive material of the circuit tape is adhered in a state in which the adhesive material is melted to some extent so that the state in which the die 1 is fully adhered is adhered.
또한, 상기한 다이(1)를 고온으로 유지하게 되면, 상기 고온에 의해 상기한 다이(1)와 결합되어 있는 부품들에 고온의 열이 전달되고, 이로 인해 열팽창이 발생되어 제조장비의 정밀도를 떨어뜨리게 된다.In addition, when the die 1 is maintained at a high temperature, high temperature heat is transmitted to the components coupled to the die 1 by the high temperature, thereby causing thermal expansion, thereby improving the precision of manufacturing equipment. Dropped.
따라서, 이러한 열전달을 차단하여 열팽창을 방지하도록 하기 위하여 본 발명에서는 상기한 다이(1)를 연결부재(6)를 매개체로 하여 하부고정대(3)에 결합시켰다. 즉, 상기한 연결부재(6)는 다이(1)와 접촉되는 면적을 최대한으로 줄여서 접촉되도록 하였음은 물론, 상기한 연결부재(6)에 복수대의 구멍(6b)을 형성함으로써, 상기 연결부재(6)를 통한 열전달은 최대한 억제되어 장비의 정밀도를 유지할 수 있다.Therefore, in order to block such heat transfer and prevent thermal expansion, in the present invention, the die 1 is coupled to the lower stand 3 using the connecting member 6 as a medium. That is, the connecting member 6 is to contact the reduced contact with the die 1 to the maximum, as well as by forming a plurality of holes (6b) in the connecting member 6, the connecting member ( Heat transfer through 6) is suppressed as much as possible to maintain the precision of the equipment.
이상의 설명에서와 같이 본 발명의 반도체 패키지 제조를 위한 웨이퍼와 써킷테이프 가열 가압장치에 의하면, 회로필름이 접착된 써킷테이프와 웨이퍼를 정확한 기준위치에 서로 부착시킨 후, 이를 완전히 밀착시키도록 함으로써, 불량을 방지할 수 있고, 열전달을 차단하여 장비의 정밀도를 유지하여 수명을 연장시킴은 물론, 신뢰성을 향상시킬 수 있는 효과가 있다.As described above, according to the wafer and circuit tape heating and pressing apparatus for manufacturing a semiconductor package of the present invention, the circuit tape and the circuit tape are bonded to each other at an accurate reference position, and then completely adhered to each other. Can be prevented, heat transfer can be blocked to maintain the precision of the equipment to extend the life, as well as to improve the reliability.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1998-0035610A KR100369392B1 (en) | 1998-08-31 | 1998-08-31 | Wafer and Circuit Tape Pressurization Unit for Semiconductor Package Manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1998-0035610A KR100369392B1 (en) | 1998-08-31 | 1998-08-31 | Wafer and Circuit Tape Pressurization Unit for Semiconductor Package Manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000015584A KR20000015584A (en) | 2000-03-15 |
| KR100369392B1 true KR100369392B1 (en) | 2003-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR10-1998-0035610A KR100369392B1 (en) | 1998-08-31 | 1998-08-31 | Wafer and Circuit Tape Pressurization Unit for Semiconductor Package Manufacturing |
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|---|---|---|---|---|
| KR100345772B1 (en) * | 2000-10-28 | 2002-07-24 | 주식회사선양테크 | circuit tape attachment device |
| KR100594642B1 (en) * | 2005-07-25 | 2006-06-30 | 한국기계연구원 | Wafer bonding apparatus, system and method |
| KR101252176B1 (en) * | 2011-02-17 | 2013-04-05 | (주)나노솔루션테크 | Heating/cooling apparatus for wafer chuck and wafer bonder comprising the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176553A (en) * | 1993-12-17 | 1995-07-14 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07176553A (en) * | 1993-12-17 | 1995-07-14 | Matsushita Electric Ind Co Ltd | Method and apparatus for mounting chip |
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