JP2003297878A - Component pressurizing and joining device and joining method of component to substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component pressurizing and joining device and a joining method capable of joining a component requesting high joining position accuracy to a substrate with the high joining position accuracy while keeping high productivity in the component pressurizing and joining device and a joining method for joining a plurality of components arranged on one substrate. <P>SOLUTION: In order to individually pressurize the plurality of components arranged on one substrate with a joining material interposed by a plurality of component pressurizing members, the plurality of component pressurizing members and the plurality of components are positioned. when making the plurality of component pressurizing members descend and making pressurizing forces act individually on the plurality of components, pressurizing operations by the respective component pressurizing members are performed individually corresponding to respective pressurizing and joining states, the melting and heating operation of the joining material is performed corresponding to the respective pressurizing and joining states and the plurality of components are joined on the substrate with the joining material interposed. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component pressing and joining apparatus and a joining method for joining a plurality of components to a single substrate, and more particularly to individually applying a pressing force to the plurality of components on the substrate. TECHNICAL FIELD The present invention relates to a component pressing and joining apparatus and a joining method for joining parts to each other.

[0002]

2. Description of the Related Art Conventionally, as a method for pressing and joining an electronic component, an electrode of an electronic component is joined to an electrode on a substrate by interposing a bonding material and pressing the components to produce an electronic component assembly.
By using a plurality of pressing heads that apply a pressing force to a plurality of electronic components arranged on the substrate with a bonding material interposed therebetween, the above-mentioned pressing heads are collectively operated so that the electrodes on the substrate are While simultaneously pressing the electrodes of each electronic component with the bonding material interposed therebetween, the bonding materials are simultaneously heated and melted so that the electrodes of each electronic component are interposed between the electrodes on the substrate. A so-called gang joining method of joining is known.

[0003] Such a gang joining method is often used in the case where a plurality of electronic components of the same type are collectively joined on one substrate. As an example of such a case, the gang joining method will be described. The details will be described below.

First, in a press-bonding apparatus for electronic parts for carrying out this gang-joining method, a plurality of pressing heads arranged on the substrate and capable of pressing a plurality of press-fitting heads,
An elevating device that collectively raises and lowers each of the pressing heads and an electronic component that is provided in each of the pressing heads and that is pressed by the pressing heads are collectively heated, so that the electrodes of the electronic components and the substrate are A heater for heating and melting the bonding material interposed between the electrodes and a machine base for fixing the substrate are provided.

Next, FIG. 17 shows a schematic cross-sectional view of an electronic component and a substrate showing a joining procedure in the above gang joining method. As shown in FIG. 17A, the rectangular plate-shaped electronic component 201 has a plurality of electrodes 201a on the lower surface which is a bonding surface.
Also, a pad 203a that is an electrode that can be bonded to each electrode 201a of a plurality of electronic components 201 is formed on a square plate-shaped substrate 203, and each electronic component 201 is attached to each pad 203a. It is an example of a bonding material and is arranged on the substrate 203 with the solder bumps 202 formed in advance on each electrode 201a of each electronic component 201 being interposed.

Each pressing head 210 has a substrate 203.
The electronic components 201 are arranged at positions that match the arrangement of the electronic components 201 arranged and arranged above. By vertically moving the pressing heads 210 collectively by the lifting device, the electronic components 201 are simultaneously moved. It can be pressed against.

First, in such a pressure joining device,
As shown in FIG. 17B, the pressing heads 210 of the pressing heads 210 are pressed so that the electronic parts 201 can be pressed against the electronic parts 201 arranged on the substrate 203 fixed on the machine base of the pressing and bonding apparatus. Positioning is performed, and then each pressing head 2
10 is collectively lowered by the lifting device.

Next, as shown in FIG. 17C, the tip end of each pressing head 210 is brought into contact with the back surface of each electronic component 201, which is the surface not having the electrode 201a, and each pressing head 210 is used. The solder bumps 202 of the electronic components 201 are simultaneously pressed and bonded onto the pads 203a of the substrate 203, and the heaters provided in the pressing heads are collectively operated to collectively operate the electronic components 201. Heating is performed simultaneously, and each solder bump 202 is melted by heating each electronic component 201.

Thereafter, as shown in FIG. 17D, the heaters are collectively stopped, and the pressing heads are collectively raised by the elevating device. After that, the solder in the molten state is gradually cooled and solidified, whereby each electronic component 201 is connected to each electrode 20 of the electronic component 201.
1a is bonded to each pad 203a of the substrate 203 with solder interposed.

In such a gang joining method,
It is possible to simultaneously bond a plurality of electronic components arranged on a substrate with a plurality of pressing heads at the same time, and in particular, each electronic component may be the same type of electronic component. In such a case, since a large number of electronic components can be bonded onto the substrate at one time, an electronic component assembly produced by bonding the electronic components onto the substrate can be efficiently produced. The productivity of the electronic component assembly can be improved.

[0011]

However, in the above-mentioned structure, the raising / lowering operation of each pressing head for performing the pressing operation of each electronic component is collectively performed by one elevating / lowering device provided in the electronic component pressing / bonding apparatus. Therefore, for example, when the board to which each electronic component is joined has a warp or a warp and the flatness of the board is low (that is, when the board has a warp or a warp), or the electronic parts arranged on the board When the heights of the joining materials are different, the joining height positions of the electronic components arranged on the substrate vary, but in the electronic component press-joining device, the pressing heads Since it is not possible to individually adjust the pressing force, the tip position of each pressing head, etc. for each, there is variation in the bonding height position of each electronic component bonded on the substrate,
Alternatively, the bonding material may be pressed too much and the bonding material may be crushed.

Further, in recent years, as the performance of electronic components has improved, it has been required to bond electronic components to substrates with higher bonding position accuracy. For example, in an electronic component such as a highly integrated IC used in a CPU of a personal computer, the bonding height position accuracy with respect to the substrate is ± 5 μm height position error accuracy at the back surface height position of the IC, further,
There is a demand for a height position error accuracy of ± 12 μm and a high bonding height position accuracy at the back surface height position of a heat spreader which is joined to the back surface of the IC and radiates heat generated by the IC. Further, such high joint height position accuracy is required, and in parallel, the time required for joining the electronic components to the substrate is shortened to improve the joining efficiency,
There is also a demand for improving the productivity of electronic component assemblies.

However, in the conventional gang joining method, as described above, for example, the substrate to which each electronic component is joined has bending or warping, and the flatness of the substrate is low.
Alternatively, when the height of the bonding material of the electronic components arranged on the substrate is different and the bonding height positions of the electronic components arranged on the substrate vary, as described above, Since each pressing head is collectively controlled, the operation of each pressing head cannot be controlled individually, and the bonding height position of each electronic component bonded on the substrate varies, and There is a problem in that it cannot be applied to the joining of electronic components that require high joining position accuracy.

Accordingly, an object of the present invention is to solve the above problems, and in a component pressing and joining apparatus and a joining method for joining a plurality of components arranged on one substrate, while maintaining high productivity, It is an object of the present invention to provide a component pressing and bonding apparatus and a bonding method capable of bonding a component, which requires high bonding position accuracy, to a substrate with high bonding position accuracy.

[0015]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, a plurality of pressing devices that individually apply a pressing force to a plurality of components arranged on one substrate with a bonding material interposed therebetween to individually perform a bonding operation. In the component pressing and joining apparatus having the above, each of the pressing devices includes a component pressing member that individually presses the component, an elevating device that individually moves the component pressing member up and down, and the component pressing member with respect to the component. And a detection device that individually detects the pressing operation state that has been made to act, and the component pressing and joining device is configured to input a heating device that melts and heats the joining material and a detection result of the detection device in each of the pressing devices. And a control device for individually controlling the elevating operation of the elevating device and the melting and heating operation of the heating device based on the input detection result. When the component pressing member is moved downward to apply a pressing force to each of the plurality of components to perform the joining operation, the component pressing members are individually operated according to the respective pressing operation states detected by the detection device. There is provided a component pressing and joining apparatus characterized by performing a pressing operation and performing a melting and heating operation by the heating device according to the pressing operation state.

According to the second aspect of the present invention, the heating device is provided in each of the pressing devices, and it is possible to individually perform melting and heating of the bonding material in each of the pressing devices. The control device can individually control the melting and heating operation of the heating device based on the input detection result, and the control device lowers the component pressing members of the plurality of pressing devices to make a plurality of parts. When the pressing operation is applied to each of the parts individually to perform the joining operation, the pressing operation by the part pressing member and the melting by the heating device are individually performed according to the pressing operation state detected by each detecting device. There is provided a component pressing and joining apparatus according to the first aspect, which performs a heating operation.

According to the third aspect of the present invention, the detection device in each of the pressing devices can individually detect the pressing force applied to the component by the component pressing member in the pressing operation state. In the plurality of pressing devices, the control device lowers the component pressing member by the elevating device and applies a pressing force to the component on the substrate facing the component pressing member to perform a bonding operation. When this is performed, the heating and melting operation of the bonding material is performed, and the pressing force detected by the detection device is maintained substantially constant with respect to the set pressing force, and the pressing force is set by the detection device. A second mode in which when the decrease with respect to the pressing force is detected, the lowering of the component pressing member by the elevating device is stopped to maintain the position of the component pressing member with respect to the substrate. Providing component pressing bonding apparatus according.

According to a fourth aspect of the present invention, when the control device causes the plurality of pressing devices to individually perform the pressing operation and the melting and heating operation according to the pressing operation state, the detection device is used. According to a third aspect of the present invention, there is provided the component pressing and joining apparatus according to the third aspect, which individually performs the pressing operation and the melting and heating operation based on the information that the pressing force detected by the method reaches the set pressing force.

According to a fifth aspect of the present invention, the controller controls the bonding material when the pressing operation and the melting and heating operation are individually performed according to the pressing operation state in the plurality of pressing apparatuses. The component pressing and bonding apparatus according to any one of the second to fourth aspects, in which the pressing operation and the melting and heating operation are individually performed according to the heating time or the flatness of the component or the substrate. .

According to a sixth aspect of the present invention, each of the pressing devices further includes a cooling device that individually solidifies and cools the melt-heated bonding material, and the pressing device controls the heating device. There is provided the component pressing and joining apparatus according to any one of the second to fifth aspects, in which solidification cooling is individually performed by the cooling device after completion of the melting and heating operation.

According to a seventh aspect of the present invention, each of the component pressing members is capable of individually holding the component in a releasable manner, and the control device in the plurality of pressing devices includes the component pressing members. Any one of the first to sixth aspects, in which the components are individually held when a pressing force is applied to the components and the holding of the components is individually released when the components are joined to the substrate. A component pressure joining device according to one aspect is provided.

According to an eighth aspect of the present invention, the pressing devices are arranged in two rows and a plurality of columns in a plan view, and the arrangement intervals of the columns are arranged at regular intervals, and are arranged on the substrate. Any one of the first aspect to the seventh aspect, in which the joining operation is individually performed on the same type and a plurality of the components arranged with the joining material interposed and along the row at the constant interval. There is provided the above described component pressure joining device.

According to a ninth aspect of the present invention, the component pressing and joining apparatus according to the eighth aspect further comprising an interval changing mechanism for changing the fixed interval of the column or the interval of the row of each pressing device. I will provide a.

According to the tenth aspect of the present invention, the substrate is supported by the component supporting mechanism for releasably supporting the respective components so that the respective bonding positions are held on the substrate. The component pressing and joining device according to any one of the first to ninth aspects is supplied to the substrate for each of the components by the pressing device in a state where the support by the component supporting mechanism is released. There is provided a component pressing and joining apparatus in which the above joining operation is performed individually.

According to an eleventh aspect of the present invention, the component is an electronic component bonded to the substrate with the bonding material interposed, or the electronic component bonded to the substrate is the bonding material. Provided is a component pressing and joining apparatus according to any one of the first to tenth aspects, which is a heat spreader joined by interposing.

According to the twelfth aspect of the present invention, in the case where the heat spreader is joined to the electronic component in a state of being joined to the substrate with the joining material interposed, the heat spreader is attached. The melting point of the bonding material bonded to the electronic component is lower than the melting point of the bonding material bonding the electronic component to the substrate.

According to the thirteenth aspect of the present invention, the plurality of component pressing members are arranged so that the plurality of component members arranged on one substrate with the bonding material interposed therebetween can be individually pressed by the plurality of component pressing members. Positioning the member and the plurality of components, lower the plurality of component pressing member, when individually pressing force is applied to the plurality of components individually according to the respective pressure bonding state of each of the above Performing a pressing operation by the component pressing member and performing a melting and heating operation of the bonding material according to each of the pressure bonding states, and bonding the plurality of components by interposing the bonding material on the substrate. A featured part pressure joining method is provided.

According to the fourteenth aspect of the present invention, when the pressing force is applied individually to the plurality of components, the pressing operation and the bonding by the respective component pressing members are individually performed according to the respective pressing and joining states. The component pressing joining method according to the thirteenth aspect is provided, in which the material is melted and heated to join the plurality of components with the joining material interposed on the substrate.

According to the fifteenth aspect of the present invention, when the plurality of component pressing members are moved down to exert a pressing force individually on the plurality of components, the pressing force exerted on each of the components is applied. Are individually detected, and the detected pressing force is maintained substantially constant with respect to the set pressing force, and the joining material is melted and heated, and the set pressing force of the pressing force maintained at the substantially constant is When the decrease is detected, the component pressing joining method according to the fourteenth aspect is provided, in which the descending of each of the component pressing members is stopped to maintain the position of each of the component pressing members with respect to the substrate.

According to the sixteenth aspect of the present invention, the detected pressing force reaches the set pressing force when the pressing operation and the melting and heating operation are individually performed according to the respective pressing operation states. A component pressing and joining method according to the fifteenth aspect, wherein the pressing operation and the melting and heating operation are individually performed based on information.

According to the seventeenth aspect of the present invention, when the pressing operation and the melting and heating operation are individually performed in accordance with the pressing operation state, the heating time of the bonding material or the flatness of the component or the substrate. According to the fourteenth to sixteenth aspects, the pressing operation and the melting and heating operation are individually performed according to
There is provided a component pressure joining method according to any one of aspects.

According to the eighteenth aspect of the present invention, when a pressing force is applied to the plurality of parts, the respective parts are individually held by the respective part pressing members, and the joining material is melted and heated by the melting and heating operation. Are individually melted, and then the melted bonding material is individually solidified and cooled, and when the bonding material is solidified and the respective components are bonded to the substrate with the bonding material interposed therebetween, The component pressing and joining method according to any one of the thirteenth aspect to the seventeenth aspect, in which the holding of the component is individually released.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION A component pressing and joining apparatus and a joining method according to an embodiment of the present invention are a component pressing and joining apparatus and a joining method for simultaneously pushing and joining a plurality of components onto a substrate by a plurality of heads. In connection with this, the component pressing and joining apparatus 101 and the joining method thereof as an example of the component pressing and joining apparatus and the joining method according to the embodiment of the present invention will be described in detail with reference to the drawings. In the component pressing / bonding apparatus 101, an IC used in a CPU of a computer as an example of a component, for example, highly integrated I which requires a bonding height position error accuracy with respect to a substrate within ± 5 μm.
A circuit board 3 in which the electronic component 1 such as C is an example of the board.
Is pressed and joined to. Further, in an electronic component assembly manufactured by joining electronic components to a circuit board, when the internal electronic circuit is operated, the electronic circuit generates heat, and due to the influence of the heat, the electronic circuit It may interfere with normal operation. In such an electronic component assembly, the operation of the electronic circuit is stabilized by joining a heat spreader that efficiently dissipates heat generated in the electronic circuit to the back surface of the electronic component. In the component pressure bonding apparatus 101, the heat spreader 5 which is an example of a component is pressure bonded to each electronic component 1 bonded on the circuit board 3. The heat spreader 5 bonded to the electronic component 1 is a heat spreader bonded to an electronic component such as an IC used in a CPU of a computer, and an electronic component such as a highly integrated IC. The heat spreader is required to have a joint height position error accuracy of ± 12 μm or less.

Here, in addition to the electronic component 1 and the heat spreader 5, the components also include mechanical components, optical components, etc., which are similarly required to have the above-mentioned joining height position accuracy with respect to the substrate. It should be noted that the present invention also includes mechanical parts, optical parts, and the like that require accurate and reliable bonding even in the case where the above-described bonding height position accuracy is not required. In addition, the substrate is a resin substrate, paper-phenol substrate, ceramic substrate, glass
Epoxy (glass epoxy) board, circuit board such as film board, circuit board such as single layer board or multilayer board, parts,
It means an object on which a circuit is formed, such as a housing or a frame.

Next, such a component pressure joining apparatus 101
FIG. 1 is a perspective view in which a part of FIG. As shown in FIG. 1, in the component pressing and joining apparatus 101, a rigid body having a gate shape is formed so that the upper portions of two prismatic rigid bodies that are erected and fixed on the machine base are further passed by the prismatic rigid body. The main frame 20 is provided in the substantially central portion of the machine base, and the pressing head 10 is an example of a pressing device for pressing and joining components.
Are arranged at equal intervals pitch P along the X-axis direction, five on each side surface of the upper portion of the main frame 20, which are line-symmetrical positions with respect to the center line of the main frame 20 in the X-axis direction. Has been done. Further, the pressing heads 10 that are line-symmetrical to each other with respect to the axis of symmetry are connected to each other, and in the connected state, the respective pressing heads 10 of the main frame 20 are movable in the X-axis direction. It is attached to the top. The X-axis direction and the Y-axis direction in FIG. 1 are orthogonal to each other, and the direction orthogonal to both the X-axis direction and the Y-axis direction is the Z-axis direction.

The five pressing heads 10 arranged on the right side (front side in FIG. 1) of the main frame 20 in the Y-axis direction in the figure are head pitches, which are an example of a space varying mechanism provided in the main frame 20. The five pressing heads 10 are fixed to the variable mechanism 31, and are attached to the main frame 20 via the head pitch variable mechanism 31. In addition, the head pitch variable mechanism 31 uses the above-mentioned 5
It is possible to vary the spacing pitch P of the individual pressing heads 10 while maintaining the state of equal spacing.

Here, a schematic explanatory view schematically showing the structure of the head pitch varying mechanism 31 is shown in FIG. As shown in FIGS. 1 and 18, the variable head pitch mechanism 31 includes a ball screw shaft portion 31a that is rotatable in the forward and reverse directions about its axis and is supported by the main frame 20 along the X-axis direction, and a ball screw shaft. Of the five pressing heads 10 screwed into the portion 31a, the pressing head 10 located at the center of the five pressing heads 10 is excluded.
Four nut parts 3 to which each pressing head 10 is fixed
1b, a bearing portion 31d for fixing the pressing head 10 located at the center to the ball screw shaft portion 31a in the X-axis direction,
And a motor 31c that is fixed to the left end of the ball screw shaft portion 31a in the drawing and that rotates the ball screw shaft portion 31a in the forward and reverse directions. The ball screw shaft portion 31a and the motor 31c are supported by the main frame 20 so as to be movable along the X-axis direction.

As shown in FIG. 18, in the head pitch varying mechanism 31, the nut portions 3 located on both sides of the bearing portion 31d fixing the pressing head 10 located at the center.
In 1b, female threads having opposite pitches and the same pitch are formed, and nut portions 31b located at both ends are further formed.
In, the female screw is formed in the same direction as the adjacent nut portion 31b and at a pitch twice the above-mentioned same pitch.
As a result, in the head pitch varying mechanism 31, the ball screw shaft portion 31a is rotated by the motor 31c in either one of the forward and reverse directions to fix the position of the bearing portion 31d located at the center as the reference position Q. , The respective nut portions 31b located on both sides thereof with the above-mentioned interval pitch P
Can be moved along the ball screw shaft portion 31a in a direction away from the reference position Q or in a direction approaching the reference position Q while maintaining the same intervals. Therefore, the head pitch variable mechanism 3
By 1, the position of the pressing head 10 located at the center can be used as the reference position Q, and the interval pitch can be varied while maintaining the interval pitch P of the pressing heads 10 at equal intervals. Since the pressing heads 10 that are line-symmetrical to each other with respect to the axis of symmetry are connected to each other, the head pitch variable mechanism 31 maintains the position of the pressing head 10 that is line-symmetric with respect to the axis of symmetry. However, the spacing pitch P of each pressing head 10 can be varied.

Further, of the five pressing heads 10, the pressing head 10 located at the center is fixed to an X-axis direction moving mechanism 32 which is an example of a moving mechanism of the pressing head provided in the main frame 20. Has been done. FIG. 18 also schematically shows the structure of the X-axis direction moving mechanism 32.
As shown in FIG. 18, the X-axis direction moving mechanism 32 has a ball screw shaft portion 3 whose axial center is fixed to the main frame 20 so as to be able to rotate forward and backward along the X-axis direction and around the axial center.
2a, a nut portion 32b screwed to the ball screw shaft portion 32a and to which the central pressing head 10 is fixed, and a ball screw shaft portion 32a fixed to the left end of the ball screw shaft portion 32a in the figure. The motor 3 that rotates in the forward and reverse directions
2c and. Thereby, the X-axis direction moving mechanism 3
2, the motor 32c drives the ball screw shaft portion 32a.
The nut portion 32b is moved forward and backward in the X-axis direction by rotating the nut portion 3 in one of the forward and reverse directions to move the nut portion 3b.
The central pressing head 10 fixed to 2b can be moved back and forth along the X-axis direction. Further, the ball screw shaft portion 31a and the motor 31c in the variable head pitch mechanism 31 are supported by the main frame 20 so as to be movable in the X-axis direction, and the X-axis direction moving mechanism 32 moves the central pressing head 10 forward and backward. Thus, the ball screw shaft portion 31a of the head pitch variable mechanism 31 fixed to the central pressing head 10 is moved back and forth along the X-axis direction, and each nut portion 31b screwed to the ball screw shaft portion 31a. It is possible to move each of the pressing heads 10 fixed in the X direction along the X-axis direction while maintaining the interval pitch P. That is, with the X-axis direction moving mechanism 32, all the pressing heads 10 can be moved back and forth in the X-axis direction while the relative positions of the pressing heads 10 are maintained.

Further, as shown in FIG. 2, which is a schematic structural view of the pressing head 10, the pressing head 10 has an elevating part 19 which is an example of an elevating device for individually lowering or elevating the pressing head 10. I have it. Further, at the lower part of each pressing head 10, the suction nozzle 11 which is an example of a component holding member for individually adsorbing and holding a component at its tip and also an example of a component pressing member for individually pressing the component
And a ceramic heater 12, which is an example of a heating device which is attached to the upper side of the suction nozzle 11 and heats the suction nozzle 11 to heat the components suction-held by the suction nozzle 11, and the tip portion of the ceramic heater 12. A cooling blow nozzle 14, which is an example of a cooling device, is provided above the ceramic heater 12 so as to be located in the periphery and cools the components heated by the ceramic heater 12. Here, as an example, the heating device is the ceramic heater 12 provided in the pressing head 10. However, instead of the ceramic heater 12, a heating unit provided in a pedestal part on which a substrate is arranged, or The component press-bonding apparatus 101 may include a heating unit that heats the component and the substrate by blowing hot air. A detailed description of the structure of the pressing head 10 will be given later.

Further, in FIG. 1, the slide base 34
Is fixed to the nut portion of the Y-axis direction moving mechanism 33,
The Y-axis direction moving mechanism 33 causes the motor to rotate the ball screw shaft in the forward and reverse directions, thereby moving the slide base 34 fixed to the nut portion screwed to the ball screw shaft forward and backward in the Y-axis direction in the drawing. In addition, on the slide base 34, a first stage 35 and a second stage 3 which are examples of a gantry unit.
6 are fixed in parallel in the Y-axis direction, and the respective substrates supplied and fixed to the first stage 35 and the second stage 36 are moved in the Y-axis direction in the drawing by the Y-axis direction moving mechanism 33. It is possible to move back and forth integrally.
Further, two rails 35a and 36a are installed on the first stage 35 and the second stage 36, respectively, so that both ends of each substrate in the Y-axis direction in the figure can be supported.
The tip surface of the suction nozzle 11 of each pressing head 10 and the rails 35a and 36a of the first stage 35 and the second stage 36 are substantially parallel to each other.

A loader 37 for supplying the circuit board 3 onto the rails 35a and 36a of the first stage 35 and the second stage 36 is installed on the left side of the first stage 35 and the second stage 36 in the X-axis direction in the figure. Has been done,
Each rail 35 of the first stage 35 and the second stage 36
An unloader 38 that discharges the circuit board 3 from above a and 36a is installed on the right side in the X-axis direction in the drawing. The loader 37 and the unloader 38 include a rail capable of supporting both ends of the circuit board 3 and the circuit board 3 supported by the rail.
And a loader 3 for moving the loader 3 respectively.
A detailed description of the structures of 7 and the unloader 38 will be given later.

Further, the component pressing / bonding apparatus 101 is provided with a control unit 9 for controlling each component of the component pressing / bonding apparatus 101, and the lifting / lowering operation of the elevating / lowering section 19, the moving operation of the X-direction moving mechanism 32, and the Y-movement operation are performed. Movement operation of the direction movement mechanism 33,
Moving operation of variable head pitch mechanism 31, pressing head 10
The suction holding operation of the suction nozzle 11, the heating operation of the ceramic heater 12 of the pressing head 10, and the movement operation of each moving mechanism of the loader 37 and the unloader 38 are performed by the control unit 9.
Is controlled by.

Next, the arrangement positions of the pressing heads 10 in the component pressing and joining apparatus 101, the first stage 35 and the second
FIG. 3 is a plan view schematically showing the positional relationship between the circuit boards 3 and the electronic components 1 that are supplied and fixed to the stage 36.
4 and 5 are cross-sectional views schematically showing the electronic component 1 and the circuit board 3.

As shown in FIGS. 3 and 4 (A), the rectangular plate-shaped electronic component 1 has a large number of electrodes 1a on the bonding surface, and each electrode 1a has a solder, which is an example of a bonding material. The bump 2 is formed in advance. Further, a rectangular plate-shaped unit circuit board 3b having pads 3a which are a large number of electrodes on the bonding surface is arranged in two in the Y-axis direction and five in the X-axis direction, that is, arranged in two rows and five columns. Circuit board 3 is formed integrally. Further, each solder bump 2 of each electronic component 1 is on each pad 3a of the circuit board 3 so that each electrode 1a of the electronic component 1 can be bonded to each pad 3a of the unit circuit board 3b with the solder bump 2 interposed. The electronic components 1 thus arranged are all the same type of electronic component 1.

Here, the "arrangement" of the electronic component 1 means
Not only when the electronic component 1 is simply placed on the circuit board 3, but by applying an external force to the electronic component 1 or the circuit board 3, the electronic component 1 and the circuit board 3 are not destroyed and the electronic component 1 is not destroyed. It also includes temporary joining which is a joined state in which the joined state between the circuit board 3 and the circuit board 3 can be easily released. Further, as will be described later, there may be a case in which the electronic component 1 is simply placed on the circuit board 3 and the state of the above-described placement is releasably supported by another member to hold the above-described placement. Included in the above arrangement.

The "joining" of the component to the substrate performed by the component pressing and joining apparatus 101 is to destroy the electronic component 1 and the circuit board 3 by applying an external force to the electronic component 1 or the circuit board 3. In other words, the joint state between the electronic component 1 and the circuit board 3 cannot be easily released. It should be noted that after the components such as the electronic component 1 are bonded to the circuit board 3, the circuit board 3 is cut along a cutting line C in the X axis direction and a cutting line D in the Y axis direction of the circuit board 3 in FIG. As a result, the circuit board 3 is divided into a plurality of unit circuit boards 3b, and an electronic component assembly in which the electronic component 1 is bonded to each unit circuit board 3b is manufactured.

Further, as shown in FIG. 3, the electronic components 1 are arranged on the circuit board 3 in the X-axis direction at a constant interval A.
It is arranged by. In addition, the circuit board 3 fixed to the first stage 35 (lower side in FIG. 3) and the circuit board 3 fixed to the second stage 36 (upper side in FIG. 3) are arranged in a similar arrangement. The component 1 is arranged so that it can be joined to each circuit board 3. Also, the first
In the stage 35 and the second stage 36, the respective circuit boards 3 are fixed with the arrangement interval in the Y-axis direction at the same position on the respective circuit boards 3 as the interval B. Therefore, in each circuit board 3, the respective arrangements of the electronic components 1 in the above-mentioned row among the above-mentioned two-row and five-column are arranged in the first column and the second column.
If it is a row, the distance between the first row of the circuit board 3 in the first stage 35 and the first row of the circuit board 3 in the second stage 36 becomes the same as the above-mentioned distance B, and further, the distance of the circuit board 3 in the first stage 35 The distance between the second row and the second row of the circuit board 3 in the second stage 36 is also the distance B.

Further, in each pressing head 10, the interval between the pressing heads 10 arranged in line symmetry with the main frame 20 in between (ie, the arrangement interval in the Y-axis direction) is the same as the interval B. Further, the spacing pitch P of the arrangement of the pressing heads 10 in the X-axis direction can be set to the same spacing as the spacing A by the head pitch varying mechanism 31.

As a result, the Y-axis direction moving mechanism 33 moves the first stage 35 and the second stage 36 back and forth in the Y-axis direction, and the first stage 35 and the second stage 36.
The first stage 35 and the second stage 36 are positioned so that the electronic heads 1 on the first row on the circuit boards 3 fixed to each other can be simultaneously pressed by the pressing heads 10. In the same manner, the first stage 35 and the second stage 3 can be similarly placed at positions where the respective electronic components 1 on the respective second rows can be simultaneously pressed.
6 can be located.

The distance between the pressing heads 10 arranged in line symmetry with the main frame 20 interposed (that is, the arrangement interval in the Y-axis direction) is variable while maintaining the above arrangements in line symmetry. It may be a case where another interval variable mechanism that can be provided is further provided in the main frame 20. In such a case, even if the distance B in the Y-axis direction between the respective first rows or the respective second rows of the respective circuit boards 3 differs depending on the type of the circuit board 3 or the like, The distance in the Y-axis direction of each of the pressing heads 10 can be changed by the other distance changing mechanism so as to match the distance B. In addition,
As an example of the above-mentioned other variable spacing mechanism, a mechanism using a ball screw mechanism composed of a ball screw shaft portion, a nut portion, a motor and the like, like the variable head pitch mechanism 31 and the X-direction moving mechanism 32, is used. is there.

As shown in FIG. 4 (A), each electronic component 1 is supplied to the component pressing and joining apparatus 101 with each solder bump 2 placed on each pad 3a of the circuit board 3. In order to maintain this arrangement state, a component support tray 6 which is an example of a component support mechanism attached to the circuit board 3 and supporting each electronic component 1 arranged on the circuit board 3 is attached to the circuit board 3. It is supplied to the component pressing and joining apparatus 101 in the state of being kept.

The component support tray 6 is formed such that the upper surface portion thereof is formed in a rectangular plate shape, and a pair of opposite end portions thereof is bent in a U shape. Circuit board 3
Of the component support tray 6 are releasably attached to the ends of the component support tray 6 facing each other in the Y-axis direction, so that the component support tray 6 covers the entire upper surface of the circuit board 3. It is possible to attach to 3.

FIG. 19 shows a partial plan view of the component support tray 6 in a state of supporting the electronic component 1. As shown in FIG. 19, in a state in which the component support tray 6 is attached to the circuit board 3 on which the electronic components 1 are arranged, the upper part of the electronic component 1 does not come into contact with the inside of the upper surface of the component support tray 6, On the upper surface of the component support tray 6, a plurality of cutouts 6b are formed in accordance with the arrangement positions of the electronic components 1. That is, even if a predetermined gap is provided between the cutout portion 6b and the electronic component 1 and the arrangement of the electronic component 1 with respect to the circuit board 3 is corrected, the electronic component 1 is It does not come into contact with the cutout portion 6b. Further, even when the electronic component 1 is pressed and joined by the suction nozzle 11, the suction nozzle 11 does not come into contact with the cutout portion 6b. Further, in the component support tray 6, the electronic component 1 is formed so as to be located inside each cutout portion 6b, and inside each cutout portion 6b, the electronic component located inside each cutout portion 6b. A plurality of supporting jigs 6a for releasably supporting 1 from two opposite side portions thereof are provided.
In the circuit board 3 in which the electronic components 3 are arranged in columns, it is possible to simultaneously support or release the support of the electronic components 1 for each row by the respective support jigs 6a. When supporting the electronic component 1, the support jig 6a projects from the inside of the notch 6b to the side of the electronic component 1 to support the side of the electronic component 1, and When the support is released, the support jig 6a is stored inside the cutout portion 6b.

As a result, the circuit board 3 can be supplied to the component pressing / bonding apparatus 101 while the arrangement of the electronic components 1 on the circuit board 3 is maintained by using the component support tray 6. It is possible to prevent the above-mentioned dislocation of each electronic component 1 from being displaced.

In the component support tray 6, the support of the electronic component 1 by the support jig 6a is not limited to the case where it is supported from the two opposite side portions, but the case where it is supported from the four side portions or the electronic component. It may be supported from the opposite corners of the electronic component 1 or from the upper surface of the electronic component 1, that is, by means that can achieve the purpose of holding the arrangement of each electronic component 1 on the circuit board 3. I wish I had it. Further, instead of collectively supporting or unsupporting each electronic component 1 for each row by the supporting jig 6a, individually supporting or unsupporting each electronic component 1 by the supporting jig 6a, or a circuit board Alternatively, the support or the release of the support for all the electronic components 1 arranged in 3 may be performed simultaneously.

In FIG. 3, the case where the bonding positions of the electronic components 1 to the circuit board 3 are arranged in 2 rows and 5 columns and at a constant interval A in the X-axis direction has been described. The arrangement of the joining positions of the electronic components 1 is not limited to the above arrangement, and may be, for example, 2 rows and 3 columns and X.
It may be arranged such that they are arranged at the interval 2A which is twice the interval A in the axial direction.

Since FIG. 3 is a diagram for the purpose of explaining the positional relationship between the electronic component 1, the circuit board 3, and the pressing head 10, the component support tray 6 is omitted for convenience.

Next, a method of joining each electronic component 1 onto the circuit board 3 using the component pressing and joining apparatus 101 will be described. In addition, below, the outline of the press-bonding method of the electronic component 1 will be described, and a detailed press-bonding method will be described later. Further, the bonding operation of the electronic component 1 described below is performed under the control of the control unit 9.

First, in FIG. 1, two circuit boards 3 in a state in which the arrangement of each electronic component 1 is held by the component support tray 6 attached to the circuit board 3 are mounted on the rails of the loader 37 at their respective ends. Part is supported, loader 37
Is moved rightward in the X-axis direction by the moving mechanism of
It is supplied and fixed onto the rails 35a and 36a of the first stage 35 and the second stage 36 on the slide base 34, respectively. It should be noted that details of a method of supplying each circuit board 3 to the first stage 35 and the second stage 36 by the loader 37 and a method of discharging each circuit board 3 from the first stage 35 and the second stage 36 by the unloader 38 will be described. The description will be given later.

Next, referring to FIG. 1, the Y-axis direction moving mechanism 3
The slide base 34 is moved leftward in the Y-axis direction in the figure by 3 and each pressing head 10 is moved in the X-axis direction in the figure by the X-axis direction moving mechanism 32, so that the circuit board 3 fixed to the first stage 35 is moved. Each electronic component 1 and the second stage 36 arranged in the first row in FIG.
The electronic components 1 arranged in the first row of the circuit board 3 fixed to the are aligned so that they can be simultaneously pressed by the pressing heads 10.

This alignment is carried out so that the reference position on the circuit board 3, which has been input in advance by the controller 9, is located at a predetermined position with respect to each pressing head 10. In addition, instead of such a case, the pressing head 10 includes an image pickup unit capable of recognizing the reference position on the circuit board 3, and the image pickup unit recognizes the reference position on the circuit board 3 for alignment. May be the case.

Further, at this time, when the spacing pitch of the array of the pressing heads 10 in the X-axis direction and the spacing A of the array of the electronic components 1 on each circuit board 3 in the X-axis direction are different from each other. That is, based on the data of the distance A of each circuit board 3 which is input in advance in the controller 9, the head pitch varying mechanism 31 causes each pressing head 10 to move.
The spacing pitch is varied so that the spacing pitches of the pressing heads 10 and the circuit board 3 match.

When the above alignment is completed, the movement operation in the X-axis direction moving mechanism 32 and the Y-axis direction moving mechanism 33 is stopped, and thereafter, as shown in FIG. The jigs 6a support the circuit boards 3 at the positions where the electronic components 1 arranged in the first row are arranged, in a released state. At this time, the support of the arrangement position of each electronic component 1 arranged in the second row on each circuit board 3 is not released but remains supported.

Thereafter, as shown in FIG. 4 (C), the respective lifting heads 19 of the respective pressing heads 10 individually and simultaneously lower the respective pressing heads 10 so that the tips of the respective suction nozzles 11 can be moved to the respective electronic parts. The top surface of each electronic component 1 is sucked and held by each suction nozzle 11 while being brought into contact with the top surface of the component 1. Further, by performing the lowering operation by the elevating unit 19, a pressing force is applied to each electronic component 1 so that each electronic component 1 simply placed on each circuit board 3 is placed.
The solder bumps 2 are securely pressed against the pads 3a of the circuit boards 3 to bring the solder bumps 2 into contact with the pads 3a.
It is in a state of being pressed against.

Here, "press contact" means a contact state in which the contact between the members is enhanced by applying a pressing force between the members. In the above case, the solder bump 2 and the pad 3
By pressing a, the shape of the solder bump 2 is deformed without being crushed, and is reliably brought into contact with the pad. Further, in this state, by applying an external force to the electronic component 1 or the circuit board 3, the electronic component 1 and the circuit board 3 are not destroyed and the electronic component 1 is not destroyed.
The contact state with the circuit board 3 can be easily released.

After this pressure contact, as shown in FIG.
In each of the pressing heads 10, the ceramic heater 12 individually heats the suction nozzles 11, and the suction nozzles 11 suck and hold the suction nozzles 11 and the pads 3 of the circuit board 3.
The melting and heating of each solder bump 2 of the electronic component 1 that is pressed against a is started. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised, and when the heating temperature reaches a temperature equal to or higher than the melting point of the solder forming each solder bump 2, the melting of each solder bump 2 is started. .

Here, "melting heating" means heating for the purpose of melting the solder by heating the bonding material such as the solder bumps 2 to a temperature equal to or higher than the melting point of the solder. Therefore,
The start of so-called preheating for the purpose of preliminarily heating the joining material to a certain temperature without melting it is different from the start of the above-mentioned melting heating.

After the solder bumps 2 are completely melted, as shown in FIG. 5 (E), the heating by the ceramic heaters 12 is stopped and the solder in the melted state is cooled and blown. Solidification cooling by cold air from the nozzles 14 is individually applied to solidify the solder. Due to the solidification of the solder, the first of the circuit boards 3 in FIG.
Each electrode 1a of each electronic component 1 arranged in a row and each pad 3a of each circuit board 3 are joined with solder interposed. It should be noted that instead of forcibly cooling the molten solder by the cooling blow nozzle 14 to solidify the solder, it may be possible to naturally cool the molten solder to solidify the solder. .

Thereafter, as shown in FIG. 5 (F), the suction holding of the electronic components 1 by the suction nozzles 11 of the respective pressing heads 10 is released, and the respective lifting heads 19 lift the respective pressing heads 10. Are raised individually.

Here, “individual” means each pressing head 1
That is, each operation of 0 is independently controlled with respect to the operation of another pressing head. For example, in each electronic component 1, the height of the solder bump 2 is different, and the circuit board 3
In the case where the height position of the upper surface of the electronic component 1 is different from that of the electronic component 1, the timing of the pressure contact by the respective pressing heads 10 is also different. This means that the melting and heating of the bump 2 is started at an independent timing.

Next, the slide base 34 is moved leftward in the Y-axis direction in the drawing by the Y-axis direction moving mechanism 33, and the slide base 34 shown in FIG.
Circuit board 3 fixed to the first stage 35 in
The electronic components 1 arranged in the second row and the electronic components 1 arranged in the second row of the circuit board 3 fixed to the second stage 36 are individually and simultaneously performed by the pressing heads 10. Positioning is performed so that it can be pressed manually. At this time, the electronic components 1 arranged in the respective second rows
Since the arrangement position is supported, the displacement of the arrangement position does not occur due to the movement of the circuit board 3.
After that, the support of each electronic component 1 in each of the second rows by each component support tray 6 is released, and the pressing and joining operation of each electronic component 1 arranged in the first row of each circuit board 3 is performed. Then, the above-mentioned work is performed, and each electrode of each electronic component 1 arranged in the second row of each circuit board 3 is bonded to each pad 3a of each circuit board 3 with solder interposed.

As a result, all the electronic components 1 arranged on the respective circuit boards 3 fixed to the first stage 35 and the second stage 36 are bonded to the respective circuit boards 3. .

Then, in FIG. 1, each circuit board 3
Is taken out onto the rail of the unloader 38 from the rails 35a and 36a of the first stage 35 and the second stage 36 on the slide base 34, and is moved rightward in the X-axis direction by the moving mechanism of the unloader 38, The respective circuit boards 3 are ejected from the component pressure bonding apparatus 101.

In the above description, the case where the bonding material is the solder bumps 2 formed in advance on the respective electrodes 1a of the electronic component 1 has been described, but instead of such a case, the bonding material is the electronic component 1. The solder bumps formed in advance on the electrodes 1a and the solder portions formed on the pads 3a of the circuit board 3 in the case of joining the solder bumps to the solder portions. Alternatively, the bonding material is each solder portion formed in advance on each pad 3a of the circuit board 3, and each electrode 1a of the electronic component 1 is interposed via each solder portion.
It may be a case where the and the pads 3a of the circuit board 3 are joined together. Further, instead of the solder bumps or the solder portions formed of the solder material, for example, bumps formed of a conductive metal material such as Au or Al may be used as the bonding material.

Further, on the electrodes 1a of the electronic component 1, on the pads 3a of the circuit board 3, or on the solder bumps 2 as a bonding material, the oxide film on the surface of each bonding portion is removed, and the molten solder is melted. A flux capable of improving the wettability of may be applied in advance and supplied. Depending on the type of flux applied and supplied, the electronic component 1 may be joined to the circuit board 3 and then the applied flux may be removed by cleaning.

Next, using the component pressure bonding apparatus 101,
A method of joining the heat spreader 5, which is an example of a component, to each of the electronic components 1 joined on the circuit board 3 will be described. The joining operation of the heat spreader 5 described below is performed by being controlled by the control unit 9.

6 and 7 show the electronic component 1 and the circuit board 3.
FIG. 6 is an explanatory view schematically showing a press-bonding procedure of the heat spreader 5, using a cross-sectional view schematically showing the heat spreader 5.

The heat spreader 5 is in the shape of a quadrangular plate, and is provided with a recess 5a at the center of the lower surface so as to cover the entire upper part of the electronic component 1.
In addition, a case where a large number of heat radiation fins for improving heat radiation may be formed on a part or the whole of the surface of the heat spreader 5.

As shown in FIG. 6 (A), on the back surface of each electronic component 1 bonded to the circuit board 3, each heat spreader 5 is supplied with the indium bonding material 4 which is an example of the bonding material inside the recess 5a. Are arranged via the indium bonding material 4. In order to hold the arrangement position of each heat spreader 5, a component support tray 7 having the same structure as the component support tray 6 and supporting each heat spreader 5 is attached to the circuit board 3. The "arrangement" of the heat spreader 5 is synonymous with the "arrangement" of the electronic component 1 described above.

Similar to the component support tray 6, the component support tray 7 is formed such that its upper surface portion is formed in a square plate shape, and a pair of opposing end portions is bent in a U shape. . In addition, the U-shaped end portions of the component support tray 7 are releasably attached to the end portions of the circuit board 3 facing each other in the Y-axis direction, so that the component support is covered so as to cover the entire upper surface of the circuit board 3. The tray 7 can be attached to the circuit board 3.

FIG. 20 shows a partial plan view of the component support tray 7 in a state of supporting the heat spreader 5. Figure 20
As shown in FIG. 5, in the state where the component support tray 7 is attached to the circuit board 3 on which each heat spreader 5 is arranged, the upper part of the heat spreader 5 is located above the component support tray 7.
A plurality of cutouts 7b are formed on the upper surface of the component support tray 7 so as not to come into contact with the inside of the upper surface of the heat spreader 5. That is, in the case where a predetermined gap is provided between the cutout portion 7b and the heat spreader 5, the arrangement of the heat spreader 5 with respect to the electronic component 1 (which is also the arrangement with respect to the circuit board 3) is corrected. Even if there is, the heat spreader 5 does not come into contact with the cutout portion 7b. Further, even when the heat spreader 5 is pressed and joined by the suction nozzle 11, the suction nozzle 11 does not come into contact with the cutout portion 7b. Furthermore, in the component support tray 7, the heat spreader 5 is formed so as to be located inside each cutout portion 7b, and inside each cutout portion 7b, the heat spreader 5 located inside each cutout portion 7b is formed. A plurality of supporting jigs 7a that releasably support the two side portions facing each other are provided, and in the circuit board 3 in which the heat spreaders 5 are arranged in the above-mentioned 2 rows and 5 columns, each heat spreader 5 for each row is arranged. It is possible to simultaneously support or release the support by the respective support jigs 7a. When supporting the heat spreader 5, the support jig 7a is provided with the cutout portion 7b.
In order to support the side portion of the heat spreader 5 by projecting to the side portion side of the heat spreader 5 from the inner side of the heat spreader 5 and to release the support of the heat spreader 5, the support jig 7a is stored inside the cutout portion 7b.

As a result, the circuit board 3 can be supplied to the component pressing and bonding apparatus 101 while maintaining the arrangement of the heat spreaders 5 on the circuit board 3 by using the component support tray 7. In the above, it is possible to prevent the displacement of the above-mentioned arrangement of each heat spreader 5.

First, referring to FIG. 1, each heat spreader 5 is mounted by the component support tray 7 attached to the circuit board 3.
The two circuit boards 3 in the state where the arrangement of FIG. 2 is held are moved to the right in the X-axis direction in the figure by the moving mechanism of the loader 37 while each end portion is supported on the rails of the loader 37, and the slide base is moved. It is supplied and fixed on the rails 35a and 36a of the first stage 35 and the second stage 36 on 34.

Next, referring to FIG. 1, the Y-axis direction moving mechanism 3
A circuit fixed to the first stage 35 in FIG. 3 by moving the slide base 34 leftward in the Y-axis direction in the figure by 3 and moving each pressing head 10 in the X-axis direction in the figure by the X-axis direction moving mechanism 32. Each heat spreader 5 arranged on the upper surface of each electronic component 1 in the first row of the board 3 and each upper surface of each electronic component 1 in the first row of the circuit board 3 fixed to the second stage 36. Each heat spreader 5 to each pressing head 10
Positioning is performed so that they can be pressed simultaneously by.

This alignment is performed so that the reference position on the circuit board 3 previously input by the control unit 9 is located at a predetermined position with respect to each pressing head 10. In addition, instead of such a case, the pressing head 10 includes an image pickup unit capable of recognizing the reference position on the circuit board 3, and the image pickup unit recognizes the reference position on the circuit board 3 for alignment. May be the case.

At this time, the spacing pitch of the array of the pressing heads 10 in the X-axis direction and the spacing pitch of the array of the heat spreaders 5 on each circuit board 3 in the X-axis direction (that is, the X-axis of each electronic component 1). In the case where the spacing A) of the arrangement in the direction is different, the head pitch varying mechanism 31 uses the head pitch varying mechanism 31 based on the data of the spacing A of each circuit board 3 which is input in advance in the controller 9. The spacing pitch of the pressing heads 10 is varied so that the spacing pitches of the pressing heads 10 and the circuit board 3 match.

When the above-mentioned alignment is completed, the movement operation in the X-axis direction moving mechanism 32 and the Y-axis direction moving mechanism 33 is stopped, and thereafter, as shown in FIG. The jigs 7a support the heat spreaders 5 arranged in the first row at the positions where the heat spreaders 5 are arranged, and release the support. At this time, the support of the arrangement position of each electronic component 1 arranged in the second row on each circuit board 3 is not released but remains supported.

Thereafter, as shown in FIG. 6 (C), the respective lifting heads 19 of the respective pressing heads 10 individually and simultaneously lower the respective pressing heads 10 so that the tips of the respective suction nozzles 11 are brought into contact with the respective heat spreaders. The upper surface of each heat spreader 5 is sucked and held by each suction nozzle 11 while being brought into contact with the upper surface of the heat spreader 5. Further, by performing the lowering operation by the elevating unit 19, a pressing force is applied to each heat spreader 5 so that the bottom surface of the inside of the recess 5a of each heat spreader 5 that is simply arranged on each electronic component 1 is moved to each electronic component 1 The indium bonding material 4 is intervened over substantially the entire upper surface of the to ensure a surface contact and press contact.

After this pressure contact, as shown in FIG.
In each of the pressing heads 10, the ceramic heater 12 individually heats the suction nozzles 11 to melt and heat the indium bonding materials 4 inside the recesses 5a of the heat spreaders 5 held by the suction nozzles 11. . Further, the suction nozzle 1 by the ceramic heater 12
The heating temperature to 1 is raised, and when the heating temperature reaches a temperature equal to or higher than the melting point of the indium bonding material 4, melting of the indium bonding material 4 is started.

Here, when the indium bonding material 4 is melted and heated, the solder bonding the electronic component 1 to the circuit board 3 is also heated, but the indium bonding material 4 has a melting point of about 1%.
While it is formed of indium at 60 ° C. to 180 ° C., for example, by using high-temperature solder having a melting point of about 230 ° C. for the solder joining the electronic component 1 to the circuit board 3, adsorption by the ceramic heater 12 is performed. By raising the heating temperature to the nozzle 11 to a temperature in the range above the melting point of indium but below the melting point of the high-temperature solder, the solder joining the electronic component 1 to the circuit board 3 is melted again. There is no such thing. Therefore, the electronic component 1 and the circuit board 3
It is possible to perform the pressure bonding to the electronic component 1 via the indium bonding material 4 of the heat spreader 5 without affecting the bonding via the solder.

After each indium bonding material 4 is completely melted, as shown in FIG. 7E, heating by each ceramic heater 12 is stopped, and the above-mentioned molten state is passed through each heat spreader 5. Each indium bonding material 4 is individually solidified and cooled by the cold air from each cooling blow nozzle 14, and each indium bonding material 4 is solidified. Due to the solidification of the indium bonding material 4, the heat spreader 5 is bonded to the upper surface of each electronic component 1 bonded to the first row of the circuit board 3 with the indium bonding material 4 interposed. When the molten indium bonding material 4 is solidified by natural cooling, instead of the case where the indium bonding material 4 is solidified by the cooling blow nozzle 14 forcibly cooling the indium bonding material 4 in the molten state. May be

Thereafter, as shown in FIG. 7 (F), the suction holding of the heat spreader 5 by the suction nozzles 11 is individually released in the respective pressing heads 10, and the respective lifting heads 19 are used to move the respective pressing heads 10 above. Increase individually.

Next, the slide base 34 is moved leftward in the Y-axis direction in the figure by the Y-axis direction moving mechanism 33, and the slide base 34 shown in FIG.
Circuit board 3 fixed to the first stage 35 in
Each heat spreader 5 arranged on the upper surface of each electronic component 1 joined to the second row of the second stage 36 and the second stage 36.
The heat spreaders 5 arranged on the upper surface of the respective electronic components 1 joined to the second row of the circuit board 3 fixed to each other are aligned so that they can be individually and simultaneously pressed by the respective pressing heads 10. I do. At this time, since the arrangement positions of the heat spreaders 5 arranged in the respective second rows are in a supported state, the displacement of the arrangement positions does not occur due to the movement of the circuit board 3. afterwards,
The support spread of the heat spreaders 5 in the respective second rows by the component support trays 7 is released, and the pressing and joining operation of the heat spreaders 5 arranged on the upper surfaces of the electronic components 1 in the first row of the circuit boards 3 is performed. Similarly to the above, the above work is performed to bond the heat spreaders 5 to the upper surfaces of the electronic components 1 in the second row of the circuit boards 3 with the indium bonding material 4 interposed therebetween.

As a result, the heat spreaders 5 arranged on the upper surfaces of the electronic components 1 of the circuit boards 3 fixed to the first stage 35 and the second stage 36 are joined together.

Then, in FIG. 1, each circuit board 3
The first stage 35 and the second stage on the slide base 34.
The unloader 38 is taken out from the rails 35a and 36a of the stage 36 onto the rail of the unloader 38.
Is moved rightward in the X-axis direction by the moving mechanism of
The respective circuit boards 3 are ejected from the component pressure bonding apparatus 101.

In the above description, the case where the indium bonding material 4 as the bonding material is supplied in advance inside the recess 5a of the heat spreader 5 has been described. However, the electronic component in which the bonding material is bonded to the circuit board 3 is described. 1 may be pre-supplied to the upper surface of the heat spreader 1, or may be pre-supplied both to the inside of the recess 5 a of the heat spreader 5 and the upper surface of the electronic component 1.

Next, the structure of the pressing head 10 in the component pressing and bonding apparatus 101 will be described in detail with reference to FIG. 2 which is a sectional view showing the structure of the pressing head 10 (a sectional view seen from the X-axis direction in FIG. 1). explain.

In FIG. 2, the pressing head 10 includes a pressing head lower portion 10a for performing a pressing operation, a suction holding operation, a heating / cooling operation, etc. on the electronic component 1 or the heat spreader 5, and a pressing head for raising and lowering the pressing head lower portion 10a. Top 1
It is composed of 0b.

The lower part of the pressing head 10a is arranged in order from the lower tip side thereof to the upper side thereof in order of the electronic component 1 or the heat spreader 5.
A suction nozzle 11 capable of suction-holding and pressing and a suction nozzle 1 by heating the suction nozzle 11.
Electronic component 1 or heat spreader 5 adsorbed and held by
The ceramic heater 12 that heats the water, the water jacket 13 that is an example of a heat insulating portion that shuts off heat from the ceramic heater 12 so as not to be transferred to the upper portion 10b of the pressing head, and the water jacket 13 that is attached to the upper portion of the water jacket 13. A shaft 15 that is an example of a shaft portion, a load cell 16 that is an example of a detection device that is attached to the upper portion of the shaft 15 and detects pressing force, and an electron that is attached to the lower periphery of the shaft 15 and that is heated by the ceramic heater 12. A cooling blow nozzle 14 for cooling the component 1 or the heat spreader 5 with cold air is provided.

The upper part 10b of the pressing head 10b carries out the ascending / descending operation of the lower part 10a of the pressing head along an ascending / descending operation axis S which is an axis along the Z-axis direction in FIG. Attached to and lift 1
9 and a head frame 18 that can be moved up and down on the ball screw shaft 19b.

The elevating part 19 includes an elevating part frame 19c having a substantially U-shaped vertical cross section formed of a rigid body,
A ball screw shaft portion 19b attached to the elevating frame 19c so as to rotate in the forward and reverse directions about the axis and with the axis substantially along the vertical direction, and the ball screw shaft portion 19b.
19d screwed to the lower part of the head frame 18 and fixed to the upper end of the elevating frame 19c and the upper end of the ball screw shaft 19b to fix the ball screw shaft 19b. The motor 19a which rotates forward and backward around the axis is provided. The axis of the ball screw shaft portion 19b is the lifting operation axis S of the lifting portion 19.

Further, the head frame 18 is formed of a rigid body and has a substantially cylindrical shape, and the lower portion of the ball screw shaft portion 19b of the elevating portion 19 is penetrated in the upper portion of the cylindrical inner portion. It is attached to the nut portion 19d.

On the right side of the head frame 18 in the figure, one end of the self-weight canceling spring 17, which is an example of an elastic body, is attached, and a spring receiving portion 18a is formed in which a protruding portion is formed. Has been done.

Further, a spring receiving portion 15a having a protruding portion is formed on the upper side portion on the right side of the shaft portion 15 in the lower portion of the pressing head 10a in the figure, and the self weight counterbalance spring 17 is formed on the spring receiving portion 15a. The other end of is attached. Each of the spring receiving portions 18a
Self-weight offset spring 1 whose both ends are fixed to 15 and 15a
7, the weight of the lower portion of the pressing head 10a is offset, and the head frame 18 supports the lower portion of the pressing head 10a.

Further, in FIG. 2, in the component pressing and joining apparatus 101, the gate-shaped main frame 20 is used.
Is fixed to the other end of each of the two rigid bodies whose one end is fixed to the machine base and the other end of each of the two rigid bodies in the lateral direction. The rigid body in the form of a rectangular prism forms a gate-shaped first frame 20a, and both ends of the first frame 20a are fixed to the two rigid bodies of the first frame 20a and the lateral direction of the first frame 20a. Second frame 20b, which is a prismatic rigid body provided below the rigid body of the first frame, and both ends of the two rigid bodies of the first frame 20a, which are provided below the second frame 20b and similarly to the second frame 20b. The third frame 20c has a fixed portion.

Further, as shown in FIG. 2, the LM rail 21 is fixed to the elevating part frame 19c along the elevating and lowering operation axis, and is engaged with the LM rail 21 and moves above the LM rail 21. The LM block 22 movable in the direction along S (that is, the Z-axis direction) is the head frame 1
8 is fixed to the left end in the drawing. Here, the LM rail and the LM block are examples of members that form a linear movement mechanism, and the LM rail and the L that are substantially linear rails.
The LM block engaged with the M rail makes it possible to move the LM block along the LM rail, that is, substantially linearly. As a result, the head frame 18
Can be moved up and down along the lifting operation axis S.

Further, in FIG. 2, the main frame 20
A pair of upper and lower LM rails 23 are fixed on the right side of the second frame 20b in the figure along the X-axis direction in FIG.
An LM rail 21 fixed to the elevating frame 19c is fixed to the M block 24. Since each LM block 24 is movable along each LM rail 23, the pressing head upper portion 10b is movable along the X-axis direction.

Further, in FIG. 2, the main frame 20
Similarly to the second frame 20b, the LM rail 2 is provided on the right side of the third frame 20c in the drawing along the X-axis direction.
5 is fixed, and the LM block 2 is engaged on the LM rail 25 so as to be movable along the LM rail 25.
6 is another LM along the direction of the lifting operation axis S.
The rail 27 is attached, and further, the LM block 28 engaged on the LM rail 27 so as to be movable along the LM rail 27 (that is, movable along the above-mentioned lifting operation axis S) is attached to the lower part 10a of the pressing head. The shaft 15 is fixed on the left side in the figure. LM block 28 is L
Since the shaft 15 can be moved along the M rail 27, the shaft 15 can be moved up and down along the lifting operation axis S, and the LM block 26 can be moved along the LM rail 25. As a result, the shaft 15 can move along the X-axis direction. That is, the pressing head lower portion 10a can be moved up and down along the elevating operation axis S, and the pressing head 10b can be moved along the X-axis direction.
It is possible to move with it.

Also, the LM rail 27 and the LM block 2
8 can guide the lifting / lowering operation of the shaft 15, and limits the lower end of the lifting / lowering operation of the shaft 15. As a result, the shaft 15 is supported by the head frame 18 via the self-weight canceling spring 17, and the LM rail 27 and L
Guided by the M block 28, the ascending / descending operation is possible, and the self-weight counterbalance spring 17 is damaged and the shaft 1
Even when it becomes impossible to support the shaft 5, the LM rail 27 and the LM block 28 can support the shaft 15 at the lower end of the ascending / descending operation thereof.
5 can be prevented from falling.

Further, with the pressing force detecting surface as the upper surface, the shaft 1
The load cell 16 attached to the upper part of the load cell 5 is attached to the head frame 18 and supported by the self-weight counterbalance spring 17 supporting the shaft 15. It is said that it has been As a result, the load cell 16
On the load detection surface of the shaft 15 of the pressing head lower portion 10a.
The pressing force acting upward in the Z-axis direction can be detected.

Further, in the elevating part 19, the motor 19a
By rotating the ball screw shaft portion 19b in the forward and reverse directions by the head frame 18 fixed to the nut portion 19d and fixed in the forward and reverse rotation directions by the LM rail 21 and the LM guide 22, the head frame 18 is moved to the lifting operation shaft S. Although the lifting head is moved up and down along with the lifting head, the lifting head lower part 10a including the load cell 16 that is always in contact with the lower end of the head frame 18 also moves up and down along the lifting axis S. To be done.

Further, the suction nozzle 11, the ceramic heater 12, the water jacket 13, the cooling blow nozzle 1
4, shaft 15, load cell 16, and head frame 18
The centers of each are arranged on the same axis, and this axis is
Since the suction nozzle 1 is arranged so as to coincide with the lifting operation axis S of the suction nozzle 1,
1, ceramic heater 12, water jacket 1
3, cooling blow nozzle 14, shaft 15, and load cell 1
6 can be moved up and down on the vertical movement axis S.

The upper portion of the pressing head 10b is supported by the second frame 20b of the main frame 20 via the LM rail 21, the LM block 24 and the LM rail 23, while the lower portion of the pressing head 10a is a self-weighted canceling spring. It is supported by the pressing head upper part 10 b via 17. Therefore, the weight of the pressing head 10 is added to the second frame 20b, and each pressing head 1
Although it may be possible that the second frame 20b is slightly bent due to its own weight of 0, in the third frame 20c having a structure in which the own weight is not added, the deflection is as long as it is compared with the bending of the second frame 20b. Rarely occurs. When the bending occurs in the second frame 20b, the pressing head upper portion 10b
The lifting operation axis S in FIG. 2 is tilted from the substantially vertical direction according to the deflection, but the pressing head lower part 10a is separated from the pressing head upper part 10b, and the lifting operation axis S of the pressing head 10a. Since the third frame 20c that guides the upward and downward movement does not bend, the upward and downward movement of the pressing head lower portion 10a is performed by the deflection of the second frame 20b, that is, each pressing head 1
It is not affected by its own weight of zero. Therefore, in the lower part 10a of the pressing head, it is possible to always perform an ascending / descending operation along a substantially vertical direction, and it is possible to always keep the tip end surface of the suction nozzle 11 and the first stage 35 and the second stage 36 substantially parallel to each other. It is possible to perform the pressing operation of the component accurately.

Further, the lower shaft portion 15 which is the periphery of the lower shaft portion 15
cooling blow nozzle 14 mounted around b
Is a water jacket 13 located below the shaft 15.
Further, the cooling blow nozzle 14 is formed so as to wrap around the side surface of the ceramic heater 12, and the tip of the cooling blow nozzle 14 is directed to the suction holding surface of the component, which is the lower surface of the suction nozzle 11, and the cool air from the cooling blow nozzle 14 is sucked by the suction nozzle. 11
It is possible to cool the electronic component 1 or the heat spreader 5 that is adsorbed and held by the heat spreader 5.

The control section 9 controls the suction operation of the suction nozzle 11, the heating operation of the ceramic heater 12, the cooling operation of the cooling blow nozzle 14 and the movement operation of the elevating section 19, and the pushing operation detected by the load cell 16 is controlled. The pressure is output to the control unit 9, and the operation of the elevating unit 19 and the like are controlled based on the pressing force.

Here, FIG. 15 shows a control system diagram in the component pressing and joining apparatus 101. In the component pressing / bonding apparatus 101, the control unit 9 moves up / down by the motor 19a of the lifting / lowering unit 19, which is the operation of each component of the component pressing / bonding apparatus 101, the heating operation of the ceramic heater 12, the cooling operation of the cooling blow nozzle 14, The suction operation of the suction nozzle 11, the movement operation of the X-direction movement mechanism 32 by the motor, the movement operation of the head pitch variable mechanism 31 by the motor, and the Y-direction movement mechanism 3
The movement operation by the motor of No. 3 and the movement operation by the motor of the movement mechanism of the loader 37 and the unloader 38 are controlled, and the pressing force detected by the load cell 16 is output to the control unit 9. As a result, each of the above-described constituent parts, which are the controlled parts of the control part 9, are controlled by the control part 9 while being related to each other.
At, the electronic component 1 and the heat spreader 5 are bonded to the circuit board 3.

Next, the pressing force in the Z-axis direction is generated by the load cell 16 of the pressing head 10 when the electronic component 1 and the circuit board 3 are pressure-contacted with each other or when the heat spreader 5 and the electronic component 1 are pressure-contacted with each other. A method of detecting the bonding pressing force will be described. Since the pressing force detection method is the same when the electronic component 1 and the circuit board 3 are pressure-contacted and when the heat spreader 5 and the electronic component 1 are pressure-contacted, the electronic component 1 and the circuit board 3 will be described below.
Only the case of the above pressure contact will be described.

First, after aligning each pressing head 10 with each electronic component 1 arranged on each circuit board 3 which is supplied and fixed to the first stage 35 and the second stage 36, The pressing heads 10 are individually and simultaneously lowered by the respective lifting / lowering portions 19, and the solder bumps 2 of the electronic components 1 are pressed and pressed against the pads 3a of the circuit board 3.

At this time, the head frame 18 is lowered by the elevating part 19 of each pressing head 10, and the lower end of the head frame 18 which is always in contact with the pressing force detection surface of the load cell 16 pushes down the load cell 16. That is, the reaction force of the joint pressing force generated between each solder bump 2 of the electronic component 1 and each pad 3a of the circuit board 3 presses the pressing force detecting surface of the load cell 16 against the lower end of the head frame 18. Load cell 16
Detected at.

In this way, the joining pressing force is detected in the load cell 16, the joining pressing force detected by the load cell 16 is output to the control unit 9, and the joining pressing force is preset in the control unit 9. The control unit 9 sets a predetermined joining pressure (hereinafter, referred to as a set pressure).
Thus, the lowering operation of the pressing head 10 by the elevating part 19 is controlled. When the load cell 16 detects that the joining pressing force reaches the set pressing force, the control unit 9
In, it is considered that each solder bump 2 of the electronic component 1 is pressed against each pad 3 a of the circuit board 3.

A predetermined allowable range is provided for the set pressing force, and the joining pressing force is set within the control unit 9 by setting the joining pressing force within the allowable range of the set pressing force. It is considered that the pressing force has been reached.

With respect to the pressure bonding method and the pressure bonding apparatus according to the present embodiment having the above-described structure and method, the bonding procedure is summarized in the flowchart shown in FIG. The operation instruction in each step in the above flow chart is given by the control unit 9.

In step S1 in FIG. 8, each pressing head 10 is pressed so that the upper surface of each electronic component 1 having the solder bumps 2 arranged on each pad 3a of the circuit board 3 can be pressed.
And electronic components 1 are aligned with each other.

Then, in step S2, the control unit 9
Accordingly, the respective pressing heads 10 are lowered by the respective elevating units 19, and in step S3, the tip of the suction nozzle 11 of each pressing head 10 is brought into contact with the upper surface of the electronic component 1, and each solder bump of each electronic component 1 is contacted. 2 is pressed against each pad 3a of the circuit board 3 and the generated bonding pressing force is detected by the load cell 16 of each pressing head 10, while the control unit 9
Thus, the lowering operation of each pressing head 10 by each elevating part 19 is controlled so that the joining pressing force reaches the set pressing force (within the allowable range of the setting pressing force), and the pressing is performed with the setting pressing force. Thus, each solder bump 2 is pressed against each pad 3a.

Then, in step S4, the control unit 9
Thus, by starting the melting and heating of the solder bumps 2 of the electronic components 1 in the pressure contact state by the ceramic heater 12 of the pressing heads 10, the solder bumps 2 are melted. Then, in step S5, the control unit 9
Thus, the solidified cooling of the melted solder by the cooling air of the cooling blow nozzle 14 is started, and in step S6, the melted solder is solidified, and each electrode 1a of each electronic component 1 is soldered to each pad 3a of the circuit board 3. And interpose.
Then, in step S7, the controller 9 releases the suction holding of the pressing nozzles 10 of the pressing heads 10 to the electronic component 1.

The solidification cooling of the melted solder in step S5 may be natural cooling instead of cooling the cooling blow nozzle 14 with cold air. Further, in the above-mentioned flowchart, the procedure for joining the electronic component 1 onto the circuit board 3 is described. However, the heat spreader 5 is attached to the electronic component 1 joined onto the circuit board 3.
The joining procedure of the case of joining is summarized in the flowchart shown in FIG. As shown in FIG. 9, the joining procedure is the same as the joining procedure shown in FIG.

Next, in place of the press-bonding procedure shown in the flow charts of FIGS. 8 and 9, after detecting the press-contact between each solder bump 2 of the electronic component 1 and each pad 3a of the circuit board 3, or by the heat spreader. In the case where constant control of the bonding pressing force by the pressing head 10 is performed after the pressure contact of the indium bonding material 4 between the electronic component 1 and the electronic component 1 is detected, further, the suction nozzle after melting each solder bump 2 or the indium bonding material 4. A case where the tip height position control of 11 is performed will be described.

Each solder bump 2 of the electronic component 1 and the circuit board 3
After the pressure contact with each of the pads 3a is detected, or after the pressure contact with the heat spreader 5 and the indium bonding material 4 of the electronic component 1 interposed, the bonding pressure detected by the load cell 16 is equal to a preset pressing force. Ascending / descending part 19
Is controlled by the control unit 9 so that the pressing head 10 makes the joining pressing force applied to the electronic component 1 and the circuit board 3 or the heat spreader 5 and the electronic component 1 constant so that the pressing head 10 performs constant pressing force control. Be seen. However, the suction nozzle 11 is heated by the ceramic heater 12,
Each solder bump 2 of the electronic component 1 or indium bonding material 4
When is melted, if the pressing force of the pressing head 10 is kept constant as described above, the tip position of the suction nozzle 11 is lowered, and the solder bumps 2 or the indium bonding material 4 in a molten state are melted. The above-mentioned constant pressing force is applied as an excessive pressing force, which may cause a problem that the solder bumps 2 or the indium bonding material 4 are excessively crushed.

In the case of solving such a problem, it is necessary to control the height of the upper surface of the electronic component 1 after melting each solder,
That is, the position of the joining height of the electronic component 1 to the circuit board 3 is surely controlled, or the height of the upper surface of the heat spreader 5 after the melting of the indium bonding material 4 is controlled, that is, the heat spreader 5 is attached to the electronic component 1. For the purpose of surely managing the joint height position, after being heated by the ceramic heater 12 and the temperature of the suction nozzle 11 starts to rise,
In the state of constant pressing force control by the pressing head 10,
The load cell 16 detects the bonding pressing force, and when the controller 9 detects the decrease in the bonding pressing force, it is determined that the melting of each solder or the indium bonding material 4 has started, and the pressing force of the pressing head 10 is kept constant. From control, suction nozzle 1
By switching to the joint height position constant control in which the tip height position of 1 is made constant, the tip height position of the suction nozzle 11 is made constant during melting of each solder or indium bonding material 4, and the above-mentioned joint height position is maintained. Can be reliably managed. Therefore, it is possible to prevent the solder bumps 2 or the indium bonding material 4 from being excessively crushed without applying a bonding pressing force to the molten solder bumps 2 or the indium bonding material 4 as an excessive pressing force. You can The decrease in the welding pressure detected by the control unit 9 means that the welding pressure detected by the load cell 16 becomes smaller than the allowable range of the set pressure.

Each pressing head 10 configured as described above
The operation procedure of the constant pressing force control and the tip height position control of the suction nozzle 11 in FIG. FIG. 10 is a flowchart showing the procedure of the component pressing and joining method of the present embodiment in FIGS. 8 and 9, in which the pressing is performed during steps S3 to S5 in FIG. 8 and steps S13 to S15 in FIG. Head 10
7 is a flowchart showing the procedure of operations of the pressing force constant control and the tip height position control of the suction nozzle 11. The operation instruction and judgment in each step are performed by the control unit 9.

First, in step S3 in FIG. 10, the load cell 16 detects the bonding pressing force, and when it is detected that the bonding pressing force reaches the set pressing force, the solder bumps 2 of the electronic component 1 are connected to each other. After the pressure contact of each pad 3a of the circuit board 3 is detected, or in step S13, the load cell 16 detects the bonding pressing force, and it is detected that the bonding pressing force reaches the set pressing force. After the pressure contact between the heat spreader 5 and the indium bonding material 4 of the electronic component 1 is detected, step S2
At 0, the temperature rise of the suction nozzle 11 is started by heating the ceramic heater 12.

Next, in step S21, the elevating part 1
By controlling the descending operation of 9 slightly, the pressing force of the pressing head 10 is controlled to be constant, and the pressing head 10 keeps the electronic component 1 and the circuit board 3 constant or the heat spreader 5 and the electronic component 1 constant. The pressing force of, that is, a predetermined set pressing force is applied.

During this constant pressing force control, the load cell 16
In the step S22, when the controller 9 detects a decrease in the welding pressure detected by the load cell 16, that is, the welding pressure is set. If the pressure falls below the allowable range, it is determined that the melting of each solder or the melting of the indium bonding material 4 has started, and in step S23, the control unit 9 controls the pressing force of the pressing head 10 to be constant. From, the control method is switched to the constant control of the height position of the tip of the suction nozzle 11. afterwards,
In step S24, the control unit 9 causes the elevating unit 19 to move.
The vertical movement of the electronic component 1 or the indium bonding material 4 adsorbed and held by the adsorption nozzle 11 whose tip height position is kept constant is made constant by controlling the vertical movement of Until it is confirmed by the unit 9 that the temperature rise of the suction nozzle 11 due to the heating stop of the ceramic heater 12 is completed (for example, the heating operation is performed for a predetermined time from the start of the pressure contact detection or the tip height position constant control). And the temperature rise is completed when the above predetermined time has elapsed),
The joint height position constant control is performed so that the tip height position of the suction nozzle 11 is constant. In step S25, when it is confirmed by the control unit 9 that the temperature rise of the suction nozzle 11 is completed, in step S5, each melted state is performed while the above-described constant joining height position control is continuously performed. In the step of cooling the solder, or in step S15, cooling of the indium bonding material 4 that has been melted while the above-described constant bonding height position control is continuously performed is started. On the other hand, if it is not confirmed in step S25 that the temperature rise has been completed (for example, if the predetermined time has not elapsed), the ceramic is controlled in a state in which the tip height position is constantly controlled. The heating by the heater 12 is continuously performed.

On the other hand, in step S22, when the decrease in the pressing force detected by the load cell 16 is not detected, it is determined by the controller 9 that the melting of each solder or the melting of the indium bonding material 4 has not been started yet. In step S26, the control unit 9 confirms whether or not the temperature rise of the suction nozzle 11 due to the heating stop of the ceramic heater 12 is completed (for example, the heating operation is performed for a predetermined time from the detection of the pressure contact). In such a case, if it is confirmed that it has not been completed (by checking whether the above specified time has elapsed, etc.),
Again, returning to step S21, the control unit 9 continues the above-mentioned constant pressing force control of the pressing head 10. In step S26, the ceramic heater 1 is controlled by the control unit 9.
When it is confirmed that the temperature rise of the suction nozzle 11 due to the heating stop of No. 2 is completed (when the elapse of the predetermined time is confirmed, etc.), the controller 9 controls the pressing head 10 to press the pressing head 10 in step S27. The control method is switched from the constant pressure control to the constant control of the tip height position of the suction nozzle 11. In step S28, the control unit 9 sucks and holds the suction nozzle 11 whose tip height position is constant. Electronic component 1 or indium bonding material 4
The height of the upper surface of the solder is constant, and in step S5, the controller 9 cools each solder melted in the state where the control of the constant bonding height position is continuously performed, or step S5.
At 15, the controller 9 starts cooling the melted indium bonding material 4 while the above-described constant bonding height position control is continuously performed.

In step S3, the electronic component 1
When the pressure contact between each solder bump 1b and each solder portion of the circuit board 4 is detected, or when the pressure contact between the heat spreader 5 and the indium bonding material 4 of the electronic component 1 is detected in step S13, When some of the solder bumps 2 are not in contact with each other due to variations in the height of the solder bumps 2 or variations in the height of the indium bonding material 4 inside the concave portion of the heat spreader 5 (that is, , The solder bump 2 is the pad 3a of the circuit board 3
In the indium bonding material 4), or in the indium bonding material 4 where there is no partial contact (that is, the indium bonding material 4 is the upper surface of the electronic component 1 or the recess 5a of the heat spreader 5). There is a case where there is not a partial contact with the inner bottom surface, but there is a part that does not. In such a case, if the electronic component 1 is heated as it is to melt the solder bumps 2 and the electronic component 1 is bonded to the circuit board 3, the solder bumps 2 that have not been brought into contact with each other become defective in bonding. There is a possibility that a problem may occur in that the electronic component 1 and the circuit board 3 are not joined properly. Also, heat spreader 5
In the above, when the heat spreader 5 is heated as it is to melt the indium bonding material 4 and the heat spreader 5 is bonded to the electronic component 1, due to a bonding failure in a portion of the indium bonding material 4 where the above contact is not performed partially. There is a possibility that air gaps will be generated and heat generated during the operation of the electronic component 1 will not be easily transferred to the heat spreader 5 through the indium bonding material 4, and the original heat spreader 5 will not be able to exhibit the heat dissipation function. There is.

In the case of solving such a problem, the preset pressing force is preset to a force that can deform the solder bump 2 or the indium bonding material 4 without crushing it. By applying the set pressing force to each solder bump 2 or the indium bonding material 4 in the constant pressing force control of the pressing head 10 in step S21, the shape of each solder bump 2 is deformed and each pad 3a is deformed. It is possible to improve the contact property or to improve the contact property to the upper surface of the electronic component 1 or the inner bottom surface of the recess 5 a of the heat spreader 5 while deforming the shape of the indium bonding material 4. Therefore, the electronic component 1 can be reliably joined to the circuit board 3, or the heat spreader 5 can be reliably joined to the electronic component 1.

In the pressure bonding operation by each pressure head 10, for example, when some electronic components 1 are not arranged on the circuit board 3 where the electronic components 1 should be arranged in the above-mentioned 2 rows and 5 columns. Alternatively, it is found immediately after the above-mentioned press-joining that the electronic component 1 press-bonded to the circuit board 3 includes the defective electronic component 1, and the heat spreader 5 is attached to the defective electronic component 1. When it is not necessary to join the above, the pressing heads 1 as they are
When the pressure bonding operation is performed with 0, the bonding pressure is not detected only in the pressure head 10 corresponding to the above. Therefore, when the pressing head 10 corresponding to the above is known in advance, the control unit 9 identifies the circuit board 3 as the individual data of the circuit board 3 and the identification data of the electronic component 1 and the like on the circuit board 3. Etc. are input, and the controller 9 determines the circuit board 3 and the electronic component 1 or the like corresponding to the above based on the input identification data, and with respect to the electronic component 1 or the like on the circuit board 3. Can be dealt with by not performing the pressing and joining operation of only the pressing head 10.

If the circuit board 3 and the electronic component 1 are not known in advance, the control unit 9 may be provided with a process control timer for the pressing and joining operation, and the like. The head 10 is also another pressing head 10.
At the same time, the pressing and joining operation is started, and it is confirmed by the process control timer whether or not the joining pressing force is detected in the pressing head 10 within a certain time. If the joining pressing force is not detected, It can be dealt with by assuming that an error has occurred in the pressure head 10 and performing the pressure bonding operation by the other pressure head 10 as it is, and completing the pressure bonding operation with respect to the circuit board 3.

Next, in the case where the electronic component 1 is bonded onto the circuit board 3 by each operation of each pressing head 10 described above, or when the heat spreader 5 is bonded to the electronic component 1, FIG. ) Is the height of the tip of the suction nozzle 11 of the pressing head 10, and FIG.
Temperature of the suction nozzle 11 of the pressing head 1 shown in FIG.
The time chart which shows the change state with respect to each time of operation of the cooling blow nozzle 14 of 0 is shown. In addition, FIG.
The time axis, which is the horizontal axis in each of (A) to (C), is the same time axis so that the above-described change states can be compared.

Further, in FIGS. 11A to 11C, t
0 to t6 indicate the time in the pressure bonding operation by the pressing head 10, t0 is the time starting point of the start of the pressure bonding operation by the pressing head 10, t1 is the completion time point of the primary lowering operation of the pressing head 10, and t2 is the pressing head. 10 is the completion time of the secondary descending operation and the pressure contact detection time, tm is the melting start time of the solder or indium bonding material 4, t3 is the solidification cooling start time of the solder or indium bonding material 4, and t4 is the pressing head 10. Of the pressing head 10, the time t5 is the time of starting the secondary rising operation of the pressing head 10, and the time t6 is the pressing head 1.
This is the time end point of the pressing and joining operation by 0. Also, T0,
T1, T2, and Tm are heating temperatures of the ceramic heater 12 of the pressing head 10, T0 is room temperature before starting heating operation, T1 is preheating temperature, Tm is melting point of solder or indium bonding material 4, and T2 is heating and melting. Is the temperature. Further, H0, H1 and H2 are the tip height positions of the suction nozzle 11, H0 is the upper end position of the lifting operation, H1 is the primary descending or primary raising height position, and H2 is the joining height position.

First, in the time section from time t0 to time t1 in FIGS. 11A to 11C, the pressing head 10 is moved by the elevating part 19 so that the tip height of the suction nozzle 11 is from H0 to H.
The temperature is lowered to 1 and the primary lowering operation is performed, preheating by the ceramic heater 12 is started, the temperature of the suction nozzle 11 is increased from T0 to T1, and the temperature of the suction nozzle 11 is maintained at the temperature T1. Is set At this time, the cooling blow nozzle 14 is in a stopped state.

Next, in the time section from time t1 to t2, the descending speed of the pressing head 10 is from the time t1 to t2.
Is weakened more than the time interval of, the pressing head 10 is gently lowered to perform the secondary lowering operation, and the tip height of the suction nozzle 11 is lowered from H1 to H2. At time t2, at the height H2, the tip portion of the suction nozzle 11 has the electronic component 1
Alternatively, the solder bumps 2 of the electronic component 1 are brought into contact with the upper surface of the heat spreader 5 and are brought into pressure contact with the pads 3a of the circuit board 3, or the heat spreader 5 and the electronic component 1 are brought into pressure contact with the indium bonding material 4 interposed therebetween, and adsorption is performed. The electronic component 1 or the heat spreader 5 is sucked and held by the nozzle 11. At the same time, the temperature T1 is set by preheating.
The adsorption nozzle 11 in the state of being held at the temperature is heated again toward the temperature T2, and at the time t2, the above-mentioned pressure contact is detected, and the melting and heating of each solder bump 2 via the electronic component 1 or the heat spreader 5 is performed. The melting and heating of all the indium bonding materials 4 is started. At this time, the cooling blow nozzle 14 is in a stopped state.

Next, in the time section from time t2 to time t3, the temperature of the suction nozzle 11 is reached to the melting point Tm of the solder or the indium bonding material 4 at the time tm and the solder bumps 2
Alternatively, the melting of the indium bonding material 4 is started, the temperature is further raised to the temperature T2, and then the solder bumps 2 or the indium bonding material 4 are melted while being kept at the temperature T2. In the time period from time t2 to tm, the pressing head 10 performs constant pressing force control. Thereafter, when the solder bumps 2 or the indium bonding material 4 starts to be melted immediately after the time tm or the time tm elapses, and a decrease in the pressing force in the pressing force constant control is detected,
A constant control of the tip height position of the suction nozzle 11 is performed by the pressing force constant control, and the tip height position is maintained at H2 until time t3.

Next, in the time section from time t3 to time t4, while the tip height H2 of the suction nozzle 11 is maintained, the heating by the ceramic heater 12 is stopped at time t3 and the cooling blow nozzle 14 The cooling blow is started, and the solder or indium bonding material 4 in the molten state is cooled and solidified. At time t4,
The solidification cooling by the cooling blow nozzle 14 is stopped, and the suction holding of the electronic component 1 by the suction nozzle 11 is released.

Finally, in the time section from time t4 to time t5, the suction nozzle 11 moves the tip height H2 by the elevating part 19.
From H1 to H1 and the primary ascending operation is performed,
In the time section from time t5 to t6, the suction nozzle 11 is further raised to the tip height H0, and the secondary raising operation is performed.

The pressing bonding operation is individually and simultaneously performed on each electronic component 1 or heat spreader 5 on each circuit board 3 by each pressing head 10 in the component pressing and bonding apparatus 101. The upper surface height of each electronic component 1 or the heat spreader 5 may be slightly different due to the bending of the heat sink or the like. In such a case, the time t2 at the time of detecting the pressure contact in FIG. It differs for each pressing head 10.
Further, although the ceramic heaters 12 included in the respective pressing heads 10 are of the same type, the heating characteristics thereof may be slightly different, and the time required to raise the temperature to a predetermined temperature is also small. May be different.
In such a case, the time tm for reaching the melting point of the solder or indium bonding material 4 in FIG. 11B is different for each pressing head 10, and accordingly the melting of the solder or indium bonding material 4 starts. That is, the detection of the decrease in the pressing force also differs. For this reason,
In each pressing head 10, when the press contact is detected,
Alternatively, when the melting point is reached, or when the decrease in the pressing force is detected, the time required for subsequent heating, the time required for cooling, the time for performing constant control of the joint height position, or adsorption When the holding is released, etc. are individually determined, and the pressing and joining operation is individually performed. Therefore, the deflection of the circuit board 3 as described above, that is, the difference in the top surface height position of each electronic component 1 or the heat spreader 5 due to the flatness of the circuit substrate 3 (or the electronic component 1 or the heat spreader 5) and the respective ceramic heaters 12 are different. Even if there is a difference in the pressure bonding operation condition for each pressure head 10 due to a difference in heating characteristics (difference in heating time), accurate and reliable pressure bonding is performed without being affected by the difference. be able to.

Further, the heating temperature change state (heating curve) at the time of the pressure bonding operation by each pressing head 10 in FIG. 11B has a certain temperature range (for example, ± 5 with respect to the temperature on the heating curve). The control unit 9 may consider that an error has occurred in the operation of the pressing head 10 when the temperature range deviates from the above temperature range during the heating operation. In addition to the above heating temperature, there may be a case in which a pressing force, a joining height position, and the like have a width, and when the width deviates from the above range, it is regarded as an error.

Further, in the component pressing and bonding apparatus 101, a ceramic heater 12 is provided for each pressing head 10, and instead of each ceramic heater 12, the solder bump 2 or the indium bonding material 4 is heated individually. (As a modified example), for example, the component pressure joining device 10
1. The electronic component 3 provided in each of the first stage 35 and the second stage 36 in FIG. 1 and arranged on the circuit board 3.
Alternatively, a case where a plurality of heating units, which are an example of a heating device that heats the solder bumps 2 in each of the plurality of electronic components 3 of the heat spreader 5 or the indium bonding material 4 in each of the plurality of heat spreaders 5, is installed. Good.

In such a case, for example, in each electronic component 1 heated by one heating unit of the plurality of heating units, all the pressure contact by each pressing head 10 is detected. After being confirmed by the control unit 9, the melting heating by the one heating unit is started, and the melting heating of the solder bumps 2 or the indium bonding material 4 in each of the electronic components 1 is collectively performed.

In the case where a plurality of heating parts capable of heating a plurality of electronic components 1 together are provided as described above, it is not necessary to individually provide the ceramic heater 12 to each pressing head 10, and the pressing heads are not required. The weight of the heating head 10 can be reduced, the productivity can be improved by increasing the moving speed of the pressing head 10, and the cost of the heating device can be reduced.

Instead of the pressing and joining operation as shown in the time charts of FIGS. 11A to 11C (as a modification of the above-mentioned pressing and joining operation), suction is performed at time t2 of FIG. 11A. After the tip portion of the nozzle 11 contacts the electronic component 1 or the heat spreader 5 at the joint height H2,
The tip of the suction nozzle 11 is further lowered in small steps, for example, the tip of the suction nozzle 11 is lowered by a unit of 1 μm, and the solder bumps 2 are pressed onto the pads 3a of the circuit board 3. There may be a case where a pressing force is applied stepwise to the electronic component 1 or to the heat spreader 5 pressed against the electronic component 1 with the indium bonding material 4 interposed. In such a case, after the pressure contact is detected (or after the contact between the suction nozzle 11 and the electronic component 1 or the heat spreader 5), the load is gradually applied to increase the joining height. Can be slightly lowered from the bonding height H2, and therefore, even when the formation height of each solder bump 2 of the electronic component 1 varies, the pressing force is applied to each solder bump 2 stepwise. By adding the above, the shape of each solder bump 2 can be gradually deformed without being crushed, and the contact property between each solder bump 2 and each pad 3a of the circuit board 3 can be enhanced. Even when the indium bonding material 4 supplied to the inside of the recess 5 a of the heat spreader 5 contains bubbles, the pressing force is gradually applied to the indium bonding material 4 to gradually increase the indium bonding material 4. The bubbles are gradually pushed away to the end of the indium bonding material 4 without being surrounded by the inside of the inside of the space, and the contact between the heat spreader 5 and the indium bonding material 4 of the electronic component 1 is increased. It becomes possible.

Next, a method of loading and unloading the circuit board 3 in the component pressure bonding apparatus 101 will be described. 12
14 to 14 are diagrams schematically showing the procedure for loading and unloading the circuit board 3 in the component pressure bonding apparatus 101. 12 to 14 are modified examples of the loader 37 and the unloader 38 of the component pressing and joining apparatus 101 in FIG.

First, referring to FIG. 1, the component pressing and joining apparatus 1
01, the first stage 35 and the second stage 36
The loader 37 that supplies the circuit board 3 to the upper and lower sides is provided with two sets of two rails 37a that can support both ends of the circuit board 3 in the Y-axis direction in the figure. Further, the first rail 37a- installed above the two sets of rails.
1, a first moving mechanism (not shown) that moves the circuit board 3 in the Y-axis direction in the state in which the circuit board 3 can be supported, and after the first moving mechanism moves the first rail 37a-1, It is supported by a lifting mechanism (not shown) that raises the installed second rail 37a-2 to the same height level as the first rail 37a-1, and the first rail 37a-1 and the second rail 37a-2. Second movement of each circuit board 3 on the rails 35a and 36a of the first stage 35 and the second stage 36 on the slide base 34 simultaneously
And a moving mechanism (not shown). As an example of the first moving mechanism, a ball screw shaft fixed to the machine base in the Y-axis direction so as to be rotatable about its axis and a first rail 37a-1 screwed onto the ball screw shaft are provided. There is a mechanism that includes a fixed nut and a drive motor that is fixed to the end of the ball screw shaft and that rotates the ball screw shaft around the axis. Further, as an example of the lifting mechanism, there is a mechanism including a cylinder and a cylinder block that move up and down by using compressed air, hydraulic pressure, or the like.

Further, the unloader 38 for taking out and discharging the circuit board 3 from the first stage 35 and the second stage 36 has the same construction as the loader described above, and the unloader 38 is installed vertically. A first rail 38a-1 and a second rail 38a-2, a first moving mechanism (not shown) for the first rail 38a-1,
A lifting mechanism (not shown) for the second rail 38a-2, and each rail 35 of the first stage 35 and the second stage 36.
a and 36a, the respective circuit boards 3 supported by the first rail 3
8a-1 and the 2nd moving mechanism (not shown) which moves simultaneously on the 2nd rail 38a-2.

First, as shown in FIG. 12 (A), in the component pressure bonding apparatus 101, among the plurality of circuit boards 3 to which the component pressure bonding is applied in the working portion 101a where the component pressure bonding is performed. The circuit board 3-A1 of the first rail 37a- of the loader 37, as shown in FIG.
1 is supplied from the left side in the X-axis direction in the figure. The working unit 101a is the pressing head 1 supported by the main frame 20 on the machine base of the pressing and joining apparatus 101.
It is a region where the pressing and joining operation by 0 is performed.

Next, as shown in FIG. 12C, the first state in which the circuit board 3-A1 is supported by the loader 37.
The rail 37a-1 is moved downward by the first moving mechanism in the Y-axis direction in the figure, and the second rail 37a-2 is raised by the elevating mechanism so that another circuit board 3-A2 is moved to the second position.
It is supplied onto the rail 37a-2 from the left side in the X-axis direction in the drawing.

After that, as shown in FIG. 13D, the second moving mechanism of the loader 37 causes the first rail 37a-1 to move.
The circuit board 3-A1 supported by the slide base 3
4, the circuit board 3-A2 supported by the second rail 37a-2 is mounted on the first stage 35 on the slide base 34.
They are simultaneously moved to the upper second stage 36.
After the circuit board 3-A1 and the circuit board 3-A2 are moved, the first rail 37a is moved by the first moving mechanism and the elevating mechanism.
-1 and the second rail 37a-2 have been moved respectively, and as shown in FIG.
It is returned to the position shown in (a).

Next, as shown in FIG. 13E, the slide base 34 is moved upward in the Y-axis direction in the drawing by the Y-axis direction moving mechanism 33, and the circuit board 3 on the first stage 35 and the second stage 36. -A1 and the circuit board 3-A2 are moved to the working unit 101a, and the pressing heads 10 in the working unit 101a perform pressure bonding of components. At the same time, another circuit board 3-B1 is supplied onto the first rail 37a-1 of the loader 37 from the left side in the X-axis direction in the drawing.

Thereafter, as shown in FIG. 13F, in the working section 101a, the circuit board 3-A1 and the circuit board 3-A2 in the first stage 35 and the second stage 36.
The slide base 34 is moved by the Y-axis direction moving mechanism 33 and is moved downward in the Y-axis direction in the figure. At the same time, in the loader 37, the first rail 37a-1 supporting the circuit board 3-B1 is moved downward in the Y-axis direction in the drawing, and the other circuit board 3-B2 is placed on the second rail 37a-2. Is supplied from the left side in the X-axis direction in the figure.

Next, as shown in FIG. 14G, the circuit board 3-A1 and the circuit board 3-A2 on the first stage 35 and the second stage 36 are moved by the second moving mechanism of the unloader 38. The unloader 38 is moved onto the first rail 38a-1 and the second rail 38a-2, respectively.
At the same time, the first rail 37a of the loader 37
-1, and the circuit board 3-B1 and the circuit board 3-B2 on the second rail 37a-2 are moved onto the first stage 35 and the second stage 36 by the second moving mechanism of the loader 37, respectively.

Next, as shown in FIG. 14H, the circuit board 3 on the second rail 38a-2 in the unloader 38 is moved to the right in the X-axis direction in the drawing, and is ejected from the component pressing and joining apparatus 101. It Then, the second rail 38a-
2 is lowered by the lifting mechanism, and the first rail 38a-1
Supporting the circuit board 3-A1 is moved by the first moving mechanism to above the second rail 38a-2. At the same time, the circuit board 3-B is moved by the Y-axis direction moving mechanism 33.
1 and the circuit board 3-B2 are moved to the working unit 101a.

Thereafter, as shown in FIG. 14 (I), the circuit board 3-A1 on the first rail 38a-1 in the unloader 38 is moved rightward in the X-axis direction in the drawing, and is ejected from the component pressing and joining apparatus 101. To be done.

The above-described operations are repeatedly and continuously performed on each circuit board 3, so that each circuit board 3 is carried in and out of the component pressing and joining apparatus 101.

As described above with reference to FIGS. 12 to 14, the rails 37a-1 and 37a are used by the loader 37 and the unloader 38 to carry the circuit board 3.
-2, 38a-1, and 38a-2 are not limited to the case where each two sets are provided, and the loader 37 and the unloader 38 in the component pressure bonding apparatus 101 of FIG.
As shown in FIG.
The case may be such that only one set of a and 38a are provided.

In addition, the loading and unloading of the circuit board 3 in the component pressing and joining apparatus 101 is performed by the X in FIG. 1 as described above.
Instead of the axial direction, the circuit board 3 may be loaded and unloaded in the Y-axis direction. FIG. 16 shows a perspective view of the component pressing device 102 in such a case.

As shown in FIG. 16, the component pressing and joining apparatus 1
02, only the installation positions of the loader 37 and the unloader 38 in the component pressure bonding apparatus 101 are different, and the other components are the component pressure bonding apparatus 1
The same as 01. A loader 137 is installed on the left side of the first stage 35 and the second stage 36 in the Y axis direction in the figure in the component pressing and joining apparatus 102, and an unloader is installed on the right side of the first stage 35 and the second stage 36 in the Y axis direction in the figure. 138 is installed. Also, loader 1
The 37 and the unloader 138 can be supported by rails provided at both ends of the circuit board 3 in the X-axis direction. In FIG. 16, the two circuit boards 3 supplied to the loader 137 of the component pressure bonding apparatus 102 are moved rightward in the Y-axis direction while being supported by the rails of the loader 137, and are moved to the first stage 35 and the second stage 36. Supplied. After the components are pressed and joined by the pressing heads 10 in the first stage 35 and the second stage 36, the respective circuit boards 3 are taken out from the first stage 35 and the second stage 36 by the unloader 138, and the unloader 138 is operated. While being supported by the rails of the loader 138, they are moved rightward in the Y-axis direction, and the respective circuit boards 3 are carried out from the component pressing and joining apparatus 102.

In such a component pressing and joining apparatus 102, since the circuit board 3 in the loader 137 and the unloader 138 can be moved only along the Y-axis in the drawing, the loader 137 and the unloader 1 can be used.
The structure of 38 can be simplified, and the manufacturing cost of the component pressure bonding apparatus 102 can be reduced.

According to the above embodiment, the following various effects can be obtained.

First, in the component pressure bonding apparatus 101,
In the case where a plurality of pressing heads 10 for joining components such as the electronic component 1 and the heat spreader 5 by pressing are provided, the elevating unit 19 that applies a pressing force to the components by lowering the pressing head 10 is conventionally used. The above-mentioned component pressing and joining apparatus is not provided with only one for a plurality of pressing heads, but is provided individually for each pressing head 10. The load cell 16 for detecting the joining pressing force applied to the parts is provided in each pressing head 1.
The accuracy of forming the above-mentioned parts to be pressed by individually controlling each elevating part 19 by the controller 9 based on the bonding pressing force detected individually for each pressing head 10 Variation in shape due to
The top surface height of each of the above-mentioned parts to be pressed is very small due to the unevenness of flatness due to the forming accuracy of Even if they differ
The pressing heads 10 are individually (in other words, independently) and simultaneously pressed individually in accordance with the states of the above-mentioned components (states such as the formation precision of the components and the formation precision of the circuit board 3). The pressure can be controlled.

For example, when the height of each solder bump 2 formed on each electrode 1a of the electronic component 1 varies, or when the circuit board 3 is partially distorted and placed at that portion. When the height of the top surface of the electronic component 1 being held is different from the height of the top surface of another electronic component 1, etc., the contact timing between the tip of the suction nozzle 11 of each pressing head 10 and the top surface of the electronic component 1 However, the pressing heads 10 do not perform simultaneously, and the pressing force applied to the electronic component 1 and the circuit board 3 by the pressing heads 10 may vary among the pressing heads 10. Even in such a case, since the pressing force can be controlled individually and simultaneously for each pressing head 10, the electronic components 1 that have been pressure-bonded can be bonded with a certain high bonding position accuracy. Will be given. Accordingly, a plurality of pressing heads 10 are provided to provide a component pressing and joining method and a joining device having high productivity by performing the pressure joining of the components to the plurality of components simultaneously with high joining position accuracy. Is possible.

Further, the suction nozzle 11 of each pressing head 10
Of the electronic component 1 or the heat spreader 5 and the upper surface of the electronic component 1 or the heat spreader 5 is suction-held by the suction nozzle 11, and each solder bump 2 of the electronic component 1 and each pad of the circuit board 3 is held. After surely contacting 3a, or the heat spreader 5 and the electronic component 1
And the indium bonding material 4 are intervened with certainty, and then the solder bumps 2 or the indium bonding material 4 are melted by heating, and the suction nozzles 1 of the pressing heads 10 are started.
The timing of releasing the adsorption and holding to the electronic component 1 or the heat spreader 5 by the solder 1 or the indium bonding material 4
Is not released during melting, but is released after the solder or indium bonding material 4 is melted and solidified. Thereby, when the suction holding of the electronic component 1 or the heat spreader 5 by the suction nozzle 11 of each pressing head 10 is released, the joining position of the electronic component 1 or the heat spreader 5 is changed by the vacuum breaking blow or the like generated in the suction nozzle 11. The gap can be eliminated. Therefore, it is possible to perform the joining of the component to the circuit board, which requires the high precision of the joining position, which causes the problem of the displacement of the joining position of the component due to the vacuum breaking blow in the suction nozzle 11.

Further, in each of the pressing heads 10, a self-weight counterbalance spring 17 attached to the spring receiving portion 18a of the head frame 18 and the spring receiving portion 15a of the shaft 15 to support the shaft 15 is used to press the upper portion of the pressing head 10b.
The lower end of the head frame 18 at the pressing force detection surface of the load cell 16 which is the upper end of the pressing head lower part 11a.
The load cell 1 is always pressed and contacted.
6, it is possible to detect the pressing force acting in the upward direction of the pressing head lower portion 10a.

As a result, each solder bump 2 of the electronic component 1
When the electrodes 3a of the circuit board 3 and the heat spreader 5 and the electronic component 1 are pressed against each other with the indium bonding material 4 interposed therebetween, the reaction force of the bonding pressing force generated between the two causes the load cell The upper surface, which is the pressing force detection surface of 16, pushes up the lower end of the head frame 18, and this makes it possible for the load cell 16 to reliably detect this bonding pressing force.

Therefore, by detecting the joining pressing force, the controller 9 causes the tip of the suction nozzle 11 and the electronic component 1 to be detected.
It is possible to detect that the upper surface of the heat spreader 5 or the upper surface of the heat spreader 5 is in contact, and the control unit 9 minutely controls the descending amount of the pressing head 10 by the elevating unit 19 based on the detected joining pressing force. The actual welding pressure can be controlled more accurately so that the welding pressure detected becomes a preset pressure. Therefore, when repeatedly joining components such as an electronic component and a heat spreader, the components can be reliably and accurately joined at a preset pressing force, and the joining quality of the components is stabilized. It becomes possible.

Also, the electronic component 1 by each pressing head 10
After the pressure contact between each solder bump 2 and each pad 3a of the circuit board 3 or after the pressure contact between the heat spreader 5 and the electronic component 1 with the indium bonding material 4 interposed therebetween, each pressure head 10 is pressed by the pressure head 10. When the bonding pressure is detected by the load cell 16 in the constant pressing force control state, and then the temperature of the adsorption nozzle 11 is raised by the heating of the ceramic heater 12, and the decrease of the bonding pressure is detected in the load cell 16. Start melting each solder,
Alternatively, it is determined that the indium bonding material 4 has begun to melt, and the suction head 1 is controlled by the pressing head 10 to control the constant pressing force.
By switching to position control in which the tip height position of No. 1 is made constant, the tip height position of the suction nozzle 11 can be made constant even when each solder or indium bonding material 4 is melted.

Thus, each solder bump 2 of the electronic component 1
Is melted, or when the indium bonding material 4 is melted, the tip position of the suction nozzle 11 is lowered to prevent the solder bumps 2 or the indium bonding material 4 in a molten state from being crushed. Therefore, it is possible to reliably control the joint height position of the electronic component or the heat spreader even while the solder or the indium joint material 4 is being melted.

Further, the set pressing force is set in advance to a force capable of deforming the solder bumps 2 or the indium bonding material 4 without crushing them, and when the pressing force constant control is performed, the setting pressing force is set. Is added to each solder bump 2 or indium bonding material 4 to enhance the contact property to each pad 3a while deforming the shape of each solder bump 2,
Alternatively, it is possible to enhance the contact property with the upper surface of the electronic component 1 or the inner bottom surface of the recess 5 a of the heat spreader 5 while deforming the shape of the indium bonding material 4. Therefore, the electronic component 1 can be reliably bonded to the circuit board 3, or the heat spreader 5 can be reliably bonded to the electronic component 1, and the reliability of the bonding of the components can be improved.

In addition, in the component pressing and joining apparatus 101,
The pressing heads 10 are arranged with an interval B in the Y-axis direction with the main frame 20 interposed therebetween, that is, an interval B between the rows of the 2 rows × 5 columns arrangement. In addition, structural restrictions of the pressing head 10 and the main frame 20, such as the size of the elevating part 19 and the like, the size of the rigid body based on the strength of the main frame 20 required to support each pressing head 10, and the like. Due to the constraint, there is a limit to the shortening of the interval B. Therefore, each of the pressing heads 1 in 2 rows and 5 columns described above
In the case where the components arranged on the circuit board in 2 rows and 5 columns are simultaneously pressed and joined by 0,
It is necessary to form the circuit board so that the space between the two rows on the circuit board is also the same as the space B, and the constraint based on the constraint of the layout of the pressing head 10 is the layout of the components on the circuit board. However, there is a problem in that there is a wasteful space for arranging the above components.

Therefore, in the present embodiment, in the component pressing and joining apparatus 101, the first stage 3 arranged in the Y-axis direction at the above-mentioned arrangement interval B of the pressing heads 10 respectively.
5 and the second stage 36 are provided,
By making it possible to perform a component pressure-bonding operation on the two circuit boards 3 supplied to the respective stages,
Each of the components arranged in the first row (first row in FIG. 3) of the two circuit boards 3 arranged at the interval B in the Y-axis direction is subjected to the pressure joining work, and then,
The first stage 35 and the second stage 36 are moved in the Y-axis direction, and press-bonded to the respective components arranged in the respective second rows (second row in FIG. 3) of the two circuit boards 3. I am working on it. This eliminates the consideration of the constrained distance B in the arrangement of the components on the circuit board, so that it is possible to eliminate a wasteful space in the arrangement of the components and to achieve a compact arrangement.
It is possible to perform efficient pressure bonding work on the respective circuit boards 3 of the first stage 35 and the second stage 36,
It is possible to provide a component pressure joining device with high productivity.

Further, since the component pressing and joining apparatus 101 is provided with the head pitch varying mechanism 31, it is possible to vary the interval pitch P of the columns of the component pressing heads 10 arranged in 2 rows and 5 columns. It is possible to perform the pressure bonding work corresponding to the arrangement of various parts on the circuit board 3, and it is possible to increase the degree of freedom of the arrangement and to eliminate the above-mentioned useless space on the circuit board to form a compact circuit. It is possible to provide a high-productivity component pressure bonding apparatus that can be used as a substrate and that includes two stages of a first stage and a second stage and that can perform efficient pressure bonding of components. .

A component support tray 6 for releasably supporting the components arranged on the circuit board 3 and holding the above arrangement.
And 7 are attached to the circuit board 3, and the circuit board 3 is supplied to the component pressing and bonding apparatus 101 in a state where the above-mentioned arrangement is maintained, so that the influence of vibration or the like generated when the circuit board 3 is moved. Even when the above-mentioned component is received, the above-mentioned arrangement is maintained, so that it is possible to prevent the occurrence of displacement or the like.

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0185]

According to the first aspect of the present invention, in a component pressing and joining apparatus provided with a plurality of pressing devices for individually pressing a plurality of components arranged on one substrate, An elevating device for individually elevating and lowering is individually provided for each of the pressing devices, and a detection device for individually detecting a pressing operation state applied to the component by the component pressing member is individually provided for each of the pressing devices. By being provided, it is possible to individually control the elevating devices for each of the pressing devices based on the pressing operation state detected by the detecting device. As a result, due to variations in the shape of the pressed parts due to the forming accuracy, or unevenness of the flatness due to the forming accuracy of the substrate or the storage state, etc. of the respective parts arranged on the pressed one substrate. Even when the heights of the upper surfaces are different, the pressing force can be controlled individually (or independently) for each pressing device and simultaneously according to the state of each of the above parts, and a plurality of pressing devices can be used. An apparatus for pressure-bonding a component to each of the above-described components arranged on the one substrate with high joint position accuracy and efficiently, thereby providing a component-pressure bonding device having high productivity. It becomes possible.

According to the second aspect of the present invention, in the component pressing and joining device, the heating device is further provided for each of the pressing devices, so that the component pressing member for each of the components is provided. It is possible to individually heat the bonding material by each of the heating devices based on the pressing operation state according to. That is, even when the upper surface heights of the respective components arranged on the one substrate to be pressed are different and the timings of pressing the respective components are different, It is possible to provide a component pressing and joining apparatus that can individually perform melting and heating in a state of being reliably pressed and can obtain the same effects as the effects according to the first aspect.

According to the third aspect of the present invention, the control device in the component pressing and joining device is arranged so that, in the plurality of pressing devices, the elevating device lowers the component pressing member to face the component pressing member. When applying a pressing force to the above-mentioned components on the substrate to perform a bonding operation,
While performing the melting and heating operation of the bonding material by the heating device, the pressing force detected by the detection device is maintained substantially constant with respect to the set pressing force, and the detection device with respect to the setting pressing force of the pressing force. With the detection of the decrease,
By determining that the joining material starts melting, by stopping the descending of the component pressing member by the elevating device and switching from the constant control of the pressing force to the control of maintaining the position of the component pressing member with respect to the substrate, Even when the bonding material is melted, the height position of the tip of the component pressing member can be kept constant. Accordingly, when the joining material is melted, it is possible to prevent the joining material in a molten state from being crushed by lowering the tip position of the component pressing member, and joining the component to the substrate. It is possible to provide a component pressing and joining apparatus that can reliably manage the height position and can press and join components with high joining position accuracy.

According to the fourth aspect of the present invention, in the plurality of pressing devices, when the pressing operation and the melting and heating operation are individually performed according to the pressing operation state, it is detected by the detection device. By individually performing the pressing operation and the melting heating operation based on the information that the pressing force reaches the setting pressing force, for example, the melting heating operation is individually started according to the timing when the setting pressing force is reached. Therefore, the melting and heating can be individually performed in a state in which the respective components are reliably pressed against each other, and reliable and accurate pressing and joining of the components can be performed.

According to the fifth aspect of the present invention, in the plurality of pressing devices, when the pressing operation and the melting and heating operation are individually performed according to the pressing operation state, the heating time of the bonding material or By individually performing the pressing operation and the melting and heating operation according to the flatness of the component or the substrate, for example, the pressing operation of the component is continuously performed during the heating time required for melting the bonding material. Or, in the case where the height of the upper surface of the component is different depending on the flatness of the component or the substrate and the timing of applying the pressing force to the component is also different for each component, individually according to the timing, The pressing operation and the melting and heating operation can be performed, and reliable and accurate pressing and joining of components can be performed.

According to the sixth aspect of the present invention, in each of the pressing devices, a cooling device is further provided individually, so that the heated and melted joining material is solidified and cooled individually for each part. It is possible to provide a component pressing and joining apparatus that can achieve the effects described above in the second to fifth aspects.

According to the seventh aspect of the present invention, in each of the pressing devices, the component pressing member is brought into contact with (or in contact with) the upper surface of the component, and the components are individually held by the component pressing member. Then, the holding of the component is not released while the bonding material is melting, but the holding of the component is performed after the bonding material is solidified, that is, when the component is bonded to the substrate. By individually releasing the above, it is possible to prevent the displacement of the joining position of the component with respect to the substrate, which is caused by the influence generated when the component pressing and holding member releases the holding, for example, the influence by the vacuum break blow or the like. . Therefore, it is possible to provide a component pressing / bonding device capable of performing pressure bonding of a component, which requires such a high bonding position accuracy that causes such a displacement of the bonding position, to the substrate.

According to the eighth aspect of the present invention, the pressing devices are arranged in two rows and a plurality of columns in a plane, and the intervals between the columns are arranged at a constant interval. It is possible to individually and simultaneously perform the press-joining operation on a plurality of the same type and the above-mentioned parts arranged at the above-mentioned constant intervals along the row direction, and press-bonding the parts with high joining position accuracy. It is possible to provide a component pressing and joining apparatus that can efficiently perform the process with high productivity.

According to the ninth aspect of the present invention, in each of the pressing joining devices arranged in two rows and a plurality of columns, the spacing mechanism that makes the spacing between the columns or the spacing between the rows variable is the component pressing joining. By being provided in the device, the degree of freedom in arranging the components on the substrate on which the pressure bonding operation is performed is increased, and the component pressure bonding device capable of coping with various arrangements of the components. Can be provided.

According to the tenth aspect of the present invention, the substrate is pressed and joined by the component support mechanism while the components are supported on the substrate so that the respective bonding positions are held on the substrate. The vibration generated when the substrate is moved by individually performing the pressing and joining operation with respect to each of the components by each of the pressing devices in a state where the support is released by the component supporting mechanism supplied to the device. Even if the above-mentioned parts are affected by the above, since the arrangement of the joining positions of the above-mentioned components is maintained, it is possible to prevent the occurrence of misalignment, etc. It is possible to perform the pressure bonding.

According to the eleventh aspect of the present invention, it is possible to provide a component pressing / bonding apparatus capable of performing the above-described pressing / bonding operation on the above-mentioned components such as an electronic component and a heat spreader.

According to the twelfth aspect of the present invention, in the case where the heat spreader is joined to the electronic component joined to the substrate, the joining material for joining the heat spreader to the electronic component is formed. Melting point
By lowering the melting point of the bonding material that bonds the electronic component to the substrate, the heat spreader can be bonded without affecting the bonding of the electronic component to the substrate.

According to the thirteenth aspect of the present invention, when a pressing force is applied individually to a plurality of components arranged on one substrate, the respective component pressing operations are individually performed according to the respective press-bonding states. By performing the pressing operation by the member and the melting and heating operation of the bonding material according to the respective pressing and bonding states, the variation in the shape due to the forming accuracy of the pressed component, or the forming accuracy and the storage state of the substrate Even if the upper surface heights of the respective components arranged on the one substrate to be pressed are different due to unevenness of flatness due to, etc., individually (or independently) for each pressing device and At the same time, the pressing force can be controlled according to the states of the respective parts. Therefore, a component pressing and joining method having high productivity is performed by simultaneously and efficiently pressing and joining components to each of the components arranged on the one substrate with high joint position accuracy. Is possible.

According to the fourteenth aspect of the present invention, when the pressing force is applied individually to the plurality of components, the pressing operation by the respective component pressing members and the pressing operation are individually performed according to the respective pressure joining states. By performing the melting and heating operation of the bonding material, the upper surface heights of the respective components arranged on the one substrate to be pressed are different, and the timing of pressing the respective components is different. Even if there is, there is provided a component pressing and joining method capable of individually performing melting and heating in a state where the respective components are reliably pressed, and obtaining the same effects as the effects of the thirteenth aspect. It becomes possible to provide.

According to the fifteenth aspect of the present invention, when the plurality of component pressing members are lowered to apply the pressing force individually to the plurality of components, the pressing force applied to each of the components is pushed. The pressure is detected individually, the detected pressing force is maintained substantially constant with respect to the set pressing force, and the joining material is melted and heated, and the decrease in the pressing force with respect to the set pressing force is detected. When it is determined that the joining material starts melting, the descent of the component pressing member is stopped and the position of the component pressing member with respect to the substrate is maintained from the maintaining of the pressing force, so that even when the joining material is melted The tip height position of the component pressing member can be made constant. Accordingly, when the joining material is melted, it is possible to prevent the joining material in a molten state from being crushed by lowering the tip position of the component pressing member, and joining the component to the substrate. It is possible to provide a component pressure bonding method capable of reliably managing the height position and performing pressure bonding of components with high bonding position accuracy.

According to the sixteenth aspect of the present invention, the information that the detected pressing force reaches the set pressing force when the pressing operation and the melting and heating operation are individually performed according to the pressing operation state By individually performing the pressing operation and the melting and heating operation based on, for example, the melting and heating operation can be individually started according to the timing when the set pressing force is reached, and the respective parts are The above-mentioned melting and heating can be individually performed in a state where the components are reliably pressure-welded, and reliable and accurate pressing and joining of components can be performed.

According to the seventeenth aspect of the present invention, when the pressing operation and the melting and heating operation are individually performed in accordance with the pressing operation state, the heating time of the bonding material or the flat surface of the component or the substrate. By performing the pressing operation and the melting and heating operation individually according to the degree, for example,
During the heating time necessary for melting the bonding material, the pressing operation of the component is continuously performed, or the upper surface height of the component differs depending on the flatness of the component or the substrate, and the pressing force is applied to the component. When the timing is also different for each of the parts, the pressing operation and the melting and heating operation can be individually performed according to the timing, and reliable and accurate press joining of the parts can be performed. Become.

According to the eighteenth aspect of the present invention, the parts are treated from the start of the action of the pressing force on the plurality of parts to the solidification of the joining material, that is, until the parts are joined to the substrate. By individually holding the component pressing member, an influence that occurs when holding is released by the component pressing holding member, for example, a displacement of the joining position of the component with respect to the substrate caused by the influence of vacuum break blow or the like. Can be prevented. Therefore, it is possible to provide a component pressure bonding method capable of performing pressure bonding of a component that requires high bonding position accuracy such that such a displacement of the bonding position becomes a problem to the substrate.

[Brief description of drawings]

FIG. 1 is a perspective view in which a part of a component pressing and joining device according to an embodiment of the present invention is made transparent.

FIG. 2 is a schematic structural diagram of a pressing head provided in the component pressing and joining device of the above embodiment.

FIG. 3 is a plan view schematically showing the arrangement of a circuit board and electronic components supplied to the component pressure bonding apparatus of the above embodiment.

FIG. 4 is a schematic explanatory view showing a method of pressing and joining an electronic component to a circuit board in the component pressing and joining method of the above embodiment.

FIG. 5 is a schematic explanatory view showing a method of pressing and joining an electronic component to a circuit board in the component pressing and joining method of the above embodiment.

FIG. 6 is a schematic explanatory view showing a method of press-bonding a heat spreader to an electronic component in the component pressure-bonding method of the above embodiment.

FIG. 7 is a schematic explanatory view showing a method of press-bonding a heat spreader to an electronic component in the component pressure-bonding method of the above embodiment.

FIG. 8 is a flowchart showing a method of pressing and joining an electronic component to a circuit board in the component pressing and joining method of the above embodiment.

FIG. 9 is a flow chart showing a method for pressing and joining a heat spreader to an electronic component in the method for pressing and joining components according to the embodiment.

FIG. 10 is a flowchart showing an operation procedure of constant pressing force control and constant tip height position control in the component pressure bonding method of the above embodiment.

11 (A) and 11 (B) in the component pressing and joining method of the above-described embodiment, FIG. 11 (B) is the temperature of the suction nozzle, and FIG. 11 (C) is the change state of the operation of the cooling blow nozzle with time. 2 is a time chart showing.

FIG. 12 is a schematic explanatory view schematically showing a method of loading and unloading a circuit board in the component pressure bonding apparatus of the above embodiment.

FIG. 13 is a schematic explanatory view schematically showing a method of loading and unloading a circuit board in the component pressure bonding apparatus of the above embodiment.

FIG. 14 is a schematic explanatory view schematically showing a method of loading and unloading a circuit board in the component pressure bonding apparatus of the above embodiment.

FIG. 15 is a control system diagram in the component pressing and joining apparatus of the above embodiment.

FIG. 16 is a perspective view in which a part of the component pressing and joining apparatus according to the modified example of the above embodiment is seen through.

FIG. 17 is an explanatory view schematically showing a conventional component pressure bonding method.

FIG. 18 is a schematic explanatory view schematically showing the structures of the head pitch varying mechanism and the X-axis direction moving mechanism of the above embodiment.

FIG. 19 is a partial plan view of the component support tray in a state where electronic components arranged on a circuit board supplied to the component pressing and joining apparatus according to the above embodiment are supported.

FIG. 20 is a partial plan view of the component support tray in a state where the heat spreader arranged on the circuit board supplied to the component pressing and joining apparatus of the above embodiment is supported.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 2 ... Solder bump, 3 ... Circuit board, 3a ... Pad, 3b ... Circuit board, 4 ... Indium, 5 ... Heat spreader, 5a ... Recess, 6 ... Component support tray, 6a ... Support jig , 7 ... Component support tray, 7a ...
Support jig, 9 ... Control unit, 10 ... Press head, 10a ... Press head lower part, 10b ... Press head upper part, 11 ... Adsorption nozzle, 12 ... Ceramic heater, 13 ... Water jacket, 14 ... Cooling blow nozzle, 15 ... Shaft, 15a ... Spring receiving part, 15b ... Shaft lower part, 16 ... Load cell, 1
7 ... Self-weight offset spring, 18 ... Head frame, 18
a ... Spring receiving part, 19 ... Elevating part, 19a ... Motor,
19b ... Ball screw shaft, 19c ... Elevating part frame, 19
d ... Nut part, 20 ... Main frame, 20a ..., First
Frame, 20b ... 2nd frame, 20c ... 3rd frame, 21 ... LM rail, 22 ... LM block, 23 ... L
M rail, 24 ... LM block, 25 ... LM rail, 2
6 ... LM block, 27 ... LM rail, 28 ... LM block, 31 ... Head pitch variable mechanism, 31a ... Ball screw shaft part, 31b ... Nut part, 31c ... Motor, 31d ...
Bearing part, 32 ... X-axis direction moving mechanism, 32a ... Ball screw shaft part, 32b ... Nut part, 32c ... Motor, 33 ... Y-axis direction moving mechanism, 34 ... Slide base, 35 ... First stage, 35a ... Rail, 36 ... Second stage, 36a ...
Rail, 37 ... Loader, 37a ... Rail, 38 ... Unloader, 38a ... Rail, 101 ... Component pressing and joining apparatus, 101a ... Working part, 102 ... Component pressing and joining apparatus, 1
37 ... Loader, 138 ... Unloader, A ... Interval, B ...
Interval, C ... Cutting line, D ... Cutting line, P ... Interval pitch, Q ...
Reference position, S ... Vertical movement axis.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shinji Kanayama             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Takaharu Mae             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5F044 PP16 PP17 PP19 RR01

Claims (18)

[Claims] 1. Bonding material (2, 4) on one substrate (3)
Component pressing and joining apparatus (101, 1) having a plurality of pressing devices (10) for individually applying a pressing force to a plurality of components (1, 5) arranged by interposing
02), wherein each of the pressing devices includes a component pressing member (11) for individually pressing the component, and an elevating device (19) for individually elevating and lowering the component pressing member.
And a detection device (16) for individually detecting a pressing operation state in which the component pressing member has acted on the component. The component pressing and joining device includes a heating device (12) for melting and heating the joining material. ) And a detection result of the detection device in each of the pressing devices, and a control device for individually controlling the elevating operation of the elevating device and the melting and heating operation of the heating device based on the input detection result. ) And when the control device lowers the component pressing members of the plurality of pressing devices to individually apply a pressing force to the plurality of components to perform a joining operation, the detection device detects In addition, the pressing operation by the component pressing member is individually performed according to each pressing operation state, and the melting and heating operation by the heating device is performed according to the pressing operation state. Parts pressing bonding and wherein the. 2. The heating device is provided in each of the pressing devices, and is capable of individually melting and heating the bonding material in each of the pressing devices, and the control device is configured to detect the input detection. It is possible to individually control the melting and heating operation of the heating device based on the result, and by the control device, the component pressing members in the plurality of pressing devices are lowered to individually apply a pressing force to the plurality of components. The method according to claim 1, wherein when the bonding operation is performed, the pressing operation by the component pressing member and the melting and heating operation by the heating device are individually performed according to the pressing operation state detected by each of the detection devices. The component pressure joining device described. 3. The detection device in each of the pressing devices can individually detect a pressing force applied to the component by the component pressing member as the pressing operation state, and the control device includes: In a plurality of pressing devices, when the component pressing member is lowered by the elevating device to apply a pressing force to the component on the substrate facing the component pressing member to perform a bonding operation, the heating device described above is used. While performing the melting and heating operation of the bonding material, the pressing force detected by the detection device is maintained substantially constant with respect to the set pressing force, and the reduction of the pressing force with respect to the setting pressing force is detected by the detection device. 3. The component pressing and joining apparatus according to claim 2, wherein the lowering of the component pressing member by the elevating device is stopped to maintain the position of the component pressing member with respect to the substrate. 4. When the control device causes the plurality of pressing devices to individually perform the pressing operation and the melting and heating operation according to the pressing operation state, the pressing force detected by the detection device is the above-mentioned. The component pressing and joining apparatus according to claim 3, wherein the pressing operation and the melting and heating operation are individually performed based on the information that reaches the set pressing force. 5. The controller controls the heating time of the bonding material or the parts or the plurality of pressing devices when individually performing the pressing operation and the melting and heating operation in accordance with the pressing operation state in the plurality of pressing devices. The component pressing and joining apparatus according to any one of claims 2 to 4, wherein the pressing operation and the melting and heating operation are individually performed according to the flatness of the substrate. 6. Each of the pressing devices further comprises a cooling device (14) for individually solidifying and cooling the melted and heated bonding material, and after the melting and heating operation of the heating device by the control device is completed. The component pressing joining apparatus according to claim 2, wherein solidification cooling is individually performed by the cooling device. 7. Each of the component pressing members can hold the component individually releasably, and the control device applies a pressing force to the component by the component pressing member in the plurality of pressing devices. 7. The component pressing and joining apparatus according to claim 1, wherein the components are individually held when the components are held, and the holding of the components is individually released when the components are joined to the substrate. 8. The pressing devices are arranged in two rows and a plurality of columns in a plan view, and the columns are arranged at regular intervals, and the bonding material is interposed on the substrate. 8. The joining operation is individually performed on the same type and a plurality of the parts arranged at the constant intervals along the row.
The component pressing and joining apparatus according to any one of 1. 9. A variable spacing mechanism (31) for varying the fixed spacing of the columns or the spacing of the rows of each pressing device.
The component pressing and joining apparatus according to claim 8, further comprising: 10. The substrate according to claim 1, wherein the substrate is supported by a component support mechanism (6, 7) for releasably supporting each component so as to hold respective bonding positions on the substrate. To the component pressing / bonding device (101, 102) according to any one of items 1 to 9 above, and in a state in which the support by the component supporting mechanism is released, the pressing device transfers the substrate to the substrate for each component. 2. The component pressing and joining apparatus in which the above joining operation is performed individually. 11. The component is an electronic component (1) bonded to the substrate with the bonding material (2) interposed, or the bonding material (4) to the electronic component bonded to the substrate. Heat spreader (5) joined by interposing
The component pressing and joining apparatus according to any one of claims 1 to 10. 12. The bonding material (4) is attached to the electronic component in a state of being bonded to the substrate with the bonding material (2) interposed therebetween.
In the case of joining the heat spreader with the interposition of, the melting point of the joining material (4) for joining the heat spreader to the electronic component is higher than the melting point of the joining material (2) for joining the electronic component to the substrate. The component pressing joining device according to claim 11, which is low. 13. A bonding material (2,
4) Positioning of the plurality of component pressing members and the plurality of components such that the plurality of components (1, 5) arranged with the interposition of 4) can be individually pressed by the plurality of component pressing members (11). And lowering the plurality of component pressing members, performing a pressing operation by each of the component pressing members individually according to the respective press-bonding states when pressing force is individually applied to the plurality of components, and A component pressing and joining method, characterized in that a melting and heating operation of the joining material is performed in accordance with each press-joining state, and the plurality of components are joined with the joining material interposed on the substrate. 14. When a pressing force is applied to each of the plurality of parts individually, a pressing operation by each of the parts pressing members and a melting and heating operation of the bonding material are individually performed according to the pressing and bonding states of the respective parts. The component pressure bonding method according to claim 13, wherein the plurality of components are bonded to each other with the bonding material interposed on the substrate. 15. When the plurality of component pressing members are lowered to individually exert a pressing force on the plurality of components, the pressing forces exerted on the respective components are individually detected, and When the detected pressing force is maintained substantially constant with respect to the set pressing force and the joining material is melted and heated, and the decrease of the set pressing force of the pressing force maintained at the substantially constant is detected, The component pressing joining method according to claim 14, wherein the descending of each component pressing member is stopped to maintain the position of each component pressing member with respect to the substrate. 16. When individually performing the pressing operation and the melting and heating operation according to each of the pressing operation states, the detected pressing force is individually based on the information that the detected pressing force reaches the set pressing force. The component pressing and joining method according to claim 15, wherein the pressing operation and the melting and heating operation are performed. 17. When individually performing the pressing operation and the melting and heating operation according to the pressing operation state, the pressing operation is individually performed according to the heating time of the bonding material or the flatness of the component or the substrate. And a method for pressing and joining parts according to any one of claims 14 to 16, wherein the melting and heating operation is performed. 18. When pressing force is applied to the plurality of parts, the respective parts are individually held by the respective part pressing members, and the joining material is individually melted by the melting and heating operation,
Thereafter, the molten joining material is individually solidified and cooled, and when the joining material is solidified and the respective components are joined to the substrate with the joining material interposed, the holding of the respective components is individually performed. The method according to any one of claims 13 to 17
The method for pressing and joining parts as described in 3.